New product announcements


KEMET Introduces the Smallest EMI X2 Film Capacitor Solution for Harsh Environments
Posted: 2021-10-27
R53 film capacitor is miniaturized, AEC-Q200 qualified and has the highest IEC robustness classification for applications requiring the highest reliability and extended life under severe, harsh environmental conditions.

KEMET, part of the YAGEO Group and leading global electronic components supplier, announces its new R53 series of miniature, polypropylene film X2 EMI (electromagnetic interference) suppression capacitors. This series fulfills the growing need for automotive, industrial, consumer, and energy applications that require a smaller, high-capacitance X2 class solution for suppressing EMI. The R53 series offers capacitance values from 0.1µF to 22µF, lead-spacing from 15mm to 37.5mmm, 85/85 THB Class IIIB classification, and long-life stability in harsh environmental conditions. Its volume, on average, is 60% smaller than competitive X2 class capacitors, enabling a smaller PCB area, reduced weight, lower costs and improved reliability. These features position R53 as an exceptional X2 class solution that addresses design engineers' size, capacitance, and reliability challenges across multiple industries.

Currently, available solutions comparable to the R53 series have either larger dimensions or require capacitors in parallel in the design. With a rated 310Vac at 50 or 60Hz, this series is intended for use in Class X2 line-to-line applications or in series with the AC mains. R53 is well-suited for AC/DC converters in onboard chargers for xEVs, smart grid hardware, EMI filtering in Variable Frequency Drivers (VFDs), LED drivers, and high energy density applications such as capacitive power supplies. R53 series features a metallized polypropylene film encapsulated in a self-extinguishing resin and a shell that meets UL 94 V-0 requirements. The metallized polypropylene film combined with an internal parallel construction provides self-healing properties to prevent catastrophic failure and extend service life.

Electronic component miniaturization and operation in harsh environmental conditions are growing in applications, such as onboard chargers, smart electric meters, capacitive power supplies, including connection in series with the mains, motor drives, wind, and solar inverters. R53 capacitors are AEC-Q200 qualified, designed for harsh environments, and meet the highest standards of reliability required for smart grid hardware, often located in limited access areas where regular service is not available.

The R53 series is available immediately via KEMET distributors. To learn more about its capabilities and applications, visit https://ec.kemet.com/film.

Power Integrations Introduces the InnoSwitch3-PD Family of Flyback Switcher ICs with Built-In USB PD Controller
Posted: 2021-10-27
A fully integrated charger solution combines USB PD, PPS, PowiGaN and FluxLink to maximize efficiency and slash component count in adapters and chargers

Power Integrations the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the InnoSwitch™3-PD family of ICs, the industry's most highly integrated solution for USB Type-C, USB Power Delivery (PD), and USB Programmable Power Supply (PPS) adapters. This compact InSOP™-24D-packaged IC includes a USB-C and PD controller, a high-voltage PowiGaN™ switch, a multi-mode quasi-resonant flyback controller, secondary-side sensing, FluxLink™ isolated digital feedback and a synchronous-rectification driver.

Aditya Kulkarni, senior product marketing engineer at Power Integrations said: “InnoSwitch3-PD ICs target designers seeking the ultimate in charger power density. This requires the highest level of integration and maximum efficiency to limit self-heating. Our latest addition to the InnoSwitch3 family dramatically simplifies the development and manufacturing of compact, energy-efficient USB PD power supplies for smartphones, tablets, notebooks, and other devices that benefit from fast charging. InnoSwitch3-PD ICs reduce the BOM count to half that of conventional designs, reducing design time and simplifying high-volume manufacture for slim, ultra-compact OEM and aftermarket chargers.”

Featuring no-load power consumption as low as 14 mW, power supply designs using InnoSwitch3-PD ICs meet all global energy-efficiency regulations. The high efficiency of these devices ensures low heat dissipation, eliminating the need for bulky heatsinks. Power Integrations’ FluxLink high-speed communications feedback link ensures fast, accurate secondary-side regulation. InnoSwitch3-PD ICs are also fully protected, with input voltage monitoring, accurate brown-in/brown-out and overvoltage protection, and output over- and under-voltage fault detection with independently configurable fault responses.

Availability & Resources

A new design report, RDR-838, describes a 60 W USB PD 3.0 Power Supply with 3.3 V – 21 V PPS output using the InnoSwitch3-PD PowiGaN-powered INN3879C-H801. The new InnoSwitch3-PD ICs are priced from $1.30 per unit in 10,000-unit quantities. For further information, contact a Power Integrations sales representative or one of the company’s authorized worldwide distributors: Digi-Key, Farnell, Mouser and RS Components.

TAIYO YUDEN's Ferrite Wire-Wound Power Inductor NR Series M-Type
Posted: 2021-10-27

Hybrid Type Power Inductor: NR Series M-Type

Enhance your device performance of industrial applications with TAIYO YUDEN’s new hybrid type power inductors for industrial applications. The NR series M-type inductors offer high anti-vibration and heat cycle resistance, along with coplanarity improvement and AOI support. Support operating temperature for up to 125°C.

Product Features

Sleeveless Structure:

  • Large electrode area for higher heat cycle resistance
  • Secure connection to PCB, less risk of open failure, high anti-vibration

Unique Core Design:

  • Improved coplanarity for less mounting risks
  • AOI (automated optical inspection) support enabled by additional side electrode

Advantages

Great Electrical Performance by Hybrid Structure:

  • Hybrid structure of molding resin and high density magnetic metal materials
  • High saturation current and stable inductance over temperature

Applications

Industrial and Automotive Applications

Details

 

Power Integrations’ New SCALE-iFlex LT Plug-and-Play Gate Driver Improves EconoDUAL IGBT Module Performance by 20%
Posted: 2021-10-27

Power Integrations (Nasdaq: POWI), the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced its new plug-and-play SCALE-iFlex™ LT dual gate-drivers. The new drivers improve the performance of multiple parallel EconoDUAL modules by 20%, allowing users to eliminate one of every six modules from power inverters and converter stacks. In addition to saving the cost of the driver and module, this reduces control complexity and costs related to modules, wiring, hardware, and heatsinking. SCALE-iFlex LT targets multiple applications in renewable energy generation and storage, and is particularly applicable to offshore wind turbines in the 3 to 5 MW range.

Thorsten Schmidt, product marketing manager at Power Integrations commented: “Dynamic and static current sharing is critical for robust operation of modules arranged in parallel. For the same power output, systems using SCALE-iFlex LT require just five parallel modules whereas competitive approaches need six. This substantial saving of cost and complexity is achieved by guaranteeing less than 20 ns of variance in turn-on and turn-off commands between modules and less than 20 A of variance between modules when conducting the rated 600 A. This allows the modules to operate reliably without current derating, which is obligatory with less advanced driver solutions.”

Up to six EconoDUAL 3, or equivalent, power modules can be paralleled from the same Isolated Master Control (IMC) unit which has a more compact outline than conventional products. The Module Adapted Gate drivers (MAGs), which fit the footprint of the EconoDUAL module, each featuring two SCALE-2 ASICs – one per channel – to optimize symmetrical paralleling, efficiency and protection.

The new SCALE-iFlex LT gate-driver modules reduce switching losses by three to five percent, due to the fast turn-on and turn-off of the SCALE-2 ASIC which features an integrated booster stage. Power Integrations’ Advanced Active Clamping (AAC) protection enables higher DC link voltages to be achieved. A full suite of other protection features, including short-circuit, are provided. Drivers feature reinforced isolation to 1700 V and may be ordered naked or conformally coated.

