New product announcements


RECOM Power 230W 4”x 2” Power Supply Features Baseplate Cooling and Medical Certification with Enclosure Options
Posted: 2020-7-16

RECOM introduces a highly compact 4”x 2” 230W innovative baseplate-cooled power supply for 2 x MOPP medical, household, industrial and ITE applications.

The new, compact 4”x 2” RACM230-G series power supplies from RECOM support up to 160W continuous output power and 230W for several seconds for loads with peak demands, without fan cooling. With forced air, depending on model, line input and ambient temperature, 230W is available continuously. Outputs available are 12V, 24V, 36V, 48V and 54V nominal with conversion efficiency up to 92% and an operating temperature range of -40 to +80°C. International safety certifications include 2 x MOPP (250VAC) medical, household, industrial and audio/video/ITE for operation up to 5000m altitude with universal 80 - 264VAC input, enabling worldwide-compliant operation. Standby power consumption is less than 500mW. Additional features as standard include a smart fan output. For flexibility, the RACM230 series is available as an open-frame design or in an enclosed metal housing. For higher output power, up to 550W, the new RACM550-G series is also available with similar or enhanced specifications with even higher power products in the pipeline. For more information, visit www.recom-power.com.

Power Integrations Releases Highly Integrated InnoSwitch3 Flyback Switcher IC for Automotive BEV and PHEV Applications
Posted: 2020-7-15
InnoSwitch3-AQ achieves Q100; operates efficiently from 30 V to 550 V DC input

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the production release of the InnoSwitch™3-AQ, an AEC-Q100-qualified flyback switcher with integrated 750 V MOSFET and secondary-side sensing. The newly qualified device family targets automotive EV applications, such as traction inverter, OBC (on-board charger), EMS (energy management DC/DC bus converters) and BMS (battery management systems).

The InnoSwitch3-AQ uses Power Integrations’ high-speed FluxLink™ coupling to achieve ±3% accuracy for combined line and load regulation while eliminating both dedicated isolated transformer sense-windings and optocouplers. FluxLink technology maintains output voltage regulation even under the transient stress test, which is particularly challenging for PSR-based implementations. The integrated 750 V MOSFET meets stringent automotive de-rating requirements, and an on-chip synchronous rectifier controller delivers above 90% efficiency at the nominal 400 VDC input voltage. Optimized InnoSwitch3-AQ designs achieve less than 10 mW no-load energy usage across the input voltage range. The InnoSwitch3-AQ family ICs are packaged in a surface-mount InSOP with 11 mm primary to secondary creepage, which exceeds the stringent requirements for high altitude (> 5000 m) isolation.

The RDR-840Q reference design kit incorporating the newly released IC demonstrates start-up, shutdown and efficient operation from 30 VDC to 550 VDC input, as well as fast transient response and a variety of safety and protection features.

Comments Power Integrations’ product marketing manager, Edward Ong: “The InnoSwitch3-AQ represents the highest level of integration for a flyback controller, resulting in automotive power supplies with the lowest component count and smallest PCB area. The high efficiency of the device across a wide load range means that it easily meets the automotive industry’s demanding thermal requirements.” Ong continued “FluxLink technology enables accurate performance and is highly reliable.”

InnoSwitch3-AQ ICs are available in the InSOP-24D package. Devices are available now with prices starting at $2.75 in 10,000-piece quantities. Technical support for the chipset is available from the Power Integrations website at: ac-dc.power.com/products/innoswitch3-aq

CUI Inc New 160 W GaN Adapters Offer 48% Size Reduction
Posted: 2020-7-14

CUI Inc has announced the addition of two GaN desktop ac-dc power supply series to its SDI product family. The SDI160G-U and SDI160G-UD offer 160 W of continuous power from a compact desktop package. These ac-dc supplies have been designed for a wide range of portable industrial and consumer products, where efficient power is needed in a lighter, smaller adapter package.

The SDI160G-U and SDI160G-UD comply with UL/EN/IEC 62368-1 requirements. The adapters also meet the current average efficiency and no-load power specifications mandated by the US Department of Energy (DoE) under the Level VI standard and the European Union’s (EU) CoC Tier 2 directive for universal input voltage ranges; with up to a 200% increase in power density, no-load power consumption as low as 150 mW, and universal input voltage ranges of 90 ~ 264 Vac.

The SDI160G-U series offers a three prong (C14) inlet, while the SDI160G-UD features a two prong (C8) inlet. Measuring 6.33 x 2.13 x 1.3 in. (161 x 54.2 x 33.2 mm.), the compact new models are 48% smaller than the non GaN models.

The SDI160G-U and SDI160G-UD are available immediately with prices starting at $122.57 per unit at 5 pieces through distribution. Please visit www.cui.com for more information.
 

EPC and Microchip Develop 300 W 16th Brick, 48 V – 12 V DC-DC Converter Demonstration Board for High-Density Computing and Data Centers
Posted: 2020-7-14

The EPC9143 power module integrates Microchip’s dsPIC33CK digital signal controller (DSC) with the latest generation EPC2053 eGaN FETs from EPC to achieve 96% efficiency in a 48 V input to 12 V output conversion at 25 A. The switching frequency of 500 kHz enables the 300 W in the very small 16th brick format which is just 33 mm x 22.9 mm (1.3 x 0.9 in).

Additional phases can be added to this scalable 2-phase design to further increase power. The flexibility of the Microchip digital controllers allows the input voltage to be adjusted from 8 V – 72 V and the output voltage from 3.3 V – 25 V.

eGaN® FETS and integrated circuits provide the fast switching, small size and low cost that can meet the stringent power density requirements of these leading-edge applications with low component count and solution cost.

For more information, visit epc-co.com/epc/

KEMET Introduces Three New Series of Film Capacitors for Rapidly Expanding Green Energy and Automotive Applications
Posted: 2020-7-7
C44U-M, C44P-R, and R75H series offer reliable power conversion and power density performance

KEMET, a leading global supplier of electronic components, today announces three new series of metallized polypropylene dielectric film capacitors: C44U-M, C44P-R, and R75H. Constructed with an aluminum canister design, both the C44U-M and C44P-R power film series address the increasing demand for high-power conversion systems in green energy and industrial applica-tions. These capacitors also support power conversion in energy storage systems, IGBT and wide bandgap (WBG) semiconductor devices. The R75H series, a radial box pulse capacitor, is similar in that it supports these applications, but also addresses the automotive sector with its high voltage, AEC-Q200 certified design.

The latest C44U-M series features a DC-Link and DC filter power film capacitor designed for high-power conversion systems applications in green energy, industrial, and energy storage sys-tems. It supports DC networks and proportionally supplies high current based on circuit needs or load demands—a common characteristic in wind, solar, and storage energy technologies. Its high DC voltage load capability (1,800 VDC) and high ripple current make this UL810-certified capacitor optimal for high capacitance while minimizing ESR. Similarly, the new C44P-R series is UL-810-certified and features high current capability for input and output AC filtering (up to 1,000 VAC) in solar converters, wind turbines, uninterruptible power supplies, and power factor correction systems. These cylindrical aluminum canister capacitors allow for higher energy den-sity, extended life, reliability, and quality constructions due to our fully vertically integrated manu-facturing facility in Bulgaria.

Designed with a radial box style for PCB mounting, the R75H Pulse series includes the same high energy density, extended life, and reliability benefits. This series meets one of the most rig-orous reliability standards in the industry with its high voltage range (up to 2,000 VDC), high ca-pacitance range, high dv/dt capability, and AEC-Q200 certified design. These automotive-grade capacitors can support power conversion for on-board electronics systems and on-board battery management systems in vehicles, micro-inverters in solar panels, and WBG semiconductor de-vices in power supply systems. This series is designed for versatility in harsh conditions due to its THB (Temperature Humidity Bias) test capability of up to 85 ºC/ 85 R.H and operating tempera-ture up to 125°C. Its high temperature capability is well-suited for applications that require minia-turization and fewer capacitors due to elevated temperatures and frequencies, such as resonant tank circuits with WBG semiconductor components.

These film capacitors launch at a time when renewable (green) energy and technologies are growing at a steady pace. In the International Energy Agency’s (IEA) “Renewables 2019” report, the total global renewable-based power capacity will grow by 50 percent between 2019 and 2024. Solar photovoltaics technology, utilized by solar panels, accounts for over half of the growth, while onshore wind technology accounts for 25 percent of the growth. With major growth in China specifically, Asia accounts for most of the global renewable capacity expansion over the forecast period. Along the same line in automotive technologies, the market for on-board chargers for electric vehicles is estimated to reach $10.8 billion by 2027 with a CAGR of 22.5% from 2020 to 2027 (*Source: Electric Vehicle On Board Charger Market by Power Output, Vehicle Type, and Propulsion Type: Global Opportunity Analysis and Industry Forecast, 2020–2027 by Allied Market Research, July 2020)

To learn more about these power conversion technologies, visit www.kemet.com/en/us/applications/power-conversion.html.

 

Asymmetrical Output, Isolated Dc-Dc Converters Added to CUI Line
Posted: 2020-6-23

CUI Inc. has announced the addition of four isolated converters to its isolated dc-dc converter line. The PRQ3W-S, PQD10W-D, PQF20W-D, and PRF30W-D are 3 to 30 W, dual regulated, dc-dc converters in SIP & DIP packages. These converters additionally offer wide input ranges, robust operating temperatures, and EN 62368-1 certification.

