New product announcements


PSMA Publishes the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report
Posted: 2019-9-10
Comprehensive Study on Digital Implementations of Power Supplies Commissioned by the PSMA Board of Directors and Executed by the PSMA Reliability Committee

The PSMA Reliability Technical Committee recently completed the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report. This is the first report from the work of PSMA's newest committee, which aims to spearhead industry initiatives that identify and attempt to address the pertinent industry challenges related to the reliability performance of power supplies and associated products.

Power Electronics are transitioning from analog control to digital control. Power supply designers now need to create and embed software in power supply products.  Moving from power electronics with analog control to power electronics with digital control is a significant transition and the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report attempts to present key findings related to the challenges and solutions to reliability in the digital control of power electronics. 

"Software reliability is the ability of software to repeatedly perform intended functionality for defined operating conditions over extended periods of time. While the focus here is on software reliability, hardware variations and evolution over time impacts software reliability and legacy software function. High quality software with high reliability requirements is typically implemented following a standards-based regulatory process," noted Brian Zahnstecher, Co-Chair of the PSMA Reliability Committee. Tony O'Brien, Reliability Committee Co-Chair, added "Software engineering best practices are being adopted for digital power electronics control for power supplies to ensure reliability does not suffer with the transition to digital control. Some of the best practices are relatively new, evolving and unfamiliar to the power electronics world."

Report Structure

This report examines a wide array of problems and challenges in the field of digitally controlled power supplies, then proceeds through observed and proposed improvements and best practices. The report includes sections on:

  • The typical issues, challenges, and points of failure in digitally controlled power supplies.
  • Best practices that are useful for high quality digital power electronics.
  • The quality of software in digital power electronic power supplies.
  • Guidance on design process improvement, allowing development to move toward best practices; some standards from related and comparable product sectors using processes to achieve high quality software are introduced.
  • Various specifications and templates that support best practices and quality.
  • Program management and integration of different engineering cultures and tools to create reliable product.
  • A range of tests, inspections, types of analysis, plans, and tools that support developing high-quality product.
  • Key metrics from both power hardware and software control backgrounds.
  • New metrics that might benefit the power supply industry.

A copy of the printed and USB memory drive versions of 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report will been sent to PSMA Regular member companies as a benefit of their membership. Additional copies may be purchased at the member price of $US290. PSMA Affiliate members may also purchase the report for $US290. The report is available to non-members for purchase on the PSMA website (www.psma.com) for the price of $US2490.

New CAPZero-3 X-Capacitor Discharge ICs from Power Integrations Meet IEC60335
Posted: 2019-8-20
New device family reduces standby power for appliance applications

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced CAPZero™-3, the latest generation of the company’s elegant, energy-saving X-capacitor discharge ICs. Two-terminal CAPZero-3 ICs enable designers to easily meet IEC60335 safety approvals for major appliances, and cover all capacitor values from 100 nF to 6 µF.

IEC60335 is the discharge safety standard for all appliances. To protect the user from an electrical hazard, it requires the voltage across the input X capacitor to discharge to less than 34 V within less than one second after the AC is removed. CAPZero-3 ICs block current flow through the X-capacitor discharge resistors when the AC voltage is connected, and automatically discharge X capacitors through those resistors when the AC is disconnected. CAPZero-3 ICs simplify EMI filter designs while permitting the use of larger X capacitors, which in turn enables smaller inductive components to be used with no resulting change in power consumption.

CAPZero-3 ICs can be placed before or after a system’s input fuse. Devices deliver high common-mode surge immunity so that no external ground connection is necessary, and feature a high differential surge withstand due to 1000 V internal MOSFETs. Creepage on the package and PCB is maintained at >4 mm.

Comments Edward Ong, product manager, Power Integrations: “With the launch of the new CAPZero-3 ICs, designers can use one part to address a large range of applications in small and major appliances that require X capacitor values from 100 nF to 6 µF.”

CAPZero-3 devices are safety-certified to CB and Nemko requirements and so developers do not need to perform a separate safety test on the X-capacitor discharge circuit of the power supply. Devices are available now, priced at $0.31 in 1,000 piece quantities. Technical support is available from the Power Integrations website at: www.power.com/products/capzero-3.

Evaluate the brightest 1080p TI DLP® Pico™ chipset
Posted: 2019-8-7
Bright 1080p displays up to 1500 lumens

The DLP® LightCrafter Display 4710 EVM-G2 is an easy to use, plug-and-play evaluation platform for the 1080p Pico display chipset, which includes the DLP4710 digital micromirror device (DMD), DLPC3439 display controller and DLPA3005 PMIC/LED driver. The DLP4710 display chipset is designed to enable low power and mobile 1080p display applications, such as mobile smart TVs, high resolution digital signage, interactive displays, smart home displays, and wearables, such as head mounted displays.

Important information:

  • Allows quick assessment of the DLP4710 1080p display chipset
  • EVM compatible with production-ready optical modules
  • HDMI-input interface offers plug-and-play functionality
  • PC user interface allows quick configuration of multiple video settings of the chipset
     
Power Integrations Releases Gallium Nitride-Based InnoSwitch3 AC-DC Converter ICs
Posted: 2019-7-29
Advanced GaN technology yields significant increase in power and efficiency

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced new members of its InnoSwitch™3 families of offline CV/CC flyback switcher ICs. The new ICs feature up to 95% efficiency across the full load range and up to 100 W in enclosed adapter implementations without requiring a heatsink. This groundbreaking increase in performance is achieved using an internally developed high-voltage GaN switch technology.

Quasi-resonant InnoSwitch3-CP, InnoSwitch3-EP and InnoSwitch3-Pro ICs combine primary, secondary and feedback circuits in a single surface-mounted package. In the newly released family members, GaN switches replace the traditional silicon high-voltage transistors on the primary side of the IC, reducing conduction losses when current is flowing, and considerably reducing switching losses during operation. This results in substantially less wasted energy and therefore increased efficiency and power delivery from the space-saving InSOP-24D package.

Targeting high-efficiency flyback designs, such as USB-PD and high-current chargers/adapters for mobile devices, set-top boxes, displays, appliances, networking and gaming products, the new ICs provide accurate CV/CC/CP independent of external components, and easily interface to fast-charging protocol ICs. The InnoSwitch3-CP and  EP variants are hardware-configurable, while the InnoSwitch3-Pro incorporates a sophisticated digital interface for software control of CV and CC setpoints, exception handing and safety-mode options.

Comments Balu Balakrishnan, president and CEO of Power Integrations: “GaN is a pivotal technology offering significant efficiency and size benefits over silicon. We anticipate a rapid conversion from silicon transistors to GaN in many power applications. InnoSwitch3 has been the clear technology leader in the offline switcher IC market since we launched the silicon variants 18 months ago, and the new GaN-based ICs further extend our lead by advancing both the efficiency and power capability of our flyback products.”
 

The 2109 iNEMI Roadmap is Now Available
Posted: 2019-7-16

The 2019 iNEMI Roadmap is now available. For the 2019 cycle, roadmap chapters will be published in waves, with two to eight chapters included in each wave, released every two to three weeks. The first wave, now available online, includes four chapters:

  • Board Assembly
  • Modeling; Simulation & Design Tools
  • Smart Manufacturing
  • Sustainable Electronics

The Smart Manufacturing chapter is new for 2019. It highlights and prioritizes many of the industry-wide challenges along the electronics manufacturing supply chain in terms of materials flow and conversion, data flow architecture, digital building blocks and security. It discusses and prioritizes areas that need to be addressed to enable faster deployment of smart manufacturing, such as defining data flow and format.

25 Years of Roadmapping

This year, iNEMI marks 25 years of roadmapping the needs of the electronics manufacturing industry. The consortium published its first roadmap in 1994 and, over the years, the number of technology areas covered has grown and changed, but the focus has always remained on providing insights into the technology requirements for success throughout the supply chain.

For more information, visit www.inemi.org/inemi-2019-roadmap

CUI Next-Generation 6 W Multi-Blade Power Adapter Boasts Ultra-Compact Package
Posted: 2019-7-16

CUI’s Power Group today announced the introduction of a next-generation 6 W wall plug-in ac-dc power supply with interchangeable ac blades designed for global use. The SMI6B series features an ultra-compact package measuring 1.85 x 1.36 x 1.04 in (47 x 34.5 x 26.5 mm), while complying with the US DoE Level VI and EU CoC Tier 2 efficiency regulations as well as the new IEC 62368-1 safety standard for ICT and AV equipment.

With ac blade options for North America, Europe, the United Kingdom, Australia, and China, this multi-blade power adapter offers no-load power consumption less than 0.075 W, a universal input voltage range of 90 to 264 Vac, and single output voltages from 5 to 15 Vdc. The series further carries over current and short circuit protections as well as a wide range of safety approvals that include UL/cUL, GS, RCM, CCC, PSE, and CE.

Complying with FCC Part 15B Class B limits for EMI/EMC, the SMI6B also features a variety of standard dc output connector options, including USB Type C and Micro B. These features and approvals combine to make this high efficiency external power adapter the ideal solution for keeping consumer, industrial, and mobile electronics in compliance around the world.

Focus on AR HUD using TI DLP® Auto Products
Posted: 2019-7-10

Augmented reality head-up displays (AR HUD) are becoming more sophisticated than ever before. With drivers demanding more real-time information about the environment around them, automotive designs that don’t incorporate AR HUD are about as exciting as last year’s model.

Luckily, AR HUDs designed around TI DLP® Auto chipsets deliver larger fields of view, a larger eyebox and a longer virtual image distance, and are much better equipped to handle increased solar loads than the competing technology.

Learn more about the optical architecture required to deliver the best HUD experience for your design in TI's solar load white paper.

TDK 550 to 650W Modular Power Supplies Have Full MoPPs Isolation, Low Acoustic Noise and up to 10 Outputs
Posted: 2019-7-2

TDK Corporation announces the introduction of the TDK-Lambda brand QM4 modular power supplies rated at 550 to 650W.  This further extends the QM series which can provide up to 1500W output power.  The QM4 models are available with up to 10 outputs, have full MoPPs (Means of Patient Protection) isolation and low acoustic noise.  With medical and industrial safety certifications, the power supplies are suitable for use in medical, test and measurement, communications and broadcast equipment.

Accepting a wide range 90 to 264Vac, 47-63Hz input (440Hz with reduced PFC), the QM4 can deliver 550W at low line and 650W with a high line 180-264Vac input.   With its modular construction, the series can be configured using a simple on-line configurator to provide 1 to 10 independently regulated outputs and include individual output good signal and remote on/off functions.  The QM series module output voltages range from 2.8V to 105.6V and have output power levels from 300W to 1200W.  A further subset of option modules provides an AC Fail signal, standby voltages (up to 12V, up to 2A), global remote on/off and PMBus™ communications.  Overall case dimensions for the QM4 are 108 x 63.3 x 270mm (W x H x D).

The QM4 will operate in ambient temperatures of -20 to +70°C (-40°C start-up), with output power and output current linearly derating above 50°C to 50% at 70°C. With efficiencies of up to 91%, less internal heat is generated allowing the use of a low speed cooling fan to reduce audible noise.  A lower airflow speed also significantly reduces the ingress of dirt and other contaminants, improving product reliability.  All models in the QM series have a seven-year warranty as standard.

