New product announcements


Flex Power Modules boosts portfolio for RFPA applications with PKB-D 250W DC-DC converter
Posted: 2018-10-17
  • High density converter ideal for Radio Frequency Power Amplifiers using GaN Transistors
  • 50V/5A/250W available in industry standard eighth-brick format

Flex Power Modules announces the PKB4216HDPI, the latest model in its series of DC-DC converters aimed at Radio Frequency Power Amplifier (RFPA) applications in the telecom market segment. Following on from the recently introduced 750W PKJ4000 series, the PKB-D is a high-density converter in the industry standard eighth-brick format with an output of 50V at 5A, and an input voltage range of 36 to 60V. This makes it ideal for 50V GaN based RFPA’s and also high voltage LDMOS applications.

The PKB4216HDPI has a wide output voltage adjustment range of 40 – 55VDC allowing for easy optimization of the connected RF section, with typical efficiency peaking at 94.5% at 48Vin and full load. Comprehensive protection is provided including short-circuit, overload, over-temperature, output over-voltage, and input under-voltage. Start-up into pre-biased loads is guaranteed, and the isolation rating is 2250VDC from primary to secondary. A remote on/off control is provided with optional positive or negative logic.

The part is available with a baseplate option for conduction cooling inside sealed enclosures with no airflow, typical of RFPA applications. This allows full-power operation at up to 85°C baseplate temperature, and up to 4A / 200W output at 100°C baseplate temperature. The full operating temperature range for the device is -40°C to +125°C, with excellent derating characteristics.

The half-bridge design of the PKB4216HDPI features the latest PWM controller technology with a high level of integration for low component count and high reliability. Synchronous rectification contributes to cutting-edge efficiency performance leading to high power density and extremely high reliability figures of up to 10.68 Mhrs.

“The PKB4216HDPI is an exciting addition to our range of RFPA power converters,” explained Olle Hellgren, Head of Business and Product Management at Flex Power Modules. “With OEM’s involved in 5G seeing global design wins and imminent roll out, together with the use of GaN and new-generation LDMOS transistors, the PKB4216HDPI is an ideal fit as a power source. The part will also find applications in the Internet of Things, mobile back- and front-haul, and in-building wireless communication infrastructure, as well as Power over Ethernet (PoE) applications.

The new PKB4216HDPI module has been designed and manufactured by Flex Power Modules to deliver the levels of quality and performance that power system designers have come to expect for their system designs.

For more information, visit flex.com.
 

CUI Inc - Absolute Encoder Series Adds Multi-Turn Output Option
Posted: 2018-10-16

CUI’s Motion Group today announced that its AMT21 series of absolute modular encoders has added models with multi-turn output capability. Offering 12 bits or 14 bits of absolute position information, the multi-turn AMT21 series implements a 14-bit signed number turns counter for applications rotating beyond 360 degrees. These features provide users with the ability to keep track of position even during power down conditions, while the turns counter can be maintained via a battery backup, eliminating the need for a homing sequence.

Based on CUI’s patented capacitive ASIC technology, the AMT21 series is highly durable and accurate with resilience to the dirt, dust, and oil typically found in motion applications. Its high-speed RS-485 protocol for fast and low latency position data is accompanied by a low current draw of 8 mA at 5 V and a compact package with locking hub for ease of installation. Boasting accuracy of ±0.2 mechanical degrees, the AMT21 series further carries an operating temperature range from -40 to +105°C in either radial or axial orientations.

The digital nature of the AMT21 series also allows users to configure the alignment via CUI’s AMT Viewpoint™ GUI or the encoder’s RS-485 protocol. Additionally, the digital interface of the AMT21 encoder can be used to set addresses for multiple encoders sharing the RS-485 bus.

For more information, visit www.cui.com

Monitor Temperature at Multiple Locations with Low-power 1.8V Temperature Sensor Family
Posted: 2018-10-15
Measure temperature fluctuation with industry’s first rate-of-change reporting feature

Temperature measurement is central to the functionality of Internet of Things (IoT) and personal computing devices, making it imperative that developers integrate temperature sensors that reduce power consumption and lower system voltage in applications. To meet these needs, Microchip Technology Inc. (NASDAQ: MCHP) today announced five new 1.8V temperature sensors, including the industry’s smallest five-channel temperature sensor with standard lead spacing. The EMC181x temperature sensor family also introduces system temperature rate-of-change reporting, a feature that provides advanced warning on how the temperature of a system is fluctuating.

Monitoring temperature at multiple locations with a single, integrated temperature sensor reduces board complexity and simplifies design. The EMC181x temperature sensor family offers a variety of remote channels at 1.8V operation to fit different design needs, ranging from two to five channels. The family is ideal for applications migrating from 3.3V systems to lower voltage rails, such as battery operated IoT applications, personal computing devices, Field-Programmable Gate Arrays (FPGAs) and Graphics Processing Units (GPUs). Additionally, the EMC181x family is register and voltage compatible with Microchip’s popular 3.3V EMC14xx temperature sensors, making migration to 1.8V testable and achievable. With the three-channel sensor available in an 8-pin 2 x 2 mm footprint and the five-channel in a 10-pin 2 x 2.5 mm footprint, the sensors can also reduce the number of devices needed for remote temperature monitoring.

With the ability to measure the system temperature rate of change, the EMC181x devices are the industry’s first to offer two-dimensional temperature sensing. In addition to reporting on the regular temperature, the feature notifies customers of the rate of temperature change in a system and shares data that can help better regulate applications. Ideal for closed control loop systems and other applications that prioritize lower voltage rails, the system provides an early notification of rising or falling temperatures, protecting against potential system failure.

“As customers migrate to lower voltage rails, the demand for multi-channel, low-voltage temperature sensors continues to grow,” said Bryan Liddiard, vice president of Microchip’s Mixed-Signal and Linear Division. “The EMC181x family exemplifies Microchip’s leadership in thermal management, offering customers flexible design choices and a new feature in rate-of-change reporting.”

At 1.8V, the EMC181x multi-channel sensor family is compatible with Microchip’s extensive portfolio of low-voltage and low-power microcontrollers.

For more information, visit the Microchip website at www.microchip.com.

Micrometals Introduces New EQ Distributed Gap Cores for High Frequency Switch-Mode Power Applications
Posted: 2018-10-15

Micrometals, a leader in high performance core solutions for power applications, is proud to introduce its new series of EQ distributed gap cores.  The rectangular geometry of the EQ body is ideal for surface mount applications while the round center post readily accepts helical flat wire coils, or bobbins with round wire.  The cores are offered in six industry standard geometries from 20mm to 50mm, three exclusive material formulations, and three reference permeability values.

The new EQ geometries are available in Micrometals exclusive material formulations of Sendust (MS), Hi-Flux™ (HF) and FluxSan™ (FS - Iron Silicon) with 26, 40 or 60 permeability values.  These uniquely formulated materials offer a combination of high saturation magnetization and low losses, making them well suited for switching applications up to 1MHz. The distributed gap nature of these materials means that they can be used with little or no center-leg gap, greatly reducing the losses associated with fringing flux at higher frequency.  EQ cores offer several key advantages over toroid or E core geometries including better self- shielding and high winding density.

 

Jim Cox, Micrometals President commented “Micrometals has a long history of providing the most trusted and reliable powder formulations, and consistently delivering uncompromising performance in every core we deliver.  These new EQ shapes will allow our customers to achieve new levels of performance and efficiency in a very compact package.”

The EQ series offering has been incorporated into the Micrometals Online Inductor Design Tool, for facilitating material selection and design optimization - www.micrometalsapc.com/design-software  

Micrometals can also provide customized sizes and materials blends.  More information can be found at www.micrometalsapc.com.

CUI Upgrades External Power Supply Line to Meet New IEC 62368-1 Standard
Posted: 2018-10-2

CUI’s Power Group today announced that it has upgraded the majority of its external ac-dc power supplies to the new IEC 62368-1 standard for ICT and AV equipment. Set to supersede the outgoing IEC 60950-1 and IEC 60065 standards on December 20, 2020, IEC 62368-1 will introduce fundamentally different guidelines based on hazard-based safety engineering principles. This means that IEC 62368-1 is more significant than a simple merger of the two standards and represents an important transition for designers of ICT and AV equipment.

