New product announcements

RECOM Eighth-Brick DC/DCs have High Efficiency
Posted: 2021-12-8
RECOM adds 100W and 300W DC/DCs in eighth-brick format to product range

RECOM has introduced two new cost-effective DC/DC products with outputs of 100W and 300W in a DOSA-compatible low-profile, through-hole eighth-brick format (58.4mm x 23mm).

The RPA100E-W 100W part has a wide 4:1 input range of 16-72V for nominal 24V, 28V and 48V supplies, and fully regulated 5V and 12V trimmable outputs are available. Full power is available to 50°C ambient in natural convection and to +85°C with forced air. Isolation is 1.5kVDC/1 min, basic grade.

The RPA300E 300W part has an input range of 36-75V for nominal 48V supplies and features an output trimmable over a wide range of 16-35V. Isolation of this part is 2.25kVDC/1 min, basic grade. The RPA300E has an integrated heat spreader that allows direct screw-fixing to a heatsink or cold wall. Full-load operation of this part without heatsinking is to 60°C with forced air and to 85°C with load derating.

Both product ranges have high power density with a typical efficiency of 94.8% (RPA300E) and 92% (RPA100E). High efficiency >90% is also maintained down to light loads, to suit applications with low standby loss requirements. The ranges include comprehensive protection against input under-voltage, short circuit, output over-current, over-voltage and over-temperature. Control features included are on/off control and remote sensing.

The RPA100E and RPA300E ranges are certified to UL/CAN/CSA 62368-1 safety standard for basic isolation and are compliant to EMC standard CISPR22 class B with an external filter.

The footprint of both parts is industry-standard DOSA-compatible, and the 100W part is just 11mm profile while the 300W part is 12.7mm. Pin-out is also standard and compatible with quarter-bricks allowing possible space saving in some applications without sacrificing power rating.

“The RPA100E and RPA300E eighth-brick DC/DCs are great examples of our commitment to develop high power-density converters” commented Matthew Dauterive, DC/DC product manager of RECOM. “They will find applications in all demanding industries from telecom, test and measurement, in data centers, industrial automation, and in PoE”.

For more information go to

Power Integrations LinkSwitch-TNZ Enables Ultra-Flexible Smart Dimmer Switch Designs
Posted: 2021-12-8

A new Bluetooth Low Energy (BLE) smart dimmer wall switch design showcases the unmatched level of integration realized by the LinkSwitch-TNZ IC family. Design example report DER-865 is now available for download.


LinkSwitch-TNZ combines offline power conversion with lossless zero-cross detection in a single IC. This eliminates discrete circuits for detecting AC line zero-crossing that typically use 10 or more components and burn 50 to 100mW of continuous power. The result is a highly efficient, ultra-flexible dimmer design applicable to different regions and building wiring setups.

DER-865 describes a 90 to 305 VAC universal-input dimmer wall switch suitable for both 2-wire (no-neutral) and 3-wire applications. It powers 3 to 250 W low- and high-power factor dimmable lamps, and is selectable between leading-edge (forward) dimming mode generally used in America and trailing-edge (reverse) mode more common in Europe.

LinkSwitch-TNZ ICs provide best-in-class light-load efficiencies, enabling more system features to be powered while meeting stringent standby regulations. DER-865 draws lower than 200 µA standby input current (including BLE). It complies with EN55022 and CISPR-22 Class B conducted EMI.

The design allows both manual and app-based dimming. A demo app for the latter is available for download in the Apple App Store.

To learn more, download DER-865 and the LinkSwitch-TNZ data sheet on our website. While you are there, don't forget to try our PI Expert Online software and turn your specifications into ready-to-build designs within minutes.


Cost-efficient SOIC-16 DC/DC range added by RECOM
Posted: 2021-12-8
RECOM adds 1W and 0.5W options to their SOIC-16 family of DC/DC converters

RECOM has extended its range of DC/DC converters in a SOIC-16 package with new versions which offer even better value. The parts feature 5V (4.5-5.5V) inputs and a semi-regulated 5V output rated at either 0.5W (R05C05TE05S) or 1W (R05CTE05S). Line and load regulation figures are specified across the full temperature range, and there is no minimum load requirement, making the parts ideal for applications that have light-load operation modes.

Both parts have a 3kVDC/1 min (basic) insulation rating with greater than 8mm input/output creepage and clearance, and operate from -40°C to 125°C with derating. Isolation capacitance is just 7pF. Protection features include short-circuit, over-current, over temperature, and input undervoltage, making the parts highly suitable for applications that demand a high level of reliability and robustness. EMI levels are also particularly low compared with more expensive competing products.

The SOIC-16 package is just 10.35mm x 7.5mm footprint and 2.5mm profile, perfect for space-constrained designs. The two parts are pin compatible, allowing future upgrades from 0.5W to 1W if necessary. The DC/DCs are also partially pin compatible with the higher specification RECOM R05CT05S, which includes features such as remote on/off and reinforced isolation.

Applications for the two ranges include isolated COM port power supplies, gate drive power, current sensing/smart metering, medical devices, industrial PLC (I/O), and sensors for IoT/IIoT.

“These new DC/DCs are a low-cost alternative when all the features of our higher spec SOIC-16 parts are not needed”, commented Matthew Dauterive, DC/DC product manager of RECOM. “Even so, they still are manufactured with the same automated process with advanced transformer fabrication technology for the highest reliability in critical applications”.

For more information go to

TDK offers miniaturized, highly sensitive MEMS pressure sensor element
Posted: 2021-12-8

TDK Corporation presents the new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

The pressure sensor element with ordering code B58601E35* works according to the piezoresistive principle via a Wheatstone bridge and is certified for an operating voltage of up to 10 V. Offering a high sensitivity of 110 mV/V/bar, C35 is well suited for applications with high demands of sensitivity, accuracy and long-term stability of 0.1% FSON. Furthermore, C35 is designed for a wide temperature range from -40 °C to +150 °C and is suitable for pressure measurements of non-aggressive gases and liquids. The main uses are in applications that require high reliability and extremely precise pressure measurement, such as medical engineering and the industrial and automotive sectors.
Main fields of application
Pressure measurement in demanding applications such as medical engineering as well as in the industrial and automotive sectors
Main features and benefits
•Measuring range of 0 to 100 mbar
•High sensitivity of 110 mV/V/bar
•High long-term stability (LTSV0) of 0.1% FSON
•Extremely low dimensions of just 2.05 x 2.05 x 1.2 mm
•Wide temperature range of -40 °C to +150 °C

New Textbook: GaN Power Devices and Applications
Posted: 2021-12-8
Edited by Alex Lidow, Ph.D.

