New product announcements


Powerbox’s S-CAP BOOST technology delivers peak power and safety to industrial and medical applications
Posted: 2018-6-26

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the introduction of its supercapacitor boost technology, S-CAP BOOST, offering backup and peak power solutions to industrial and medical applications. Based on the latest supercapacitor technology combined with intelligent control and monitoring, S-CAP BOOST offers a solution to equipment manufacturers requiring high energy peaks for short periods or emergency backup purposes in applications where due to safety regulations, Lithium Ion or acid batteries are not allowed. Depending on the application, S-CAP BOOST can be configured to charge and monitor supercapacitor banks to work as UPS, delivering backup power to allow safety operations to take place before shutdown or delivering high peak power for a short period without disturbing the main source or discharging/damaging the system battery in applications such as laser, electric motor booster or X-ray emission element.

Critical applications operating in hostile or confined environments are strictly regulated in terms of chemical and other hazardous risks, reducing or forbidding certain type of batteries such as Lithium Ion. For safety reasons, those applications must have a power backup long enough to run alarms and safety shutdown processes. In such arduous conditions, conventional batteries are replaced by supercapacitor banks whose values could be from few Farads to 200 Farads for general applications, but up to container size in the case of large systems. S-CAP BOOST technology tightly controls vital parameters, from a single 2.8V cell supercapacitor to a wide range of assemblies delivering a specific voltage and energy required for a given application.

One example of a product built using Powerbox’s S-CAP BOOST technology is a 2500W backup unit developed for an industrial process-control computer installed in a very restricted area. Housed in a 19 inch 2U chassis, the 29F-54V-60A integrates 22 supercapacitors totaling 29 Farads and has a capacity of 2500W during 5 seconds at full load and 30 seconds at half-load. To optimize the cells charge, the 29F-54V-60A integrates a DC/DC converter with current control, guaranteeing the supercapacitors are properly charged to deliver full power when required. The unit includes active charging cells control with load balancing, cell health monitoring and alarms. Alarms signals including Vcell-high, Vcell-low, Vcell-zero and temperature are available via a physical interface, with digital control and monitoring being an alternative option.

“The number of applications requiring emergency backup or high peak current are growing, and integrating supercapacitors within power supplies is becoming an extremely reliable and well suited option to be considered by system architects.” said Patrick Le Fèvre, Powerbox’s Chief Marketing and Communication Officer. “Powerbox’s S-CAP BOOST is a great platform for the future and we foresee an impressive number of applications for supercapacitor energy storage technology, and not only for electrical vehicles.”

Compared to Lithium Ion which has a cyclability (number of recharges) of 500 to 1,000, supercapacitors can sustain from 500,000 to 20,000,000 cycles, making that technology extremely relevant for applications requiring large amounts of charge /discharge cycles with high energy such as industrial or medical lasers. This is what S-CAP BOOST technology has been developed for, very tight control of the supercapacitors’ charge in order to optimize the energy stored between each cycle, with very high levels of safety and reliability.

For more information visit www.prbx.com

 

Powerbox announces four new series of extra-wide input DC/DC converters for railway and transportation industry
Posted: 2018-6-7

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the launch of four new series of extra-wide input voltage range, 8W to 20W board-mounted DC/DC converters for railway and transportation industry. With a 13:1 input voltage range of 12V to 160V, the MAD33 (8W), MAD32 (10W), MAE35 (15W) and MAF35 (20W) have been developed to provide systems designers with a single part number that is able to power a large range of transportation industry applications (e.g. railway, industrial automation and automotive, remote radio-control), reducing inventory, time to market and documentation.

The MAD-MAE-MAF series are designed to meet railway specifications EN50155, EN50121-3-2, EN61373 and EN45545, but as well ISO7637-2 for 24V vehicles, and EN12895 for industrial trucks and other industrial applications such as robotics. The 8W MAD33 is packaged in an industry standard DIP24 case, and the MAD32, MAE35 and MAF35 are housed in a 2x1 inch case. All four series have a typical efficiency rating of 86%, which considering the extra-wide up to 13:1 input range is an outstanding figure.

With the development of connected devices and Internet of Things (IoT), the number of points-of-interaction and sensors are rapidly increasing. Systems designers are facing challenging situations by having to develop products able to operate in many different applications powered by a large range of voltages – versatility is the name of the game. As an example, the railway standard EN50155 specifies no less than six different bus voltages (24V, 37.5V, 48V, 72V, 96V and 110V) including brownout (voltage drops) and transient surges during start-up. Considering many equipment could be connected to any of those six voltages, system designers have to be able to guarantee that their equipment will operate from 14.4V to 154V, include brownout (voltage drop down to 14.4V) and a one second transient of 154V as specified in EN50155. With an operating input voltage range from 12V to 160V and a power rating range from 8W to 20W, the new MAD-MAE-MAF series converters from Powerbox are the Swiss army knife power solution, simplifying design while shortening time-to-market and reducing documentation and inventory.

“Time to market is very important for systems designers as is simplicity of the sourcing / supply chains in order to reduce downtime in the case of trains maintenance or hardware upgrades. Both are driving forces behind extra-wide input range converters and we see similar demands from other industries such industrial automotive,” said Martin Fredmark, Powerbox’s VP Portfolio Management. “Designing 13:1 input range DC/DC converters is very challenging in order to optimize all parameters while keeping the highest possible efficiency levels across the whole input voltage range, and we are proud that our designers achieved this in the new MAD-MAE-MAF series.”

The new series of converters are suitable for low power loads and devices in railway applications such as communication devices, GSM-R phones and their docking stations, routers/Wi-Fi access points, small screens, USB charging sockets (both in-seat and driver’s cabin), sensors, and standby power for larger devices.

Available in four output voltages of 5, 12, 24 and 48V in natural convection conditions, the MAD33 delivers 8W and the MAD32 10W. The MAD33 is available in a Dual In Line Packaging (31.8 x 20.3 x 12.7 mm – 1.25 x 0.8 x 0.5 inches) and the MAD32 in an industry standard 2x1 inch packaging (50.8 x 25.4 x 10.2 mm – 2.00 x 1.00 x 0.40 inches). The 15W MAE35 and 20W MAF35 are available in three output voltages of 12, 24 and 48V and are similarly provided in 2x1 packages. All series deliver full output power in ambient temperatures up to 60 degrees C and continue to deliver power with a linear derating up to the 100 degrees C case. The MAD32, MAD33, MAE35 and MAF35 are housed in plastic cases.

Designed for ruggedized environments, the MAD-MAE-MAF series meet thermal shock and vibration requirements as specified in EN61373 and MIL-STD-810F, and they all meet the Fire and Smoke EN45545-2 standard.
All models within the MAD-MAE-MAF series feature full protection level sets including input voltage lockout, short-circuit protection and current limiting. All units operate at a fixed switching frequency and including PI type input filters. The operating temperature range is from -40 to +85 degrees C ambient (maximum 105 degrees C case) and storage is from -55 to +125 degrees C.

The new series of converters from Powerbox meet the requirements of UL60950-1, EN60950-1 and IEC60950-1 standards, and CE mark 2014/30/EU. All products have an input to output isolation voltage of 3,000 VAC. The MAD-MAE-MAF series are RoHS compliant.

The MAD33 (8W), MAD32 (10W), MAE35 (15W) and MAF35 (20W) are complementing the PQB50U-72S (50W) and PFB600W-110S (600W), offering a complete range of power modules solutions, from 8W up to 600W, to railway applications and demanding industries.

For more information, visit www.prbx.com

Powerbox’s Medical Power Supply Delivers Power and Safety to Healthcare Facilities at Altitude
Posted: 2017-12-17

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the launch of a new series of power supplies for medical applications requiring BF (Body Floating) class insulation and full, reliable operation up to 5,000 meters altitude to power medical healthcare facilities and equipment. Complying with the latest EMI coexistence standard IEC 60601-1-2: 2014 (4th edition) and specifically designed with patient and operator safety in mind, the OBR04 series delivers an output power of 650W. The OBR04 is available in 12 different voltages from 12V to 58V with an efficiency rating up to 91%. With a strong focus on ‘no interference and radio coexistence’, the product meets conducted and radiated EN55011 class B without requiring any additional components. Built to ensure patient and operator safety, the OBR04 has an input-to-output isolation of 4,000 VAC (2xMOPP), an input to ground of 1,500 VAC (1xMOPP) and a 1,500 VAC output-to-ground, when many conventional products offer only 500 VDC isolation. In order to guarantee full operation up to an altitude of 5,000 meters, the OBR04 has been designed in respect of required creepage distances and additional isolation barriers.

Many countries such as China or those in South America are bringing healthcare to mountainous region based populations, and it is very common in those countries for healthcare centers and hospitals to be located at altitudes higher than 3,000 meters. Medical equipment must be designed to guarantee the highest level of safety up to 5,000 meters. The base design altitude for power supplies is 2,000 meters but as the altitude increases, the insulating qualities of the thin air diminish and the clearance distances have to be increased from 8 mm at 2,000 meters, up to 11.84 mm at 5,000 meters, thus requiring power supplies to be designed in accordance with the needs of such physical requirements and in some cases to comply with local approvals such as the CCC (China Compulsory Certification). The Chinese Safety Standard GB 4943.1-2011 mandates strict rules for clearance distances and since December 1, 2012 - the primary-to-secondary clearance has increased by a factor of 1.48 to qualify the power supply for operation up to 5,000 meters.

Designed with high altitude applications in mind, Powerbox’s PRBX OBR04 withstands an isolation voltage of 4,000 VAC (2MOPP) from the input to the output, 1,500 VAC (1MOPP) from the input to ground and 1,500 VAC from the output to ground, when most products currently available are offering only 500 VAC. The OBR04 leakage current is 300 µA maximum, and the touch current is 100 µA maximum at 264 VAC and 63 Hz.

Powerbox’s OBR04 is available as standard in twelve output voltages; 12, 15, 18, 24, 28, 30, 32, 34, 36, 48, 57 and 58 VDC, covering a large range of applications from 12 VDC intermediate bus voltages through to point-of-loads up to 58 VDC to power the latest generation of power amplifiers. Depending on the output voltage the maximum output power starts at 600 W and rises to 650 W with a peak power level of up to 720 W. An auxiliary 12 V output is provided for an additional fan, as well as a standby 5 VDC supply at 200 mA.

“Designed for medical and high altitude applications, the OBR04 is also suitable for other types of applications such as radio-transmitters and also observatory stations equipment installed at the top of mountains and requiring similar performance levels in term of clearance distances” said Martin Fredmark, Powerbox’s VP Product Management. “Also, we see a growing demand for industrial applications requiring higher isolation voltages and for equipment that is designed equally as good as those for altitude applications in order to make their final equipment none sea-level depending.”

The output voltage of the OBR04 is protected against overvoltage exceeding 115-140% of the nominal output voltage and is over-current protected. The power supply also includes thermal shutdown and a TTL interface that provides a power fail detect signal.

The OBR04 input voltage spans from 90 VAC to 264 VAC and includes an active PFC, typically 0.98. Exhibiting versatility, the power supply is designed for global operation with an input frequency range of 47 to 63 Hz. The input current at 115 VAC and 60 Hz is 8.4 A (RMS), and 4.2 A (RMS) at 230 VAC 50 Hz. The power supply can be safely operated within a temperature range of -10 to +70 degrees C and stored at -40 up to +85 degrees C.

Housed in an aluminum chassis, the OBR04’s dimensions are 165.8 x 101.6 x 62.5 mm (6.53 x 4.0 x 1.95 inches) and it is available in a ‘U’ shape chassis or an enclosed box with built-in fan. Based on a calculated MTBF per MIL-HDBK-217F, at full load and at 25 degrees C, the OBR04 has an impressive MTBF of 190,000 hours.