The PRQ3W-S series offers up to 3 W of continuous power, an ultra-wide 4:1 input range, and a wide -40 to +85 °C temperature range in a SIP package. These low power dc-dc converters provide a rugged solution for sensitive applications, including medical equipment, hybrid module systems, datacom, telecom, distributed power supply systems, and remote-control systems.

The PQD10W-D series offers up to 10 W of continuous power, an ultra-wide 4:1 input range, and a wide -40 to +85°C operating temperature range in an industry standard 1” x 1” DIP package. These dc-dc converters are suitable for convection-cooled equipment and applications including micro and industrial controllers, datacom, telecom, remote sensor systems, and industrial equipment.

The PQF20W-D series offers up to 20 W of continuous power, an ultra-wide 4:1 input range, and a wide -40 to +105°C operating temperature range in a DIP package. These dc-dc converters are ideal for regulated dual output applications such as datacom, telecom, distributed power systems, and hybrid module systems.

The PRF30W-D series offers up to 30 W of continuous power, an ultra-wide 4:1 input range, and a wide -40 to +85°C operating temperature in a DIP package. These dc-dc converters are perfect for applications such as relay protection, datacom, telecom, hybrid module systems, remote control platforms, and industrial equipment, as well as battery-driven applications where charging and discharging conditions require an ultra-wide input range.

The PRQ3W-S, PQD10W-D, PQF20W-D, and PRF30W-D all offer asymmetrical outputs, which is a feature that is new to CUI’s line of dc-dc converters. This asymmetrical, independently isolated output feature means that each of the PRQ3W-S, PQD10W-D, PQF20W-D, and PRF30W-D feature two outputs that are isolated from each other. Asymmetrical outputs make these dc-dc converters ideal for space constrained applications that require two load outputs, such as motor control circuits, distributed power supply systems, and hybrid module systems.

For more information, visit www.cui.com

KEMET Advances Its Latest Environmental Sensor Solutions for Industrial Applications
Posted: 2020-6-18
Pyroelectric passive infrared (PIR) sensors allow for easy integration, configuration and more design-in possibilities

KEMET, a leading global supplier of electronic components, continues to strengthen its solutions for industrial applications with its range of environmental PIR sensors. By utilizing the pyroelectric effect, these thin-film PZT sensors have both high sensitivity and fast response times to ensure rapid and accurate detection of gas, flame, motion, food and organic compounds for industrial automation, lighting, power generation and distribution, among many other applications.

Built with hybrid micro-electromechanical systems (MEMS) technology, these high-quality environmental sensors are packaged in a small surface-mount device (SMD) for use in portable and battery-powered detectors. Their capacity for low power consumption, low maintenance, and low sensitivity to mechanical and thermal shock allows for stable performance and a lifespan of up to 15 years, making them ideal for small, smart, or IoT (Internet of Things) devices in industrial, consumer, automotive and medical applications. Compatibility with industry-standard I2C communication enables plug-and-play connectivity to microcontrollers making these sensors easy to configure, tune, and calibrate.

KEMET’s environmental PIR sensors, which use the standard semiconductor manufacturing process, are well-suited for industrial applications. These components are positioned for growth in the environmental sensor market. According to a 2020 report from 360 Market Updates*, the global environmental sensor market is expected to grow at a CAGR of 5.4 percent from 2020 to 2025 and reach USD 1550.1 million by 2025.

KEMET’s range of environmental sensors is available immediately via KEMET distributors. To learn more about their capabilities and applications, visit www.kemet.com/en/us/applications/sensing.html.

*Source: Global Environmental Sensor Market 2020 by Manufacturers, Regions, Type and Application, Forecast to 2025, 360 Market Updates, February 2020

CDE Energy Dense, Very Low-Profile Capacitors, Now 5,000 Hour-Rated
Posted: 2020-6-16
THA and THAS Series Thinpack aluminum electrolytic capacitors deliver the highest-energy density in a low-profile

First introduced in 2018, Cornell Dubilier Electronics, Inc. (CDE) has made significant design tweaks to their groundbreaking THA and THAS Series Thinpack capacitors. The product updates raise the rated life to 5,000 hours, a 66% increase over the first-generation devices. The key strength of the series is still high-energy-density. The 85 °C THA Series Thinpack capacitors are only 8.2mm thick, and 9mm for the 105 ºC THAS Series.  While of similar height to V-chip electrolytics, tantalums, and board-mounted axials, THA and THAS offer much higher bulk-storage capability.  For example, a single THA/THAS capacitor can replace an entire board full of SMT, axial or radial aluminum electrolytic or solid tantalum capacitance arrays.  The upgrade to a 5,000-hour rating expands the potential range of applications to the longer life commercial and MIL/Aero devices. All THA/THAS capacitors sold after January 1, 2020, will meet the new performance specifications. Pricing is unchanged.

THA/THAS Series capacitors are thinner and more cost-effective than most alternative technologies.  Unlike traditional cylindrical electrolytics, THA/THAS capacitors have sealed, laser-welded aluminum cases to eliminate the need for space-wasting end seal gaskets. Compared to cylindricals, flat THA and THAS capacitors are up to 60% smaller by volume. The design includes a valve to vent hydrogen gas buildups that may otherwise cause pressure-related swelling.  The 105°C rated THAS Series adds a 0.38mm form-fitting stainless-steel sleeve to further prevent potential swelling at the highest temperatures.

Compared to a bank of SMT or axial aluminum electrolytic capacitors comprising similar total values, THA/THAS capacitors can offer significant cost, weight, and space savings. The benefits include requiring about 70% less board space than alternatives. Even where size or weight reduction is not essential, the smaller part and connection count improves overall circuit reliability (one part vs. many).  The THA is rated at 5,000 hr. life @ 85°C; and the THAS is rated at 5,000 hr. life @ 105°C.  Values range from 140 µF at 450 Vdc to 18,000 µF at 10 Vdc, with 72 capacitance/voltage combinations available for each series. 

Potential applications include any circuits that require high capacitance bulk storage and filtering.  These include: tablets, laptops, instrumentation, commercial-grade LED driver modules, compact power supplies, drones and RPVs, set-top boxes, 1U rack-mounted devices, and other high-performance, low-profile devices.
CDE’s THA and THAS Thinpack aluminum electrolytic capacitors are available now from CDE’s franchised distributors.  For more information on this series visit: cde.com/new-product/tha-thas
 

CUI Inc: Introducing High Density Internal Ac-Dc Power Supplies for Medical & Dental Applications
Posted: 2020-6-9

CUI Inc today announced the addition of four high-density ac-dc power supply series to its medical product family. The VMS-450B, VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF offer 450 W of continuous power from compact chassis mount packages. These ac-dc supplies have been designed for space-constrained medical and dental applications where reliability and regulatory compliance are major concerns.

The VMS-450B, VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF comply with the medical 60601-1 edition 3.1 safety standards for 2 x MOPP applications and 4th edition EMC requirements. These internal medical power supplies additionally offer 5 Vdc AUX output, power factor correction, and over temperature, over voltage, over current, and short circuit protections.

With an industry standard 3" x 5" footprint and an open frame package, the VMS-450B is ideal for applications with less space and heat management outside of the unit. The VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF come in a metal case with various fan configurations for ultimate flexibility;

  • VMS-450B-CF - Top Fan
  • VMS-450B-CFS - Side Fan
  • VMS-450B-CNF - No Fan
  • VMS-450B - Open Frame

For more information, visit www.cui.com.

 

RECOM Announces the Launch of its RACM60-K Series of 60W AC/DC Power Supplies
Posted: 2020-6-3
Open frame AC/DCs feature high efficiency

RECOM is adding the RACM60-K series to its range of open-frame AC/DC power supplies.The low-profile 2“ x 3” design features 90% efficiency across its load range, enabling full-power operation from -40°C to +55°C without forced cooling, and up to +85°C with derating or forced air. Input range is universal 80-264VAC and outputs available are 5V, 12V, 15V, 24V, 36V and 48V.

The parts are suitable for a wide range of applications with EN 62368-1, IEC 61558-1/-2-16 and IEC/EN 60335-1 certifications for ITE/audio-visual, industrial and household use respectively up to 5000m operating altitude. Medical safety and EMC certifications meet ANSI/AAMI/IEC/CSA 60601-1 for 2x MOPP with an isolation of4kVAC/1 minute suitable for B and BF applications up to 4000m operating altitude. Class B EMC standards are also met in installation class II or class I PELV with grounded output.

The RACM60-K series features full protection against short-circuits, output over-voltage, over-current and over-temperature and has line and neutral fusing for medical applications. No-load input current is only 100mW typical at 230VAC. 

Various mounting options are available: Molex connectors for wired installation, wave-solder pins for direct PCB mount with built-in stand-offs and a 2” x 4” footprint for legacy design compatibility. A cover is available for the 2” x 4” option.

According to Steve Roberts Innovations Manager at RECOM: “The high efficiency of these products, right down to 10% load, is a major advantage when the application is space-constrained and only convection cooling is available”.