Since the 2019 release of the 3rd edition textbook, GaN Transistors for Efficient Power Conversion, published by J. Wiley, there has been rapid adoption of GaN transistors and integrated circuits into a myriad of end-use applications such as robots, drones, AI computers, AC adapters, autonomous vehicles, and even vacuum cleaners.

This book, GaN Power Devices and Applications, provides an update on gallium nitride technology and applications by leading experts. The book starts with two years of new information on technology developments, design techniques, and reliability beginning right after the publication of the 3rd edition textbook. In a practical sense, this book includes detailed descriptions of the latest examples of GaN’s usage in power supplies, lidar, motor drives, and space applications.

Powerbox Announces 700W Power Supply Optimized for Conduction Cooling Applications
Posted: 2021-12-1

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, has announced the release of a new 700W power supply for industrial applications, the OFI700A. Optimized for conduction cooling, the OFI700A delivers high performance levels across a baseplate temperature range of -40 to +95 degrees C, without the use of a fan. The power supply operates with a wide universal input range from 85 to 264VAC with power factor correction (PFC) and is available with DC outputs of 12V, 28V (adjustable to 24V) or 48VDC. A 12V auxiliary is also provided.
In many industrial applications cooling of the dissipating elements relies on the use of fans and blowers. But there are applications where it is not possible or even allowed to use active ventilation. In harsh environments or in applications where the required reliability level imposes the need to remove all possible risk of failure, fans and blowers are not allowed. A sealed box such as is required for laser-cutting is but one example, but there is also a growing demand for equipment installed in supervisory rooms or even offices that for the comfort and health of the employees, generated noise is simply not allowed or needs to be very much limited.
Conduction cooling requires very specific building practices and the PRBX OFI700A has been designed to guarantee optimal heat transfer from the dissipating components to the baseplate, delivering a high level of performances within an operating temperature of -40 to +95 degree centigrade at baseplate. Depending on the assembly method and the overall cooling conditions, a derating may apply as specified in the technical documentation. To cover a wide range of applications, the OFI700A operates with a wide universal input range from 85 to 264VAC. The unit includes a PFC with a coefficient of 0.95/0.92 (110VAC/230VAC). For applications powered by a DC bus e.g., mining equipment, the OFI700A operates from 120 to 350VDC.
The OFI700A is available in three versions of single output DC voltage, 12V/58.4A ; 28V/25A and 48V/14.6A. The output voltage can be adjusted using the provided onboard potentiometer. For example, the 28V output can be adjusted from 22.4V to 33.6V, covering the 24V applications. An additional voltage of 12V/0.1A is provided for auxiliary functions. For applications requiring 1+1 redundancy it is possible to connect two units in parallel, adding an external diode to protect the unit. Using a diode for this purpose is a simple solution but it increases power losses which depending on the output current could be as high as 30W. So, to maintain the highest level of efficiency when operated in redundancy-mode, an ‘option O’ OFI700A version is available with active ORing circuitry deploying high performance FET technology. In this version the power losses are minimized to an excellent less than 1.5W.
For safety, the OFI700A has an IN/OUT isolation of 3,000VAC and IN/FG of 2,000VAC. Output isolation to FG is 500VAC. The power supply includes over current protection with auto recovery, over voltage and over temperature protection. The OFI700A board includes easy access to auxiliary functions via on board connectors, namely: Remote Control, Output Voltage Sensing, DC-OK, Inverter Operation Mode (IOG) and auxiliary 12V. The OFI700A has endured shock and vibration testing as specified in MIL-STD-810H. In that respect the products have been tested to levels far above normal operating conditions and are specified to sustain a high 20G vibration level during transportation. The OFI700A is certified in accordance with UL62368-1, C-UL (equivalent to CAN/CSA-C22.2 No.62368-1), EN62368-1. The OFI700A series has a full three-year warranty and conforms to the European RoHS, REACH and Low Voltage Directives. The product carries the UL, CE and UKCA marks.
For more information, visit
KEMET Introduces the Smallest EMI X2 Film Capacitor Solution for Harsh Environments
Posted: 2021-10-27
R53 film capacitor is miniaturized, AEC-Q200 qualified and has the highest IEC robustness classification for applications requiring the highest reliability and extended life under severe, harsh environmental conditions.

KEMET, part of the YAGEO Group and leading global electronic components supplier, announces its new R53 series of miniature, polypropylene film X2 EMI (electromagnetic interference) suppression capacitors. This series fulfills the growing need for automotive, industrial, consumer, and energy applications that require a smaller, high-capacitance X2 class solution for suppressing EMI. The R53 series offers capacitance values from 0.1µF to 22µF, lead-spacing from 15mm to 37.5mmm, 85/85 THB Class IIIB classification, and long-life stability in harsh environmental conditions. Its volume, on average, is 60% smaller than competitive X2 class capacitors, enabling a smaller PCB area, reduced weight, lower costs and improved reliability. These features position R53 as an exceptional X2 class solution that addresses design engineers' size, capacitance, and reliability challenges across multiple industries.

Currently, available solutions comparable to the R53 series have either larger dimensions or require capacitors in parallel in the design. With a rated 310Vac at 50 or 60Hz, this series is intended for use in Class X2 line-to-line applications or in series with the AC mains. R53 is well-suited for AC/DC converters in onboard chargers for xEVs, smart grid hardware, EMI filtering in Variable Frequency Drivers (VFDs), LED drivers, and high energy density applications such as capacitive power supplies. R53 series features a metallized polypropylene film encapsulated in a self-extinguishing resin and a shell that meets UL 94 V-0 requirements. The metallized polypropylene film combined with an internal parallel construction provides self-healing properties to prevent catastrophic failure and extend service life.

Electronic component miniaturization and operation in harsh environmental conditions are growing in applications, such as onboard chargers, smart electric meters, capacitive power supplies, including connection in series with the mains, motor drives, wind, and solar inverters. R53 capacitors are AEC-Q200 qualified, designed for harsh environments, and meet the highest standards of reliability required for smart grid hardware, often located in limited access areas where regular service is not available.

The R53 series is available immediately via KEMET distributors. To learn more about its capabilities and applications, visit

Power Integrations Introduces the InnoSwitch3-PD Family of Flyback Switcher ICs with Built-In USB PD Controller
Posted: 2021-10-27
A fully integrated charger solution combines USB PD, PPS, PowiGaN and FluxLink to maximize efficiency and slash component count in adapters and chargers

Power Integrations the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the InnoSwitch™3-PD family of ICs, the industry's most highly integrated solution for USB Type-C, USB Power Delivery (PD), and USB Programmable Power Supply (PPS) adapters. This compact InSOP™-24D-packaged IC includes a USB-C and PD controller, a high-voltage PowiGaN™ switch, a multi-mode quasi-resonant flyback controller, secondary-side sensing, FluxLink™ isolated digital feedback and a synchronous-rectification driver.

