New product announcements

Powerbox, one of Europe’s largest power supply companies and a leading force for four decades in optimizing power solutions for demanding applications, has announced the release of its new ruggedized series, the ECD1000A for ground-based defense applications and harsh industrial environments. Housed in a metal IP65 enclosure with baseplate conduction cooling, the ECD1000A series delivers 1000W and can be used with a baseplate operating temperature range of -40 up to +75 degrees C. For extremely demanding applications the ECD1000A is mechanically ruggedized according to the MIL-STD-810H standard and interior boards and components are protected with a conformal coating. The product is equally well electrically ruggedized to withstand harsh transients and meet demanding EMC performance levels as required for most common defense and the more demanding industrial applications, according to the MIL-STD- 461 CE102 / RE102 and meeting the MIL-STD-1399-300. The power supply operates with a wide universal input range from 85 to 305VAC with power factor correction (PFC). Designed for high availability, short time-to-market and to meet commercial and military off-the-shelf (COTS/MOTS) business models, the ECD1000A is available in a 28VDC output voltage version, however the series also includes 500W and 700W versions with 12VDC and 28VDC output voltages for use in lower power distribution systems.

Many defense applications require power supplies to operate with limited or no ventilation cooling. In this respect, we are referring to those operating in harsh environments where electronic equipment is installed in a sealed box, such as radio communication systems subject to adverse weather conditions, outdoor surveillance and access control, and indoor equipment with very strict audible noise restrictions. In addition to environmental requirements, reliability and cost of maintenance are motivating systems designers not to use fans and blowers, privileging conduction cooling enclosed in a box that offers an ingress protection level of IP65 (Dust tight and protected against water jets).

Conduction cooling requires very specific building practices and the ECD1000A has been designed to guarantee optimal heat transfer from the dissipating components to the baseplate, delivering a high level of performance within an operating temperature of -40 to +75 degrees centigrade at the baseplate. Depending on the assembly method and the overall cooling conditions, a derating may apply as specified in the technical documentation.

To cover a large range of applications, the ECD1000A operates with a wide universal input range from 85 to 305VAC (Nominal 100 to 277VAC). The unit includes PFC with a power factor of 0.98/0.95 (110VAC/230VAC).

To power internal bus distribution systems, the ECD1000A is available in a single output DC voltage of 28V/36A. Using a high efficiency topology, typical efficiency at 28V output and 230VAC input is an excellent 91%.

From defense to demanding industrial applications, the addressable range of applications requiring ruggedized power solutions is extremely large. Accordingly, the ECD1000A series has been designed to meet higher levels of shock and vibration, it has harsh transient protection and additional EMC filtering such as specified by MIL-STD-461E CE102 / RE102, MIL-STD 1399-300A and MIL-STD-810H.

For safety, the ECD1000A has an IN/OUT isolation of 3,000VAC and IN/FG of 2,000VAC. Output isolation to FG is 500VAC. The power supply includes over current protection with auto recovery, over voltage and over temperature protection.

The input, output and signal are interfaced via circular MIL Spec Connectors providing extremely reliable connection and protection against moisture penetration and oxidation.

The ECD1000A includes a Remote Control and a Power Good interface to monitor the unit whether in normal or abnormal operation. It has passed shock and vibration testing as specified in MIL-STD-810H. In that respect the products have been tested to levels far above normal operating conditions and are designed to sustain high, 20G level shocks.

The ECDA platform includes additional embedded functions shortening the Time-To-Market for specific applications requiring different output voltages.

In its IP65 enclosure, the ECD1000A measures 204 x 326 x 50.8mm (8.03 x 12.83 x 2 inches) and weighs 3.5kg max.

Benefiting from a design optimized for conduction cooling, the ECD1000A is suitable for applications requiring a silent power solution such as in a control room. Equally, it is suitable for industrial applications where forced air ventilation is not possible due to environmental constraints. Attached to a chassis or cold plate, the ECD1000A can deliver impressive power levels with a very high level of reliability.

The ECD1000A complies with the 62368-1 standard and, CE and UKCA, and it has a full three-year warranty.

Powerbox, one of Europe’s largest power supply companies and a leading force for four decades in optimizing power solutions for demanding applications, has announced the release of its new ruggedized 1200W AC/DC power supply for ground based defense applications and harsh industrial environments. In metal chassis format with a baseplate for conduction cooling, the OFD1200A series can be used with a baseplate operating temperature range of -40 up to +95 degrees C. For extremely demanding applications the OFD1200A features a conformal coating and is mechanically ruggedized according to the MIL-STD810H standard. The product is as electrically well ruggedized to withstand harsh transients and meet demanding EMC performance levels as required with most common defense and the more demanding industrial applications, according to the MIL-STD- 461 CE-102 and also meeting the MIL-STD-1399-300. The power supply operates with a wide universal input range from 85 to 305VAC with power factor correction (PFC). Covering a large range of applications, its output voltage and current can be adjusted from near zero to the maximum allowed for each model. Designed for high availability, short time-to-market and to meet commercial and military off-the-shelf (COTS/MOTS) business models, the OFD1200A is available in four output voltages of 12V, 28V, 48V and 65V and can be connected in parallel up to nine units delivering an impressive total power level of up to 9,720W.

A number of defense applications require power supplies to operate with limited or no ventilation cooling. In this respect, those operating in harsh environments where electronic equipment is installed in a sealed box, radio communication systems subject to adverse weather conditions, outdoor surveillance and access control, and indoor equipment with very strict audible noise restrictions. In addition to environmental requirements, reliability and cost of maintenance are motivating systems designers not to use fans and blowers, privileging conduction cooling.

Conduction cooling requires very specific building practices and the PRBX OFD1200A has been designed to guarantee optimal heat transfer from the dissipating components to the baseplate, delivering a high level of performance within an operating temperature of -40 to +95 degrees centigrade at baseplate. Depending on the assembly method and the overall cooling conditions, a derating may apply as specified in the technical documentation.

To cover a large range of applications, the OFD1200A operates with a wide universal input range from 85 to 305VAC (Nominal 100 to 277VAC). The unit includes a PFC with a coefficient of 0.98/0.95 (110VAC/230VAC).

The OFD1200A is available in four versions of single output DC voltage, 12V/84A ; 28V/43A ; 48V/25A and 65V/18.5A. Using a high efficiency topology, typical efficiency for the 48V output unit at 230VAC input is an excellent 92%.

From defense to demanding industrial, the addressable range of applications requiring ruggedized power solutions is extremely large. Accordingly, Powerbox’s OFD1200A series has been designed to meet higher levels of shock and vibration, it has harsh transient protection and additional EMC filtering such as specified by MIL-STD 461E CE102, MIL-STD 1399-300A and MIL-STD 810H.

Defense applications such as battery chargers require the power supply to deliver constant current, and this must be easily adjustable. Often such equipments are operated in environments requiring the electronics to be enclosed and protected from hazards. This necessitates the power supply to offer an external control to adjust the output voltage and/or current from the maximum allowed to near zero.