For more information, www.recom-power.com

 

KEMET Extends KC-LINK™ Range Using KONNEKT™ High-Density Packaging Technology
Posted: 2020-6-2
Designed for use by power electronics engineers where high-power density and high efficiency in a small form factor is critical

KEMET Corporation, a leading global supplier of electronic components, continues to strengthen its power conversion solutions by extending its popular KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications. This technology combines KC-LINK’s robust and proprietary C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution well-suited for both high-density packaging and high-efficiency applications, producing up to four times the capacitance compared to a single multi-layer ceramic capacitor.

High mechanical robustness allows KC-LINK capacitors with KONNEKT to be mounted without the use of lead frames. This design provides extremely low effective series inductance (ESL), increasing the operating frequency range and allowing for further miniaturization. Available in commercial grade with tin termination finish, this series is Pb-Free, RoHS and REACH compliant. Capacitors utilizing KONNEKT technology have the unique ability to be mounted in a low-loss orientation to increase their power handling capability further.

Combining KEMET’s revolutionary Class 1 C0G dielectric system with KONNEKT technology offers a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. These components are positioned for growth within the DC/DC converter market in aerospace, medical and automotive applications. According to Business Insider*, the global DC-DC converter market is expected to grow at a CAGR of 17.5% from 2019 to 2025 and reach USD 22.4 billion by 2025.

“The low ESR of KC-LINK capacitors results in best-in-class ripple current capability,” said Dr. John Bultitude, KEMET Vice President and Technical Fellow. “Combined with KONNEKT technology, this solution delivers thermal stability and mechanical robustness through increased efficiency by combining multiple capacitors into a single high density, ultra-low loss package.”

KEMET’s KC-LINK range with KONNEKT technology is available immediately via KEMET distributors. To learn more about KC-LINK with KONNEKT technology capabilities and applications, visit kemet.com/konnekt

*Source: DC-DC Converter Market by Vertical, Form Factor, Product Type, Output Power, Input Voltage, Output Voltage, Sales Channel, Output Number and Region - Forecast to 2025, Business Insider, November 2019
 

Cornell Dubilier Defibrillator Capacitors Offer High Energy Density, Multiple Packaging Options
Posted: 2020-5-5
Also offers ability to mold capacitors into a module

Cornell Dubilier Electronics, Inc. announces the availability of its Q Series film capacitors for medical defibrillator applications.  Designed specifically for today’s quick response and professional use defibrillators, the Q Series meets the reliability demands of Class III medical devices.  Used extensively in automated external defibrillators (AEDs), the series offers designers the highest in-class energy density and broadest range of packaging options.

Q Series capacitors are designed for use in monophasic and bi-phasic defibrillators with energy densities as high as 2 J/cc. Some designs can deliver in excess of 500 joules when fully charged.  Voltage ratings range from 800 Vdc to 6,000 Vdc with capacitance values covering the range from 32 to 500 μF.

Standard packages include oil-filled metal cases or epoxy-filled plastic cases, both available in either round or oval configurations.  A multitude of terminations are available ranging from quick-connect blades to insulated wire leads. The company also has the capability of integrating capacitor windings into a custom molded package to achieve the smallest possible profile and highest energy density for the end-device.

Over the past 20 years CDE’s engineers have advanced the metallized film capacitor technology, processing and testing to help its customers achieve the smallest and most reliable designs. With the capability of withstanding 40,000 charge/discharge cycles (depending on part and application), Q Series capacitors are designed for long-term reliable service where it matters the most.

For more information on these Series visit: https://cde.com/new-product/type-q

TDK Compact dual inductors with high saturation current
Posted: 2020-4-30

TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A. The magnetically shielded inductors have dimensions of just 12.5 x 12.5 x 10.5 mm3 and are designed for a wide temperature range of -55°C to +150 °C. Depending on the type, the inductors offer very high coupling factors of the two windings from 97 to 99 percent.

The fields of application of dual inductors are diverse: Indeed, they can be used as coupled inductors in SEPIC (Single-Ended Primary Inductance Converter) or 1:1 transformers in flyback topologies. A further application involves use as a common-mode inductor in power supply lines. The isolation voltage between the two windings is >500 V.

Main fields of application

  • Common-mode inductors in power supply lines
  • DC/DC converters in SEPIC topology
  • Flyback converters

Main features and benefits

  • High saturation currents of up to 16.1 A
  • Low dimensions of just 12.5 x 12.5 x 10.5 mm3
  • Wide temperature range of -55°C to +150°C
  • High coupling factor of up to 99 percent

You can find further information about the products at www.tdk-electronics.tdk.com/en/power_inductors.

TDK OVC III certified 600W half-brick power module operates from a 200 to 425Vdc input
Posted: 2020-4-27

TDK Corporation announces the introduction of the TDK-Lambda PH600A280-24 DC-DC converter.  Rated at 24V 600W, this further extends the 280Vdc nominal input PH-A series from 50W to 600W. The PH-A series is utilized in HVDC (High Voltage Direct Current) equipment for data communications, high voltage transmission, renewable energy applications, robot controllers and factory automation.

Certification to the safety standard EN 62477-1 (Over Voltage Category III) benefits users requiring compliance to the machinery safety standard IEC 60204-1.  The PH600A280 does not require an isolation transformer on the distribution panel, reducing cost, size and weight.

The PH600A280-24 accepts a wide range 200 to 425Vdc input delivering 24V at 12.5A.  The output voltage can be set between 14.4 and 28.8V using the trim terminal. With an efficiency of 93%, the module can operate at full load with baseplate temperatures of -40°C to +85°C, derating linearly to 80% load at +100°C.  Conduction cooling through the baseplate enables the PH-A to be used in outdoor sealed enclosures or liquid cooled equipment.

Following the industry standard, the half-brick package measures 61.0 x 12.7 x 57.9mm (WxHxL).  The PH600-A has remote on-off, over-current and over-voltage protection and a five-year warranty.  Input to output isolation is 3,000Vac and is safety certified to IEC/EN/UL/CSA 62368-1, EN 62477-1 (OVC III) with CE marking for the Low Voltage and RoHS Directives

More information on the PH-A series, including distributor inventory, can be obtained from the TDK-Lambda Americas website at https://www.us.lambda.tdk.com.

Main applications

  • Data communications, high voltage transmission, renewable energy applications, robot controllers and factory automation

Main features and benefits

  • Very compact half-brick package
  • Up to 93% efficient
  • Baseplate cooled
  • -40 to 100oC baseplate temperature range
  • Certified to EN62477-1 (OVC III)
     

 

ON Semiconductor Expands its Portfolio for Industrial Motor Drive Applications
Posted: 2020-4-27

ON Semiconductor, driving energy efficient innovations, continues to expand its portfolio for industrial motor drive applications, to further help customers solve their specific design challenges. Motor drive systems are proliferating along with industrial automation and robotics. These systems require energy efficiency, precise measurement, accurate control, and high reliability within harsh industrial environments. Effective semiconductor development for industrial motor drive requires advanced design, ability to integrate active and passive components, sophisticated packaging including substrate material, and high quality and reliability standards.

ON Semiconductor announced the NXH25C120L2C2, NXH35C120L2C2/2C2E, and NXH50C120L2C2E, which are 25, 35, and 50 Ampere versions of Transfer-Molded Power Integrated Modules (TM-PIM) for 1200 Volt (V) applications. They are available in Converter-Inverter-Brake (CIB) and Converter-Inverter (CI) configurations. The modules consist of six 1200 V IGBTs, six 1600 V rectifiers, and an NTC thermistor for system level temperature monitoring; the CIB versions use an additional 1200 V IGBT coupled with a diode. The new modules feature transfer-molded encapsulation, extending the cycling lifetime for both temperature and power. The modules measure just 73 x 40 x 8 mm, have solderable pins, and have a standardized pin-out for CIB and CI versions.

The company also announced the NFAM2012L5B and NFAL5065L4B, expanding its Intelligent Power Module (IPM) portfolio, which includes voltage ratings of 650 V and 1200 V, and current ratings from 10 to 75 A. These 3-phase inverters - with integrated short circuit rated Trench IGBTs, fast recovery diode, gate driver, bootstrap circuits, optional NTC thermistor, and protection - provide compact, reliable modules with UL 1557 certification via an isolation rating of 2500 Vrms / minute. These IPMs feature direct bonding copper substrate and low loss silicon, enhancing power cycling lifetime and thermal dissipation.

With on-chip galvanic isolation, the NCD57000 and NCD57001 IGBT Gate Drivers enable compact, efficient, reliable gate driver designs by reducing system complexity. The devices deliver 4 / 6 A of source and sink current respectively, while also integrating DESAT, Miller clamp, UVLO, Enable, and regulated VREF.

The NCS21871 zero-drift operational amplifier, which provides precision signal conditioning with a low input offset voltage of 45 µV, and maintains that precision from -40°C to +125°C with low input offset drift of 0.4 µV/°C. These parameters make it ideal for low-side current sensing.

The NCP730 LDO Regulator delivers 150 mA with ±1% output voltage accuracy, and has an operating input voltage range of 2.7 to 38 V with low dropout. The integrated soft-start to suppress inrush current, and short-circuit and over-temperature protections for overload conditions, make the device ideal for industrial automation applications.

Additional resources & documents:
Application note: New Transfer Molded Power Integrated Module (TM PIM) for Industrial Drives
Evaluation board: Evaluation Board for Transfer-Molded Power Modules
Tutorial: Power Integrated Modules for Industrial Drives

Flex Power Modules Extends 2W DC/DC Converter Solutions for Industrial Use
Posted: 2020-4-24

Flex Power Modules has added to its range of miniature isolated DC/DC converters intended for industrial applications with the introduction of the PUB-2M series. Delivering an output power of up to 2W with no minimum load required, the high performance product is available in single or dual output options. 

