New product announcements


RECOM Power Half-Brick 3kw Buck-Boost Converter Has 98% Efficiency
Posted: 2019-12-4

RECOM announces the launch of a 3kW buck-boost high-efficiency DC/DC converter in a half-brick baseplate-cooled package. 

The recently introduced RECOM RBBA3000 buck-boost, non-isolated, DC/DC converter features a maximum of 3kW of output power rating in a industry-standard half brick baseplate-cooled package. Input range is 9-60VDC and the output voltage and maximum current can be user-programmed from 0-60VDC and 0-50A respectively. Programming can be via a single resistor or by an externally applied voltage. A particular feature is that the buck-boost topology utilised allows the output voltage to be set lower or higher than the input voltage. With its excellent 98% conversion efficiency, the RBBA3000  provides a full power over an operating temperature of -40 up to +85°C when appropriately cooled. The load current can be monitored from a current share pin which can also be used to parallel two modules to provide up to 100A output with active load balancing. The converter complies with EMC standard EN55024 and also EN 55032 class A and B with an external filter. Typical applications for the product are 48V to 24V or 12V to 24V battery power conversion, electric vehicle voltage regulators, battery voltage stabilisers or high power laboratory DC power supplies.

“The RECOM RBBA3000 has a great combination of high efficiency, power density and functionality” commented Steve Roberts, CTO of RECOM, “It’s also backed by our two-year warranty for peace of mind”.

For more information, visit www.recom-power.com.

Cornell Dubilier Expands Capabilities in High Current AC Harmonic Filter Capacitors
Posted: 2019-12-2

Cornell Dubilier Inc. announced that it now offers 85 Ampere RMS ratings and numerous other enhancements to its PC series of AC harmonic filter capacitors. The series improvements include UL recognized construction and an internal pressure interrupter system that has passed the rigors of UL testing to ensure fail-open performance under high current fault conditions. The higher current ratings improve the capacitor’s ability to handle the high levels of harmonic content encountered in inverter AC input and output filtering applications. 

The series is typically networked with inductors to filter out undesirable harmonics in both single-phase and three-phase AC power systems. As a two-terminal capacitor device, multiple PC series capacitors can be connected in delta or wye configurations to achieve the reactive power and harmonic tuning needed to filter out the unwanted frequencies. The presence of multiple harmonics puts additional stress on capacitors in the form of self-heating. The PC series is designed with robust terminations and low equivalent series resistance (ESR), to minimize heating. The service life objective of the PC series is 60,000 hours when operated at full rated voltage and a case hot spot of 70 °C.

The PC series is offered with capacitance ratings ranging from 20 µF to 125 µF at voltage ratings from 300 Vac to 700 Vac. Case diameters vary from 63.5 to up to 116mm. Custom capacitance and voltage ratings, sizes and performance characteristics are also available. Specific application conditions, especially harmonic content profiles, are needed to properly size the capacitors for peak performance.

The PC series enhancements add capabilities to the broad range of AC harmonic filtering solutions offered by the company. These include three-phase cylindrical and welded rectangular cases used in large inverter systems. Cornell Dubilier also offers rack-mount systems, designed and fabricated in-house, to allow for easy integration of capacitor banks into the mechanical design of a filter system.

For more information on this series visit:  http://www.cde.com/PC

TDK Lambda's Advanced 1U Full-Rack AC/DC Programmable Power Supply Series Adds 2.7kW Platform to Its Product Portfolio
Posted: 2019-12-2

TDK Corporation announces the introduction of the TDK-Lambda 1U Full-Rack Genesys 2.7kW AC/DC Programmable Power Supply Series. Adding to the already released 1.7kW, 5kW, 10kW and 15kW platforms, the 2.7kW platform provides the user with a choice of ten different models, ranging from 10V-265A to 600V-4.5A, that have advanced performance and functionality well suited for Design, Test and Measurement within the Laboratory/R&D environment and address broad market segments including Automotive, Aerospace, Semiconductor, Industrial and Renewable/Alternative Energy.

Built into a lightweight 1U high, 19” (483mm) wide rack-mountable chassis, the Genesys 2.7kW Power Supply Series offers five embedded front panel setup menus that offer user-selectable functions including Internal Resistance simulation, Slew-Rate control of Output voltage/current, Constant-Power limit and Arbitrary waveform generation.

All models have three AC Input options which include a single-phase 230VAC Input (with 0.99 PF), a three-phase 208VAC Input (with 0.94 PF) or a wide-range 400VAC/480VAC Input (with 0.94 PF), and have conversion efficiencies up to 90.5% with cooling fan speed control (for reduced audible noise and extended life). Standard safety features include user-selectable Safe-Start/Auto Re-Start and Last Setting Memory along with other built-in protective functions including Output Over-Voltage Protection (OVP), Output Under-Voltage Limit (UVL), Output Under-Voltage Protection (UVP), Fold-Back protection (FOLD) for CV or CC mode, Output Over-Current Limit (OCL) and Over-Temperature protection (OTP). A new Advanced Parallel Master/Slave system allows for up to four units to be connected in parallel with Auto-Configuring technology and provides dynamic response and Output voltage ripple/noise characteristics comparable to that of a single unit.

All model functions can be programmed locally via the menu-driven front panel display or remotely using software instrument drivers with any one of the three built-in standard Digital interfaces (LAN (LXI 1.5), USB (2.0) and RS-232/RS-485). Other programming interfaces include the built-in standard Isolated Analog Program/Monitor/Control Interface, the optional IEEE (IEEE 488.2) and ModBUS-TCP Digital interfaces.

The 2.7kW Power Supply Series carries a five (5) year warranty, has Safety certifications to IEC/EN/UL/cUL 60950-1 and has the CE mark in accordance with the Low Voltage, EMC (IEC/EN61204-3; industrial environment) and RoHS Directives.

For more information about the TDK-Lambda 1U Full-Rack Genesys 2.7kW AC/DC Programmable Power Supply Series, please visit the TDK-Lambda Americas Programmable & High Voltage website at https://us.tdk-lambda.com/hp/product_html/genplus1u2_7.htm and fill out an online Information Request at https://us.tdk-lambda.com/hp/Form/request_genplus2-7.htm.

Texas Instruments: Update Your Motor Drives Design with the Opto-Emulated Input Gate Drivers Reference Design
Posted: 2019-11-27
Increase the reliability and robustness of your next motor drive design

Three-phase inverter reference design for 200-480 VAC drives with opto-emulated input gate drivers

Looking for robust isolation and higher temperature operation for your next motor drive design? Check out our three-phase inverter power stage design suited for 200-480 VAC powered drives with output current rating up to 14 Arms. Featuring a reinforced isolated gate driver with opto-emulated inputs and 6-pin wide body package that may be used as pin to pin replacement for opto-isolated gate drivers, giving you a more efficient and robust design. Learn how our isolation technology is solving AC motor drive lifetime and temperature challenges in this white paper.

Powerbox Announces Industry’s First Power Supply for Immerged Computing Applications
Posted: 2019-11-14

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, has announced the release of its ‘industry first’ power supply solution for immerged applications such as hyper loaded computing machines. The OFI600A12 is the first commercial power supply designed to meet immerged applications specifications and guarantee the highest level of safety for system and operators. With its built-in digital supervising functions, in just a few minutes the OFI600A12 can be factory reconfigured to meet specific tasks and demands.

The PRBX OFI600A12 is the result of two years of research and development and has been validated by Powerbox’s R&D and quality teams as a certified platform for a new generation of power supplies for immerged applications. The OFI600A12 is based on an interleaved transition mode power factor correction (PFC) design with an LLC converter as second stage. It is designed to have the lowest possible inrush current, less than 10A at 264VAC. The product has an input voltage of 187 to 265VAC, dual outputs comprising a master 12V/600W and an independent auxiliary of 5V/10W, and its efficiency is up to 93%.

The OFI600A12 includes remote On/Off, remote reset, over-current and over-voltage protection and complies with safety and EMC regulations. Depending on the application, output protection may be required to be one of a number of different configurations (Switch off, Hiccup mode or Constant current), meeting this requirement, the OFI600A12 is able to be reconfigured as appropriate. Based on firmware defined profiles and the output protection configuration, the mode of operation can be factory selected in a few minutes to meet the requirements of specific applications. The unit is protected by a conformal coating and complies with the RoHS and REACH directives.

The concept of immersed data-centers emerged in 2005, and following a number of successful trials and experiments it has now become a market reality. The technology requires special caution when selecting switching power components, although manufacturing practices are very similar to those required by the marine industry in terms of robustness and the ability to endure operation in high levels of humidity or salty environments.

“With increased concerns for the environment and energy optimization, immersed data centers are becoming widespread and a number of industrial embedded applications have adopted immersed computers requiring compliant power supplies that are designed, tested and certified to work safely when immerged in a cooling fluid.” Said Patrick Le Fèvre, Powerbox’s Chief Marketing and Communication Officer.