Targeting demanding application and low EMI, the OBR04 series meets EN55011, FCC and VCCI Class B conducted and emitted standards. It also complies with safety standards TÜV EN60601-1, UL ES 60601-1, CSA C22.2 No.60601-1 and is RoHS compliant.

For more information, visit www.prbx.com.

Flex Power Modules Launches New 1000-Watt High-End DC/DC Advanced Bus Converter
Posted: 2017-12-5
  • Based upon company’s leading-edge Hybrid Regulated Ratio (HRR) topology, new DC/DC advanced bus converter module delivers high-efficiency power across wide input voltage range
  • Offering efficiency of up to 97% and excellent thermal performance, the BMR480 significantly reduces energy and cooling costs
  • Delivering up to 1000W and 96.2A peak power for high-end and high-power applications, the modules come pre-programmed at 10.4V, 12V and 12.5V with factory configuration available at any voltage between 9V-13.2V
  • Targeting intermediate bus conversion and dynamic bus voltage applications, new converter is ideal for deployment in range of Information and Communication Technologies (ICT) markets

Flex Power Modules today announced the launch of the BMR480, a new DC/DC advanced bus converter that targets high-end and high-power applications and can handle 1000W of power and 96.2A of peak current. Flex Power Modules is part of the Power Division of Flex (NASDAQ: FLEX), the Sketch-to-Scale™ solutions provider that designs and builds Intelligent Products for a Connected World™.

The BMR480 module employs Flex’s leading edge Hybrid Regulated Ratio (HRR) technology, which enables better utilization of the powertrain to deliver high-power conversion across its wide input voltage range. In addition, delivering exemplary performance for applications that operate in high ambient temperatures with limited airflow, the module offers power conversion of up to 97% efficiency – at 53V and half load – while also keeping power losses low.

As well as being ideal for intermediate bus conversion (IBC), dynamic bus voltage (DBV) and distributed power architectures (DPA), the new BMR480 power module has been designed to power high-end and high-power applications powered by multi-cell batteries or rectifiers that are commonly used in ICT (Information and Communication Technologies) applications. Other important market sectors include networking and telecommunications equipment, industrial equipment, and server and storage applications.

Delivering higher useable power in high ambient temperature and limited-airflow environments means the BMR480 can offer high reliability. Although the module comes with a standard baseplate, it can also be connected to a heatsink or coldplate for the most extremely challenging thermal environments.

Key features for power designers and power system architects include dynamic load compensation and support for the latest version (v1.3) of the PMBus communication specification and the Ericsson Power Designer software tool. Other product features of the BMR480 include droop load sharing capability, 1500V input/output isolation, monotonic start-up, remote control, and a range of protection capabilities including over-temperature, output-short-circuit and output-over-voltage.

“The new BMR480 meets the demands of customers that are developing solutions based on industry leading power system designs and architectures,” said Olle Hellgren is Head of Business and Product Management at Flex Power Modules. “Able to handle very high power envelopes and peak currents up to 96A, this new advanced bus converter delivers on many different levels, in terms of high power, high efficiency and excellent thermal performance.”

For more information, visit flex.com.
 

TRANSPHORM SECURES INVESTMENT FROM YASKAWA ELECTRIC
Posted: 2017-11-30

Transphorm Inc., the leader in the design and manufacturing of highest reliability (JEDEC and AEC-Q101 qualified) 650V gallium nitride (GaN) semiconductors, announced it received a $15 million investment from Yaskawa Electric Corporation. This news comes only a few weeks after Yaskawa revealed its integrated Σ-7 F servo motor relies on Transphorm’s high-voltage (HV) GaN to deliver unprecedented performance and power density. Transphorm intends to allocate the funds to various areas of its GaN product development.

“We've seen the benefits of working with gallium nitride from the R&D phases through to the application development phases of our products, such as photovoltaic converters and the integrated Σ-7 F servo motor,” said Yukio Tsutsui, General Manager of Corporate R&D Center from Yaskawa. “We look ahead to further developments from Transphorm and its cutting-edge technology.”

The integrated  Σ-7 F products resulting from the companies’ co-development serves one of the core target markets that can benefit most from HV GaN: servo motors. The technology is also an optimal solution for automotive systems, data center and industrial power supplies, renewable energy and other broad industrial applications.

“Transphorm has consistently prioritized the quality and reliability of our GaN platform,” said Dr. Umesh Mishra, Chairman, CTO and co-founder of Transphorm. “That focus leads to strong customer relationships with visionaries such as Yaskawa and companies that not only innovate, but also influence market growth by demonstrating GaN’s real-world impact. Receiving Yaskawa’s recent support illustrates the rising confidence in GaN while underscoring its reliability.” 
 

New Bluetooth® Low Energy and Energy Harvesting Sensor Shields Further Extend the Capabilities of ON Semiconductor’s IoT Development Kit
Posted: 2017-11-29
Ultra-low power connectivity and battery-free sensing solutions enable development of novel IoT use cases

ON Semiconductor, driving energy efficient innovations, has released two new boards (shields) further extending the recently launched Internet of Things (IoT) Development Kit (IDK) platform’s capabilities. With the addition of two new shields that include Bluetooth low energy technology and Smart Passive Sensors (SPS), customers are now able to create diverse and unique use cases that target smart home/building, smart city, industrial automation and mHealth applications.

The Bluetooth low energy shield features the recently launched RSL10 multi-protocol Bluetooth 5 certified radio System-on-Chip (SoC). With the industry’s lowest deep sleep current and receive power, the RSL10 enables manufacturers to create IoT devices with extended battery life. The small form factor of the RSL10 delivers the ultra-compact, cost effective end designs demanded by low power IoT sensor networks. By integrating the Bluetooth low energy shield with the IDK, customers get a complementary choice of connectivity for extending reach, and sensing and actuator options, including lighting and motors.

The SPS shield extends the IDK to capture data from ON Semiconductor’s battery-free wireless sensors that measure temperature, moisture and pressure. The sensors are ideal for industrial and other applications with hard to access areas where zero maintenance is a necessity, and battery replacement is a challenge. Pairing the SPS shield with the IDK enables rapid prototyping of IoT applications that require battery-free sensing and wide area or local connectivity and actuation options.

Both new shields expand the configurable, modular options for sensing, actuation and wired/wireless connectivity of the IDK, thereby giving application designers complete flexibility agnostic of the communication protocol chosen. They offer rapid and easy start-up of projects right out of the box, allowing developers to deliver data directly into the cloud, thereby enabling value-added services, including analytics.

IDK shields are supplied with full documentation including complete design schematics, PCB layouts and Gerber files to facilitate rapid transition of designs from concept, through development and into production. The industry standard interfaces ensure that current and future modules from ON Semiconductor and other vendors can be seamlessly integrated into designs while the simple ‘cut-and-paste’ approach to end product design reduces R&D time, expense and risk.

“The new shields take the IDK to a whole new tier and enable a unique class of IoT applications,” said Wiren Perera, who heads IoT at ON Semiconductor. “Energy harvesting, battery-free sensing enables a new paradigm for IoT use cases in quality control and predictive maintenance through asset health monitoring to agriculture. The ubiquity of Bluetooth technology creates a new realm of possibilities for low power connectivity. Coupling these with an already extensive portfolio of complementary, energy efficient connectivity and actuation choices and the node to cloud capabilities of the IDK creates a powerful tool for rapidly delivering IoT solutions and services to the market.”

For more information, visit www.onsemi.com.

Compact Open Frame Ac-Dc Power Supplies Carry IEC 60601-1 4th Edition Approvals for Medical Applications
Posted: 2017-11-28

CUI’s Power Group today announced the introduction of five new open frame series, ranging from 180 W up to 550 W, to its line of internal ac-dc medical power supplies. Certified to the medical 60601 1 edition 3.1 safety standards for 2 x MOPP applications and 4th edition EMC requirements, the VMS 180, VMS 225, VMS 275, VMS 350, and VMS 550 series feature high efficiency up to 94% and high power densities up to 30 W/in3. The new models are housed in 2 x 4 inch (50 x 101 mm) and 3 x 5 inch (76 x 127 mm) packages with profiles measuring as low as 0.75 inches (19 mm), providing a compact, high density solution for medical diagnostic equipment, medical monitoring devices, and dental applications.

All of the new VMS series provide output voltage options from 12 to 58 Vdc, feature wide universal input voltage ranges from 80 to 264 Vac, and offer no-load power consumption as low as 0.5 W. The 180 W to 550 W models also carry an input to output isolation of 4200 Vac with leakage current ratings as low as 0.3 mA at 230 Vac. Operating temperatures range at full load from -40 up to +50°C with forced air cooling, derating to 50% load at +70°C. Additional features include protections for over voltage, over current, and short circuit, power factor correction, and a 12 Vdc/500 mA fan output.
 

CUI Ultra-Compact 3 W Wall Plug Adapters Meet DoE Level VI and CoC Tier 2 Efficiency Standards
Posted: 2017-11-15

CUI’s Power Group today introduced four new series of 3 W wall plug power adapters to its portfolio of DoE Level VI and CoC Tier 2 compliant external power supplies. The SWI3 N and SWI3 N USB series, available with North American input blades, and the SWI3 E and SWI3 E USB series, featuring European input blades, are all certified to meet the current average efficiency and no-load power requirements enforced by the US Department of Energy’s (DoE) Level VI standards. The new series are also designed to meet the European Union’s proposed CoC Tier 2 directive, under review to become law in 2018, which looks to further tighten the efficiency requirements enforced by Level VI while adding a new power consumption limit at 10% load levels.

Housed in an ultra-compact case measuring as small as 2.54 x 1.42 x 0.89 inches (64.6 x 36 x 22.5 mm), these external ac-dc power supplies offer 5 Vdc single regulated outputs, a wide universal input voltage range from 90 to 264 Vac, and no-load power consumption less than 0.075 W. Thanks to their ultra-compact design and class II construction, the new models are ideally suited for a wide range of consumer applications, including media players, e-readers, GPS, and other mobile devices.

The SWI3-N and SWI3-E series feature a range of standard dc output connector options, including micro USB type B, while the SWI3 N USB and SWI3 E USB series incorporate an integrated USB connector. Models with fixed input blades for North American and Japanese applications carry UL/cUL and PSE safety approvals with European fixed blade models carrying CE and GS safety approvals. All of the wall plug adapters offer over current, over voltage, and short circuit protections and comply with FCC Part 15 Class B limits for EMI/EMC.

Groundbreaking Image Sensor from ON Semiconductor Enables Next-Generation ADAS Solution
Posted: 2017-11-10
State-of-the-art functionality improves camera performance and increases traffic safety

ON Semiconductor Corporation, driving energy efficient innovations, today announced that Bosch has selected ON Semiconductor, the world leader in automotive image sensors, as the image sensor supplier for a future camera technology for advanced driver assistance systems (ADAS). Engineered to meet OEM requirements for future ADAS cameras, the new image sensor delivers high dynamic range (HDR) with state-of-the-art functional safety features.

As drivers become more distracted with gadgets, new technology can make critical differences in safety, differences that will also assist drivers in identifying pedestrians and cyclists in challenging low light conditions. Safety standards such as EuroNCAP have led global requirements for mitigating the severity of rear-end collisions with expanding coverage for vulnerable road users in challenging low light conditions. The new image sensor technology from ON Semiconductor enables safety systems to perform in the most challenging light conditions.

"We are committed to bringing best-in-class imaging technology into production ADAS systems," says Ross Jatou, vice president and general manager of the Automotive Solutions Division at ON Semiconductor. “Bosch and ON Semiconductor have a proven history of developing new technology to improve safety where it counts the most – on the road, in cars people drive every day.”

For more information, visit www.onsemi.com.

