Packaging Forum

Packaging Info & Resources
for the Power Electronics Industry.

 

Resources

PSMA Packaging Committee Members

Co-chair:
Brian Narveson

Email: bcnarveson@gmail.com

Co-chair:
Ernie Parker

Crane Aerospace & Electronics
Phone: 425-743-8430
Fax: 425-743-8562
Contact e-mail: ernie.parker@crane-eg.com

Arnold Alderman
Anagenesis, Inc.

Charles Bailey
GaN Systems

John Bultitude
KEMET Corporation

Louis Burgyan
LTEC

William Chen
ASE

Bob Conner
X-Celeprint

Dan Eifert
Lockheed Martin

Rick Fishbune
IBM

Michael Hayes
Tyndall National Institute

Edward Herbert

Daniel Homiak
Lockheed Martin

Prof Doug Hopkins
NC State University

Jaren Hornberger
Wolfspeed

Greg Hunsinger
TowerJazz

Steven Kowalec
Continental Corporation

Jason Kulick
Indiana Integrated Circuits

GQ Lu
Virginia Tech

Fang Luo
University of Arkansas

Andy Mackie
Indium Corporation

Patrick McCluskey
University of Maryland

Mitsuhiro Nakamura
Sony

Cian O'Mathuna
Tyndall National Institute

P.M. Raj
Georgia Tech

Lee Smith
UTAC Group

Dennis Stephens
Continental Corporation

Noah Sturcken
Ferric

Ralph Taylor

Matt Wilkowski
EnaChip

Mike Wingard
Amphenol

 

Resources for further research and understanding

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