Calling on years of experience and expertise in developing power supplies for the marine industry, Powerbox designers have transposed best practice for ruggedized design over to immerged electronics. Besides requiring a new mechanical approach to facilitate fluid circulation through and around the power supply, designers had to investigate every single component for compatibility with cooling fluids to guarantee they will maintain their mechanical and electrical performances when immerged, e.g. risk of corrosion. The development process also included a thorough risk analysis to verify that when immerged the final product operates with the highest level of safety for users and equipment.

For more information visit www.prbx.com

Flex Power Modules Introduces Power Modules for Railway Rolling Stock
Posted: 2019-11-14
  • High performance/price ratio
  • Compact half-brick package saves space
  • High efficiency of up to 92%, reducing power dissipation
  • Wide input voltage range and comprehensive input/output protection increase reliability in harsh environments

Flex Power Modules announces the PKJ7200 and PKJ7300 series of power modules for railway rolling stock equipment. The new modules are designed for the demands of the EN 50155 standard for railway applications, including a wide input voltage range, surge protection, power interruption and backup, wide operational temperature range, and resistance to shock and vibration.

The modules achieve high efficiency of up to 92% at full load, which reduces power dissipation. They are provided in a compact half-brick package, delivering high power density and thus saving space.

To handle the multiple different voltages used on trains, they have a wide input range of 60VDC to 160VDC. This means they are capable of handling harsh input voltage conditions, making it easier to cope reliably with the brownouts and transients that can occur in railway rolling stock. To protect against damage for both the modules and the devices they power, the modules provide input under-voltage protection (UVP) and output over-current protection (OCP), over-voltage protection (OVP) and over-temperature protection (OTP).

The PKJ7200 series offers 200W of output power, while the PKJ series delivers 300W. Both series provide output voltages of 12V, 13.8V, 15V, 24V, 48V and 54V.

Olle Hellgren, Director of Product Management and Business Development at Flex Power Modules, said: “Railway rolling stock places tough demands on power components, with a wide range of voltages, unpredictable variations in supply, and physically harsh conditions. The new PKJ7000 power modules provide the reliability, performance and affordability that’s needed.”

The first two devices in the new series, the PKJ7216 and PKJ7316, is available in OEM quantities. Flex Power Modules will showcase its portfolio of power modules for railway applications on Booth 2040 at Modern Railways 2019, an international trade show held at China National Convention Center in Beijing between 20 – 22 November.

For more information, visit flex.com

Gore Showcasing New and Time-Proven Solutions at 2019 Space Tech Expo
Posted: 2019-11-14

W. L. Gore & Associates will exhibit an extensive collection of qualified GORE® Space Cables and Assemblies at the 2019 Space Tech Expo in Bremen, Germany on November 19-21 in Booth H50. Gore will also be a featured speaker on November 20th at 11:15 am CET.

On display will be GORE® Space Cables that have been proven to be reliable in the harshest environments. These ESCC-qualified cables ensure non-stop power is distributed, and continuous high-speed data is transmitted at all times in critical systems. With small, lightweight, and flexible packages, they save valuable weight for critical subsystems in low-earth orbit (LEO) and geostationary earth orbit (GEO) applications.

Also highlighted will be GORE® Spaceflight Microwave/RF Assemblies for high-power, high-frequency, high-flex, and high-density applications. Proven now and over time, these ESA-qualified cable assemblies with robust connector options ensure quality signals, low loss, excellent phase stability, and outstanding shielding effectiveness from DC to 40 GHz. Diameter sizes range from 1.2 mm (0.047 in) to 8.1 mm (0.320 in) to meet mass-driven or insertion loss application requirements. Gore also offers advanced solutions for thermal extremes, multipaction, low PIM (Passive Intermodulation), and radiation resistance.

Finally, Gore will showcase cost-effective solutions for the emerging NewSpace economy. These new cables and assemblies are qualified to appropriate NASA, ESA, and Technology Readiness Levels (TRL) specifications for NewSpace applications. Gore’s reliable, low-risk solutions can also meet program schedules varying from 1 to 5 years, such as global connectivity and Earth observation.

All of Gore’s solutions are engineered with robust materials that withstand extreme temperatures, harsh chemicals, cut-through, abrasion, material creep, atomic oxygen, and more. They have been thoroughly tested and approved according to stringent industry requirements for traditional space and NewSpace applications.

Program Heritage

Gore has delivered proven and trusted solutions in hundreds of global spaceflight programs for more than 50 years. The 100-percent success rate of these products demonstrates Gore’s commitment to helping customers successfully launch space vehicles, monitor the Earth, explore planets, observe distant events and objects, and ensure astronauts' safe return.

For more information about GORE® Space Cables and Assemblies, visit Gore at the Space Tech Expo in Bremen, Germany on November 19-21 in Booth H50. Additional details can be found at www.gore.com/stexpo2019.

RECOM Power AC/DC with 1in² footprint provides 3W
Posted: 2019-11-13

With the RAC03-K, RECOM introduces the smallest 3 watt solution on the market. This versatile converter can be used in a wide range of applications due to complete certifications for ITE and household standards.

In a compact 1in² footprint, these modules deliver an output power of 3 watts from -40°C to 60°C and 2 watts up to 80°C. Despite such a high power density and small footprint, the RAC03-K series is a complete solution supporting Ecodesign Lot 6 standby mode operation for worldwide applications in automation, industry 4.0, IoT, household, and home automation. With an input voltage range from 85 to 264VAC and international safety certifications for industrial, domestic, ITE, and household applications, these are some of the most versatile power modules on the market. Due to their reinforced class II installation rating and their significantly wide margin to class B emissions compliance without external components, these are the easiest to use modular power solutions in the industry.

For more information, visit www.recom-power.com.

Get more from your application with TI's newest ultra-small and lowest IQ LDO
Posted: 2019-11-13
Industry's lowest IQ 25-nA ultra-small LDO double battery life

Looking for a way to simplify your design while making it more robust? Consider adding the ability to make a smaller solution size that increases efficiency using an ultra-low quiescent current (low IQ). TI's newest LDO comes in the smallest package (0.65mm x 0.65mm DSBGA package) but doesn't sacrifice performance for applications that require low IQ as a critical parameter. This low-dropout linear regulator has an ultra-low IQ of 25 nA and can source 200 mA with excellent transient performance to ensure quick wake up. With the TPS7A02, both of these key features can help to further increase the battery life of your application. Doesn't that sound nice?

Description
The TPS7A02 is an ultra-small, ultra-low quiescent current low-dropout linear regulator (LDO) that can source 200 mA with excellent transient performance.

The TPS7A02, with an ultra-low IQ of 25 nA, is designed specifically for applications where very-low quiescent current is a critical parameter. This device maintains low IQ consumption even in dropout mode to further increase the battery life. When in shutdown or disabled mode, the device consumes ultra-low,
3-nA IQ that helps increase the shelf life of the battery. The TPS7A02 has an output range of 0.8 V to 5.0 V available in 50-mV steps to support the lower core voltages of modern microcontrollers (MCUs).

The TPS7A02 features a smart enable circuit with an internally controlled pulldown resistor that keeps the LDO disabled even when the EN pin is left floating and helps minimize the external components used to pulldown the EN pin. This circuit also helps minimize the current drawn through the external pulldown circuit when the device is enabled.

New Design Options: GORE® High Speed Data Cables for Prototyping & Evaluation in Aircraft
Posted: 2019-11-7

W. L. Gore & Associates now offers new design options in the company’s sample inventory of GORE® High Speed Data Cables to continue to meet aerospace industry needs and new protocols. The expanded sample inventory includes eight new part numbers ranging from OM4 fiber optics 1.8 mm Simplex, CAN Bus shielded pair, Ethernet specialty quadrax, and shielded twisted pair.

Samples with Short Lead Times

Gore recently streamlined the company’s business offerings with more efficient ordering and manufacturing processes to deliver reliable solutions quickly to OEMs and users.

Complimentary samples of Gore’s pre-qualified solutions can be shipped within two business days (48 hours) from the date of the request from WireMasters in the US and Air Cost Control in Europe. Aircraft OEMs can validate and support low-rate production using Gore’s standard high data rate cables in their specific applications with lower technical and business risks to their programs.

Customers can fill out a short online form to receive their complimentary samples.

Impressive Portfolio of Solutions

Gore offers an extensive portfolio of copper and fiber optic solutions that support the latest open-source architectures and high-speed data protocols, such as IEEE 1394 FireWire, Ethernet, Fiber Channel, HDMI, USB and more.

GORE® High Speed Data Cables are available in various durable, compact, and routable designs with proven installed and lifetime performance in civil and defense aircraft.

For more information about GORE® High Speed Data Cables for civil and defense aircraft, visit www.gore.com/highdatarateaircraftcables.