Similar to the past standards, IEC 62368-1 will apply not only to the end system, but also to components such as external power supplies. CUI’s newly compliant line ranges from 3 W to 250 W in wall plug-in, multi blade, and desktop versions, all available with a variety of dc output plug options. The models also meet the latest global efficiency standards, including US DoE Level VI and the EU’s voluntary CoC Tier 2 requirements.

“CUI’s mission is to provide our customers with products and tools that prepare them for the latest safety regulations and industry standards,” stated Jeff Schnabel, VP of Global Marketing at CUI. “This is why CUI has upgraded many of our power supply models to 62368-1 well ahead of the December 2020 deadline, while further developing resources such as our IEC 62368-1 whitepaper to keep customers informed,” Schnabel concluded.

Texas Instruments: Isolated voltage sensing, like never before
Posted: 2018-10-1

Compromise is a thing of the past — with the ISO224, you can now design with all the benefits of reinforced isolation, with higher working voltages and longer lifetimes. Increase system stability and accuracy of measurements over an extended temperature range, all while reducing board size for compact designs.

Additional resources:

ISO224 features:

  • High reliability and longer system lifetime with reinforced isolation of 7 kVPK per VDE 0884-11 and 5 kVRMS isolation for 1 minute per UL1577
  • High accuracy measurements with ±0.3% Gain error, ±0.01% non-linearity ±5 mV input offset over extended temperature range of -55 to 125°C (ISO224B)
  • Fast system response with 275 kHz output bandwidth
New Digital Signal Controller (DSC) Accelerates DSP Performance for Time-Critical Control Applications
Posted: 2018-9-25
dsPIC33CK is Microchip’s highest performance single-core DSC in an ultra-small package

System designers looking for digital signal processing power with the design simplicity of a microcontroller (MCU) can now utilize a new family of 16-bit Digital Signal Controllers (DSCs) from Microchip Technology Inc. (Nasdaq: MCHP). Designed to deliver faster deterministic performance in time-critical control applications, the new dsPIC33CK DSCs have expanded context selected registers to reduce interrupt latency and new, faster instruction execution to accelerate Digital Signal Processor (DSP) routines. This dsPIC33CK single-core family complements the recently announced dsPIC33CH dual-core family based on the same core.

With 100 MIPS performance, the core delivers almost double the performance of previous single-core dsPIC® DSCs, making it ideally suited for motor control, digital power and other applications requiring sophisticated algorithms such as automotive sensors and industrial automation. It has been designed specifically for controlling multiple sensorless, brushless motors running field-oriented control algorithms and power factor correction.

The new DSCs are also designed to ease functional safety certification required by many automotive, medical and appliance applications where safe operation and shutdown in failure situations are critical. The devices include integrated functional safety features for safety-critical designs such as: RAM Built-In Self-Test (BIST) for checking RAM health and functionality; Deadman Timer for monitoring the health of application software through periodic timer interrupts within a specified timing window; Dual Watchdog Timers (WDT); Flash Error Correction Code (ECC); Brown Out Reset (BOR); Power On Reset (POR); and Fail Safe Clock Monitor (FSCM).

“Microchip’s 16-bit DSCs are highly efficient with minimal delay or latency into the system, and this new core is our best yet,” said Joe Thomsen, vice president of Microchip’s MCU16 business unit. “The feature set and performance make the dsPIC33CK family ideal for time-critical functions such as controlling the precise speed or rotation of a motor, as well as safety-critical functions to ease functional safety certification and ensure dependable operation.”

The dsPIC33CK family features a CAN-FD communication bus to support new automotive communication standards. It comes with a high level of analog integration including high-speed ADCs (3.5 Msps), analog comparators with DACs, and operational amplifiers, enabling motor control applications with smaller footprints and lower bill of material costs. The DSCs include a 250 ps resolution PWM which is ideal for advanced digital power topologies. Live update of firmware (with up to 2 × 128 KB blocks) is also offered to support high-availability systems, especially important for digital power supplies.

For more information, visit the Microchip website at www.microchip.com.

CUI Inc: Waterproof Speakers with Compact Frame Sizes Carry IP67 Ratings
Posted: 2018-9-18

CUI’s Audio Group today announced the addition of several waterproof micro speaker models, with Ingress Protection (IP) ratings of IP67, to its CMS product family. Housed in compact packages measuring as small as 15 x 11 mm with profiles as low as 2.5 mm, these waterproof speakers are ideal for portable and handheld electronic devices subject to the moisture and environmental contaminants found in industrial and outdoor applications.

These rectangular frame models feature sound pressure levels (SPLs) ranging from 90 to 93 dB at 0.1 meters, nominal inputs of 0.7 W, resonance frequencies from 550 to 800 Hz, and impedance ratings of 6 or 8 ohms. All series further offer spring contact, solder pad, or wire lead mounting styles and are constructed with Neodymium magnets and mylar cones for added durability.

For more information, visit www.cui.com.

Powerbox Announces Precharger Solution for Railway Applications at Innotrans 2018
Posted: 2018-9-13

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the introduction of its ENR1000-PC series precharger unit designed to deliver peak power to high capacitive loads in railway applications. The precharger converts the battery nominal bus voltage of 50VDC up to 137.5VDC to a regulated output voltage of 400VDC or 600VDC to charge high voltage capacitor banks used to switch electric valves actuators such as for unlocking and lifting pantographs. The ENR1000-PC series delivers a peak power of 1000W, is able to charge a load of 5 to 35mF in two seconds and automatically switches to standby mode when charging is completed. The ENR1000-PC series is part of PRBX’s Enhanced Rail Power Solutions (PRBX-ERPS).

Within operating input voltage range as wide as 50VDC to 137.5VDC, the ENR1000-PC series is covering the 72V, 96V and 110V system voltages according to EN50155. The series comprises two models:

  • The ENR1000D110/400-PC is delivering 400VDC is able to charge a capacitance load of 5 to 35mF. The unit sustains a maximum voltage of 137.5VDC, a 154VDC transient voltage and an external output reverse voltage of a maximum up to 5.8kVDC.
  • The ENR1000D110/600-PC is delivering 600VDC to 10 to 12mF capacitive loads. The unit sustains a maximum voltage and transient of 130VDC and an external output reverse voltage of a maximum up to 2.5kVDC.

The ENR1000-PC series includes overvoltage, overload, short-circuit and thermal protection. Designed for indoor and outdoor applications, the ENR1000-PC series can be operated within a wide range of temperature from -40 to +70 degrees C, EN50155 temperature class TX and up to +85 degrees C in storage conditions.

The product will be presented at Innotrans 2018 in Berlin, 18 – 21 September 2018. Meet us in Hall 17, Booth 103.

ON Semiconductor Expands Bluetooth® 5 Radio Family with System-in-Package (SiP) Module
Posted: 2018-9-11
Bluetooth Certified and EEMBC® ULPMark™ validated, the 6 x 8 x 1.46 mm SiP features integrated antenna for accelerated design and market introduction

ON Semiconductor, driving energy efficient innovations, has extended its RSL10 family of Bluetooth 5 certified radio System-on-Chips (SoCs) with a ready-to-use 6 x 8 x1.46 mm System-in-Package (SiP) module. Supporting Bluetooth low energy wireless profiles, RSL10 devices can be easily designed into any "connected" application including sports / fitness or mHealth wearables, smart locks and appliances.

The RSL10 SIP features a built-in antenna, RSL10 radio, and all required passive components in one complete, miniature solution. Certified with the Bluetooth Special Interest Group (SIG), the RSL10 SIP significantly reduces time-to-market and development costs by removing the need for any additional RF design considerations.

With the two megabits per second (Mbps) speeds possible with Bluetooth 5 alongside the industry’s lowest power consumption, the RSL10 family provides advanced wireless functionality without compromising battery application life. RSL10 consumes just 62.5 nanowatts (nW) while in Deep Sleep mode, and 7 milliwatts (mW) peak receive power. RSL10’s energy efficiency was recently validated by the EEMBC’s ULPMark where it became the first device in the benchmark’s history to break 1,000 ULP Marks and produced Core Profile scores more than twice as high as the previous industry leader.

"With its best-in-class power consumption, it's not surprising that RSL10 has already been selected for use in a number of applications including energy harvesting and industrial IoT," said Michel De Mey, senior director and general manager of Hearing, Consumer Health, and Bluetooth Connectivity solutions at ON Semiconductor. "By adding a new System-in-Package that significantly reduces design efforts, costs and time-to-market, the possibilities for RSL10 are endless."