To make it possible for customers to precisely adjust the voltage and current to suit their application the OFD1200A offers two analog inputs, VTRM and ITRM. Using those functions, the output voltage and current can be adjusted from near zero up to the maximum specified per model. For example, the 28V output can be adjusted from near zero volts up to 33.6V, and the output current from near zero amps up to 43A. The output voltage can also be adjusted using the provided onboard potentiometer.

The extended trimming and control function simplifies the utilization of the power supply in constant voltage (CV) or constant current (CC) mode, without adding external circuitry.

For applications requiring redundancy or higher power it is possible to connect up to nine units in parallel, delivering an impressive total power level of up to 9,720W in conduction cooling mode. To maintain the highest level of efficiency when operated in parallel or in redundancy-mode, optional active ORing circuitry deploying high performance FET technology (Option-O) is available on the OFD1200A28 and OFD1200A48.

For safety, the OFD1200A has an IN/OUT isolation of 3,000VAC and IN/FG of 2,000VAC. Output isolation to FG is 500VAC. The power supply includes over current protection with auto recovery, over voltage and over temperature protection.

The OFD1200A board includes easy access to auxiliary functions via on board connectors, namely: Remote Control, Output Voltage Sensing, Power Good, VTRM, ITRM.

The OFD1200A has passed shock and vibration testing as specified in MIL-STD-810H. In that respect the products have been tested to levels far above normal operating conditions and are designed to sustain high, 20G level shocks.

In its enclosed format, the OFD1200A measures 142 x 40 x 340mm (5.59 x 1.57 x 13.38 inches) and weighs 1.8kg max.

Benefiting from a design optimized for conduction cooling, the OFD1200A is suitable for applications requiring a silent power solution such as in a control room. Equally, it is suitable for industrial applications where forced air ventilation is not possible due to environmental constraints. Attached to a chassis or cold plate, the OFD1200A can deliver impressive power levels with a very high level of reliability.

The OFD1200A is certified in accordance with UL62368-1 3rd edition, cUL (equivalent to CAN/CSA-C22.2 No.62368-1).

The OFD1200A series has a full three-year warranty and conforms to the European RoHS, REACH and Low Voltage Directives. The product carries the CE, UKCA and cURus markings.

NORTHVALE, New Jersey, USA - In response to the rapidly growing demand for higher-performance DC link capacitors for EV chargers, Cornell Dubilier Electronics (CDE) has expanded its standard-product offerings with devices issued through franchise distributor New Yorker Electronics. While the inverter circuitry at the heart of EV charging stations may seem familiar to design engineers, there are operational, environmental and mechanical demands that make Level 3 EV charging stations unique. The latest designs are pushing voltages and current handling to higher levels to shorten recharge times.

According to Bob Kropiewnicki, Director of Applications Engineering of CDE, “We’ve found that design engineers engaged in Level 3 charger projects are faced with a balancing act to mitigate significant circuit harmonics that cause heating problems. Adequate input and output filtering, strategic current paths, and reducing inductance and ESR are all concerns.” Kropiewnicki continued, “All too often, the DC link capacitor is an afterthought which forces those problems to be dealt with in ways that are more complex than necessary. A better solution is to focus on the requirements of the DC link as early as possible in the design process. We are able to predict performance by using our advanced capacitor modeling based on project application conditions.”

Before the EV charger market started to take off, CDE was already deeply involved in the design and manufacture of DC link and pulse power capacitors for high-power applications in military and green-energy fields. This base was further enhanced by the acquisition of the custom film capacitor division of NWL in 2021.

Components available include screw terminal and snap-in aluminum electrolytics as well as polypropylene film capacitors; air or water-cooled types, with oil-impregnated or dry-epoxy construction. Constructions include multiple terminal options in metal or plastic cases. CDE’s process begins with the customer providing the required specifications, including life and other application requirements. These specifications help determine if a standard or custom solution is recommended. To validate the recommendation, CDE utilizes advanced in-house thermal modeling and product testing capabilities. CDE has dedicated engineering resources to design custom DC link capacitors that meet the exact power requirements and unique mechanical packaging to fit complex applications. On the manufacturing side, the company has multiple North American manufacturing facilities.

CDE’s custom-engineered DC Link capacitors are designed specifically for Level 3 EV charging applications. The high-power demands of Level 3 charging require robust DC link capacitors, having exceptional life and reliability over a broad range of operating conditions. CDE offers high capacitance values with low inductance (< 5 nH), high ripple current (100s of Amps), self-healing, and low loss dielectrics. Voltage Range: 450 Vdc to 3800 Vdc. -40 °C to +135 °C Operating Temperature, with life expectancies of 200,000 hours typical.

New Yorker Electronics is franchise distributor of Exxelia Magnetics (ex-Microspire), part of Exxelia Group, and supplies its full line of Film, Mica, Tantalum, Aluminum Electrolytics and Ceramic Capacitors as well as its EMI/RFI Filters, Magnetics, Position Sensors, Slip Rings and Rotary Joints.

About New Yorker Electronics
Headquartered in Northvale, NJ, New Yorker Electronics, Co., Inc. (www.newyorkerelectronics.com) is a global franchised distributor of electronic components, value-added services, and supply chain solutions to the world’s leading OEMs and contract manufacturers in various markets. Founded in 1948, the AS9120B and ISO 9001:2015 certified company has earned a reputation for delivering superior levels of reliability and customer support while providing direct franchise access to an extensive ready-to-ship inventory of passive, inter-connect, electromechanical and Mil-Spec components, as well as semiconductor devices.

Two new ranges of cost-effective switching regulators are available from RECOM - the RPMGQ-20 and RPMGS-20. Both are open-frame, through-hole, non-isolated DC/DC buck converters with an 18V-75V input. Optional nominal outputs are 5V or 12V trimmable over a wide range, 3.3V to 8V and 8V to 24V respectively. Output current for all variants is 20A and the RPMGQ-20 is in an industry-standard quarter-brick format while the RPMGS-20 is in the emerging standard package size of 36.83 x 34.04mm with a standard sixteenth brick pin-out. Both products have a maximum height of 15mm from their mounting surface.

The efficiency of both variants is very high, peaking at 98% for the 12V output versions and 94% for 5V output, with a nearly-flat efficiency curve down to around 10% load. Remote sense and control input is provided and the products feature comprehensive protection against input undervoltage, output over-current, short circuits, and over-temperature.

With air-flow, full load is available to an ambient temperature of more than 90°C for all variants with derating to 120°C.

“These super-high efficiency DC/DCs with their high operating temperature capability are ideal as a point of load converters in demanding distributed power architectures” comments Matthew Dauterive DC/DC product manager of RECOM.”.

Samples and OEM pricing of the RPMGQ-20 and RPMGS-20 ranges are available from all authorized distributors or directly from RECOM.

Greetings!

EPC is expanding the family of QFN-packaged GaN FETs for high performance applications.