Performance Solutions

Gore develops products and technologies that address complex product and process challenges in a variety of markets and industries, including aerospace, automotive, pharmaceutical, mobile electronics and more. Through close collaboration with industry leaders across the globe, Gore enables customers to design their products and processes to be safer, cleaner, more productive, reliable, durable and efficient across a wide range of demanding environments.

EPC expands AEC-Q101 family with the EPC2216, a 15 V GaN FET optimized for high resolution, time-of-flight lidar systems
Posted: 2019-10-15

EPC announces successful AEC-Q101 qualification of the 15 V EPC2216 designed for lidar systems where increased accuracy is vital such as in self-driving cars and other time-of-flight (TOF) applications including facial recognition, warehouse automation, drones and mapping.

The EPC2216, a 15 V, 26 mΩ, eGaN FET with a 28 A pulsed current rating in a tiny 1.02 mm2 footprint, is perfectly suited to use for firing the lasers in lidar systems because the FET can be triggered to create high-current with extremely short pulse widths. The short pulse width leads to higher resolution, and the tiny size and low cost, make eGaN FETs ideal for time-of-flight applications from automotive to industrial, healthcare to smart advertising, gaming and security.

AEC-Q101 GaN FETs

To complete AEC-Q101 testing, EPC’s eGaN FETs underwent rigorous environmental and bias-stress testing, including humidity testing with bias (H3TRB), high temperature reverse bias (HTRB), high temperature gate bias (HTGB), temperature cycling (TC), as well as several other tests. Of note is that EPC’s WLCS packaging passed all the same testing standards created for conventional packaged parts, demonstrating that the superior performance of chip-scale packaging does not compromise ruggedness or reliability. These eGaN devices are produced in facilities certified to the Automotive Quality Management System Standard IATF 16949.

More information on EPC's reliability testing can be found on the EPC website:
epc-co.com/Reliability

EPC’s CEO and co-founder Alex Lidow notes, “This new automotive product joins a rapidly expanding family of EPC transistors and integrated circuits designed to enable autonomous driving and improve resolution are reduce cost in all time-of-flight applications.”

TDK-Lambda's Active Technology 20A 40Vdc MIL-COTS EMC Filters Provide MIL-STD Voltage Surge and Spike Protection
Posted: 2019-10-10

TDK Corporation announces the introduction of the TDK-Lambda FQB series of EMC filters, with a rating of 40Vdc at 20A. Voltage surge and spike protection for DC-DC converters is accomplished through the use of active technology. The FQB has a rugged encapsulated quarter-brick package with a choice of flanged or non-flanged baseplates. These modules are suitable for use in a wide variety of harsh and demanding environments, including MIL-COTS vehicle and airborne applications.

The FQB series is designed with a high differential and common mode noise attenuation, simplifying system level compliance to the MIL-STD-461(F, G) standard. The modules also provide input spike and surge protection per MIL-STD-1275(D, E) and RTCA/DO-160G (Sec 16-18).  Qualifying testing is consistent with MIL-STD-883F and MIL-STD-202G.

The operating input voltage is 8.5 (start-up) to 40Vdc and the filters can withstand transients of up to -50 to +210V.  Reverse polarity and over current protection is also provided.  The filter modules have a remote on-off function and an open collector DC Good / Fault signal.  No load input current is typically 3mA but reduces to 1.5mA when the remote on/off function is initiated.

The PCB mount FQB can be cooled using either an industry standard ¼ brick heatsink, or conduction cooled via a cold plate. The non-flanged package size measures 60.6 x 39 x 12.7mm (L x W x H) and the flanged version 60.6 x 55.9 x 12.7mm.  The total DC resistance of the filter is typically 30mΩ, minimizing power losses.

The filters are available with standard production screening (-S suffix) and a baseplate temperature rating of -40°C to +115°C, or with enhanced screening (-M suffix) and an extended temperature rating of -55°C to +115°C. Enhanced screening includes functional testing at high and low temperatures and a 96 hour burn-in period with temperature cycling.

All models have been safety certified to UL 60950-1, CAN/CSA C22.2 No. 60950-1-07 and IEC 60950-1, IEC/UL/CSA 62368-1 (pending) and carry the CE mark.

More information can be obtained on the TDK-Lambda Americas website https://www.us.tdk-lambda.com/lp/products/fq-series.htm, or by calling 800-LAMBDA-4.  

TDK-Lambda's 2000W Modular Power Supplies Have Full MoPPs Isolation, Low Acoustic Noise and up to 18 Outputs
Posted: 2019-10-8

TDK Corporation announces the introduction of the TDK-Lambda brand QM8B modular power supplies rated at up to 2000W.  This further extends the QM series which can provide 550W to 2000W output power.  The QM8B models are available with up to 18 outputs, have full MoPPs (Means of Patient Protection) isolation and low acoustic noise.  With medical and industrial safety certifications, the power supplies are suitable for use in medical, test and measurement, communications and broadcast equipment. This avoids the need for multiple power supplies in systems requiring a large number of independent voltages.

Accepting a wide range 90 to 264Vac, 47-63Hz input (440Hz with reduced PFC), the QM8B can deliver 1200W at low line and 2000W with a high line 180-264Vac input.   With its modular construction, the series can be configured using a simple on-line configurator to provide 1 to 18 independently regulated outputs and include individual output good signal and remote on/off functions.  The QM series module output voltages range from 2.8V to 105.6V and have output power levels from 300W to 1200W.  A further subset of option modules provides an AC Fail signal, standby voltages (up to 12V, up to 2A), global remote on/off and PMBus™ communications.  Overall case dimensions for the QM8B are 200 x 63.3 x 268mm (W x H x D).

The QM8B will operate in ambient temperatures of -20 to +70°C (-40°C start-up), with output power and output current linearly derating above 50°C to 50% at 70°C. With efficiencies of up to 91%, less internal heat is generated allowing the use of low speed cooling fans to reduce audible noise.  A lower airflow speed also significantly reduces the ingress of dirt and other contaminants, improving product reliability.  All models in the QM series have a seven-year warranty as standard.

More information can be obtained at the following TDK-Lambda Americas website, https://www.us.tdk-lambda.com/lp/products/qm-series.htm, or by calling 800-LAMBDA-4.  

RECOM Power Low profile QFN-package Power Module
Posted: 2019-10-8
RECOM’s latest addition to its DC/DC converter portfolio is one of the smallest in its class of low profile QFN-packaged buck regulator power modules. The RPX-2.5 module is exceptional due to its flip-chip technology which increases power density and improves thermal management.

RECOM’s new power module offers a high power density footprint on a 4.5mm x 4mm x 2mm thermally-enhanced QFN package. The RPX-2.5 provides an input range from 4.5 to 28VDC, allowing 5V, 12V or 24V supply voltages to be used. The output voltage can be set with two resistors in the range from 1.2V up to 6V. The maximum output current is 2.5A, and the output is fully protected against continuous short-circuits, output overcurrent, or over-temperature faults. It has an efficiency of up to 92%, and it is thermally optimized due to its flip-chip technology. An integrated shielded inductor in this miniature package makes it optimal for space-constrained applications.

To facilitate rapid testing, RECOM also offers an evaluation board for this product so that customers will be able to quickly and easily test.

For more information, visit www.recom-power.com.

TDK-Lambda's 48V 480W DIN Rail Power Supply Features a Narrow 84mm Width and Long Field Life
Posted: 2019-10-3

TDK Corporation announces the introduction of the TDK-Lambda brand DRB480-48-1 AC-DC DIN Rail mount power supply.  With an efficiency of up to 93%, waste heat has been reduced, allowing the use of a compact enclosure size featuring a power density of 6 Watts per inch3. The power supply is suitable for a wide range of industrial applications including factory automation, process control and test and measurement, particularly where there is limited room on the DIN mounting rail.

The DRB480-48-1 has an operating input range of 90 to 264Vac and can deliver 48V at 10A. The output can be adjusted from 48 to 52.8V to offset voltage drops in cabling or where OR-ing diodes/FETs are used in a redundant configuration.  A DC Okay relay and a front panel LED provides output status.

The convection cooled unit can operate in ambient temperatures of -20 to +70oC (with a cold start at -40 oC), with linear derating above 50 oC to 62.5% load at 70oC.  The design of the product ensures that electrolytic capacitor temperature rises are minimized, providing a 7-year life when operating 24 hours a day in a 40oC ambient at 230Vac input, 75% load.

The product is housed in a robust metal case measuring just 84mm wide, 124mm deep and 125mm tall.  Input to output isolation is 3kVac, input to ground 1.5kVac and output to ground 500Vac.  The DRB480 is certified to IEC/UL/CSA/EN 60950-1, IEC/UL/CSA/EN 62368-1 (pending) and UL 508 with CE marking for the Low Voltage, EMC and RoHS Directives.  All units meet EN55011/EN55022-B, CISPR11/CISPR22-B, and EN61204-3 (Class A) conducted and radiated emissions and comply with IEC 61000-3-2 harmonics and IEC 61000-4 immunity standards.