Powerbox Announces Advanced Marine Power Supply and Platform for Immersed Computers
Posted: 2017-11-7

Powerbox, one of Europe’s largest power supply companies and a leading force for four decades in optimizing power solutions for demanding applications, has announced the launch of its second generation of power supplies dedicated for Marine applications and demanding industrial systems. Responding to a demand from Marine equipment manufacturers to simplify logistics and to reduce energy consumption, the PT578 integrates programed digital protection, built-in redundancy and paralleling circuitry. Based on latest technologies, the 500W PT578 has a typical efficiency of 94% and can be operated between -25 to +70°C. It includes an active PFC, three output protection modes firmware reconfigurable, is designed for convection cooling and is protected against humidity and corrosion with conformal coating and can withstand high shock and vibration levels. The technology developed for the PT578 is suitable for immersed computing systems requiring the power unit to operate safely within neutral fluid containers and part of PRBX Custom Power library.

“Introduced in 2005, the concept of immersed data-centers emerged and since then a number of experiments became market reality. This technology requires specific caution when selecting switching power components and building practice very similar to that required by the Marine Industry. Immersed data centers are becoming widespread and a number of industrial embedded applications have adopted immersed computers requiring compliant power supplies” said Martin Fredmark, Powerbox’s VP Product Management.“ The technology platform developed for the Marine PT578 employs the same components and design rules as immersed power supplies. Our Custom Power Solution group has now qualified these supplies as part of the PRBX Technology platform, shortening time to market for immersed embedded industrial computer and similar applications.”

The requirements imposed on products responsible for shipping and offshore installations are greater than the average for industrial and office environments, requiring power designers to follow strict design rules and to select components and technology complying with international standards. The limits regarding mechanical and climatic requirements are also more demanding than for typical industrial applications. Vibration levels up to 4g are common, as well as large temperature fluctuations from -25°C and + 70°C and high relative humidity where condensation cannot be excluded. The new product, PT578 integrates the latest power technologies specific to the Marine Industry offering a unique combination of electrical and mechanical performance.

To guarantee the highest level of safety, marine power architectures and immersed computing designs often require redundant power sources. To ensure this, several power supplies are usually connected in parallel, linked to each other through external ORing diodes modules. To simplify installation and utilization, the PT578 has built-in circuitry making it possible for the user to select if the power unit will be used in “Single Mode” or “Parallel mode with droop current sharing.” This also reduces the number of products to keep in inventory as well the space used in the power rack.

Depending on the application, the output protection may need a different type of configuration (Switch off, Hiccup mode or Constant current), which is one of the features included in the PT578. Based on firmware defined profiles and the output protection the mode of operation can be selected via a DIP switch with factory default settings though, in case of specific demand, it is possible to reconfigure any of the profiles at one of our PRBX Configuration centers. The unit also includes a DC OK signal and a potential free relay contact for fault protection. A front LED indicates power unit status (OK or Fault).

When Constant Current mode selected, the PT578 behaves as a current generator and is suitable for high capacitive loads, driving DC motors, and as well an ideal solution to charge a second level battery backup for critical equipment such as navigation systems.

PT578 will operate with wide AC input voltages of 90 to 265 VAC and with a DC Bus voltage of 125 to 375 VDC. The input AC frequency is of 47-63Hz, and for naval airborne 440Hz with reduced PFC. Covering a large range of Marine applications, from sea to air, the PT578 is specified to operate up to 10.000 feet and up to 30.000 feet in non-operating.

For more information visit www.prbx.com.

CUI Inc 2” x 4” Open Frame Ac-Dc Power Supplies Offer High Densities up to 30 W/in3
Posted: 2017-11-2

CUI’s Power Group today announced the continued expansion of its portfolio of high density open frame ac-dc power supplies with the introduction of two new series. The VOF 180 and VOF 225A series, outputting 180 W and 225 W of continuous power respectively, feature high efficiencies up to 94% and high power densities up to 30 W/in3. Housed in compact, low profile packages measuring as small as 2 x 4 x 0.75 in (50 x 101 x 19 mm), these ac-dc power supplies provide space and energy saving benefits for IT equipment, industrial, and consumer electronics applications.

The 180 W and 225 W models deliver no-load power consumption less than 0.5 W and are certified to the UL and EN 60950-1 safety standards, while further meeting EN 55032 B limits for conducted and radiated emissions. Both open frame series feature wide universal input voltage ranges of 80 to 264 Vac and offer single output voltages from 12 to 58 Vdc. All models carry operating temperature ranges at full load from -40 up to +50°C with forced air cooling, derating to 50% load at +70°C.

Additional features include a 12 Vdc/500 mA fan output, power factor correction, and over voltage, over current, and short circuit protections. Calculated per Telcordia SR-332 Issue 3, the two new VOF series also boast an MTBF of 3.37 million hours.

Cornell Dubilier Very Low-Profile Aluminum Electrolytic Capacitor Breaks Energy Density Barriers
Posted: 2017-11-2
THA and THAS Series Thinpack capacitors offer the highest-energy density available in low-profile aluminum electrolytic technology

Cornell Dubilier Electronics, Inc. (CDE) has announced a significant new development in aluminum electrolytic technology.  Its 85 ºC THA Series Thinpack capacitors are only 8.2mm thick, and 9mm for the 105 ºC THAS Series.  This is comparable in height to V-chip electrolytics, tantalums and board-mounted axials, yet offer much higher bulk-storage energy density.  A single THA/THAS capacitor can replace an array of SMT, axial or radial aluminum electrolytic or solid tantalum capacitance arrays.  That substitution can allow engineers to design smaller products with simplified assembly and higher reliability.

The THA/THAS Series design is radically new, yet based on CDE’s 20+ years of experience with MIL-grade flat electrolytics.   Reengineered to be thinner and more cost effective, it is a good fit for many of today’s high-performance electronics.  Unlike traditional cylindrical electrolytics, a THA/THAS capacitor has a sealed, laser welded aluminum case that eliminates the need for space wasting end seal gaskets. The design includes a valve to vent hydrogen gas, reducing swelling by relieving internal pressure.  

In most applications, there are significant cost, weight and space savings vs. a comparably rated bank of SMT or axial aluminum electrolytic capacitors.  This includes requiring about 70% less board space than alternatives, resulting in a reduction of overall size and weight of the finished board.  The use of a single component versus many and fewer connections improves overall circuit reliability. The THA is rated at 3,000 hr. life @ 85 ºC; and the THAS is rated at 3,000 hr. life @ 105 ºC.  Values from 140 µF @ 450 Vdc to 18,000 µF @ 10 Vdc, with 72 capacitance/voltage combinations are available for each series. 

Potential applications include any circuits that require high capacitance bulk storage and filtering in a low-height profile.  This includes: tablets, laptops, instrumentation, commercial-grade LED driver modules, compact power supplies, drones and RPVs, set-top boxes, 1U rack-mounted devices and other thin, high-performance devices.

For more information on this series visit: www.cde.com/THA/THA.htm

ON Semiconductor Introduces World’s First Highly Scalable Family of Next-Generation Automotive Image Sensors
Posted: 2017-10-26
Hayabusa™ platform delivers simultaneous120 dB ultra-high dynamic range (UHDR) with LED flicker mitigation (LFM) imaging in a range of sizes from 1 MP to 5 MP

ON Semiconductor, driving energy efficient innovations and the market leader in automotive imaging, today announced a CMOS image sensor platform that brings new levels of performance and image quality to automotive applications such as ADAS, mirror replacement, rear and surround view systems and autonomous driving. The Hayabusa™ platform features a ground-breaking 3.0-micron backside illuminated pixel design that delivers a charge capacity of 100,000 electrons, the highest in the industry, with other key automotive features such as simultaneous on-chip high dynamic range (HDR) with LED flicker mitigation (LFM), plus real-time functional safety and automotive grade qualification.

“The Hayabusa family enables automakers to meet the evolving standards for ADAS such as European NCAP 2020, and offer next-generation features such as electronic mirrors and high-resolution surround view systems with anti-flicker technology. The scalable approach of the sensors from ½” to ¼” optical sizes reduces customer development time and effort for multiple car platforms, giving them a time-to-market advantage.” said Ross Jatou, VP and GM of the Automotive Solutions Division at ON Semiconductor. “ON Semiconductor has been shipping image sensors with this pixel architecture in high-end digital cameras for cinematography and television. We are now putting this proven architecture into new sensors developed from the ground up for automotive standards.”

The high charge capacity of this pixel design enables every device in the Hayabusa family to deliver Super-Exposure capability, which results in 120-decibel (dB) HDR images with LFM for high image fidelity in the most challenging scenes without sacrificing low-light sensitivity. The simultaneous HDR and LFM capability is especially important in enhancing safety as it ensures that all objects and potential hazards can be identified in both very dark and very bright areas of the scene. With the widespread use of LEDs for front and rear lighting as well as traffic signs, the LFM capability of the platform makes certain that pulsed light sources do not appear to flicker, which can lead to driver distraction or, in the case of front facing ADAS, the misinterpretation of a scene by machine vision algorithms.

The Hayabusa product family also features real-time, ISO26262-compliant functional safety capabilities to alert the system processor if the sensor has any issues or potential errors. These features enable system designs rated up to ASIL-C. The real-time capability enables errors to be identified immediately rather than waiting for the full image to be transferred to the processor and then waiting for image analysis. This faster response time means the system processor can take immediate action to remedy the issue, which is crucial when considering that a vehicle moving on a freeway easily covers 100 feet in less than one second.

For more information, visit www.onsemi.com.

ON Semiconductor Introduces Preconfigured Development Suite Providing Easier Way to Build Hearing Aids
Posted: 2017-10-23
New development toolkit includes wireless-enabled firmware with adaptive audio algorithms, development software and cross-platform software development kit (SDK) for industry-leading Ezairo® DSP platform

ON Semiconductor, driving energy efficient innovations, continues to grow its broad portfolio of ultra-low-power solutions for the hearing health industry by unveiling the Ezairo Preconfigured Suite (Pre Suite), a development toolkit enabling turnkey solutions based on the company’s Ezairo 7100 Digital Signal Processor (DSP).

The wireless-enabled Ezairo 7150 SL is the first hybrid module to be supported by the Ezairo Pre Suite, with a firmware bundle that makes it easier to build wireless-enabled hearing aids. It features Wide Dynamic Range Compression (WDRC), adaptive noise reduction, support for directional microphones, acoustic feedback cancellation, and environmental classification. Paving the way for easier development of mid-range hearing aids or upcoming Over-the-Counter (OTC) devices, the firmware bundle also provides support for advanced wireless features, opening the door for wireless fitting and advanced user control.

To help manufacturers tailor the Ezairo-based firmware bundles to their specific needs, ON Semiconductor provides a Windows®-based software package which acts as a complete end-to-end user interface for developing next-generation hearing aids. The sophisticated software package includes features such as transducer modeling and calibration, parameter control, and live diagnostic tools that help fine-tune performance and optimize audio quality. Also included is a cross-platform Software Development Kit (SDK) which not only supports Windows, but mobile platforms as well including both iOS® and Android®, with wired or wireless communications over Bluetooth® low energy (BLE) technology possible.

“The Ezairo Pre Suite represents a serious leap forward in supporting hearing aid development. It provides manufacturers with a complete easy-to-use, turnkey solution with all components needed to create a hearing aid or OTC device,” said Michel De Mey, Senior Director of Hearing Health Solutions at ON Semiconductor. “The mobile SDK is a compelling addition to the software, enabling the creation of new and exciting ways for users to interact with their hearing devices from their smartphones.”

For more information, visit www.onsemi.com.