The power supply has 4,000Vac (2 x MoPPs) input to output, 1,500Vac (1 x MoPP) input to ground and 1,500Vac (1 x MoPP) output to ground isolation.  All models are certified to the IEC/EN/UL/CSA 60601-1, ANSI/AAMI ES 60601-1 and IEC/EN/UL/CSA 60950-1 safety standards.  The QM series is also designed to meet IEC/EN61010-1 with CE marking for the Low Voltage, EMC and RoHS Directives.  Earth leakage current is less than 300µA, and complies with the EN61000-6-3:2007 and EN60601-1-2:2015 (curve B conducted and radiated) emission standards.  The units also meet the EN60601-1-2 and EN61000-6-2 immunity standards and are designed and manufactured under the control of ISO9001 and ISO13485 (including risk management).

More information can be obtained at the following TDK-Lambda Americas website, http://www.us.tdk-lambda.com/lp/products/qm-series.htm, or by calling 800-LAMBDA-4.  Products can be configured using the “Product Quick Finder” at http://www.us.tdk-lambda.com/lp/.

Powerbox’s extra wide input quarter-brick DC/DC converters shorten time to market for very demanding applications
Posted: 2019-7-2
  • 100W market leading power density, 12:1 input, quarter brick format.
  • Two input ranges covering from 9 to 160VDC
  • EN50155 input voltage range, from 24V up to 110V (including continuous operation in the 14.4V brownout condition and 154V transients)
  • +105C maximum base plate temperature
  • Seven output voltages including 53V for PoE and 28V for defense applications
  • Meets thermal shock and vibration requirements of EN61373 and MIL-STD-810F

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the launch of three new series of extra-wide input voltage range, 40W to 100W board-mounted DC/DC converters for the railway, transportation and defense industries. With an extra wide input voltage range of 14V to 160V and 9V to 75V, the PQAE40U (40W), PQAE60U (60W) and PQAE100U (100W) have been developed to provide systems designers with a single part number that is able to power a large range of applications (e.g. railway, industrial automation and automotive, remote radio-control), thus reducing inventory, time to market and documentation.

Designed for use in harsh environments, the PQAE40/60/100U series meet thermal shock and vibration requirements as specified in EN61373 and MIL-STD-810F, and also meet the fire and smoke EN45545-2 standard. The PQAE40/60/100U series can be operated from -40 up to +105 degrees Celsius case temperature, meeting the very demanding, ruggedized requirements such as found in construction vehicles, mining equipment and heavy machinery process control.

Industrial and railway power designers often face very demanding challenges to optimize board power solutions when designing standardized equipment for worldwide operation on a very large variety of system bus voltages. In the railway industry, designers are permanently seeking the best power architecture to operate within the overall EN50155 input voltage range, from 24V up to 110V, including continuous operation in the 14.4V brownout condition and 154V transients.

To guarantee board power designers the highest level of flexibility, the PQAE40/60/100U series has been developed to deliver full and stable power within an extended input voltage range from 14V up to 160V. For lower bus voltages, the 9V to 75V versions cover the main battery voltages, sustaining peak voltage and continuous operation up to 75V. The PQAE40/60/100U series is available in seven output voltages of 5, 12, 15, 24, 28, 48 and 53V, and exhibit an efficiency figure of up to 90%, which considering the extra-wide 12:1 input range, is an outstanding efficiency figure. All models within the PQAE40/60/100U series feature full protection level sets including over voltage, short-circuit, over load protection, and thermal shutdown. All units operate at a fixed switching frequency and including PI type input filters. The operating temperature range is from -40 to +105 degrees C baseplate, and storage is from -55 to +125 degrees C.

Designed for ruggedized environments, the PQAE40/60/100U series meet thermal shock and vibration requirements as specified in EN61373 and MIL-STD-810F. All products comply with IEC/UL/EN-60950, EN62368-1 and the railway standards EN50155 and EN45545-2. The PQAE40/60/100U series are available in an industry standard quarter-brick (36.8 x 57.9 x 12.7mm – 1.45 x 2.28 x 0.50 inches). All units are housed in a plastic case with an aluminum baseplate and are potted with a UL94-V0 silicon compound. Four optional heatsinks with different height and airflow orientations are available on request. The 9 to 75VDC modules feature an input to output basic insulation of 2,250VDC and the 14 to 160VDC modules a reinforced insulation of 3,000VAC.

PQAE40/60/100U series converters are RoHS compliant.

For more information visit www.prbx.com

Bear Begins Production of Second-Generation Custom Medical Power Supply for Leading Surgical Instrument Manufacturer
Posted: 2019-6-27
New design for 75 Watt AC-DC converter with CF-rated and BF-rated outputs features higher efficiency, 20% lower costs

Bear Power Supplies has begun production of a second-generation dual-output medical AC-DC converter that it designed for a leading global producer of medical instruments.

Bear Power Supplies’ US-based contract electronics design team developed the second-generation power supply to increase efficiency and deliver a 20% reduction in manufacturing costs. It is a drop-in replacement for the first-generation power supply. The customer will also use it to replace commercial off-the-shelf (COTS) power supplies in several other of its medical systems.

Bear designed and has manufactured the first generation of this custom medical power supply at its USA contract manufacturing center, located near Rochester, New York.

“Our customer has recognized the clear performance and cost advantages of a custom Bear medical power supply over standard commercial power supplies,” said Michal Allen, President of Bear Power Supplies. “With the use of this second-generation design across more of their product line, they have approximately doubled their production volume with us.”

The 75 Watt medical power supply has universal input and two outputs. The CF-rated output features an ultra-low capacitance of less than 15 pF, and can be switched off when not needed. The BF-rated output remains active to supply electronics used in the vicinity of a patient.

For more information, visit www.bearpwr.com

Transphorm Strengthens 900 V GaN Portfolio with Second FET
Posted: 2019-6-25
New Generation III GaN-on-Si FETs Capable of Powering Three-phase Broad Industrial Power Supplies and Automotive Converters

Transphorm Inc.—the leader in the design and manufacturing of the highest reliability high-voltage (HV) Gallium Nitride (GaN) semiconductors—today introduced its second 900 V FET, the Gen III TP90H050WS, enhancing the industry’s only 900 V GaN product line. These devices now enable three-phase industrial systems and higher voltage automotive electronics to leverage GaN’s speed, efficiency and power density. Further, the new FET’s platform is based on Transphorm’s 650 V predecessor, the only JEDEC- and AEC-Q101-qualified HV GaN technology. As such, system developers can design with confidence in its quality and reliability. 

The TP90H050WS has a typical on-resistance of 50 mOhm with a 1000 V transient rating, offered in a standard TO-247 package. The TP90H050WS can reach power levels of 8 kW in a typical half bridge while maintaining greater than 99 percent efficiencies. Its figures of merit for Ron*Qoss (resonant switching topologies) and Ron*Qrr (hard switching bridge topologies) are two to five times less than those of common superjunction technologies in production—indicating highly reduced switching losses. While a JEDEC qualified version is slated for Q1 2020, customers can design 900 V GaN power systems today.

Transphorm’s first 900 V device, the TP90H180PS, with a typical on-resistance of 170 mOhm in a TO-220 package is JEDEC qualified and has been available through Digi-Key since 2017. It can reach a peak efficiency of 99 percent, demonstrating its suitability for 3.5 kW single-phase inverters.

Establishing GaN’s Viability in New High Voltage Applications
“Transphorm’s latest 900 V GaN product represents a major milestone for commercial GaN power transistors as it reaches the 1 kilovolt mark, an industry first. This paves the way for GaN to be a viable choice at these higher voltage nodes,” said Primit Parikh, Co-founder and COO, Transphorm. “With partial funding from ARPA-E for early risk reduction and Power America for initial product qualification, this effort represents successful public-private partnership that accelerates GaN’s market adoption.”

Transphorm’s 900 V platform provides higher breakdown levels for systems already targeted by the company’s 650 V FETs, such as renewables, automotive, and various broad industrial applications. It is designed to be deployed in bridgeless totem-pole power factor correction (PFC), half-bridge configurations used in DC to DC converters and inverters. The ability to support these topologies at a higher voltage expands Transphorm’s target applications to now include a broad list of three-phase industrial applications, such as uninterruptible power supplies and automotive chargers/converters at higher battery voltage nodes.

“900 V GaN power devices eliminate barriers to access applications not presently supported with GaN semiconductors. With innovations like this 900 V platform, Transphorm is advancing the industry, creating new customer opportunities,” said Victor Veliadis, Deputy Executive Director and CTO of PowerAmerica, which partially funded the project.

As do all Transphorm qualified GaN FETs, the TP90H050WS offers the following advantages along with the differentiating features mentioned earlier:

  • Easy to drive with off-the-shelf drivers
  • Robust safety gate margin
  • Higher power density than incumbent Silicon technologies
  • Performance exceeding that of IGBTs, superjunction
  • Reduced overall system costs
  • Reduced system weight

For more information, visit transphormusa.com.

CUI Introduces Terminal Block Connectors to Interconnect Portfolio
Posted: 2019-6-18

CUI’s Interconnect Group today announced the addition of terminal block connectors to its existing line of connector products. Featuring up to 24 pole counts, the terminal blocks come available in pluggable, screw type, and screwless configurations with 2.54, 3.50, 3.81, 5.00, 5.08, and 7.62 mm pitches. These terminal block models also offer horizontal, vertical, 45°, and 180° orientations, making them ideal for lighting systems, commercial building equipment, industrial controls, and any wire-to-board application requiring quick wire termination in the field.

Accommodating 28 up to 10 AWG wires, all terminal block series include blue, green, orange, yellow, gray, and black color options, along with an additional white color option for the push button on the screwless versions. The terminal blocks carry UL current ratings from 2 to 30 A and IEC current ratings from 5 to 32 A as well as UL voltage ratings of 150 and 300 Vdc and IEC voltage ratings from 130 to 630 Vdc. With operating temperature ranges from  40 up to 105°C, all models further comply with RoHS and the UL94V-0 flammability rating.

View details for CUI’s terminal block connectors

EPC and Spirit Electronics to Provide Lot-Specific Data Packs for eGaN® Power Devices
Posted: 2019-6-11

EPC announces a partnership with Spirit Electronics to provide an expanded range of manufacturing lot-specific data services for their industry-leading enhancement-mode gallium nitride (GaN) devices.

“Our partnership with Spirit Electronics provides the opportunity for EPC to complement Spirit’s extensive history and proven successful track record in working with defense and aerospace customers,” commented Alex Lidow, CEO and co-founder of EPC. “Offering lot-specific data services related to our eGaN power semiconductor products will enable us to bring additional value to these demanding applications.”

Marti McCurdy, CEO of Spirit Electronics, noted that, “Our partnership with EPC has been an exciting addition to our portfolio of products and this new offering of lot-specific data services will further help us bring the superior performance of eGaN power transistors and ICs to defense and aerospace customers, so they can design leading-edge power system solutions.”

EPC is offering a variety of data pack services for their eGaN FETs and ICs. More information can be found at: epc-co.com/epc/Products/DataPacks.aspx

TDK - 250W Non-Isolated SIP DC-DC Converter Uses 60% Less PCB Area
Posted: 2019-6-10

TDK Corporation announces the introduction of 250W rated SIP (Single In-line Package) models to the TDK-Lambda i6A4W product family of non-isolated DC-DC converters. Utilizing less than 0.47 in2 of board area, this represents a 60% saving compared to 1/16th brick format converters. 

Capable of operating from a wide input voltage of up to 9 to 53V, the i6A4W step-down converters deliver an output voltage that can be adjustable from 3.3V to 15V or 3.3V to 40V. The i6A4W series can operate from existing 12, 24, 36 or 48V system voltages to generate additional high power voltages in medical, communications, industrial and test and measurement equipment.