The 150 V, 3 mΩ

EPC2305 and the 200 V, 5 mΩ EPC2304 GaN FETs in a thermally enhanced QFN package with exposed top and tiny 3 mm x 5 mm footprint are the lowest on-resistance FETs in the market at 150 V and 200 V in a size that is fifteen times smaller than alternative silicon MOSFETs. In addition, QG, QGD, QOSS are more than three times smaller than Si MOSFETs and the reverse recovery charge (QRR), is zero. These characteristics result in switching losses that are six times smaller in both hard switching and soft switching applications. The driver losses are three times less than silicon solutions and ringing and overshoot are both significantly reduced.

The new devices are footprint compatible with the previously released 100 V, 1.8 mΩ EPC2302, the 100 V, 3.8 mΩ EPC2306, and the 150V 4.9 mΩ EPC2308 for the maximum design flexibility.

This family of products are ideal for smaller and lighter weight BLDC motor drives, smaller and more efficient DC-DC converters, solar optimizers and microinverters, and higher power density USB chargers and power supplies. The footprint compatibility allows for optimization of performance and cost without redesigning the board.

Download EPC2304 (200 V) Datasheet

Flex Power Modules is announcing an upgrade to the specification of their innovative BMR510, a two-phase voltage regulator module. The BMR510 now utilizes advanced materials of magnetic core, yielding high inductance in a small package size, allowing lower switching frequency operation than would be necessary with the gapped ferrite cores previously used. This in turn reduces switching losses, improving efficiency by up to a useful 1.5% to 90% compared with the original solution at 13.5 V input, 0.8 V/40 A output.

The BMR510 is capable of delivering a total of 80 A continuous (140 A peak) output current at 0.5-1.3 V from an input of 4.5-16 V. The module comprises complete power stages including MOSFETs and drivers coupled with integrated inductors, for a highly-specified integrated power stage and is ideal for space-constrained applications with its volume of less than 0.7 cm3 (10 x 9 x 7.6 mm).

The BMR510 is halogen-free and is optimized for top-side cooling. Terminations are solder-bump or optionally LGA, for easy assembly. Output over-current and over-temperature protection are included, and sensed values are available for remote monitoring. The module will accept tri-state PWM inputs from the chosen controller and a separate enable input is provided.

The BMR510 is targeted at providing power for silicon devices with a current demand of over 100 A, such as GPUs, CPUs, IPUs, high-end FPGAs and high-performing ASICs often found in the latest AI applications.

To enable effective integration in target applications, thermal models are available for the part and the upgraded BMR510 will be released for production in Q4/22 with samples available now.

The BMR510 is the first of many new single and multiphase VRMs to be released by Flex Power Modules. Upcoming devices will feature different variations of total numbers of phases, output current rating and footprints, to support current and next-generation power-hungry silicon devices.

Olle Hellgren, Product Manager at Flex Power Modules comments “Our upgraded BMR510 gives an instant boost to efficiency in existing applications and gives more flexibility in new designs, where power demands are even greater and every watt saved is valuable”.

About Flex Power Modules
Flex Power Modules, a business line of Flex, is a leading manufacturer and solution provider of scalable DC/DC power converters primarily serving the data processing, communications, industrial and transportation markets. Offering a wide range of both isolated and non-isolated solutions, its digitally-enabled DC/DC converters include PMBus compatibility supported by the powerful Flex Power Designer. Further information can be found at flexpowermodules.com or on LinkedIn.
 

Bel Power Solutions, a Bel group company, today announced the availability of a new line of automotive fuses, most suitable for eMobility applications seen in electric vehicles (EVs), hybrid vehicles, and electrical energy storage (EES). The release of this line makes Bel the only supplier in the industry showing a complete 500V and 1000V offering on their website, building upon their current automotive offering and further solidifying their commitment to the future of the automotive and EV markets.

With Bel’s EV fuses, customers can design and develop a variety of end products, which include battery modules, battery packs, battery junction boxes, battery chargers, charging stations, auxiliary circuits, and more. The high-voltage fuses are self-certified and meet various stringent automotive requirements.

Products in this series include 0AFG, 0AKH, 0AKK, 0AKL, 0AKM, 0AKN, 0AKR, 0AKS, 0ALA, 0ALE. The products are to be made available through distribution beginning December 2022.

For more information see www.belf.com

Greetings!

We are proud to introduce the the expansion of automotive qualified GaN FETs with the release of the 80 V, 6 mΩ EPC2204A and the 80 V, 3.2 mΩ EPC2218A. These devices offer designers significantly smaller and more efficient alternatives to silicon MOSFETs for automotive DC-DC for 48 V - 12 V conversion, infotainment, and lidar for autonomous driving.

48 V Automotive Power:

For 2 kW – 4 kW 48 V-12 V converters, GaN devices allow five times the frequency of silicon MOSFET solutions. Also, with a quarter of the inductance, inductor size and losses are reduced allowing 40% higher current per phase and up to half of the phases for lower system cost and half of the size. Despite the smaller size, efficiency increases up to 98%, greater than 2% higher than MOSFET solutions.

Infotainment:

For lower power DC-DC, such as those used for infotainment applications in the vehicle, GaN allows for operations at 2 MHz and above to avoid interference and enable the smallest solution size.

Advanced Autonomy:

The fast-switching speed of GaN, with sub nanosecond transitions and the capability to generate high current pulses in less than 3 ns, allows for longer range and higher resolution in lidar for autonomous driving, parking, and collision avoidance.

Download EPC2204A Datasheet

Flex Power Modules has launched the BMR320, a non-isolated, unregulated, DC-DC intermediate bus converter with a fixed 8:1 input/output voltage ratio in a compact form-factor.

The product operates over a 40-60 VDC input range, producing a 5 to 7.5 VDC output, ideal for powering point of load converters at lower intermediate bus voltages to optimize system efficiency. The BMR320 is rated at 400 W/60 A at 54 V input and achieves an outstanding power density of 128 W/cm3 (2126 W/in3), measuring just 27 x 18 x 6.4 mm. With efficiency peaking at 97.7%, up to three units can be paralleled for a total load of 1080 W. The parts are designed for top-side cooling to a heatsink with airflow or for liquid cooling via a thermal block, and the relatively flat design of the topside of the converter allows for easy connection via a thermal interface material such as a gap pad.

The unregulated, non-isolated architecture used in the BMR320 reduces the output impedance of the converter when compared to regulated designs, which effectively reflects the input bus capacitance efficiently to the output, enhancing its ability to cope with large load transients with minimal “droop”.

The BMR320 protection features include output current limit and over-voltage, along with over-temperature and input undervoltage. A PMBusTM interface is included for monitoring and control and the part is supported by the Flex Power Designer Tool.

Anders Sellin, Strategic Product Manager at Flex Power Modules comments “The BMR320 intermediate bus converter is designed for optimum system efficiency when used alongside point of load converters and Integrated Power Stages such as our BMR510 and up-coming BMR515. It is a great solution for datacom, cloud computing and AI applications, where power density, efficiency and low cost are critical factors”.