As well as renewable energy, other applications include power quality, commercial air-conditioning units and medium-voltage drives. The new SCALE-iFlex LT gate drivers are available now. For more information, please visit www.power.com/scale-iflex-lt.

TDK Develops Industry’s First High-Reliability Chip Beads for Automotive
Posted: 2021-9-29
  • Compatible with high durability soldering in 150 ºC environments
  • Designed for automotive applications such as ECM, ABS, EPS, EV-EHV, inverters and LED headlights

TDK Corporation today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ºC environments. This series marks the industry’s first* high-reliability chip bead specifically designed for automotive applications associated with engine control modules (ECM), anti-lock brake systems (ABS), electric power steering (EPS), electric and hybrid electric vehicles (EV/EHV), inverters and LED headlights.

In high-temperature automotive environments, such as engine compartments, high-durability solder is increasingly used to prevent solder cracks in the bonds between chip components and the mounting substrate. Since high-durability solders do not stretch easily and impart higher stress compared with conventional solders, they place a large load on chip components and do not meet the reliability requirements of existing chip beads. With improvements to the terminal electrode material and plating process, the MMZ1608-HE series improves the bonding strength between the terminal electrode and plating, making it ideal for use with high-durability solder in 150 ºC environments.

The four products in the series have a rated current max ranging from 200 to 300 at 150 ºC, DC resistance max between 0.15 to 0.5, and impedance from 120-1000, respectively.

TDK will continue to expand its lineup of compact sizes and various impedances to support a wide range of automotive specifications and designs.

For more information, visit www.product.tdk.com.

TDK announces new miniaturized, common-mode filters for high-temperature automotive applications
Posted: 2021-9-29

TDK Corporation (TSE:6762) today announced the development of its KCZ1210AH series of miniaturized common-mode filters for automotive applications. The series is extremely compact, measuring 1.25 (L) x 1.0 (W) x 0.5 mm (H), which contributes to a smaller footprint on substrate and provides a noise control function for different transmission signal lines for automobiles.

With an increase in advanced driver-assistance systems (ADAS), demands for automotive cameras are rapidly growing. Forward sensing cameras and cameras for around view monitors utilize common-mode filters as anti-noise products. However, as the conventional multilayer common-mode filter operates within a temperature range of -40 and +105℃, it cannot be used for ADAS cameras and was principally used in automotive accessories.

TDK's series uses proprietary materials technology and structural design to achieve a temperature range from -55 to +125℃; it also has a rated current max of 100 and a rated voltage max of 5. By adopting a conductive resin-based electrode, it controls product cracks due to thermal shock and increases durability against mechanical stresses, such as substrate strains.

TDK is working to enhance its inductive devices for ADAS and will expand its line of miniaturized common-mode filters supporting higher-speed differential signals. Mass-production of this series will begin in September 2021.

Further information on the products can be found under https://product.tdk.com/system/files/dam/doc/product/emc/emc/cmf_cmc/catalog/cmf_automotive_signal_kcz1210ah_en.pdf.

TDK offers miniaturized, high performance thin-film common-mode filters for mobile devices
Posted: 2021-9-29

TDK Corporation has developed the TCM0403M Series of miniaturized thin-film common-mode filters for mobile devices. The 0403 case size (0.45 x 0.3 x 0.23 mm) is 58 % smaller and 56 % lighter than previous products. With its high common-mode attenuation characteristic, these products reduce intruding noise and improve wireless signal reception sensitivity. The common mode attenuation at 2.4 GHz is 21 dB, and 28 dB at 5.0 GHz, with a maximum permissible current of 50 mA. Mass production started in August 2021.

Due to the growing multifunctionality of wireless devices such as smartphones, wearables and other mobile products, noises generated inside the devices are deteriorating wireless signals. It is critical to prevent the deterioration of signal reception sensitivity and to prevent external noise that has the potential to cause device malfunction; this series addresses those common challenges.

The products are mountable in ultra-small spaces due to their 58 % footprint reduction, which was previously impossible with the existing TCM0605 Series (0.65 x 0.5 mm case size). By improving TDK’s proprietary fine pattern technology and optimizing design, the products feature a common-mode attenuation characteristic that equals existing products and a differential transmission characteristic capable of supporting high-speed signal transmission.

TDK’s wide array of products meets the needs for common filters for high-speed differential signal lines, including for USB, MIPI and HDMI.

Further information on the products can be found under https://product.tdk.com/system/files/dam/doc/product/emc/emc/cmf_cmc/catalog/cmf_commercial_signal_tcm0403m_en.pdf.

KEMET Introduces Next-Generation Supercapacitors for Automotive
Posted: 2021-9-29

KEMET, part of the YAGEO Group and leading global electronic components supplier, announces its new high-performance supercapacitors for automotive electronics, the FMD and FU0H series. These series deliver 1,000 hours at 85°C/85% RH-rated voltage and operational temperature ranging from -40°C to 85°C. The FMD series offers the highest lifetime with up to 4,000 hours. These supercapacitors are qualified to an automotive testing protocol. These capacitors are manufactured in an ISO TS 16949 certified plant and are subjected to PPAP/PSW and change control. They are ideal for automotive applications needing a main power system backup during a power loss, such as ADAS, autonomous vehicles, and central gateway ECUs. Supercapacitors are ideal for maintaining the main power system’s real-time clock or volatile memory when it is removed, such as during a power failure or when the main power system’s battery has been removed for replacement. Additionally, these supercapacitors offer power backup in equipment ranging from IoT devices, smart meters, medical devices, and industrial computing.

Using supercapacitors for automotive electronics enables freedom from the design limits imposed by finite battery lifetimes. The supercapacitor’s benign open-circuit failure mode contrasts with typical short-circuit battery failures that may result in outgassing or ignition. Furthermore, supercapacitors are a cost-effective alternative to small backup batteries. Depending on the type of load and current demand, they can store enough energy to provide backup for durations ranging from a few seconds to several hours.

KEMET’s miniature supercapacitors use a proprietary aqueous electrolyte solution that provides high durability against liquid leakage, vibrations, and thermal shock, thus high reliability in harsh environments. Aqueous electrolytes are highly conductive, have a low environmental impact, and are non-toxic and non-flammable. Unlike a battery, supercapacitors store and release energy quickly through physical adsorption and the ions desorption in the electrolyte between its electrodes. With the supercapacitor’s low internal resistance, these devices can fully charge within a few seconds. In contrast, a secondary battery cell can take from ten minutes to several hours to fully charge. Moreover, there is no theoretical limit to the life cycle, whereas a lithium-ion secondary cell has a finite lifetime of about 500 cycles. They also typically have a greater resistance to moisture absorption than organic compounds, resulting in a longer life with better stability.

According to an Allied Market Research report, the global supercapacitor market generated $3.27 billion in 2019 and is estimated to reach $16.95 billion by 2027, with a CAGR of 23.3% from 2020 to 2027.* An increase in demand for automotive applications, renewable energy systems, and supportive government regulations is boosting the growth of the global supercapacitor market.

KEMET supercapacitors are available immediately via KEMET distributors. To learn more about their capabilities and applications, visit https://www.kemet.com/en/us/new-products.html

*Source: “Supercapacitor Market by Product Type (Double-Layer Capacitor, Pseudocapacitors, and Hybrid Capacitors), Module Type (Less Than 10 Volts Modules, 10 Volts to 25 Volts Modules, 25 Volts to 50 Volts Modules, 50 Volts to 100 Volts Modules, and Above 100 Volts Modules), Material (Activated carbon, Carbide Derived Carbon, Carbon Aerogel, and Others), and Application (Automotive, Industrial, Energy, Consumer Electronics, and Aerospace & Defense): Global Opportunity Analysis and Industry Forecast, 2020–2027."

