We are delighted to invite you to attend and submit your work to 3D-PEIM 2026, taking place November 16–19, 2026, at Arizona State University in Tempe, Arizona.
The 3D-PEIM Organizing Committee is pleased to announce the addition of four two-hour short tutorials to the 3D-PEIM conference program.
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Advanced Packaging
George Dogiamis (DECA), Chanyeop Park (ASU), Hongbin Yu (ASU), Leslie Hwang (ASU), and Chris Bailey (ASU) -
Die-Attach by Metal Powder Sintering: The Science and Practice
G.Q. Lu (Virginia Tech) -
Digital Twin-Driven Reliability and Prognostics in Power Electronics Systems
Jong Eun Rye (North Carolina State University) -
Trends in Magnetic Material Properties to Meet the Challenges of Supporting High-Performance Computing
Matt Wilkowski
These short tutorials will be held on Monday, November 16, from 1:00 PM to 5:15 PM. The tutorials are free. You will be able to register for the tutorials you wish to attend at the time of conference registration, which will open in June. Additional details for these short tutorials are available on the conference website.
The Future of 3D Power Packaging Starts Here
Join leading researchers, innovators, and industry pioneers from around the world at 3D-PEIM 2026, the premier international symposium dedicated to 3D power packaging and heterogeneous integration. This year’s event brings together breakthrough technologies, real-world applications, and unparalleled networking opportunities—all set against the vibrant backdrop and sunshine of the Southwest.
Whether you are advancing fundamental research or driving next-generation products to market, 3D-PEIM 2026 is where ideas spark collaboration and innovation accelerates.
Our Biggest and Most Dynamic Program Yet
3D-PEIM 2026 features our most ambitious technical program to date, including:
- 6 distinguished plenary speakers delivering visionary insights
- 7 in-depth technical sessions covering cutting-edge developments
- Expert-led tutorials designed to deepen your technical expertise
- Interactive poster sessions and industry showcases
- Exclusive guided lab tours of ASU’s renowned MacroTechnology Works facility
Be Part of What’s Next
3D-PEIM 2026 is more than a symposium. It’s a global community of researchers, engineers, and industry leaders working together to define the next era of 3D power electronics.
- Abstract Submission Deadline: May 8, 2026
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Registration Opens: June 8, 2026
Please note that the abstract submission portal is now open. We encourage you to plan your submissions and participation in this exciting event in Phoenix, Arizona.
For full details—including information for sponsors and exhibitors—please visit: https://www.3d-peim.org/
The first International Symposium on 3D Power Electronics and Manufacturing was a true success! On June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and began with three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.
A highlight was the Plenary Road Mapping session chaired by Brian Narveson, PSMA, with keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.