With efficiencies of up to 97.5%, power losses are minimized allowing the products to operate in harsh ambient temperatures of -40oC to +125oC even with low airflow requirements.  The need for external output capacitance is reduced due to an optimized dynamic voltage response, thus further reducing board space requirements.

The basic feature models include an output voltage adjustment pin, positive or negative logic remote on-off, remote sense, input under-voltage, over-current and thermal protection.  The full-featured models are equipped with a power good signal, output voltage sequencing and the ability to synchronize the operating frequency to minimize system noise.  All models are certified to UL/CSA 60950-1, IEC/EN 60950-1 and carry the CE mark for the Low Voltage and RoHS Directives.

More information can be obtained at the following TDK-Lambda Americas website, www.us.tdk-lambda.com/lp/products/i6A-series.htm.

EPC to Provide eGaN® Power Devices in Wafer Form
Posted: 2019-6-4

EPC announces the availability of their industry-leading enhancement-mode gallium nitride (GaN) devices in wafer form for ease of integration. EPC’s eGaN FETs and ICs are traditionally sold as singulated chip-scale devices with solder bars or solder bumps.

Chip-scale packaging is a more efficient form of packaging that reduces the resistance, inductance, size, thermal impedance, and cost of power transistors. These attributes of eGaN devices enable unmatched in-circuit performance at competitive prices.

Wafer-level offerings of these devices allows for easier integration in customer power system sub-assemblies, further reducing device interconnect inductances and the interstitial space needed on the printed circuit board (PCB). This increases both efficiency and power density while reducing assembly costs.

“We have listened to our partners and are pleased to offer our industry-leading GaN products in wafer form that can accommodate a variety of assembly techniques and applications,” commented Alex Lidow, CEO and co-founder of EPC.

EPC is offering eGaN power devices in wafer form either with or without solder bumps. Extra services such as wafer thinning, metallization of the wafer backside, and application of backside coating tape are also available. More information can be found at: epc-co.com/epc/Products/WaferSales.aspx  

RECOM Power - All-in-one: AC/DC power supply in IEC Mains Filter Housing
Posted: 2019-6-3

RECOM’s latest innovation fits a universal AC input power supply inside the case of a standard IEC mains filter. It features safe and touchable DC outputs and is easy to install.

The unique design of the RAC05-K/C14 fits a complete 5W power supply into a standard C14 mains filter housing, without altering the case size and at a lower cost than many power supplies or mains filters alone. It uses a standard IEC “kettle connector” mounting hole, so installation time is only a few seconds. The touchable output terminals are safe extra-low voltage (SELV) available in 3.3V, 5V, 12V, 15V and 24V DC output voltages and are protected against short circuits, overload and overvoltage. The metal case offers secure fixing and enhances the thermal dissipation allowing an operating temperature from -40°C to +60°C without derating. The RAC05-K/C14 is ideal for powering single board computers such as the Raspberry Pi (including touchscreen), Arduino, BBC Micro:bit, etc. and is CE marked and EN/IEC/UL certified. 

For more information, visit www.recom-power.com.

Powerbox Announces 105 Models of DC/DC Converters Featuring 2xMOPP Medical Approvals
Posted: 2019-5-28
  • Reinforced isolation: 5,000VAC with two means of patient protection (2xMOPP)
  • Low leakage current of 2µA, low standby power and no minimum load required
  • Wide-input (2:1) and Ultra wide input (4:1) voltage ranges covering from 9V to 75V
  • Operating altitude up to 5,000 meters

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the introduction of three new series of 15W, 20W and 30W board mount DC/DC converters for demanding medical applications, totaling 105 models. The PMM15, PMM20 and PMM30 are certified to the 3rd Edition of the IEC/EN/ANSI/AAMI ES 60601-1 medical safety standard and rated for the highest levels of patient protection - 2xMOPP. With a clearance and creepage distance of 8mm, a typical leakage current of 2µA and a 5,000VAC isolation voltage, the modules ensure operator and patient safety and protection in medical applications. For optimized efficiency and flexibility, all models are available in wide input (2:1) and ultra-wide input (4:1) versions covering from 9V to 75V input voltage and providing seven different output voltages from 5V to +/-15V. The power converters are covered by a five year warranty.

In medical equipment, safety is an absolute must and as specified in the IEC/EN/ANSI/AAMI ES 60601-1 safety standard, the PMM15, PMM20 and PMM30 have an input to output isolation voltage of 5,000VAC. They integrate a reinforced insulation with two means of patient protection (2x MOPP), have a typical leakage current of 2µA and a clearance and creepage distance of 8mm.

Many countries such as China or those in South America are bringing healthcare to populations based in mountainous regions, and it is very common in those countries for healthcare centers and hospitals to be located at altitudes higher than 3,000 meters. Medical equipment must be designed to guarantee the highest level of safety up to 5,000 meters. Powerbox’s PMM15, PMM20 and PMM30 have been designed for this and they also comply with the Chinese Safety Standard GB 4943.1-2011 requirement for operation at altitude.

The PMM15, PMM20 and PMM30 wide input (2:1) units are available in three input voltage ranges, 9-18V, 18-36V, 36-75V, and the ultra-wide input (4:1) versions in two input voltage, 9-36V and 18-75V. All models are fully regulated with a complete range of output voltages comprising 5V, 12V, 15V, 24V, +/-5V, +/-12V and +/-15V. No minimum load is required and tight regulation from no load to full load of +/-0.2% on single output, and +/-0.5% on dual output is provided.

Designed around an optimized topology, the PMM15, PMM20 and PMM30 have an efficiency up 90% and can be operated within an ambient temperature of -40 to +105 degrees C. In the case of natural convection a derating may apply. In cases of excess of heat, an internal over-temperature protection is set at +115 degrees C case.

The PMM15, PMM20 and PMM30 include a number of protections including over-voltage, under-voltage, over-load and short circuit, and thermal-shutdown.
Supplied in a non-conductive black plastic housing and potted with a UL94-V0 silicon compound, the PMM15 and PMM20 are sized at 40.6 x 25.4 x 10.2 mm (1.6 x 1 x 0.4 inch) and weigh 24 grams. The PMM30 is available in a 50.8 x 25.4 x 10.2 mm (2.0 x 1.0 x 0.4 inch) housing and weighs 32 grams.
Without using external components, the PMM15, PMM20 and PMM30 meet EMI levels as specified by EN55011, EN55032 and FCC Part 18, Class A.
According to the MIL-HDBK-217F, at full load and +25 degrees C, the PMM15, PMM20 have an MTBF of 2 million hours, and the PMM30 of 1.1 million hours.
An optional remote control pin (P) for positive logic and (N) for negative logic is available to externally control ON/OFF. All single output voltage modules can be externally adjusted up and down by adding a resistor bridge connected to the trimming pin.

The PMM15, PMM20 and PMM30 are suitable for a very large range of medical applications such as home healthcare auxiliary equipment, ultrasound, assisted ventilation, infusion pumps, dental chair and supervisory systems and many others. In industrial applications, the 5,000VAC reinforced isolation figure makes the PMM an ideal solution to add, at low cost, an IGBT drive channel to any industrial power supply, meeting the safety requirement required by such applications.
The PMM family includes 6 series, 3W PMM03 ; 6W PMM06 ; 10W PMM10 ; 15W PMM15 ; 20W PMM20 and 30W PMM30.

All products conform to the European directive RoHS, REACH and are CE marked.

For more information, visit www.prbx.com.

 

Micrometals Introduces New Optilloytm Alloy Powder Materials Specifically Formulated to Optimize Inductor Performance Parameters for Demanding Power Applications
Posted: 2019-5-21

Micrometals, a leader in high performance core solutions for power applications, is proud to introduce its new offering of Optilloy Alloy Powder materials.  The offering includes three new formulations, OD, OC and OE, which are specifically formulated to deliver optimal core performance for demanding applications. All Optilloy materials are unique formulations of iron, silicon, aluminum and nickel and are available in toroid shapes with permeabilities from 14µ to 125µ.

The original Optilloy material, OP, was formulated to provide low core losses and high saturation.

The new OD material, Optimized DC Bias, is optimized to provide superior DC Bias while maintaining low losses and be very cost competitive.  OD material is ideal for applications that require high saturation magnetization that may have traditionally used high flux materials like FluxSan or Hi-Flux. Optimized DC Bias cores are available in toroids from 3.5mm to 196mm with permeabilities from 14µ to 90µ.

The new OC material, Optimized Core Loss, is optimized for provide very low losses while maintaining good DC bias at an economical price. OC material is economical alternative for applications that may have traditionally used Sendust or MPP type materials. Optimized Core Loss cores are available in toroids from 3.5mm to 196mm with permeabilities from 14µ to 125µ.

OE, Optimized Economy, has been specifically formulated to provide an economical alternative to applications that require moderate, but consistent magnetic performance.  Optimized Economy cores are available in toroids from 3.5mm to 196mm with permeabilities from 14µ to 90µ.

Jim Cox, Micrometals President commented “For decades, our customers have trusted Micrometals cores to deliver exceptional reliability, consistency and performance.  With these new Optilloy materials we will continue to deliver that same reliability and consistency, but with performance targeted at one or more magnetic attributes that are the most important for their application, and a very competitive price.”

The Optilloy materials have been incorporated into the Micrometals Online Inductor Design Tool, for facilitating material selection and design optimization - www.micrometalsapc.com/design-software  

More information on Micrometals new Optilloy Alloy Powder products can be found at www.micrometalsapc.com.

Microchip Announces Cost-Effective Smart Lighting Systems with Eight-port Switch that Supports New IEEE 802.3bt Power over Ethernet (PoE) Standard
Posted: 2019-5-21
480-watt fanless switch is compatible with all PoE lighting, providing maximum power for enterprise connected lighting applications

The adoption of commercial smart lighting systems has grown significantly as organizations strive to improve energy efficiency and operational costs in buildings. Power over Ethernet (PoE) is rising in popularity for these systems, providing a reliable and easy-to-install solution that manages power and data over a single Ethernet cable. To support larger and more efficient lighting systems, Microchip Technology Inc. announces a cost-effective eight-port PoE switch that provides guaranteed power of 60 watts (W) per port for all eight ports simultaneously. Ideal for digital ceiling installations, the IEEE 802.3bt-compliant PDS-408G PoE switch runs noise-free with a fanless design.

Designed for enterprise connected lighting applications, the PDS-408G connects separate systems such as lighting, sensors, HVAC and Wi-Fi® access points over a single switch. The switch has eight PoE ports – the optimal amount for connected lighting – and offers end applications additional cost-savings from energy savings and lower operating expenses. In compliance with IEEE 802.3bt, the PDS-408G provides a total of 480 W, including up to 90 W for any individual port or 60 W for eight ports simultaneously.

The PDS-408G is plenum rated and can be installed in any air handling space, making it ideal for digital ceiling installations. Its fanless design provides the features needed for buildings that require noise-free and reliable operation, such as offices, hospitals and hotels. The PDS-408G also provides other proven advantages of PoE, including safe power, simple installation, flexible deployment and remote power management.

“Demand for Power over Ethernet in connected lighting systems has accelerated, and our new PoE switch is designed specifically for the needs of these applications,” said Rich Simoncic, senior vice president of Microchip’s Analog, Discrete and Power business unit. “The PDS-408G continues Microchip’s leadership in PoE technology, providing an IEEE 802.3bt-compliant solution that provides almost six times the amount of power than the original PoE standard.”

