A successful IWIPP 2022 in Grenoble, France

The International Workshop on Integrated Power Packaging (IWIPP 2022), chaired by Francesco Iannuzzo was held August 24-26, 2022, and hosted by the faculty of G2Elab at the World Trade Center in Grenoble, France.  The workshop is sponsored by Power Source and Manufacturing Association (PSMA) and IEEE societies Dielectrics and Electrical Insulation Society (DEIS), Power Electronics Society (PELS), and Electronic Packaging Societies (EPS). There were four Partner/Exhibitors NanowiredPinkPVATepla, and Wolfspeed that also contributed to the success of the event.  The workshop was chaired by Francesco Iannuzzo in collaboration with Technical Chairman Nick Baker.  The workshop focused on the integration of circuits, materials, and manufacturing to create state of the art power sources. The sessions were organized to provide technology updates for design, packaging, and manufacturing engineers who are all engaged in research and the practical applications of materials, components, manufacturing, and qualification of power sources.  In addition to the excellent sessions on Power Modules, Manufacturing Processes, Thermal, EMI and Reliability there were exciting presentations on Diamond Semiconductor and Dielectrics and Insulation.

IWIPP 2022 was a Hybrid Workshop with 50 in person and 24 virtual attendees.  The attendees and contributors represented 15 countries and came from industry, academia, and government.  Attendees were treated to three information packed days with 35 presentations (6 Keynote and 29 invited/submitted) and 9 posters.  The in-person attendees were treated to a lab tour and dinner in G2ELab facilities.

The workshop consisted of many excellent presentations.  A Keynote by Aaron Brovont for PC Krause & Associates "Modeling and Simulation of Conducted EMI in Power Electronics Systems" generated a lot of discussion about tools that helped approach EMI form a systematic standpoint during and after his presentation. The non-semiconductor experts in attendance were very appreciative of the presentation by Peter Friedrichs from Infineon Technologies "Insights into the Layout of Power Semiconductor Chip" providing the fundamental understanding of how devices are designed.

The hottest overall topic was how to create new packaging concepts to accommodate the demand for high voltage power sources with low parasitics using wide bandgap semiconductors to reduce size and increase efficiency.  The audience engaged in lively conversation on how to unite the progress in semiconductor fabrication, optimal packaging, isolation materials with modeling and testing to achieve the next generation power sources.

IWIPP is held every two years.  The location and date of the 2024 editions will be announced in society and industry publications in 2023.

Provided by Brian Narveson,
IWIPP 2022 Publicity Chair

Announcing the International Workshop on Integrated Power Packaging (IWIPP 2022) Grenoble, France



Registration is now open for IWIPP 2022, a PSMA and IEEE sponsored hybrid workshop, which will be held August 24-26, 2022, at the World Trade Center in Grenoble, France, and hosted by G2E Labs. IWIPP is a growing and successful power technology packaging workshop offering well known experts and excellent speakers along with international networking opportunities.

Under the leadership of General Chairman Dr. Francesco Iannuzzo, Aalborg University, IWIPP brings together industry, academic and government researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to facilitate and promote the development and commercialization of high-density and high-efficiency power converters. The invited presentations and contributed papers will address a range of topics, including power module design, magnetic and dielectric materials technology, component performance, and application-level impacts of packaging technology. Presenters will address important challenges and present solutions to increase product reliability and manufacturability while targeting improved performance with reduced size and system cost.

Technical Chairman Nick Baker, University of Alabama invites you to this year's outstanding technical program which includes an exciting set of power technology and packaging Keynote addresses including:

  1. "Packaging, Integration and Fast switching: what has been achieved and what´s next?" - Eckart Hoene, Chief Expert Power Electronics, Fraunhofer IZM, Germany

Only close interaction between packaging end circuit engineers will bring power electronics to the next step. This presentation will give an overview on achievements in packaging and its implementation into commercial products as well as new concepts intended to reduce the technological market barrier.

2. "Environmental Trends and Challenges on Power Packaging" - Garron Morris and Chris Genthe, Senior Principal Engineer, Rockwell Automation, USA

This keynote covers the challenges of increasing power densities, coupled with new environmental stresses stemming from changing customer locations, behaviours, and applications.

3. Insulation Materials and Systems for Power Electronic Modules: Challenges and Future Research Needs, Mona Ghassemi, Assistant Professor, Virginia Tech, USA

This presentation critically reviews recent research on electrical insulation materials and systems used in power electronics devices and focuses on electrical treeing in silicone gel, PD modelling, and mitigation methods.  In particular, it shows that the investigations carried out to date are in their infancy regarding the working conditions targeted for next-generation WBG power devices.

Packaging and related technologies are the key to creating reliable and cost-effective high-density power sources. Attendance at this important workshop can keep you and your colleagues on the cutting edge of packaging technologies and practices. Registration is now open for this important event at Registration – IWIPP.  If your company would benefit from meeting and interacting with the attendees, there are also opportunities available for partners and exhibitors.  The event is available for both in person and virtual attendance. Additional information regarding the workshop can be found at the conference website: https://iwipp.org/ .