The product will be available in OEM quantities by end of this year.

About Flex Power Modules
Flex Power Modules, a business line of Flex, is a leading manufacturer and solution provider of scalable DC/DC power converters primarily serving the data processing, communications, industrial and transportation markets. Offering a wide range of both isolated and non-isolated solutions, its digitally-enabled DC/DC converters include PMBus compatibility supported by the powerful Flex Power Designer. Further information can be found at flexpowermodules.com or on LinkedIn.

A new 300W-rated half-brick DC/DC converter, the REC300H-W, is now available with a wide 9V to 36VDC input and output options of 12V, 15V, 24V, and 48VDC isolated to 3kVDC/1 minute. Additionally released, our 150W-rated REC150H-UW has an ultra-wide input range of 9V to 75VDC with the same output voltage options, apart from 28V and 54VDC to suit avionic systems and PoE applications, isolated at 2.5kVDC/1 minute.

Both REC300H-W and REC150H-UW products are highly regulated and protected against input under-voltage, short circuits, and output overload and over-voltage. Outputs are all adjustable by +/-10% and feature remote sensing. An enable input is also provided. The parts are fully sealed and operate with high efficiency across the load range up to a maximum baseplate temperature of 105°C, to suit demanding environments. ‘Class A’ and ‘B’ EMC specifications can be met with external filtering.

The half brick format is 57.9 x 61mm footprint, 12.7mm high with baseplate cooling. Through-hole pin connections for the REC300H-W and REC150H-UW are in a standard arrangement making the parts a drop-in replacement for other products on the market for cost reduction and performance upgrade.

These new DC/DCs are ideal for many applications that benefit from the wide input and output options, including telecom, industrial, aerospace, and PoE.

We are proud to introduce the the lead product for a new generation of eGaN devices that have double the power density compared to EPC’s prior-generation products.

The EPC2619 has an RDS(on) of just 4 mOhms in a tiny, 1.5 mm x 2.5 mm, footprint. The maximum RDS(on) x Area of the EPC2619 is 15 mΩ*mm2 – five times smaller than 80 V silicon MOSFETs.

The typical RDS(on) x QGD, which is indicative of power losses in hard-switching applications, is 10 times better than 80 V silicon MOSFETs. This enables switching frequencies that are 10 times higher than silicon MOSFETs and without an efficiency penalty, thus producing the highest power density. This makes the EPC2619 ideal for high frequency hard-switching 24 V – 48 V applications, such as used in buck, buck-boost, and boost converters.

The typical RDS(on) x QOSS, which is indicative of power losses in soft-switching applications, is 87 mOhm*nC, two times better than 80 V silicon MOSFETs. This makes the EPC2619 ideal for soft-switching applications, such as the primary rectification full bridge for LLC-based DCX DC-DC converters.

Download EPC2619 Datasheet

The industry’s highest power density portfolio of stackable, 60-A and 80-A eFuse devices enables designers of enterprise and communications applications to design robust input hot swap protection for high-current systems with features including:

 •Active current sharing for unlimited scalability and reliability

 •2.1% accuracy and 0.5MHz bandwidth current monitor for system optimization, control and diagnosis

 •0.59 mΩ of RDS(ON) in 4.5mm x 5mm package enables high efficiency and thermal performance

 •On-chip debug capabilities for faster time to market

Click here to learn how you can achieve higher power density designs, reduce solution size and BOM cost without compromising safety or performance.

Expanding our AC/DC range, the cost-effective RACM130E-K series in a 2”x4” footprint is now available with 130W peak output power from a wide 85-264Vac input.

Tightly regulated single outputs available are 12V, 15V, 24V, 36V and 48VDC. Safety certifications include 2MOPP/250Vac medical for ‘B’ or ‘BF’ applications to IEC/EN/ANSI/AAMI ES 60601-1, as well as IEC/EN 62368-1, IEC/EN 60335-1 and IEC/EN 61558-1 for industrial, test and measurement, IT and household use, all to 4000m altitude. On-board dual input fusing is included. EN 55032/35 ‘Class B’ EMC emissions limits are met with a good margin and the parts are suitable for installation in surge Class 3 and Over-Voltage Category OVC III environments.

Efficiency is particularly high at 90% typical, depending on variant and is maintained down to low loads for ErP compliance, while no-load losses are less than 200mW at 230Vac. Operating temperature range is -40°C to +90°C with derating.

The RACM130E-K series is available as an open card with 2”x4” footprint and with an optional metallic enclosure and will suit a wide variety of cost-sensitive applications, where a high specification is also required.

TI’s PCIe Gen 5.0 redriver is the pin-to-pin compatible next generation of TI’s Gen 4.0 redriver. With a PCI-SIG certified Gen 5.0 redriver portfolio, including the DS320PR810 and DS320PR822, TI is building on its history of providing a reliable solution to meet your PCIe design needs both today and in the future.

• Simplify your complex thermal designs with lower power consumption. TI’s PCIe Gen 5.0 redrivers use 75% less power than retimers, requiring only 160 mW per channel and reducing the need for a bulky pad and fan.

• Build your high-speed communication solutions with reduced data delays. With a significantly lower latency of 0.1 ns, TI’s Gen 5.0 redrivers enable highly efficient PCIe link throughput.

• Improve your signal quality at a fraction of the cost of equivalent retimers. TI’s PCIe Gen 5.0 redrivers provide an optimized price-to-performance ratio, enabling you to build a cost-effective, high-speed solution.

Click here to learn more

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The EPC9176 is a 3-phase BLDC motor drive inverter using the EPC23102 ePower™ Stage GaN IC with embedded gate driver function and tow GaN FETs with 5.2 mΩ typical RDS(on). The EPC9176 operates from an input supply voltage between 20 V and 80 V and can deliver up to 28 Apk (20 ARMS). This voltage range and power level makes the solution ideal for a variety of 3-Phase BLDC motor drive applications with 36 V – 80 V input including eBikes, eScooters, power tools, drones, robots, DC servo, medical robots and factory automation. The extremely small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density, and lowest weight.

The use of the EPC23102 integrated GaN-on-silicon device offers higher performance in a smaller footprint with significantly reduced design engineering requirements for fast time to market. The EPC9176 mates with an assortment of compatible controllers, supported by various manufacturers leveraging existing resources for quick development purposes that reduce design cycle times.

GaN enables motor systems that are smaller, lighter, less noisy, have more torque, more range, and greater precision while improving EMI, reducing EMI filtering and capacitor count, and eliminating electrolytic capacitors and input filter inductors.

Download the EPC9176 Quick Start Guide

Building on the success of our 5W board-mount RAC05-K/480 AC/DC, RECOM now offers 15W and 25W versions with the same ultra-wide input range of 85-528VAC, for line-to-line and line-to-neutral connections in global single- and three-phase AC supplies.