The PDS-408G joins Microchip’s portfolio of end-to-end PoE solutions. Developers can use the PDS-408G switch alongside the company’s extensive portfolio of 8- and 32-bit PIC® and AVR® microcontrollers (MCUs) at the end node. Microchip offers an array of easy-to-use hardware and software tools to accelerate PoE designs, including the PIC18 PoE Main Board, which features a PIC18 MCU, ATECC608A secure element and MIC28512 buck regulator. Additional information on Microchip’s Ethernet solutions is available at www.microchip.com/design-centers/ethernet/ethernet-of-everything.

Flex Power Modules Extends its PKE Range of Highly Reliable and Efficient Industrial DC-DC Converters
Posted: 2019-5-8
  • Encapsulated 1 x 1in package now delivers single outputs up to 30W, and dual outputs up to 15W
  • 3.3V, 5V, 12V, 15V, 24V, 48V and 54V single outputs available up to 30W
  • ±12V and ±15V output versions added, delivering 15W
  • 9 to 36V and 18 to 75V inputs suit industrial and telecom applications

Flex Power Modules introduces several new additions to the PKE series of DC-DC power converter modules for the industrial, test equipment and telecom sectors, continuing its commitment to offer a wider portfolio to design engineers. The modules are provided in sealed and encapsulated packaging, to ensure they will work reliably when subjected to dust, moisture, severe vibration and other harsh conditions.

The PKE3000 and PKE5000 series provide highly reliable, high-performance and rugged DC-DC solutions in the industry-standard 1 x 1in form factor, running from 12V or 24V nominal inputs for the PKE3000 series (9 to 36V), and 24V or 48V nominal inputs for the PKE5000 series (18 to 75V). Delivering up to 30W of output power at up to 92% efficiency, the series also offer mean time between failures (MTBF) of up to 5 million hours, and input-to-output isolation of 1500VDC. The new galvanically isolated devices also meet the latest IEC/EN/UL62368-1 safety standards.

David Xie, Head of Product Management at Flex Power Modules, commented: “The PKE series is a popular package size in the industrial and test equipment market. Being designed to meet the requirements of demanding applications in these sectors alongside the telecom market too, these new variants further expand our support to design engineers with versatile products that are highly reliable and efficient.”

For more information, visit flex.com

TDK - 100W Medical / ITE Certified 2x4” Power Supplies Deliver 50W at 80°C Ambient when Conduction Cooled
Posted: 2019-4-30

TDK Corporation announces the introduction of the TDK-Lambda brand CUS100ME series of AC-DC 100W rated power supplies, with the capability of delivering 50W in ambient temperatures of 80°C when conduction cooled without the need for forced air cooling.  Certified to medical and ITE standards for Class I and II (no earth ground connection) operation, the series meets both class B radiated and conducted emissions.  CUS100ME target applications include medical, home healthcare, dental, test and measurement, broadcast and industrial equipment.

Available with 12V, 15V, 18V, 24V, 28V, 36V and 48V outputs, the CUS100ME operates from an 85 to 264Vac input and has operating efficiencies up to 94%.  Off-load power consumption is less than 0.5W and the product warranty is five years.

The open frame version is in the industry standard 50.8 x 101.6mm (2” x 4”) footprint with a height of 31.5mm.  Convection cooled it can deliver 100W at 50°C and 60W at 70°C, or with forced air cooling 100W at 70°C and 75W at 85°C.  With a U-channel construction, measuring 64 x 116 x 38.5mm (WxLxH), the CUS100ME can be conduction cooled via a cold plate to deliver 100W at 70°C and 50W at 80°C.  Cover or top fan options are also available.

Input to output isolation is 4kVac (2 x MoPP), input to ground 1.5kVac (1 x MoPP) and output to ground 1.5kVac (1 x MoPP) making the series suitable for B and BF rated medical equipment.  Touch current is a maximum of 100µA, with leakage current less than 250µA. 5,000m is the maximum operating, transportation and storage altitude.

All the power supplies are certified to IEC/EN/ES/CSA 60601-1, IEC/EN/UL/CSA 62368-1 and IEC/EN/UL/CSA 60950-1 with CE marking for the Low Voltage, EMC and RoHS Directives.  The CUS100ME is designed to meet IEC61010-1 and EN 60355-1 compliant versions also available.  Both Class I and Class II versions are compliant to EN 55011-B and EN 55032-B (radiated and conducted) and meet the EN 61000-3-2 harmonics, IEC 60601-1-2 Edition 4 and IEC 61000-4 immunity standards.

Major applications

Medical, home healthcare, dental, test and measurement, broadcast and industrial equipment

Main features and benefits

  • High Efficiency, up to 94%
  • Operation up to 85°C Ambient Temperatures
  • Industry Standard 2” x 4” Footprint (open frame)
  • Class I and II Operation with Class B EMI
  • Suitable for B and BF Rated Equipment

For more information visit, www.us.tdk-lambda.com/lp/products/cus-m-series.htm,

Powering next generation datacenters: Infineon’s 48 V high-efficiency, two-stage architecture power distribution
Posted: 2019-4-29

Infineon Technologies AG is introducing its zero-voltage-switching (ZSC) switched capacitor converter. It features a two-stage architecture for 48 V applications to power up CPUs, GPUs, SoCs, ASICs, and memory. Infineon’s full system concept for 48 V architecture paves a way towards 99 percent of efficiency. Combining ZSC board with CoolGaN™ 600 V based solutions results in an optimized power flow and unparalleled performance for the datacenters of tomorrow. The latest ZSC converter board is introduced at the PCIM 2019 tradeshow in Nuremberg, Germany.

The ZSC converter delivers the highest efficiency and power density for applications using 48 V. Through capacitive energy transfer with soft switching of the power MOSFETs, it generates an intermediate bus voltage. This enables an easy and low-risk migration path for legacy 12 V systems to a 48 V infrastructure at significantly improved total cost of ownership. Combined with Infineon’s best-in-class multi-phase buck regulators, it offers overall efficiency of more than 94 percent and power density for 48 V input systems above the industry’s average.

The board is featuring microcontrollers, drivers and switches from Infineon. It comprises well-matched 25 V and 40 V OptiMOS™ 5 and OptiMOS 6 MOSFETs as well as EiceDRIVER™ 2EDi gate driver ICs. The XMC™ family of microcontrollers is complementing the ZSC switched capacitor converter.

It is easy to implement as a voltage regulator module (VRM) or down (VRD) design depending upon system requirements and limitations. The bidirectional power transfer capability of the ZSC converter offers ultimate flexibility for designers of power architectures to implement high-efficiency and compact bus converters that can provide voltage conversion from 48 V to 12 V, or vice versa.

Additionally, the converter can be easily configured to supply different conversion ratios (2:1, 4:1, 6:1, 8:1, 10:1, 12:1) with the same set of components for best system-level efficiency optimization. In a 4:1 configuration, the ZSC converter can achieve peak efficiency of up to 99 percent at 600 W with a power density of 780 W/inch2. The same design can deliver up to 1 kW with excellent thermal performance due to its high power conversion efficiency. The ZSC board is available upon request.

More information is available at www.infineon.com/zsc.

TDK Low Loss 20A to 40A DIN Rail Mount Redundancy Module Assists Load Current Balancing
Posted: 2019-4-26

TDK Corporation announces the introduction of the DRM40 series DIN rail mount redundancy modules.  The two 20A 10V to 30Vdc rated inputs can be connected to provide a 20A redundant configuration, or using the load balancing option, to deliver a 40A output.  For capacitive and inductive loads, the DRM40 will support an additional 50% peak load for four seconds.  The use of low-loss MOSFET reverse current protection devices reduces the internal voltage drop to just 200mV.  Applications include industrial process control, factory automation, battery chargers, and test and measurement equipment.

If the input currents are unbalanced, the DRM40 front panel mounted LED is off. When the input voltages are adjusted and the load current is shared equally, the LED is illuminated.  In addition, the DRM40 has two isolated DC Good PhotoMOS relays to indicate that each input voltage is between the limits of 10V and 30V.  Two front panel mount DC Good LEDs provide visual indication.  For cost sensitive applications the DRM40B has identical electrical performance without the current balance and DC Good functions.

Major applications

Industrial process control, factory automation, battery chargers, and test and measurement equipment.

Main features and benefits

  • Low 200mV Voltage Drop
  • Current Balance Indicator Option
  • Isolated Alarm Signaling Option
  • 50% Peak Current Rating

For more information visit, us.tdk-lambda.com/lp/products/drm-series.htm

Automotive Qualified eGaN® FET, 80 V EPC2214 Helps Lidar Systems ‘See’ Better
Posted: 2019-4-16
Efficient Power Conversion (EPC) expands AEC Q101 product family with the addition of the EPC2214, 80 V gallium nitride transistor optimized for high resolution lidar systems.

EPC announces successful AEC Q101 qualification of the 80 V EPC2214 designed for lidar systems in the automotive industry and other harsh environments.

eGaN technology has been in mass production for over nine years, accumulating billions of hours of successful field experience in automotive applications, such as lidar (Light Detection and Ranging) and radar for autonomous cars, 48 V – 12 V DC-DC converters used in data center computers, ultra-high fidelity infotainment systems, and high-intensity headlamps for trucks. This new device has completed rigorous automotive AEC Q101 qualification testing and will be followed with several more discrete transistors and integrated circuits designed for the harsh automotive environment.

The EPC2214, an 80 V, 20 mΩ, eGaN FET with a 47 A pulsed current rating in a tiny 1.8 mm2 footprint, is perfectly suited to use for firing the lasers in lidar systems because the FET can be triggered to create high current with extremely short pulse widths. The short pulse width leads to higher resolution, and the higher pulse current allows the lidar system to discern objects at greater distances. These two characteristics, along with their tiny size and low cost, make eGaN FETs ideal for radar and ultrasonic sensors in addition to lidar in demanding automotive applications.

To complete AEC Q101 testing, EPC’s eGaN FETs underwent rigorous environmental and bias-stress testing, including humidity testing with bias (H3TRB), high temperature reverse bias (HTRB), high temperature gate bias (HTGB), temperature cycling (TC), as well as several other tests. Of note is that EPC’s WLCS packaging passed all the same testing standards created for conventional packaged parts, demonstrating that the superior performance of chip-scale packaging does not compromise ruggedness or reliability. These eGaN devices are produced in facilities certified to the Automotive Quality Management System Standard IATF 16949.

EPC’s CEO and co-founder Alex Lidow notes, “This new automotive product is the most recent in what will be a constant stream of EPC transistors and integrated circuits designed to enable autonomous driving and improve fuel economy and safety. Our eGaN technology is faster, smaller, more efficient, lower cost, and more reliable than the aging silicon power MOSFET used in today’s vehicles.”

For more information, visit www.epc-co.com.

PSMA Power Technology Roadmap Provides Critical Insights into Technology and Research Advancing Power Conversion Developments
Posted: 2019-4-16
2019 edition of bi-annual publication provides multidimensional perspectives on power technology growth and trends; latest edition adds new section surveying global academic research activities

The Power Sources Manufacturers Association (PSMA) announces the 2019 edition of the Power Technology Roadmap. The report, which forecasts the power technology and power delivery trends through 2023, includes a printed report along with a feature-rich USB memory drive containing a record number of seventeen recorded webinars with up-to-date explanations of the information contained in the final report. The webinars add much to the presentation materials because the listener can hear and understand the context and the subtext of the original presentation in the speaker's voice. The recordings also capture the interesting and informative question and answer periods.

In this edition a new section on University Research in Power Electronics has been added. University research provides a window into what products and technologies are in store for Power Electronics. Leading power electronics research universities were asked about their research areas and priorities and their responses were analyzed to extract most common research areas, least common/missing research areas and unique research areas.