Power Integrations Introduces Two PowiGaN ICs Combine for 30.3 W/ in3 Power Density in a New USB Charger Design
Posted: 2021-9-29

A recent Design Example Report (DER-928) describes the use of two PowiGaN-based IC products to achieve 30.3 W/ in3 power density in a 60 W USB PD 3.0 adapter that is up to 93% efficient. The combination of the new InnoSwitch4-CZ zero-voltage-switching flyback switcher IC (with its companion active-clamping ClampZero IC) and the MinE-CAP bulk capacitor miniaturization IC ushers in a new class of ultra-compact mobile device chargers.

The 1.77 in x 1.77 in x 0.63 in design can provide 5 V, 9 V, 15 V or 20 V to the output to support rapid charging of devices from mobile phones to compact laptops. It consumes less than 60 mW no-load power and requires no heatsinks.

InnoSwitch4-CZ devices incorporate a robust PowiGaN-based 750 V primary switch and work with the new ClampZero high-frequency active clamp ICs. The pair provides a steady state switching frequency of up to 140 kHz to minimize transformer size. It maintains very high efficiency across line voltage, system load and with different output voltages.

MinE-CAP ICs drastically reduce the size of high-voltage bulk electrolytic capacitors, resulting in up to 40% adapter size reduction without compromising output ripple, operating efficiency, or requiring redesign of the transformer. MinE-CAP devices work seamlessly with the InnoSwitch family of switcher ICs and require minimal external components.

To learn more, download the following documents:

 

Power Integrations PowiGaN Solutions Enable Compact Chargers for eBikes and Power Tools
Posted: 2021-9-29

Typical eBike and power tool adapters come in bulky packages, with much of their volume devoted to thick, heavy metal heatsinks that siphon away wasted energy when they are charging. InnoSwitch3-CP offline flyback switcher ICs featuring PowiGaN Technology enable heatsink-free charger designs that are smaller, lighter, have ultra-high efficiency and low no-load consumption. Thanks to PowiGaN, you can slip your charger into your backpack and charge anywhere you can find an outlet.

A new design example report, DER-915, describes a 84 W (42 V / 2 A) adapter with 160-264 VAC high-line input for eBikes and power tools. The low component-count design fits neatly on a 3.2 in x 1.9 in circuit board; that’s about the size of a bank card. It’s greater than 93% efficient and consumes less than 70 mW of no-load power at 230 VAC.

The InnoSwitch3-CP device at the heart of this design incorporates a 750 V PowiGaN switch, primary and secondary controllers, and safety-rated feedback into a single IC. It’s the ideal solution for constant power charging applications up to 100 W.

To learn more, visit our website to download DER-915 and read the InnoSwitch3-CP data sheet. You can also use PI Expert Online to kickstart your next power supply design. The browser-based software turns your specifications into a ready-to-build design within minutes.

 

Power Integration Safeguard Meters from Magnetic Tampering with New LinkSwith-XT2 Design
Posted: 2021-9-11

Utility meters need to work without interruption and often under adverse conditions. From full load to light load, through line surges, or even when being tampered with, meters require rugged and efficient power supplies to deliver power without fail. A new design example report (DER-711) addresses these challenges with a 6.6 W dual-output flyback converter using a LinkSwitch-XT2 offline switcher IC. With a low-RDS (ON), 900 V MOSFET, LinkSwitch-XT2 improves efficiency at full load, maintains efficiency at light load, and resists magnetic tampering.

Meter tampering is often done by placing a strong magnet close to the meter’s power supply to interfere with transformer inductance. LinkSwitch-XT2 features an ON/OFF control that compensates for the primary inductance reduction by increasing operating frequency to maintain output power level. The ON/OFF control enables high efficiency at light load, allowing utility providers to minimize energy consumption during normal meter operation.

No EMI or Thermal Issues

The DER-711 circuit design utilizes the high current limit of LinkSwitch-XT2 to operate at very low frequency, making it capable of withstanding severe magnetic tampering. When operating frequency increases to 60 kHz due to proximity to a magnet, the design wouldn’t incur thermal or electromagnetic interference issues. In the extreme case when a magnet is in physical contact with the transformer, the drop in system efficiency is limited to 4-6%, and IC temperature increases by merely 16°C at full load. The DER-711 board layout places the transformer in the center, maximizing distance from possible external magnetic interference.

A True Universal Design

The LinkSwitch-XT2 IC’s integrated 900 V MOSFET provides valuable safety margin for meters in regions with high and unstable mains voltage. DER-711 has an ultra-wide 85-350 VAC input range and can withstand 6 kV of differential line surge.

To learn more download DER-711

TDK develops downsized, compact, thin-film power inductors for automotive power circuits
Posted: 2021-9-11

TDK Corporation (TSE: 6762) has developed a series of thin-film metal power inductors for automotive power circuits. The new TFM201210ALMA inductors feature a mounting area downsized approximately 22 % from TDK’s conventional product, TFM201610ALMA (2.0 mm (L) x 1.6 mm (W) x 1.0 mm (H)). Mass production will begin in August 2021.

Demand has recently increased in ECU* mounting for the electrification of various automotive controlling functions, autonomous driving, information communication and other purposes. Downsized inductors for power circuits contribute to space-saving in a mounting substrate, at a time when quick advances in ADAS** performance increase the number of components typically used in system architectures.

In addition to its compact dimension of 2.0 mm (L) x 1.25 mm (W), this series uses the TDK proprietary metallic magnetic material as its core material. The thin-film inductors support a wide range of operating temperatures from -55 °C to +150 °C, the highest level in the industry***. Moreover, it features increased robustness against mechanical stress, such as vibrations and shocks due to the resin electrode structure.

In addition to the new items, TFM series includes a lineup of products with a rated voltage of 40 V, allowing use on an automotive power circuit side directly connected with a 12 V battery.

For more information see tdk.com

Functional safety compliant TI mmWave sensors
Posted: 2021-9-11
TI's mmWave radar sensors are now functional-safety compliant and follow the requirements of ISO 26262 or IEC 61508. These sensors have multiple built-in safety mechanisms to provide the required diagnostic coverage to meet a random hardware capability of ASIL-B / SIL-2 at a component level. In addition to addressing both systematic and random hardware faults, TI functional safety mmWave sensors bring in additional system benefits to customers:
 
  Reduced system complexity with autonomous monitoring capability to enhance functional safety with minimum loading on the host which reduces the need for external components
 
  Shorter time to market with component level documentation, software packages, and reference design to simplify functional safety development
 

 

Power Integration 600 V Qspeed Diodes Can Replace SiC Parts in Automotive Applications
Posted: 2021-9-11

PI’s newest AEC-Q100 qualified Qspeed diode has the lowest reverse recovery charge (Qrr) of any 600 V silicon diode. Expanding our portfolio of automotive-qualified diodes, the QH12TZ600Q diode offers the same low switching-loss performance as a silicon carbide (SiC) device without the higher price tag.

Automotive on-board charger applications require higher switching frequency to reduce volume and weight. Our QH12TZ600Q diode has a Qrr of just 14 nC at 25 °C – half the Qrr of competing silicon diodes. It improves the efficiency of power factor correction (PFC) stages in the on-board charger while significantly reducing thermals in PFC MOSFETs.

Like our other Qspeed diodes, QH12TZ600Q uses merged PiN and Schottky diode technology to achieve high performance. Its smooth reverse recovery current transition characteristics not only increase efficiency, but reduce EMI and peak reverse voltage stress, eliminating the need for snubbers when used as output rectifiers.