For more information, visit www.onsemi.com.

PSMA Publishes Technology Report: 3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies
Posted: 2018-9-6
Comprehensive report is the first to address higher power embeddable passives that will accelerate the development of higher density power sources using new, 3D disruptive packaging technologies

The Power Sources Manufacturers Association (PSMA) Packaging Committee announces the publication of its latest report titled, “3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies.” This is the third in a series of reports focused on using embedded substrate technology for building power sources. It is the first extensive study of embeddable passive components both available and in development for use in the power path of power sources. The report contains extensive research and product illustrations geared to an audience of technology executives and design engineers.

Miniaturization of passive components without compromising their power handling and efficiency and their integration with actives has always been a key focus for power packaging. There is also an increasing trend to vertical or 3D package integration to address the performance issues by eliminating parasitics from interconnections. Embedding gives lowest package inductance and enables co-integration of power systems and drivers in a single package with direct interconnection between gate driver circuits and switches with shortest interconnection length. This has become even more important with the rapid emergence of wide bandgap power switching devices. This, however, leads to several process integration and reliability challenges that need to be systematically addressed.

Georgia Tech Packaging Research Center, under contract from PSMA systematically surveyed the recent advances in passives, active embedding and 3D passive-active integration to generate this report, with emphasis on 3D power packaging enabled by advances in passive components and embedding of actives in power packages. A detailed literature study was conducted on key advances in embedded passive technologies and related topics. Emerging nanomaterials, processes and technologies are described in detail for inductors, capacitors and resistors. Nanostructured materials provide additional degrees of freedoms in enhancing the properties to improve the performance metrics such as volumetric density and efficiency of the components. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted in advancing the components to improve performance. Industry leaders were surveyed to get the recent technology advances in each category. Roadmaps are projected for passive component advances and active embedding technologies.

The trends and roadmaps in 3D power packaging are also described in three categories: low power (1-100 W), medium power (100-1000 W) and high power (10-100 kW). Integration in each category is classified into lead-frame-based, substrate-embedding based and traditional ceramic substrates. Active embedding with panel-scale substrate manufacturing is also reviewed in detail. Recent innovations in substrate materials and associated reliability challenges such as via cracking, dielectric cracking or electric breakdown are highlighted. Advances in die-attach solutions with sintered nanocopper are reviewed, highlighting the evolution of low-stress sintered copper-based die-attach solutions.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded passives in 3D power packaging to create the significantly higher power densities.

The PSMA report on 3D packaging was provided free of charge to PSMA Regular and Associate Company members.  Additional copies may be purchased at the member price of $290. PSMA Affiliate members may also purchase the report for $290. The report is available to non-members for purchase on the PSMA website (www.psma.com/publications) for the price of $3,490.

Provided by the PSMA Packaging Committee.

Brian Narveson
Co-chairman
  Brian Narveson   Ernie Parker  
Ernie Parker 
Co-chairman

 

Flex Power Modules debuts ultra-efficient 700W half-brick DC/DC converters to power RFPA applications in LDMOS or GaN technology
Posted: 2018-9-4
  • Available with either 28V or 50V nominal output voltages, ideal for LDMOS and GaN transistor applications
  • Efficiencies of up to 96.5% enable delivery of 700W in a half-brick format

Flex Power Modules announced the release of the PKJ4000 series of DC/DC converters primarily targeting radio frequency power amplifier (RFPA) applications within the telecom market segment. The PKJ4000 series delivers 28V DC or 50V DC at up to 700W of power from an input voltage range of 36V to 75V.

Packaged in the industry-standard half-brick format measuring 2.40 x 2.28 x 0.50 inches (61 x 57.9 x 12.7mm), the PKJ4000 achieves a power density of more than 255W/in3. With special attention being paid to thermal design during the development of the product, conduction cooling of the module is optimized via the attached baseplate, which enables full power delivery at up to 85°C ambient, with a 100°C baseplate temperature and zero airflow in closed-box environments, which is typical within RFPA applications.

Two models are initially available at release. The PKJ4716APIHS delivers 28V at up to 25A/700W, with an output voltage adjustment range of 14V to 35V, while the PKJ4716HPIHS delivers 50V at up to 14A/700W, adjustable from 25V to 55V. The wide range of adjustability of the outputs makes them not only suitable for RFPA applications using LDMOS or GaN transistor technology, but also for other applications and markets that require a regulated programmable bus voltage such as 24V, 28V, 32V, 48V, 50V or 53/54V, Test and Automation, and Industrial Control and Instrumentation, to name a few.

“The PKJ4000 series is the first of a new expanded range of products we are developing for the RFPA market,” explained Olle Hellgren, Head of Business and Product Management at Flex Power Modules. “We see great potential for us to bring the benefits of our leading-edge technology and efficiencies to this area as 5G continues its development and roll-out.”

Other product features of the PKJ4000 series include 1500V input/output isolation, basic level insulation, monotonic start-up, remote sensing, remote control, and a range of protection capabilities including over-temperature, output-short-circuit and output-over-voltage.

Offering a calculated MTBF figure of 7.5Mhrs, the new series has been designed and manufactured by Flex Power Modules to deliver the levels of quality and confidence that are required by power system designers to develop long-term and high-performance reliable platforms. 

For more information, visit flex.com.

CUI Inc: Stepper Motor and Encoder Combo Offers All-in-One Motion Control Solution
Posted: 2018-7-31

CUI’s Motion Group today announced a new line of stepper motors paired with their AMT11 incremental encoder series. The NEMA AMT112S stepper servo motor family is available in compact NEMA 8, 11, 14, 17, and 23 frame sizes with a step angle of 1.8° and holding torques ranging from 3 to 270 oz-in (0.021 to 1.90 N-m). When paired with a controller, the motor and encoder combo provides closed-loop feedback for a complete servo system. This gives designers a highly reliable motor and motion control feedback solution in one convenient package for a range of applications.

Integrating with the stepper motors is CUI’s innovative AMT11 incremental encoder series. This rugged, high accuracy modular encoder features 22 programmable resolutions from 48 to 4096 PPR, a digitally set zero position, and CMOS voltage output waveforms. The resolutions are fully programmable via CUI’s AMT Viewpoint™ software without having to remove the encoder from the motor, allowing for ultimate flexibility in the field. Thanks to its proprietary capacitive technology, the AMT11 series is also not susceptible to contaminants such as dirt, dust, and oil typically encountered in industrial environments.

For more information, visit www.cui.com.

Maximize System Performance with Microchip’s Dual-mode Power Monitoring IC
Posted: 2018-7-30
Single IC offers industry-leading accuracy for real-time power measurement of AC and DC power supplies

In systems that use both AC and DC power, the implementation of dual-mode power monitoring traditionally requires multiple ICs to ensure superior performance and accuracy. Growing applications such as solar inverters, smart lighting and cloud servers often use both modes to maintain safe operation, with AC as the main power source and DC as backup or vice versa. To optimize performance and ease development of these systems, Microchip Technology Inc. today released a flexible dual-mode power monitoring IC that measures both AC and DC modes with industry-leading accuracy of 0.1 percent error across a wide 4000:1 range. Power calculations and event monitoring are included with a single IC, reducing bill of materials cost and firmware development time. For additional information, visit: www.microchip.com/MCP39F511A  

The MCP39F511A power monitoring IC is a highly integrated device that addresses the growing need for more accurate power measurements in high-performance designs. To simplify calibration procedures and support most accuracy requirements, two 24-bit delta-sigma Analog-to-Digital Converters (ADCs) with 94.5 dB of signal-to-noise ratio plus distortion (SINAD) performance and a 16-bit calculation engine are included. Suitable for a range of consumer, Internet of Things (IoT) and industrial applications, the MCP39F511A automatically senses power supply types and switches between AC and DC modes, optimizing measurement results. The device also helps developers troubleshoot issues with an on-chip EEPROM that logs critical events, as well as an integrated low-drift voltage reference and internal oscillator to reduce implementation costs.

Other benefits of using the MCP39F511A include its flexibility and ease of implementation. The device provides standard power calculations such as active, reactive and apparent power, active and reactive energy, root-mean-square (RMS) current and voltage, line frequency and power factor, which enable designers to easily add highly accurate power monitoring functions to end applications with minimal firmware development. To further simplify development efforts, the MCP39F511A includes advanced features such as auto-save and auto-load of power quantities to and from the EEPROM at power loss or start, ensuring that measurement results are never lost if power is disrupted unexpectedly. Event monitoring of various power conditions also enhances preventative system maintenance and enables developers to better manage power consumption.