The overall structure of this year’s PTR largely follows the format of and keeps the improvements made in the 2017 report. It offers a consolidated view of the latest trends in the power management, power control, and power delivery technologies by integrating the most recent inputs from webinars, surveys, analyses and discussions. The report is divided into five sections:

  • Application Trends
  • Component Technologies
  • University Research
  • Webinar Presentations
  • Power Supply and Converter Trends

“As power technology continues to emerge from the shadows to play a more central role in the next phase of electronics industry revolution, the PTR report provides many relevant pointers to the current and future industry stakeholders,” said Conor Quinn, Co-Chair of the Power Technology Roadmap committee.

Dhaval Dalal, Co-Chair of the committee, said, “In many emerging fields, such as electric vehicles, alternative energy converters and energy harvesting devices, power technology assumes a more central and driving role and the PTR captures how the industry is shaping up to play this role.”

PSMA Regular Member companies have each been sent one copy of the printed report and USB memory drive versions of the 2019 edition as a benefit of their membership. Members can access the webinars on line at no cost and purchase additional copies of the full report for $290. The non-member price is $4,490. For information about purchasing the report, please to the PSMA website at: www.psma.com/publications.

ON Semiconductor Continues to Make Battery-less IoT a Reality with Bluetooth® Low Energy Multi-Sensor Platform
Posted: 2019-4-10
Industry's lowest power Bluetooth radio enables new multi-sensor solution powered entirely using solar energy

ON Semiconductor, driving energy efficient innovations, continues to enable battery-less and maintenance-free IoT with the introduction of its RSL10 Multi-Sensor Platform powered solely with a solar cell. This complete solution supports the development of IoT sensors using continuous solar energy harvesting to gather and communicate data through Bluetooth® Low Energy, without the need for batteries or other forms of non-renewable energy.

The powerful combination of ultra-low-power wireless communications, small form-factor solar cell and low duty cycle sensing applications makes it possible to develop and deploy totally maintenance-free IoT sensor nodes. The RSL10 Solar Cell Multi-Sensor Platform is enabled by the RSL10 SIP, a complete System-in-Package (SiP) solution featuring the RSL10 radio, integrated antenna and all passive components.

The platform combines the RSL10 SIP with a solar cell and a host of low power sensors from Bosch Sensortec, including the BME280 all-in-one environmental sensor (pressure, temperature, humidity) and the BMA400 ultra-low-power 3-axis accelerometer. Together, they will allow developers and manufacturers to create complete IoT nodes that are entirely powered through renewable energy or energy harvested from the sensor's surroundings.

"After the success of the RSL10 Sensor Development Kit, we are thrilled to work with ON Semiconductor on a new cutting-edge sensor development platform that is entirely solar powered," said Dr. Peter Weigand, Vice President of Marketing, Bosch Sensortec. "The BMA400 is the first real ultra-low-power accelerometer that doesn't compromise on performance. Combined with the BME280 integrated environmental sensor, this provides a comprehensive sensing solution for IoT applications such as climate control, intrusion detection and asset tracking."

Commenting on the release of the RSL10 Solar Cell Multi-Sensor Platform, Wiren Perera, who heads IoT at ON Semiconductor, said: "To support the growth of IoT, manufacturers are actively investigating alternative sources of energy to power their designs, helping to reduce environmental impact and lower manufacturing and maintenance costs. With this solution, established on the RSL10 Bluetooth Low Energy radio, we are proving that a battery-free and maintenance-free approach to smart sensor development is not only possible but can help manufacturers improve their designs."

There are a growing number of IoT sensor applications where the duty cycle is low enough to support intermittent communications, allowing the energy needed to support operation to be harvested using renewable sources. The energy efficiency of the RSL10 is augmented by the highly efficient power management system and the ultra-low-power sensors implemented in the platform. Applications are expected to include smart home and building automation such as HVAC control, window/door sensors and air quality monitoring. Asset tracking including package open/close detection, shock monitoring, and temperature and humidity data logging are also possible applications.

For easy development, the platform is supplied with all design files (Gerber, schematic and BoM) and customizable source code as part of a CMSIS software package. The RSL10 Solar Cell Multi-Sensor Platform is available now from ON Semiconductor alongside a number of other energy-efficient rapid prototyping platforms for IoT, including the Energy Harvesting Bluetooth Low Energy Switch which just was just named 2018 China's Most Competitive IoT Solution by China Electronic Magazine.

For more information, visit www.onsemi.com.

CUI Inc - Waterproof 3.5 mm Audio Jack Connectors Carry IP67 Ratings
Posted: 2019-4-9

CUI’s Interconnect Group today announced the introduction of waterproof audio jack connectors with Ingress Protection (IP) ratings of IP67. The audio jacks are available in surface mount, mid mount SMT, and through hole mounting styles, while featuring right-angle orientations, 4 conductors, and conformance to the 3.5 mm audio standard. With compact form factors and profiles as low as 5.3 mm, these waterproof audio jacks help designers create a sealed barrier between their device and the environmental contaminants often encountered in consumer electronics, mobile, and industrial applications.

CUI’s waterproof stereo jacks are rated up to 10,000 mating cycles and offer operating temperature ranges up to -30 to +85°C. Shielding, an internal switch, mounting tabs for added stability on the PCB, and reflow solder compatibility are also available depending on the series. All models comply with the most recent RoHS standards and carry a UL94V-0 flammability rating.

For more information, visit www.cui.com.

ABB Launches Carbon Reducing High-Voltage Breaker
Posted: 2019-4-3
Latest Live Tank Breaker technology with AirPlus™ is an eco-friendly alternative to sulfur hexafluoride gas (SF₆)-based products

On average, Earth’s temperature has risen about 0.9 degrees Celsius since the late 19th century. In the last decade alone, ice losses have tripled in Antarctica.1 Therefore, across utilities and industries there’s a rising and urgent need to combat global warming.

In the electrical power industry, the sulfur hexafluoride gas (SF6) has been used extensively for decades because of its excellent insulating and arc-extinguishing properties. However, it is a greenhouse gas and for long ABB has been working on finding alternatives.

On April 2019, during Hannover Fair 2019, ABB will launch the Live Tank Breaker (LTB) 145-kilovolt (kV) AirPlus™ and which represents a breakthrough in eco-efficient innovation. The LTB uses a carbon dioxide (CO2)-based gas mixture as the insulation and switching medium, instead of SF6. Designed to protect electrical networks and prevent power outages, the technology will minimize environmental impact.

The new LTB AirPlus™ is reduces almost 100 percent of the global warming potential (GWP), compared with SF6. The GWP, expressed as CO2 equivalent, measures the amount of heat a gas traps in the atmosphere over a time horizon of 100 years. Based on ABB’s well-proven high-voltage breaker technology, and which has been already in operation for decades, the LTB AirPlus™ offers excellent switching performance within the same space requirements. Unlike SF6 where lifecycle management requires careful handling and reporting of inventory, the LTB AirPlus™ is future-proof and complies with environmental regulation changes.

“This technology is the latest addition to our eco-efficient high-voltage platform, and another milestone in our efforts toward lowering environmental impact,” said Markus Heimbach, head of ABB’s High Voltage Products business unit within the company’s Power Grids division. “We have already deployed various - climate-friendly solutions such as the 72.5 kV LTB and 170 kV gas-insulated switchgear in projects around the world.”

The technology is also available as a disconnecting circuit breaker (DCB), which means the disconnecting function is integrated with the breaker. This enables high equipment availability and reliability in a compact footprint.

For more information, visit www.abb.com.

ABB and Rolls-Royce Announce Global Microgrids Cooperation
Posted: 2019-4-3
Partnership on microgrid solutions that integrates digital technology and efficient hybrid power systems

ABB and Rolls-Royce have announced a global partnership on microgrid technology and advanced automation. Together the two companies will offer an innovative, energy-efficient microgrid solution for utilities, commercial and industrial entities.

A microgrid is a small scale electric grid that combines power from distributed energy generation sources such as combined heat and power plants, diesel- and gas-powered gensets and renewable sources with batteries. The microgrid provides the overall control to coordinate these resources to meet the requirements of industrial, residential or consumer loads. Microgrids can either function off-grid, or connected to the main power grid. The ability of microgrids to seamlessly separate themselves from the main grid, in the event of a potential grid fault or emergency, is an increasingly important feature.

Reliable power supply – even during harsh weather conditions and times of peak consumption – is critical for economic growth. Integrating renewable energy is a sustainable solution to support uninterrupted power as well as encourage clean energy use. Microgrid solutions benefit utilities, industries and commercial sites that are looking for reliable power supply as well as cost and carbon emission reduction. Microgrids enable resilient power supply even with high penetration of intermittent renewable energy sources like wind and solar. Digital automation and control systems intelligently coordinate distributed energy resources and loads for the microgrid to function efficiently.  

Rolls-Royce offers the MTU Onsite Energy brand power system solutions: from mission critical, standby and continuous power to combined generation of heat and power, and microgrids. “Due to the transformation towards decarbonization, customers need to pursue sustainable power options that also deliver utmost profitability. For this, we rely primarily on microgrids, which are autonomous energy supply systems that are efficient, reliable, and environmentally friendly,” said Andreas Schell, CEO, Rolls-Royce Power Systems. “Combining our integrated MTU diesel and gas genset system technology and our control solutions, with ABB’s modular microgrid solution, control capability and remote service, will offer customers the combined strengths of the two world leaders in technology.”

“ABB Ability™ e-mesh™ can ensure a stable power grid, even with a high share of renewable energy from various sources, working smoothly together with already installed gas or diesel engines,” said Massimo Danieli, head of ABB’s grid automation business line within the company’s Power Grids business. “ABB has a vast number of microgrid installations globally and through our partnership with Rolls-Royce Power Systems, we will further support the growing interest for microgrid solutions globally.”

The ABB Ability™ e-mesh™ solution will provide power generation asset owners a vertically integrated, unified view of their distributed energy resources and renewable power generation that is quick to deploy and that reduce operational costs. Cloud operations, site and fleet optimization, weather and load forecast and machine learning algorithms offer infinite insights for decision-making, such as knowing where to increase investments on maintenance or how to increase revenue streams to operate assets more profitable.  

For more information, visit www.abb.com

Venable News: Resources for Testing and Stabilizing Power Electronics
Posted: 2019-3-20
Power Supply Feedback Loops: Measurement and analysis techniques that are tried and true.

Feedback loops determine how well a power supply behaves (or any system, for that matter). Using an FRA to measure the loop gain provides useful insight into the feedback loop's performance. This requires an understanding of the measurement technique and how to apply it in different circumstances. These three white papers contain methodology development and practical examples of its application.

Practical Testing Techniques for Modern Control Loops Testing and Stabilizing Feedback Loops Current Mode Control in Power Electronics
Learn how to measure for gain margin and phase margins by downloading our latest white paper. Learn how to test and stabilize feedback loops in modern power supplies. Download this white paper to learn more about current mode control in power electronics.
Download White Paper Download White Paper Download White Paper
     

 

CUI Inc - New Line of Ac-Dc Power Filters Addresses EMC and Surge Compliance
Posted: 2019-3-19
New Line of Ac-Dc Power Filters Addresses EMC and Surge Compliance

CUI’s Power Group today announced the addition of ac-dc power filters, designed to accompany its existing portfolio of low power embedded ac-dc power supplies. The EMC‑20 and EMC‑30 series offer 20 dB and 30 dB of ac-line noise filtering at 150 kHz to 1 GHz, respectively. Available in compact board mount, chassis mount, and DIN rail configurations, the models ensure surge compliance to the IEC/EN61000-4-5 standard and reduce conducted and radiated emissions to help designs comply with CISPR22/EN55022 Class B limits.