Presented in a compact SMD (surface mount device) package measuring 12.75 x 11.2 x 8.0 mm (0.502 x 0.441 x 0.315 in) for single output and 15.25 x 11.2 x 8.0 mm (0.6 x 0.441 x 0.315 in) for dual output, the new unregulated DC/DC converters achieve a high efficiency, typically up to 86.5% with a 12V output under full load conditions.

The new family of isolated, unregulated DC/DC converter modules offers output short-circuit protection and MTBF figures of 17.9Mhrs. The robust converters are ideal for harsh environments common in industrial applications with a capability to reliably operate in temperatures ranging from -40°C to +110°C. The devices are safety compliant to EN/UL 62368-1, and Flex Power Modules is an ISO 9001/14001 certified supplier.

The launch of the PUB-2M series follows the company’s recently introduced PUC-2B, a series of 2W isolated, unregulated DC/DC converters with reinforced insulation for industrial applications which are housed in a compact SIP7 package.   

For more information, the full data sheet of the PUB-2M is available here: https://flexpowermodules.com/documents/fpm-techspec-pub-2m
 

Gore Launches New Online Microwave/Rf Assembly Builder
Posted: 2020-4-22

W. L. Gore & Associates has launched its updated GORE® Microwave/RF Assembly Builder, a step-by-step tool that allows the user to configure and request a quote for an assembly with a variety of connector & cable options, assembly lengths, and frequencies.

The updated online tool features enhancements that allow users to design a cable from their desktop, tablet or mobile phone. In today’s predominantly remote-work environment, these added features make it possible to design GORE® Microwave/RF Assemblies with ease, from anywhere and anytime, and from any device. “With so many engineers and specifiers currently working from home,” says Jennifer Haupt, Gore Marketing Communications, “we hope these enhancements provide a bit of ease to our customers’ online experience.”

“One feature we heard customers wanted was to be able to compare multiple GORE® Cables in a single project in the online platform,” said Keith Cuthbert, Gore Applications Engineer. “Also, customers wanted the option to build assemblies using either cables or connectors as their starting point. We’re happy that we were able to accommodate both of these requests with this Builder update.”

The new GORE Microwave/RF Assembly Builder is designed to aid those working in Test & Measurement, Spaceflight, Aerospace or Defense industries. Once the assembly has been designed, the visitor can download custom datasheets for the assemblies within minutes, as well as submit the builds for a quote. A Gore specialist will then review the submitted designs and application requirements and provide a quote on each design.

Additionally, Gore has carried over the option to retrieve specifications of existing builds. Previously constructed assemblies can be located by Gore part number and frequency, thereby speeding up the re-quoting and re-ordering process.

To view Gore’s new Microwave/RF Assembly Builder, visit gore.com/rfcablebuilder. Or contact a Gore applications specialist at electronics.usa@wlgore.com to discuss any application needs or challenges.

 

Power Integrations’ GaN Technology Increases Output Power of High-Efficiency Display PSUs to 75 W
Posted: 2020-4-21
Higher-power TVs, monitors and appliances benefit from 91% efficiency, reduced BOM, elimination of heatsinks, smaller size, lower weight

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced that its InnoSwitch™3-MX isolated switcher IC family has been expanded with the addition of three new PowiGaN™ devices. As part of a chipset with Power Integrations’ InnoMux™ controller IC, the new switcher ICs now support display and appliance power supply applications with a continuous output power of up to 75 W without a heatsink. 

The InnoMux chipset employs a unique single-stage power architecture that reduces losses in display applications by 50% when compared to conventional designs, increasing overall efficiency to 91% in constant-voltage and constant-current LED backlight driver designs. Additionally, by eliminating the need for post regulation (i.e. buck and boost) stages, TV and monitor designers can halve component count, improving reliability and reducing manufacturing cost. With a high breakdown voltage of 750 V, the PowiGaN InnoSwitch3-MX parts are also extremely robust and highly-resistant to the line surges and swells commonly-seen in regions with unstable mains voltages.

InnoSwitch3-MX flyback switcher ICs combine the primary switch, the primary-side controller, a secondary-side synchronous rectification controller, and PI’s innovative FluxLink™ high-speed communications link. The InnoSwitch3-MX receives control instructions from its chipset partner InnoMux IC, which independently measures the load requirements of each output and directs the switcher IC to deliver the right amount of power to each output, maintaining accurate regulation of current or voltage.

Comments Power Integrations’ product marketing manager Edward Ong: “By using our PowiGaN technology we are able to address higher-output applications in TVs, monitors and appliances that employ LED displays. The chipset increases efficiency beyond the requirements of all mandatory regulations and improves manufacturers’ scores in EU efficiency labeling programs.”

Technical support for the chipset is available from the Power Integrations website at: https://ac-dc.power.com/products/innomux-family/
 

Powerbox Announces Ruggedized Dual Channel Power Supply for Marine Engine Control
Posted: 2020-4-3

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, has announced the release of a new dual channel power supply for Marine engine control. Based on a ruggedized platform for use in harsh environments, the ENMA500D24/2x27-CC provides two 27V/20A isolated outputs and a total power of 540W. The power supply is housed in a robust IP56 case, it is mechanically designed for efficient conduction cooling, and it complies with DNV/GL standards.

From local low power DC/DC converters powering sensors to high power DC generators powering the whole boat, ships and vessels are full of electrical and electronic equipment requiring robust and safe power supplies. Although many applications can be powered by marine certified commercial off-the-shelf (COTS) power supplies, others are very specific, requiring unique power solutions designed to pair with the final application.

One example being the servomotors used to operate Fast Switched Valves (FSV) like the ones used for safety purposes in fuel injection pumps, orientable propellers, and engine control.

FSV operation is based on servomotors ensuring that fluids are transferred or interrupted with the highest level of safety. As failure is simply not an option in such types of equipment, FSV manufacturers often use two independent power supplies to guarantee redundancy. However, considering the equipment is installed in very compact and harsh environments, this can be a challenge for the installer.

With high levels of expertize in designing power solutions for the marine industry to DNV/GL standards, PRBX has developed the highly integrated, isolated, dual channel DC/DC converter, the ENMA500D24/2x27-CC.

Because they are often used in harsh environments, the ENMA500D24/2x27-CC is built in a robust IP56 case, resistant to high-pressure and heavy sprays of water. Being sealed to comply with IP56, the ENMA500D24/2x27-CC DC/DC converters have been designed and optimized for conduction cooling. Two lateral heatsinks facilitate the thermal exchange between the inner dissipating components and the ambient outside.

Powered by the low voltage 24V distributed supply to electronics equipment, the ENMA500D24/2x27-CC can tolerate a wide operating range of 18 to 36V, and is able to accommodate a large voltage drop down to 10V for 10 seconds. The ENMA500D24/2x27-CC delivers 27VDC / 20A and a total power of 540W and has an efficiency superior to 85%.

Typically used for safety equipment requiring redundant power sources, when redundancy is not required but the application requires two independent outputs, the ENMA500D24/2x27-CC offers two 27VDC fully isolated outputs. In that case the total output power remains at 540W though it can be balanced from 540W on one output and no load on the second to any mix between the two whilst remaining within the maximum power allowed.

The ENMA500D24/2x27-CC is protected against input reverse polarity, output short-circuit and includes over-temperature, over-voltage and over-current protection.  It is designed according to EN60068-2-x and complies with the safety standard EN 60950.

For more information, visit www.prbx.com

Wide Input and Output Range Convection Cooled DIN Rail Mount DC-DC Converters Deliver up to 250W per Output
Posted: 2020-3-24

TDK Corporation announces the introduction of the TDK-Lambda brand DIN rail mount DDA DC-DC converters.  The series uses step-down non-isolated power modules that operate from an input range of 9 up to 53Vdc, with a wide adjustable output voltage range of 3.3 up to 24V. The DDA is ideally suited for generating additional low cost, high current outputs from an existing 24V bus in industrial, semi fabrication and test and measurement equipment.

Three models are available in the DDA series.  A single nominal output +12V 20A, a dual output +12V 20A / +5V 20A and a dual output +12V 14A / -12V 8A. Output power is typically 250W for each of the positive outputs and 75W for the negative output. Convection cooled the overall output power is 250W, which can be increased to up to 500W with forced air cooling. 

Positive remote sense, remote on/off and individual power good signals are fitted as standard. The DDA series is highly efficient, up to 95%, reducing internal waste heat for reliable operation.  The models are 123.4mm high, 115mm deep and have a very narrow 36.5mm width, providing additional space on the DIN rail.

Safety certifications include IEC/EN/UL 62368-1 with CE marking for the Low Voltage, EMC and RoHS Directives.  The units also comply with EN 55032-A conducted and radiated emissions and meet the EN 61000-4 conducted, radiated and magnetic field immunity standards.

More information can be obtained at the following TDK-Lambda Americas website, https://www.us.tdk-lambda.com/lp/products/dda-series.htm

Major applications

  • Industrial, process control, semiconductor fabrication and test and measurement.

