New product announcements


Powerbox Announces Power Solution for High Speed E-Commerce Hub Conveyers
Posted: 2019-3-6
  • Designed for factory automation and intelligent conveyers
  • Three phase input, 323 to 560VAC
  • 24V, 250W with 480W peak power for motor start or high capacitive loads
  • High ingress protection level for harsh environments (IP54)
  • Up to 94% efficiency

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the introduction of its ENI250A series designed to deliver peak power to motor start or/and high capacitive loads in factory automation applications. The three-phase ENI250A series is housed in an IP54 case, delivers a constant 250W and up to 480W peak power with an efficiency up to 94%. The ENI250A includes a microcontroller that offers many possibilities to adjust protection behavior to meet specific customer requirements.

Factory automation is already well established in many industries, but with the progress in Artificial Intelligence (AI), remote communication and the growing demand for shorter customer lead times, it is predicted to explode in coming years. Similarly, the growth of automated parcel-hubs is expected to rise spectacularly. The rapid development of e-commerce has contributed to the creation of highly automated hubs with conveyers, sorting switches and many other equipments requiring efficient and intelligent power solutions able to work in demanding environments.

Parcel hub-designers and hub-operators are facing multiple challenges in having to deal with a large variety and types of equipment. This not only requires high quality, high performances power supplies, but the ability to operate in harsh environments with a complex mix of mechanical, thermal and electrical constraints.

“Designed to meet such demanding requirements with built in high Ingress Protection (IP) for harsh environments, Powerbox’s three-phase ENI250A is not only a robust and efficient power solution but a mechanically reconfigurable platform able to fit different form factors or even direct integration into DC motors. “ Said Martin Fredmark, Powerbox’s VP Portfolio Management. “Equipped with a micro controller, functions like peak power, current limiting, protection mode and behavior, and others can easily be set to suit customers’ specific needs, shortening time to operation and conveyer upgrades.”

Addressing 24VDC motors, the 250W ENI250A24 can deliver 480W peak power for one second, sustain high capacitive loads and manage energy recycling when a DC motor is decelerating or stopping. This function is very important for energy saving and to increase equipment life-time. For higher power or redundancy, the ENI250A24 can simply be paralleled. The unit has an operating temperature range from -25 to +70 degree Centigrade.

Other output voltages are available on demand to power 36V, 48V DC motors, as well customized voltages.

The ENI250A24 includes soft-start, over current, voltage and temperature protection. An LED indicator informs the status of the power supply and a DC-OK signal and remote reset provide for easy integration within the conveyer operation management system. It is designed using Powerbox’s reliable power platform concept and uses an active power factor correction (PFC) in combination with a high efficiency and compact LLC topology.

Exhibiting versatility, the ENI250A24 accepts input voltages from 323VAC to 560VAC three phase, and is designed to meet safety specifications 60950-1 and 62368-1. EMC is in accordance with EN61000-6-3 and EN61000-6-2.

Housed in an IP54 case, the ENI250A24 has dimensions of 250x160x55mm, weighs 1.5Kg and mounting brackets are available for easy installation. Designed for easy integration within customers’ equipment, the ENI250A platform can be factory re-configured to fit specific form-factors.

For more information, visit www.prbx.com.

CUI Inc - 3 W and 5 W Encapsulated Ac-Dc Power Supplies Offer Multiple Mounting Options
Posted: 2019-2-12

CUI’s Power Group today announced the addition of 3 W and 5 W models to its line of low power, encapsulated ac-dc power supplies. Available in board mount, chassis mount, wire lead, and DIN rail configurations, the single output PSK S3 and PSK S5B series are housed in compact packages measuring as small as 1.46 x 0.97 x 0.71 inches (37 x 24.5 x 18 mm), making them well suited for space-constrained low power ITE, industrial control, automation, and consumer electronics applications. Designed for easy installation, the wire lead PSK S3 L and PSK S5B L series, chassis mount PSK S3 T and PSK S5B T series, and DIN rail mount PSK S3 DIN and PSK S5B DIN series afford engineers additional options for simpler design implementation.

These encapsulated modules feature 4 kVac input to output isolation, a universal input voltage range of 85 to 264 Vac, and a wide operating temperature range from -40 up to +70°C. The series also offer single output voltages of 3.3, 5, 9, 12, 15, and 24 Vdc, along with over current, over voltage, and continuous short circuit protections.

All models are certified to the new IEC 62368-1 safety standard for ICT and AV equipment, while meeting CISPR32/EN55032 Class A limits for conducted and radiated emissions. Featuring class II construction, these encapsulated ac-dc power supplies further carry a minimum MTBF of 300,000 hours at +25°C ambient, per MIL HDBK 217F.

For more information, visit www.cui.com.

 

Flex Power Modules broadens portfolio to meet rising demand in industrial and railways sectors
Posted: 2019-1-13
  • Broad range of voltages and features to meet the needs of many diverse applications
  • Encapsulated packaging for reliable operation in harsh conditions
  • Flex Power Modules builds on reputation in ICT market with new capabilities for industrial and railways sectors

Flex Power Modules is introducing new DC-DC power modules for the industrial and railways sectors, broadening its product range to meet increasing demand in these sectors, as well as providing additional versions of existing products, with different input/output voltage ranges. The modules are provided in sealed and encapsulated packaging, to ensure they will work reliably when subjected to dust, moisture, severe vibration and other harsh conditions.

For industrial applications, Flex Power Modules provides high-reliability, high-performance and rugged DC-DC solutions in standard form factors, often running from 24V or 12V supply voltages, rather than the 48V more commonly found in information and communications technology (ICT) applications.

For railway applications, the company provides a series of products that can meet the most stringent electrical and environmental specifications. Modern railway systems need a wide range of DC-DC converters to power different monitoring and control units, and the new series of products mean that Flex Power Modules can now meet a broader range of requirements.

Olle Hellgren, Director of Product Management and Business Development at Flex Power Modules, commented: “While Flex Power Modules has traditionally been best known for its power products in the ICT sector, we have always had a strong offering for the industrial and railways sectors, and the success of our existing PKE and PKM-A modules has encouraged us to invest in offering more products for these applications – to ensure more customers can benefit from the high quality and reliability of our power solutions.”  

The DC-DC modules support a wide range of input voltages, to cover the needs of different applications. For industrial products, this includes 9 to 36V, 18 to 36V, 9 to 75V and 18 to 75V. Other modules provide input ranges of 43 to 160V and 66 to 160V, to cater to different railway application bus voltages, including 72V, 96V and 110V.

Flex Power Modules provides multiple product families for the industrial and railway sectors, and currently offers five ranges: the PKV Series (1.65-3W), PKE 3000 Series (15-30 W / Vin at 9-36 V), PKE 5000 Series (15-30 W / Vin at 18-75 V), PKE 8000A Series (40 W / Vin at 9-75 V) and PKM 7000A Series (100W / Vin at 66-160 V). The new products are well suited to a broad range of applications, including process control, factory automation, robotics, alternative energy, smart grid, and test and measurement. More families and additional input and output voltage combinations will be added in the coming months.

Additionally, the company’s PKR and PKU-E product families – which are already available to customers – are also suitable for industrial applications.

For more information, visit flex.com.
 