Aditya Kulkarni, senior product marketing engineer at Power Integrations said: “InnoSwitch3-PD ICs target designers seeking the ultimate in charger power density. This requires the highest level of integration and maximum efficiency to limit self-heating. Our latest addition to the InnoSwitch3 family dramatically simplifies the development and manufacturing of compact, energy-efficient USB PD power supplies for smartphones, tablets, notebooks, and other devices that benefit from fast charging. InnoSwitch3-PD ICs reduce the BOM count to half that of conventional designs, reducing design time and simplifying high-volume manufacture for slim, ultra-compact OEM and aftermarket chargers.”

Featuring no-load power consumption as low as 14 mW, power supply designs using InnoSwitch3-PD ICs meet all global energy-efficiency regulations. The high efficiency of these devices ensures low heat dissipation, eliminating the need for bulky heatsinks. Power Integrations’ FluxLink high-speed communications feedback link ensures fast, accurate secondary-side regulation. InnoSwitch3-PD ICs are also fully protected, with input voltage monitoring, accurate brown-in/brown-out and overvoltage protection, and output over- and under-voltage fault detection with independently configurable fault responses.

Availability & Resources

A new design report, RDR-838, describes a 60 W USB PD 3.0 Power Supply with 3.3 V – 21 V PPS output using the InnoSwitch3-PD PowiGaN-powered INN3879C-H801. The new InnoSwitch3-PD ICs are priced from $1.30 per unit in 10,000-unit quantities. For further information, contact a Power Integrations sales representative or one of the company’s authorized worldwide distributors: Digi-Key, Farnell, Mouser and RS Components.

TAIYO YUDEN's Ferrite Wire-Wound Power Inductor NR Series M-Type
Posted: 2021-10-27

Hybrid Type Power Inductor: NR Series M-Type

Enhance your device performance of industrial applications with TAIYO YUDEN’s new hybrid type power inductors for industrial applications. The NR series M-type inductors offer high anti-vibration and heat cycle resistance, along with coplanarity improvement and AOI support. Support operating temperature for up to 125°C.

Product Features

Sleeveless Structure:

  • Large electrode area for higher heat cycle resistance
  • Secure connection to PCB, less risk of open failure, high anti-vibration

Unique Core Design:

  • Improved coplanarity for less mounting risks
  • AOI (automated optical inspection) support enabled by additional side electrode


Great Electrical Performance by Hybrid Structure:

  • Hybrid structure of molding resin and high density magnetic metal materials
  • High saturation current and stable inductance over temperature


Industrial and Automotive Applications



Power Integrations’ New SCALE-iFlex LT Plug-and-Play Gate Driver Improves EconoDUAL IGBT Module Performance by 20%
Posted: 2021-10-27

Power Integrations (Nasdaq: POWI), the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced its new plug-and-play SCALE-iFlex™ LT dual gate-drivers. The new drivers improve the performance of multiple parallel EconoDUAL modules by 20%, allowing users to eliminate one of every six modules from power inverters and converter stacks. In addition to saving the cost of the driver and module, this reduces control complexity and costs related to modules, wiring, hardware, and heatsinking. SCALE-iFlex LT targets multiple applications in renewable energy generation and storage, and is particularly applicable to offshore wind turbines in the 3 to 5 MW range.

Thorsten Schmidt, product marketing manager at Power Integrations commented: “Dynamic and static current sharing is critical for robust operation of modules arranged in parallel. For the same power output, systems using SCALE-iFlex LT require just five parallel modules whereas competitive approaches need six. This substantial saving of cost and complexity is achieved by guaranteeing less than 20 ns of variance in turn-on and turn-off commands between modules and less than 20 A of variance between modules when conducting the rated 600 A. This allows the modules to operate reliably without current derating, which is obligatory with less advanced driver solutions.”

Up to six EconoDUAL 3, or equivalent, power modules can be paralleled from the same Isolated Master Control (IMC) unit which has a more compact outline than conventional products. The Module Adapted Gate drivers (MAGs), which fit the footprint of the EconoDUAL module, each featuring two SCALE-2 ASICs – one per channel – to optimize symmetrical paralleling, efficiency and protection.

The new SCALE-iFlex LT gate-driver modules reduce switching losses by three to five percent, due to the fast turn-on and turn-off of the SCALE-2 ASIC which features an integrated booster stage. Power Integrations’ Advanced Active Clamping (AAC) protection enables higher DC link voltages to be achieved. A full suite of other protection features, including short-circuit, are provided. Drivers feature reinforced isolation to 1700 V and may be ordered naked or conformally coated.

As well as renewable energy, other applications include power quality, commercial air-conditioning units and medium-voltage drives. The new SCALE-iFlex LT gate drivers are available now. For more information, please visit

TDK Develops Industry’s First High-Reliability Chip Beads for Automotive
Posted: 2021-9-29
  • Compatible with high durability soldering in 150 ºC environments
  • Designed for automotive applications such as ECM, ABS, EPS, EV-EHV, inverters and LED headlights

TDK Corporation today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ºC environments. This series marks the industry’s first* high-reliability chip bead specifically designed for automotive applications associated with engine control modules (ECM), anti-lock brake systems (ABS), electric power steering (EPS), electric and hybrid electric vehicles (EV/EHV), inverters and LED headlights.

In high-temperature automotive environments, such as engine compartments, high-durability solder is increasingly used to prevent solder cracks in the bonds between chip components and the mounting substrate. Since high-durability solders do not stretch easily and impart higher stress compared with conventional solders, they place a large load on chip components and do not meet the reliability requirements of existing chip beads. With improvements to the terminal electrode material and plating process, the MMZ1608-HE series improves the bonding strength between the terminal electrode and plating, making it ideal for use with high-durability solder in 150 ºC environments.

The four products in the series have a rated current max ranging from 200 to 300 at 150 ºC, DC resistance max between 0.15 to 0.5, and impedance from 120-1000, respectively.

TDK will continue to expand its lineup of compact sizes and various impedances to support a wide range of automotive specifications and designs.

For more information, visit

TDK announces new miniaturized, common-mode filters for high-temperature automotive applications
Posted: 2021-9-29

TDK Corporation (TSE:6762) today announced the development of its KCZ1210AH series of miniaturized common-mode filters for automotive applications. The series is extremely compact, measuring 1.25 (L) x 1.0 (W) x 0.5 mm (H), which contributes to a smaller footprint on substrate and provides a noise control function for different transmission signal lines for automobiles.

With an increase in advanced driver-assistance systems (ADAS), demands for automotive cameras are rapidly growing. Forward sensing cameras and cameras for around view monitors utilize common-mode filters as anti-noise products. However, as the conventional multilayer common-mode filter operates within a temperature range of -40 and +105℃, it cannot be used for ADAS cameras and was principally used in automotive accessories.