More information can be obtained at the following TDK-Lambda Americas website, https://www.us.tdk-lambda.com/lp/products/drb-series.htm, or by calling 800-LAMBDA-4.  

RECOM Power Switching Regulator with High Input Voltage Range
Posted: 2019-10-2
RECOMs new high input voltage switching regulator R-78HE excels in versatility and quality for your industrial 48V battery powered equipment.

The R-78HE5.0-0.3 is a low-cost industrial grade switching regulator in a classic SIP3 3-pin format that will accept an input voltage up to 72VDC (100V DC surge) to supply a regulated 5V/300mA short-circuit protected output. The converter will operate over an extra-wide ambient temperature range of -40°C up to +105°C without load derating and delivers a tightly regulated (+/- 1%) output  with high efficiency and low ripple/noise. The R-78HE5.0-0.3 is also exceptionally reliable with an MTBF of 15 million hours and is manufactured in our IATF 16949 certified factory for consistently high quality control. Typical applications include industrial CAN-bus systems, 36V/48V Li-Ion battery-powered equipment, off-grid solar power supplies and remote powered units with very long supply cables. For more information, visit www.recom-power.com.

 

EPC Announces Third Edition Gallium Nitride (GaN) Textbook with Power Conversion Applications Focus
Posted: 2019-10-1

GaN theory and applications, such as lidar, DC-DC conversion, and wireless power using gallium nitride FETs and ICs, form the focus of this third edition of GaN Transistors for Efficient Power Conversion, a textbook written by power conversion industry experts and published by John Wiley and Sons. 

This textbook is designed to provide power system design engineering students, as well as practicing engineers, basic technical and application-focused information on how to design more efficient power conversion systems using gallium nitride-based transistors.

This timely third edition has been substantially expanded to keep students and practicing power conversion engineers ahead of the learning curve in GaN technology advancements and emerging applications. This book serves as a practical guide for understanding basic GaN transistor construction, characteristics, and a wide range of applications.

Included are:

  • Discussions on the fundamental physics of these power semiconductors
  • Practical guidance on layout and other circuit design considerations
  • Application examples employing GaN including lidar for autonomous vehicles, DC-DC power conversion, RF envelope tracking used in 5G communication networks, wireless power, class-D audio, and high radiation environments.
TDK Power line EMC filters
Posted: 2019-9-20
20A 40Vdc MIL-COTS EMI Filters Simplify Compliance to MIL-STD-461G, MIL-STD-1275D and RTCA/DO-160G

TDK Corporation announces the introduction of the TDK-Lambda FQA series of EMC filters, with a rating of +/-40Vdc at 20A. The FQA has a rugged encapsulated quarter-brick package with a choice of flanged or non-flanged baseplates. These modules are suitable for use in a wide variety of harsh and demanding environments, including MIL-COTS vehicle and airborne applications.

The FQA series is designed with a high differential and common mode noise attenuation.  This simplifies system level compliance to MIL-STD-461G standards. The modules also provide input spike protection to MIL-STD-1275D and RTCA/DO-160G.  Qualifying testing is consistent with MIL-STD-883F and MIL-STD-202G.

The PCB mount FQA can be cooled using either an industry standard ¼ brick heatsink, or conduction cooled via a cold plate. The non-flanged package size measures 60.6 x 39 x 12.7mm (L x W x H) and the flanged version 60.6 x 55.9 x 12.7mm.  The total DC resistance of the filter is typically 12mΩ, minimizing power losses.

The filters are available with standard production screening (-S suffix) and a baseplate temperature rating of -40°C to +115°C, or with enhanced screening (-M suffix) and an extended temperature rating of -55°C to +115°C. Enhanced screening includes functional testing at high and low temperatures and a 96 hour burn-in period with temperature cycling.

All models have been safety certified to UL 60950-1, CAN/CSA C22.2 No. 60950-1-07 and IEC 60950-1, IEC/UL/CSA 62368-1 (pending) and carry the CE mark.

More information can be obtained on the TDK-Lambda Americas website https://www.us.tdk-lambda.com/lp/products/fq-series.htm, or by calling 800-LAMBDA-4.  
 

Ground-breaking PSMA Report Addresses Reliability of Power Supply Digital Control Software/Firmware
Posted: 2019-9-19
Comprehensive study on digital implementations of power supplies addresses challenges and solutions to reliability of digital control of power supplies and recommends best practices

The Power Sources Manufacturers Association (PSMA) announces publication of its ground-breaking Power Supply Software/Firmware Reliability Improvement Report. This report, the result of a year-long project undertaken by PSMA’s  Reliability Technical Committee, addresses recommended reliability improvements for power supply digital control software and firmware. This new report attempts to present key findings related to the challenges of and solutions to reliability in the digital control of power electronics.

“This is the first report from the work of PSMA’s newest committee, which aims to spearhead industry initiatives that identify and attempt to address the pertinent industry challenges related to the reliability performance of power supplies and associated products,” noted Brian Zahnstecher, Co-Chair of the PSMA Reliability Committee. Tony O’Brien, Reliability Committee Co-Chair, added “Moving from power electronics with analog control to power electronics with digital control is a significant transition. Software engineering best practices are being adopted for digital power electronics control for power supplies to ensure that reliability does not suffer with the transition to digital control. Some of the best practices are relatively new, evolving and unfamiliar to the power electronics world”

This 166-page report, divided into nine chapters, examines a wide array of problems and challenges in the field of digitally controlled power supplies, then proceeds to present observed and proposed improvements and best practices. Brian Zahnstecher further noted, “The ongoing tasks of the PSMA Reliability Committee will include efforts to support adoption of the recommended best practices and to update and refine our findings. We welcome the involvement of knowledgeable industry experts in this important work.” 

A copy of the printed and USB memory drive versions of the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report has been sent to PSMA Regular member companies as a benefit of their membership. Additional copies may be purchased at the member price of $US290. PSMA Affiliate members may also purchase the report for $US290. The report is available to non-members for purchase on the PSMA website (www.psma.com) for the price of $US2490.

A preview of the report is available here.

Gore’s Fiber Optic 1.8 mm Simplex Cables Achieve NextGen Performance in Durable, Lightweight Package
Posted: 2019-9-12

GORE® Aerospace Fiber Optic Cables, 1.8 mm Simplex by W. L. Gore & Associates, Inc. (Gore) are proven to perform at the highest levels in the most challenging civil aviation environments. These cables reliably transfer critical data on high-speed avionics networks up to 100 Gbps and beyond, while providing significant weight and cost savings overtraditional copper cable and ruggedized fiber optic cables.With the advancements in modern digital networks andpassenger demand for faster access to in-flight entertainment(IFE), cables need to deliver higher data rates over longer distances. At the same time, they need to provide consistentsignal integrity in less space and at lower weight. “As onboard systems become more data intensive, the speed demands are simply beyond physics of copper cable,” said Jeremy Moore, Global Product Specialist with Gore. “Our Fiber Optic solution provides significant weight and cost savings over the life of an aircraft, while meeting the rigorous demands of in-flight operation.”

GORE Aerospace Fiber Optic Cables withstand the challenging environments they encounter throughout an aircraft’s service life. They deliver excellent signal integrity for high-speed data transmission in a wide range of temperatures.

ADDED DURABILITY

Built with a unique buffering system, Gore’s 1.8 mm Simplex cables resist crushing, kinking and abrasion, and they can easily handle complex routing, maintenance activities, and repeated flight conditions — unmatched by today’s ruggedized alternatives. These robust cables also have a compact, flexible footprint with installed robustness that meets size, weight and routing constraints as more high-tech avionics are being installed or retrofitted into civil aircraft.

APPLICATIONS

GORE Aerospace Fiber Optic Cables are engineered to perform reliably in a variety of civil aerospace applications, including avionics networks; cabin management systems; digital video systems; flight management systems; in-flight entertainment (IFE) systems; Ethernet backbone; transceivers; and weather radar systems.

GORE® Aerospace Fiber Optic Cables complement Gore’s wide selection of Cables and Assemblies, including Ethernet, USB, HDMI, and more. Additional details can be found at gore.com/stayconnected

 

High-Speed Image Sensor From ON Semiconductor Enables Intelligent Vision Systems for Viewing and Artificial Intelligence
Posted: 2019-9-11
Ultra-low power 0.3 mega-pixel image sensor offers superior low-light performance in a cost effective, compact, square format

ON Semiconductor, driving energy efficient innovations, has announced the introduction of the ARX3A0 digital image sensor with 0.3 Mega-Pixel (MP) resolution in a 1:1 aspect ratio. With up to 360 frames per second (fps) capture rate it can perform like a global shutter in many conditions but with the size, performance and responsivity benefits of being a Back-Side Illuminated (BSI) rolling shutter sensor. With its small size, square format and high frame rate, ARX3A0 is particularly suitable for emerging Machine Vision, Artificial Intelligence and AR/VR applications, as well as small supplemental security cameras.