Digital and Analog MEMS Microphones Added to CUI’s Audio Product Group
Posted: 2019-1-10

CUI’s Audio Group today announced the introduction of a comprehensive line of MEMS microphones ideal for a range of portable electronic devices. Boasting improved audio quality, performance, and reliability, CUI’s CMM series is housed in extremely compact, low profile footprints measuring as small as 2.75 x 1.85 x 0.95 mm. As reflow solder compatible components, these MEMS microphones will afford designers additional flexibility where surface mount assembly is required, making them well suited for audio recording and voice capture in smart phones, tablets, smart home devices, wearables, and more.

CUI’s MEMS microphones are omnidirectional and available in analog or digital pulse density modulation (PDM) output types with top or bottom port locations. Offering round or rectangular form factors, the CMM series models carry sensitivity ratings from -44 up to -26 dB and signal to noise ratios from 57 up to 65 dBA. These MEMS microphones also deliver reduced vibration sensitivity, low current draw down to 80 microamps (µA), and wide operating temperature ranges from -40 up to +105°C. With tight sensitivity tolerances as low as ±1 dB, the CMM series is a perfect fit for array applications used to perform functions such as beam forming and noise cancelation. A unique inner chamber construction also provides more stable performance and gives these silicon-based microphones added protection against moisture and dust.
 

ON Semiconductor Announces Strata Developer StudioTM, Industry's Most Comprehensive Research, Evaluation and Design Tool
Posted: 2019-1-3
Innovative cloud-based platform significantly accelerates device and system evaluation and simplifies the design process for development teams

ON Semiconductor, driving energy efficient innovations, is announcing the introduction of the Strata Developer StudioTM, a first-of-its-kind cloud-based development platform that provides a seamless, personalized and secure environment for engineers to evaluate and design with ON Semiconductor technologies.

The Strata platform will provide a faster and simpler way for engineers to work with evaluation and development boards, delivering the latest documentation, product information, design and application notes, and reference design files straight to the desktop. This unparalleled functionality makes Strata the most comprehensive design tool available in the industry.

All of ON Semiconductor's new evaluation boards will in the future be 'Strata-Ready,' meaning they will automatically be recognized by the Strata Developer Studio when they are connected to the host computer. This platform provides design teams with a user interface to the board, giving direct control of the configuration parameters and visual feedback of the board's functionality. At the same time, Strata will download all the design information an engineer needs to start evaluation or design.

"We reimagined the research, evaluation, and design process of hardware systems, creating a holistic Software as a Service (SaaS) solution to unencumber and speed customers in their quest to develop innovative new products," said Edward Osburn, Strata Project General Manager at ON Semiconductor. "Gone are the archaic and outdated hardware evaluation paradigms hampering our customers' ability to deliver amazing products."

The Strata Developer Studio is provided as a Microsoft signed application connecting to the company's SaaS platform. It features secure authentication, data transfers and full information containment using encrypted and EU General Data Protection Regulation (GDPR) compliant databases. All information and security follows National Institute of Standards and Technology (NIST) Cybersecurity guidelines.

"Strata brings the world of information to you in a single, secure application," commented Ian Cain, Director of Software and Chief Architect of Strata at ON Semiconductor. "Security First and Security Built In was followed throughout the software development life cycle, providing the user with full privacy and content controls."

Patrick Moorhead, Founder, President and Principal Analyst at Moor Insights & Strategy, said: "Enabled by rapidly evolving electronics technology, products and systems in most sectors are renewing with exciting and enhanced capabilities at a relentless rate. This puts pressure on design engineers to get products to market as quickly as possible to gain competitive edge. That's where tools that support research, evaluation and design come in, and Strata sets a high bar at a new level in terms of speeding and easing the process."

The roadmap for the Strata Developer Studio will see its functionality increase rapidly, as new boards are supported and new features are added. Initial boards include a Configurable Multifunction Logic Gate, a Dual 100W USB-PD Automotive Charging System, and a Universal Offline 200W 4-Port Type-C USB-PD Source. For more information and to order a board, visit www.onsemi.com/strata.

Flex Power Modules targets emerging Direct Conversion market with class-leading isolated DC-DC converter
Posted: 2018-11-20
  • 48V-to-Load Direct Conversion technology addresses demands of next generation data centers 
  • Enabling more compact, higher efficiency and cost-effective power system implementations
  • Flex Power Modules positioning itself as the driving force in this sector 

Flex Power Modules introduces its first generation of Direct Conversion products to address the growing need for higher energy efficiency levels in data center and cloud computing infrastructure. The new BMR481 DC-DC converter has an input range of 40-60V targeting 48-54V nominal supplies, and a programmable 0.5-1.35V output. The 12 x 27.7mm footprint ‘main’ module provides a maximum output current of 70A and also incorporates a digital interface for monitoring, configuration and control purposes. This main unit can then be supported by up to 5 additional ‘satellite’ modules, resulting in a total current rating that reaches 420A.

The single-stage BMR481 provides an attractive alternative to the conventional two-stage intermediate bus converter (IBC) and point of load (POL) architecture – where an extra conversion step is required, which thereby takes up greater space and impacts operational performance. In contrast, this new groundbreaking Direct Conversion module presents engineers with a far more streamlined and economical solution. It is capable of achieving up to 92% efficiency from a 1V output at 53V in – which is 2-3% higher than what an equivalent IBC-based deployment can deliver. It also allows a reduction in board area of up to 50%. MTBF is in excess of 8.7Mhrs for the main module.    

Optimized efficiency is achieved by automatic enabling and disabling of phases/satellite modules depending on the required load, along with dynamic voltage adjustment to provide optimum supply rails to connected ICs. Output ripple and noise is extremely low, typically 1mV p-p, due to the zero voltage/zero current switching employed. Load and line regulation are typically kept to just 1mV. At 53V input and 0.5V output, the full 70A output current is available from the main module to over 75°C ambient temperature with 0.5m/s airflow and to over 90°C with just 2m/s airflow. Full digital control is implemented with a PMBus v1.3 interface compliant with PMBus or AVS / SVID. Isolation is rated at 1500VDC (functional).

Olle Hellgren, Director Product Management and Business Development at Flex Power Modules, commented: “Direct Conversion will be pivotal in stopping data center capital and operational costs from spiraling, as well as enabling increasingly stringent energy efficiency guidelines to be met. This is being made possible by eliminating the 12V intermediate level conversion stage in order to boost efficiency, along with utilizing less board space. With the BMR 481, Flex is pushing forward the proliferation of Direct Conversion, and demonstrating the huge potential of this new power conversion architecture.”  

For more information, visit flex.com.

Eaton announces new high-power density inductors to meet the demanding progression of power and thermal handling requirements in automotive and commercial electronics
Posted: 2018-11-15

Power management company Eaton today announced its next generation of miniature power inductors. The MPI25V2 and MPIA25V2 represents many of Eaton’s latest advancements in power magnetics in a compressed 2.5 mm x 2.0 mm package with 1.0 mm and 1.2 mm heights.  MPI25V2 and MPIA25V2 utilizes an advanced molded construction design for high current handling capabilities, better thermal dissipation characteristics and superior mechanical strength.