TDK's series uses proprietary materials technology and structural design to achieve a temperature range from -55 to +125℃; it also has a rated current max of 100 and a rated voltage max of 5. By adopting a conductive resin-based electrode, it controls product cracks due to thermal shock and increases durability against mechanical stresses, such as substrate strains.

TDK is working to enhance its inductive devices for ADAS and will expand its line of miniaturized common-mode filters supporting higher-speed differential signals. Mass-production of this series will begin in September 2021.

Further information on the products can be found under

TDK offers miniaturized, high performance thin-film common-mode filters for mobile devices
Posted: 2021-9-29

TDK Corporation has developed the TCM0403M Series of miniaturized thin-film common-mode filters for mobile devices. The 0403 case size (0.45 x 0.3 x 0.23 mm) is 58 % smaller and 56 % lighter than previous products. With its high common-mode attenuation characteristic, these products reduce intruding noise and improve wireless signal reception sensitivity. The common mode attenuation at 2.4 GHz is 21 dB, and 28 dB at 5.0 GHz, with a maximum permissible current of 50 mA. Mass production started in August 2021.

Due to the growing multifunctionality of wireless devices such as smartphones, wearables and other mobile products, noises generated inside the devices are deteriorating wireless signals. It is critical to prevent the deterioration of signal reception sensitivity and to prevent external noise that has the potential to cause device malfunction; this series addresses those common challenges.

The products are mountable in ultra-small spaces due to their 58 % footprint reduction, which was previously impossible with the existing TCM0605 Series (0.65 x 0.5 mm case size). By improving TDK’s proprietary fine pattern technology and optimizing design, the products feature a common-mode attenuation characteristic that equals existing products and a differential transmission characteristic capable of supporting high-speed signal transmission.

TDK’s wide array of products meets the needs for common filters for high-speed differential signal lines, including for USB, MIPI and HDMI.

Further information on the products can be found under

KEMET Introduces Next-Generation Supercapacitors for Automotive
Posted: 2021-9-29

KEMET, part of the YAGEO Group and leading global electronic components supplier, announces its new high-performance supercapacitors for automotive electronics, the FMD and FU0H series. These series deliver 1,000 hours at 85°C/85% RH-rated voltage and operational temperature ranging from -40°C to 85°C. The FMD series offers the highest lifetime with up to 4,000 hours. These supercapacitors are qualified to an automotive testing protocol. These capacitors are manufactured in an ISO TS 16949 certified plant and are subjected to PPAP/PSW and change control. They are ideal for automotive applications needing a main power system backup during a power loss, such as ADAS, autonomous vehicles, and central gateway ECUs. Supercapacitors are ideal for maintaining the main power system’s real-time clock or volatile memory when it is removed, such as during a power failure or when the main power system’s battery has been removed for replacement. Additionally, these supercapacitors offer power backup in equipment ranging from IoT devices, smart meters, medical devices, and industrial computing.

Using supercapacitors for automotive electronics enables freedom from the design limits imposed by finite battery lifetimes. The supercapacitor’s benign open-circuit failure mode contrasts with typical short-circuit battery failures that may result in outgassing or ignition. Furthermore, supercapacitors are a cost-effective alternative to small backup batteries. Depending on the type of load and current demand, they can store enough energy to provide backup for durations ranging from a few seconds to several hours.

KEMET’s miniature supercapacitors use a proprietary aqueous electrolyte solution that provides high durability against liquid leakage, vibrations, and thermal shock, thus high reliability in harsh environments. Aqueous electrolytes are highly conductive, have a low environmental impact, and are non-toxic and non-flammable. Unlike a battery, supercapacitors store and release energy quickly through physical adsorption and the ions desorption in the electrolyte between its electrodes. With the supercapacitor’s low internal resistance, these devices can fully charge within a few seconds. In contrast, a secondary battery cell can take from ten minutes to several hours to fully charge. Moreover, there is no theoretical limit to the life cycle, whereas a lithium-ion secondary cell has a finite lifetime of about 500 cycles. They also typically have a greater resistance to moisture absorption than organic compounds, resulting in a longer life with better stability.

According to an Allied Market Research report, the global supercapacitor market generated $3.27 billion in 2019 and is estimated to reach $16.95 billion by 2027, with a CAGR of 23.3% from 2020 to 2027.* An increase in demand for automotive applications, renewable energy systems, and supportive government regulations is boosting the growth of the global supercapacitor market.

KEMET supercapacitors are available immediately via KEMET distributors. To learn more about their capabilities and applications, visit

*Source: “Supercapacitor Market by Product Type (Double-Layer Capacitor, Pseudocapacitors, and Hybrid Capacitors), Module Type (Less Than 10 Volts Modules, 10 Volts to 25 Volts Modules, 25 Volts to 50 Volts Modules, 50 Volts to 100 Volts Modules, and Above 100 Volts Modules), Material (Activated carbon, Carbide Derived Carbon, Carbon Aerogel, and Others), and Application (Automotive, Industrial, Energy, Consumer Electronics, and Aerospace & Defense): Global Opportunity Analysis and Industry Forecast, 2020–2027."

Power Integrations Introduces Two PowiGaN ICs Combine for 30.3 W/ in3 Power Density in a New USB Charger Design
Posted: 2021-9-29

A recent Design Example Report (DER-928) describes the use of two PowiGaN-based IC products to achieve 30.3 W/ in3 power density in a 60 W USB PD 3.0 adapter that is up to 93% efficient. The combination of the new InnoSwitch4-CZ zero-voltage-switching flyback switcher IC (with its companion active-clamping ClampZero IC) and the MinE-CAP bulk capacitor miniaturization IC ushers in a new class of ultra-compact mobile device chargers.

The 1.77 in x 1.77 in x 0.63 in design can provide 5 V, 9 V, 15 V or 20 V to the output to support rapid charging of devices from mobile phones to compact laptops. It consumes less than 60 mW no-load power and requires no heatsinks.

InnoSwitch4-CZ devices incorporate a robust PowiGaN-based 750 V primary switch and work with the new ClampZero high-frequency active clamp ICs. The pair provides a steady state switching frequency of up to 140 kHz to minimize transformer size. It maintains very high efficiency across line voltage, system load and with different output voltages.

MinE-CAP ICs drastically reduce the size of high-voltage bulk electrolytic capacitors, resulting in up to 40% adapter size reduction without compromising output ripple, operating efficiency, or requiring redesign of the transformer. MinE-CAP devices work seamlessly with the InnoSwitch family of switcher ICs and require minimal external components.

To learn more, download the following documents:


Power Integrations PowiGaN Solutions Enable Compact Chargers for eBikes and Power Tools
Posted: 2021-9-29

Typical eBike and power tool adapters come in bulky packages, with much of their volume devoted to thick, heavy metal heatsinks that siphon away wasted energy when they are charging. InnoSwitch3-CP offline flyback switcher ICs featuring PowiGaN Technology enable heatsink-free charger designs that are smaller, lighter, have ultra-high efficiency and low no-load consumption. Thanks to PowiGaN, you can slip your charger into your backpack and charge anywhere you can find an outlet.