CUI Inc: High Density Ac-Dc Power Supplies Housed in Low Profile, Open Frame Packages
Posted: 2017-10-17

CUI’s Power Group today announced the addition of 275 W, 350 W, and 550 W models to its VOF family of open frame ac-dc power supplies. The VOF 275, VOF 350, and VOF 550 series are housed in compact, low profile packages measuring as small as 3 x 5 x 0.75 in (76 x 127 x 19 mm) with high power densities up to 24.4 W/in3. Coupled with high efficiencies up to 94% and no-load power draw as low as 0.5 W, these open frame ac-dc power supplies are ideally suited for IT equipment, industrial, and telecom applications where space and energy consumption are of major concern.

The three new VOF series offer output voltage options from 12 to 58 Vdc and feature wide universal input voltage ranges up to 80 to 264 Vac. Certified to the UL and EN 60950-1 safety standards, the power supplies further meet EN 55032 B requirements for conducted and radiated emissions. All models also provide power factor correction, a 12 Vdc/500 mA fan output, and protections for over voltage, over current, and short circuit.

Operating temperatures range at full load from -40 up to +50°C with forced air cooling, derating to 50% load at +70°C. The high density ac-dc power supplies also carry an MTBF of 3.37 million hours, calculated per Telcordia SR-332 Issue 3.

Imaging SOCs from ON Semiconductor Enable Big Vision with Smaller Automotive Cameras
Posted: 2017-10-10
Smaller camera designs help automakers add cameras without affecting styling and reduce system cost

ON Semiconductor, driving energy efficient innovations, continues to make major advances within the rapidly growing automotive imaging sector with the announcement of two new highly integrated 1.0 Megapixel (Mp) CMOS image sensing products. The new parts provide a complete solution with the image sensor and processing functionality integrated within a low power system-on-chip (SoC) that simplifies and speeds adoption in applications such as rear and surround view cameras. PCB real estate savings of greater than 30% can be achieved compared to conventional solutions comprised of discrete sensor and processor components. This helps designers to implement camera solutions without impacting vehicle styling or aesthetics.

The number of cameras and other image sensing technologies utilized on passenger vehicles continues to increase rapidly. Industry analyst predictions suggest annual shipments of cameras for use in cars will easily surpass 80 million units by 2020. Sensors that support the progression towards full autonomous driving represent one area of application, whilst imaging devices such as the AS0140 and AS0142 can be used to improve driver comfort, convenience and safety through a growing range of Advanced Driver Assistance Systems (ADAS). Integrated sensors can provide vehicle designers with easy-to-implement solutions that support comprehensive and clear views of the vehicle surroundings for drivers.

The AS0140 and AS0142 are both 1/4-inch format devices capable of supporting 45 fps throughput at full resolution or 60 fps at 720p. Key features include distortion correction, multi-color overlays and both analog (NTSC) and digital (Ethernet) interfaces. Both SoC devices achieve enhanced image quality by making use of the adaptive local tone mapping (ALTM) in order to eliminate artifacts that impinge on the acquisition process. Dynamic range of 93 decibels (dB) allows new devices to operate effectively in both high and low light applications. The AS0140 and AS0142 provide multi-camera synchronization support which increases their value to automotive design engineers as the number of cameras installed on vehicles continues to rise.

“These devices provide engineers with complete SoC camera solutions, that combine low power operation and high dynamic range with minimal impact in relation to PCB footprint and overall bill-of-materials cost,” states Ross Jatou, Vice President and General Manager of the Automotive Imaging Solutions Division at ON Semiconductor. “This means that they are able to meet the imaging demands of car manufacturers from both a logistical and performance perspective. Most current solutions still rely on inefficient discrete arrangements with a separate image sensor and image processor, or are SoCs with relatively limited functionality.”

For more information, visit www.onsemi.com.

CUI Inc - Dc Axial Fans Deliver Improved Life and Performance with Advanced Bearing System
Posted: 2017-10-4

CUI’s Thermal Management Group today announced the introduction of its CFM-V line of dc axial fans that boasts superior performance and reliability compared to conventional sleeve bearing fans, thanks to its innovative omniCOOL™ system. This advanced bearing design bridges the cost-performance gap between traditional sleeve and ball bearing fan technologies. Incorporating a magnetic structure that enables rotor-balancing to minimize tilt, wobble, and friction, the omniCOOL system allows for fan operation at any angle. It also reduces the need for lubricant, further decreasing fan noise and friction. In addition, the bearing system extends operational life by utilizing a specially hardened material that provides additional heat resistance and offers protection against any abrasion that may occur.

The CFM-V series with frame sizes from 40 to 120 mm delivers airflows ranging from 5.4 to 10.8 CFM in the 40 mm series up to 138 CFM in the 120 mm series. Available with rated voltages of 5, 12, 24, and 48 Vdc, all axial fans come as standard with auto restart protection and feature options for tachometer signal and rotation detector depending on the model. Static pressure values range from 0.04 up to 0.41 inch H2O with low rated currents from 26 to 958 mA.

All models in the CFM-V series also carry UL/cUL 507 and TUV EN 60950-1 safety approvals while complying with EN 61000-6-1:2007 limits for EMI/EMC.

With typical MTBF ratings of 70,000 hours @ 40°C and multiple speed options ranging from 1700 to 8500 RPM, CUI’s line of dc axial fans with the omniCOOL system provide the ideal mix of economy and performance for a variety of cooling needs, including telecommunications equipment, medical devices, and industrial applications.
 

Powerbox’s Battery Backup Unit System Reduces Railway Modernization Times
Posted: 2017-9-29

Powerbox, one of Europe’s largest power supply companies and a leading force for four decades in optimizing power solutions for demanding applications, has announced the launch of its second generation Battery Backup Unit System (BBU-S) to support the modernization of railway networks and industrial applications that require flexible power backup systems with extended monitoring and control. Responding to the needs of a large range of applications and designed for use in enclosed outdoor environments, Powerbox’s BBU-S comprises an industry standard 19-inch rack unit with sub-modules. System-wise, the BBU-S includes an active power factor corrected input, micro controlled smart charging, automatic battery test, output distribution and several control and monitoring signals. Developed for fast deployment in heterogeneous railway and industrial applications, the versatile BBU-S is available with AC or DC input voltage and can charge and control multiple battery pack configurations. The BBU-S starts at 340W and is available up to 1200W. For remote monitoring and control, the BBU-S offers multiple options such as LAN interface, a radio communications module (GSM, 3G, LTE) and can be reconfigured to match specific demands as needed for different applications.

Combining a high efficiency switching topology with advanced control and monitoring, the new generation of PRBX BBU-S is the ideal solution to power railway trackside applications such as signaling, offering a significant cost and energy saving compared to conventional technology. The BBU-S includes a range of products that can be quickly modified to meet specific demands such as adaptive voltage and power to suit the length of the track, and to the number of systems installed in the signaling network.

The BBU-S power supplies are enclosed in metal cases with individual components being protected by conformal coating and delivering a regulated voltage to the signaling equipment. The BBU-S also incorporates a power supply backup system with monitoring and control, ensuring that batteries are always operational. To guarantee an ‘always-on’ condition, the BBU-S includes dual redundancy battery strings.

Railway and demanding industrial applications have mandatory requirements that any parts installed in a critical system must have the provision to be quickly and easily repaired or replaced. Based on a range of plug-and-play modules, the PRBX BBU-S can be installed, maintained, repaired and eventually decommissioned with the minimum possible downtime of service, often just minutes.

“Railway modernization programs are now integrating digital control and additional safety functionalities that require a new generation of equipment for signaling, one that includes monitoring and independent battery backup. Most, if not all modernization programs will require it necessary to maintain and upgrade existing systems without any traffic disruption. This demands a high degree of flexibility in the power solution deployed at the trackside.” said Patrick Le Fèvre, Powerbox’s Chief Marketing and Communication Officer.“ To achieve this goal, we developed the modular concept BBU-S, making it easy to adjust and adapt to different configurations. Existing power modules and monitoring units can be substituted by fitting the new generation ones into the existing chassis, and in the cases of expansion or high level upgrades that require a very short time to achieve operational status, the new modular racks can be customized to specific configurations to power new signaling equipment such as optical fiber transmission.”

For more information, visit www.prbx.com.

 

ON Semiconductor Introduces World's Most Compact Sigfox Verified Solution With its First RF System-in-Package for Low Power IoT Designs
Posted: 2017-9-26
Sigfox RC1 verified SiP provides turnkey RF solution with module-like functionality in an IC form factor for device-to-cloud communications

ON Semiconductor, driving energy efficient innovations, has announced a new programmable RF transceiver System in Package (SiP) integrating an advanced RF System-on-Chip (SoC) with all surrounding Bill of Material (including a TCXO). The AX-SIP-SFEU provides the most integrated Sigfox solution for both uplink (transmit) and downlink (receive) communications. The device is the first in a new family of SiPs that will be launched over the coming months, providing a comprehensive range of ready-to-use, turnkey radio frequency (RF) solutions to support applications requiring Internet of Things (IoT) connectivity.

With the challenging space constraints of many IoT applications – where, for example, connectivity is needed close to the sensor - ON Semiconductor’s 7 mm x 9 mm x 1 mm SiP transceiver has almost one-third the footprint and is one-tenth the overall size of a module-based solution; this gives engineers much greater design freedom. Building on the success of the AX-SFEU SoC family and thanks to the integration of all necessary functionality, the AX-SIP-SFEU positions ON Semiconductor with a market leading one-chip solution for Sigfox applications. Delivered with conformal shielding and pre-certified radio regulatory approvals, the ‘out of the box’ solution helps to simplify design, speed time to market, and reduce overall development cost by allowing customers to focus on their application and antenna design.

Due to the need for long-life from a battery powered solution, a further concern for design engineers working on wireless communications applications is power consumption. Sigfox’s predictable and claimed lowest energy consumption ‘device-to-cloud’, is complemented by ON Semiconductor’s own ultra-low power design to give the new SiP standby, sleep and deep sleep mode currents of just 0.5 milliamps (mA), 1.3 microamps (µA) and 100 nanoamps (nA) respectively.

The AX-SIP-SFEU connects to the customer product via a simple universal asynchronous receiver transmitter (UART) interface. AT commands are used to send frames and configure radio parameters, with an Application Programming Interface (API) variant available for customers wishing to write their own software. The new device is part of an ON Semiconductor ecosystem which also comprises a development kit and an integrated IDE for software developers.

“ON Semiconductor’s new SiP transceivers, of which the AX-SIP-SFEU is the first, provides all of the advantages, integration and convenience associated with a module, but with the form factor of an IC,” said Thomas Wolff, Vice President of Wireless & Connectivity Solutions at ON Semiconductor. “Sigfox certification and compliancy with local regulation means that engineers, working on exciting and innovative IoT solutions across many market sectors, can focus on other aspects of the design knowing that the connectivity and communications element is already taken care of.”

“Sigfox is delighted to have partners like ON Semiconductor that provide our ecosystems with innovative products and leading technologies,” said Tony Francesca, VP of Global Ecosystem Partners at Sigfox. “The new SiP from ON Semiconductor is opening a new generation of devices, demonstrating with its high level of integration that the IoT market is developing now and gaining in maturity.”

For more information, visit www.onsemi.com.

 

Powerbox releases full range of high input voltage DC/DC converters for microgrids and datacenters
Posted: 2017-9-4

Powerbox, one of Europe’s largest power supply companies and a leading force for four decades in optimizing power solutions for demanding applications, has announced a new range of high-voltage input DC/DC converters for microgrid, datacenters and industrial applications. Part of its industrial line, the new series of HVDC/DC converters operate with an input voltage range of 180VDC to 425VDC, and deliver output power levels from 150W to 750W. The range of applications powered by high-voltage DC supplies is rapidly expending, and from the latest microgrids and datacenters using high voltage DC (HVDC) bus voltages to reduce power losses through to industrial systems, all of these applications require ready to use, board-mounted power converters. Powerbox’s PQB-PHB-PFB300S series is specially designed for such applications. They are built around a high efficiency topology, have a layout optimized for thermal conduction, an input/output isolation of 3,000VAC minimum and deliver output voltages from 3.3VDC to 48VDC.