“Power monitoring has become more prevalent in growing markets such as smart cities and smart homes as developers look to monitor product performance and improve energy usage,” said Bryan Liddiard, vice president of Microchip’s Mixed-signal and Linear Products Division. “The MCP39F511A provides customers with a simplified development path and the ability to monitor both AC and DC power supplies with industry-leading accuracy.”  

For more information, visit the Microchip website at www.microchip.com.

ON Semiconductor Announces New Multimedia Analog Audio Switch And High Precision Current Sense Amplifiers for USB-C Applications
Posted: 2018-7-23
New devices ideal for tablets, smartphones, laptops and other USB-C and power-oriented applications

ON Semiconductor, driving energy efficient innovations, has announced two new products that can be used together in USB-C(Type-C)applications while offering benefits in other modern power-oriented applications. The new devices are the FSA4480, a USB Type-C analog audio switch with integrated protection, and the NCS21x series of current sense amplifiers.

The FSA4480 is a high-performance USB Type-C port multimedia switch that supports analog audio headsets allowing a common USB Type-C port to pass USB2.0 signals, analog audio and analog microphone signals. The device, which supports an audio sense path, is a fully integrated and optimized solution that eases design-in and minimizes overall solution footprint. It includes integrated high voltage protection up to 20 volts (V) DC, and offers pinout support for both OMTP and CTIA - sometimes known as American Headset Jack (AHJ) - smartphone headset standards. There is overvoltage protection (OVP) on the common node pins and the unplugging of any audio device is automatically detected.

With its integrated I2C interface, the FSA4480 is easily controlled by a host processor and audio ‘pop and click’ is highly reduced as the change is made. Housed in a small WLCSP chipscale package measuring just 2.24 mm x 2.28 mm x 0.5 mm, the device is ideally suited to space-constrained mobile applications such as smartphones, tablets, digital cameras and speakers. It can also be utilized in computing devices including laptops, desktops and hybrid notebooks.

The NCS21x family of bi-directional current sense amplifiers which include integrated, highly matched precision resistors, that offer an accurate, compact system design for measuring small differential voltages. The devices are able to detect common mode voltages in the range -0.3 to 26 V, making them ideal for both high-side and low-side current sensing. The zero-drift architecture of the NCS21xR provides a low input offset voltage (as low as 35 µV) and low offset drift (as low as 0.5 µV/°C). Together with integrated gain setting components, these devices are capable of sensing smaller voltage drops across the shunt, providing a higher gain accuracy and superior temperature performance.

Offered in 50/ 100/ 200, and 500/ gain options with a maximum gain error of ±1%, these devices consume a low quiescent current of 40 μA, which significantly improves efficiency and makes them ideal for power conscious, battery-powered applications. The small SC-70 and UQFN packages make them ideal for monitoring charging and discharging current for battery management in handheld applications such as smartphones, tablets and laptops. With the adoption of USB Type-C in rapid growth markets such as hybrid and electric vehicles and several consumer products, these current sense amplifiers have noted presence in the power management, motor control and signal conditioning blocks.

“Our new multimedia switch and current sense amplifiers play an important role in managing the USB Type-C interface in modern mobile devices.” said Wiren Perera, who heads IoT at ON Semiconductor. “The highly-integrated designs, low-power operation and small size mean they are ideal for tablets and smartphones where space is limited and power budgets are important. Furthermore, the current sense amplifiers can be instrumental in controlling power in larger applications including white goods and electric vehicles.”

For more information, visit www.onsemi.com.

Flex Power Modules expands innovative BMR480 DC/DC advanced bus converter series with 1300 Watt rated version
Posted: 2018-7-11
  • Based upon the company’s leading-edge and patented Hybrid Regulated Ratio (HRR) topology, the new addition to the range delivers up to 1300W at 12V in a standard quarter-brick footprint incorporating a PMBus digital interface. This represents a 44% increase in power over previous 12V/900W model
  • Efficiencies of up to 97.4% offer significant annualized energy and cooling savings
  • Higher efficiencies in turn result in higher system reliability and greater longevity
  • Market-leading credentials make it suitable for a range of information and communication technologies (ICT) applications

Flex Power Modules today announced an addition to the BMR480 DC/DC advanced bus converter series for high-end and high-power applications. The BMR48001x6/005 delivers 12V DC at up to 1300W of power and 108.3A.

Packaged in the industry-standard quarter-brick-format measuring 2.30 x 1.45 x 0.57 inches (58.4 x 36.8 x 14.48mm), the BMR48001x6/005 achieves an impressive power density of more than 680W/in3. This is achieved in part by optimizing its operation across the input voltage range of 45V to 60V to produce a regulated 12V output, employing the company’s patented Hybrid Regulated Ratio (HRR) technology between 51V and 45V. Over 15 patents have been filed in relation to the BMR480 series, many of which are directly related to efficiency improvements and design techniques for lowering power dissipation. As a result, the DC/DC converter is able to offer 97.4% efficiency when operating from a 53V input voltage and delivering 100% output current.

Compared with other members of the BMR480 series, the BMR48001x6/005 delivers around 0.5% higher efficiency at 1000W, making it a viable upgrade for existing installations, as well as a high-efficiency solution for new designs.

“Annualized over 24/7 operation, an improvement of 0.5% equates to over 40kWh power reduction for every module in the system,” explained Olle Hellgren, Head of Business and Product Management at Flex Power Modules. “Depending on the cooling solutions employed throughout a facility, a typical rule of thumb might suggest that every 1W of power wasted as heat typically requires 0.5W of energy to cool, so the total power saved is 60kWh per year from every module. If we multiply that saving by the number of blade servers in a typical data center, the benefits add up significantly.”

The BMR480 series is perfect for intermediate bus conversion (IBC), dynamic bus voltage (DBV) and distributed power architectures (DPAs), and is designed to power high-end and high-power applications supplied by front end AC/DC rectifiers, typically favored by the ICT sector. Networking and telecom equipment, industrial equipment, and server and storage applications can also benefit from the efficiency and reliability of the BMR480 series.

The module comes as standard fitted with a baseplate, which can be connected to a heatsink or cold plate for use in more challenging thermal environments. Even when operating in high ambient temperature environments with limited airflow, the efficiency of the BMR48001x6/005 helps to minimize power dissipation, and maximize system reliability.

Dynamic load compensation and support for the latest version of the PMBus communication specification are complemented by the Flex Power Designer software tool (https://flexdigitalpowerdesigner.com), giving power architects total flexibility during system design and enabling them to deliver power systems with the highest energy efficiency. Other product features of the BMR48001x6/005 include a DOSA standard 7-pin digital header, 1500V input/output isolation, monotonic start-up, remote control, and a range of protection capabilities including over-temperature, output-short-circuit and output-over-voltage.

The new module has been designed and manufactured by Flex Power Modules to deliver the levels of quality and confidence that are required by power system designers to develop long-term and high-performance reliable platforms. 

For more information, visit flex.com.

Vicor White Paper: Designing Rapid-start Applications that Never Fail
Posted: 2018-6-28
Three keys to designing rapid-start power supplies

Design of a rapid-start, isolated power system presents unique challenges. These systems, leveraged in rapid-start applications, need to start in milliseconds - every time. For example, a growing number of vehicles use start-stop engine technology to conserve fuel and battery power at traffic signals and other situations when the vehicle is stationary.

In these applications, some electrical systems that would otherwise draw significant power while the vehicle idles may be shut down. However, those same systems need to be powered up again quickly and reliably.

This is where rapid-start systems are essential.

This whitepaper will help you with your own rapid start power system design.

Download it now to find out more.

Powerbox’s S-CAP BOOST technology delivers peak power and safety to industrial and medical applications
Posted: 2018-6-26

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the introduction of its supercapacitor boost technology, S-CAP BOOST, offering backup and peak power solutions to industrial and medical applications. Based on the latest supercapacitor technology combined with intelligent control and monitoring, S-CAP BOOST offers a solution to equipment manufacturers requiring high energy peaks for short periods or emergency backup purposes in applications where due to safety regulations, Lithium Ion or acid batteries are not allowed. Depending on the application, S-CAP BOOST can be configured to charge and monitor supercapacitor banks to work as UPS, delivering backup power to allow safety operations to take place before shutdown or delivering high peak power for a short period without disturbing the main source or discharging/damaging the system battery in applications such as laser, electric motor booster or X-ray emission element.