Outputs available are 5V, 12V, 15V and 24V, fully protected against short circuits, over-current and over-voltage. The two new series are certified to IEC/EN/UL 62368-1 and IEC/EN 61010 and are classed as Limited Power Source (LPS). The parts are rated for Over-Voltage Category III (OVC III) and Pollution Degree 3 (PD3) environments up to 5000m, making them suitable for harsh applications such as housekeeping supplies in roadside EV chargers or factory automation equipment. Efficiency is high, peaking at 87%, supporting full load operation in a wide operating temperature range of -40°C to +70°C (60°C for the RAC25-K/480), and up to 90°C at reduced power. The parts comply with emissions standard EN 55032 Class B with floating outputs, without external components, along with EN 55035 for EMI immunity. No-load power is less than 0.3W to comply with eco-design requirements.

The RAC15-K/480 measures just 2” x 1.6” x 1” and the RAC25-K/480 measures 3.2” x 1.8” x 1.2”, both in a silicone-free encapsulated package with industry standard footprints.

Like their 5W little brother, these 15W and 25W parts are cost-effective and can be used in global applications in a wide range of industries including smart grid/metering, IoT, renewable energy, sensor and actuator power and more.

The RECOM RSH3 DC/DC converter is an addition to the successful RSH2 series featuring fully regulated, low-noise, and isolated 3W outputs in a surface mount package. The series features nominal inputs of 12V (9–18V) and 24V (18–36V), which are useful for battery or bus-powered systems, while the outputs available are 5V, 12V, 15V, 24V, +/−12V, and +/−15V. The parts have short-circuit and overcurrent protection, and meet EN 55032 class A or B limits for input noise with a simple external filter. No minimum load is required, and the on/off control is standard.

The RSH3 series operates from −40°C to over 80°C without derating, making the products suitable for demanding industrial, test and measurement, and transport applications. The isolation rating is 2kVDC/60s (optionally 3kVDC/60s) with UL/IEC/EN 62368-1 certification. The parts are RoHS-2 compliant. The RSH3 series comes in a compact, light-weight DIP14 SMD case, available in tube or tape-and-reel packaging. The parts may be IR-oven or vapor-phase reflow soldered using industry-standard JEDEC profiles.

Matthew Dauterive, the DC/DC product manager of RECOM, comments, “The surface mount RSH3 series builds on the success of our 2W version and provides extra power for isolated on-board DC rails in the mains, and in the battery-powered equipment. The RSH3 will also find use in ground-loop isolation for industrial sensors and bus communication networks.”

The RSH3 series is available through all authorized RECOM distributors or can be availed by contacting the manufacturer directly.

EPC expands the selection of off-the-shelf GaN FETs in thermally enhanced QFN packages with the introduction of the 100 V EPC2306 designed for 48 V DC-DC conversion used in high-density computing applications, in 48 V BLDC motor drives for e-mobility and robotics, and in solar optimizers and microinverters, and Class D Audio.

The EPC2306 GaN FET offers a super small RDS(on), of just 3.8 mOhm, together with very small QG, QGD, and QOSS parameters for low conduction and switching losses. The device features a thermally enhanced QFN package with exposed top and footprint of just 3 mm x 5 mm, offering an extremely small solution size for the highest power density applications.

The EPC2306 is footprint compatible with the previously released 100 V, 1.8 mOhm EPC2302. The two footprint compatible devices allow designers to trade off RDS(on) vs. price to optimize solutions for efficiency or cost by dropping in a different part number in the same PCB footprint.

Download EPC2306 Datasheet

Development Board

The EPC90145 development board is a 100 V maximum device voltage, 45 A maximum output current, half bridge featuring the EPC2306 GaN FET. The purpose of this board is to simplify the evaluation process of the EPC2306 to speed time to market. This 2” x 2” (50.8 mm x 50.8 mm) board is designed for optimal switching performance and contains all critical components for easy evaluation.

Reduce Time to Market: Buy EPC90145 Development Board

The newly expanded InnoSwitch4-CZ family of high frequency, zero voltage switching (ZVS) flyback switcher ICs now supports ultra-compact chargers and adapters up to 220 W. When paired with ClampZero active-clamp IC and, optionally, HiperPFS-5 power factor correction ICs, the PowiGaN-based new parts easily address the latest USB PD 3.1 specification.

The USB PD 3.1 standard brings significant increase in power range, allowing one USB charger to power most electronic devices from mobile phones to workstation laptops. PowiGaN-based InnoSwitch4-CZ and ClampZero ICs enable designers to easily exceed 23 W per cubic inch to pack a lot of power in a small space for single- and multiple-output USB PD 3.1 certified designs.

Watch PI’s Director of New Product Definition Roland Saint Pierre introduce the new products in this short video.

Even at 220 W of output power, the IC’s high efficiency minimizes waste heat. Bulky heatsinks are not required on any of the active devices. The maximum switching frequency of up to 140 kHz reduces transformer size, and the high level of integration approximately halves the number of passive components, MOSFETs and diodes that make safety-compliant PCB layout difficult.

Download the following resources to learn more:

• InnoSwitch4-CZ Data Sheet
• ClampZero Data Sheet
• DER-957 – 130 W USB PD 3.1 Charger Design Using InnoSwitch4-CZ, ClampZero and HiperPFS-5

We are proud to introduce the latest ePower™ Stage IC that integrates a complete GaN half-bridge power stage capable of up to 35 A at 1 MHz operation offering higher performance and smaller solution size for high power density applications including DC-DC conversion, motor drives, and class-d audio amplifiers.

The EPC23102 eGaN IC is capable of a maximum withstand voltage of 100 V, delivering up to 35 A load current, while capable of switching speeds greater than 1 MHz.

Key features of the EPC23102 integrated circuit using EPC’s proprietary GaN IC technology include integrated input logic interface, level shifting, bootstrap charging and gate drive buffer circuits controlling 6.6 mOhm RDS(on) high side and low side FETs configured as a half-bridge power stage

• The EPC23102 features a thermally enhanced QFN package with a footprint of just 3.5 mm x 5 mm, offering an extremely small solution size for the highest power density applications.

When operated in a 48 V to 12 V buck converter, the EPC23102 delivers greater than 96% peak efficiency at 1 MHz switching frequency and around 8 – 17 A of continuous load current with a rated current of 35 A.

Download EPC23102 Datasheet

Development Board

The EPC90147 development board is a 100 V maximum device voltage, 35 A maximum output current, half bridge featuring the EPC23102 ePower Stage IC. The purpose of this board is to simplify the evaluation process of the EPC23102. This 2” x 2” (50.8 mm x 50.8 mm) board is designed for optimal switching performance and contains all critical components for easy evaluation.