“Our new MPI25V2 inductors were developed to meet new trends in DC to DC power converters requiring high power density and ambient temperatures.” said Steve Subiry, global product manager at Eaton. “The new product family of molded inductors strengthens our product portfolio and allow us to participate in new generation technology platforms. We are very proud to bring this market leading solution to our customers”.

The MPI25V2 is ideal for commercial applications such as servers and datacenters, mobile and handheld devices, wearables, notebooks, graphics, game consoles, IoT, industrial connectivity and memory. The MPIA25V2 offers the automotive grade performance suitable for LED lighting, vehicle infotainment, Advanced Drivers Assistant Systems (ADAS), predictive safety systems, vehicle connectivity, USB chargers, and engine control units (ECUs).

To learn more about Eaton’s complete line of electronics solutions, please visit Eaton.com/electronics.

ON Semiconductor Delivers Energy Harvesting Bluetooth® Low Energy Switch Based on the Ultra-Low-Power RSL10 SIP
Posted: 2018-11-15
Based on the industry's lowest power Bluetooth 5 radio, the fully-featured reference design operates entirely from harvested energy to enable truly self-powered IoT applications

ON Semiconductor, driving energy efficient innovations, is defining new levels of ultra-low power operation in the IoT with the introduction of its Bluetooth Low Energy Switch reference design that operates entirely from harvested energy. The platform demonstrates how the RSL10 System-in-Package (SIP) can enable Bluetooth 5 devices that are battery-less and entirely self-powered, requiring no additional energy source. Application examples include wall and lighting control, building automation, and asset tracking.

The Energy Harvesting Bluetooth Low Energy Switch brings together the highly integrated and exceedingly low-power RSL10 SIP with the innovative energy-harvesting technology developed by ZF Friedrichshafen AG, to provide the ideal platform for a range of IoT applications. Featuring a fully-integrated antenna, RSL10 radio, and all passive components; the RSL10 SIP simplifies system design and minimizes the Bill of Materials.

The Switch reference design is provided with complete BoM, schematics, PCB layout and Gerber files, as well as free use of the switch-side firmware. The source code included provides a platform from which to develop application code, and the documentation includes detailed explanations of how to customize the firmware and connect the reference design to a Bluetooth Low Energy scanner application running on a smart phone or tablet. Exclusive new features of the switch include the absence of a buck/boost converter for simplified design-in and improved performance, as well as a smart dimming function.

The technology developed by ZF captures the energy transferred when a user presses a button. The switch converts energy from kinetic to electromagnetic, and stores it for use by the RSL10 SIP. Each time the button is pressed the fully integrated energy harvesting solution generates 300 µJ. This is enough to meet the extremely low power requirements of the RSL10 SIP, which is just 62.5nW in deep sleep and only 10 mW when transceiving.

Wiren Perera, who heads IoT at ON Semiconductor said: "Energy harvesting is becoming increasingly important for IoT deployments since it eliminates the need for power delivery, battery costs and replacement costs coupled with its inherent eco-friendliness. Based on the industry's lowest power Bluetooth radio, the Energy Harvesting Bluetooth Low Energy Switch is the perfect starting point for self-powered Bluetooth IoT applications. Along with the reference hardware design, ON Semiconductor provides a firmware suite, which can be customized using the RSL10 Software Development Kit (SDK)."

The Energy Harvesting Bluetooth Low Energy Switch is compatible with the ON Semiconductor IoT Development Kit and Bluetooth Low Energy IoT Development Kit, which include a comprehensive portfolio of sensors, connectivity and actuator devices.

For more information, visit www.onsemi.com.

CDE introduces DC Link Capacitor Modules for Large Inverter Systems
Posted: 2018-11-13
Type MDL DC Link Capacitor Modules apply advanced technology for long life and high reliability.

Cornell Dubilier has announced a new series of DC link polypropylene film capacitor modules aimed at high-power inverters.  The MDL series offers capacitance values ranging from 600 µF to 4,200 µF, with applied voltages of 900 Vdc to 1,300 Vdc. 

Designed as an alternative to banks of cylindrical bus-mounted capacitors, these modules have higher energy density and simplify bus connections by reducing the number of terminations.  By using a single DC Link capacitor in a compact rectangular package, smaller inverter topologies are possible.  The use of one capacitor versus several parallel-banked capacitors typically results in enhanced system reliability with lower assembly costs.  The MDL series also features long life, meeting a 5,000-hour life test at rated voltage, with a core temperature of 85 °C.  This translates to a life of 200,000 hours when operated at a 60 °C ambient at full rated voltage and ripple current.  

The MDL series is based on CDE’s well proven DC Link film technology utilizing low-loss, high-grade polypropylene dielectric.  Featuring current ratings up to 400 Arms these modules are well suited for high-power inverters used in commercial and utility-scale wind, solar and fuel cell systems.  Other applications include UPS, switching power supplies and large motor drives.

For more information on this series visit:  www.cde.com/mdl  

Texas Instruments: The new 60GHz mmWave sensor is now available
Posted: 2018-11-9

To advance mmWave sensor technology in worldwide industrial applications, Texas Instruments announces its 60 GHz sensor portfolio, its highest resolution single-chip, complementary metal-oxide semiconductor (RFCMOS) designed for industrial systems.

With new 60 GHz mmWave sensors, engineers worldwide now have unrestricted options for integrating mmWave technology into limitless building automation, factory automation and industrial transportation designs.  

Key features and benefits:

  • Intelligent autonomy at the edge which provides real-time decision making
  • Provides up to 4GHz of ultra-wide bandwidth
  • Includes antenna-on-package, shrinking board size and removing traditional challenges of RF design
     
50 Megapixel CCD Image Sensor from ON Semiconductor Targets Inspection of Smartphone Displays
Posted: 2018-10-30
New KAI-50140 matches modern smartphone display aspect ratios, combines high resolution with exceptional image uniformity

ON Semiconductor, driving energy efficient innovations, is enabling more efficient inspection of smartphone displays with the introduction of a new 50 megapixel (MP) resolution charge-coupled device (CCD) image sensor. As the highest resolution Interline Transfer CCD image sensor commercially available, the KAI-50140 provides the critical imaging detail and high image uniformity needed not only for inspection of smartphone displays but also circuit board and mechanical assembly inspection as well as aerial surveillance.

The KAI-50140 is designed in a 2.18 to 1 aspect ratio to match the format of modern smartphones, reducing the number of image captures required to inspect a full display. The 4.5 µm Interline Transfer CCD pixel used in the KAI-50140 provides high resolution with a true electronic (global) shutter while preserving critical imaging performance. The new device supports frame rates up to 4 fps through the use of flexible 1, 2, or 4 output readout architecture, and shares the same pin definitions as both the popular 29 MP KAI-29050 and KAI-29052 as well as the KAI-43140 image sensors. This allows the KAI-50140 to be incorporated into existing camera designs with only minor electrical changes - speeding time-to-market for adoption of the new device.

"As the specifications and aspect ratios of smartphone displays continue to expand in both physical size as well as pixel density, we were compelled to develop an image sensor designed specifically for inspection of these devices," said Herb Erhardt, Vice President and General Manager, Industrial Solutions Division, Intelligent Sensing Group at ON Semiconductor. "The unique combination of high resolution, unmatched image uniformity, and 2.18:1 pixel arrangement provided by the KAI-50140 enables higher quality, more efficient inspection of modern smartphone displays."