CUI’s ac-dc EMC filters further feature a wide input voltage range from 85 to 305 Vac and accept up to 1.5 A of nominal input current. A 2,000 Vac isolation voltage and wide operating temperature range from -40 to +85°C affords additional ruggedness in harsh environments. These ac-dc power filters ultimately provide engineers with a convenient modular solution for addressing EMC and surge challenges, while reducing the need for additional external components.

Flex Power Modules introduces digital PoL regulator for high power density ICT applications
Posted: 2019-3-19

Flex Power Modules introduces dual-output digital PoL regulator for high power density ICT applications

  • High power density and compact size saves board space
  • Flexible dual- or single-output configuration, with output up to 80A
  • Design and debug work simplified with Flex Power Designer software

Flex Power Modules introduces the BMR469 family, a digital point-of-load (PoL) regulator that is ideal for high-current ICT applications. The BMR469 delivers high power density, up to 160A per square inch, which saves valuable board space.

Two variants with different output currents are available, both in compact packages. The 80A BMR4690000 measures 25.4 x 12.7 x 11.6mm (1.00 x 0.50 x 0.46in), while the 50A BMR4696001 provides a low-profile solution with a maximum height of just 5.8mm (0.23in), helping customers who need to find space for a large processor heatsink, or who want to place the PoL regulator on the underside of their PCB. The low height of the BMR4696001 also makes it possible to place it very close to the processor, thus improving transient response.

Both versions are configurable as either dual outputs or a single, higher-power output. This gives customers the flexibility to use one part to cover different requirements, for example to drive different processors or FPGA rails, helping simplify power system design.

The BMR4690000 variant provides two independent 40A outputs for dual configurations, or one 80A rail in single-output operation mode, while the BMR4696001 provides 2 x 25A outputs or one 50A rail in single-output operation mode. Up to four modules can be paralleled for current sharing, delivering a total of up to 320A for the BMR4690000 and 200A for the BMR4696001.

The BMR469 is simple to configure via pin-strap or PMBus, making it easy to set up for different applications. The regulator is also supported by a simulation model in Flex’s Power Designer software, making design and debug work straightforward. In particular, Flex Power Designer’s advanced simulation functions enable customers to optimize configuration parameters, so they can achieve a stable control loop with fast load-transient responses.

The BMR469 is well suited to a broad range of applications in the ICT sector, and in particular is ideal for designs that require high power density and a digital architecture solution, such as test equipment or simulator manufacturers. The BMR469 is capable of providing sufficient power to drive high-end components such as processors, FPGAs and ASICs.

Olle Hellgren, Director of Product Management and Business Development at Flex Power Modules, said: “For demanding ICT applications, the new BMR469 delivers a flexible solution in a small package, addressing multiple design headaches for our customers.” 

For more information, visit flex.com.

ON Semiconductor Introduces New Industrial and Automotive Qualified SiC MOSFETs Complementing a Growing Ecosystem and Bringing Wide Band Gap Performance Benefits to Rapid Growth Applications
Posted: 2019-3-18
SiC MOSFET devices support highly efficient, small form factor, rugged and cost-effective high frequency designs in automotive, renewable energy and data center power systems

ON Semiconductor, driving energy efficient innovations, has introduced two new silicon carbide (SiC) MOSFET devices. The industrial grade NTHL080N120SC1 and AEC-Q101 automotive grade NVHL080N120SC1 bring the enabling, wide-ranging performance benefits of wide band gap technology to important high growth end application areas such as Automotive DCDC and onboard charger applications for electric vehicles as well as solar, and uninterruptible and server power supplies.

The announcement sees the strengthening of ON Semiconductor's comprehensive and growing SiC ecosystem that features complementary devices including SiC diodes and SiC drivers, plus vital resources such as device simulation tools, SPICE models and application information to help design and systems engineers meet their high frequency circuit development challenges.

ON Semiconductor's 1200 volt (V), 80 milliohm (mO), SiC MOSFETs are rugged and align with the needs of modern high frequency designs. They combine high power density with highly efficient operation that can significantly reduce operating costs and overall system size due to smaller device footprints. These characteristics also mean less thermal management is required, further reducing bill of materials (BoM) costs, size and weight.

Key features and associated design benefits of the new devices include class-leading low leakage current, a fast intrinsic diode with low reverse recovery charge, which gives steep power loss reduction and supports higher frequency operation and greater power density, and low Eon and Eoff / fast turn ON and OFF combined with low forward voltage to reduce total power losses and therefore cooling requirements. Low device capacitance supports the ability to switch at very high frequencies which reduces troublesome EMI issues; meanwhile, higher surge, avalanche capability, and robustness against short-circuits enhances overall ruggedness, gives improved reliability and longer overall life expectancy.

A further unique benefit of ON Semiconductor's new SiC MOSFET devices is a patented termination structure that adds to reliability and ruggedness and enhances operational stability. The NVHL080N120SC1 has been designed to withstand high surge currents and offers high avalanche capability and robustness against short circuits. The AEC-Q101 qualification of the MOSFET plus other SiC devices offered, ensures they can be fully utilized in the growing number of in-vehicle applications emerging as a result of increasing electronic content and electrification of powertrains. A maximum operating temperature of 175°C enhances suitability for use in automotive designs as well as other target applications where high density and space constraints are pushing up typical ambient temperatures.

Commenting on the introduction of new SiC MOSFET devices and the overall enhancement of ON Semiconductor's wide band gap ecosystem, Gary Straker, Vice President and General Manager, Power MOSFET Division, Power Solutions Group, ON Semiconductor, said: "Increasingly, the most important applications and current mega trends demand all-round performance beyond that of regular silicon devices. ON Semiconductor's comprehensive SiC portfolio, enhanced by the introduction of these two new MOSFETs and supported by an ecosystem of tools and resources, means that not only can we provide the complete wide band gap component solution, but that we can lead engineers through the development and design-in process to achieve a solution that performs to expectations, is cost-effective and has reliability coupled with longevity."

Additional resources & documents:

Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC® Digital Signal Controller (DSC) Family
Posted: 2019-3-13
New dsPIC33C devices meet market demand for more memory and functional safety features in automotive and wireless charging applications

System developers designing high-end embedded control applications need flexible options to provide scalability as projects increase in complexity. To meet these needs, Microchip Technology Inc. (Nasdaq: MCHP) today announced new dual- and single-core dsPIC33C Digital Signal Controllers (DSCs) with more options to meet changing application requirements across memory, temperature and functional safety.

Microchip’s new dsPIC33CH512MP508 dual-core DSC enables support for applications with larger program memory requirements. The dsPIC33CK64MP105 single-core DSC adds a cost-optimized version for applications that require smaller memory and footprint. Developers can easily scale across product lines using the new devices, which are pin-to-pin compatible within the dsPIC33CH and dsPIC33CK families.

The dsPIC33CH512MP508 (MP5) family expands the recently introduced dsPIC33CH with Flash memory growing from 128 KB to 512 KB and triples the program RAM from 24 KB to 72 KB. This enables support for larger applications with multiple software stacks or larger program memory, such as automotive and wireless charging applications. More memory is needed to accommodate AUTOSAR software, MCAL drivers and CAN FD peripherals in automotive applications. Implementing wireless charging in automotive applications requires additional software stacks for the Qi protocol and Near-Field Communication (NFC), driving the need for even more program memory. Using Live Update capability for real-time firmware updates is essential for high-availability systems but also doubles the overall memory requirement. In the dual-core devices, one core can function as a master while the other is designed as a slave. The slave core is useful for executing dedicated, time-critical control code while the master core is busy running the user interface, system monitoring and communications functions. For example, having two cores facilitates partitioning of the software stacks for parallel execution of the Qi protocol and other functions such as NFC to optimize performance in automotive wireless charging applications.

The dsPIC33CK64MP105 (MP1) family extends the recently introduced dsPIC33CK family with a cost-optimized version for smaller memory and footprint applications, offering up to 64 KB Flash memory and 28- to 48- pin packages. Package sizes are available as small as 4 mm x 4 mm. This compact device offers the ideal combination of features for automotive sensors, motor control, high-density DC-DC applications or stand-alone Qi transmitters. Both single- and dual-core dsPIC33C devices enable fast deterministic performance for time-critical control applications, providing expanded context selected registers to reduce interrupt latency and bringing faster instruction execution of math-intensive algorithms.

“With 76 dsPIC33C single- and dual-core devices in the family, the common tools, common peripherals and footprint compatibility make it easier for customers to scale as their memory, I/O, performance or budget needs change,” said Joe Thomsen, vice president of Microchip’s MCU16 business unit. “In addition, the dual-core options enable easier software integration for separate software development teams to focus on control algorithms versus communications and housekeeping code.”

All devices in the dsPIC33C family include a fully featured set of functional safety hardware to ease ASIL-B and ASIL-C certifications in safety-critical applications. Functional safety features include multiple redundant clock sources, Fail Safe Clock Monitor (FSCM), IO ports read-back, Flash Error Correction Code (ECC), RAM Built-In Self-Test (BIST), write protection, analog peripheral redundancies and more. A robust set of CAN-FD peripherals, along with the new support for 150°C operation, make these devices ideally suited for use in extreme operating conditions such as under-the-hood automotive applications.

For more information, visit the Microchip website at www.microchip.com.

TI Building automation solutions designed with your application in mind
Posted: 2019-3-12
Design confidently with logic solutions

Building automation solutions continue to evolve at a rapid pace, adding new capabilities such as wireless connectivity, artificial intelligence, and fault monitoring. To support these advanced features, a more diverse set of sensors, analog, digital, and embedded technologies are required. Logic solutions play a critical role in helping designers bring these components together efficiently in applications such as video surveillance, HVAC and building security.

Robust system performance is a key attribute of all building automation systems that often drives the need for specific features in logic devices, including:

  • Glitch free operation;
  • Higher current drive;
  • Extended temperature range;
  • Low power; and
  • Wide Vcc range
Device Description
SN74AXCH1T45 Single-bit dual-supply bus transceiver 
2N7001T  1-Bit dual-supply buffered voltage signal converter 
SN74AUP1G08 Low-power single 2-input positive-AND gate 
SN74AXC4T245 4-bit dual-supply bus transceiver 
TXB0108  8-Bit bidirectional voltage-level shifter with auto direction sensing and +/-15-kV ESD protect

 
 
           

ABB flash-charging eBus solution reaches a new milestone of half a million km
Posted: 2019-3-7
TOSA flash charging technology has been in operation in Geneva for more than a year and will equip the first 24-meter fully electric bus in Nantes

In little more than a year, Geneva has turned greener thanks to the ABB flash-charging eBus solution. Electric buses equipped with this solution have covered record 500,000 kilometers, transporting millions of passengers and reducing carbon emissions by about 1000 tons.

A technological breakthrough developed for sustainable mass transportation, TOSA is the world’s fastest charging technology and onboard traction system for high frequency and high capacity bus routes. Not only is it environmentally friendly, it also ensures that the fleet is not oversized to cover for electric buses on stand-by for charging. With TOSA, less electric buses are needed, and they can be more easily re-deployed to other lines. It takes less than a second to connect to overhead high-power charging contacts, and only twenty seconds to charge; allowing passengers to get on and off the bus as batteries are topped up.

“This is a complete system to make mobility sustainable for future urban needs and it has been tested in Geneva as the first city in the world,” says Anne Hornung-Soukup, Chair of the Board of Director of Transports publics genevois (tpg), Geneva’s public transport operator in Switzerland.