QH12TZ600Q diodes are available in the compact, 2.5 kV isolated TO-220 package, enabling direct mounting to metal heat sinking and facilitating excellent thermal performance. They can be used as a single or interleaved continuous conduction mode (CCM) PFC boost diode or an output rectifier diode in on-board chargers.

To learn more download the QH12TZ600Q Data Sheet

MCUs to Help Reduce Power, Size and Cost
Posted: 2021-7-29

Explore the low-cost MSP430FR243x family of FRAM-based microcontrollers

TI’s MSP430 microcontroller platform is based on an ultra-low-power FRAM system architecture that increases performance while lowering energy consumption. The MSP430FR2433 is TI’s lowest-cost family of MCUs for sensing and measurement applications.

Learn more

MSP430F2xx family: Get more from power from your MCU with integrated analog

MSP430FR21xx devices are ultra-low-power, low-cost MCUs built on the FRAM architecture. These devices provide integrated peripherals and combine low-power modes to achieve extended battery life in portable, battery-powered sensing applications.

Learn more

MSP430FR247x family: Delivering integrated analog at extended temps

MSP430FR247x MCUs are created to support industrial applications, leveraging the FRAM data-logging capabilities. This device integrates a 12-bit SAR ADC and one comparator, and offers an extended temperature range from –40°C up to 105°C.

Learn More

Capacitive sensing MSP430™ MCUs: Easiest to use capacitive touch solutions

The MSP430FR267x MUC family provides ultra-low-power microcontroller solutions for capacitive touch sensing applications supporting buttons, slides, wheel and proximity solutions. MSP430 MCUs with CapTIvate technology operate through thick glass, plastic enclosures, metal, and wood with operation in harsh environments including wet, greasy, and dirty environments.

Learn more

Simplify gas and liquid measurement with ultrasonic sensing MCUs

Ultrasonic sensors help with the level sensing for liquids and gases to measure liquid concentration, leak detection, level sensing and oxygen concentration. The MSP430FR604x microcontroller families are low-cost, single-chip solutions with integrated ultrasonic sensing analog front end. Its unique waveform capturing technology with high speed ADC and cross correlation method enables high accuracy measurements with low power.

Learn more

Easy to use development kit for sensing solutions

Get everything you need to start developing your sensing solutions using MSP430™ microcontrollers. The LaunchPad™ development kit includes an ambient light sensor, connector for external analog sources and probes for programming, debugging and energy measurements.

Learn more

New LinkSwitch-TNZ ICs Incorporate Lossless Zero-Cross Detection and X-Capacitor Discharge
Posted: 2021-7-29

Typical discrete AC zero-cross detection circuits require many components and consume as much as half of the standby power budget. Power Integrations’ new LinkSwitch-TNZ IC family solves this problem by combining offline power conversion, lossless zero-cross detection and optional X-capacitor discharge functions in a compact SO-8C package. With integrated lossless AC zero-cross detection, LinkSwitch-TNZ ICs provide best-in-class light-load efficiencies.

LinkSwitch-TNZ ICs provide an accurate signal indicating that the sinusoidal AC line is at zero volts. This signal is used by Smart Home and Building Automation (HBA) products and appliances to control the switching of relays, IGBTs and TRIACs to minimize switching stress and system in-rush current. The device’s detection of the zero-cross point consumes less than 5 mW, allowing systems to reduce standby power losses versus alternative approaches that require 10 or more discrete components and burn 50 to 100 mW of continuous power.

This highly efficient switcher can be used for non-isolated buck and buck-boost power supplies up to 575 mA output current and can provide up to 12 W output for universal input isolated flyback designs. For more information visit www.power.com

TDK expands its range of coupled inductors
Posted: 2021-7-29

TDK Corporation (TSE:6762) has extended its range of coupled inductors to include the new EPCOS series B82472D6*. The nine series types cover an inductance range of 2 x 2.2 µH to 2 x 47 µH and are designed for maximum rated currents of 1.1 A to 4.3 A. The RoHS-compliant chokes are certified in line with AEC-Q200 and feature high saturation currents of up to 7.95 A. The magnetically shielded inductors have dimensions of just 7.3 x 7.3 x 4.8 mm and are designed for a wide temperature range of between -55 °C and +150 °C. Depending on the type, the chokes offer very high coupling factors of the two windings from 97 to 99 percent.

These compact, robust components proof to be useful in a wide range of applications: They are ideal in various galvanically non-insulated DC/DC converter topologies such as SEPIC, Cuk and Zeta and can also be used as transformers in flyback and multi-output buck topologies. In the latter, coupled inductors provide a second output voltage. Furthermore, they can be utilized as common-mode chokes in power supply lines. The insulation voltage between the two windings is >500 V.

Further information on the products can be found under http://www.tdk-electronics.tdk.com/power_inductors

5W AC/DC is OVC III and PD3-rated
Posted: 2021-7-29

The RAC05-K/PD3/H from RECOM is a board-mounted 5W Class II AC/DC converter series, intended for ‘fixed installations’ where higher levels of transients according to over-voltage category III are experienced, along with increased environmental pollution levels.

The converters are available with 5V, 12V or 15V single outputs and include enhanced clearances to meet OVCIII up to 5000m altitude. Nominal input ratings are 100VAC to 277VAC but the parts will withstand 480Vac without damage continuously. The series is rated for operation in ‘Pollution Degree 3’ environments, where pollution can become conductive if condensation occurs.

The RAC05-K/PD3-H series is fully protected against short circuits and over-voltage in case of internal abnormalities’ and meets EN 55032 Class B EMI emissions level (floating output), without external components. No-load consumption is less than 0.5W to meet eco-design directives. The parts are offered in a 2” x 1” x 1” high package and operate to 70°C in free air and to 85°C (12V part) with 40% derating. Certifications include IEC/EN 62368-1 and UL 61010-1.

Michael Schrutka, RECOM AC/DC product manager comments “Our new 5W AC/DC converters provide real value when compliance with over-voltage category III is required especially along with higher levels of protection against ambient air pollution in harsh environments. By elimitated or at least significantly reduced need for external suppression components. The parts will find applications in smart grid, renewable energy, smart metering and IoT systems, as well as monitoring food and beverage processing appliances.”

For more information go to www.recom-power.com

TDK offers high-current and low-inductance power inductors for automotive power circuits
Posted: 2021-7-29

TDK Corporation developed new HPL505032F1 power inductors for use in automotive circuits. The inductors enable level 5 ADAS applications for cameras by offering high-current and low-inductance for power circuits in central processing units and graphic processing units, such as advanced driver-assistance systems (ADAS).

The new products achieve high power efficiency by adopting a low-resistance frame for the highly permeable and low-loss ferrite made of high BS material and low-RDC that is fully developed in-house. Its rated current is 1.5 times higher than TDK's existing product (HPL505028), accommodating currents as high as 40 A to 50 A. While the proprietary structural design generates magnetic flux canceling effects contributing to noise control, the frame that integrates internal with external electrodes reduces the risk of an open circuit and short circuit, ensuring high reliability.

The need for high-speed, large-capacity camera footage in ADAS is increasing as vehicles grow more autonomous. Cameras are an essential part of cars with ADAS capabilities to assure that everything is aligned within a vehicle and no dangerous situations occur. TDK’s product line for ADAS systems includes a range of automotive inductors for these applications. Mass production of these new inductors will begin in July 2021.

Further information on the products can be found under https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_automotive_power_hpl505032f1_en.pdf.

Cornell Dubilier Long Life, 85/85 THB-Rated DC Link Capacitors for Harsh Environments
Posted: 2021-7-29
Type BLH exceeds industry standards for humidity testing, AEC-Q200 compliant

Green energy and electric transportation systems have pushed explosive growth in inverter markets. Many of these applications present harsh operating environments for power electronics circuitry. Often, these applications demand a high percentage of uptime, increasing the need for highly reliable components. In response, CDE’s BLH series of DC Link capacitors have been designed and tested to exceed the industry’s most stringent requirements for high humidity, vibration testing and thermal cycling.