The KAI-50140 is sampling today with production planned by the end of 2018, and is available in a ceramic PGA package in both monochrome and Bayer Color configurations. For more information, visit www.onsemi.com.

ON Semiconductor Announces Industry's First CE Certification for Sigfox Verified RF System-in-Package Solution
Posted: 2018-10-24
All-in-one Sigfox SiP is optimized for LPWAN IoT applications without requiring additional components or certification

ON Semiconductor, driving energy efficient innovations, has achieved CE certification for its AX-SIP-SFEU System in Package (SiP) solution. This means that the device conforms to health, safety and environmental protection standards for products sold within the European Economic Area.

The AX-SIP-SFEU provides ready-to-use Sigfox connectivity (uplink and downlink) for industrial IoT applications including building and home automation as well as sensor and asset tracking. Greatly simplifying supply chain and improving overall device quality through integration, the SiP includes a Sigfox radio IC, discrete RF matching, all required passive components, and firmware into a single, miniature solution. The RF transceiver is Sigfox verified for the RC1 zone network.

Housed in a tiny 7 mm x 9 mm x 1 mm conformally coated package, the AX-SIP-SFEU occupies just 10 percent of the space of a PCB module-based solution, allowing it to be deployed in space-constrained, remote IoT applications. The ultra-low power design has standby, sleep and deep sleep mode currents of just 0.55 milliamps (mA), 1.2 microamps (µA) and 180 nanoamps (nA) respectively, allowing the device to be powered from the type of small battery that is typically found in IoT applications.

Device connection for the AX-SIP-SFEU is through a Universal Asynchronous Receiver Transmitter (UART) interface. AT commands are used to send frames and configure radio parameters; an API variant is available for customers wishing to write their own software to have a true single-chip solution.

Commenting on the release Ryan Cameron, Vice President and General Manager of Industrial and Off-line Power Division, ON Semiconductor, said, "The CE certification for the AX-SIP-SFEU is a significant step forward for long-range wireless applications. Since its release, it has been successful in allowing designers to deliver extremely small, low power Sigfox-equipped IoT solutions to the market. As it requires no external components and carries all relevant approvals and Sigfox verification, the SiP dramatically reduces design risk, speeds up time-to-market, and simplifies supply chains."

For more information, visit www.onsemi.com.

 

Microchip: Extend Battery Life in Portable Devices with New Ultra-low Iq LDO
Posted: 2018-10-24
Device prolongs battery life up to four times longer than traditional ultra-low Iq LDOs

Portable electronic devices are now expected to run for months or even years on a single battery, making minimizing power consumption in these applications a top priority for product designers. Microchip Technology Inc. today introduced a linear Low Dropout (LDO) regulator that extends battery life in portable devices up to four times longer than traditional ultra-low quiescent (Iq) LDOs. With an ultra-low Iq of 250 nanoamps (nA) versus the approximately 1 uA operation of traditional devices, the MCP1811 LDO reduces quiescent current to save battery life, enabling end users to recharge or replace batteries less often.

Ideal for IoT and battery-operated applications such as wearables, remotes and hearing aids, the 250 nA ultra-low Iq reduces power consumption in applications by minimizing standby or shutdown current. Reducing standby power consumption is critical in remote, battery-powered sensor nodes, where battery replacement is difficult and operating life requirements are high. Available in package options as small as 1 x 1 millimeter (mm), the MCP1811 consumes minimal board space to meet the needs of today’s compact portable electronic designs. Depending on the application and number of LDOs, designers can take advantage of the extra board space with a larger battery to further increase battery life.  

“Microchip continues to invest in bringing innovative power management devices to market that enable designers to extend battery life in applications,” said Rich Simoncic, vice president of Microchip’s Analog, Power and Interface business unit. “As the prevalence of small battery-powered devices continues to grow, the MCP1811 LDO offers developers a way to increase efficiency in applications without compromising on board space.” 

An additional benefit the MCP1811 offers is faster load line and transient response when compared to other ultra-low Iq LDOs. Faster response times can accelerate wake-up speed in devices such as monitors or sensors that require immediate attention. Faster transient response can help designers avoid undervoltage and overvoltage lockout measures used in sensitive applications where transient spikes can lead to catastrophic results.

For more information, visit the Microchip website at www.microchip.com.

Flex Power Modules boosts portfolio for RFPA applications with PKB-D 250W DC-DC converter
Posted: 2018-10-17
  • High density converter ideal for Radio Frequency Power Amplifiers using GaN Transistors
  • 50V/5A/250W available in industry standard eighth-brick format

Flex Power Modules announces the PKB4216HDPI, the latest model in its series of DC-DC converters aimed at Radio Frequency Power Amplifier (RFPA) applications in the telecom market segment. Following on from the recently introduced 750W PKJ4000 series, the PKB-D is a high-density converter in the industry standard eighth-brick format with an output of 50V at 5A, and an input voltage range of 36 to 60V. This makes it ideal for 50V GaN based RFPA’s and also high voltage LDMOS applications.

The PKB4216HDPI has a wide output voltage adjustment range of 40 – 55VDC allowing for easy optimization of the connected RF section, with typical efficiency peaking at 94.5% at 48Vin and full load. Comprehensive protection is provided including short-circuit, overload, over-temperature, output over-voltage, and input under-voltage. Start-up into pre-biased loads is guaranteed, and the isolation rating is 2250VDC from primary to secondary. A remote on/off control is provided with optional positive or negative logic.

The part is available with a baseplate option for conduction cooling inside sealed enclosures with no airflow, typical of RFPA applications. This allows full-power operation at up to 85°C baseplate temperature, and up to 4A / 200W output at 100°C baseplate temperature. The full operating temperature range for the device is -40°C to +125°C, with excellent derating characteristics.

The half-bridge design of the PKB4216HDPI features the latest PWM controller technology with a high level of integration for low component count and high reliability. Synchronous rectification contributes to cutting-edge efficiency performance leading to high power density and extremely high reliability figures of up to 10.68 Mhrs.

“The PKB4216HDPI is an exciting addition to our range of RFPA power converters,” explained Olle Hellgren, Head of Business and Product Management at Flex Power Modules. “With OEM’s involved in 5G seeing global design wins and imminent roll out, together with the use of GaN and new-generation LDMOS transistors, the PKB4216HDPI is an ideal fit as a power source. The part will also find applications in the Internet of Things, mobile back- and front-haul, and in-building wireless communication infrastructure, as well as Power over Ethernet (PoE) applications.

The new PKB4216HDPI module has been designed and manufactured by Flex Power Modules to deliver the levels of quality and performance that power system designers have come to expect for their system designs.

For more information, visit flex.com.
 

CUI Inc - Absolute Encoder Series Adds Multi-Turn Output Option
Posted: 2018-10-16

CUI’s Motion Group today announced that its AMT21 series of absolute modular encoders has added models with multi-turn output capability. Offering 12 bits or 14 bits of absolute position information, the multi-turn AMT21 series implements a 14-bit signed number turns counter for applications rotating beyond 360 degrees. These features provide users with the ability to keep track of position even during power down conditions, while the turns counter can be maintained via a battery backup, eliminating the need for a homing sequence.