Power is becoming increasingly important for many applications that provide still or streaming images. The ARX3A0 is designed to deliver flexible, high-performance image capture with minimal power; it consumes less than 19 mW when capturing images at 30 fps, and just 2.5 mW when capturing 1 fps.

The 1/10 in square format enables low height modules, while the miniature 3.5 mm die size helps maximize the sensor’s field of view. Its small size and square format mean the ARX3A0 can be used in emerging applications where orientation isn’t fixed but space is limited, such as AR/VR goggles to monitor the wearer’s eye movement. Eye movement data can be used to adjust the image viewed, which is believed to mitigate the possible effect of motion sickness as experienced by some users. Simultaneous Localization and Mapping (SLAM) is another application where ARX3A0’s small size and low power image sensors will be crucial.

The monochrome sensor is based on a 560 by 560 active-pixel array featuring ON Semiconductor’s NIR+ technology, giving it high sensitivity at near IR wavelengths to deliver superior performance in no light or when lighting is used that is non-detectable by the human eye. Advanced power management features include the ability to automatically wake from a low power mode when detecting motion or lighting changes in the scene. This allows the sensor to become the main source of wake for an entire camera system saving even more system power.

Developments in Artificial Intelligence have seen its use extend to more areas, creating demand for data that is specifically intended for machines rather than humans. The specific requirements of these systems impact image sensor technology. While most image sensors were conceived purely with visual applications in mind, the ARX3A0 is the first of new breed of digital image sensor designed for advanced and increasingly intelligent systems, as well as traditional viewing systems.

Gianluca Colli, Vice President and General Manager, Consumer Solution Division of Image Sensor Group at ON Semiconductor said: “As we approach an era where Artificial Intelligence (AI) is becoming an integral part of vision-based systems, it becomes clear that we now share this world with a new kind of intelligence. The ARX3A0 has been designed for that new breed of machine, where vision is as integral to their operation as it is ours.”

The ARX3A0 is available in both chip scale package and reconstructed wafer die. Evaluation boards running on ON Semiconductor’s industry leading PC-based DevWare system and prototype modules are also available through ON Semiconductor and authorized distributors.

For more information, visit http://www.onsemi.com.

CUI Expands Capacitive Incremental Encoder Line to Support Shaft Sizes up to 5/8 in (15.875 mm)
Posted: 2019-9-10

CUI’s Motion Group today announced the addition of a new series to its innovative AMT incremental encoder family designed to support larger motor shaft sizes from 9 mm to 15.875 mm (5/8 inch). The AMT13 series, based on CUI’s proprietary capacitive ASIC technology, brings the same high levels of durability, accuracy, and immunity to environmental particulates as current AMT encoder models. Ideally suited for a variety of robotics, industrial, and automation applications, the series offers 22 programmable resolutions from 48 to 4096 PPR, CMOS voltage or differential line driver outputs, and low current consumption of 16 mA at 5 V.

Available in radial or axial orientations, the AMT13 incremental encoder is housed in a compact 42.3 x 42.3 x 13.5 mm package and carries a wide -40 to +125°C operating temperature range. Its digital nature and compatibility with CUI’s AMT Viewpoint™ software makes the AMT13 encoder highly customizable with the ability to easily configure the resolution and set the zero position.

The AMT13-V kit affords users further flexibility in their design with the inclusion of 9 different sleeve bore options from 9 mm to 5/8 in and simple mounting tools to assist in the easy installation process onto a motor.

Ultra-Flat Aluminum Electrolytic Capacitors Save Board
Posted: 2019-9-9
A single ULP series capacitor saves space by replacing large arrays of SMT capacitors!

The new ULP Series of Ultra-Low-Profile aluminum electrolytic capacitors from Cornell Dubilier is a real “game-changer” for engineers designing compact electronic devices. Designed specifically for applications requiring bulk capacitance and the lowest board profiles, type ULP offers considerably higher energy density than arrays of surface mount capacitors. ULP technology allows the circuit designer to use a single component that saves space, weight, and cost while improving reliability.

“With energy density exceeding 0.4 J/cc, a single ULP capacitor provides much greater bulk storage in a smaller footprint than a bank of low-profile SMT capacitors.” claims Mario DiPietro, Product Manager at Cornell Dubilier.  “The technology is particularly effective at displacing parallel banks of SMT solid tantalum capacitors to achieve high capacitance on the board,” continued DiPietro. Due to its light weight, the ULP is ideal for use in portable devices and is well-suited for a wide range of applications where height profile, board space, and weight are critical design factors.  In such situations, the ULP is not only cost-competitive, but it also improves circuit reliability through use of a single component versus an entire array of SMT capacitors.  

The ULP is offered in package heights of 2.2 and 3.2mm. Capacitance values range from 500µF to 24,000µF. Working voltages range from 4 to 63 WVDC with an operating life of 3,000 hours @ 85° C. Unlike solid tantalum capacitors, type ULP capacitors do not require voltage derating.

Housed in a highly durable nickel-silver case, the ULP is rated at 10g for vibration withstand.  As thin as 2.2mm, ULP Series capacitors are easy to design-in.  With flat ribbon-lead style terminations, it is even possible to mount the device off-board. This provides added design flexibility to maximize the use of available space.
Developed by Cornell Dubilier, the ULP breaks away from the cylindrical designs usually associated with aluminum electrolytic capacitors. The ULP design is an outgrowth of the company’s more than twenty years of experience in the manufacture of aerospace-grade flat capacitors.

CDE’s ULP, Ultra-Low-Profile Aluminum Electrolytic Capacitors are available from the company’s franchised distributors.   For more information on this series visit:  http://www.cde.com/ulp

Coin Cell Style Electric Double-Layer Supercapacitors Provide Memory Backup in Circuits up to 6.3 WVDC
Posted: 2019-9-9

The new EDC and EDS series of Coin Cell style EDLC capacitors from Cornell Dubilier (CDE) can replace or extend battery life in on-board memory backup. With quick-response and recharge times, these devices offer higher power than batteries and greater energy than typical aluminum electrolytic capacitors without degradation over millions of charge-discharge cycles.

Both series offer values from 0.047 to 1.5 Farad capacity, at voltages up to 6.3 WVDC for the EDC series; and 5.5 WVDC for the EDS series. Operating temperature for the EDS series is from -25 °C to +85 °C, with the EDC series offering -25 °C to +70 °C.  Three case configurations are available for horizontal, vertical and radial-lead PCB mounting. 

EDC and EDS series capacitors are ready to board mount in such applications as real-time clock (RTC) backup, power failure backup, battery assist and in market segments such as smart metering, HVAC controls, building automation, communication systems, appliances, instruments and other microprocessor-based devices.  Because of their high volumetric power density, they can be an effective way to reduce board size and weight.  Either series can be used as a drop-in replacement for similar value capacitors recently discontinued by other manufacturers. Lead times are less than 12 weeks with popular values in stock.

For more information on this series visit: www.cde.com/edc
 

ON Semiconductor Supports Increasing Power Demands of IoT Endpoints with New Power over Ethernet (PoE) Solutions
Posted: 2019-9-4
Compliance with IEEE 802.3bt delivers 90 Watts of power to applications including smart sensors, building automation and connected lighting

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is leading the industry with its support for the IEEE 802.3bt standard, thanks to a growing portfolio of compliant products and technologies. Using the new IEEE 802.3bt standard, Power over Ethernet (PoE) can be used to deliver high-speed connectivity up to 90 W of power over Local Area Network (LAN) connections. ON Semiconductor’s solutions not only support the new standard limit of power, but extends it further to 100 W for systems including telecommunications and digital signage.

The new IEEE 802.3bt standard for PoE has the potential to transform every vertical market touched by the IoT, by enabling more sophisticated endpoints operating across larger networks. The IEEE 802.3bt standard optimizes energy management through the new “Autoclass” feature, which enables Powered Devices (PDs) to communicate their specific power needs to the Power Sourcing Equipment (PSE). This in turn allows each PSE to allocate just the right amount of power to each PD, maximizing both the available energy and bandwidth.

With up to 90 W of power available, compared to the 30 W provided by the IEEE 802.at standard (PoE+), IEEE 802.3bt can provide both power and connectivity to new applications that would otherwise require a dedicated and typically off-line power source. PoE will simplify network topologies and provide a more robust ‘plug and play’ user experience.

“Power over Ethernet is one of the fastest-growing markets for power semiconductors today, with a compound average unit growth rate of 14% expected from 2017 through 2022,” said Kevin Anderson, senior analyst, power semiconductors at business information provider IHS Markit. “The additional power-delivery capability defined in IEEE 802.3bt enables new applications, such as higher-powered connected lighting, networked high-resolution surveillance cameras and high-performance wireless access points.”