IWIPP is co-sponsored by the PSMA Packaging Committee and IEEE.   Brian Narveson, Ernie Parker and John Bultitude are the Co-chairman of the PSMA Packaging Committee.  They look forward to seeing all of you in Grenoble, France August 24-26, 2022.

Sponsored by:                                                                

Power Sources Manufacturers Association (PSMA)
IEEE Power Electronics Society (PELS)       
IEEE Electronic Packaging Society (EPS)
IEEE Dielectrics and Electrical Insulation Society (DEIS)
European Center for Power Electronics (ECPE) 

Organizing Committee:


General Chair: Francesco Iannuzzo, Aalborg University
Technical Chair: Nick Baker, University of Alabama
Finance Chair: Andrew Lemmon, University of Alabama
Publications Chair: Ramchandra Kotecha, GE
Publicity Chair: Brian Narveson, PSMA

International Workshop on Integrated Power Packaging (IWIPP) 2019


The 2019 International Workshop on Integrated Power Packaging (IWIPP) was held the LAPLACE CNRS, Toulouse, France, April 24-26, 2019.  Dr. Thierry Lebey the Director and General Chair of the workshop welcomed us to Toulouse on the first day.  Attendance was up 30% compared to 2017 (94 registered attendees in 2019 vs. 72 in 2017).  This increase in interest probably reflects the importance of improved power electronics packaging for more efficient power through many industries.  There was a significant international representation; approximately 50% of attendees from Europe, 35% from the US, and 15% from Asia.

IWIPP 2019 Attendees

The technical program this year was very strong with positive feedback from audience members that indicated that the program exceeded expectations for content quality.   Since Toulouse is the center of the European Aerospace Industry it is not surprising that many of the presentations were related to the Electrification Challenges in Aeronautics.  These were reviewed in a Plenary by Dr Christophe Lochot of Airbus.  Although this gave us an insight into these issues, one of the core characteristics of IWIPP is that it has always been a multi-disciplinary workshop and this year was no exception.  Power packaging design requires expertise from a range of engineering disciplines; including electrical, thermal, mechanical, and materials.  Attendees were exposed to all aspects of power electronics packaging over a wide range of interdisciplinary research.  The use of wide band gap semiconductors and the challenges these present for packaging were discussed by many presenters.  Dr Ty McNutt of Wolfspeed gave a tutorial on System Level Reliability for SiC Power Modules and Dr. Ahmed Elasser of GE Global Research reviewed the history and future prospects for SiC.  The critical packaging design aspects associated with higher switching frequencies and temperatures were reviewed in depth.   Dr. Aaron Brovont of the University of Alabama gave a tutorial on assessing EMI in power electronics and novel approaches to thermal management were reviewed by Dr. Ercan Dede of Toyota.  As power packaging becomes more critical to Aerospace and Automotive Industries understanding reliability is extremely important and the origins of these limits were described by Dr. Laurent Dupont IFSTAR-SATIE in his Plenary presentation.

Many of the oral presentations described various approaches to enhancing performance through improved packaging materials and better circuit designs.  Several different developments were described in detail including the use of aluminum metallized silicon nitride substrates as well as the increasing use of sintered metal and transient liquid metal interconnects.  The performance of coatings for very high voltage insulation was reviewed in detail. Packaging passive components to achieve higher power densities whilst reducing parasitic inductance and resistance was reviewed in some of the presentations. 

In addition to presentations by leaders from academia and industry students also presented their work in oral and poster presentations.  To encourage student participation to present their research findings and cultivate interest in packaging technologies among the next generation of engineers IWIPP 2019 offers a Student Travel Grant Award  In 2019 this was won by Brian T. DeBoi of the University of Alabama who presented work on Bus Snubber Optimization for Multi-Chip Power Modules supervised by Dr Andrew N. Lemmon. Brian's research focuses on improving frequency-domain characterization and behavioral die modeling methods of silicon carbide utilizing devices and their surrounding packaging. These improved models and parasitic estimations can be leveraged in simulation to better understand what parameters are most impactful on device behavior, and to devise techniques to improve performance of real-world systems.

There were plenty of networking opportunities at the poster session at the several benchtops exhibits and during the tours of the Power Electronics & Integration, Smart Grid & Emulation and Actuation & Electroactive Morphing Laboratories.  Discussions continued through the Banquet Dinner sponsored by Wolfspeed (Diamond Level Sponsorship).  The high-quality food and wine provided during the Banquet and meetings probably set a new benchmark for the workshop.