Critical applications operating in hostile or confined environments are strictly regulated in terms of chemical and other hazardous risks, reducing or forbidding certain type of batteries such as Lithium Ion. For safety reasons, those applications must have a power backup long enough to run alarms and safety shutdown processes. In such arduous conditions, conventional batteries are replaced by supercapacitor banks whose values could be from few Farads to 200 Farads for general applications, but up to container size in the case of large systems. S-CAP BOOST technology tightly controls vital parameters, from a single 2.8V cell supercapacitor to a wide range of assemblies delivering a specific voltage and energy required for a given application.

One example of a product built using Powerbox’s S-CAP BOOST technology is a 2500W backup unit developed for an industrial process-control computer installed in a very restricted area. Housed in a 19 inch 2U chassis, the 29F-54V-60A integrates 22 supercapacitors totaling 29 Farads and has a capacity of 2500W during 5 seconds at full load and 30 seconds at half-load. To optimize the cells charge, the 29F-54V-60A integrates a DC/DC converter with current control, guaranteeing the supercapacitors are properly charged to deliver full power when required. The unit includes active charging cells control with load balancing, cell health monitoring and alarms. Alarms signals including Vcell-high, Vcell-low, Vcell-zero and temperature are available via a physical interface, with digital control and monitoring being an alternative option.

“The number of applications requiring emergency backup or high peak current are growing, and integrating supercapacitors within power supplies is becoming an extremely reliable and well suited option to be considered by system architects.” said Patrick Le Fèvre, Powerbox’s Chief Marketing and Communication Officer. “Powerbox’s S-CAP BOOST is a great platform for the future and we foresee an impressive number of applications for supercapacitor energy storage technology, and not only for electrical vehicles.”

Compared to Lithium Ion which has a cyclability (number of recharges) of 500 to 1,000, supercapacitors can sustain from 500,000 to 20,000,000 cycles, making that technology extremely relevant for applications requiring large amounts of charge /discharge cycles with high energy such as industrial or medical lasers. This is what S-CAP BOOST technology has been developed for, very tight control of the supercapacitors’ charge in order to optimize the energy stored between each cycle, with very high levels of safety and reliability.

For more information visit www.prbx.com

 

ON Semiconductor Announces New Family of Multi-Chip Module PWM Buck Regulators Offering Market-Leading Current Density and Fully Integrated MOSFETs
Posted: 2018-6-25
FAN6500xx series delivers exceptional levels of integration for higher efficiency and reliability

ON Semiconductor, driving energy efficient innovations, has announced the release of three new highly-efficient mid-voltage PWM buck converters.

Supporting a wide input voltage range of 4.5 V to 65 V, an output current of up to 10 A and output power of 100 W, ON Semiconductor’s new FAN6500X family of buck converters combines the time tested fixed frequency control scheme with flexible Type III compensation and robust fault protection. ON Semiconductor has integrated its PowerTrench® MOSFET technology to create a rugged integrated solution that delivers industry leading power density and efficiency for DC-DC applications.

By combining ON Semiconductor’s PowerTrench MOSFET process with industry-leading packaging technology in a PQFN footprint, the FAN65008B/5A/4B PWM buck converters deliver extremely low parasitics in the power path, enabling developers to realize a peak efficiency of 98.5%, with low ringing and better EMI than a solution that uses an external MOSFET.

All three devices support a wide input voltage range from 4.5 V to 65 V, making them applicable to a large range of applications in the Industrial and Consumer sectors, from Base Station Power supplies to Home Automation. They are also suitable for battery management systems, as well as USB Power Delivery (PD) applications. The integration of two LDOs plus an on-chip Power Path switch gives designers the flexibility to power the controller from the input voltage, the buck converter output or through the PVCC pin using the Power Path.

The high level of integration means manufacturers can use the FAN6500x family to strike the right balance between power density, BoM cost, performance and flexibility. By leveraging its PowerTrench MOSFET technology, ON Semiconductor successfully addresses the key features developers look for in a power management solution.

The FAN6500x family implements an exhaustive range of features to protect itself and any downstream circuits from damage. These include adjustable Over-Current protection, Thermal Shutdown, Over-Voltage protection and Short-Circuit protection.

“With the release of the FAN6500X family of parts ON Semiconductor has produced a series of robust solutions to help customers meet their mid-voltage DC-DC needs with industry leading efficiency, power density, and flexibility,” said Richard Lu, Vice President of Mobile, Computing and Cloud Division, ON Semiconductor.

For more information, visit www.onsemi.com.

Cornell Dubilier Introduces Protected Metalized Polypropylene Film Capacitors Target UPS Systems and AC Filtering Applications
Posted: 2018-6-25
Design incorporates fuse protection, UL 810 Approved for Fail-Safe Operation

Cornell Dubilier announces the availability of its newest metalized polypropylene film capacitors for UPS, AC power supplies and general AC filtering applications. The 951C and 953B series offer strong performance for filtering in applications where high ripple currents are encountered and benign end-of-life failure mode is essential. The 951C has a cylindrical body with axial leads, while the 953B has a rugged radial box form factor.

Both capacitors offer a fused, segmented metallization pattern, providing significant circuit protection. UL 810 approval assures fail-safe operation under fault conditions. The metallization pattern is deposited on a low-loss, high-grade polypropylene dielectric. The built-in fuse-links limit capacitance loss to a small segment within the capacitor. This is in contrast to the larger areas of uncontrolled capacitance loss observed with non-segmented types. This capability is not usually available for board-mounted capacitors.

The axial-leaded 951C Series is offered in values ranging from 0.825 to 40 μF, while the 953B spans 2.5 to 50 μF. Voltage ratings in both series are available at 160, 250 and 275 Vac. Both types offer -40 to +85°C performance and meet the requirements of UL 94V-0 for flammability.

With a 10,000-hour service-life expectancy without derating, series 951C and 953B capacitors will excel at providing reliable filtering and smoothing for today's demanding applications in UPS systems, AC power supplies and more.

For more information on these series visit: www.cde.com/news/2018/6/953b
 

Powerbox announces four new series of extra-wide input DC/DC converters for railway and transportation industry
Posted: 2018-6-7

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the launch of four new series of extra-wide input voltage range, 8W to 20W board-mounted DC/DC converters for railway and transportation industry. With a 13:1 input voltage range of 12V to 160V, the MAD33 (8W), MAD32 (10W), MAE35 (15W) and MAF35 (20W) have been developed to provide systems designers with a single part number that is able to power a large range of transportation industry applications (e.g. railway, industrial automation and automotive, remote radio-control), reducing inventory, time to market and documentation.

The MAD-MAE-MAF series are designed to meet railway specifications EN50155, EN50121-3-2, EN61373 and EN45545, but as well ISO7637-2 for 24V vehicles, and EN12895 for industrial trucks and other industrial applications such as robotics. The 8W MAD33 is packaged in an industry standard DIP24 case, and the MAD32, MAE35 and MAF35 are housed in a 2x1 inch case. All four series have a typical efficiency rating of 86%, which considering the extra-wide up to 13:1 input range is an outstanding figure.

With the development of connected devices and Internet of Things (IoT), the number of points-of-interaction and sensors are rapidly increasing. Systems designers are facing challenging situations by having to develop products able to operate in many different applications powered by a large range of voltages – versatility is the name of the game. As an example, the railway standard EN50155 specifies no less than six different bus voltages (24V, 37.5V, 48V, 72V, 96V and 110V) including brownout (voltage drops) and transient surges during start-up. Considering many equipment could be connected to any of those six voltages, system designers have to be able to guarantee that their equipment will operate from 14.4V to 154V, include brownout (voltage drop down to 14.4V) and a one second transient of 154V as specified in EN50155. With an operating input voltage range from 12V to 160V and a power rating range from 8W to 20W, the new MAD-MAE-MAF series converters from Powerbox are the Swiss army knife power solution, simplifying design while shortening time-to-market and reducing documentation and inventory.