Based on CUI’s patented capacitive ASIC technology, the AMT21 series is highly durable and accurate with resilience to the dirt, dust, and oil typically found in motion applications. Its high-speed RS-485 protocol for fast and low latency position data is accompanied by a low current draw of 8 mA at 5 V and a compact package with locking hub for ease of installation. Boasting accuracy of ±0.2 mechanical degrees, the AMT21 series further carries an operating temperature range from -40 to +105°C in either radial or axial orientations.

The digital nature of the AMT21 series also allows users to configure the alignment via CUI’s AMT Viewpoint™ GUI or the encoder’s RS-485 protocol. Additionally, the digital interface of the AMT21 encoder can be used to set addresses for multiple encoders sharing the RS-485 bus.

For more information, visit www.cui.com

Micrometals Introduces New EQ Distributed Gap Cores for High Frequency Switch-Mode Power Applications
Posted: 2018-10-15

Micrometals, a leader in high performance core solutions for power applications, is proud to introduce its new series of EQ distributed gap cores.  The rectangular geometry of the EQ body is ideal for surface mount applications while the round center post readily accepts helical flat wire coils, or bobbins with round wire.  The cores are offered in six industry standard geometries from 20mm to 50mm, three exclusive material formulations, and three reference permeability values.

The new EQ geometries are available in Micrometals exclusive material formulations of Sendust (MS), Hi-Flux™ (HF) and FluxSan™ (FS - Iron Silicon) with 26, 40 or 60 permeability values.  These uniquely formulated materials offer a combination of high saturation magnetization and low losses, making them well suited for switching applications up to 1MHz. The distributed gap nature of these materials means that they can be used with little or no center-leg gap, greatly reducing the losses associated with fringing flux at higher frequency.  EQ cores offer several key advantages over toroid or E core geometries including better self- shielding and high winding density.

 

Jim Cox, Micrometals President commented “Micrometals has a long history of providing the most trusted and reliable powder formulations, and consistently delivering uncompromising performance in every core we deliver.  These new EQ shapes will allow our customers to achieve new levels of performance and efficiency in a very compact package.”

The EQ series offering has been incorporated into the Micrometals Online Inductor Design Tool, for facilitating material selection and design optimization - www.micrometalsapc.com/design-software  

Micrometals can also provide customized sizes and materials blends.  More information can be found at www.micrometalsapc.com.

CUI Upgrades External Power Supply Line to Meet New IEC 62368-1 Standard
Posted: 2018-10-2

CUI’s Power Group today announced that it has upgraded the majority of its external ac-dc power supplies to the new IEC 62368-1 standard for ICT and AV equipment. Set to supersede the outgoing IEC 60950-1 and IEC 60065 standards on December 20, 2020, IEC 62368-1 will introduce fundamentally different guidelines based on hazard-based safety engineering principles. This means that IEC 62368-1 is more significant than a simple merger of the two standards and represents an important transition for designers of ICT and AV equipment.

Similar to the past standards, IEC 62368-1 will apply not only to the end system, but also to components such as external power supplies. CUI’s newly compliant line ranges from 3 W to 250 W in wall plug-in, multi blade, and desktop versions, all available with a variety of dc output plug options. The models also meet the latest global efficiency standards, including US DoE Level VI and the EU’s voluntary CoC Tier 2 requirements.

“CUI’s mission is to provide our customers with products and tools that prepare them for the latest safety regulations and industry standards,” stated Jeff Schnabel, VP of Global Marketing at CUI. “This is why CUI has upgraded many of our power supply models to 62368-1 well ahead of the December 2020 deadline, while further developing resources such as our IEC 62368-1 whitepaper to keep customers informed,” Schnabel concluded.

Texas Instruments: Isolated voltage sensing, like never before
Posted: 2018-10-1

Compromise is a thing of the past — with the ISO224, you can now design with all the benefits of reinforced isolation, with higher working voltages and longer lifetimes. Increase system stability and accuracy of measurements over an extended temperature range, all while reducing board size for compact designs.

Additional resources:

ISO224 features:

  • High reliability and longer system lifetime with reinforced isolation of 7 kVPK per VDE 0884-11 and 5 kVRMS isolation for 1 minute per UL1577
  • High accuracy measurements with ±0.3% Gain error, ±0.01% non-linearity ±5 mV input offset over extended temperature range of -55 to 125°C (ISO224B)
  • Fast system response with 275 kHz output bandwidth
New Digital Signal Controller (DSC) Accelerates DSP Performance for Time-Critical Control Applications
Posted: 2018-9-25
dsPIC33CK is Microchip’s highest performance single-core DSC in an ultra-small package

System designers looking for digital signal processing power with the design simplicity of a microcontroller (MCU) can now utilize a new family of 16-bit Digital Signal Controllers (DSCs) from Microchip Technology Inc. (Nasdaq: MCHP). Designed to deliver faster deterministic performance in time-critical control applications, the new dsPIC33CK DSCs have expanded context selected registers to reduce interrupt latency and new, faster instruction execution to accelerate Digital Signal Processor (DSP) routines. This dsPIC33CK single-core family complements the recently announced dsPIC33CH dual-core family based on the same core.

With 100 MIPS performance, the core delivers almost double the performance of previous single-core dsPIC® DSCs, making it ideally suited for motor control, digital power and other applications requiring sophisticated algorithms such as automotive sensors and industrial automation. It has been designed specifically for controlling multiple sensorless, brushless motors running field-oriented control algorithms and power factor correction.

The new DSCs are also designed to ease functional safety certification required by many automotive, medical and appliance applications where safe operation and shutdown in failure situations are critical. The devices include integrated functional safety features for safety-critical designs such as: RAM Built-In Self-Test (BIST) for checking RAM health and functionality; Deadman Timer for monitoring the health of application software through periodic timer interrupts within a specified timing window; Dual Watchdog Timers (WDT); Flash Error Correction Code (ECC); Brown Out Reset (BOR); Power On Reset (POR); and Fail Safe Clock Monitor (FSCM).

“Microchip’s 16-bit DSCs are highly efficient with minimal delay or latency into the system, and this new core is our best yet,” said Joe Thomsen, vice president of Microchip’s MCU16 business unit. “The feature set and performance make the dsPIC33CK family ideal for time-critical functions such as controlling the precise speed or rotation of a motor, as well as safety-critical functions to ease functional safety certification and ensure dependable operation.”

The dsPIC33CK family features a CAN-FD communication bus to support new automotive communication standards. It comes with a high level of analog integration including high-speed ADCs (3.5 Msps), analog comparators with DACs, and operational amplifiers, enabling motor control applications with smaller footprints and lower bill of material costs. The DSCs include a 250 ps resolution PWM which is ideal for advanced digital power topologies. Live update of firmware (with up to 2 × 128 KB blocks) is also offered to support high-availability systems, especially important for digital power supplies.

For more information, visit the Microchip website at www.microchip.com.