Energy network managers and systems architects developing electronic equipment connected to microgrids are concerned about energy efficiency and utilizing direct conversion from the 350VDC bus for specific applications. In many cases the voltage conversion is achieved using single stage, modular HVDC/DC converters stepping down the bus voltage to the load. The same is now happening in the latest generation of datacenters, increasing energy utilization by the reduction of power losses by migrating from AC distribution to HVDC. High voltage DC distribution is also very common in industrial electrical vehicles such as are used in the mining and tunnel industries. These require fully encapsulated power modules able to operate within a wide temperature range, and down to -40 degrees C. Such applications are what the PRBX PQB-PHB-PFB300S HVDC/DC converters series is designed for.

In order to provide a solution for any application powered from a high-voltage bus, the PRBX PQB-PHB-PFB300S series includes four power levels (150, 300, 600 and 750W) in three industry-standard packaging formats and footprints; quarter, half and full-brick.

Designed for use in industrial environments, the PQB-PHB-PFB300S series can be operated within a wide temperature range of -40 to +100 degrees C and in 95% of non-condensing relative humidity. The modules’ thermal shutdown is set to protect the units when the housing reaches 105 degrees C.

All products in the PRBX PQB-PHB-PFB300S series include under-voltage, over-voltage protection and lockout, continuous short circuit protection, current limiting and over-temperature protection. Both positive and negative remote ON/OFF types are available. The output voltage can be adjusted via the trim pin and all products feature voltage sensing and compensation pins.
The products are encapsulated in a plastic case with an aluminum baseplate to facilitate cooling and power dissipation. All units operate at a fixed switching frequency and including input filters (Pi or C types).

As required for HVDC bus voltage applications, all products have an input to output isolation of 3,000VAC minimum. The input to case isolation is 2,500VAC and output to case is 500VAC. The isolation resistance is 107 (10 to the power of 7) ohms minimum. The PRBX PQB-PHB-PFB300S series meet the requirements of UL60950-1, EN60950-1 and IEC60950-1 standards and CE mark 2014/30/EU.

For more information, visit www.prbx.com.

Power Monitoring and Switching System Unlocks Unutilized Power in Data Centers
Posted: 2017-8-5

CUI Inc announced the production release of its second solution for unlocking power capacity in data center and networking infrastructure. The ICE Switch, manufactured by CUI, is a power monitoring and switching system that connects to Virtual Power Systems’ (VPS) ICE (Intelligent Control of Energy) Software to provide dynamic redundancy inside a data center. Consisting of two identical modules with up to 50 A of current per module, the ICE Switch features hot-swap functionality and a configurable single-phase or three-phase input. The system, housed in a standard 19” 1U package, also carries UL/cUL and TUV 60950-1 safety certifications.

In a traditional data center, power is typically provisioned to be 2N redundant, meaning that 50% of the power infrastructure is untapped to provide redundancy in the event of a failure. The ICE Switch unlocks additional power by allowing data centers to utilize that stranded power for 1N non-critical servers. Should a failure event occur, the ICE Switch shifts critical 2N applications to the redundant power, while provisioning any remaining power capacity to non-critical 1N applications based on priority levels set in VPS’ ICE Software. The ICE Software uses a combination of fine-grained telemetry and machine learning predictions to distribute redundant power for optimal use and high availability. This functionality will allow data center operators to safely and reliably add servers without having to further invest in costly power infrastructure to support those additional applications.

“The ICE Switch is the next step in unlocking underutilized power capacity in data centers,” stated Matt McKenzie, President of CUI. “In addition to the peak shaving capabilities of the ICE Block hardware, the ICE Switch is a continuation of our efforts with Virtual Power Systems to set new standards for efficient power infrastructure.”

Shankar Ramamurthy, CEO of Virtual Power Systems, added, “CUI has been a tremendous partner for VPS in bringing the idea of Software Defined Power to market. The successful pilot tests of the ICE Block and now the release of the ICE Switch have proven them to be the ideal hardware partner for our innovative ICE Software solution.”

For more information on the ICE Switch and Software Defined Power, please visit: https://www.cui.com/sdp-infrastructure-solutions

 

CUI New Medical Wall Plug Power Adapters Comply with IEC 60601-1 4th Edition Standards
Posted: 2017-7-26

CUI’s Power Group announced the addition of a new line of wall plug-in power adapters to its portfolio of external medical power supplies. The SWM6, SWM6 USB, SWM12, and SWM30 series, available with either North American or European input blades, are all certified to the medical 60601-1 edition 3.1 safety standards for 2 x MOPP applications and 4th edition EMC requirements. Featuring high efficiency, class II construction, and no-load power consumption as low as 0.075 W, these ac-dc power supplies are a continuation of CUI’s initiative to provide customers with the most efficient global power solutions for medical, dental, and home healthcare equipment.

The compact 6 W, 12 W, and 30 W wall plug adapters all feature a wide universal input voltage range of 90 to 264 Vac and input-to-output isolation of 4,000 Vac, with output voltage options from 5 to 48 Vdc, depending upon the series. The SWM6, SWM6 USB, and SWM12 series offer horizontal and vertical blade orientations, while the SWM6 USB series also incorporates an integrated USB connector. Protections for over voltage, over current, and short circuit are included for all models as well as a range of dc output connector options.

Models with input blades for North American applications carry medical UL/cUL 60601-1 safety certifications and meet FCC Part 15B Class B limits for EMI/EMC, while models with European input blades carry medical TUV EN 60601-1 safety approvals and bear the CE mark.

For more information on the IEC 60601-1 medical design standards, click here

PSMA Power Technology Roadmap 2017 Report Is Now Available
Posted: 2017-7-21
The 2017 edition includes 551 page report plus USB drive with recorded webinars covering individual sections

The Power Sources Manufacturers Association (PSMA) announces that The Power Technology Roadmap 2017 is now available for purchase by both PSMA members and non-members. This is the tenth edition in the roadmap series, which is published every two years. A preview of the report, including the Table of Contents and Foreword, is available on the homepage of the PSMA website, www.psma.com.

The 2017 report forecasts the power technology and power delivery trends through 2021 and includes a USB memory drive version containing the complete report and the graphics and the presentation in color as well as the recorded webinars which provided up-to-date industry information used in the final report. The webinar recordings add much to the report because the listener can understand the context and the subtext of the materials in the presenter's own voice.

In this edition, a new section on Component Technologies has been added. It is widely recognized that the power technology growth is strongly impacted by the growth (or lack thereof) of underlying component technologies. In prior roadmaps, the component angle was covered through the webinar presentations, but it is hoped that the addition of this new section will provide further insights and value to the readers.

The 2017 report continues with essay contributions by the industry experts on Applications Trends and Emerging Technologies. The Application Trends section covers diverse segments such as automotive, consumer, computing, lighting, motor control, medical, and portable charging. This year, an energy harvesting segment makes a debut to keep up with the changing trends in power electronics.  The Emerging Technologies section includes 3D packaging, additive manufacturing, high-frequency magnetics, integrated magnetics and use of nanofluids in electronic cooling. There is much valuable information in these essays. 

"The end result of the webinars, surveys, presentations and discussions is a comprehensive report by the PSMA that offers a consolidated view of the latest trends in the power management, power control and power delivery technologies," said Dhaval Dalal, Co-Chair of the organizing committee. "This latest edition of the PTR provides the most extensive, forward-looking view of our industry. It is an invaluable resource for any organization involved in the power electronics technology marketplace."

"Power electronics technology has emerged, or should we say re-emerged, as an enabling technology in its own right. Part of our industry is now shaping the technology for a large part of the electronics industry." said Conor Quinn, Co-Chair of the organizing committee. "The breadth and depth of the information in this report is unprecedented and together captures the technical trends and issues facing the power sources industry. We hope industry professionals will find our 2017 report useful, thought provoking and valuable."

A copy of the printed and USB memory drive versions of 2017 PSMA Power Technology Roadmap has been sent to PSMA Regular and Associate member companies as a benefit of their membership. Additional copies may be purchased at the member price of $190. PSMA Affiliate members may also purchase the report for $190. The report will be available to non-members June 15 for purchase on the PSMA website (www.psma.com) at the price of $2,990.

Vicor: New MIL-COTS DC-DC Converters
Posted: 2017-7-12

Vicor's new MIL-COTS parts help simplify designs and optimize SWaP-C attributes.The DCM is an isolated, regulated DC-DC converter, operating from an unregulated, wide range input to generate an isolated output.

Features:

  • Up to 93% efficient
  • External companion filter meets MIL-STD-461 and MIL-STD-704/1275
  • Thermally adept VIA package:Chassis mount or PCB mount options

Benefits:

  • Quickly develop power dense, low profile, high performance products
  • Comprehensive range of EMI and transient spec compliance
  • Easier thermal and mechanical design 

For more information, visit www.vicorpower.com.
 

CUI Next Generation Dc Switching Regulators Maximize Economy and Performance
Posted: 2017-7-11

CUI’s Power Group announced the addition of four new series to its family of non-isolated dc switching regulators. The next generation VX78 500, VXO78 500, VX78 1000, and VXO78 1000 series are extremely efficient, typically up to 96%, and balance maximizing economy while delivering a high level of performance as a direct alternative to using linear regulators. Utilizing switching technology, the models are footprint compatible with TO-220 package LM78XX and LM79XX model regulators and unlike linear regulators, do not require a heat sink. This makes them ideal for use in portable devices, battery-fed equipment, and embedded designs where board space is at a premium and energy efficiency is a concern.

For more information, visit www.cui.com.

 

CUI 3 W Isolated Dc-Dc Converter Series Delivers 4:1 Input Range in Compact, SMT Package
Posted: 2017-6-27

CUI’s Power Group today announced the addition of a new 3 W isolated dc-dc converter series to its portfolio of low power dc-dc converters. The PQME3 series housed in a compact, industry standard 14 pin surface mount package measuring 0.76 x 0.71 x 0.40 in (19.20 x 18.10 x 10.16 mm), provides a rugged, low power solution for a variety of industrial, test and measurement, and telecommunication applications, thanks to its encapsulated design.

Ideal for converting and isolating fluctuating dc voltages, the 3 W series features 4:1 input ratio ranges of 9 to 36 Vdc and 18 to 75 Vdc, single regulated outputs of 3.3, 5, 9, 12, 15, and 24 Vdc, remote on/off control, and 1500 Vdc input to output isolation. For devices where energy consumption is a concern, the PQME3 series offers efficiency up to 84% and no-load power draw less than 0.1 W. Operating temperatures range from -40 up to +71°C at full load, derating to 60% load at +85°C, making the low power modules suitable for harsh environments.

For more information, visit www.cui.com.
 

Now available: TI CMOS mmWave Sensors
Posted: 2017-6-20
High accuracy range, velocity and angle detection

TI’s IWR sensors enable highly precise results for a wide range of applications like traffic monitoring, drones, and level sensing. Operating in a frequency range between 76-81 GHz enables mmWave technology to detect 2-3 times higher measurements than solutions on the market today, regardless of environmental conditions. The IWR mmWave sensors integrate a DSP and MCU with an Analog Front End into a single chip with a package roughly 25% the size of a stamp- now save up to 50% on both board space and power consumption. Enabled by TI’s mmWave Software Development Kit (SDK), developers can get started in less than 30 minutes! 