“Time to market is very important for systems designers as is simplicity of the sourcing / supply chains in order to reduce downtime in the case of trains maintenance or hardware upgrades. Both are driving forces behind extra-wide input range converters and we see similar demands from other industries such industrial automotive,” said Martin Fredmark, Powerbox’s VP Portfolio Management. “Designing 13:1 input range DC/DC converters is very challenging in order to optimize all parameters while keeping the highest possible efficiency levels across the whole input voltage range, and we are proud that our designers achieved this in the new MAD-MAE-MAF series.”

The new series of converters are suitable for low power loads and devices in railway applications such as communication devices, GSM-R phones and their docking stations, routers/Wi-Fi access points, small screens, USB charging sockets (both in-seat and driver’s cabin), sensors, and standby power for larger devices.

Available in four output voltages of 5, 12, 24 and 48V in natural convection conditions, the MAD33 delivers 8W and the MAD32 10W. The MAD33 is available in a Dual In Line Packaging (31.8 x 20.3 x 12.7 mm – 1.25 x 0.8 x 0.5 inches) and the MAD32 in an industry standard 2x1 inch packaging (50.8 x 25.4 x 10.2 mm – 2.00 x 1.00 x 0.40 inches). The 15W MAE35 and 20W MAF35 are available in three output voltages of 12, 24 and 48V and are similarly provided in 2x1 packages. All series deliver full output power in ambient temperatures up to 60 degrees C and continue to deliver power with a linear derating up to the 100 degrees C case. The MAD32, MAD33, MAE35 and MAF35 are housed in plastic cases.

Designed for ruggedized environments, the MAD-MAE-MAF series meet thermal shock and vibration requirements as specified in EN61373 and MIL-STD-810F, and they all meet the Fire and Smoke EN45545-2 standard.
All models within the MAD-MAE-MAF series feature full protection level sets including input voltage lockout, short-circuit protection and current limiting. All units operate at a fixed switching frequency and including PI type input filters. The operating temperature range is from -40 to +85 degrees C ambient (maximum 105 degrees C case) and storage is from -55 to +125 degrees C.

The new series of converters from Powerbox meet the requirements of UL60950-1, EN60950-1 and IEC60950-1 standards, and CE mark 2014/30/EU. All products have an input to output isolation voltage of 3,000 VAC. The MAD-MAE-MAF series are RoHS compliant.

The MAD33 (8W), MAD32 (10W), MAE35 (15W) and MAF35 (20W) are complementing the PQB50U-72S (50W) and PFB600W-110S (600W), offering a complete range of power modules solutions, from 8W up to 600W, to railway applications and demanding industries.

For more information, visit www.prbx.com

Transphorm Increases Noise Immunity and Reduces Switching Noise with Third Generation GaN Power Conversion Platform
Posted: 2018-6-5
First GaN FET with 4 Volt Threshold and New Power System Development Methods Result from Field Experience

Transphorm Inc.—the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101 qualified gallium nitride (GaN) semiconductors—today announced availability of its third generation (Gen III) 650-volt (V) GaN FETs. Power transistors built on Gen III technology yield lower electromagnetic interference (EMI), increased gate noise immunity, and greater headroom in circuit applications.

The latest evolution of the award-winning platform stems from knowledge gained by the Transphorm team working with customers on end product designs now in production or soon to be released. Gen III devices being released include the TP65H050WS 50 mΩ FET and TP65H035WS 35 mΩ FET, both available in standard TO-247 packages.

Transphorm in the Field = Product Development Advantages
Transphorm is one of the only GaN semiconductor companies owning each critical stage of FET development. Given this, insight gained during customer development projects along with Gen I and Gen II platforms  can be applied to the GaN-on-Si technology to increase the transistor’s quality, reliability, and performance. Data is often gathered that also informs development techniques that can simplify design complexity, increase safety margin, and/or positively affect power system performance.

Research that lead to Gen III produced both opportunities: increased benefits now inherent to the GaN technology itself and new design methods augmenting the FET’s performance. Further, the design and fabrication innovations enable Transphorm to reduce device price, generating even more ROI.

Technologically, the incorporation of a new MOSFET along with other design modifications enable Gen III devices to deliver:

  • An increased threshold voltage (noise immunity) to 4 V from 2.1 V for Gen II, eliminating  the need for a negative gate drive.
  • A gate reliability rating of ±20 V; an 11 percent increase versus Gen II.

As a result, switching is quieter, and the platform delivers performance improvement at higher current levels with simple external circuitry.

Regarding learned design techniques, Transphorm published elegant solutions for oscillation suppression in its app note 0009: Recommended External Circuitry for Transphorm GaN FETs. Example recommendations include the use of DC-link RC snubbers and switching-node RC snubbers that add further stability without adverse impact on efficiency. Notably, the solutions can benefit half-bridge and bridgeless totem-pole PFC topologies.

“It’s important to us to evolve our GaN technology based on customer need and real-world experience. Our Gen III FETs exemplify what’s possible when we adhere to that basic philosophy,” said Philip Zuk, Vice President of Technical Marketing, Transphorm.

“We’ve brought forth a safer, more cost-effective high-voltage GaN FET. We trust that these transistors will be seen by customers as the new power semiconductors delivering invaluable efficiency, high power handling capability and otherperformance advantages with ease of use,” added Dr. Yifeng Wu, Senior Vice President of Engineering, Transphorm.

 

ON Semiconductor Announces SiC Diodes for Demanding Automotive Applications
Posted: 2018-6-5
Lower losses and higher switching deliver highly efficient, space-saving solutions and reduced overall system costs

ON Semiconductor, driving energy efficient innovations, has announced an expansion of its silicon carbide (SiC) Schottky diode portfolio to include devices specifically intended for demanding automotive applications. The new AEC-Q101 automotive grade SiC diodes deliver the reliability and ruggedness needed by modern automotive applications, along with the numerous performance benefits synonymous with Wide Band Gap (WBG) technologies.

SiC technology provides superior switching performance and higher reliability compared to silicon devices. The diodes have no reverse recovery current, and switching performance is independent of temperature. Excellent thermal performance, increased power density and reduced EMI, as well as decreased system size and cost make SiC a compelling choice for the growing number of high-performance automotive applications.

ON Semiconductor’s new SiC diodes are available in popular surface mount and through-hole packages, including TO-247, D2PAK and DPAK. The FFSHx0120 1200 Volt (V) Gen1 devices, and FFSHx065 650 V Gen2 devices offer zero reverse recovery, low forward voltage, temperature independent current stability, extremely low leakage current, high surge capacity and a positive temperature coefficient. They deliver improved efficiency while the faster recovery increases switching speeds, thereby reducing the size of magnetic components required.

In order to meet the robustness requirements and perform reliably in the harsh electrical environments of automotive applications, the diodes have been designed to withstand high surge currents. They also include a unique, patented termination structure that improves reliability and enhances stability. Operating temperature range is -55°C to +175°C.

“By expanding our Schottky diode range with AEC qualified devices, ON Semiconductor is bringing the significant benefits of SiC technology to automotive applications, allowing our customers to achieve the demanding performance requirements of this sector,” said Fabio Necco, Senior Director, ON Semiconductor. “SiC technology is a perfect fit for the automotive environment where it delivers greater efficiency, faster switching, improved thermal performance and high levels of robustness. In a sector where saving space and weight are critical, the greater power density of SiC, which helps reduce overall solution size, along with the associated benefit of smaller magnetics, is most welcome.”

The new devices will be demonstrated during PCIM along with the company’s solutions in areas such as Wide Band Gap, Automotive, Motor Control, USB Type-C power delivery, LED Lighting and Smart Passive Sensors (SPS) for industrial predictive maintenance applications.

ON Semiconductor will also be demonstrating its industry-leading advanced SPICE model that is sensitive to process parameter and layout perturbations and therefore represents a step-change versus current industry modelling capabilities. Using this tool, circuit designers can evaluate technologies early in the simulation process rather than through costly and time consuming fabrication iterations. A further benefit of ON Semiconductor’s robust SPICE agnostic model is that it can port across multiple industry standard simulation platforms.

For more information, visit www.onsemi.com.

Check out TI's ultra-flexible ultrasonic sensors
Posted: 2018-6-5
Get to know the industry’s most flexible ultrasonic sensors

The PGA460 ultrasonic sensor supports wide distance detection at low power, making it well suited to a range of industrial applications. The quick object detection and flexible set-up of the PGA460-Q1 support automotive park assist, lane departure and other object and position sensing applications.
 