By now an established technology in the Swiss city, ABB’s flash-charging eBus solution has been selected by Nantes Metropole and will be launched in France. The world’s first 24-meter fully electric bus will go into operation in Nantes – the first time such a long bus will run completely on battery energy.

“We are excited to be among the pioneers in e-mobility, making the new buses – running on their innovative flash-charging solution – part of the Nantes modern public transportation system,” says Stéphane Bis Directeur Technique et Maîtrise d'Ouvrage from Semitan, bus operator in France.

The new electric buses from manufacturer HESS will run on the Busway Bus Rapid Transit route, connecting the historic center of Nantes with municipalities on the southern side of river Loire. It will increase passenger capacity by 35 percent, enabling sustainable transportation for up to 5,000 commuters per hour. Free from overhead lines, TOSA will also have minimal aesthetic impact on the cityscape.

“It is truly exciting to see what future mobility will look like. Together with our partners, we developed some unique technologies”, says Patrick Fragman, head of ABB´s grid integration business.

Links:

Powerbox Announces Power Solution for High Speed E-Commerce Hub Conveyers
Posted: 2019-3-6
  • Designed for factory automation and intelligent conveyers
  • Three phase input, 323 to 560VAC
  • 24V, 250W with 480W peak power for motor start or high capacitive loads
  • High ingress protection level for harsh environments (IP54)
  • Up to 94% efficiency

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the introduction of its ENI250A series designed to deliver peak power to motor start or/and high capacitive loads in factory automation applications. The three-phase ENI250A series is housed in an IP54 case, delivers a constant 250W and up to 480W peak power with an efficiency up to 94%. The ENI250A includes a microcontroller that offers many possibilities to adjust protection behavior to meet specific customer requirements.

Factory automation is already well established in many industries, but with the progress in Artificial Intelligence (AI), remote communication and the growing demand for shorter customer lead times, it is predicted to explode in coming years. Similarly, the growth of automated parcel-hubs is expected to rise spectacularly. The rapid development of e-commerce has contributed to the creation of highly automated hubs with conveyers, sorting switches and many other equipments requiring efficient and intelligent power solutions able to work in demanding environments.

Parcel hub-designers and hub-operators are facing multiple challenges in having to deal with a large variety and types of equipment. This not only requires high quality, high performances power supplies, but the ability to operate in harsh environments with a complex mix of mechanical, thermal and electrical constraints.

“Designed to meet such demanding requirements with built in high Ingress Protection (IP) for harsh environments, Powerbox’s three-phase ENI250A is not only a robust and efficient power solution but a mechanically reconfigurable platform able to fit different form factors or even direct integration into DC motors. “ Said Martin Fredmark, Powerbox’s VP Portfolio Management. “Equipped with a micro controller, functions like peak power, current limiting, protection mode and behavior, and others can easily be set to suit customers’ specific needs, shortening time to operation and conveyer upgrades.”

Addressing 24VDC motors, the 250W ENI250A24 can deliver 480W peak power for one second, sustain high capacitive loads and manage energy recycling when a DC motor is decelerating or stopping. This function is very important for energy saving and to increase equipment life-time. For higher power or redundancy, the ENI250A24 can simply be paralleled. The unit has an operating temperature range from -25 to +70 degree Centigrade.

Other output voltages are available on demand to power 36V, 48V DC motors, as well customized voltages.

The ENI250A24 includes soft-start, over current, voltage and temperature protection. An LED indicator informs the status of the power supply and a DC-OK signal and remote reset provide for easy integration within the conveyer operation management system. It is designed using Powerbox’s reliable power platform concept and uses an active power factor correction (PFC) in combination with a high efficiency and compact LLC topology.

Exhibiting versatility, the ENI250A24 accepts input voltages from 323VAC to 560VAC three phase, and is designed to meet safety specifications 60950-1 and 62368-1. EMC is in accordance with EN61000-6-3 and EN61000-6-2.

Housed in an IP54 case, the ENI250A24 has dimensions of 250x160x55mm, weighs 1.5Kg and mounting brackets are available for easy installation. Designed for easy integration within customers’ equipment, the ENI250A platform can be factory re-configured to fit specific form-factors.

For more information, visit www.prbx.com.

New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments
Posted: 2019-3-6
As the industry’s only 1 Msps fully AEC-Q100-qualified 16-bit SAR, the 12 new devices are designed to operate in high temperatures and electromagnetic environments

To address applications that demand higher-speed and higher-resolution analog-to-digital conversion, Microchip Technology Inc. today announced 12 new Successive Approximation Register (SAR) Analog-to-Digital Converters (ADCs) along with a companion differential amplifier designed specifically for the new portfolio of SAR ADCs. Designed to operate in high temperatures and high electromagnetic environments, the MCP331x1(D)-xx family includes the industry’s only one million samples per second (Msps) fully AEC-Q100-qualified 16-bit SAR, providing the reliability required for automotive and industrial applications. The MCP6D11 differential amplifier provides a low-distortion, high-accuracy interface to achieve the full performance of the ADC within systems.

The MCP331x1(D)-xx family ranges in resolution from 12-, 14- and 16-bit, with speed options ranging from 500 kilosamples per second (ksps) to 1 Msps, allowing developers to choose the right ADC for their designs. A fixed low analog supply voltage (AVDD) of 1.8V and low-current operation (1.6 mA typical active current for 1 Msps and 1.4 mA for 500 ksps) enables this family of ADCs to have an ultra-low power consumption, while maintaining a wide input full-scale range.

These devices support a wide digital I/O interface voltage (DVIO) range (1.7V - 5.5V) which allows it to interface with most host devices, including Microchip’s PIC32, AVR® and Arm®-based microcontrollers and microprocessors. This eliminates the need for using external voltage level shifters. The MCP331x1(D)-xx family contains both single-ended and differential input voltage measurement options, enabling systems to convert the difference between any two arbitrary waveforms. Ideal for applications such as high-precision data acquisition, electric vehicle battery management, motor control and switch-mode power supplies, the AEC-Q100-qualified family provides reliable performance across harsh environments. 

Properly interfacing a small analog signal to a high-speed, high-resolution ADC without introducing additional noise and distortion is a critical challenge. Microchip’s MCP6D11 differential amplifier is designed specifically to address this challenge, providing a low-distortion and high-accuracy interface to properly drive the ADC.

“The ADC market and applications are pushing toward higher resolution, higher speed and higher accuracy,” said Bryan J. Liddiard, vice president of Microchip’s mixed-signal and linear business unit. “In addition, lower power consumption and smaller packaging are also tremendously important, and these products address all these demands.”

For more information, visit the Microchip website at www.microchip.com.

CUI Inc - USB Cable Assemblies Added to CUI’s Interconnect Portfolio
Posted: 2019-3-6

CUI’s Interconnect Group today announced the addition of USB cables to its existing portfolio of connector and cable assembly products. The USB cable assemblies come available with USB Type A, USB Type B, Micro B, Mini B, and USB Type C plugs and receptacles, along with dc power plugs, blunt cut, and stripped and tinned terminations. Joining CUI’s line of ac power cords, these USB cables comply to USB 2.0 and USB 3.1 Gen 1 standards, while offering a flexible range of options and customizations to address a designer’s data transfer or power delivery needs.

Housed in either PVC or a TPE, halogen free jacket material, all USB cable models are shielded and come in black or white 1-meter lengths with a 24, 26, 28, or 32-wire gauge, depending on the series. The USB cables carry nominal 20 Vdc voltage ratings, 1 to 3 A current ratings, and an operating temperature range from -20 to +80°C. All models further comply with RoHS and the UL94V-0 flammability rating.

“The addition of USB cables to CUI’s Interconnect portfolio is a natural extension of our USB connectors line,” stated David Carroll, Direct of Product Management at CUI. “This new product introduction furthers CUI’s pursuit to ease the component selection process for engineers by providing them with a complete interconnect solution, from cable to connector,” Carroll concluded.

View details for CUI’s USB cables

TI: Face your smart meter design challenges
Posted: 2019-3-5
Problem solved with reference designs

Are you currently designing a water, gas or electricity smart meter and facing a host of challenges? We have you covered. Check out our fully-tested reference designs for maximizing battery life, improving flow measurement accuracy and mitigating the threat of tampering.

Cornell Dubilier: Type RA, Stacked Polyester Capacitors
Posted: 2019-2-19
Type RA capacitors are constructed using stacked metallized polyester protected with an impregnated sealant, which eliminates the need for an external case.

Cornell Dubilier announces availability of its Type RA  multilayered film capacitors for 125°C operation. Type RA capacitors are constructed using stacked metallized polyester protected with an impregnated sealant, which eliminates the need for an external case. This package style offers the highest energy density technology available for switching power supplies, DC to DC converters and other high ripple current applications.

Type RA capacitors are impregnated with a microcrystalline polymer sealant and exterior tape wrap that protects the capacitor element from moisture, allowing it meet 85 °C/ 85% RH requirements for demanding applications in military vehicles and aerospace.

Available in capacitance values ranging from 0.1 µF to 10.0 µF, voltage ratings of 100, 250, 400 and 500 Vdc, Type RA capacitors are terminated with radial leads to cover a broad range of applications in power electronics where high density capacitors are needed for board-level DC filtering.

Cornell Dubilier RA capacitors series are available through our key franchised distributor sites for quick turnaround on prototype and preproduction quantities.
Since its founding in 1909, Cornell Dubilier has been dedicated to advancing capacitor technology for new applications. The company combines innovative products with engineering expertise to provide reliable solutions for inverters, wind and solar power, electric vehicles, power supplies, motor drives, HVAC, motors, welding, aerospace, medical equipment, telecom and UPS systems.

For more information on this series visit www.cde.com/ra

ON Semiconductor Introduces the RSL10 Sensor Development Kit for Power-Optimized IoT Applications
Posted: 2019-2-14
Out-of-the-box sensor platform provides enhanced sensor technology with industry's lowest power Bluetooth® Low Energy

ON Semiconductor, driving energy efficient innovations, is pleased to announce the introduction of the RSL10 Sensor Development Kit, designed to provide engineering teams with a comprehensive platform for developing IoT applications with cutting-edge smart sensor technology, and enabled by the industry’s lowest power Bluetooth Low Energy radio.

The RSL10 Sensor Development Kit brings together the highly integrated RSL10 System-in-Package (RSL10 SIP) with a range of advanced low power sensors from Bosch Sensortec. The development platform provides 9 degrees of freedom (DoF) detection and environmental monitoring, including ambient light, Volatile Organic Compounds (VOC), pressure, relative humidity and temperature. An ultra-low noise digital microphone is also included, along with a user-programmable RGB LED, three programmable push-button switches, and 64 kbit of EEPROM.

Commenting on the introduction of the RSL10 Sensor Development Kit, Dr. Peter Weigand, Vice President of Marketing, Bosch Sensortec, said: “We were excited to work with ON Semiconductor on the RSL10 Sensor Kit. This small form-factor platform includes Bosch Sensortec’s highly integrated BME680 environmental sensor to detect a broad range of gases for air quality applications, as well as our BMM150 geomagnetic sensor and the BHI160 smart sensor for high accuracy motion sensing. The RSL10 Sensor Kit combines motion and environmental sensing with the ultra-low power capabilities of the Bluetooth 5 certified RSL10 to enable a new class of consumer and industrial IoT applications with improved sensor technology and longer battery life.”

Using the RSL10 Sense and Control mobile application, developers can connect to the RSL10 Sensor Development Kit to monitor sensors and to evaluate the kit’s features (optional right out-of-the-box). The app also supports multiple commercial cloud platforms for uploading sensor data.