 The Temperature, Humidity at Bias (THB) test exposes parts to the harsh conditions of 85 °C at 85% relative humidity with rated voltage applied. This demanding test simulates the harsh operating conditions encountered in many commercial and industrial inverter applications. Such conditions can cause non-THB rated capacitors to fail early from moisture penetration. While most capacitor makers validate their THB components for 1,000 hours under these conditions, CDE’s BLH series has been validated for 1,500 hours.

Utilizing the most advanced materials and processes, these board mounted capacitors have been designed and tested to meet the rigors of automotive AEC-Q200 testing. Their solvent-resistant plastic case and epoxy encapsulation system are UL Recognized and meet IEC61071. Tin-plated copper RoHS-compliant terminations ensure excellent solderability. With their superior resistance to moisture and robust design, these capacitors are well suited for solar, wind, UPS, EV chargers, and other inverter applications that may be subjected to wide-ranging environmental conditions.

The series is optimized for DC link applications in medium to high-power inverters. Capacitance ranges from 1.0 to 170 µF at 450-1,200 Vdc, with high rms ripple current ratings up to 36 Arms. When operated at a 70 °C hot-spot temperature with rated voltage applied, their life expectancy is 100,000 hours.

BLH Series film capacitors are available now from the company’s authorized distributors. For more information contact CDE: Product Manager: Larry Bromley, 508-996-8561 x1120 email:  lbromley@cde.com

New Qi 1.3 Wireless Charging Reference Design Unveiled to Accelerate Development of Automotive and Consumer Qi Transmitter
Posted: 2021-7-29
Microchip’s Qi 1.3 reference design is compliant with the recently released Qi 1.3 specification and includes everything needed to quickly develop a Qi 1.3 certified transmitter

The Wireless Power Consortium (WPC) has recently released the Qi 1.3 specification that requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver.

To meet the requirements of the specification, Microchip Technology Inc. announced today a new Qi® 1.3 wireless charging reference design providing developers of wireless charging systems for automotive and consumer applications with the necessary tools and support for the seamless integration and certification of new-generation product designs.

For wireless charging system developers launching certified Qi 1.3 transmitters under tight timelines, Microchip’s three-coil Qi 1.3 reference design provides a head start for product development. The reference design fully integrates secure storage subsystem software with the wireless power microcontroller (MCU) and is a flexible solution, enabling custom topologies and foreign object detection (FOD) implementation.

As a regular member in the WPC, which sets global standards for wireless charging of mobile devices, Microchip provided expertise during development of the recently released Qi 1.3 specification. Qi 1.3 is a significant update from Qi 1.2.4 and mandates hardware-based authentication between transmitter and receiving devices for power transfer above 5W. By adhering to the new authentication standard, designers can ensure phones receiving 15W are receiving it from a Qi-certified authenticated transmitter to ensure safety.

“Wireless charging makes it easy and convenient for consumers to charge devices and, as a result, demand for these systems in the automotive and consumer segments is on the rise,” said Joe Thomsen, vice president, MCU16 business unit. “Microchip’s Qi 1.3 reference design, tools and support help engineers to meet rapidly evolving development requirements and enable easy certification of the new Qi 1.3 transmitter designs, speeding time to market and easing end-product certification.”

Included in Microchip’s reference design solution for wireless charging systems are all required elements: Qi controller, Qi application software, provisioned authentication controller that is a WPC-approved secure storage subsystem and crypto software libraries that execute on the Qi controller. The reference design includes complete schematics, bill of materials, software and design guidelines. Microchip is partnering with Avnet to make evaluation boards for the Qi reference design available to qualified customers around the world.

To support its Qi 1.3 wireless power solution, Microchip provides the dsPIC33C family of devices to run the Qi application software and the ECC608/TA100 secure storage subsystem provisioned by Microchip as a licensed WPC Manufacturing Certificate Authority. As a total system solution, this reference design also incorporates MIC4605 and MCP14700 gate drivers, MCP16331 and MCP1725 regulators, an MCP6C02 current sense device, an ATA6563 CAN transceiver and an MCP9700 temperature sensor.

For pricing and additional information, contact a Microchip sales representative, authorized worldwide distributor, or visit Microchip’s website https://www.microchip.com/wireless-power.

TDK offers a new screw terminal series with high current capability and long service life
Posted: 2021-7-29

TDK Corporation presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals. The new components are designed for rated voltages between 400 V DC and 500 V DC and cover a capacitance range of 820 µF to 15,000 µF.

A special feature is the high-rated current capability of up to 56.1 A AC (100 Hz, 85 °C). In case of standard operating conditions (for example, at 300 Hz, 60 °C, 2 m/s), currents of up to 100 A can even be reached. These values mean an approx. 25 percent increase in the current capability in the case of rated conditions in contrast to previous series.

The robust capacitors are designed for a service life of 12,000 hours at 85 °C. A precise service life calculation can be performed with the online AlCap Tool (www.tdk-electronics.tdk.com/en/alcap_tool). Similar to other EPCOS screw terminal series, a range of options such as heat sink mounting or special terminals are available as reverse polarity protection.

The new capacitors are particularly well suited to frequency converters and industrial power supplies as well as UPS systems. Furthermore, the capacitors can be effectively used for converters in the renewable energies sector, such as wind power and photovoltaic systems.

Further information on the products can be found under www.tdk-electronics.tdk.com/en/alu_screw.

16:1 input DC/DC is Ideal for Rail Applications
Posted: 2021-7-20
format

RECOM is launching its 16:1 ultra-wide input high-isolation quarter-brick DC/DC converter, ideal for rail and harsh industrial applications. Input range of the RPA150Q series is 14.4V to 170V (200V for 1s), and fully regulated available outputs are 12, 24, or 54VDC with wide +10/-20% trim range (+18/-20% for 24V output). Efficiency is high across the operating range, and with sufficient airflow, 150W output is available from -40°C up to at least 65°C for every variant, or to at least 75°C with baseplate cooling. With derating, operation to a baseplate temperature of 105°C is possible.

The product features 4.242kV/1 min reinforced isolation with safety certifications to EN/UL 62368-1 and CAN/CSA-C22.2 N0. 62368-1 up to 5500m altitude, along with functional and safety compliance to rail standards EN 50155 and EN 45545-2. EMC standards EN 55022 and EN 55011, along with EN 50121-3-2 for rail applications can be met with external filtering. The product is fully featured with trim, remote sense, and remote on/off control. Protection includes under-voltage lockout, over-temperature, and output over-voltage/over-current.

The RPA150Q series will operate down to 12V and up to 200V for one second, allowing for dips and surges across various nominal voltages from 24V to 110VDC defined by rail standards EN 50155 and RIA12, with some margin. To suit the typical high shock and vibration rail environment, the product complies with EN 61373 and includes threaded inserts for secure mounting to a PCB or bulkhead. In industrial applications, the compact quarter brick size is useful in space-constrained designs requiring very wide input range.

Our RPA150Q series is ideal for rail and harsh industrial applications,” commented Matthew Dauterive, DC/DC Productmanager of RECOM. “The ultra-wide input range means only one part in the standard quarter-brick format can be used to cover multiple nominal inputs and their surges and transients.