Key features and benefits:

  • Ease of use: highly integrated with a programmable digital core
  • Flexibility: Achieve better resolution and shorter distance detection through a range of frequencies from 30-70kHz and 180-480kHz
  • Distance detection: object detection at distances as low as 5cm and as high as 11m
  • Low power: Reduce power consumption at 500 µA operation in sleep mode 

Learn more from the TI Ultrasonic experts 

 

ON Semiconductor Announces Industry Leading Ultra-High PSRR LDO Regulators for Demanding Applications
Posted: 2018-6-4
High PSRR improves performance in imaging and wireless applications, including automotive

ON Semiconductor, driving energy efficient innovations, has announced a new range of ultra-low noise LDO regulators with the industry’s best power supply rejection ratio (PSRR), enabling better performance in noise sensitive analog designs. The new NCP16x series, along with the AEC-Q100 qualified NCV81x automotive variants, delivers improved performance in applications such as automotive ADAS image sensor modules, portable devices and wireless applications – including 802.11ad WiGig, Bluetooth and WLAN.

The NCP16x series comprises four devices with a wide input voltage range from 1.9 to 5.5 volts (V) to support a variety of end applications. Output current of 250 milliamperes (mA), 450 mA and 700 mA in a common package footprint enable easy scalability of designs. Ultra-high PSRR of 98 decibels (dB) blocks unwanted power supply noise from reaching sensitive analog circuits, while ultra-low noise of 6.5 microvolts (uV) RMS eliminates the need for additional output capacitance.

The new LDO regulators have a low dropout voltage of 80 millivolts (mV), supporting and helping to prolong the operating life of battery powered end products. This is further enhanced by a no-load quiescent current of just 12 microamperes (μA). They are available in fixed output voltages from 1.2 V to 5.3 V with an accuracy of +/-2% over the entire application range. Stable operation is achieved with only 1 µF of capacitance on the input and output enabling lower system cost and size.

A new patented architecture is implemented to achieve the ultra-high PSRR performance and extends ON Semiconductor’s leadership position in this area. Providing high PSRR over a wide frequency range (10 kHz to 100 kHz) is important to end application performance. In image sensor applications for ADAS cameras, for example, the NCV8163 provides improved image quality by filtering out power supply noise that would otherwise corrupt the voltage signal applied to the pixel. In wireless applications such as WiGig 802.11ad, the combination of ultra-high PSRR and ultra-low noise as seen in the NCP167 ensure the power-per-bit efficiency capability of the system is realized by providing a clean power supply.

“This new series of ultra-low noise LDOs dramatically improves PSRR, exceeding some conventional LDOs by 30 dB. Our customers are excited about the new level of performance they are able to achieve with this product family,” said Tim Kaske, Sr. Business Unit Director, ON Semiconductor. “An LDO is still the best solution for low current applications and with the small size and now even higher levels of performance in PSRR and low noise, they are an ideal power management solution for noise sensitive RF and image sensor applications. As an example of this we have a growing collection of image sensor reference designs that use this new LDO family. The total system level application provided by ON Semiconductor enables engineers to quickly implement the highest image quality sensor solutions available on the market today.”

For more information, visit www.onsemi.com.

PSMA Power Technology Roadmap 2017 Report Is Now Available
Posted: 2017-7-21
The 2017 edition includes 551 page report plus USB drive with recorded webinars covering individual sections

The Power Sources Manufacturers Association (PSMA) announces that The Power Technology Roadmap 2017 is now available for purchase by both PSMA members and non-members. This is the tenth edition in the roadmap series, which is published every two years. A preview of the report, including the Table of Contents and Foreword, is available on the homepage of the PSMA website, www.psma.com.

The 2017 report forecasts the power technology and power delivery trends through 2021 and includes a USB memory drive version containing the complete report and the graphics and the presentation in color as well as the recorded webinars which provided up-to-date industry information used in the final report. The webinar recordings add much to the report because the listener can understand the context and the subtext of the materials in the presenter's own voice.

In this edition, a new section on Component Technologies has been added. It is widely recognized that the power technology growth is strongly impacted by the growth (or lack thereof) of underlying component technologies. In prior roadmaps, the component angle was covered through the webinar presentations, but it is hoped that the addition of this new section will provide further insights and value to the readers.

The 2017 report continues with essay contributions by the industry experts on Applications Trends and Emerging Technologies. The Application Trends section covers diverse segments such as automotive, consumer, computing, lighting, motor control, medical, and portable charging. This year, an energy harvesting segment makes a debut to keep up with the changing trends in power electronics.  The Emerging Technologies section includes 3D packaging, additive manufacturing, high-frequency magnetics, integrated magnetics and use of nanofluids in electronic cooling. There is much valuable information in these essays. 

"The end result of the webinars, surveys, presentations and discussions is a comprehensive report by the PSMA that offers a consolidated view of the latest trends in the power management, power control and power delivery technologies," said Dhaval Dalal, Co-Chair of the organizing committee. "This latest edition of the PTR provides the most extensive, forward-looking view of our industry. It is an invaluable resource for any organization involved in the power electronics technology marketplace."

"Power electronics technology has emerged, or should we say re-emerged, as an enabling technology in its own right. Part of our industry is now shaping the technology for a large part of the electronics industry." said Conor Quinn, Co-Chair of the organizing committee. "The breadth and depth of the information in this report is unprecedented and together captures the technical trends and issues facing the power sources industry. We hope industry professionals will find our 2017 report useful, thought provoking and valuable."

A copy of the printed and USB memory drive versions of 2017 PSMA Power Technology Roadmap has been sent to PSMA Regular and Associate member companies as a benefit of their membership. Additional copies may be purchased at the member price of $190. PSMA Affiliate members may also purchase the report for $190. The report will be available to non-members June 15 for purchase on the PSMA website (www.psma.com) at the price of $2,990.

PSMA Publishes Technology Report: “Current Development in 3D Packaging With Focus on Embedded Substrate Technologies”
Posted: 2015-3-17
Comprehensive report is the first to address “More than Moore” digital power demands by accelerating the development of higher density power sources using new, disruptive packaging technologies

March 16, 2015—The PSMA (Power Sources Manufacturers Association) Packaging Committee announced today that it has published a report titled “Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies.” The first comprehensive study on using embedded substrate technology for building power sources, the report contains extensive research and product illustrations geared to an audience of technology executives and design engineers. Its purpose is to offer an in-depth industry perspective on how currently available materials and processes can be best used for the creation of advanced high-efficiency, high-power-density power products.

The PSMA created the 3D packaging report to address the pressing demands in the power industry to accelerate the development of higher density power sources. The first challenge arose from digital semiconductor packaging technology hitting a “cost barrier” brought about when advanced deep-submicron semiconductor technology could no longer reduce cost with the addition of more functions to the semiconductor die. This barrier was circumvented through the development of wafer thinning that enabled through-silicon-via (TSV) technology and the eventual introduction of 2.5D and 3D integration, which facilitated heterogeneous (“More than Moore”) integration. This integration allowed the power requirements of the digital load to increase two to five times, within the same footprint, in a single generation. Now the power industry is tasked with finding ways news ways to package power sources that will meet this demand, but without increasing footprint.

In parallel, power semiconductor technology is facing a “construction barrier” that prevents the realization of the significant benefits new technology can offer in terms of increased power efficiency and higher power density.  These new technologies, including gallium-nitride (GaN), silicon-carbide (SiC), and gallium-arsenic (GaAs) power semiconductor devices, all require operation in a package that is free of bond wires and that minimizes parasitic interconnect elements. Both of these challenges can be addressed with power packaging utilizing embedded substrate technologies and are addressed in the report.

The PSMA’s 340-page report, prepared under contract by LTEC Corporation with work subcontracted to Anagenesis and Fraunhofer-Institute, is based on the Packaging Committee’s extensive research of over 750 articles and papers, analysis of 450 presentations/papers, and by conducting 30 industry expert interviews. Information was also derived from attendance at 10 industry conferences, workshops and seminars. The report contains 172 links and 394 citations.
The report provides detailed analysis of substrates (organic and inorganic), components (actives and passives), thermal management, high temperature die, packaging technologies, interposers, as well as additive manufacturing and laser fabrication. Each passive component (resistors, capacitors, inductors) has an entire chapter detailing which suppliers are currently shipping products usable in power sources.  Every chapter covers manufacturing issues and includes references to contract manufacturing companies already producing power products utilizing embedded substrate technology. Embedded substrate packaging leverages the large investment made by the digital industry in advanced packaging technologies and is being used to resolve the power source construction challenge. As the report demonstrates, 3D power packaging using embedded substrate technology is a disruptive technology, in that it enables large increases in power density and efficiency.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the  challenges companies will face to implement embedded substrate 3D power packaging to create the significantly higher power densities driven by the “More than Moore” digital power demands.”

