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for the Power Electronics Industry.



2016 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations (click headings to expand)

Additive Manufacturing 

Keynote Speaker:

3D Printing Technology for Automotive Applications” Madhu Chinthavali, Oak Ridge National Laboratory


Additive Manufacturing of Planar Inductor for Power Electronics Applications” Guo-Quan Lu, Virginia Tech

"Thermal Response of Additive Manufactured Aluminum” Tong Wu, Oak Ridge National Laboratory

"3D Printed Microchannel Heat Sink Design Considerations” Frank Wang, Crane EG

Thermal Management & Systems Integration

Keynote Speaker:

Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components” Eric Dede, Toyota Research Institute of North America


Thermal Management and Reliability of Power Electronics and Electric Machines” Sreekant Narumanchi, National Renewable Energy Laboratory

A High Power-Density Three-Phase Inverter Adopting Double-End Sourced Power Module Structure” Dr. Fang Luo, The Ohio State University

Novel Packaging and Thermal Measurement for 3D Heterogeneous Stacks” Theodore Harris, NC State University

Plenary Road Mapping

Multiphysics Modeling & Simulation


Keynote Speakers:

Ag Sinter Joining and Stress Migration Bonding for WBG Die Attach”  Katsuaki Suganuma, Osaka University 


Materials for 3D Integration” Patrick McCluskey, University of Maryland

Photocurable Dielectrics for Electronic Packaging and Encapsulant Applications” Wuttichai Reainthippayasakul, Penn State


Dialogue Sessions:

Embedding Technologies

Keynote Speakers:

Power System-in-Package” Cian O'Mathuna, Tyndall National Institute, University of Cork

Significant developments and trends in embedded substrate and component technologies for power applications” Brian Narveson, PSMA

On Size and Magnetics: Why Small Efficient Power Inductors Are Rare” Charlie Sullivan, Dartmouth

Embedded Components

Quality & Reliability


Site Design: David Fogle Design

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