Reduce Time to Market: Buy EPC90147 Development Board

We are excited to announce the release of a new range of DC/DC converters for E-mobility applications. With the push for zero-emission transport, electric propulsion is the ideal solution for off-highway vehicles and they invariably require DC/DC converters to generate isolated auxiliary power rails from the traction battery. The compact and cost-effective RMOD500-W range introduced is perfect for the application as the products are IP67-rated, fully sealed against moisture and dust including connectors and can therefore be fitted in any unprotected area of the vehicle.

The RMOD500-W is rated at 500W with an input range covering 32-96V for nominal 48V, 60V, 72V and 80V batteries. Outputs available are: 13.7V, 13V, 12.4V, 11.7V, 24.5V and 23.5V and parallel operation is possible for higher power applications. Certified isolation is provided, at 2.25kVDC and ambient operating temperature range is from -40°C to 90°C.

The RMOD500-W is designed for easy plug-and-play chassis-mounting installation with standard connectors and is sized 198 x 113 x 45mm including connectors. Protection features make the parts rugged in the application and include input reverse polarity and under-voltage, over-temperature, output over-current/short circuit and output over-voltage. The range has been qualified to standards for EMC, radiation, shock/vibration, thermal shock/temperature cycling, salt mist, water/dust ingress and safety.

With improved charging speed, 800 V batteries are becoming standard for electric vehicles. PI’s AEC-Q100 qualified InnoSwitch3-AQ switcher IC family is available in 1700 V-rated variants featuring a silicon carbide (SiC) primary switching MOSFET, allowing sensitive control circuits to safely draw from an 800 V battery.

A pair of new design example reports (DERs) describe emergency power supplies with an ultra-wide input range from 30 VDC to 1000 VDC. Tailored for 800 V main traction inverters, these designs showcase the high efficiency and high reliability realized by SiC-based InnoSwitch3-AQ devices.

• DER-946Q – 10 W 7.5 V Output Power Supply for 800 V Bus using INN3947CQ
• DER-956Q – 13 W Dual-Output Power Supply for 800 V Bus using INN3949CQ

Integrated InnoSwitch ICs dramatically reduce component count, saving circuit-board space and enhancing system reliability. DER-946Q requires only 60 total components while DER-956Q does 62. Both designs stand merely 17 mm in height and have an ambient operating temperature range from -40 °C to 105 °C, easily surpassing the 85 °C requirement typical to automotive applications.

Each of these two rugged designs utilizes a reinforced 1000 V isolated transformer that is IEC-60664-1 and IEC-60664-4 compliant. All other components are AEC-Q100 or AEC-Q200 qualified for automotive use. To learn more about the benefits of InnoSwitch3-AQ, download the data sheet, and the product flyer.

A new design example report (DER-959) from Power Integrations describes a 6 W non-isolated flyback power supply for appliances. This dual-output, universal-input design maintains high efficiency from full load to light load. It utilizes a highly integrated InnoSwitch3-TN switcher IC and requires only 25 components, offering a cost-effective solution to upgrade from low-efficiency buck regulators.

The design shown in DER-959 consumes less than 5 mW no-load power at 230 VAC input and less than 200 mW standby power at 5V, 30 mA load. With 85% average efficiency, it eliminates energy waste by 75% compared to a typical buck topology design.

Housed in an ultra-compact MinSOPTM-16A package, InnoSwitch3-TN is the smallest and most versatile member of PI’s InnoSwitch3 product family. Watch CEO Balu Balakrishnan explain the adventages of InnoSwitch3-TN in this video.

InnoSwitch3-TN ICs are ideal for both isolated and non-isolated designs. They can be used in a 5 V single-output power supply, with two positive output rails, or with both positive and negative rails. Excellent load and cross-regulation performance means that these devices can eliminate the post regulators typically required for multi-output designs in appliance applications.

To learn more,

• Download DER-959 – 6 W Dual-Output Non-Isolated Flyback Power Supply for Appliances
• Visit PI’s InnoSwitch3-TN switcher Product Page
• Start your next design with PI Expert, our browser-based design tool that turns your specifications into ready-to-build solutions within minutes.

The EPC7004 is a 100 V, 7 mΩ, 160 APulsed, rad-hard eGaN FET in a small 6.56 mm2 footprint. The EPC7004, along with the rest of the rad hard family (EPC7014, EPC7007, EPC7019, EPC7018) has a total dose rating greater than 1 Mrad and SEE immunity for LET of 85 MeV/(mg/cm2). These devices are offered in a chip-scale package, the same as the commercial eGaN FET and IC family. Packaged versions will be available from EPC Space.

The EPC7004 joins a family of rad hard products than range from 40 V to 200 V offering significant electrical and radiation performance benefits for applications including DC-DC power, motor drives, lidar, deep probes, and ion thrusters for space applications, satellites, and avionics.

Download the EPC7004 Datasheet

With a nanocrystalline metal core, SCF-XV achieves higher inductance and impedance values, a broader frequency response, and a smaller footprint than other common mode chokes currently available.

As part of the YAGEO Group and leading global electronic components supplier, KEMET announces its new SCF-XV series of AEC-Q200 qualified common mode chokes. This series fulfills the growing need for high voltage automotive and harsh environment industrial EMI filtering applications. The SCF-XV series offers up to 1,000 V AC/DC, the highest rated voltage. The nanocrystalline metal core results in a reduced footprint, rated current range from 5 to 35 A, DCR from 0.65 to 40.3 mΩ, an operating temperature from -40°C to +150°C, two different layouts (vertical/horizontal), and three different outer core diameters (19/25/29 mm). The toroidal coils are designed with nanocrystalline metal cores and are useful in various noise countermeasure fields. These features position SCF-XV as an exceptional EMI suppression solution. This series addresses design engineers' needs with a wide variety of characteristics for automotive and harsh environment industrial applications (robotics, high voltage power supplies, high reliability) and completes KEMET's already existing automotive-grade common mode chokes portfolio including SCR-XV and SCT-XV.

Many solutions comparable to the SCF-XV use ferrite coils are not always AEC-Q200 qualified, have a maximum 750 V AC/DC, and have a larger footprint. With a rated 1,000 V AC/DC and AEC-Q200 qualified, this series, together with SCR-XV and SCT-XV, is ideal for use in the EV automotive market. This series supports the industry’s trend to increase the vehicle-installed Lithium-ion battery pack voltage to limit drive train currents. With its space-saving and high characteristics, this series also addresses the trend of miniaturization and operation in harsh environmental conditions. Applications include onboard chargers for EV/PHEV, E-compressors, wireless charging systems with 85 kHz, medium power drives for power steering, air conditioning, and mild hybrid 48 V systems.

The SCF-XV series is available immediately via KEMET distributors. To learn more about its capabilities and applications, visit https://www.kemet.com/en/us/new-products.html.