Forming the foundation of ON Semiconductor’s PoE-PD solutions, the NCP1095 and NCP1096 Interface Controllers incorporate all of the features needed to implement a PoE interface, including detection, auto-classification and current limiting. The controllers employ either an external (NCP1095) or internal (NCP1096) hot-swap FET. The integrated hot-swap FET in the NCP1096 features the lowest on-resistance available in a Type 3 or Type 4 PoE controller The controllers are complemented by the NCP1566 DC-DC Controller, the FDMC8622 Single MOSFET and the FDMQ8203 and FDMQ8205A GreenBridge™ Quad MOSFETs, which have been developed to provide a more efficient alternative to a diode bridge in PoE applications. Together, these devices enable highly efficient PoE interfaces with up to the standard limit of 90 Watts of power or to a proprietary 100 W solution if more power is needed.

“As a company focused on energy efficiency, we are really excited to help PoE achieve its full potential,” commented Ryan Cameron, Vice President of Industrial and Off-Line Power Solutions at ON Semiconductor. “By providing a complete family of IEEE 802.3bt compliant solutions, we have made the technology more accessible for all development engineers which will help enable many more connected devices with guaranteed interoperability.”

For more information, visit www.onsemi.com.

LYTSwitch-6 LED Drivers from Power Integrations Use PowiGaN Technology to Deliver Industry-Leading Power Density and Efficiency
Posted: 2019-9-3
Up to 110 W output with no heatsinks and smallest footprint to suit smart-lighting and ballast applications

Power Integrations, the leader in high-efficiency, high-reliability LED-driver ICs, today announced new high-power-density members of its LYTSwitch™-6 family of safety-isolated LED-driver ICs for smart-lighting applications. The new ICs with PowiGaN™ technology enable designs that deliver up to 110 W with 94% conversion efficiency using a simple, flexible flyback topology. 

The high efficiency of the new LYTSwitch-6 ICs eliminates the need for heatsinks – greatly reducing ballast size, weight and cooling airflow requirements. The 750 V PowiGaN primary switches provide very low RDS(ON) and reduced switching losses. This improvement, combined with existing LYTSwitch-6 features, increases power conversion efficiency by up to 3% compared to conventional solutions – reducing wasted heat by more than one-third.

LYTSwitch-6 ICs with PowiGaN technology employ lossless current sensing, which contributes to the higher efficiency.  The new family members retain existing LYTSwitch-6 benefits such as fast transient response, which facilitates excellent cross regulation for parallel LED strings without the need for additional regulator hardware, and flicker-free system operation. This allows simple implementation of a pulse-width-modulation (PWM) dimming interface.

Comments Hubie Notohamiprodjo, director of product marketing for LED lighting at Power Integrations: “The new LYTSwitch-6 ICs with PowiGaN technology enable highly efficient designs up to 110 W for smart residential and commercial fixtures and low-profile ceiling troffers. The high power density of LYTSwitch-6 designs enables reduced height and weight, which is vital for space-constrained and sealed ballast applications.”

The GaN-based LYTSwitch-6 LED-driver ICs are available now, priced at $32.2714 in 10,000 quantities. A reference design (DER-801) describing a 100 W 3-way dimming LED ballast is available for download from the Power Integrations website at https://www.power.com/lytswitch-6/.

Simplify Power Delivery (PD) in Growing USB Type-C™ Charging Market with Two USB-PD Solutions from Microchip
Posted: 2019-8-29
Expanding portfolio adds certified USB 3.1 PD SmartHub™ IC with HostFlexing and PDBalancing plus standalone USB Type-C PD controller for simpler applications

USB Type-C has become increasingly popular, and with the introduction of Power Delivery (PD), it is now possible to charge more types of devices – and charge faster – than ever before. To remove the traditional complexity and high costs associated with implementing USB Type-C, Microchip Technology Inc. (Nasdaq: MCHP) today announced two new solutions that simplify USB Type-C PD for a range of applications.

As one of the industry’s first USB-IF-certified USB 3.1 SmartHub devices with integrated support for Power Delivery (TID1212), the USB705x family enables fast device charging and introduces unique PD implementations called HostFlexing and PDBalancing. The UPD301A is a standalone USB Type-C PD controller that significantly simplifies the implementation of basic USB Type-C PD charging functionality, making it ideal for applications from rear seat charging in vehicles to portable equipment to public charging stations.

The USB705x family includes two unique features that simplify USB Type-C PD implementations – HostFlexing and PDBalancing. HostFlexing simplifies the user’s docking station experience by allowing all USB Type-C ports to function as the “notebook” port, eliminating the need for cryptic labels that try and explain overall functionality of each USB Type-C port. PDBalancing provides a methodology for manufacturers to manage overall system power through centralized control, ultimately saving money for consumers by being able to charge a number of PD enabled devices with less overall power.

To meet consumer demand for faster mobile device charging and data streaming, the USB705x family combines native support for USB Type-C PD with the 5 Gbps SuperSpeed data rates of USB 3.1. Ideal for docks, PC monitors and automotive infotainment, the family – consisting of the USB7050, USB7051, USB7052 and USB7056 – provides a range of USB configurations to meet varying PD and USB Type-C design needs. For example, the USB7050 supports three PD-enabled upstream and downstream USB Type-C ports, while the USB7056 provides only one upstream port alongside five traditional Type-A downstream ports. The new hubs also support driver assistance applications that are available on all mobile handsets, allowing the graphical user interface of a phone to be displayed on a vehicle’s screen while simultaneously charging the mobile device.

With smartphones increasingly requiring more than standard BC 1.2 power, designers of electronic systems need to be able to easily implement basic high-powered charging in systems. The UPD301A provides a simple, standalone solution for implementing USB Type-C PD charging in a variety of applications. The device supports both single- and dual-port operation and uses a pin-configurable implementation that focuses on ease of use. The UPD301 complements Microchip’s expansive family of USB hubs and enables solutions from charge-only to full data, video and power management.

“With the acceleration of USB Type-C PD in phones, PCs and portable devices, it’s critical that designers of new computing systems and automotive infotainment systems are easily able to add USB Type-C PD functionality to designs,” said Charles Forni, vice president of Microchip’s USB and Networking business unit. “From hub-based data management to standalone power delivery, Microchip continues to invest in evolving and growing our USB Type-C portfolio to support the varying needs of our broad customer base.”   

For more information, visit www.microchip.com.

New CAPZero-3 X-Capacitor Discharge ICs from Power Integrations Meet IEC60335
Posted: 2019-8-20
New device family reduces standby power for appliance applications

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced CAPZero™-3, the latest generation of the company’s elegant, energy-saving X-capacitor discharge ICs. Two-terminal CAPZero-3 ICs enable designers to easily meet IEC60335 safety approvals for major appliances, and cover all capacitor values from 100 nF to 6 µF.

IEC60335 is the discharge safety standard for all appliances. To protect the user from an electrical hazard, it requires the voltage across the input X capacitor to discharge to less than 34 V within less than one second after the AC is removed. CAPZero-3 ICs block current flow through the X-capacitor discharge resistors when the AC voltage is connected, and automatically discharge X capacitors through those resistors when the AC is disconnected. CAPZero-3 ICs simplify EMI filter designs while permitting the use of larger X capacitors, which in turn enables smaller inductive components to be used with no resulting change in power consumption.

CAPZero-3 ICs can be placed before or after a system’s input fuse. Devices deliver high common-mode surge immunity so that no external ground connection is necessary, and feature a high differential surge withstand due to 1000 V internal MOSFETs. Creepage on the package and PCB is maintained at >4 mm.

Comments Edward Ong, product manager, Power Integrations: “With the launch of the new CAPZero-3 ICs, designers can use one part to address a large range of applications in small and major appliances that require X capacitor values from 100 nF to 6 µF.”

CAPZero-3 devices are safety-certified to CB and Nemko requirements and so developers do not need to perform a separate safety test on the X-capacitor discharge circuit of the power supply. Devices are available now, priced at $0.31 in 1,000 piece quantities. Technical support is available from the Power Integrations website at: www.power.com/products/capzero-3.

Evaluate the brightest 1080p TI DLP® Pico™ chipset
Posted: 2019-8-7
Bright 1080p displays up to 1500 lumens

The DLP® LightCrafter Display 4710 EVM-G2 is an easy to use, plug-and-play evaluation platform for the 1080p Pico display chipset, which includes the DLP4710 digital micromirror device (DMD), DLPC3439 display controller and DLPA3005 PMIC/LED driver. The DLP4710 display chipset is designed to enable low power and mobile 1080p display applications, such as mobile smart TVs, high resolution digital signage, interactive displays, smart home displays, and wearables, such as head mounted displays.