For more information go to www.recom-power.com

TDK provides its stray-field robust 3D HAL® position sensors now with integrated decoupling capacitors
Posted: 2021-7-20

TDK Corporation expands its Micronas 3D HAL® sensor portfolio with the Hall-sensor family HAC® 39xy*, which features integrated capacitors for stray-field robust position detection in automotive and industrial applications. The TO92UF package was designed explicitly for PCB-less applications, combining both a chip from the HAL® 39xy* family featuring stray-field compensation capability, and up to two capacitors with up to 330 nF. The new sensors suit a wide range of applications, including valves and actuators, gear shifters, transmission systems, or brake stroke position detection. The PSI5 interface supports the latest requirements of chassis-position detection sensors. **

HAC 39xy sensors enable angular measurements up to 360° with ferrite 2-pole magnets and linear measurements up to 35 mm by using two-pole bar magnets. The stray-field robust position detection can take both measurement types, with additional 3D measurements resulting in two independent angles. The SENT interface transmits data from both angles while the sensors achieve a high ESD immunity and meet all of the stringent EMC requirements. Samples are available now; mass production will start by the end of 2021.

The patented 3D HAL pixel-cell technology is the core of the HAC 39xy sensors, and accurately measures magnetic fields while being insensitive to stray fields. The unique concept of the masterHAL® sensor line is based on an array of Hall plates. The highly flexible sensor array helps design engineers select the best operation mode for any given measurement task.

With its flexible architecture, HAC 39xy offers a wide range of configuration possibilities. It features a powerful DSP, which is responsible for fast signal processing, and an embedded microcontroller that performs the interface configuration and supervision of the Functional Safety related tasks. The innovative architecture of the HAC 39xy sensors makes it easy for customers to develop new solutions using fast prototyping techniques. It also enables quick and easy adaptation to changes in interface standards such as SENT and PSI5.

The pins of the TO92UF package can be welded or soldered directly to a lead frame, eliminating the need for a printed circuit board (PCB), thus reducing the total system size and cost. Furthermore, the overall system long-term reliability is significantly improved.

For more information go to https://www.micronas.tdk.com/en/products/direct-angle-sensors/hal-39xy

TDK offers extremely small TVS diodes with extremely low capacitances and clamping voltages
Posted: 2021-7-20

TDK Corporation has extended its range of TVS (transient voltage suppression) diodes characterized by their extremely low capacitance values for bidirectional overvoltage protection to include the ULC series (Ultra Low Clamping & Capacitance). The SD01005SL-ULC101 (B74111U0033M060) type has a minimum capacitance of ~0.5 pF and the SD0201SL-ULC101 (B74121U0033M060) type of ~0.6 pF, both at 1 MHz.

The new TVS diodes are designed for a maximum operating voltage of 3.3 V. The ULC products offer an extremely low clamping voltage of ~3.8 V at a peak pulse current of 8 A or 16 A at ~5 V and a breakdown voltage of 6.3 V. Further features include very short response times and the extremely low leakage current of ~1 nA at 3.3 V. They are designed in accordance with IEC 61000-4-2 for an ESD contact discharge of up to 15 kV.

Despite high-level performance of robust protective components, the diodes meet the highest requirements in terms of miniaturization. Their dimensions in the Wafer-Level Chip Scale Package (WL-CSP) are just 400 x 200 µm (WL-CSP01005) or 600 x 300 µm (WL-CSP0201) with a height of 100 µm in the 01005 size or 150 µm in the 0201 size. Despite their extremely small size, the components are designed for a high surge current load of up to 7 A according to IEC 61000-4-5 (8/20 µs).

The diodes are well suited for the reliable ESD protection of high-speed interface ICs and data lines such as USB 3.1, USB 3.2, HDMI, FireWire and Thunderbolt due to their parasitic capacitances, clamping voltage, and small size. Typical target applications include smartphones, notebooks, tablets, wearables and ESD sensitive network components.

More information can be found at www.tdk-electronics.tdk.com/tvs_diode

150W Eighth-Brick DC/DC has 6:1 input
Posted: 2021-7-20
RECOM unveils the RPA150E eighth-brick wide-input DC/DC converter series rated at 150W

RECOM has launched an eighth-brick DC/DC converter series with 9-60VDC input and optional 12, 24 or 48V outputs rated at 150W. The RPA150E series has an industry standard pin-out with outputs trimmable over a wide +/-20% range to include 28V for avionic systems and 57V for PoE applications. The 6:1 input range covers nominal 12, 24, and 48V system rails with sufficient margin to include 48V battery charging voltage and 12V battery cranking voltage dips.

Efficiency of the RPA150E series is high, up to 92% typical, allowing operation to +85°C with minimal derating with airflow or baseplate cooling. Isolation is rated at 3kVDC, and standard control and protection feature include remote on/off, under-voltage lockout, over-voltage, over-current, and over-temperature.

Safety certifications for the converter include UL 62368-1, CAN/CSA-C22 No. 62368-1, and the parts are EMC-compliant to EN 55032 and EN 55011 with a recommended external filter network. With suitable external components, the RPA150E series is compliant with EN 50155 and EN 45545-2 railway functional and safety standards along with EN 50121-3-2 railway EMC standard.

Matthew Dauterive, DC/DC product manager of RECOM comments: “The wide input range of our RPA150E series means it can provide cost effective power conversion from battery voltages in EVs, rail, and E-mobility designs as well as in a broad range of industrial applications”.

For more information contact www.recom-power.com

TDK offers compact DC-link solution for PCB mounting in cylindrical shape
Posted: 2021-7-2

TDK Corporation presents its new B32320I* series of compact cylindrical DC-link capacitors for mounting on PCBs. They are designed for voltages of 450 V DC to 1300 V DC and cover a capacitance range of 6.5 µF to 260 µF. The current handling capacity IRMS is up to 27.6 A (10 kHz, 60 °C) and minimal ESR is 2.4 mΩ. The new DC-link capacitors are designed for a maximum hotspot temperature of 105 °C. The plastic housing corresponds to UL 94 V-0.

Depending on the model, the dimensions are between 35 mm x 53 mm and 60 mm x 120 mm. Due to their relatively tall insertion height compared with cubic capacitors, the new DC-link capacitors have low footprint requirements on the PCB in relation to their capacity. All models in the new series feature five pins, which ensures high current capability as well as high stability on the PCB.

Typical areas of application include frequency converters for drives, converters for photovoltaic and air conditioning systems and critical UPS systems.

Main fields of application
• Frequency converters for drives
• Converters for photovoltaic and air conditioning systems as well as UPS systems

Main features and benefits
• Rated voltage of 450 V DC to 1300 V DC
• Capacitance range from 6.5 µF to 260 µF
• Compact dimensions of 35 mm x 53 mm and 60 mm x 120 mm
• Minimal space requirements on the PCB

Further information on the products can be found at www.tdk-electronics.tdk.com/en/ac_capacitors.

Miniature Buck Converter Delivers 4A
Posted: 2021-7-2
RECOM announces the RPX-4.0 cost-effective buck converter in a QFN package.

RECOM has added a 4A option to its RPX series of miniature buck converters. The RPX-4.0 is rated to 3.8 to 36V input and programmable 1 to 7V output at 4A. With a compact 5mm x 5.5mm footprint and low 4.1mm height in a thermally-enhanced QFN package, the buck module pushes the limit on power density. The product features on-off control, a power good signal, and soft start, and is fully protected including under-voltage, short-circuit, over-current, and over-temperature.

The RPX-4.0 efficiency is high, allowing full power operation up to 65°C and derated operation up to 90°C. Construction follows the RECOM ‘3D Power Packaging®’ technology for high power density, with flip-chip on leadframe construction, an integrated shielded inductor for low EMI, and intelligent control of switching frequency to maintain high efficiency even at light load.