Main features and benefits

  • Provides additional low cost, lower output system voltages
  • Wide input range, 9 up to 53V
  • Wide output adjustment from 3.3 up to 24V
  • Narrow 36.5mm width
  • Convection and forced air cooling ratings
     
EPC Redefines Power Conversion with the Release of ePower™ Stage IC Family of Products
Posted: 2020-3-17

EPC announces the introduction of an 80 V, 12.5 A power stage integrated circuit designed for 48 V DC-DC conversion used in high-density computing applications and in motor drives for e-mobility.

The EPC2152 is a single-chip driver plus eGaN® FET half-bridge power stage using EPC’s proprietary GaN IC technology. Input logic interface, level shifting, bootstrap charging and gate drive buffer circuits along with eGaN output FETs configured as a half-bridge are integrated within a monolithic chip. This results in a chip-scale LGA form factor device that measures only 3.9 mm x 2.6 mm x 0.63 mm. 

The EPC2152 is the first offering in what will be a wide-range family of integrated power stages available in chip scale package (CSP) as well as multi-chip quad flat modules (QFM). Within a year the family will fill out with products capable of operating at high frequency up to 3 to 5 MHz range as well as high current from 15 A to 30 A per power stage.

This family of products makes it easy for designers to take advantage of the significant performance improvements made possible with GaN technology. Integrated devices in a single chip are easier to design, easier to layout, easier to assemble, save space on the PCB, and increase efficiency.

48 V DC-DC

When operated in a 48 V to 12 V buck converter at 1 MHz switching frequency, the EPC2152 ePower Stage achieves a peak efficiency above 96% at 12.5 A with a solution that is 33% smaller in size on the printed circuit board (PCB) compared to an equivalent multi-chip discrete implementation. The peak efficiency of 96% is substantially better than discrete MOSFET or monolithic MOSFET IC-based Power Stage.

Motor Drive

Another promising application for the ePower Stage is motor drive inverters for robotics, drones, and e-scooters. These motor drive applications require a lighter weight, higher bandwidth and lower torque ripple, which are advantages for inverters built using the EPC2152. 

EPC built a prototype using the EPC2152 to power the motor of an e-scooter. The ePower Stage device is employed in a 3-phase sinusoidal excitation, 10 ARMS per phase, 15 A peak motor drive for an efficient, quiet, high performance, and low-cost solution to BLDC motors for e-mobility.

Transphorm’s GaN Used in HZZH’s 98 Percent Efficient Power Module
Posted: 2020-3-17
Ultra-efficient 48 Volt Module is Semiconductor Company’s Latest Customer Product Targeting Data Centers

Transphorm Inc.—the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101 qualified high voltage gallium nitride (GaN) power semiconductors—today confirmed that Hangzhou Zhongheng Electric Co., Ltd has developed an ultra-efficient, GaN-based power module. The 3 kW ZHR483KS uses Transphorm’s GaN devices to reach 98 percent efficiency, making it the telecommunications industry’s most efficient GaN-powered module to date. Original design manufacturers (ODMs) can swap the ZHR483KS—which offers standardized output connector configurations—with existing same-wattage power modules to achieve a high reliability, higher performing solution at a lower overall system cost.

Setting Industry Benchmarks
The ZHR483KS is HZZH’s first GaN-based power solution and is the flagship product for a new product line. The module’s input voltage ranges from 85 V to 264 V, while its output voltage ranges from 42 V to 58 V. Transphorm’s TPH3205WS GaN devices are used in an interleaved bridgeless totem-pole PFC to achieve 98 percent efficiency at half load. The GaN devices lower the power module’s switching and driving losses, leading to the ZHR483KS outperforming preceding modules that used superjunction Silicon MOSFETs.

“We sought a power transistor that would enable us to develop a more efficient yet cost-effective solution for our customers,” said Dr. Guo, CTO, HZZH. “We considered Silicon Carbide devices but could not achieve the desired advantages at low voltages. We then vetted several GaN manufacturers’ devices, and ultimately selected Transphorm’s GaN FETs due to their reliability, device cost, and simple implementation.”

Transphorm’s GaN FETs are two-chip normally-off devices available in standard TO-XXX packages and PQFN modules that can be driven with common off-the-shelf drivers. The current Gen III family offers the GaN semiconductor industry’s highest threshold voltage at 4 V and highest gate robustness at ±20 V. These features enable customers to easily design in highly reliable GaN solutions to gain the technology’s high-power density benefits.

“Transphorm develops each generation of its GaN platform with four key factors in mind: reliability, drivability, designability, and reproducibility,” said Kenny Yim, Vice President of Asia Sales, Transphorm. “We’re proud that HZZH selected us as its GaN partner as it affirms that those four factors are what our customers need to disrupt their markets. They result in our GaN being designed into a wide range of multi-kilowatt power systems that are setting industry records. We anticipate HZZH will continue to innovate as our collaboration continues on future products.”

The ZHR483KS is currently in production.
 

Power Integrations’ SCALE-iDriver for SiC MOSFETs Achieves AEC-Q100 Automotive Qualification
Posted: 2020-3-17
Compact and robust isolated SiC MOSFET driver incorporates active clamping and <2 µs short-circuit turn-off time

, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced that its SIC118xKQ SCALE-iDriver™, a high-efficiency, single-channel gate driver for silicon carbide (SiC) MOSFETs, is now certified to AEC-Q100 for automotive use. Devices can be configured to support gate-drive voltage requirements of commonly used SiC MOSFETs and feature sophisticated safety and protection features.

The SIC1182KQ (1200 V) and SIC1181KQ (750 V) SCALE-iDriver devices are optimized for driving SiC MOSFETs in automotive applications, exhibiting rail-to-rail output, fast gate switching speed, unipolar supply voltage supporting positive and negative output voltages, integrated power and voltage management and reinforced isolation. Critical safety features include Drain to Source Voltage (VDS) monitoring, SENSE readout, primary and secondary Undervoltage Lock-out (UVLO), current-limited gate drive and Advanced Active Clamping (AAC) which facilitates safe operation and soft turn-off -under fault conditions. AAC in combination with VDS monitoring ensures safe turn-off in less than 2 µs during short-circuit conditions. Gate-drive control and AAC features allow gate resistance to be minimized; this reduces switching losses, maximizing inverter efficiency. 

By pairing the SCALE-iDriver control and safety features with its high-speed FluxLink™ communication technology, Power Integrations delivers a revolution in gate-driver IC technology compared to opto-, capacitive- or Si- isolated magnetic couplers. The combination dramatically improves isolation capability, and enables safe, cost-effective designs for inverters with very few external components up to 300 kW.

Comments Michael Hornkamp, senior director of marketing for automotive gate-driver products at Power Integrations: “Silicon carbide MOSFET technology opens the door for smaller, lighter automotive inverter systems. Switching speeds and operating frequencies are increasing; our low gate resistor values maintain switching efficiency, while our fast short-circuit response quickly protects the system in the event of a fault.”

“Furthermore, SCALE-iDriver sets a new standard in isolation robustness for functional safety; even if a power device causes catastrophic driver failure, SCALE-iDriver’s isolation remains intact ensuring that no part of the chassis will carry life-threatening high voltages,” continued Hornkamp.

Technical information is available from the Power Integrations website at http://www.power.com/products/scale-idriver-ic-family/sic118xkq/.
 

KEMET Introduces Metal Composite Power Inductors for Automotive Applications
Posted: 2020-3-16
METCOMTM for automotive offers high reliability and performance with best in class EMI shielding for low magnetic flux leakage

KEMET Corporation, a leading global supplier of electronic components, has launched a new family of metal composite power inductors to address the stringent demands of the automotive market. The MPXV product offering enhances the company’s METCOM range and is AEC-Q200 qualified for use in the automotive sector.

The new power inductors provide efficient power conversion while minimizing Electromagnetic Interference (EMI) and are ideal for use in DC to DC switching power supplies for the growing number of Electronic Control Units (ECUs) found in automotive systems.  According to Fortune Business Insights* the automotive ECU market is forecast to reach USD 12.92 Billion by 2026, a CAGR of 11.9% in seven years.

The MPXV series is optimized for use within the automotive market, where the increased demand and adoption for electronic systems necessitates high efficiency, low self-heating, and low power losses. The MPXV series inductors’ metal composite core has class-leading high permeability to meet these requirements. The qualities of the MPXV inductors make them ideal for use in designs where thermal considerations are vital to avoid adverse effects to other critical systems.

Available in various industry standard SMD footprints, MPXV inductors can operate at temperatures up to 155°C and feature low electrical noise allowing them to be used in all areas of the vehicle - including the challenging operating environments found under the hood and in the powertrain. The metal composite material is molded around the inductor coil core and, therefore, acts to shield neighboring electronics from the magnetic flux that might otherwise cause interference in sensitive systems. These devices are qualified to standards set by the Automotive Engineering Council’s Q200 (AEC-Q200) requirements and they are suitable for even the most demanding areas of automotive applications.

“Our experience and expertise in high permeability inductor material development and production allow us to introduce devices with differentiated performance to meet and exceed the needs of the latest applications in sectors such as automotive,” said Dr. Philip Lessner, KEMET Senior Vice President and Chief Technology Officer. “With their robust performance, high reliability and energy-saving features, MPXV inductors are a perfect example of this and provide a dependable, easy-to-design-in solution.”