The PSMA report on 3D packaging will be provided free of charge to PSMA Regular and Associate members.  Affiliate members can purchase the report for the reduced price of $190.  Others interested in the report may order a copy from PSMA for $2,990. 
 

Power Sources Manufacturers Association Reprints Classic Magnetics Text
Posted: 2011-7-25

 

MENDHAM, N.J. – June 23, 2011 − The Power Sources Manufacturers Association (PSMA) announced that it is again making available Nathan Grossner's classic treatise, Transformers for Electronic Circuits - Second Edition. The first reprint of this work sold out and this second reprint is now available. PSMA members may now purchase this important text online, directly from PSMA, at the discounted price of $55. The non-member PSMA online price is $75. Non-members may also purchase it through How2Power or through Amazon. This text is a complete, one-stop guide to transformer and inductor design and applications for everyone who designs, builds, or uses power magnetics components. Throughout this book, the author combines analysis and synthesis and all theory is related to the solution of real-world problems.

Sections of the text provide guidance in the use of transformers and inductors in power electronics and in digital and pulse circuits. Also included is design information about other forms of high-frequency magnetics such as transmission-line transformers, hybrid transformers, ferroresonant tranformers, flyback converter magnetics and inductors used in switch-mode power converter designs.

Special attention is given in the book to the proper control of dielectric stress, corona and thermal factors in high-voltage magnetics designs. Modeling methods for magnetic parts are also included and treated in some detail. This book is an essential reference book for any engineer involved in the design and development of modern-day magnetic components.

According to Steve Carlsen, co-chair of the PSMA Magnetics Committee, “Grossner's book should be an essential part of every power supply designer’s technical library. The initial PSMA reprint edition sold out and thanks to PSMA, it is once again available after being out of print for several years.”

PSMA Answers Continued Demand for Snelling Magnetics Text with 2nd Reprint
Posted: 2010-10-4

Mendham, New Jersey—June 1, 2010—The Power Sources Manufacturers Association (PSMA) has announced the renewed availability of SOFT FERRITES – Properties and Applications - Second Edition, authored by Eric Snelling. The book had been out of print for several years and was reprinted in limited quantity by the PSMA in 2006. Due to continued demand, a second reprinting is now available. The book was initially published in 1969 and was extensively revised by Snelling in 1988 to bring all eleven chapters in line with current design practices and applications of ferrite cores used in modern-day inductors and transformers. The aim of this unique 366-page reprint is to provide all the information on ferrite properties and wound-component design necessary for efficient applications of these materials. Data in the book are represented by means of extensive use of graphs and tables, and design procedures are supported by many working examples of inductors and transformers. According to Stephen Carlsen, PSMA Magnetics Committee Chair, “Snelling’s book is considered by many working design engineers as the ‘ferrite user’s bible’ and PSMA is pleased to make this wonderful text available once again.” Copies of Snelling’s classic treatise on magnetics, SOFT FERRITES – Properties and Applications - Second Edition, are available for sale at www.psma.com. The cover price for the reprint is $150 but PSMA members, as a benefit of their membership, can purchase the text for $100. The PSMA-reprint text is also available at the non-member price at www.amazon.com.

PSMA Announces Availability of On-Line Energy Efficiency Standards Database
Posted: 2009-4-12
Database offered as a free service to the industry; provides “one-click” access to details of standards by world region, agency and application.

Mendham, New Jersey — April 9, 2009 — The Power Sources Manufacturers Association (PSMA) announces availability of its On-line Energy Efficiency Database (EEDB) as a service to the industry. The number of energy efficiency standards and the world wide agencies that generate them continue to grow daily. It is time consuming for an individual or company to keep track of the many actions and activities by government and industry groups. The PSMA on-line energy efficiency standards database provides “one click” access to the very latest global standards and initiatives.

As a result of user feedback on an earlier version of the database, PSMA has incorporated a number of improvements. Some of the useful features:

•Quick access to world region, agency, or standards application
•Expanded data includes list of specific standards generated by an agency and parametric specifications for each regulation
•Expanded description of regulations and agencies
•Enhanced descriptions that include html code for quick linking to agency site or database location
•Latest schedule of standards meetings

Dusty Becker, PSMA Board Chairman and chair of the PSMA Energy Efficiency Committee, states that "The PSMA On-line Energy Efficiency Data Base, which incorporates a number of improvements suggested by product planners to keep current, is a valuable resource for engineers. We are pleased to offer this resource free of charge to our membership and to the industry."

Though access to the PSMA EEBD is free, users are required to register on www.psma.com/green/ so PSMA can provide notice of special database announcements and associated PSMA activities.

About PSMA

PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its membership which includes most major power supply companies.

PSMA Announces Reprint Availability of J. K. Watson's “Applications of Magnetism”
Posted: 2008-2-4
New reprint is the fourth title in PSMA's out-of-print Classic Book Series

MENDHAM, N.J. - February 4, 2008 ─ The Power Sources Manufacturers Association (PSMA) is pleased to announce availability of a reprint of the classic book "Applications Of Magnetism" authored by the late J. K. Watson and originally published by John Wiley and Sons in 1980. According to Ed Bloom "This classic book, written by one of the most respected teachers in the field of magnetics, makes the principles of applied magnetics accessible to the practicing electronics engineer. With emphasis on practical design, the text presents the relevant principles of physics, circuit analysis, simple models and the calculations involved in designing a circuit or a magnetic device. No prior knowledge of the physics of magnetism is assumed ─ material properties are explained in a step-by-step manner, with special attention to their effects on the volt-ampere characteristics of a magnetic device, and to the physics of magnetic domain processes. Applications of magnetics, including those associated with power electronics circuits, are covered as well as reluctance modeling methods for transformers and inductors." Copies of this practical design treatment of magnetics will be available for sale at this year's Applied Power Electronics Conference (APEC 2008) to be held in Austin, Texas, February 24-28, 2008 and through the PSMA web site - www.psma.com. Copies will sell for US$100, but members of PSMA companies can obtain a copy for US$50. To order directly from PSMA please complete the "members order form" or the "non-members order form". In the past three years, PSMA has reprinted three other classic books on magnetics including Transformers for Electronic Circuits by the late Nathan R. Grossman, Soft Ferrites - Properties and Applications by E.C. Snelling and Electronic Transformers and Circuits by the late Reuben Lee and associates. A limited number of the Snelling and Lee books are still available through www.psma.com. About PSMA PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants, interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization, whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its members, which include most major power supply companies.

PSMA Announces Latest Edition of Standardized Terminology Handbook
Posted: 2007-10-6
Third edition includes print and CD versions; provides comprehensive resource of power sources industry terminology

 

 

 

MENDHAM, N.J.,—October 5, 2007—The Power Sources Manufacturers Association (PSMA) is pleased to announce publication of The Handbook of Standardized Terminology for the Power Sources Industry–3rd Edition. Revised and expanded, this unique handbook contains hundreds of added terms, especially selected for the power electronics professional. The third edition also contains illustrations and four new appendices, including a listing of EMI specifications, excerpts from international standards of units and symbols, along with guides for authors of technical papers. These added resources provide concise, easy-to-use references for engineers involved in technical writing and presentations. Many new magnetic terms are described in this new 126-page third edition that are of particular interest to the practicing designer and marketer of power supplies and related products. Valuable information regarding worldwide power sources, standards agencies, and military specifications has been retained, updated and expanded from the previous edition. Titles of the appendices are: • Testing and Standards Agencies; Designer's Reference; • World Voltages and Frequencies; • Military Specifications; • EMI Specifications; • Writing Technical Papers for Archival Publications; Units, Symbols and Style Guide; A Brief Writing Guide. The book comes in hard copy along with a CD containing a PDF version that can easily be searched for terms and words within the definitions, making it a valuable tool for posting on your internal network. The book price is $25 to PSMA members and $50 to nonmembers. To order directly from PSMA please complete the "members order form" or the "non-members order form".

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