Featured specs

  • Frequency Range - 76  81GHz
  • Minimum Range - less than 5 cm
  • Maximum range - 250 meters
  • Angle accuracy - 1°
  • Max relative velocity - 300 km/hr
  • Power output - 12dBm

 

Ericsson’s award-winning advanced bus converter upgraded to include burst-mode capability for peak power demand
Posted: 2017-6-20
  • Third-generation BMR458 quarter-brick advanced bus converter upgraded to deliver burst-mode capability and handle 1079W of power for one second
  • New capability negates need for second converter module in parallel
  • BMR458 handle delivers up to 650W for range of Information and Communication Technologies (ICT) applications
  • Designed to meet the demands of high-end and high power applications based on intermediate bus conversion (IBC) and dynamic bus voltage (DBV) architectures

Ericsson Power Modules today announced that its award-winning BMR458 third-generation 3E* quarter-brick advanced bus converter has been upgraded to integrate burst-mode operation, which enables the module to handle 1079W of peak power for a brief period of time, up to a maximum of one second.

Increasingly high-performance microprocessors and ASICs will require brief bursts of high current demand that is typically well in excess of normal system operation. Importantly, this burst-mode or peak-power capability eliminates the need for a second converter module to be placed in parallel.

The BMR458 delivers industry-leading performance to system architects developing equipment for Information and Communication Technology (ICT) applications, including datacom and server and storage systems. The module is ideal for high-power applications that are powered by multi-cell batteries or rectifiers commonly used in the ICT industry and employ intermediate bus conversion (IBC) or dynamic bus voltage (DBV) architectures.

“This upgrade of the BMR458 meet the needs of leading customers to handle peak current, commonly demanded by the latest system processors, ASICs and other system-on-chip devices,” said Martin Hägerdal, Head of Ericsson Power Modules. “Once again, Ericsson has extended its technological leadership with this further augmentation of capabilities to deliver the most advanced and highest power capable advanced bus converter available on the market today.”

Other features of the BMR458 include: the highest power delivery (650W) in the industry for a digitally operated quarter-brick advanced bus converter controlled via the PMBus, reducing the number of required modules in very high power applications; and highly accurate current sharing, as well as it being the only advanced bus converter available today to offer active- or droop-current sharing. Other key features including dynamic load compensation, snapshot parameter capture, and a PMBus v1.3 interface.

This new version of the BMR458 has been built to the highest quality design and manufacturing standards, enabling Ericsson to deliver to customers a continued high level of confidence in its power modules.

For further information, please visit www.ericsson.com/powermodules

Powerbox Reveals Its High Reliability Power Solution for Subsea Applications
Posted: 2017-6-16

Powerbox, one of Europe’s largest power supply companies and a leading force for four decades in optimizing power solutions for demanding applications, has announced a new technology platform to power industrial applications requiring high reliability and resilience in extreme environments. Designed to power subsea equipment such as gas and oil monitoring and control systems situated on the seafloor, fed from an AC or DC high voltage line feeder the PRBX VB410-380 power solution delivers 48V DC with very high reliability and resilience. The unit comprises a pre-stage converter and a secondary stage with redundant power modules and for monitoring and control, a full set of communications and interfaces.

Industrial applications such as gas and oil situated on the seafloor, or long distance transmission cables require very specific power solutions to supply a subset of electronic equipment operating 24/7 with no downtime, and where maintenance is either very expensive or simply not an option. These applications are usually powered from the shore or from a technical platform generator via a high voltage line, which depending on the power station could be AC or DC voltage within the range of 300 to 900VAC, or 400 to 1500VDC, ultimately requiring a 48V DC intermediate bus voltage to power electronic equipment.  Outputs need to be able to operate in parallel in order to increase the power or to offer redundancy.

Equipment deployed in extreme environments such as the seafloor must be designed for very high reliability and resilience and able to operate within a temperature range of -25 to +80 degrees C without derating, using conduction cooling only. Subsea electronic equipment is often contained within a very tight tubular container fixed to the cable. Powerbox’s PRBX VB410-380 is designed to guarantee the maximum level of isolation between the high-voltage input and the low-voltage output, but with sufficient physical isolation between the different components to allow for tight integration.

“Delivering power to extreme applications such as subsea ones is always a challenge for designers. But in developing standardized, easily reusable sub-systems such as the VB410-380 we have shortened the design cycle and time-to-market for our customers” said Patrick Le Fèvre, Powerbox’s Chief Marketing and Communication Officer. “Expanding sales opportunities, its design philosophy makes it eminently suitable for other applications such as the chemical industry and in highly restricted areas where human intervention is both complicated and risky.”

Using an advanced switching topology the complete system (high voltage input to low voltage output) energy efficiency is over 85%, which compared to earlier generation, similar products is some 10% higher. The PRBX VB410-380 layout is designed and optimized to conduct heat from the dissipative elements to the cold plate, reducing the possibility of internal hot spots and contributing to higher reliability.

The VB410 primary module converts the line voltage to an internal voltage of 380VDC. It includes an active Power Factor Corrector (PFC) and an RS-232 communication bus for the network manager to supervise the power unit. The module is designed with an ‘inrush current free topology’, cleverly reducing peaks on the main line and reducing component stress.

The secondary stage of the PRBX VB380 includes four independent output modules each delivering 95W (48V / 2A). Each output has its own current limiting capability, and an integrated digital controller, used to monitor voltage and current that is readable through a CAN-Bus. Each output can be ON/OFF controlled or made redundant. The CAN-Bus is also used for diagnostic and predictive actions (e.g. to shutdown modules when not required or enable in order to maintain peak power).

Designed to meet specific systems’ requirements, Powerbox’s PRBX VB410-380 complies with all safety, EMI and other regulations relevant to the system.

For more information, visit www.prbx.com.

CUI: New Line of Compact, Encapsulated Ac-Dc Power Supplies Ranging From 6 W to 20 W
Posted: 2017-6-16

CUI’s Power Group introduced a new line of low power, encapsulated ac-dc power supplies ( http://www.cui.com/encapsulated-ac-dc-power-supplies ) to their broad power portfolio ranging from 1 W to 12 kW. Housed in a compact, encapsulated board mount package with industry standard pin-outs, the new PSK series offers models with 6, 10, 15, and 20 W of continuous power. Thanks to their compact footprints measuring as small as 2 x 1 x 0.659 in (50.8 x 25.4 x 16.74 mm), these rugged, encapsulated modules are ideally suited for low power ITE, consumer electronics, and industrial control applications where board space limitations and environmental contaminants are a concern.

The PSK‑6B, PSK‑10B, PSK‑15B, and PSK‑20B series all offer 4 kVac isolation, no-load power consumption less than 100 mW, and operating temperature ranges at full load from ‑25 up to +50°C, derating to 50% load at +70°C. A wide universal input voltage range of 85 to 264 Vac is featured with single output voltages of 5, 9, 12, 15, 24, and 48 Vdc, depending upon the series. Carrying UL/cUL and TUV 60950-1 safety certifications while meeting EN 55032 Class B and FCC Class B limits for radiated emissions, all models come standard with short circuit, over current, and over voltage protections. Calculated per MIL‑HDBK‑217F, the 6 W to 20 W modules also carry a minimum MTBF of 300,000 hours at 115 Vac at +25°C ambient.

The PSK‑6B, PSK‑10B, PSK‑15B, and PSK‑20B series are available immediately with prices starting at $9.69 per unit at 100 pieces through distribution. Please contact CUI for more information.  https://www.cui.com/contact

ON Semiconductor Improves Imaging Performance for High Resolution Industrial Applications
Posted: 2017-6-16
New 29-megapixel CCD image sensor combines high resolution with enhanced imaging performance for high-end security, machine vision, and aerial surveillance

ON Semiconductor, driving energy efficient innovations, is improving performance for industrial imaging applications that require both high resolution image capture and maximum image uniformity.

The new 29 megapixel KAI-29052 image sensor provides up to twice the imaging sensitivity of the existing KAI-29050 in the wavelength range of 500 nanometer (nm) to 1050 nm. This improved performance is particularly beneficial to applications operating in near-infrared (NIR) wavelengths, such as 850 nm. This enhanced pixel design retains isolation of charge from one photodiode to another, enabling this increase in sensitivity without any reduction to image sharpness (Modulation Transfer Function, or MTF). In addition, an improved amplifier design reduces read noise by 15%, increasing the linear dynamic range available from the device to 66 decibel (dB). With these enhancements, the KAI-29052 serves as a new performance benchmark for high resolution image capture.

“The evolving needs of industrial imaging applications such as high end security, machine vision, and aerial surveillance and mapping require continued advancements in the portfolio of image sensors serving this market,” said Herb Erhardt, Vice President and GM, Industrial Solutions Division, Image Sensor Group at ON Semiconductor. “The enhanced performance available from the KAI-29052 is a further demonstration of ON Semiconductor’s ongoing commitment to provide the most advanced CCD and CMOS image sensors for these demanding markets.”

For more information, visit www.onsemi.com.

Cornell Dubilier Introduces New Type HHT Ruggedized Axial Leaded Aluminum Electrolytic Capacitor
Posted: 2017-6-16

Cornell Dubilier Electronics, Inc. (CDE) has announced a new line of axial-lead aluminum electrolytic capacitors, for applications demanding very high-performance under all operating conditions.  The HHT is the only axial-lead electrolytic featuring a glass-to-metal seal to prevent dry-out of the capacitor electrolyte.  Shelf life is an extraordinary10 years and operational rated life is 2,000 hours at rated voltage and +175 °C.  At 150 °C and full-rated voltage, HHT capacitors outperform competitive technologies in a 5,000 hr test with ripple currents of up to 10 Arms.  This level of performance makes the HHT an excellent match for high-stress applications in military, aerospace, down-hole and off-road transportation applications.  Nine values are offered, from 470 µF to 4,700 µF, with ratings from 16 Vdc to 40 Vdc.

The CDE HHT Series is the only aluminum electrolytic capacitor available in the market with +175 °C performance.  This is usually the domain of the considerably more expensive wet tantalum technology.     The HHT’s glass-to-metal seal is the reason.   Without the seal, high temperatures will cause conventional electrolytics to lose electrolyte over time.  This causes a drop in capacitance and an increase in ESR.   With capacitance stability at high temperature, low leakage current and very competitive ESR and ripple current specifications, these devices provide new options for mission-critical applications.   Like other CDE capacitors, the HHT Series is subject to the industry’s most rigorous dynamic testing.  The 20g vibration testing follows procedures outlined in MIL-STD-202, method 204.

Since its founding in 1909, CDE has been dedicated to advancing capacitor technology for new applications. The company combines innovative products with engineering expertise to provide reliable component solutions for inverters, wind and solar power, electric vehicles, power supplies, motor drives, HVAC, motors, welding, aerospace, telecom, medical equipment and UPS systems.

For more information on this series visit: www.cde.com/HHT

Bel Power Solutions Introduces The First-Ever AC-DC Power Supply Using Transphorm GaN FETS
Posted: 2017-6-16
New Power Supply First to Achieve Titanium Efficiency Using Bridgeless Totem-Pole Power Factor Correction

Transphorm Inc., the leader in the design and manufacturing of JEDEC-qualified 650V gallium nitride (GaN) semiconductors, stated today that the recently announced high efficiency TET3000-12-069RA power supply marks another GaN industry milestone. Developed by Bel Power Solutions, a Bel group company and premier global manufacturer of power management devices, the AC to DC front-end TET3000 uses a GaN-based bridgeless totem-pole power factor correction (PFC) topology to achieve greater than 96 percent efficiency. 

The TET3000 is a 3kW power supply designed for enterprise reliability server, router and network switching subsystems. Bel Power designed the supply with GaN to serve three critical customer needs: power density, size and performance reliability. The TET3000’s volume power density is 31.7W/in3. The device size is 2.72 x 1.59 x 21.85 inches, small enough to meet 1U end-system design requirements. Lastly, the TET3000 is certified for 80 Plus Titanium efficiency and earned a CE Mark per the European Commission’s Low Voltage Directive, an initiative ensuring European citizen protection from electrical equipment.