The RPX-4.0 needs just voltage setting resistors and input/output capacitors for a complete high-performance solution and is delivered with the RECOM 3-year warranty. An evaluation board, RPX-4.0-EVM-1, is also available, allowing customers to exercise all of the product features and optimize filtering to meet target system requirements.

“We are excited to launch the latest in our RPX series of buck converters” commented Matthew Dauterive DC/DC product manager of RECOM, “Users will find it particularly suitable for industrial automation, test and measurement, portable devices, and high density or weight-sensitive applications”.

Flex Power Modules introduces DC/DC converter with ultra-wide input voltage range for railway applications
Posted: 2021-7-2

Flex Power Modules announces the PKJ7200W, a series of EN50155-compliant DC/DC converter modules for railway rolling stock equipment. Provided in a half-brick format, the PKJ7200W delivers up to 200 W output power, with an ultra-wide input voltage range of 14 V to 160 V.

Equipment for use in railway rolling stock must meet a wide range of standard input voltages, which varies between countries. These voltages are defined by the EN50155 standard, which specifies the various nominal voltages in use, as well as variations due to voltage spikes and dips.

Due to its wide input voltage range, which covers the standard’s defined values, the PKJ7200W can be used in railway applications anywhere in the world, where previously at least two product variants would be required. This makes installation, qualification and aftermarket support simpler – saving time and reducing costs.

Olle Hellgren, Director Product Management and Business Development at Flex Power Modules, said: “The new module series expands our existing range for railway applications, taking their place alongside our PKM family of DC/DC converters, while providing twice the output power.”

To ensure reliable operation, the new module will comply with the EN50155 specifications for surge protection, power interruption and backup with external circuitry, wide operational temperature, and shock and vibration. It is also compliant with the functional insulation and safety standard IEC/UL 62368, and the EN45545-2 railway standard for fire behavior of components.

The module includes input under voltage protection, output over current protection, output over voltage protection, and over temperature protection. MTBF is 4 million hours.

Efficiency of the module is up to 90%. Input to output isolation is 4000 V, and the available versions of the new converter can provide outputs at voltages of 12 V, 13.8 V, 15 V, 24 V, 48 V and 54 V.

The PKJ 7200W is provided in an industry-standard half-brick format, measuring 60.96 x 57.91 x 12.70 mm, and it will be available in July, 2021. Customers can obtain further information by contacting pm.info@flex.com.

24 W Medical Ac-Dc Supply Ideal for Home Healthcare Applications
Posted: 2021-7-2

CUI Inc, a Bel group company, today announced the addition of a new series of medical desktop ac-dc power supplies to its external ac-dc power supply line. The SDM24-UD Series is available in four models and in black or white color options. The series features up to 27 W of continuous power and no-load power consumption of less than 0.1 W, with a two-prong (C8) inlet. The series is certified to the medical 60601-1 safety standard, meeting the requirements for a 2 x MOPP (Means of Patient Protection) classification.

These external supplies provide a compact solution for a variety of medical and dental applications, including blood pressure monitors, portable ultrasound units, sleep monitors and CPAP machines. These adapters are also suitable for use in home-healthcare applications such as at-home heartbeat monitors and examination kits.

Summary
Product series: SDM24-UD (https://www.cui.com/product/external-ac-dc-power-supplies/desktop/sdm24-ud-series)
Applications: Medical, Dental
Distribution availability: Digi-Key, Mouser, Arrow, Future Electronics
Datasheets: SDM24-UD

Air cooled, 98% efficient, 45kW AC-DC modular power supply provides 385Vdc for distributed power and DC Microgrids
Posted: 2021-7-2

TDK Corporation announces the introduction of the TDK-Lambda brand TPF45000-385 non-isolated modular AC-DC power supply. Developed for use in distributed power architectures (DPA) and DC Microgrids, the 98% highly efficient TPF45000 provides a regulated 385Vdc output with a current of up to 117A.  Low internal losses enables the use of cooling by fans, avoiding the complexity of water cooling.  This industrial grade product is suitable for use in semiconductor test and burn in systems, LED based horticultural lighting and DC Microgrids.

 

Comprising of up to ten 4.5kW modules, the series can deliver up to 45kW of output power in a less than 3U high package, and operates from a wide range Delta or Wye 360 - 528Vac three phase input. The unit can operate at full load in ambient temperatures from -10 to 50oC (-20oC start-up).  The enclosure measures 450mm wide (excluding side rack mount flanges) 113mm high and has a depth of 533mm. The weight of the product is 30kg.

 

The TPF45000 is fully featured with DC Good, dropped phase, over temperature and fault alarm signals, remote on/off and a 13 to 15V 0.5A auxiliary output.  PMBus™ and USB communications interfaces allows remote monitoring of the input voltage, output voltage, output current, internal temperature, status signals and fan.  In addition, the remote on/off can be programmed by the PMBus™.

 

The power supply has 2kVac primary to ground isolation, is certified to IEC/EN/UL/CSA 62368-1 and carries the CE mark for the Low Voltage, EMC and RoHS Directives.  The TPF45000 also complies with EN55032-A (conducted and radiated emissions), SEMI F47-0706 (line dips) and IEC 61000-4 (immunity).

 

More information can be obtained at the following TDK-Lambda Americas website https://product.tdk.com/en/power/tpf, or by calling 800-LAMBDA-4.  Product availability for the TPF45000-385 power supply can be found via the link to TDK-Lambda’s distributor network (see “Check Distributor Inventory”) at https://www.us.lambda.tdk.com.

 

Cost-efficient, regulated SIP8 DC/DC converters are fully featured
Posted: 2021-7-2
RECOM announces the launch of a range of regulated SIP8 DC/DC converters with high power density and industrial temperature range.

RECOM, industry leader in power conversion, has announced the launch of the RS3E family of DC/DC converters in an industry-standard SIP8 format and pin-out. The parts are rated at 3W with no derating to 70°C and feature 2:1 input ranges of 4.5-9V, 9-18V, 18-36V and 36-72V. Fully regulated outputs available are 3.3V, 5V, 9V, 12V, 15V and 24V. Isolation is 3kV (one minute) and the parts hold IEC/UL/CSA 62368-1 safety certification up to 5000m altitude while meeting EN 55032/FCC class B and EN 55035 EMI standards. The RS3E family features short circuit protection, high MTBF of 1.8M hours and a control input to place the converters in a low-power shutdown mode.

Matthew Dauterive, RECOM DC/DC product manager comments: “We have set the bar high again with a great combination of low cost and high power density from a 3W DC/DC converter in a standard SIP8 package. It will find wide application in demanding environments such as industrial and e-mobility”. 
 

  

 
Narrow width 24V 20A DIN rail buffer module has inhibit function for safe operation
Posted: 2021-4-23

TDK Corporation announces the introduction of the TDK-Lambda brand DBM20 24V 20A rated DIN rail buffer module. The narrow 49mm width saves space on the DIN rail allowing additional modules and functionality to be fitted.  A remote on/off inhibit function avoids the unsafe discharge of stored energy during system maintenance and servicing.  The DBM20 provides an extended 250ms hold-up time to power supplies preventing data loss during brief power interruptions or allowing equipment to safely shutdown.  Applications include industrial automation, robotics and semiconductor fabrication equipment.

To remove the need for servicing and maintenance of batteries, energy is stored in electrolytic capacitors.  Charge and discharge status can be monitored local or remotely via a DC OK relay, LED indicators and photo-coupled signals. To obtain longer buffer times, the DBM20 modules can be connected in parallel.  A front panel switch can be used to select either fixed or variable voltage buffer levels. In fixed mode, it will provide power when the input voltage drops to 22.4V, in variable mode when the input decreases by 1V.