RECOM has added further automotive-qualified parts to its product range with the RPY-1.5Q: a high-efficiency, cost-effective, 1.5A-rated LED driver. Meeting the requirements of AEC-Q100 with optional ‘wettable flanks’ for Automated Optical Inspection, the product comes in a thermally-enhanced QFN package with integrated shielded inductor and is just 3 x 5 x 1.6mm. The RPY-1.5Q operates over an input range of 4 to 36VDC, covering nominal 5, 12, or 24V. The part can be adjusted for lower constant currents, and PWM or analog 0-100% dimming is possible. Temperature rating is -40°C to +125°C junction temperature, and the part features an enable input and fault flag indicator. Full protection is included against input undervoltage, over-temperature, and output short circuit and over-current.

While the RPY-1.5Q will find applications in the automotive market, it is also ideal for general visible or IR lighting for buildings, drones, robotic camera systems, or as a precision current source in test and measurement.

“The addition of ‘wettable flanks’ is an option that automotive customers are now asking for” says Matthew Dauterive of RECOM, “the feature means that joints can be inspected optically without the need for expensive and slow X-ray techniques”.

Samples and OEM pricing are available from all authorized distributors or directly from RECOM.

With the industry's widest-bandwidth, fully differential RF amplifier, the TRF1208, designers can now support -3dB bandwidth up to 11GHz in radar, instrumentation and communication applications without the use of discrete mechanical baluns. This allows designers to reduce board space and BOM cost while maximizing bandwidth. The device also has a single supply voltage (3.3V or 5V), consuming 73% less power than competing fully differential amplifiers – helping designers increase system efficiency in their RF signal chain.

Learn more about using the TRF1208 in your designs:

 • Technical white paper - Improving your RF signal chain with an RF fully differential amplifier (FDA)

Discover more

The EPC7018, a 100 V, 3.9 mΩ, 345 APulsed, rad-hard eGaN FET in a small 13.9 mm2 footprint. The EPC7018 has a total dose rating greater than 1 Mrad and SEE immunity for LET of 85 MeV/(mg/cm2). These devices are offered in a chip-scale package, the same as the commercial eGaN FET and IC family. Packaged versions will be available from EPC Space.

With higher breakdown strength, lower gate charge, lower switching losses, better thermal conductivity, and very low on-resistance, power devices based on GaN significantly outperform silicon-based devices and enable higher switching frequencies resulting in higher power densities, higher efficiencies, and more compact and lighter weight circuitry for critical spaceborne missions. GaN devices also support higher total radiation levels and SEE LET levels than silicon solutions.

Applications benefiting from the performance and fast deployment of the EPC7018 include DC-DC power, motor drives, lidar, deep probes, and ion thrusters for space applications, satellites, and avionics.

Download the EPC7018 Datasheet

The successful RECOM RPX QFN-packaged DC/DC converters now have ‘-Q’ variants which meet stringent automotive AEC-Q100 Grade 1 requirements and have been upgraded to include ‘wettable flanks’ for Automated Optical Inspection (AOI). The DC/DCs have an input range up to 36V, and the output can be trimmed from 0.8V to 30V. The RPX-0.5Q variant delivers 0.5A, and the RPX-1.5Q delivers 1.5A, both in a tiny 3 x 5 x 1.6mm leadless, thermally-enhanced QFN package, operating to well over 100°C ambient with derating. This is enabled by state-of-the-art integration and advanced 3D packaging techniques using an over-molded Flip Chip on Leadframe (FCOL) construction to provide lowest package thermal resistance while keeping manufacturing and end-product pricing low.

The RPX series integrates the necessary inductor and requires just external input and output capacitors, scaled for the customer’s application, for full functionality. On/off control and synchronization inputs are provided with a power good output. Soft start along with full short circuit, over-current, over-temperature, and input under-voltage protection is included. Due to the FCOL construction, EMI is low, and fixed-frequency operation makes any required additional filtering easy to implement.

Evaluation modules are available for both products.

Matthew Dauterive, DC/DC product manager of RECOM comments; “The success of our RPX range has spurred us on to further qualify them to automotive standards. This gives our customers extra confidence that they can also be used in other application areas such as industrial or ATE, with high reliability”.

The RPX0.5Q and RPX-1.5Q series are available through all authorized RECOM distributors or by contacting the manufacturer directly. Samples can be requested via the RECOM website.

Power Integrations’ new SCALE EV family of gate-driver boards for Infineon™ EconoDUAL™ modules are automotive-qualified and ASIL-certified. These plug-and-play, dual-channel drivers for both silicon carbide (SiC) MOSFETs and silicon IGBTs are suitable for high-power automotive and traction inverters for electric, hybrid and fuel-cell vehicles, including buses and trucks, as well as construction, mining and agricultural equipment.

The first SCALE EV family member to be released is 2SP0215F2Q0C, designed for Infineon EconoDUAL 1200 V IGBT half-bridge modules. Peter Vaughan, director of automotive business development, introduces the new product in this short video.

The board-level gate drivers incorporate two reinforced gate-drive channels, associated power supplies and monitoring telemetry. The high level of integration provided by innovative new driver ICs enables the entire board to fit onto the outline of the power module, while still providing the spacing necessary for reinforced isolation according to the IEC 60664 standard.

The ASIC package provides 11.4 mm of creepage and clearance, specifically designed to meet the requirements for 800 V vehicle system voltages. The design carries a 5500-meter altitude rating and is optionally available with conformal coating for technical cleanliness requirements.

For more information, download the following documents:

• 2SP0215F2Q0C Data Sheet
• RDHP-2250Q Reference Design - Adapter Board for SCALE EV Gate Driver Board
• SCALE EV Product Flyer

OEMs are experiencing increasing application complexity and the need for AUTOSAR, ISO 26262 functional safety-compliant and secure solutions as the market for electric and autonomous vehicles grows. For automotive developers looking to design scalable applications for future technology while also meeting the latest automotive requirements, Microchip Technology Inc. (Nasdaq: MCHP) today announces a comprehensive ecosystem around AUTOSAR-ready dsPIC33C Digital Signal Controllers (DSCs) to enable accelerated development and a high level of system optimization while reducing total system cost.

Microchip is expanding its broad portfolio of dsPIC33C DSCs to cover the large memory segment with the new ISO 26262-compliant dsPIC33CK1024MP7xx family. This new family of dsPIC33C DSCs with 1 MB Flash enables applications running automotive software like AUTOSAR, OS, MCAL drivers, ISO 26262 functional safety diagnostics and security libraries. The family of dsPIC33 DSCs also includes a high-performance Central Processing Unit (CPU) with deterministic response and specialized peripherals for general automotive, advanced sensing and control, digital pwer and motor control applications.

“The AUTOSAR-ready dsPIC33C DSCs enable designers to achieve a high level of system optimization by implementing AUTOSAR-based applications, functional safety goals and security use cases in a single microcontroller (MCU) while meeting robust automotive application requirements,” said Joe Thomsen, vice president of the MCU16 business unit at Microchip Technology. “This opens up a world of opportunities for designers looking to work with Microchip while expanding into e-mobility and advanced sensing and control applications.”