Wiren Perera, who heads IoT at ON Semiconductor, added: “The RSL10 Sensor Development Kit, enabled by the industry’s lowest power Bluetooth Low Energy radio, will set the standard for ultra-low-power Bluetooth enabled smart sensor design. We are delighted to have the support of Bosch Sensortec in bringing the RSL10 Sensor Development Kit to market.”

The RSL10 Sensor Development Kit is available now from ON Semiconductor alongside a number of other energy-efficient rapid prototyping platforms for IoT, including the Bluetooth IoT Development Kit and the recently-introduced Energy Harvesting Bluetooth Low Energy Switch. The RSL10 is available in a 5.5 mm2 WLCSP, a 6mm by 6mm QFN package, and a complete System-in-Package (SiP) with an integrated antenna.

For more information, visit www.onsemi.com.

CUI Inc - 3 W and 5 W Encapsulated Ac-Dc Power Supplies Offer Multiple Mounting Options
Posted: 2019-2-12

CUI’s Power Group today announced the addition of 3 W and 5 W models to its line of low power, encapsulated ac-dc power supplies. Available in board mount, chassis mount, wire lead, and DIN rail configurations, the single output PSK S3 and PSK S5B series are housed in compact packages measuring as small as 1.46 x 0.97 x 0.71 inches (37 x 24.5 x 18 mm), making them well suited for space-constrained low power ITE, industrial control, automation, and consumer electronics applications. Designed for easy installation, the wire lead PSK S3 L and PSK S5B L series, chassis mount PSK S3 T and PSK S5B T series, and DIN rail mount PSK S3 DIN and PSK S5B DIN series afford engineers additional options for simpler design implementation.

These encapsulated modules feature 4 kVac input to output isolation, a universal input voltage range of 85 to 264 Vac, and a wide operating temperature range from -40 up to +70°C. The series also offer single output voltages of 3.3, 5, 9, 12, 15, and 24 Vdc, along with over current, over voltage, and continuous short circuit protections.

All models are certified to the new IEC 62368-1 safety standard for ICT and AV equipment, while meeting CISPR32/EN55032 Class A limits for conducted and radiated emissions. Featuring class II construction, these encapsulated ac-dc power supplies further carry a minimum MTBF of 300,000 hours at +25°C ambient, per MIL HDBK 217F.

For more information, visit www.cui.com.

 

Flex Power Modules broadens portfolio to meet rising demand in industrial and railways sectors
Posted: 2019-1-13
  • Broad range of voltages and features to meet the needs of many diverse applications
  • Encapsulated packaging for reliable operation in harsh conditions
  • Flex Power Modules builds on reputation in ICT market with new capabilities for industrial and railways sectors

Flex Power Modules is introducing new DC-DC power modules for the industrial and railways sectors, broadening its product range to meet increasing demand in these sectors, as well as providing additional versions of existing products, with different input/output voltage ranges. The modules are provided in sealed and encapsulated packaging, to ensure they will work reliably when subjected to dust, moisture, severe vibration and other harsh conditions.

For industrial applications, Flex Power Modules provides high-reliability, high-performance and rugged DC-DC solutions in standard form factors, often running from 24V or 12V supply voltages, rather than the 48V more commonly found in information and communications technology (ICT) applications.

For railway applications, the company provides a series of products that can meet the most stringent electrical and environmental specifications. Modern railway systems need a wide range of DC-DC converters to power different monitoring and control units, and the new series of products mean that Flex Power Modules can now meet a broader range of requirements.

Olle Hellgren, Director of Product Management and Business Development at Flex Power Modules, commented: “While Flex Power Modules has traditionally been best known for its power products in the ICT sector, we have always had a strong offering for the industrial and railways sectors, and the success of our existing PKE and PKM-A modules has encouraged us to invest in offering more products for these applications – to ensure more customers can benefit from the high quality and reliability of our power solutions.”  

The DC-DC modules support a wide range of input voltages, to cover the needs of different applications. For industrial products, this includes 9 to 36V, 18 to 36V, 9 to 75V and 18 to 75V. Other modules provide input ranges of 43 to 160V and 66 to 160V, to cater to different railway application bus voltages, including 72V, 96V and 110V.

Flex Power Modules provides multiple product families for the industrial and railway sectors, and currently offers five ranges: the PKV Series (1.65-3W), PKE 3000 Series (15-30 W / Vin at 9-36 V), PKE 5000 Series (15-30 W / Vin at 18-75 V), PKE 8000A Series (40 W / Vin at 9-75 V) and PKM 7000A Series (100W / Vin at 66-160 V). The new products are well suited to a broad range of applications, including process control, factory automation, robotics, alternative energy, smart grid, and test and measurement. More families and additional input and output voltage combinations will be added in the coming months.

Additionally, the company’s PKR and PKU-E product families – which are already available to customers – are also suitable for industrial applications.

For more information, visit flex.com.
 

Digital and Analog MEMS Microphones Added to CUI’s Audio Product Group
Posted: 2019-1-10

CUI’s Audio Group today announced the introduction of a comprehensive line of MEMS microphones ideal for a range of portable electronic devices. Boasting improved audio quality, performance, and reliability, CUI’s CMM series is housed in extremely compact, low profile footprints measuring as small as 2.75 x 1.85 x 0.95 mm. As reflow solder compatible components, these MEMS microphones will afford designers additional flexibility where surface mount assembly is required, making them well suited for audio recording and voice capture in smart phones, tablets, smart home devices, wearables, and more.

CUI’s MEMS microphones are omnidirectional and available in analog or digital pulse density modulation (PDM) output types with top or bottom port locations. Offering round or rectangular form factors, the CMM series models carry sensitivity ratings from -44 up to -26 dB and signal to noise ratios from 57 up to 65 dBA. These MEMS microphones also deliver reduced vibration sensitivity, low current draw down to 80 microamps (µA), and wide operating temperature ranges from -40 up to +105°C. With tight sensitivity tolerances as low as ±1 dB, the CMM series is a perfect fit for array applications used to perform functions such as beam forming and noise cancelation. A unique inner chamber construction also provides more stable performance and gives these silicon-based microphones added protection against moisture and dust.
 

ON Semiconductor Announces Strata Developer StudioTM, Industry's Most Comprehensive Research, Evaluation and Design Tool
Posted: 2019-1-3
Innovative cloud-based platform significantly accelerates device and system evaluation and simplifies the design process for development teams

ON Semiconductor, driving energy efficient innovations, is announcing the introduction of the Strata Developer StudioTM, a first-of-its-kind cloud-based development platform that provides a seamless, personalized and secure environment for engineers to evaluate and design with ON Semiconductor technologies.

The Strata platform will provide a faster and simpler way for engineers to work with evaluation and development boards, delivering the latest documentation, product information, design and application notes, and reference design files straight to the desktop. This unparalleled functionality makes Strata the most comprehensive design tool available in the industry.

All of ON Semiconductor's new evaluation boards will in the future be 'Strata-Ready,' meaning they will automatically be recognized by the Strata Developer Studio when they are connected to the host computer. This platform provides design teams with a user interface to the board, giving direct control of the configuration parameters and visual feedback of the board's functionality. At the same time, Strata will download all the design information an engineer needs to start evaluation or design.

"We reimagined the research, evaluation, and design process of hardware systems, creating a holistic Software as a Service (SaaS) solution to unencumber and speed customers in their quest to develop innovative new products," said Edward Osburn, Strata Project General Manager at ON Semiconductor. "Gone are the archaic and outdated hardware evaluation paradigms hampering our customers' ability to deliver amazing products."

The Strata Developer Studio is provided as a Microsoft signed application connecting to the company's SaaS platform. It features secure authentication, data transfers and full information containment using encrypted and EU General Data Protection Regulation (GDPR) compliant databases. All information and security follows National Institute of Standards and Technology (NIST) Cybersecurity guidelines.

"Strata brings the world of information to you in a single, secure application," commented Ian Cain, Director of Software and Chief Architect of Strata at ON Semiconductor. "Security First and Security Built In was followed throughout the software development life cycle, providing the user with full privacy and content controls."

Patrick Moorhead, Founder, President and Principal Analyst at Moor Insights & Strategy, said: "Enabled by rapidly evolving electronics technology, products and systems in most sectors are renewing with exciting and enhanced capabilities at a relentless rate. This puts pressure on design engineers to get products to market as quickly as possible to gain competitive edge. That's where tools that support research, evaluation and design come in, and Strata sets a high bar at a new level in terms of speeding and easing the process."

The roadmap for the Strata Developer Studio will see its functionality increase rapidly, as new boards are supported and new features are added. Initial boards include a Configurable Multifunction Logic Gate, a Dual 100W USB-PD Automotive Charging System, and a Universal Offline 200W 4-Port Type-C USB-PD Source. For more information and to order a board, visit www.onsemi.com/strata.

PSMA Publishes Technology Report: 3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies
Posted: 2018-9-6
Comprehensive report is the first to address higher power embeddable passives that will accelerate the development of higher density power sources using new, 3D disruptive packaging technologies

The Power Sources Manufacturers Association (PSMA) Packaging Committee announces the publication of its latest report titled, “3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies.” This is the third in a series of reports focused on using embedded substrate technology for building power sources. It is the first extensive study of embeddable passive components both available and in development for use in the power path of power sources. The report contains extensive research and product illustrations geared to an audience of technology executives and design engineers.

Miniaturization of passive components without compromising their power handling and efficiency and their integration with actives has always been a key focus for power packaging. There is also an increasing trend to vertical or 3D package integration to address the performance issues by eliminating parasitics from interconnections. Embedding gives lowest package inductance and enables co-integration of power systems and drivers in a single package with direct interconnection between gate driver circuits and switches with shortest interconnection length. This has become even more important with the rapid emergence of wide bandgap power switching devices. This, however, leads to several process integration and reliability challenges that need to be systematically addressed.

Georgia Tech Packaging Research Center, under contract from PSMA systematically surveyed the recent advances in passives, active embedding and 3D passive-active integration to generate this report, with emphasis on 3D power packaging enabled by advances in passive components and embedding of actives in power packages. A detailed literature study was conducted on key advances in embedded passive technologies and related topics. Emerging nanomaterials, processes and technologies are described in detail for inductors, capacitors and resistors. Nanostructured materials provide additional degrees of freedoms in enhancing the properties to improve the performance metrics such as volumetric density and efficiency of the components. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted in advancing the components to improve performance. Industry leaders were surveyed to get the recent technology advances in each category. Roadmaps are projected for passive component advances and active embedding technologies.

The trends and roadmaps in 3D power packaging are also described in three categories: low power (1-100 W), medium power (100-1000 W) and high power (10-100 kW). Integration in each category is classified into lead-frame-based, substrate-embedding based and traditional ceramic substrates. Active embedding with panel-scale substrate manufacturing is also reviewed in detail. Recent innovations in substrate materials and associated reliability challenges such as via cracking, dielectric cracking or electric breakdown are highlighted. Advances in die-attach solutions with sintered nanocopper are reviewed, highlighting the evolution of low-stress sintered copper-based die-attach solutions.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded passives in 3D power packaging to create the significantly higher power densities.

The PSMA report on 3D packaging was provided free of charge to PSMA Regular and Associate Company members.  Additional copies may be purchased at the member price of $290. PSMA Affiliate members may also purchase the report for $290. The report is available to non-members for purchase on the PSMA website (www.psma.com/publications) for the price of $3,490.

Provided by the PSMA Packaging Committee.

Brian Narveson
Co-chairman
  Brian Narveson   Ernie Parker  
Ernie Parker 
Co-chairman

 

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