A new design example report, DER-915, describes a 84 W (42 V / 2 A) adapter with 160-264 VAC high-line input for eBikes and power tools. The low component-count design fits neatly on a 3.2 in x 1.9 in circuit board; that’s about the size of a bank card. It’s greater than 93% efficient and consumes less than 70 mW of no-load power at 230 VAC.

The InnoSwitch3-CP device at the heart of this design incorporates a 750 V PowiGaN switch, primary and secondary controllers, and safety-rated feedback into a single IC. It’s the ideal solution for constant power charging applications up to 100 W.

To learn more, visit our website to download DER-915 and read the InnoSwitch3-CP data sheet. You can also use PI Expert Online to kickstart your next power supply design. The browser-based software turns your specifications into a ready-to-build design within minutes.


Power Integration Safeguard Meters from Magnetic Tampering with New LinkSwith-XT2 Design
Posted: 2021-9-11

Utility meters need to work without interruption and often under adverse conditions. From full load to light load, through line surges, or even when being tampered with, meters require rugged and efficient power supplies to deliver power without fail. A new design example report (DER-711) addresses these challenges with a 6.6 W dual-output flyback converter using a LinkSwitch-XT2 offline switcher IC. With a low-RDS (ON), 900 V MOSFET, LinkSwitch-XT2 improves efficiency at full load, maintains efficiency at light load, and resists magnetic tampering.

Meter tampering is often done by placing a strong magnet close to the meter’s power supply to interfere with transformer inductance. LinkSwitch-XT2 features an ON/OFF control that compensates for the primary inductance reduction by increasing operating frequency to maintain output power level. The ON/OFF control enables high efficiency at light load, allowing utility providers to minimize energy consumption during normal meter operation.

No EMI or Thermal Issues

The DER-711 circuit design utilizes the high current limit of LinkSwitch-XT2 to operate at very low frequency, making it capable of withstanding severe magnetic tampering. When operating frequency increases to 60 kHz due to proximity to a magnet, the design wouldn’t incur thermal or electromagnetic interference issues. In the extreme case when a magnet is in physical contact with the transformer, the drop in system efficiency is limited to 4-6%, and IC temperature increases by merely 16°C at full load. The DER-711 board layout places the transformer in the center, maximizing distance from possible external magnetic interference.

A True Universal Design

The LinkSwitch-XT2 IC’s integrated 900 V MOSFET provides valuable safety margin for meters in regions with high and unstable mains voltage. DER-711 has an ultra-wide 85-350 VAC input range and can withstand 6 kV of differential line surge.

To learn more download DER-711

TDK develops downsized, compact, thin-film power inductors for automotive power circuits
Posted: 2021-9-11

TDK Corporation (TSE: 6762) has developed a series of thin-film metal power inductors for automotive power circuits. The new TFM201210ALMA inductors feature a mounting area downsized approximately 22 % from TDK’s conventional product, TFM201610ALMA (2.0 mm (L) x 1.6 mm (W) x 1.0 mm (H)). Mass production will begin in August 2021.

Demand has recently increased in ECU* mounting for the electrification of various automotive controlling functions, autonomous driving, information communication and other purposes. Downsized inductors for power circuits contribute to space-saving in a mounting substrate, at a time when quick advances in ADAS** performance increase the number of components typically used in system architectures.

In addition to its compact dimension of 2.0 mm (L) x 1.25 mm (W), this series uses the TDK proprietary metallic magnetic material as its core material. The thin-film inductors support a wide range of operating temperatures from -55 °C to +150 °C, the highest level in the industry***. Moreover, it features increased robustness against mechanical stress, such as vibrations and shocks due to the resin electrode structure.

In addition to the new items, TFM series includes a lineup of products with a rated voltage of 40 V, allowing use on an automotive power circuit side directly connected with a 12 V battery.

For more information see

Functional safety compliant TI mmWave sensors
Posted: 2021-9-11
TI's mmWave radar sensors are now functional-safety compliant and follow the requirements of ISO 26262 or IEC 61508. These sensors have multiple built-in safety mechanisms to provide the required diagnostic coverage to meet a random hardware capability of ASIL-B / SIL-2 at a component level. In addition to addressing both systematic and random hardware faults, TI functional safety mmWave sensors bring in additional system benefits to customers:
  Reduced system complexity with autonomous monitoring capability to enhance functional safety with minimum loading on the host which reduces the need for external components
  Shorter time to market with component level documentation, software packages, and reference design to simplify functional safety development


Power Integration 600 V Qspeed Diodes Can Replace SiC Parts in Automotive Applications
Posted: 2021-9-11

PI’s newest AEC-Q100 qualified Qspeed diode has the lowest reverse recovery charge (Qrr) of any 600 V silicon diode. Expanding our portfolio of automotive-qualified diodes, the QH12TZ600Q diode offers the same low switching-loss performance as a silicon carbide (SiC) device without the higher price tag.

Automotive on-board charger applications require higher switching frequency to reduce volume and weight. Our QH12TZ600Q diode has a Qrr of just 14 nC at 25 °C – half the Qrr of competing silicon diodes. It improves the efficiency of power factor correction (PFC) stages in the on-board charger while significantly reducing thermals in PFC MOSFETs.

Like our other Qspeed diodes, QH12TZ600Q uses merged PiN and Schottky diode technology to achieve high performance. Its smooth reverse recovery current transition characteristics not only increase efficiency, but reduce EMI and peak reverse voltage stress, eliminating the need for snubbers when used as output rectifiers.

QH12TZ600Q diodes are available in the compact, 2.5 kV isolated TO-220 package, enabling direct mounting to metal heat sinking and facilitating excellent thermal performance. They can be used as a single or interleaved continuous conduction mode (CCM) PFC boost diode or an output rectifier diode in on-board chargers.

To learn more download the QH12TZ600Q Data Sheet

MCUs to Help Reduce Power, Size and Cost
Posted: 2021-7-29

Explore the low-cost MSP430FR243x family of FRAM-based microcontrollers

TI’s MSP430 microcontroller platform is based on an ultra-low-power FRAM system architecture that increases performance while lowering energy consumption. The MSP430FR2433 is TI’s lowest-cost family of MCUs for sensing and measurement applications.

Learn more

MSP430F2xx family: Get more from power from your MCU with integrated analog

MSP430FR21xx devices are ultra-low-power, low-cost MCUs built on the FRAM architecture. These devices provide integrated peripherals and combine low-power modes to achieve extended battery life in portable, battery-powered sensing applications.