KEMET’s MPXV series is available immediately via KEMET distributors. To learn more about the company’s metal composite power inductors visit www.kemet.com/metcom.

ON Semiconductor Introduces New 900 V and 1200 V SiC MOSFETs for Demanding Applications
Posted: 2020-3-10
New SiC MOSFET devices will enable better performance, higher efficiency and ability to operate under harsh conditions

ON Semiconductor, driving energy efficient innovations, has expanded their range of wide bandgap (WBG) devices with the introduction of two additional families of silicon carbide (SiC) MOSFET. Intended for use in a variety of demanding high-growth applications including solar power inverters, on-board charging for electric vehicles (EV), uninterruptible power supplies (UPS), server power supplies, and EV charging stations, the new devices offer levels of performance that were simply not possible with silicon (Si) MOSFETs.

ON Semiconductor’s new 1200 volt (V) and 900 V N-channel SiC MOSFETs deliver faster switching performance and enhanced reliability when compared to silicon. A fast intrinsic diode with low reverse recovery charge delivers a significant reduction in power losses, boosts operating frequencies, and increases the power density of the overall solution.

High frequency operation is further enhanced by the small chip size that leads to a lower device capacitance and reduced gate charge - Qg (as low as 220 nC), reducing switching losses when operating at high frequencies. These enhancements improve efficiency, reduce EMI when compared with Si-based MOSFETs, and allow for the use of fewer (and smaller) passive components. The highly robust SiC MOSFETs offer higher surge ratings, improved avalanche capability and improved short circuit robustness when compared to Si devices, delivering the higher reliability and longer lifetimes that are essential in demanding modern power applications. A lower forward voltage provides threshold-free on-state characteristics that reduce the static losses that occur when the device is conducting.

Commenting on the new SiC MOSFET devices, Gary Straker, Vice President/General Manager, Power MOSFET Division, Power Solutions Group, ON Semiconductor said: “If design engineers are to meet the challenging efficiency and power density goals that modern renewable energy, automotive, IT and telecom applications demand, then they require high performance, high reliability MOSFET devices. ON Semiconductor’s WBG SiC MOSFETs extend performance beyond what was possible with silicon devices, delivering lower losses, higher operating temperatures, faster switching, improved EMI and better reliability. Further supporting the engineering community, ON Semiconductor provides a wide range of resources and tools that simplify and speed up the design process.”

All of ON Semiconductor’s SiC MOSFETs are Pb-free and Halide free, and the devices intended for automotive applications are AEC-Q100 qualified and PPAP capable. All devices are offered in industry standard TO-247 or D2PAK packages.

For more information, visit http://www.onsemi.com.

Power Integrations Expands Range of InnoSwitch3 ICs Incorporating Robust 750 V GaN Transistors
Posted: 2020-3-10
PowiGaN technology permits manufacture of 94% efficient power supplies suitable for regions with frequent brown-outs and line surges

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced an expansion of its InnoSwitch™3 families of offline CV/CC flyback switcher ICs. The new INN3x78C devices incorporate a smaller “size 8” 750 V PowiGaN™ transistor, enabling  compact, efficient power supplies delivering between 27 W and 55 W without heatsinks. The ICs are housed in the same high-creepage, safety-compliant InSOP™-24D package as larger members of the GaN-based InnoSwitch3 families, which target up to 120 W.

Known for exceptional efficiency – up to 94% efficient across line and load, PowiGaN technology is also extremely robust, making them highly resistant against line surges and swells commonly seen in regions with unstable mains voltage. This enables OEMs to specify a single power supply design to be used worldwide. Applications for the new parts include USB PD and high-current chargers/adapters for mobile devices, as well as set-top boxes, displays, networking and gaming products and appliances – especially those aiming to comply with the planned European Energy Labeling Regulation.

Comments Chris Lee, director of product marketing at Power Integrations: “We have experienced increased demand for our efficient AC-DC converter ICs with the highly robust 750 V GaN transistor. Simultaneous electrical strength and efficiency are difficult to achieve due to the relationship between Silicon MOSFET breakdown voltage and COSS-related switching loss. Our electrically strong PowiGaN transistors have very low COSS, so achieving over 94% efficiency and low field return rate from tropical markets is very straightforward.”

Technical information is available from the Power Integrations website at www.power.com/innoswitch3.

Cornell Dubilier's 1mm-Thin Polymer Aluminum Electrolytics Provides High Ripple Current and Capacitance
Posted: 2020-3-7
Thinner than a dime, available in custom values and shapes.

The new PPC Series of ultra-thin polymer aluminum electrolytic capacitors from Cornell Dubilier represents a totally new capacitor form factor. Designed specifically for applications requiring high ripple current and the thinnest possible profiles, type PPC opens up new product design options. In addition to being just 1 mm thin, the PPC uses versatile packaging technology that makes it possible for capacitors to be formed into custom shapes and sizes to accommodate available space.

“A single PPC capacitor offers capacitance and ripple current equivalent to dozens of SMT capacitors or a bulky cylindrical device,” said Mario DiPietro, Product Manager at Cornell Dubilier.  As an example, the company claims that a single PPC capacitor is equivalent to a parallel bank of 50 or more polymer tantalum capacitors and occupies one fourth the height. Also, circuit reliability is improved by using a single component versus an entire array of SMT capacitors.

Developed by Cornell Dubilier, the PPC is the latest leading-edge capacitor development by the company. These designs have been responsive to market demands for capacitors that provide higher performance while breaking away from traditional cylindrical form factors.

For more information on this series visit:  www.cde.com/PPC

Easy-to-Use SCALE-2 Plug-and-Play Gate Drivers from Power Integrations Suit Press-Pack IGBT Modules
Posted: 2020-3-3
Flexible, robust, reliable; rated for 4500 V modules

Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today introduced the 1SP0351 SCALE-2™ single-channel, +15/-10 V, plug-and-play gate-driver, developed specifically for new 4500 V press-pack IGBT (PPI) modules from manufacturers such as Toshiba, Westcode and ABB. Based on Power Integrations’ widely used SCALE-2 chipset, the new gate-drivers are perfectly suited for high-reliability applications such as HVDC VSC, STATCOM/FACTS and medium-voltage drives.

The 1SP0351 drivers are equipped with Dynamic Advanced Active Clamping (DAAC), short-circuit protection, a built in DC-DC converter, regulated turn-on gate-drive voltage, DC-DC overload monitoring and supply-voltage monitoring. Active Miller Clamping is also included. The SCALE-2 ASIC chipset uses sophisticated digital control techniques to reduce component count by as much as 85% compared with conventional solutions, significantly increasing reliability.

Designed for ease of use, 1SP0351 drivers feature plug-and-play capability, which facilitates commissioning and allows immediate operation after installation. The inclusion of a simple two-pin power plug also simplifies operation, and conformal coating increases product ruggedness and reliability.

Comments Thorsten Schmidt, technical product manager at Power Integrations: “These drivers are the optimum drive solution for the industry’s leading press-pack IGBT modules. Devices are rugged, reliable and simple to use.”

More information is available from the Power Integrations website at www.power.com/products/scale-2-plug-and-play-drivers/1SP0351/.

TDK Class I & II Medical and Industrial Power Supplies Deliver 600W in 3 x 5” Footprint
Posted: 2020-2-27

TDK Corporation announces the introduction of the TDK-Lambda brand CUS600M AC-DC power supply series in a 3 x 5” footprint.  Rated at 600W these compact products meet curve B conducted and radiated EMI in either a Class I or Class II (double insulated) construction, without the need for external filtering.  This flexibility allows the CUS600M to be used in a wide range of applications, including home healthcare, medical, dental, test and measurement, broadcast and industrial equipment.

The CUS600M series accepts an 85 to 264Vac input and has a no-load power consumption of less than 0.5W when the output is inhibited.  Seven output voltages are available, 12V, 19V, 24V, 28V, 32V, 36V and 48V.  A 5V 2A standby voltage, remote on/off, remote sense and a power good signal are fitted as standard.  A cover with integral fan option is also available.  The open frame models measure 76.2 x 127 x 37mm (WxLxH), or 85 x 157 x 42.5mm with the cover/fan assembly fitted. 

Convection cooled the CUS600M can deliver 400W (600W peak) in -20oC to +40oC ambient temperatures, derating linearly to 200W load at +70oC. With forced air cooling or the integral fan fitted, the series provides 600W at +55oC ambient, derating to 420W at +70oC.  The efficiency of the series is up to 96%, reducing internal power losses.

The CUS600M has an input to output isolation of 4,000Vac (2 x MoPP), an input to ground isolation of 2,000Vac (1 x MoPP) and an output to ground isolation of 1,500Vac (1 x MoPP) for suitability in B and BF rated medical equipment.  The leakage current is <200µA and touch current is <100µA.  The maximum operating, transportation and storage altitude is 5,000m.

Safety certifications include IEC/EN/ES 60601-1 and IEC/EN/UL 62368-1 with CE marking for the Low Voltage, EMC and RoHS Directives.  The units also comply with EN 55011-B and EN 55032-B conducted and radiated emissions (Class I and II), and meet the EN 61000-3-2 harmonics, IEC60601-1-2 Edition 4 and IEC 61000-4 immunity standards

More information can be obtained at the following TDK-Lambda Americas website, https://www.us.tdk-lambda.com/lp/products/cus-m-series.htm

RECOM First-of-its-kind, non-isolated DC/DC in SMD LGA footprint with input range spanning 4.3V to 65V
Posted: 2020-2-26

RECOM extends its RPM series with the launch of the RPMH-0.5, a 0.5A non-isolated DC/DC switching regulator in a low-profile DOSA-compatible LGA package with an input range from 4.3V up to 65V and five trimmable output options. 