CUI Inc: Waterproof Speakers with Compact Frame Sizes Carry IP67 Ratings
Posted: 2018-9-18

CUI’s Audio Group today announced the addition of several waterproof micro speaker models, with Ingress Protection (IP) ratings of IP67, to its CMS product family. Housed in compact packages measuring as small as 15 x 11 mm with profiles as low as 2.5 mm, these waterproof speakers are ideal for portable and handheld electronic devices subject to the moisture and environmental contaminants found in industrial and outdoor applications.

These rectangular frame models feature sound pressure levels (SPLs) ranging from 90 to 93 dB at 0.1 meters, nominal inputs of 0.7 W, resonance frequencies from 550 to 800 Hz, and impedance ratings of 6 or 8 ohms. All series further offer spring contact, solder pad, or wire lead mounting styles and are constructed with Neodymium magnets and mylar cones for added durability.

For more information, visit www.cui.com.

Powerbox Announces Precharger Solution for Railway Applications at Innotrans 2018
Posted: 2018-9-13

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the introduction of its ENR1000-PC series precharger unit designed to deliver peak power to high capacitive loads in railway applications. The precharger converts the battery nominal bus voltage of 50VDC up to 137.5VDC to a regulated output voltage of 400VDC or 600VDC to charge high voltage capacitor banks used to switch electric valves actuators such as for unlocking and lifting pantographs. The ENR1000-PC series delivers a peak power of 1000W, is able to charge a load of 5 to 35mF in two seconds and automatically switches to standby mode when charging is completed. The ENR1000-PC series is part of PRBX’s Enhanced Rail Power Solutions (PRBX-ERPS).

Within operating input voltage range as wide as 50VDC to 137.5VDC, the ENR1000-PC series is covering the 72V, 96V and 110V system voltages according to EN50155. The series comprises two models:

  • The ENR1000D110/400-PC is delivering 400VDC is able to charge a capacitance load of 5 to 35mF. The unit sustains a maximum voltage of 137.5VDC, a 154VDC transient voltage and an external output reverse voltage of a maximum up to 5.8kVDC.
  • The ENR1000D110/600-PC is delivering 600VDC to 10 to 12mF capacitive loads. The unit sustains a maximum voltage and transient of 130VDC and an external output reverse voltage of a maximum up to 2.5kVDC.

The ENR1000-PC series includes overvoltage, overload, short-circuit and thermal protection. Designed for indoor and outdoor applications, the ENR1000-PC series can be operated within a wide range of temperature from -40 to +70 degrees C, EN50155 temperature class TX and up to +85 degrees C in storage conditions.

The product will be presented at Innotrans 2018 in Berlin, 18 – 21 September 2018. Meet us in Hall 17, Booth 103.

ON Semiconductor Expands Bluetooth® 5 Radio Family with System-in-Package (SiP) Module
Posted: 2018-9-11
Bluetooth Certified and EEMBC® ULPMark™ validated, the 6 x 8 x 1.46 mm SiP features integrated antenna for accelerated design and market introduction

ON Semiconductor, driving energy efficient innovations, has extended its RSL10 family of Bluetooth 5 certified radio System-on-Chips (SoCs) with a ready-to-use 6 x 8 x1.46 mm System-in-Package (SiP) module. Supporting Bluetooth low energy wireless profiles, RSL10 devices can be easily designed into any "connected" application including sports / fitness or mHealth wearables, smart locks and appliances.

The RSL10 SIP features a built-in antenna, RSL10 radio, and all required passive components in one complete, miniature solution. Certified with the Bluetooth Special Interest Group (SIG), the RSL10 SIP significantly reduces time-to-market and development costs by removing the need for any additional RF design considerations.

With the two megabits per second (Mbps) speeds possible with Bluetooth 5 alongside the industry’s lowest power consumption, the RSL10 family provides advanced wireless functionality without compromising battery application life. RSL10 consumes just 62.5 nanowatts (nW) while in Deep Sleep mode, and 7 milliwatts (mW) peak receive power. RSL10’s energy efficiency was recently validated by the EEMBC’s ULPMark where it became the first device in the benchmark’s history to break 1,000 ULP Marks and produced Core Profile scores more than twice as high as the previous industry leader.

"With its best-in-class power consumption, it's not surprising that RSL10 has already been selected for use in a number of applications including energy harvesting and industrial IoT," said Michel De Mey, senior director and general manager of Hearing, Consumer Health, and Bluetooth Connectivity solutions at ON Semiconductor. "By adding a new System-in-Package that significantly reduces design efforts, costs and time-to-market, the possibilities for RSL10 are endless."

For more information, visit www.onsemi.com.

PSMA Publishes Technology Report: 3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies
Posted: 2018-9-6
Comprehensive report is the first to address higher power embeddable passives that will accelerate the development of higher density power sources using new, 3D disruptive packaging technologies

The Power Sources Manufacturers Association (PSMA) Packaging Committee announces the publication of its latest report titled, “3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies.” This is the third in a series of reports focused on using embedded substrate technology for building power sources. It is the first extensive study of embeddable passive components both available and in development for use in the power path of power sources. The report contains extensive research and product illustrations geared to an audience of technology executives and design engineers.

Miniaturization of passive components without compromising their power handling and efficiency and their integration with actives has always been a key focus for power packaging. There is also an increasing trend to vertical or 3D package integration to address the performance issues by eliminating parasitics from interconnections. Embedding gives lowest package inductance and enables co-integration of power systems and drivers in a single package with direct interconnection between gate driver circuits and switches with shortest interconnection length. This has become even more important with the rapid emergence of wide bandgap power switching devices. This, however, leads to several process integration and reliability challenges that need to be systematically addressed.

Georgia Tech Packaging Research Center, under contract from PSMA systematically surveyed the recent advances in passives, active embedding and 3D passive-active integration to generate this report, with emphasis on 3D power packaging enabled by advances in passive components and embedding of actives in power packages. A detailed literature study was conducted on key advances in embedded passive technologies and related topics. Emerging nanomaterials, processes and technologies are described in detail for inductors, capacitors and resistors. Nanostructured materials provide additional degrees of freedoms in enhancing the properties to improve the performance metrics such as volumetric density and efficiency of the components. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted in advancing the components to improve performance. Industry leaders were surveyed to get the recent technology advances in each category. Roadmaps are projected for passive component advances and active embedding technologies.

The trends and roadmaps in 3D power packaging are also described in three categories: low power (1-100 W), medium power (100-1000 W) and high power (10-100 kW). Integration in each category is classified into lead-frame-based, substrate-embedding based and traditional ceramic substrates. Active embedding with panel-scale substrate manufacturing is also reviewed in detail. Recent innovations in substrate materials and associated reliability challenges such as via cracking, dielectric cracking or electric breakdown are highlighted. Advances in die-attach solutions with sintered nanocopper are reviewed, highlighting the evolution of low-stress sintered copper-based die-attach solutions.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded passives in 3D power packaging to create the significantly higher power densities.

The PSMA report on 3D packaging was provided free of charge to PSMA Regular and Associate Company members.  Additional copies may be purchased at the member price of $290. PSMA Affiliate members may also purchase the report for $290. The report is available to non-members for purchase on the PSMA website (www.psma.com/publications) for the price of $3,490.

Provided by the PSMA Packaging Committee.