Measuring 49 x 123.6 x 115.4mm (W x H x D), the units will operate without derating in ambient temperatures of -25°C to +70°C.  The five-year warranty DBM20 has protection against both input overvoltage and overcurrent conditions, has inrush current reduction and internal fusing.  Safety certification includes IEC/UL/CSA/EN 62368-1, UL 508 with CE marking to the Low Voltage, EMC and RoHS Directives.

More information can be obtained at the following TDK-Lambda Americas website, https://product.tdk.com/en/power/dbm, or by calling 800-LAMBDA-4.  Product availability for the DBM20 power supply can be found via the link to TDK-Lambda’s distributor network (see “Check Distributor Inventory”) at https://www.us.lambda.tdk.com.

Ground-breaking PSMA Report Addresses Reliability of Power Supply Digital Control Software/Firmware
Posted: 2019-9-19
Comprehensive study on digital implementations of power supplies addresses challenges and solutions to reliability of digital control of power supplies and recommends best practices

The Power Sources Manufacturers Association (PSMA) announces publication of its ground-breaking Power Supply Software/Firmware Reliability Improvement Report. This report, the result of a year-long project undertaken by PSMA’s  Reliability Technical Committee, addresses recommended reliability improvements for power supply digital control software and firmware. This new report attempts to present key findings related to the challenges of and solutions to reliability in the digital control of power electronics.

“This is the first report from the work of PSMA’s newest committee, which aims to spearhead industry initiatives that identify and attempt to address the pertinent industry challenges related to the reliability performance of power supplies and associated products,” noted Brian Zahnstecher, Co-Chair of the PSMA Reliability Committee. Tony O’Brien, Reliability Committee Co-Chair, added “Moving from power electronics with analog control to power electronics with digital control is a significant transition. Software engineering best practices are being adopted for digital power electronics control for power supplies to ensure that reliability does not suffer with the transition to digital control. Some of the best practices are relatively new, evolving and unfamiliar to the power electronics world”

This 166-page report, divided into nine chapters, examines a wide array of problems and challenges in the field of digitally controlled power supplies, then proceeds to present observed and proposed improvements and best practices. Brian Zahnstecher further noted, “The ongoing tasks of the PSMA Reliability Committee will include efforts to support adoption of the recommended best practices and to update and refine our findings. We welcome the involvement of knowledgeable industry experts in this important work.” 

A copy of the printed and USB memory drive versions of the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report has been sent to PSMA Regular member companies as a benefit of their membership. Additional copies may be purchased at the member price of $US290. PSMA Affiliate members may also purchase the report for $US290. The report is available to non-members for purchase on the PSMA website (www.psma.com) for the price of $US2490.

A preview of the report is available here.

PSMA Power Technology Roadmap Provides Critical Insights into Technology and Research Advancing Power Conversion Developments
Posted: 2019-4-16
2019 edition of bi-annual publication provides multidimensional perspectives on power technology growth and trends; latest edition adds new section surveying global academic research activities

The Power Sources Manufacturers Association (PSMA) announces the 2019 edition of the Power Technology Roadmap. The report, which forecasts the power technology and power delivery trends through 2023, includes a printed report along with a feature-rich USB memory drive containing a record number of seventeen recorded webinars with up-to-date explanations of the information contained in the final report. The webinars add much to the presentation materials because the listener can hear and understand the context and the subtext of the original presentation in the speaker's voice. The recordings also capture the interesting and informative question and answer periods.

In this edition a new section on University Research in Power Electronics has been added. University research provides a window into what products and technologies are in store for Power Electronics. Leading power electronics research universities were asked about their research areas and priorities and their responses were analyzed to extract most common research areas, least common/missing research areas and unique research areas.

The overall structure of this year’s PTR largely follows the format of and keeps the improvements made in the 2017 report. It offers a consolidated view of the latest trends in the power management, power control, and power delivery technologies by integrating the most recent inputs from webinars, surveys, analyses and discussions. The report is divided into five sections:

  • Application Trends
  • Component Technologies
  • University Research
  • Webinar Presentations
  • Power Supply and Converter Trends

“As power technology continues to emerge from the shadows to play a more central role in the next phase of electronics industry revolution, the PTR report provides many relevant pointers to the current and future industry stakeholders,” said Conor Quinn, Co-Chair of the Power Technology Roadmap committee.

Dhaval Dalal, Co-Chair of the committee, said, “In many emerging fields, such as electric vehicles, alternative energy converters and energy harvesting devices, power technology assumes a more central and driving role and the PTR captures how the industry is shaping up to play this role.”

PSMA Regular Member companies have each been sent one copy of the printed report and USB memory drive versions of the 2019 edition as a benefit of their membership. Members can access the webinars on line at no cost and purchase additional copies of the full report for $290. The non-member price is $4,490. For information about purchasing the report, please to the PSMA website at: www.psma.com/publications.

PSMA Publishes Technology Report: 3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies
Posted: 2018-9-6
Comprehensive report is the first to address higher power embeddable passives that will accelerate the development of higher density power sources using new, 3D disruptive packaging technologies

The Power Sources Manufacturers Association (PSMA) Packaging Committee announces the publication of its latest report titled, “3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies.” This is the third in a series of reports focused on using embedded substrate technology for building power sources. It is the first extensive study of embeddable passive components both available and in development for use in the power path of power sources. The report contains extensive research and product illustrations geared to an audience of technology executives and design engineers.

Miniaturization of passive components without compromising their power handling and efficiency and their integration with actives has always been a key focus for power packaging. There is also an increasing trend to vertical or 3D package integration to address the performance issues by eliminating parasitics from interconnections. Embedding gives lowest package inductance and enables co-integration of power systems and drivers in a single package with direct interconnection between gate driver circuits and switches with shortest interconnection length. This has become even more important with the rapid emergence of wide bandgap power switching devices. This, however, leads to several process integration and reliability challenges that need to be systematically addressed.

Georgia Tech Packaging Research Center, under contract from PSMA systematically surveyed the recent advances in passives, active embedding and 3D passive-active integration to generate this report, with emphasis on 3D power packaging enabled by advances in passive components and embedding of actives in power packages. A detailed literature study was conducted on key advances in embedded passive technologies and related topics. Emerging nanomaterials, processes and technologies are described in detail for inductors, capacitors and resistors. Nanostructured materials provide additional degrees of freedoms in enhancing the properties to improve the performance metrics such as volumetric density and efficiency of the components. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted in advancing the components to improve performance. Industry leaders were surveyed to get the recent technology advances in each category. Roadmaps are projected for passive component advances and active embedding technologies.

The trends and roadmaps in 3D power packaging are also described in three categories: low power (1-100 W), medium power (100-1000 W) and high power (10-100 kW). Integration in each category is classified into lead-frame-based, substrate-embedding based and traditional ceramic substrates. Active embedding with panel-scale substrate manufacturing is also reviewed in detail. Recent innovations in substrate materials and associated reliability challenges such as via cracking, dielectric cracking or electric breakdown are highlighted. Advances in die-attach solutions with sintered nanocopper are reviewed, highlighting the evolution of low-stress sintered copper-based die-attach solutions.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded passives in 3D power packaging to create the significantly higher power densities.

The PSMA report on 3D packaging was provided free of charge to PSMA Regular and Associate Company members.  Additional copies may be purchased at the member price of $290. PSMA Affiliate members may also purchase the report for $290. The report is available to non-members for purchase on the PSMA website (www.psma.com/publications) for the price of $3,490.

Provided by the PSMA Packaging Committee.

Brian Narveson
Co-chairman
  Brian Narveson   Ernie Parker  
Ernie Parker 
Co-chairman

 

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