Important information:

  • Allows quick assessment of the DLP4710 1080p display chipset
  • EVM compatible with production-ready optical modules
  • HDMI-input interface offers plug-and-play functionality
  • PC user interface allows quick configuration of multiple video settings of the chipset
     
Power Integrations Releases Gallium Nitride-Based InnoSwitch3 AC-DC Converter ICs
Posted: 2019-7-29
Advanced GaN technology yields significant increase in power and efficiency

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced new members of its InnoSwitch™3 families of offline CV/CC flyback switcher ICs. The new ICs feature up to 95% efficiency across the full load range and up to 100 W in enclosed adapter implementations without requiring a heatsink. This groundbreaking increase in performance is achieved using an internally developed high-voltage GaN switch technology.

Quasi-resonant InnoSwitch3-CP, InnoSwitch3-EP and InnoSwitch3-Pro ICs combine primary, secondary and feedback circuits in a single surface-mounted package. In the newly released family members, GaN switches replace the traditional silicon high-voltage transistors on the primary side of the IC, reducing conduction losses when current is flowing, and considerably reducing switching losses during operation. This results in substantially less wasted energy and therefore increased efficiency and power delivery from the space-saving InSOP-24D package.

Targeting high-efficiency flyback designs, such as USB-PD and high-current chargers/adapters for mobile devices, set-top boxes, displays, appliances, networking and gaming products, the new ICs provide accurate CV/CC/CP independent of external components, and easily interface to fast-charging protocol ICs. The InnoSwitch3-CP and  EP variants are hardware-configurable, while the InnoSwitch3-Pro incorporates a sophisticated digital interface for software control of CV and CC setpoints, exception handing and safety-mode options.

Comments Balu Balakrishnan, president and CEO of Power Integrations: “GaN is a pivotal technology offering significant efficiency and size benefits over silicon. We anticipate a rapid conversion from silicon transistors to GaN in many power applications. InnoSwitch3 has been the clear technology leader in the offline switcher IC market since we launched the silicon variants 18 months ago, and the new GaN-based ICs further extend our lead by advancing both the efficiency and power capability of our flyback products.”
 

The 2109 iNEMI Roadmap is Now Available
Posted: 2019-7-16

The 2019 iNEMI Roadmap is now available. For the 2019 cycle, roadmap chapters will be published in waves, with two to eight chapters included in each wave, released every two to three weeks. The first wave, now available online, includes four chapters:

  • Board Assembly
  • Modeling; Simulation & Design Tools
  • Smart Manufacturing
  • Sustainable Electronics

The Smart Manufacturing chapter is new for 2019. It highlights and prioritizes many of the industry-wide challenges along the electronics manufacturing supply chain in terms of materials flow and conversion, data flow architecture, digital building blocks and security. It discusses and prioritizes areas that need to be addressed to enable faster deployment of smart manufacturing, such as defining data flow and format.

25 Years of Roadmapping

This year, iNEMI marks 25 years of roadmapping the needs of the electronics manufacturing industry. The consortium published its first roadmap in 1994 and, over the years, the number of technology areas covered has grown and changed, but the focus has always remained on providing insights into the technology requirements for success throughout the supply chain.

For more information, visit www.inemi.org/inemi-2019-roadmap

CUI Next-Generation 6 W Multi-Blade Power Adapter Boasts Ultra-Compact Package
Posted: 2019-7-16

CUI’s Power Group today announced the introduction of a next-generation 6 W wall plug-in ac-dc power supply with interchangeable ac blades designed for global use. The SMI6B series features an ultra-compact package measuring 1.85 x 1.36 x 1.04 in (47 x 34.5 x 26.5 mm), while complying with the US DoE Level VI and EU CoC Tier 2 efficiency regulations as well as the new IEC 62368-1 safety standard for ICT and AV equipment.

With ac blade options for North America, Europe, the United Kingdom, Australia, and China, this multi-blade power adapter offers no-load power consumption less than 0.075 W, a universal input voltage range of 90 to 264 Vac, and single output voltages from 5 to 15 Vdc. The series further carries over current and short circuit protections as well as a wide range of safety approvals that include UL/cUL, GS, RCM, CCC, PSE, and CE.

Complying with FCC Part 15B Class B limits for EMI/EMC, the SMI6B also features a variety of standard dc output connector options, including USB Type C and Micro B. These features and approvals combine to make this high efficiency external power adapter the ideal solution for keeping consumer, industrial, and mobile electronics in compliance around the world.

Focus on AR HUD using TI DLP® Auto Products
Posted: 2019-7-10

Augmented reality head-up displays (AR HUD) are becoming more sophisticated than ever before. With drivers demanding more real-time information about the environment around them, automotive designs that don’t incorporate AR HUD are about as exciting as last year’s model.

Luckily, AR HUDs designed around TI DLP® Auto chipsets deliver larger fields of view, a larger eyebox and a longer virtual image distance, and are much better equipped to handle increased solar loads than the competing technology.

Learn more about the optical architecture required to deliver the best HUD experience for your design in TI's solar load white paper.

TDK 550 to 650W Modular Power Supplies Have Full MoPPs Isolation, Low Acoustic Noise and up to 10 Outputs
Posted: 2019-7-2

TDK Corporation announces the introduction of the TDK-Lambda brand QM4 modular power supplies rated at 550 to 650W.  This further extends the QM series which can provide up to 1500W output power.  The QM4 models are available with up to 10 outputs, have full MoPPs (Means of Patient Protection) isolation and low acoustic noise.  With medical and industrial safety certifications, the power supplies are suitable for use in medical, test and measurement, communications and broadcast equipment.

Accepting a wide range 90 to 264Vac, 47-63Hz input (440Hz with reduced PFC), the QM4 can deliver 550W at low line and 650W with a high line 180-264Vac input.   With its modular construction, the series can be configured using a simple on-line configurator to provide 1 to 10 independently regulated outputs and include individual output good signal and remote on/off functions.  The QM series module output voltages range from 2.8V to 105.6V and have output power levels from 300W to 1200W.  A further subset of option modules provides an AC Fail signal, standby voltages (up to 12V, up to 2A), global remote on/off and PMBus™ communications.  Overall case dimensions for the QM4 are 108 x 63.3 x 270mm (W x H x D).

The QM4 will operate in ambient temperatures of -20 to +70°C (-40°C start-up), with output power and output current linearly derating above 50°C to 50% at 70°C. With efficiencies of up to 91%, less internal heat is generated allowing the use of a low speed cooling fan to reduce audible noise.  A lower airflow speed also significantly reduces the ingress of dirt and other contaminants, improving product reliability.  All models in the QM series have a seven-year warranty as standard.

The power supply has 4,000Vac (2 x MoPPs) input to output, 1,500Vac (1 x MoPP) input to ground and 1,500Vac (1 x MoPP) output to ground isolation.  All models are certified to the IEC/EN/UL/CSA 60601-1, ANSI/AAMI ES 60601-1 and IEC/EN/UL/CSA 60950-1 safety standards.  The QM series is also designed to meet IEC/EN61010-1 with CE marking for the Low Voltage, EMC and RoHS Directives.  Earth leakage current is less than 300µA, and complies with the EN61000-6-3:2007 and EN60601-1-2:2015 (curve B conducted and radiated) emission standards.  The units also meet the EN60601-1-2 and EN61000-6-2 immunity standards and are designed and manufactured under the control of ISO9001 and ISO13485 (including risk management).

More information can be obtained at the following TDK-Lambda Americas website, http://www.us.tdk-lambda.com/lp/products/qm-series.htm, or by calling 800-LAMBDA-4.  Products can be configured using the “Product Quick Finder” at http://www.us.tdk-lambda.com/lp/.

Powerbox’s extra wide input quarter-brick DC/DC converters shorten time to market for very demanding applications
Posted: 2019-7-2
  • 100W market leading power density, 12:1 input, quarter brick format.
  • Two input ranges covering from 9 to 160VDC
  • EN50155 input voltage range, from 24V up to 110V (including continuous operation in the 14.4V brownout condition and 154V transients)
  • +105C maximum base plate temperature
  • Seven output voltages including 53V for PoE and 28V for defense applications
  • Meets thermal shock and vibration requirements of EN61373 and MIL-STD-810F

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the launch of three new series of extra-wide input voltage range, 40W to 100W board-mounted DC/DC converters for the railway, transportation and defense industries. With an extra wide input voltage range of 14V to 160V and 9V to 75V, the PQAE40U (40W), PQAE60U (60W) and PQAE100U (100W) have been developed to provide systems designers with a single part number that is able to power a large range of applications (e.g. railway, industrial automation and automotive, remote radio-control), thus reducing inventory, time to market and documentation.

Designed for use in harsh environments, the PQAE40/60/100U series meet thermal shock and vibration requirements as specified in EN61373 and MIL-STD-810F, and also meet the fire and smoke EN45545-2 standard. The PQAE40/60/100U series can be operated from -40 up to +105 degrees Celsius case temperature, meeting the very demanding, ruggedized requirements such as found in construction vehicles, mining equipment and heavy machinery process control.