Brian Narveson
Co-chairman
  Brian Narveson   Ernie Parker  
Ernie Parker 
Co-chairman

 

Vicor White Paper: Designing Rapid-start Applications that Never Fail
Posted: 2018-6-28
Three keys to designing rapid-start power supplies

Design of a rapid-start, isolated power system presents unique challenges. These systems, leveraged in rapid-start applications, need to start in milliseconds - every time. For example, a growing number of vehicles use start-stop engine technology to conserve fuel and battery power at traffic signals and other situations when the vehicle is stationary.

In these applications, some electrical systems that would otherwise draw significant power while the vehicle idles may be shut down. However, those same systems need to be powered up again quickly and reliably.

This is where rapid-start systems are essential.

This whitepaper will help you with your own rapid start power system design.

Download it now to find out more.

PSMA Power Technology Roadmap 2017 Report Is Now Available
Posted: 2017-7-21
The 2017 edition includes 551 page report plus USB drive with recorded webinars covering individual sections

The Power Sources Manufacturers Association (PSMA) announces that The Power Technology Roadmap 2017 is now available for purchase by both PSMA members and non-members. This is the tenth edition in the roadmap series, which is published every two years. A preview of the report, including the Table of Contents and Foreword, is available on the homepage of the PSMA website, www.psma.com.

The 2017 report forecasts the power technology and power delivery trends through 2021 and includes a USB memory drive version containing the complete report and the graphics and the presentation in color as well as the recorded webinars which provided up-to-date industry information used in the final report. The webinar recordings add much to the report because the listener can understand the context and the subtext of the materials in the presenter's own voice.

In this edition, a new section on Component Technologies has been added. It is widely recognized that the power technology growth is strongly impacted by the growth (or lack thereof) of underlying component technologies. In prior roadmaps, the component angle was covered through the webinar presentations, but it is hoped that the addition of this new section will provide further insights and value to the readers.

The 2017 report continues with essay contributions by the industry experts on Applications Trends and Emerging Technologies. The Application Trends section covers diverse segments such as automotive, consumer, computing, lighting, motor control, medical, and portable charging. This year, an energy harvesting segment makes a debut to keep up with the changing trends in power electronics.  The Emerging Technologies section includes 3D packaging, additive manufacturing, high-frequency magnetics, integrated magnetics and use of nanofluids in electronic cooling. There is much valuable information in these essays. 

"The end result of the webinars, surveys, presentations and discussions is a comprehensive report by the PSMA that offers a consolidated view of the latest trends in the power management, power control and power delivery technologies," said Dhaval Dalal, Co-Chair of the organizing committee. "This latest edition of the PTR provides the most extensive, forward-looking view of our industry. It is an invaluable resource for any organization involved in the power electronics technology marketplace."

"Power electronics technology has emerged, or should we say re-emerged, as an enabling technology in its own right. Part of our industry is now shaping the technology for a large part of the electronics industry." said Conor Quinn, Co-Chair of the organizing committee. "The breadth and depth of the information in this report is unprecedented and together captures the technical trends and issues facing the power sources industry. We hope industry professionals will find our 2017 report useful, thought provoking and valuable."

A copy of the printed and USB memory drive versions of 2017 PSMA Power Technology Roadmap has been sent to PSMA Regular and Associate member companies as a benefit of their membership. Additional copies may be purchased at the member price of $190. PSMA Affiliate members may also purchase the report for $190. The report will be available to non-members June 15 for purchase on the PSMA website (www.psma.com) at the price of $2,990.

PSMA Publishes Technology Report: “Current Development in 3D Packaging With Focus on Embedded Substrate Technologies”
Posted: 2015-3-17
Comprehensive report is the first to address “More than Moore” digital power demands by accelerating the development of higher density power sources using new, disruptive packaging technologies

March 16, 2015—The PSMA (Power Sources Manufacturers Association) Packaging Committee announced today that it has published a report titled “Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies.” The first comprehensive study on using embedded substrate technology for building power sources, the report contains extensive research and product illustrations geared to an audience of technology executives and design engineers. Its purpose is to offer an in-depth industry perspective on how currently available materials and processes can be best used for the creation of advanced high-efficiency, high-power-density power products.

The PSMA created the 3D packaging report to address the pressing demands in the power industry to accelerate the development of higher density power sources. The first challenge arose from digital semiconductor packaging technology hitting a “cost barrier” brought about when advanced deep-submicron semiconductor technology could no longer reduce cost with the addition of more functions to the semiconductor die. This barrier was circumvented through the development of wafer thinning that enabled through-silicon-via (TSV) technology and the eventual introduction of 2.5D and 3D integration, which facilitated heterogeneous (“More than Moore”) integration. This integration allowed the power requirements of the digital load to increase two to five times, within the same footprint, in a single generation. Now the power industry is tasked with finding ways news ways to package power sources that will meet this demand, but without increasing footprint.

In parallel, power semiconductor technology is facing a “construction barrier” that prevents the realization of the significant benefits new technology can offer in terms of increased power efficiency and higher power density.  These new technologies, including gallium-nitride (GaN), silicon-carbide (SiC), and gallium-arsenic (GaAs) power semiconductor devices, all require operation in a package that is free of bond wires and that minimizes parasitic interconnect elements. Both of these challenges can be addressed with power packaging utilizing embedded substrate technologies and are addressed in the report.

The PSMA’s 340-page report, prepared under contract by LTEC Corporation with work subcontracted to Anagenesis and Fraunhofer-Institute, is based on the Packaging Committee’s extensive research of over 750 articles and papers, analysis of 450 presentations/papers, and by conducting 30 industry expert interviews. Information was also derived from attendance at 10 industry conferences, workshops and seminars. The report contains 172 links and 394 citations.
The report provides detailed analysis of substrates (organic and inorganic), components (actives and passives), thermal management, high temperature die, packaging technologies, interposers, as well as additive manufacturing and laser fabrication. Each passive component (resistors, capacitors, inductors) has an entire chapter detailing which suppliers are currently shipping products usable in power sources.  Every chapter covers manufacturing issues and includes references to contract manufacturing companies already producing power products utilizing embedded substrate technology. Embedded substrate packaging leverages the large investment made by the digital industry in advanced packaging technologies and is being used to resolve the power source construction challenge. As the report demonstrates, 3D power packaging using embedded substrate technology is a disruptive technology, in that it enables large increases in power density and efficiency.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the  challenges companies will face to implement embedded substrate 3D power packaging to create the significantly higher power densities driven by the “More than Moore” digital power demands.”

The PSMA report on 3D packaging will be provided free of charge to PSMA Regular and Associate members.  Affiliate members can purchase the report for the reduced price of $190.  Others interested in the report may order a copy from PSMA for $2,990. 
 

Power Sources Manufacturers Association Reprints Classic Magnetics Text
Posted: 2011-7-25

 

MENDHAM, N.J. – June 23, 2011 − The Power Sources Manufacturers Association (PSMA) announced that it is again making available Nathan Grossner's classic treatise, Transformers for Electronic Circuits - Second Edition. The first reprint of this work sold out and this second reprint is now available. PSMA members may now purchase this important text online, directly from PSMA, at the discounted price of $55. The non-member PSMA online price is $75. Non-members may also purchase it through How2Power or through Amazon. This text is a complete, one-stop guide to transformer and inductor design and applications for everyone who designs, builds, or uses power magnetics components. Throughout this book, the author combines analysis and synthesis and all theory is related to the solution of real-world problems.