Inside the TET3000: Bridgeless Totem-Pole PFC
GaN designs implementing the bridgeless totem-pole PFC topology achieve a number of system benefits when compared to a standard interleaved boost converter:

  • Smaller size/higher power density: Lower component count and EMI filter size, delivering the same power in a smaller footprint
  • Higher efficiency: Faster switching speeds lowers crossover losses and increases system efficiency, and removing the bridge rectifier decreases losses by 20 to 30 percent
  • Lower cost: GaN enables increased performance and higher power density using twice the on-resistance as Si to help reduce system cost

“Bel Power’s legacy of leading the global power management industry is built on responsible innovation that empowers our customers,” said Alain Chapuis, CTO, Bel Power Solutions. “The TET3000 is a result of that commitment. After considerable R&D weighing various semiconductor materials and power system designs, Transphorm’s GaN within a totem-pole PFC configuration proved the most reliable, highest performing solution possible today. In turn, our customers gain access to a next generation power supply that stands to outperform incumbent solutions while delivering a greater ROI.”

The TET3000 uses Transphorm’s TPH3205WSB 49 milliOhm (mΩ) GaN FETs. To learn more about the system benefits of implementing a bridgeless totem-pole PFC, contact Transphorm’s Center of Excellence customer support team at transphormusa.com/support.
 

Highly Integrated Capacitive-Digital Converter Delivers Superior Gesture Sensing and Enhanced Touch Performance to Automotive and Industrial Systems
Posted: 2017-1-18
Eight-channel device exhibits sensitivity up to 150 mm away to support gesture recognition

ON Semiconductor, driving energy efficient innovations, has introduced a new touch/proximity sensing solution that combines industry-leading performance, cost-effectiveness and convenience in a single chip. The LC717A30UJ high dynamic range capacitance-to-digital converter uses mutual capacitance to detect changes in capacitance down to femtofarad (fF) levels. Parasitic capacitance cancellation raises the detector sensitivity, while its built-in noise rejection mechanism combats the effects of electromagnetic interference (EMI).

The eight capacitance-sensing input channels make the LC717A30UJ highly optimized for use in systems where an array of switches is required. The device includes an integrated multiplexer for input channel selection, analog-to-digital converter, dual-stage amplifier that determines capacitance changes plus outputs analog amplitude values, system clock, power-on reset circuit, and all the necessary control logic to create a total solution. Both I2C and SPI interfaces are selectable based on the system application needs.

As the device's sensitivity has a range of 150 millimeters (mm) - beyond the scope of any competing device on the market - its higher sensitivity enables gesture motions as well as offering conventional touch functionality, thereby enhancing users' control options to address a wide range of application scenarios. In addition, it is capable of operating with an airgap between the sensor/PCB and the protective cover - so engineers can eliminate the inclusion of a light guide from the assembly and reduce overall complexity. This device also includes an integrated automatic calibration function which optimizes and self-calibrates total capacitance according to electrode, line capacitance, and surrounding environment, thus significantly accelerating system development cycle time as well as robustness in the field.

The LC717A30UJ delivers rapid responsiveness, with a measurement time of 16 milliseconds (ms) for its 8 sensing channels and runs off a +2.6 volt (V) to +5.5 V supply with a low-power standby mode of one microampere (µA). The high degree of integration means that minimal external components are required, thereby further reducing the bill of materials. To support the needs of automotive applications such as vehicle entry systems and dashboard controls, the device is AEC-Q100 compliant. With its high integration level and wide dynamic range, it can also be employed in a range of touch or gesture human interfaces in industrial and consumer end products such as induction cookers, refrigerators, home entertainment systems, building automation equipment, industrial equipment, and lighting controls.

"As we all know, touch technology has witnessed widespread uptake within the consumer electronics sector over the course of the last decade. Now there are an ever-increasing number of opportunities for its utilization in various nonconsumer sectors," said Ikuya Kawasaki, General Manager of the Intelligent Power Solutions Group at ON Semiconductor. "This new device possesses the key attributes needed to address these demands, by providing a robust, simple to deploy solution that successfully combines low price and superior performance."

 

ON Semiconductor and Hexius Semiconductor Expand Scope of Analog Functionality for Next Generation Mixed Signal ASICs
Posted: 2017-1-10
New intellectual property offering will accelerate time to market and reduce development-cycle risk

ON Semiconductor, driving energy efficient innovations, has announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process. This enables ON Semiconductor to better serve its customers with proven analog IP that can ultimately reduce design cycles and time-to-market. The eight initial designs resulting from this collaboration include a variety of analog-to-digital converters, digital-to-analog converters, voltage references and current references. There is provision, if needed, for the designs to be custom-tailored to match particular application demands. Further data converter and PLL designs are currently being developed for introduction later this year.

ON Semiconductor's ONC18 process relies on a 0.18 micrometer (µm) CMOS architecture and due to its high voltage capabilities is extremely well suited to automotive, industrial, military and medical deployment. By having access to an expansive portfolio of qualified IP that supports this process, customers will be able to benefit from ASIC implementations that are highly optimized for their specific requirements, without needing to allocate too much of their own engineering resources to the task. As a result, much quicker design cycles, reduced risk of re-spins and lower associated costs can all be realized.

"The mixed signal ASIC market continues to grow as systems need to utilize the real-word data that is captured by sensors and user interface," states Rocke Acree, Director of the Custom Foundry business unit at ON Semiconductor. "OEMs are looking to integrate more effective proprietary designs, rather than relying on standard off-the-shelf components. Through this, performance levels can be enhanced, board space saved and unit costs significantly lowered. By working together, ON Semiconductor and Hexius Semiconductor are delivering qualified analog IP needed to facilitate this migration and enabling a new era of mixed signal design."

"Through the combination of the respective skill sets that our two companies possess, we are in a position to supply the industry with qualified analog IP macrocells on superior semiconductor processes that will deliver clear performance and logistical advantages. This will allow OEMs to respond more quickly to market opportunities that they have identified by taking products from the concept phase right through to full commercial production in the shortest possible time," adds Chris Cavanagh, CEO at Hexius Semiconductor.

Visit ON Semiconductor's External Intellectual Property page for more information. 
 

New Technology Report Introduced at APEC 2015
Posted: 2015-3-21
Current Development in 3D Packaging With Focus on Embedded Substrate Technologies

At APEC 2015, the PSMA Packaging Committee will introduce the first comprehensive study of the feasibility of using Embedded Substrate Technologies to build power sources. The report entitled “Current Developments in 3D Packaging with Focus on Embedded Substrate Technologies” will also be discussed at the Industry Session on 3D Packaging. The report was prepared under contract by LTEC Corporation with work subcontracted to Anagenesis and Fraunhofer-Institute. The intent of this article is to provide PSMA members a high level preview of the contents of Technical Report.

The PSMA Packaging Committee believes the 340 page report with extensive illustrations of the leading edge product technologies will provide valuable insights to executives and managers in their own analysis of how currently available materials and processes could be best used for the creation of advanced high efficiency, high power-density power electronic products. The report builds upon the findings of the Phase I report - 3D Power Packaging - issued by the Power Sources Manufacturers Association (PSMA) Packaging Committee in 2014.

Background

Let’s begin with a little background. The power electronics industry and the semiconductor industry are inseparably intertwined with one another, and both are facing unprecedented market challenges for efficiency, cost, construction and thermal issues which provide many opportunities for innovation. These industries are in the focal point of the “energy challenge” a multifaceted problem that involves mobile and cloud infrastructure systems, Internet-of-Things, renewable energy, smart grid, vehicle electrification, and across-the-board power efficiency enhancements in order to keep up with the industry's rapid growth in data consumption. These are the competiveness and sustainability challenges of the twenty-first century.

The paradigm shift we have been experiencing in semiconductor packaging technology was brought about by advanced deep submicron semiconductor technology reaching a “cost barrier” that prevented further cost reduction by adding more functions to the semiconductor die. This barrier was circumvented through the development of wafer thinning that enabled through-silicon-via (TSV) technology, and the eventual introduction of 2.5D and 3D integration that facilitated heterogeneous (“More than Moore”) integration. It will allow the power requirements of the digital load to increase 2 to 5 times, within the same footprint, in a single generation. The power sources community must now find ways to package power sources that will meet this demand, but with no increase in footprint.

In parallel, power semiconductor technology has been facing a “construction barrier” that prevents realization of the huge benefits new technology can offer in terms of increased power efficiency and higher power density. These new technologies which include gallium-nitrogen (GaN), silicon-carbon (SiC), and gallium-arsenic (GaAs) power semiconductor devices all require operation in an environment that is free of bond wires and minimizes parasitic interconnect elements. The best possible packaging technology to achieve this is embedding active and passive components in organic or inorganic substrates.

Overview of the Report

The report begins with a discussion of PCB embedding technology, which is fueled by the rapid evolution of low-power embedding and 3D packaging technologies, which are in high volume production. These technologies will in turn enable power electronic systems to deliver higher efficiency and higher power density.

Embedding Actives and Passives in Substrate using Shinko Electrics Molded Core Embedded Package
Embedding Actives and Passives in Substrate using Shinko Electrics Molded Core Embedded Package (MceP®)

In addition to substrates the report dedicates entire chapters to each of the passive components (resistors, capacitor, and inductors) as well interposers and additive manufacturing.

Embedding using Formed or Inserted Components
Embedding using Formed or Inserted Components

The report also discusses high temperature die and component attach technologies that are evolving rapidly in the research labs; however, a single, low-cost, “one-size-fits-all applications” high-lead solder-substitution technology is currently unavailable and addresses the fact that high power-density component embedding and 3D packaging of power semiconductor devices also have to overcome a “thermal barrier.” Simply stated, it is more challenging to remove heat generated within the body of a 3D integrated system than from a planar, two-dimensional surface. This leads to a discussion of advanced thermal management technologies which are key enablers for 3D packaging as well as PCB embedding.

The authors acknowledge and devote a chapter to the fact that high power-density component embedding and 3D packaging of power semiconductor devices also have to overcome a “thermal barrier.” Simply stated, it is more challenging to remove heat generated within the body of a 3D integrated system than from a planar, two-dimensional surface. This leads to a discussion of advanced thermal management technologies which are key enablers for 3D packaging as well as PCB embedding.

In addition to their primary research, the team conducted a worldwide literature review and analysis of research and development (R&D) published by participating organizations in the USA, Asia-Pacific Region, and the EU, and identified several potentially high-impact technologies of interest to the power electronics and the semiconductor industries.. In terms of leadership positions, Germany and the EU appear to lead in the area of high-power PCB embedding and research into vertical interconnect/high-lead replacement technology, while Japan is leading in low power, high-density embedding, high performance, low CTE, high modulus (low warpage) substrates, and organic interposer technologies.

Finally the report highlights some of the technology gaps as well as a recognition that this new technology requires updated or additional standards for manufacturing and testing. This report reviews the existing and pending new standards for PCB embedding which the IPC Association has taken the lead to author. However, much additional standard action is needed since the manufacturing supply chain is still evolving. Procedures need to evolve to establish compatibility of up-top metal-die design and PCB layout rules, testing, quality control, and for assigning ownership of failure.

In summary, there has been substantial progress and excellent opportunities lie ahead for the power electronics and semiconductor industries and the entire manufacturing ecosystem to embrace PCB embedding and 3D packaging technologies for power electronic applications. The intersection of these technologies with the emerging wide-bandgap power semiconductor technology creates truly exciting possibilities at the same time the power electronics industry faces unprecedented challenges to help mitigate the fast growing demand for electricity and environmental problems our world faces. Embedded substrate packaging technologies can be, and will be deployed in hybrid and electric vehicles, alternative energy generation and distribution systems, smart grid, industrial, and military aerospace applications in the coming years and beyond. These technologies, combined with wide-bandgap semiconductor devices will literally re-vitalize the entire power electronic infrastructure block by block, module by module, for the twenty-first century.