Learn more

MSP430FR247x family: Delivering integrated analog at extended temps

MSP430FR247x MCUs are created to support industrial applications, leveraging the FRAM data-logging capabilities. This device integrates a 12-bit SAR ADC and one comparator, and offers an extended temperature range from –40°C up to 105°C.

Learn More

Capacitive sensing MSP430™ MCUs: Easiest to use capacitive touch solutions

The MSP430FR267x MUC family provides ultra-low-power microcontroller solutions for capacitive touch sensing applications supporting buttons, slides, wheel and proximity solutions. MSP430 MCUs with CapTIvate technology operate through thick glass, plastic enclosures, metal, and wood with operation in harsh environments including wet, greasy, and dirty environments.

Learn more

Simplify gas and liquid measurement with ultrasonic sensing MCUs

Ultrasonic sensors help with the level sensing for liquids and gases to measure liquid concentration, leak detection, level sensing and oxygen concentration. The MSP430FR604x microcontroller families are low-cost, single-chip solutions with integrated ultrasonic sensing analog front end. Its unique waveform capturing technology with high speed ADC and cross correlation method enables high accuracy measurements with low power.

Learn more

Easy to use development kit for sensing solutions

Get everything you need to start developing your sensing solutions using MSP430™ microcontrollers. The LaunchPad™ development kit includes an ambient light sensor, connector for external analog sources and probes for programming, debugging and energy measurements.

Learn more

New LinkSwitch-TNZ ICs Incorporate Lossless Zero-Cross Detection and X-Capacitor Discharge
Posted: 2021-7-29

Typical discrete AC zero-cross detection circuits require many components and consume as much as half of the standby power budget. Power Integrations’ new LinkSwitch-TNZ IC family solves this problem by combining offline power conversion, lossless zero-cross detection and optional X-capacitor discharge functions in a compact SO-8C package. With integrated lossless AC zero-cross detection, LinkSwitch-TNZ ICs provide best-in-class light-load efficiencies.

LinkSwitch-TNZ ICs provide an accurate signal indicating that the sinusoidal AC line is at zero volts. This signal is used by Smart Home and Building Automation (HBA) products and appliances to control the switching of relays, IGBTs and TRIACs to minimize switching stress and system in-rush current. The device’s detection of the zero-cross point consumes less than 5 mW, allowing systems to reduce standby power losses versus alternative approaches that require 10 or more discrete components and burn 50 to 100 mW of continuous power.

This highly efficient switcher can be used for non-isolated buck and buck-boost power supplies up to 575 mA output current and can provide up to 12 W output for universal input isolated flyback designs. For more information visit

TDK expands its range of coupled inductors
Posted: 2021-7-29

TDK Corporation (TSE:6762) has extended its range of coupled inductors to include the new EPCOS series B82472D6*. The nine series types cover an inductance range of 2 x 2.2 µH to 2 x 47 µH and are designed for maximum rated currents of 1.1 A to 4.3 A. The RoHS-compliant chokes are certified in line with AEC-Q200 and feature high saturation currents of up to 7.95 A. The magnetically shielded inductors have dimensions of just 7.3 x 7.3 x 4.8 mm and are designed for a wide temperature range of between -55 °C and +150 °C. Depending on the type, the chokes offer very high coupling factors of the two windings from 97 to 99 percent.

These compact, robust components proof to be useful in a wide range of applications: They are ideal in various galvanically non-insulated DC/DC converter topologies such as SEPIC, Cuk and Zeta and can also be used as transformers in flyback and multi-output buck topologies. In the latter, coupled inductors provide a second output voltage. Furthermore, they can be utilized as common-mode chokes in power supply lines. The insulation voltage between the two windings is >500 V.

Further information on the products can be found under

5W AC/DC is OVC III and PD3-rated
Posted: 2021-7-29

The RAC05-K/PD3/H from RECOM is a board-mounted 5W Class II AC/DC converter series, intended for ‘fixed installations’ where higher levels of transients according to over-voltage category III are experienced, along with increased environmental pollution levels.

The converters are available with 5V, 12V or 15V single outputs and include enhanced clearances to meet OVCIII up to 5000m altitude. Nominal input ratings are 100VAC to 277VAC but the parts will withstand 480Vac without damage continuously. The series is rated for operation in ‘Pollution Degree 3’ environments, where pollution can become conductive if condensation occurs.

The RAC05-K/PD3-H series is fully protected against short circuits and over-voltage in case of internal abnormalities’ and meets EN 55032 Class B EMI emissions level (floating output), without external components. No-load consumption is less than 0.5W to meet eco-design directives. The parts are offered in a 2” x 1” x 1” high package and operate to 70°C in free air and to 85°C (12V part) with 40% derating. Certifications include IEC/EN 62368-1 and UL 61010-1.

Michael Schrutka, RECOM AC/DC product manager comments “Our new 5W AC/DC converters provide real value when compliance with over-voltage category III is required especially along with higher levels of protection against ambient air pollution in harsh environments. By elimitated or at least significantly reduced need for external suppression components. The parts will find applications in smart grid, renewable energy, smart metering and IoT systems, as well as monitoring food and beverage processing appliances.”

For more information go to

TDK offers high-current and low-inductance power inductors for automotive power circuits
Posted: 2021-7-29

TDK Corporation developed new HPL505032F1 power inductors for use in automotive circuits. The inductors enable level 5 ADAS applications for cameras by offering high-current and low-inductance for power circuits in central processing units and graphic processing units, such as advanced driver-assistance systems (ADAS).

The new products achieve high power efficiency by adopting a low-resistance frame for the highly permeable and low-loss ferrite made of high BS material and low-RDC that is fully developed in-house. Its rated current is 1.5 times higher than TDK's existing product (HPL505028), accommodating currents as high as 40 A to 50 A. While the proprietary structural design generates magnetic flux canceling effects contributing to noise control, the frame that integrates internal with external electrodes reduces the risk of an open circuit and short circuit, ensuring high reliability.

The need for high-speed, large-capacity camera footage in ADAS is increasing as vehicles grow more autonomous. Cameras are an essential part of cars with ADAS capabilities to assure that everything is aligned within a vehicle and no dangerous situations occur. TDK’s product line for ADAS systems includes a range of automotive inductors for these applications. Mass production of these new inductors will begin in July 2021.

Further information on the products can be found under

Cornell Dubilier Long Life, 85/85 THB-Rated DC Link Capacitors for Harsh Environments
Posted: 2021-7-29
Type BLH exceeds industry standards for humidity testing, AEC-Q200 compliant

Green energy and electric transportation systems have pushed explosive growth in inverter markets. Many of these applications present harsh operating environments for power electronics circuitry. Often, these applications demand a high percentage of uptime, increasing the need for highly reliable components. In response, CDE’s BLH series of DC Link capacitors have been designed and tested to exceed the industry’s most stringent requirements for high humidity, vibration testing and thermal cycling.