Sections of the text provide guidance in the use of transformers and inductors in power electronics and in digital and pulse circuits. Also included is design information about other forms of high-frequency magnetics such as transmission-line transformers, hybrid transformers, ferroresonant tranformers, flyback converter magnetics and inductors used in switch-mode power converter designs.

Special attention is given in the book to the proper control of dielectric stress, corona and thermal factors in high-voltage magnetics designs. Modeling methods for magnetic parts are also included and treated in some detail. This book is an essential reference book for any engineer involved in the design and development of modern-day magnetic components.

According to Steve Carlsen, co-chair of the PSMA Magnetics Committee, “Grossner's book should be an essential part of every power supply designer’s technical library. The initial PSMA reprint edition sold out and thanks to PSMA, it is once again available after being out of print for several years.”

PSMA Answers Continued Demand for Snelling Magnetics Text with 2nd Reprint
Posted: 2010-10-4

Mendham, New Jersey—June 1, 2010—The Power Sources Manufacturers Association (PSMA) has announced the renewed availability of SOFT FERRITES – Properties and Applications - Second Edition, authored by Eric Snelling. The book had been out of print for several years and was reprinted in limited quantity by the PSMA in 2006. Due to continued demand, a second reprinting is now available. The book was initially published in 1969 and was extensively revised by Snelling in 1988 to bring all eleven chapters in line with current design practices and applications of ferrite cores used in modern-day inductors and transformers. The aim of this unique 366-page reprint is to provide all the information on ferrite properties and wound-component design necessary for efficient applications of these materials. Data in the book are represented by means of extensive use of graphs and tables, and design procedures are supported by many working examples of inductors and transformers. According to Stephen Carlsen, PSMA Magnetics Committee Chair, “Snelling’s book is considered by many working design engineers as the ‘ferrite user’s bible’ and PSMA is pleased to make this wonderful text available once again.” Copies of Snelling’s classic treatise on magnetics, SOFT FERRITES – Properties and Applications - Second Edition, are available for sale at www.psma.com. The cover price for the reprint is $150 but PSMA members, as a benefit of their membership, can purchase the text for $100. The PSMA-reprint text is also available at the non-member price at www.amazon.com.

PSMA Announces Availability of On-Line Energy Efficiency Standards Database
Posted: 2009-4-12
Database offered as a free service to the industry; provides “one-click” access to details of standards by world region, agency and application.

Mendham, New Jersey — April 9, 2009 — The Power Sources Manufacturers Association (PSMA) announces availability of its On-line Energy Efficiency Database (EEDB) as a service to the industry. The number of energy efficiency standards and the world wide agencies that generate them continue to grow daily. It is time consuming for an individual or company to keep track of the many actions and activities by government and industry groups. The PSMA on-line energy efficiency standards database provides “one click” access to the very latest global standards and initiatives.

As a result of user feedback on an earlier version of the database, PSMA has incorporated a number of improvements. Some of the useful features:

•Quick access to world region, agency, or standards application
•Expanded data includes list of specific standards generated by an agency and parametric specifications for each regulation
•Expanded description of regulations and agencies
•Enhanced descriptions that include html code for quick linking to agency site or database location
•Latest schedule of standards meetings

Dusty Becker, PSMA Board Chairman and chair of the PSMA Energy Efficiency Committee, states that "The PSMA On-line Energy Efficiency Data Base, which incorporates a number of improvements suggested by product planners to keep current, is a valuable resource for engineers. We are pleased to offer this resource free of charge to our membership and to the industry."

Though access to the PSMA EEBD is free, users are required to register on www.psma.com/green/ so PSMA can provide notice of special database announcements and associated PSMA activities.

About PSMA

PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its membership which includes most major power supply companies.

PSMA Announces Reprint Availability of J. K. Watson's “Applications of Magnetism”
Posted: 2008-2-4
New reprint is the fourth title in PSMA's out-of-print Classic Book Series

MENDHAM, N.J. - February 4, 2008 ─ The Power Sources Manufacturers Association (PSMA) is pleased to announce availability of a reprint of the classic book "Applications Of Magnetism" authored by the late J. K. Watson and originally published by John Wiley and Sons in 1980. According to Ed Bloom "This classic book, written by one of the most respected teachers in the field of magnetics, makes the principles of applied magnetics accessible to the practicing electronics engineer. With emphasis on practical design, the text presents the relevant principles of physics, circuit analysis, simple models and the calculations involved in designing a circuit or a magnetic device. No prior knowledge of the physics of magnetism is assumed ─ material properties are explained in a step-by-step manner, with special attention to their effects on the volt-ampere characteristics of a magnetic device, and to the physics of magnetic domain processes. Applications of magnetics, including those associated with power electronics circuits, are covered as well as reluctance modeling methods for transformers and inductors." Copies of this practical design treatment of magnetics will be available for sale at this year's Applied Power Electronics Conference (APEC 2008) to be held in Austin, Texas, February 24-28, 2008 and through the PSMA web site - www.psma.com. Copies will sell for US$100, but members of PSMA companies can obtain a copy for US$50. To order directly from PSMA please complete the "members order form" or the "non-members order form". In the past three years, PSMA has reprinted three other classic books on magnetics including Transformers for Electronic Circuits by the late Nathan R. Grossman, Soft Ferrites - Properties and Applications by E.C. Snelling and Electronic Transformers and Circuits by the late Reuben Lee and associates. A limited number of the Snelling and Lee books are still available through www.psma.com. About PSMA PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants, interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization, whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its members, which include most major power supply companies.

PSMA Announces Latest Edition of Standardized Terminology Handbook
Posted: 2007-10-6
Third edition includes print and CD versions; provides comprehensive resource of power sources industry terminology

 

 

 

MENDHAM, N.J.,—October 5, 2007—The Power Sources Manufacturers Association (PSMA) is pleased to announce publication of The Handbook of Standardized Terminology for the Power Sources Industry–3rd Edition. Revised and expanded, this unique handbook contains hundreds of added terms, especially selected for the power electronics professional. The third edition also contains illustrations and four new appendices, including a listing of EMI specifications, excerpts from international standards of units and symbols, along with guides for authors of technical papers. These added resources provide concise, easy-to-use references for engineers involved in technical writing and presentations. Many new magnetic terms are described in this new 126-page third edition that are of particular interest to the practicing designer and marketer of power supplies and related products. Valuable information regarding worldwide power sources, standards agencies, and military specifications has been retained, updated and expanded from the previous edition. Titles of the appendices are: • Testing and Standards Agencies; Designer's Reference; • World Voltages and Frequencies; • Military Specifications; • EMI Specifications; • Writing Technical Papers for Archival Publications; Units, Symbols and Style Guide; A Brief Writing Guide. The book comes in hard copy along with a CD containing a PDF version that can easily be searched for terms and words within the definitions, making it a valuable tool for posting on your internal network. The book price is $25 to PSMA members and $50 to nonmembers. To order directly from PSMA please complete the "members order form" or the "non-members order form".

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