With the launch of the RPMH-0.5 series, RECOM has expanded its range of compact, non-isolated DC/DCs in a standard 12.19 x 12.19 x 3.75mm DOSA-compatible thermally-enhanced low profile LGA package. Excellent thermal management means that the RPMH-0.5 series operates from -40°C up to 95°C (100°C) ambient with full load and convection cooling only. Efficiency is up to 89% allowing the full 500mA output current to be delivered across the entire input voltage range.  Efficiency is also excellent at very low loads, which, combined with very low quiescent current down to 16µA (3.3V and 5V versions), makes this series suitable for applications that have ‘sleep’ modes such as microcontrollers and transceivers. The RPMH also features 6-sided shielding for low radiated EMI so ‘Class B‘ EMI compliance is achieved with a simple low cost line inductor.  Additional features include full protection (UVLO, SCP, OCP) along with power sequencing, soft start, on/off control, remote sensing and a power good signal.

Steve Roberts, Innovation Manager at RECOM comments: “Because of the adoption of 48V in soft hybrid vehicles, we see the cost of Li-ion batteries falling and 48V power rails increasingly being used in many other application areas. When down-conversion to a lower voltage is necessary, the RPMH-0.5 series is a perfect fit with its wide input range up to 65V“.

For more information, visit www.recom-power.com

BridgeSwitch BLDC Motor-Driver IC Family from Power Integrations Expands to 400 W
Posted: 2020-2-25
High-voltage half-bridge motor-driver is 99.2%-efficient; needs no heatsinks and reduces software certification time and expense

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced that its BridgeSwitch™ integrated half-bridge (IHB) motor-driver IC family has been expanded and now supports applications requiring up to 400 W.  BridgeSwitch ICs feature high- and low-side advanced FREDFETs (Fast Recovery Diode Field Effect Transistors) with integrated lossless current sensing, resulting in inverter efficiency of up to 99.2% in brushless DC (BLDC) motor-drive applications. This industry-leading efficiency performance along with the distributed thermal footprint provided by the IHB driver eliminates the need for a heatsink, reducing both system cost and weight.

The new 400 W BRD1167 and BRD1267 BridgeSwitch ICs deliver up to 1.33 A RMS, 11.5 A DC output peak current. Like the rest of the BridgeSwitch family, they are self-powered and available in the same compact InSOP-24C surface-mount package. These devices can drive single- or multi-phase high-voltage, synchronous or asynchronous motors, and support all popular MCU and motor control algorithms. All BridgeSwitch ICs feature cycle-by-cycle hardware–based overcurrent, over/under-voltage and over-temperature protection features, which eliminate the software component from many protection functions. This simplifies IEC 60335 and 60730 certification, saving time and cost.

Like other BridgeSwitch family ICs, the new, uprated BRD1167 and BRD1267 devices also feature built-in device protection and system monitoring and a robust single-wire preventive maintenance interface which enables communication between the motor microcontroller and up to three BridgeSwitch devices. Each BridgeSwitch device may be configured with different high- and low-side current limits, eliminating role of the microcontroller and external circuitry in protecting the system from open or shorted motor windings.

Comments senior product marketing manager Cristian Ionescu-Catrina: “BridgeSwitch is a scalable solution for single- and multi-phase inverter designs. The increased 400 W power capability will allow the family to support applications with higher RMS current and thermally challenging requirements, such as range hoods, compressors, fans and pumps.”

Technical support for the BridgeSwitch BLDC motor-drive family of ICs is available from the Power Integrations website at: https://motor-driver.power.com/bridgeswitch.
 

RECOM Announces the Launch of its RS12-Z Series of 4:1 Input DC/DC Converters, Providing 12W in a SIP-8 Package.
Posted: 2020-2-24
New standard set for DC/DC power density in a SIP-8 package

Leveraging advanced planar technology, RECOM now offers a full 12W output in the industry-standard SIP-8 package from their new RS12-Z series of DC/DC converters up to 75 °C in free air, the highest power available in this format. With a footprint of just 2cm2, the range features 4:1 inputs of 9 – 36V or 18 – 75V with surge ratings to 50V and 100V respectively and regulated single outputs of 3.3, 5, 12, 15 or 24V, all trimmable +/-10% and with remote on/off control. Short circuit and under-voltage protection are included along with 3kVDC/1s isolation and EN 62368-1 certification. EN 55032 class A or class B EMC levels are met with a simple, low cost external filter. The series features a metal casing providing EMI shielding as well as enhanced thermal performance with case tabs providing mechanical stability and additional heat sinking to the customer’s PCB.

“We have incorporated radical design changes in our new RS12-Z series, with a planar transformer construction and metal casing to push the limits of power density achievable in the SIP-8 package” commented Steve Roberts, Innovation Manager at RECOM. “The series is ideal for nominal 12, 24 or 48V systems where real estate is at a premium and full power is needed over a wide temperature range.”

For more information, visit www.recom-power.com.

Flex Power Modules Adds Telecom Version to BMR480 DC-DC Converter Series
Posted: 2020-2-13
  • Wide input voltage range of 36V to 60V enables use in telecom applications
  • Output voltage of 12V
  • Output power and current up to 800W/69A
  • High efficiency of typically 96.4% at 53Vout

Flex Power Modules introduces a new version of its BMR480 digital DC-DC converter, optimized for telecom applications that require input voltage down to 36Vin.

The converter, called the BMR480 0113/034, provides an extended input voltage range below 40Vin, as required for telecom power conversion applications. It is optimized for a wider input voltage range of 36Vin to 60Vin, compared to the standard converters in the BMR480 series.

The new version also has an output voltage of 12V, which is a common requirement for telecom, and output power up to 800W (output current up to 69A). It provides 1500VDC input-to-output isolation.

Olle Hellgren, Director of Product Management and Business Development at Flex Power Modules, said: “Telecom applications have specific requirements, and with this new version, we’re delivering what customers in this sector need – while still offering them the proven efficiency, reliability and performance of our existing BMR480 series.”

Compared to other solutions on the market, the BMR480 telecom version delivers superior thermal performance, with efficiency of typically 96.4% at 53V output voltage and half load. Thermal performance is enhanced by a baseplate, which can be connected to a heatsink or cold plate, and the converter has an extended operating temperature range of -40°C to +125°C.

The converter provides droop load-sharing capability and monotonic start-up, and it offers protection against output over-voltage and short-circuits, and against over-temperature. Reliability is high, with a mean time between failures (MTBF) of over 6 million hours, and quality is ensured by Flex Power Modules’ highly automated manufacturing processes.

Existing models in the BMR480 series are targeted at high-power datacom applications, including intermediate bus conversion (IBC), dynamic bus voltage (DBV) and distributed power architectures (DPAs). More than 15 patents have been filed in relation to the BMR480 family, many directly related to improving efficiency.

The technical specification for the new BMR480 is available at https://flex.com/-/media/Project/Flex/BrandSite/technology/power/power_modules/Digital_DCDC/FPM-TechSpec-BMR480-Vin36-60-800W.pdf

 

CUI Inc Expand Ac-Dc Power Supply Line to Include Compact GaN Desktop Adapters
Posted: 2020-2-5

CUI Inc announced the addition of two GaN desktop ac-dc power supply series to its SDI product family. The SDI200G-U and SDI200G-UD offer 200 W of continuous power from a compact desktop package. These ac-dc supplies have been designed for a wide range of portable industrial and consumer products, where efficient power is needed in a lighter, smaller adapter package.

The SDI200G-U and SDI200G-UD comply with UL/EN/IEC 62368-1 and 60950-1 requirements. The adapters also meet the current average efficiency and no-load power specifications mandated by the US Department of Energy (DoE) under the Level VI standard and the European Union’s (EU) CoC Tier 2 directive for universal input voltage ranges; with up to a 250% increase in power density, no-load power consumption as low as 210 mW, and universal input voltage ranges of 90 ~ 264 Vac..

The SDI200G-U series offers a three prong (C14) inlet, while the SDI200G-UD features a two prong (C8) inlet. Measuring 5.91 x 2.13 x 1.3 in. (150 x 54 x 33 mm.), the compact new models are 32% smaller than the non GaN models.

For more information on GaN’s role within adapters, please visit CUI’s blog post, “How GaN Enables Smaller, More Efficient Power Supplies”.

Powerbox Announces High Peak Load Power Supply for Medical Laser Applications
Posted: 2020-1-29

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, has announced the release of its new power supply solution for high peak load applications in the medical sector. Based on digital control and high energy storage management techniques, the SMM3000A80024C series delivers 2.25kW repetitive peak power to medical lasers with high efficiency. The SMM3000A80024C complies with medical safety standards and for silent operation it includes a thermo-controlled cooling system.

Laser equipment is widely used in medical applications and from cosmetic through to general surgery they all require power supplies able to deliver very high peak energy levels to the laser or discharge tubes. However, high peak energy and the repetition thereof generates electromagnetic radiation and line disturbance. This is a challenge for power designers who need power solutions that are able to deliver the required amount of power without generating line disturbances, whilst also guaranteeing patient and operator safety when high voltages and energy levels are involved during the process.