 The Temperature, Humidity at Bias (THB) test exposes parts to the harsh conditions of 85 °C at 85% relative humidity with rated voltage applied. This demanding test simulates the harsh operating conditions encountered in many commercial and industrial inverter applications. Such conditions can cause non-THB rated capacitors to fail early from moisture penetration. While most capacitor makers validate their THB components for 1,000 hours under these conditions, CDE’s BLH series has been validated for 1,500 hours.

Utilizing the most advanced materials and processes, these board mounted capacitors have been designed and tested to meet the rigors of automotive AEC-Q200 testing. Their solvent-resistant plastic case and epoxy encapsulation system are UL Recognized and meet IEC61071. Tin-plated copper RoHS-compliant terminations ensure excellent solderability. With their superior resistance to moisture and robust design, these capacitors are well suited for solar, wind, UPS, EV chargers, and other inverter applications that may be subjected to wide-ranging environmental conditions.

The series is optimized for DC link applications in medium to high-power inverters. Capacitance ranges from 1.0 to 170 µF at 450-1,200 Vdc, with high rms ripple current ratings up to 36 Arms. When operated at a 70 °C hot-spot temperature with rated voltage applied, their life expectancy is 100,000 hours.

BLH Series film capacitors are available now from the company’s authorized distributors. For more information contact CDE: Product Manager: Larry Bromley, 508-996-8561 x1120 email:

New Qi 1.3 Wireless Charging Reference Design Unveiled to Accelerate Development of Automotive and Consumer Qi Transmitter
Posted: 2021-7-29
Microchip’s Qi 1.3 reference design is compliant with the recently released Qi 1.3 specification and includes everything needed to quickly develop a Qi 1.3 certified transmitter

The Wireless Power Consortium (WPC) has recently released the Qi 1.3 specification that requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver.

To meet the requirements of the specification, Microchip Technology Inc. announced today a new Qi® 1.3 wireless charging reference design providing developers of wireless charging systems for automotive and consumer applications with the necessary tools and support for the seamless integration and certification of new-generation product designs.

For wireless charging system developers launching certified Qi 1.3 transmitters under tight timelines, Microchip’s three-coil Qi 1.3 reference design provides a head start for product development. The reference design fully integrates secure storage subsystem software with the wireless power microcontroller (MCU) and is a flexible solution, enabling custom topologies and foreign object detection (FOD) implementation.

As a regular member in the WPC, which sets global standards for wireless charging of mobile devices, Microchip provided expertise during development of the recently released Qi 1.3 specification. Qi 1.3 is a significant update from Qi 1.2.4 and mandates hardware-based authentication between transmitter and receiving devices for power transfer above 5W. By adhering to the new authentication standard, designers can ensure phones receiving 15W are receiving it from a Qi-certified authenticated transmitter to ensure safety.

“Wireless charging makes it easy and convenient for consumers to charge devices and, as a result, demand for these systems in the automotive and consumer segments is on the rise,” said Joe Thomsen, vice president, MCU16 business unit. “Microchip’s Qi 1.3 reference design, tools and support help engineers to meet rapidly evolving development requirements and enable easy certification of the new Qi 1.3 transmitter designs, speeding time to market and easing end-product certification.”

Included in Microchip’s reference design solution for wireless charging systems are all required elements: Qi controller, Qi application software, provisioned authentication controller that is a WPC-approved secure storage subsystem and crypto software libraries that execute on the Qi controller. The reference design includes complete schematics, bill of materials, software and design guidelines. Microchip is partnering with Avnet to make evaluation boards for the Qi reference design available to qualified customers around the world.

To support its Qi 1.3 wireless power solution, Microchip provides the dsPIC33C family of devices to run the Qi application software and the ECC608/TA100 secure storage subsystem provisioned by Microchip as a licensed WPC Manufacturing Certificate Authority. As a total system solution, this reference design also incorporates MIC4605 and MCP14700 gate drivers, MCP16331 and MCP1725 regulators, an MCP6C02 current sense device, an ATA6563 CAN transceiver and an MCP9700 temperature sensor.

For pricing and additional information, contact a Microchip sales representative, authorized worldwide distributor, or visit Microchip’s website

TDK offers a new screw terminal series with high current capability and long service life
Posted: 2021-7-29

TDK Corporation presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals. The new components are designed for rated voltages between 400 V DC and 500 V DC and cover a capacitance range of 820 µF to 15,000 µF.

A special feature is the high-rated current capability of up to 56.1 A AC (100 Hz, 85 °C). In case of standard operating conditions (for example, at 300 Hz, 60 °C, 2 m/s), currents of up to 100 A can even be reached. These values mean an approx. 25 percent increase in the current capability in the case of rated conditions in contrast to previous series.

The robust capacitors are designed for a service life of 12,000 hours at 85 °C. A precise service life calculation can be performed with the online AlCap Tool ( Similar to other EPCOS screw terminal series, a range of options such as heat sink mounting or special terminals are available as reverse polarity protection.

The new capacitors are particularly well suited to frequency converters and industrial power supplies as well as UPS systems. Furthermore, the capacitors can be effectively used for converters in the renewable energies sector, such as wind power and photovoltaic systems.

Further information on the products can be found under

150W Eighth-Brick DC/DC has 6:1 input
Posted: 2021-7-20
RECOM unveils the RPA150E eighth-brick wide-input DC/DC converter series rated at 150W

RECOM has launched an eighth-brick DC/DC converter series with 9-60VDC input and optional 12, 24 or 48V outputs rated at 150W. The RPA150E series has an industry standard pin-out with outputs trimmable over a wide +/-20% range to include 28V for avionic systems and 57V for PoE applications. The 6:1 input range covers nominal 12, 24, and 48V system rails with sufficient margin to include 48V battery charging voltage and 12V battery cranking voltage dips.

Efficiency of the RPA150E series is high, up to 92% typical, allowing operation to +85°C with minimal derating with airflow or baseplate cooling. Isolation is rated at 3kVDC, and standard control and protection feature include remote on/off, under-voltage lockout, over-voltage, over-current, and over-temperature.

Safety certifications for the converter include UL 62368-1, CAN/CSA-C22 No. 62368-1, and the parts are EMC-compliant to EN 55032 and EN 55011 with a recommended external filter network. With suitable external components, the RPA150E series is compliant with EN 50155 and EN 45545-2 railway functional and safety standards along with EN 50121-3-2 railway EMC standard.

Matthew Dauterive, DC/DC product manager of RECOM comments: “The wide input range of our RPA150E series means it can provide cost effective power conversion from battery voltages in EVs, rail, and E-mobility designs as well as in a broad range of industrial applications”.