Additional sponsorship was provided by Littelfuse and KEMET (both at Platinum Level) and Heraeus (Gold Level Partner).  This workshop was endorsed by IEEE Power Electronics Society, IEEE Electronics Packaging Society, IEEE Dielectrics and Insulation Society, Power Sources Manufacturers Association, the European Center for Power Electronics and Power Sources Manufacturer's Association This broad participation of academia and industry resulted in a multi-disciplinary event to present and discuss innovative solutions to address the challenges of power packaging in many applications.  Planning will begin soon for IWIPP 2021 that will expand this commitment to the power packages of tomorrow.  People interested in helping to organize for 2021 can just reach out to Dr. Andrew Lemmon at lemmon@eng.ua.edu.

Sponsored by:
IEEE Power Electronics Society (PELS)
IEEE Components, Packaging, and Manufacturing Technology Society (CPMT)
IEEE Dielectrics and Electrical Insulation Society (DEIS)
Power Sources Manufacturers Association (PSMA)
European Center for Power Electronics (ECPE)


Provided by Dr. John Bultitude, PSMA Representative,
with additional input from Dr. Andrew Lemmon, IWIPP 2019 Finance Chair


International Workshop on Integrated Power Packaging (IWIPP) 2017

The 2017 International Workshop on Integrated Power Packaging (IWIPP), which was held at the Technical University of Delft from April 5-7, was a great event focused on upcoming developments in packaging from the device to the system, with 80 total attendees across industry, research, and academic institutions in the fields of power packaging and system design. This year's attendees were exposed to three days of inter-disciplinary technical content focused on the enhanced understanding of the major issues within the power packaging industry. On both Wednesday and Thursday morning, the conference agenda was opened with curated tutorials – one on Packaging & Thermal Management by Dr. Patrick McCluskey of the University of Maryland, and one on Electrical Insulation by Dr. Thierry Lebey of the University of Toulouse. Friday morning introduced a Modeling & Reliability Panel Session with leaders from different simulation and modeling fields across both academic and industry organizations. This year's technical sessions addressed Systems & Circuits,  Power Modules, Packaging & Interconnects, Thermal Management, and Sensors, Passives, & EMI. In addition to the technical sessions, tutorials, and panel sessions, each day also included invited keynote presentations selected to discuss the future of the wide bandgap and power packaging industry.

Wolfspeed's Brice McPherson, a power module design engineer, presenting on how innovative thermal management techniques can improve the Hybrid-Electric Vehicle Market.
Second day of Technical Sessions.

The 2017 IWIPP Student Travel Grant Award winner was Andrea Wallace of the University of Arkansas, who presented on her research group's work with Thermo-Mechanical Reliability of Silicon Carbide Schottky Diode Flip-Chip packaging. Andrea is a first-year Ph.D. student in the Center for Space & Planetary Sciences Department, pursuing research in the field of Power Packaging for High Temperature Applications under Dr. Alan Mantooth. Andrea's Bachelor of Science in Mechanical Engineering, coupled with her career goal to work with space-bound systems, lead her to choose the power packaging research field and to attend the 2017 IWIPP event, due to its inter-disciplinary nature.

General Chair, Dr. Ty McNutt, of Wolfspeed presenting IWIPP's 2017 Student Travel Grant Award Winner, Andrea Wallace, with her conference stipend.
View from Wolfspeed's Conference Banquet activity, which was a guided tour through the historic canals of Delft.

While the conference was heavy with technical sessions, there were also plenty of networking opportunities available to attendees. On Wednesday, upon conclusion of the technical sessions, attendees were invited to a Poster, Lab Tour, & Exhibition Reception, sponsored by Murata. There were three posters, which represented technical papers included in the proceedings, and five technical demonstrations from TU Delft researchers; a tour of TU Delft's famous High Voltage laboratory was also provided during Murata's Welcome Reception. On Thursday evening, the conference attendees celebrated a successful event with a boat trip through the historic canals of Delft, followed by the Wolfspeed Conference Banquet where prizes from IWIPP's industrial sponsors were raffled off. Winners received: an Apple Watch, courtesy of Wolfspeed; an Apple iPad, courtesy of Murata; a Lego® Mindstorms® set, courtesy of Littelfuse; and Holland's famous Stroopwafels, courtesy of ISP Systems.

The 2017 event brought together a multi-faceted group of supporting technical organizations; in addition to the Power Sources Manufacturers Associations (PSMA), the event also included: the IEEE Components, Packaging & Manufacturing Technology Society; the IEEE Dielectric & Electrical Insulation Society; the IEEE Power Electronics Society; and the European Center for Power Electronics. These societies all remain committed to expanding the future development of the International Workshop on Integrated Power Packaging. The next International Workshop on Integrated Power Packaging is currently being planned, and the 2019 location will be announced on the website in the coming months. For 2019, the IWIPP Steering Committee plans to expand its commitment to bringing together inter-disciplinary thought leaders in the field of power packaging to discuss innovative solutions to the industry's biggest challenges. Please stay tuned for more information about the event from PSMA and to learn how you can become involved in the 2019 event.

Provided by Lauren Kegley, IWIPP 2017 Sponsorship & Publications Chair