Industrial and railway power designers often face very demanding challenges to optimize board power solutions when designing standardized equipment for worldwide operation on a very large variety of system bus voltages. In the railway industry, designers are permanently seeking the best power architecture to operate within the overall EN50155 input voltage range, from 24V up to 110V, including continuous operation in the 14.4V brownout condition and 154V transients.

To guarantee board power designers the highest level of flexibility, the PQAE40/60/100U series has been developed to deliver full and stable power within an extended input voltage range from 14V up to 160V. For lower bus voltages, the 9V to 75V versions cover the main battery voltages, sustaining peak voltage and continuous operation up to 75V. The PQAE40/60/100U series is available in seven output voltages of 5, 12, 15, 24, 28, 48 and 53V, and exhibit an efficiency figure of up to 90%, which considering the extra-wide 12:1 input range, is an outstanding efficiency figure. All models within the PQAE40/60/100U series feature full protection level sets including over voltage, short-circuit, over load protection, and thermal shutdown. All units operate at a fixed switching frequency and including PI type input filters. The operating temperature range is from -40 to +105 degrees C baseplate, and storage is from -55 to +125 degrees C.

Designed for ruggedized environments, the PQAE40/60/100U series meet thermal shock and vibration requirements as specified in EN61373 and MIL-STD-810F. All products comply with IEC/UL/EN-60950, EN62368-1 and the railway standards EN50155 and EN45545-2. The PQAE40/60/100U series are available in an industry standard quarter-brick (36.8 x 57.9 x 12.7mm – 1.45 x 2.28 x 0.50 inches). All units are housed in a plastic case with an aluminum baseplate and are potted with a UL94-V0 silicon compound. Four optional heatsinks with different height and airflow orientations are available on request. The 9 to 75VDC modules feature an input to output basic insulation of 2,250VDC and the 14 to 160VDC modules a reinforced insulation of 3,000VAC.

PQAE40/60/100U series converters are RoHS compliant.

For more information visit www.prbx.com

Micrometals Introduces New Optilloytm Alloy Powder Materials Specifically Formulated to Optimize Inductor Performance Parameters for Demanding Power Applications
Posted: 2019-5-21

Micrometals, a leader in high performance core solutions for power applications, is proud to introduce its new offering of Optilloy Alloy Powder materials.  The offering includes three new formulations, OD, OC and OE, which are specifically formulated to deliver optimal core performance for demanding applications. All Optilloy materials are unique formulations of iron, silicon, aluminum and nickel and are available in toroid shapes with permeabilities from 14µ to 125µ.

The original Optilloy material, OP, was formulated to provide low core losses and high saturation.

The new OD material, Optimized DC Bias, is optimized to provide superior DC Bias while maintaining low losses and be very cost competitive.  OD material is ideal for applications that require high saturation magnetization that may have traditionally used high flux materials like FluxSan or Hi-Flux. Optimized DC Bias cores are available in toroids from 3.5mm to 196mm with permeabilities from 14µ to 90µ.

The new OC material, Optimized Core Loss, is optimized for provide very low losses while maintaining good DC bias at an economical price. OC material is economical alternative for applications that may have traditionally used Sendust or MPP type materials. Optimized Core Loss cores are available in toroids from 3.5mm to 196mm with permeabilities from 14µ to 125µ.

OE, Optimized Economy, has been specifically formulated to provide an economical alternative to applications that require moderate, but consistent magnetic performance.  Optimized Economy cores are available in toroids from 3.5mm to 196mm with permeabilities from 14µ to 90µ.

Jim Cox, Micrometals President commented “For decades, our customers have trusted Micrometals cores to deliver exceptional reliability, consistency and performance.  With these new Optilloy materials we will continue to deliver that same reliability and consistency, but with performance targeted at one or more magnetic attributes that are the most important for their application, and a very competitive price.”

The Optilloy materials have been incorporated into the Micrometals Online Inductor Design Tool, for facilitating material selection and design optimization - www.micrometalsapc.com/design-software  

More information on Micrometals new Optilloy Alloy Powder products can be found at www.micrometalsapc.com.

PSMA Power Technology Roadmap Provides Critical Insights into Technology and Research Advancing Power Conversion Developments
Posted: 2019-4-16
2019 edition of bi-annual publication provides multidimensional perspectives on power technology growth and trends; latest edition adds new section surveying global academic research activities

The Power Sources Manufacturers Association (PSMA) announces the 2019 edition of the Power Technology Roadmap. The report, which forecasts the power technology and power delivery trends through 2023, includes a printed report along with a feature-rich USB memory drive containing a record number of seventeen recorded webinars with up-to-date explanations of the information contained in the final report. The webinars add much to the presentation materials because the listener can hear and understand the context and the subtext of the original presentation in the speaker's voice. The recordings also capture the interesting and informative question and answer periods.

In this edition a new section on University Research in Power Electronics has been added. University research provides a window into what products and technologies are in store for Power Electronics. Leading power electronics research universities were asked about their research areas and priorities and their responses were analyzed to extract most common research areas, least common/missing research areas and unique research areas.

The overall structure of this year’s PTR largely follows the format of and keeps the improvements made in the 2017 report. It offers a consolidated view of the latest trends in the power management, power control, and power delivery technologies by integrating the most recent inputs from webinars, surveys, analyses and discussions. The report is divided into five sections:

  • Application Trends
  • Component Technologies
  • University Research
  • Webinar Presentations
  • Power Supply and Converter Trends

“As power technology continues to emerge from the shadows to play a more central role in the next phase of electronics industry revolution, the PTR report provides many relevant pointers to the current and future industry stakeholders,” said Conor Quinn, Co-Chair of the Power Technology Roadmap committee.

Dhaval Dalal, Co-Chair of the committee, said, “In many emerging fields, such as electric vehicles, alternative energy converters and energy harvesting devices, power technology assumes a more central and driving role and the PTR captures how the industry is shaping up to play this role.”

PSMA Regular Member companies have each been sent one copy of the printed report and USB memory drive versions of the 2019 edition as a benefit of their membership. Members can access the webinars on line at no cost and purchase additional copies of the full report for $290. The non-member price is $4,490. For information about purchasing the report, please to the PSMA website at: www.psma.com/publications.

PSMA Publishes Technology Report: 3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies
Posted: 2018-9-6
Comprehensive report is the first to address higher power embeddable passives that will accelerate the development of higher density power sources using new, 3D disruptive packaging technologies

The Power Sources Manufacturers Association (PSMA) Packaging Committee announces the publication of its latest report titled, “3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies.” This is the third in a series of reports focused on using embedded substrate technology for building power sources. It is the first extensive study of embeddable passive components both available and in development for use in the power path of power sources. The report contains extensive research and product illustrations geared to an audience of technology executives and design engineers.

Miniaturization of passive components without compromising their power handling and efficiency and their integration with actives has always been a key focus for power packaging. There is also an increasing trend to vertical or 3D package integration to address the performance issues by eliminating parasitics from interconnections. Embedding gives lowest package inductance and enables co-integration of power systems and drivers in a single package with direct interconnection between gate driver circuits and switches with shortest interconnection length. This has become even more important with the rapid emergence of wide bandgap power switching devices. This, however, leads to several process integration and reliability challenges that need to be systematically addressed.

Georgia Tech Packaging Research Center, under contract from PSMA systematically surveyed the recent advances in passives, active embedding and 3D passive-active integration to generate this report, with emphasis on 3D power packaging enabled by advances in passive components and embedding of actives in power packages. A detailed literature study was conducted on key advances in embedded passive technologies and related topics. Emerging nanomaterials, processes and technologies are described in detail for inductors, capacitors and resistors. Nanostructured materials provide additional degrees of freedoms in enhancing the properties to improve the performance metrics such as volumetric density and efficiency of the components. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted in advancing the components to improve performance. Industry leaders were surveyed to get the recent technology advances in each category. Roadmaps are projected for passive component advances and active embedding technologies.

The trends and roadmaps in 3D power packaging are also described in three categories: low power (1-100 W), medium power (100-1000 W) and high power (10-100 kW). Integration in each category is classified into lead-frame-based, substrate-embedding based and traditional ceramic substrates. Active embedding with panel-scale substrate manufacturing is also reviewed in detail. Recent innovations in substrate materials and associated reliability challenges such as via cracking, dielectric cracking or electric breakdown are highlighted. Advances in die-attach solutions with sintered nanocopper are reviewed, highlighting the evolution of low-stress sintered copper-based die-attach solutions.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded passives in 3D power packaging to create the significantly higher power densities.

The PSMA report on 3D packaging was provided free of charge to PSMA Regular and Associate Company members.  Additional copies may be purchased at the member price of $290. PSMA Affiliate members may also purchase the report for $290. The report is available to non-members for purchase on the PSMA website (www.psma.com/publications) for the price of $3,490.

Provided by the PSMA Packaging Committee.

Brian Narveson
Co-chairman
  Brian Narveson   Ernie Parker  
Ernie Parker 
Co-chairman

 

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