CO2 (carbon dioxide) lasers or Erbium YAG are commonly used in medical applications, though the energy released during the pulse related to the specific task can vary by large amounts. There are different types of pulsing for CO2 lasers. In the cosmetic word, there is a newer technology called UltraPulse (a very short pulse duration with high pulse power and very high influence), that is even faster than SuperPulse (medium pulse duration with medium pulse power).

“A good device has less than a millisecond pulse width, meaning that it is incredibly fast-firing, requiring the power supply to be able to deliver high energy levels during the pulse, but also able to restore energy for the next pulse.” Said Patrick Le Fèvre, Powerbox Chief Marketing and Communication officer. “To meet such requirements is a great challenge, though by combining digital power and special PRBX innovations, the PRBX 2.25kW AC/DC capacitor charger SMM3000A80024C effectively meets the requirements of the job and complies with the medical safety standard IEC60601-1 3rd.

The power supply provides a level of protection, primary to secondary main output of 2xMOOP, and 2xMOPP to auxiliary output. To accommodate different capacitor banks and applications, the output voltage can be adjusted from zero to 800VDC (600VDC nominal) with an output current of 5.5A at nominal. An automatic current controller guarantees that the power envelope is always within safe limits, reducing capacitor aging and overstressing of components, thus contributing to a longer lifetime. The SMM3000A80024C has a built-in microprocessor constantly monitoring the charging status, reporting end of charge and discharge level, as well as all protection warnings due to abnormal operation such as over-temperature, over-voltage and current.

To reduce line disturbances the SMM3000A80024C includes a very high efficiency power factor corrector (PFC), soft-start circuitry, filtering and is housed in a six-sided shielded case. To limit audible noise to a minimum, the SMM3000A80024C’s fans are thermo-controlled, regulating their speed to the minimum required for normal, safe operation. The SMM3000A80024C also delivers an auxiliary output voltage of 24VDC, reducing the need for an additional power supply to power laser controller and interfaces. For additional power, the SMM3000A80024C can be connected in parallel.

For more information, visit www.prbx.com.

 

Ground-breaking PSMA Report Addresses Reliability of Power Supply Digital Control Software/Firmware
Posted: 2019-9-19
Comprehensive study on digital implementations of power supplies addresses challenges and solutions to reliability of digital control of power supplies and recommends best practices

The Power Sources Manufacturers Association (PSMA) announces publication of its ground-breaking Power Supply Software/Firmware Reliability Improvement Report. This report, the result of a year-long project undertaken by PSMA’s  Reliability Technical Committee, addresses recommended reliability improvements for power supply digital control software and firmware. This new report attempts to present key findings related to the challenges of and solutions to reliability in the digital control of power electronics.

“This is the first report from the work of PSMA’s newest committee, which aims to spearhead industry initiatives that identify and attempt to address the pertinent industry challenges related to the reliability performance of power supplies and associated products,” noted Brian Zahnstecher, Co-Chair of the PSMA Reliability Committee. Tony O’Brien, Reliability Committee Co-Chair, added “Moving from power electronics with analog control to power electronics with digital control is a significant transition. Software engineering best practices are being adopted for digital power electronics control for power supplies to ensure that reliability does not suffer with the transition to digital control. Some of the best practices are relatively new, evolving and unfamiliar to the power electronics world”

This 166-page report, divided into nine chapters, examines a wide array of problems and challenges in the field of digitally controlled power supplies, then proceeds to present observed and proposed improvements and best practices. Brian Zahnstecher further noted, “The ongoing tasks of the PSMA Reliability Committee will include efforts to support adoption of the recommended best practices and to update and refine our findings. We welcome the involvement of knowledgeable industry experts in this important work.” 

A copy of the printed and USB memory drive versions of the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report has been sent to PSMA Regular member companies as a benefit of their membership. Additional copies may be purchased at the member price of $US290. PSMA Affiliate members may also purchase the report for $US290. The report is available to non-members for purchase on the PSMA website (www.psma.com) for the price of $US2490.

A preview of the report is available here.

PSMA Power Technology Roadmap Provides Critical Insights into Technology and Research Advancing Power Conversion Developments
Posted: 2019-4-16
2019 edition of bi-annual publication provides multidimensional perspectives on power technology growth and trends; latest edition adds new section surveying global academic research activities

The Power Sources Manufacturers Association (PSMA) announces the 2019 edition of the Power Technology Roadmap. The report, which forecasts the power technology and power delivery trends through 2023, includes a printed report along with a feature-rich USB memory drive containing a record number of seventeen recorded webinars with up-to-date explanations of the information contained in the final report. The webinars add much to the presentation materials because the listener can hear and understand the context and the subtext of the original presentation in the speaker's voice. The recordings also capture the interesting and informative question and answer periods.

In this edition a new section on University Research in Power Electronics has been added. University research provides a window into what products and technologies are in store for Power Electronics. Leading power electronics research universities were asked about their research areas and priorities and their responses were analyzed to extract most common research areas, least common/missing research areas and unique research areas.

The overall structure of this year’s PTR largely follows the format of and keeps the improvements made in the 2017 report. It offers a consolidated view of the latest trends in the power management, power control, and power delivery technologies by integrating the most recent inputs from webinars, surveys, analyses and discussions. The report is divided into five sections:

  • Application Trends
  • Component Technologies
  • University Research
  • Webinar Presentations
  • Power Supply and Converter Trends

“As power technology continues to emerge from the shadows to play a more central role in the next phase of electronics industry revolution, the PTR report provides many relevant pointers to the current and future industry stakeholders,” said Conor Quinn, Co-Chair of the Power Technology Roadmap committee.

Dhaval Dalal, Co-Chair of the committee, said, “In many emerging fields, such as electric vehicles, alternative energy converters and energy harvesting devices, power technology assumes a more central and driving role and the PTR captures how the industry is shaping up to play this role.”

PSMA Regular Member companies have each been sent one copy of the printed report and USB memory drive versions of the 2019 edition as a benefit of their membership. Members can access the webinars on line at no cost and purchase additional copies of the full report for $290. The non-member price is $4,490. For information about purchasing the report, please to the PSMA website at: www.psma.com/publications.

PSMA Publishes Technology Report: 3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies
Posted: 2018-9-6
Comprehensive report is the first to address higher power embeddable passives that will accelerate the development of higher density power sources using new, 3D disruptive packaging technologies

The Power Sources Manufacturers Association (PSMA) Packaging Committee announces the publication of its latest report titled, “3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies.” This is the third in a series of reports focused on using embedded substrate technology for building power sources. It is the first extensive study of embeddable passive components both available and in development for use in the power path of power sources. The report contains extensive research and product illustrations geared to an audience of technology executives and design engineers.

Miniaturization of passive components without compromising their power handling and efficiency and their integration with actives has always been a key focus for power packaging. There is also an increasing trend to vertical or 3D package integration to address the performance issues by eliminating parasitics from interconnections. Embedding gives lowest package inductance and enables co-integration of power systems and drivers in a single package with direct interconnection between gate driver circuits and switches with shortest interconnection length. This has become even more important with the rapid emergence of wide bandgap power switching devices. This, however, leads to several process integration and reliability challenges that need to be systematically addressed.

Georgia Tech Packaging Research Center, under contract from PSMA systematically surveyed the recent advances in passives, active embedding and 3D passive-active integration to generate this report, with emphasis on 3D power packaging enabled by advances in passive components and embedding of actives in power packages. A detailed literature study was conducted on key advances in embedded passive technologies and related topics. Emerging nanomaterials, processes and technologies are described in detail for inductors, capacitors and resistors. Nanostructured materials provide additional degrees of freedoms in enhancing the properties to improve the performance metrics such as volumetric density and efficiency of the components. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted in advancing the components to improve performance. Industry leaders were surveyed to get the recent technology advances in each category. Roadmaps are projected for passive component advances and active embedding technologies.

The trends and roadmaps in 3D power packaging are also described in three categories: low power (1-100 W), medium power (100-1000 W) and high power (10-100 kW). Integration in each category is classified into lead-frame-based, substrate-embedding based and traditional ceramic substrates. Active embedding with panel-scale substrate manufacturing is also reviewed in detail. Recent innovations in substrate materials and associated reliability challenges such as via cracking, dielectric cracking or electric breakdown are highlighted. Advances in die-attach solutions with sintered nanocopper are reviewed, highlighting the evolution of low-stress sintered copper-based die-attach solutions.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded passives in 3D power packaging to create the significantly higher power densities.

The PSMA report on 3D packaging was provided free of charge to PSMA Regular and Associate Company members.  Additional copies may be purchased at the member price of $290. PSMA Affiliate members may also purchase the report for $290. The report is available to non-members for purchase on the PSMA website (www.psma.com/publications) for the price of $3,490.

Provided by the PSMA Packaging Committee.

Brian Narveson
Co-chairman
  Brian Narveson   Ernie Parker  
Ernie Parker 
Co-chairman

 

Site Design: David Fogle Design

Contact us:   Tel: (973) 543-9660   Fax: (973) 543-6207   power@psma.com
P.O. Box 418, Mendham, NJ 07945-0418
© 2020Power Sources Manufacturers Association.