For more information contact

Ground-breaking PSMA Report Addresses Reliability of Power Supply Digital Control Software/Firmware
Posted: 2019-9-19
Comprehensive study on digital implementations of power supplies addresses challenges and solutions to reliability of digital control of power supplies and recommends best practices

The Power Sources Manufacturers Association (PSMA) announces publication of its ground-breaking Power Supply Software/Firmware Reliability Improvement Report. This report, the result of a year-long project undertaken by PSMA’s  Reliability Technical Committee, addresses recommended reliability improvements for power supply digital control software and firmware. This new report attempts to present key findings related to the challenges of and solutions to reliability in the digital control of power electronics.

“This is the first report from the work of PSMA’s newest committee, which aims to spearhead industry initiatives that identify and attempt to address the pertinent industry challenges related to the reliability performance of power supplies and associated products,” noted Brian Zahnstecher, Co-Chair of the PSMA Reliability Committee. Tony O’Brien, Reliability Committee Co-Chair, added “Moving from power electronics with analog control to power electronics with digital control is a significant transition. Software engineering best practices are being adopted for digital power electronics control for power supplies to ensure that reliability does not suffer with the transition to digital control. Some of the best practices are relatively new, evolving and unfamiliar to the power electronics world”

This 166-page report, divided into nine chapters, examines a wide array of problems and challenges in the field of digitally controlled power supplies, then proceeds to present observed and proposed improvements and best practices. Brian Zahnstecher further noted, “The ongoing tasks of the PSMA Reliability Committee will include efforts to support adoption of the recommended best practices and to update and refine our findings. We welcome the involvement of knowledgeable industry experts in this important work.” 

A copy of the printed and USB memory drive versions of the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report has been sent to PSMA Regular member companies as a benefit of their membership. Additional copies may be purchased at the member price of $US290. PSMA Affiliate members may also purchase the report for $US290. The report is available to non-members for purchase on the PSMA website ( for the price of $US2490.

A preview of the report is available here.

PSMA Power Technology Roadmap Provides Critical Insights into Technology and Research Advancing Power Conversion Developments
Posted: 2019-4-16
2019 edition of bi-annual publication provides multidimensional perspectives on power technology growth and trends; latest edition adds new section surveying global academic research activities

The Power Sources Manufacturers Association (PSMA) announces the 2019 edition of the Power Technology Roadmap. The report, which forecasts the power technology and power delivery trends through 2023, includes a printed report along with a feature-rich USB memory drive containing a record number of seventeen recorded webinars with up-to-date explanations of the information contained in the final report. The webinars add much to the presentation materials because the listener can hear and understand the context and the subtext of the original presentation in the speaker's voice. The recordings also capture the interesting and informative question and answer periods.

In this edition a new section on University Research in Power Electronics has been added. University research provides a window into what products and technologies are in store for Power Electronics. Leading power electronics research universities were asked about their research areas and priorities and their responses were analyzed to extract most common research areas, least common/missing research areas and unique research areas.

The overall structure of this year’s PTR largely follows the format of and keeps the improvements made in the 2017 report. It offers a consolidated view of the latest trends in the power management, power control, and power delivery technologies by integrating the most recent inputs from webinars, surveys, analyses and discussions. The report is divided into five sections:

  • Application Trends
  • Component Technologies
  • University Research
  • Webinar Presentations
  • Power Supply and Converter Trends

“As power technology continues to emerge from the shadows to play a more central role in the next phase of electronics industry revolution, the PTR report provides many relevant pointers to the current and future industry stakeholders,” said Conor Quinn, Co-Chair of the Power Technology Roadmap committee.

Dhaval Dalal, Co-Chair of the committee, said, “In many emerging fields, such as electric vehicles, alternative energy converters and energy harvesting devices, power technology assumes a more central and driving role and the PTR captures how the industry is shaping up to play this role.”

PSMA Regular Member companies have each been sent one copy of the printed report and USB memory drive versions of the 2019 edition as a benefit of their membership. Members can access the webinars on line at no cost and purchase additional copies of the full report for $290. The non-member price is $4,490. For information about purchasing the report, please to the PSMA website at:

PSMA Publishes Technology Report: 3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies
Posted: 2018-9-6
Comprehensive report is the first to address higher power embeddable passives that will accelerate the development of higher density power sources using new, 3D disruptive packaging technologies

The Power Sources Manufacturers Association (PSMA) Packaging Committee announces the publication of its latest report titled, “3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies.” This is the third in a series of reports focused on using embedded substrate technology for building power sources. It is the first extensive study of embeddable passive components both available and in development for use in the power path of power sources. The report contains extensive research and product illustrations geared to an audience of technology executives and design engineers.

Miniaturization of passive components without compromising their power handling and efficiency and their integration with actives has always been a key focus for power packaging. There is also an increasing trend to vertical or 3D package integration to address the performance issues by eliminating parasitics from interconnections. Embedding gives lowest package inductance and enables co-integration of power systems and drivers in a single package with direct interconnection between gate driver circuits and switches with shortest interconnection length. This has become even more important with the rapid emergence of wide bandgap power switching devices. This, however, leads to several process integration and reliability challenges that need to be systematically addressed.

Georgia Tech Packaging Research Center, under contract from PSMA systematically surveyed the recent advances in passives, active embedding and 3D passive-active integration to generate this report, with emphasis on 3D power packaging enabled by advances in passive components and embedding of actives in power packages. A detailed literature study was conducted on key advances in embedded passive technologies and related topics. Emerging nanomaterials, processes and technologies are described in detail for inductors, capacitors and resistors. Nanostructured materials provide additional degrees of freedoms in enhancing the properties to improve the performance metrics such as volumetric density and efficiency of the components. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted in advancing the components to improve performance. Industry leaders were surveyed to get the recent technology advances in each category. Roadmaps are projected for passive component advances and active embedding technologies.

The trends and roadmaps in 3D power packaging are also described in three categories: low power (1-100 W), medium power (100-1000 W) and high power (10-100 kW). Integration in each category is classified into lead-frame-based, substrate-embedding based and traditional ceramic substrates. Active embedding with panel-scale substrate manufacturing is also reviewed in detail. Recent innovations in substrate materials and associated reliability challenges such as via cracking, dielectric cracking or electric breakdown are highlighted. Advances in die-attach solutions with sintered nanocopper are reviewed, highlighting the evolution of low-stress sintered copper-based die-attach solutions.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded passives in 3D power packaging to create the significantly higher power densities.

The PSMA report on 3D packaging was provided free of charge to PSMA Regular and Associate Company members.  Additional copies may be purchased at the member price of $290. PSMA Affiliate members may also purchase the report for $290. The report is available to non-members for purchase on the PSMA website ( for the price of $3,490.

Provided by the PSMA Packaging Committee.

Brian Narveson
  Brian Narveson   Ernie Parker  
Ernie Parker 


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