As a benefit of PSMA membership, the Current Development in 3D Packaging with Focus on Embedded Substrate Technologies report will be sent to all PSMA Regular and Associate member companies and Affiliate companies will be able to purchase the report at a reduced price. The report will also be offered to others in the industry at a price of $2990. You can view the report at the PSMA Exhibit booth at APEC 2015 and shortly the Table of Contents will be available on the PSMA website: www.psma.com.

 

Submitted by the PSMA Packaging Committee.
Brian Narveson
Co-chairman
  Brian Narveson   Ernie Parker  
Ernie Parker 
Co-cha

 

PSMA Publishes Technology Report: “Current Development in 3D Packaging With Focus on Embedded Substrate Technologies”
Posted: 2015-3-17
Comprehensive report is the first to address “More than Moore” digital power demands by accelerating the development of higher density power sources using new, disruptive packaging technologies

March 16, 2015—The PSMA (Power Sources Manufacturers Association) Packaging Committee announced today that it has published a report titled “Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies.” The first comprehensive study on using embedded substrate technology for building power sources, the report contains extensive research and product illustrations geared to an audience of technology executives and design engineers. Its purpose is to offer an in-depth industry perspective on how currently available materials and processes can be best used for the creation of advanced high-efficiency, high-power-density power products.

The PSMA created the 3D packaging report to address the pressing demands in the power industry to accelerate the development of higher density power sources. The first challenge arose from digital semiconductor packaging technology hitting a “cost barrier” brought about when advanced deep-submicron semiconductor technology could no longer reduce cost with the addition of more functions to the semiconductor die. This barrier was circumvented through the development of wafer thinning that enabled through-silicon-via (TSV) technology and the eventual introduction of 2.5D and 3D integration, which facilitated heterogeneous (“More than Moore”) integration. This integration allowed the power requirements of the digital load to increase two to five times, within the same footprint, in a single generation. Now the power industry is tasked with finding ways news ways to package power sources that will meet this demand, but without increasing footprint.

In parallel, power semiconductor technology is facing a “construction barrier” that prevents the realization of the significant benefits new technology can offer in terms of increased power efficiency and higher power density.  These new technologies, including gallium-nitride (GaN), silicon-carbide (SiC), and gallium-arsenic (GaAs) power semiconductor devices, all require operation in a package that is free of bond wires and that minimizes parasitic interconnect elements. Both of these challenges can be addressed with power packaging utilizing embedded substrate technologies and are addressed in the report.

The PSMA’s 340-page report, prepared under contract by LTEC Corporation with work subcontracted to Anagenesis and Fraunhofer-Institute, is based on the Packaging Committee’s extensive research of over 750 articles and papers, analysis of 450 presentations/papers, and by conducting 30 industry expert interviews. Information was also derived from attendance at 10 industry conferences, workshops and seminars. The report contains 172 links and 394 citations.
The report provides detailed analysis of substrates (organic and inorganic), components (actives and passives), thermal management, high temperature die, packaging technologies, interposers, as well as additive manufacturing and laser fabrication. Each passive component (resistors, capacitors, inductors) has an entire chapter detailing which suppliers are currently shipping products usable in power sources.  Every chapter covers manufacturing issues and includes references to contract manufacturing companies already producing power products utilizing embedded substrate technology. Embedded substrate packaging leverages the large investment made by the digital industry in advanced packaging technologies and is being used to resolve the power source construction challenge. As the report demonstrates, 3D power packaging using embedded substrate technology is a disruptive technology, in that it enables large increases in power density and efficiency.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the  challenges companies will face to implement embedded substrate 3D power packaging to create the significantly higher power densities driven by the “More than Moore” digital power demands.”

The PSMA report on 3D packaging will be provided free of charge to PSMA Regular and Associate members.  Affiliate members can purchase the report for the reduced price of $190.  Others interested in the report may order a copy from PSMA for $2,990. 
 

Power Sources Manufacturers Association Reprints Classic Magnetics Text
Posted: 2011-7-25

 

MENDHAM, N.J. – June 23, 2011 − The Power Sources Manufacturers Association (PSMA) announced that it is again making available Nathan Grossner's classic treatise, Transformers for Electronic Circuits - Second Edition. The first reprint of this work sold out and this second reprint is now available. PSMA members may now purchase this important text online, directly from PSMA, at the discounted price of $55. The non-member PSMA online price is $75. Non-members may also purchase it through How2Power or through Amazon. This text is a complete, one-stop guide to transformer and inductor design and applications for everyone who designs, builds, or uses power magnetics components. Throughout this book, the author combines analysis and synthesis and all theory is related to the solution of real-world problems.

Sections of the text provide guidance in the use of transformers and inductors in power electronics and in digital and pulse circuits. Also included is design information about other forms of high-frequency magnetics such as transmission-line transformers, hybrid transformers, ferroresonant tranformers, flyback converter magnetics and inductors used in switch-mode power converter designs.

Special attention is given in the book to the proper control of dielectric stress, corona and thermal factors in high-voltage magnetics designs. Modeling methods for magnetic parts are also included and treated in some detail. This book is an essential reference book for any engineer involved in the design and development of modern-day magnetic components.

According to Steve Carlsen, co-chair of the PSMA Magnetics Committee, “Grossner's book should be an essential part of every power supply designer’s technical library. The initial PSMA reprint edition sold out and thanks to PSMA, it is once again available after being out of print for several years.”

PSMA Answers Continued Demand for Snelling Magnetics Text with 2nd Reprint
Posted: 2010-10-4

Mendham, New Jersey—June 1, 2010—The Power Sources Manufacturers Association (PSMA) has announced the renewed availability of SOFT FERRITES – Properties and Applications - Second Edition, authored by Eric Snelling. The book had been out of print for several years and was reprinted in limited quantity by the PSMA in 2006. Due to continued demand, a second reprinting is now available. The book was initially published in 1969 and was extensively revised by Snelling in 1988 to bring all eleven chapters in line with current design practices and applications of ferrite cores used in modern-day inductors and transformers. The aim of this unique 366-page reprint is to provide all the information on ferrite properties and wound-component design necessary for efficient applications of these materials. Data in the book are represented by means of extensive use of graphs and tables, and design procedures are supported by many working examples of inductors and transformers. According to Stephen Carlsen, PSMA Magnetics Committee Chair, “Snelling’s book is considered by many working design engineers as the ‘ferrite user’s bible’ and PSMA is pleased to make this wonderful text available once again.” Copies of Snelling’s classic treatise on magnetics, SOFT FERRITES – Properties and Applications - Second Edition, are available for sale at www.psma.com. The cover price for the reprint is $150 but PSMA members, as a benefit of their membership, can purchase the text for $100. The PSMA-reprint text is also available at the non-member price at www.amazon.com.

PSMA Announces Availability of On-Line Energy Efficiency Standards Database
Posted: 2009-4-12
Database offered as a free service to the industry; provides “one-click” access to details of standards by world region, agency and application.

Mendham, New Jersey — April 9, 2009 — The Power Sources Manufacturers Association (PSMA) announces availability of its On-line Energy Efficiency Database (EEDB) as a service to the industry. The number of energy efficiency standards and the world wide agencies that generate them continue to grow daily. It is time consuming for an individual or company to keep track of the many actions and activities by government and industry groups. The PSMA on-line energy efficiency standards database provides “one click” access to the very latest global standards and initiatives.

As a result of user feedback on an earlier version of the database, PSMA has incorporated a number of improvements. Some of the useful features:

•Quick access to world region, agency, or standards application
•Expanded data includes list of specific standards generated by an agency and parametric specifications for each regulation
•Expanded description of regulations and agencies
•Enhanced descriptions that include html code for quick linking to agency site or database location
•Latest schedule of standards meetings

Dusty Becker, PSMA Board Chairman and chair of the PSMA Energy Efficiency Committee, states that "The PSMA On-line Energy Efficiency Data Base, which incorporates a number of improvements suggested by product planners to keep current, is a valuable resource for engineers. We are pleased to offer this resource free of charge to our membership and to the industry."

Though access to the PSMA EEBD is free, users are required to register on www.psma.com/green/ so PSMA can provide notice of special database announcements and associated PSMA activities.

About PSMA

PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its membership which includes most major power supply companies.

PSMA Announces Reprint Availability of J. K. Watson's “Applications of Magnetism”
Posted: 2008-2-4
New reprint is the fourth title in PSMA's out-of-print Classic Book Series

MENDHAM, N.J. - February 4, 2008 ─ The Power Sources Manufacturers Association (PSMA) is pleased to announce availability of a reprint of the classic book "Applications Of Magnetism" authored by the late J. K. Watson and originally published by John Wiley and Sons in 1980. According to Ed Bloom "This classic book, written by one of the most respected teachers in the field of magnetics, makes the principles of applied magnetics accessible to the practicing electronics engineer. With emphasis on practical design, the text presents the relevant principles of physics, circuit analysis, simple models and the calculations involved in designing a circuit or a magnetic device. No prior knowledge of the physics of magnetism is assumed ─ material properties are explained in a step-by-step manner, with special attention to their effects on the volt-ampere characteristics of a magnetic device, and to the physics of magnetic domain processes. Applications of magnetics, including those associated with power electronics circuits, are covered as well as reluctance modeling methods for transformers and inductors." Copies of this practical design treatment of magnetics will be available for sale at this year's Applied Power Electronics Conference (APEC 2008) to be held in Austin, Texas, February 24-28, 2008 and through the PSMA web site - www.psma.com. Copies will sell for US$100, but members of PSMA companies can obtain a copy for US$50. To order directly from PSMA please complete the "members order form" or the "non-members order form". In the past three years, PSMA has reprinted three other classic books on magnetics including Transformers for Electronic Circuits by the late Nathan R. Grossman, Soft Ferrites - Properties and Applications by E.C. Snelling and Electronic Transformers and Circuits by the late Reuben Lee and associates. A limited number of the Snelling and Lee books are still available through www.psma.com. About PSMA PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants, interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization, whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its members, which include most major power supply companies.

PSMA Announces Latest Edition of Standardized Terminology Handbook
Posted: 2007-10-6
Third edition includes print and CD versions; provides comprehensive resource of power sources industry terminology

 

 

 

MENDHAM, N.J.,—October 5, 2007—The Power Sources Manufacturers Association (PSMA) is pleased to announce publication of The Handbook of Standardized Terminology for the Power Sources Industry–3rd Edition. Revised and expanded, this unique handbook contains hundreds of added terms, especially selected for the power electronics professional. The third edition also contains illustrations and four new appendices, including a listing of EMI specifications, excerpts from international standards of units and symbols, along with guides for authors of technical papers. These added resources provide concise, easy-to-use references for engineers involved in technical writing and presentations. Many new magnetic terms are described in this new 126-page third edition that are of particular interest to the practicing designer and marketer of power supplies and related products. Valuable information regarding worldwide power sources, standards agencies, and military specifications has been retained, updated and expanded from the previous edition. Titles of the appendices are: • Testing and Standards Agencies; Designer's Reference; • World Voltages and Frequencies; • Military Specifications; • EMI Specifications; • Writing Technical Papers for Archival Publications; Units, Symbols and Style Guide; A Brief Writing Guide. The book comes in hard copy along with a CD containing a PDF version that can easily be searched for terms and words within the definitions, making it a valuable tool for posting on your internal network. The book price is $25 to PSMA members and $50 to nonmembers. To order directly from PSMA please complete the "members order form" or the "non-members order form".

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