The benefit of adopting AUTOSAR-ready devices like this one is that customers can improve their risk and complexity management while decreasing development time through reusability. Customers who have previously designed bare metal or non-AUTOSAR automotive applications and are now adopting AUTOSAR can scale up by staying within the dsPIC33C DSC ecosystem and continuing to take advantage of Microchip’s value-added solutions, customer support and product advantages with the new AUTOSAR-ready dsPIC33C DSCs. The AUTOSAR ecosystem for the dsPIC33C DSCs includes MICROSAR Classic from Vector, KSAR OS from KPIT Technologies Ltd. and ASPICE- and ASIL B-compliant MCAL drivers from Microchip.

“We have worked with our partners to offer an integrated solution to simplify development for automotive OEMs and Tier 1s,” said Matthias Kaestner, vice president of Microchip’s automotive products business unit. “The integrated solution gives insights into the AUTOSAR-based development. It simplifies evaluation of an ECU project using AUTOSAR 4.3.x and enables customers to get familiar with the systems based on dsPIC33 AUTOSAR-ready DSCs quickly.”  

Microchip has expanded its functional safety packages that include FMEDA reports, safety manuals and diagnostic libraries to cover the ISO 26262-compliant dsPIC33CK1024MP7xx DSCs. These AUTOSAR-ready dsPIC33C DSCs, used together with Microchip’s TA100 CryptoAutomotive™ security integrated circuits (ICs), enable the implementation of robust security in automotive designs.

Development Tools

Software and tools from Microchip Technology include certified MPLAB® XC16 compiler functional safety licenses, MPLAB X Integrated Development Environment (IDE), MPLAB Code Configurator (MCC), programming and debugging tools for dsPIC33C DSCs, ISO 26262- and ASPICE-compliant MCAL drivers for dsPIC33C DSCs, ISO 26262 functional safety packages for dsPIC33C DSCs and software libraries and reference code for security use cases. Third-party software includes MICROSAR Classic from Vector and KSAR OS from KPIT Technologies Ltd. Third-party hardware tools include TRACE32® debugger from Lauterbach.

Availability

For information about AUTOSAR BSW, OS and MCAL drivers supporting dsPIC33C DSCs, visit www.microchip.com/dsPIC33-AUTOSAR-Ready. For information about the dsPIC33CK1024MP708 DSCs that offer up to 100 MHz real-time performance, 1 MB Flash, dual CAN FD interfaces and dedicated peripherals for advanced sensing and control, digital power, motor control and high-performance general automotive applications, visit www.microchip.com/dsPIC33CK1024MP708. For information about the ISO 26262 functional safety packages, secure solutions and tools ecosystem for the AUTOSAR-ready dsPIC33C DSCs, visit www.microchip.com/dsPIC33-Automotive or contact a Microchip sales representative.

The EPC9173 is a 3-phase BLDC motor drive inverter using the EPC23101 eGaN® IC with embedded gate driver function and a floating power GaN FET with 3.3 mΩ RDS(on). The EPC9173 operates from an input supply voltage between 20 V and 85 V and can deliver up to 50 Apk (35 ARMS). This voltage range and power level makes the solution ideal for a variety of motor drive applications including e-bikes, scooters, city cars, drones, and robotics. The extremely small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density, and lowest weight.

The use of the EPC23101 integrated GaN-on-silicon device offers higher performance in a smaller footprint with significantly reduced design engineering requirements for fast time to market. The solution enables phase current sensing and leg shunt current sensing, for maximum flexibility. EPC provides full demonstration kits, which include interface boards that connect the inverter board to the controller board development tool for fast prototyping that reduce design cycle times.

Download the EPC9173 Quick Start Guide

The TPS7A94 offers at least 42% better intrinsic noise performance than competitive options and greater system-level accuracy with ultra-high power supply rejection ratio (PSRR) across both high and low frequencies. With an 1-A output current capability in a 3-mm x 3-mm footprint, designers of highly-sensitive telecom, medical, radar and test and measurement applications can overcome noise and solution size challenges.

Explore techniques for reducing internal noise for a clean supply rail that won't compromise system performance.

Discover now

The EPC7007, a 200 V, 25 mΩ, 80 APulsed, rad-hard eGaN FET in a small 5.76 mm2 footprint. The EPC7007 has a total dose rating greater than 1 Mrad and SEE immunity for LET of 85 MeV/(mg/cm2). These devices are offered in a chip-scale package, the same as the commercial eGaN FET and IC family. Packaged versions will be available from EPC Space.

Compared to rad-hard silicon devices with similar RDSon, the EPC7007 offers 40 times smaller QG and QGD, zero reverse recovery (QRR). and the size is 40 times smaller. With higher breakdown strength, lower gate charge, lower switching losses, better thermal conductivity, and very low on-resistance, power devices based on GaN significantly outperform silicon-based devices and enable higher switching frequencies resulting in higher power densities, higher efficiencies, and more compact and lighter weight circuitry for critical spaceborne missions. GaN devices also support higher total radiation levels and SEE LET levels than silicon solutions.

Applications benefiting from the performance and fast deployment of the EPC7007 include DC-DC power, motor drives, lidar, deep probes, and ion thrusters for space applications, satellites, and avionics.

Download the EPC7007 Datasheet

The HiperPFS-5 family of power-factor-correction (PFC) ICs incorporate a 750 V PowiGaN gallium-nitride switch. With efficiency of up to 98.3%, the new ICs deliver up to 240 W with no heatsinks and can achieve a power factor of better than 0.98.

Vice President of Marketing Doug Bailey introduces the HiperPFS-5 in this short video.

These quasi-resonant PFC ICs give engineers a critical advantage in the race to create the fastest, smallest and most versatile high-power USB PD chargers. They are also ideal for TVs, game consoles, all-in-one computers and appliances.

Many countries require power supplies over 75 W to have power factor correction. HiperPFS-5 ICs allow designers to easily beat the most aggressive efficiency regulations while cutting the bill of materials by half and achieving extremely attractive form factors for ultra-fast chargers.

• For LLC topology up to 240 W, pair with the new HiperLCS-2 chipsets
• For flyback topology up to 110 W, pair with InnoSwitch4-CZ active-clamp ICs

HiperPFS-5’s innovative QR discontinuous conduction mode (DCM) control technique ensures low switching losses and permits the use of a low-cost boost diode. They maintain a high power factor up to 305 VAC and can operate continuously at up to 460 VAC during line swells. Additionally, the new devices incorporate PI’s automatic X-capacitor discharge (CAPZero) function, including the required redundant pins to meet safety regulations.

To learn more,

• Download Design Example Report DER-672 – 220 W LLC Power Supply for TV and Monitors using HiperLCS-2 Chipset and HiperPFS-5 PFC IC
• Read HiperPFS-5 data sheet and product flyer
• Start designing with HiperPFS-5 chipset using the PI Expert online tool, supporting the latest PI products and turning your specifications into ready-to-build designs within minutes

AM263 is third product family in the AM2x portfolio and integrates, for the first time, TI’s industry-leading real-time control IP with Sitara’s multicore ARM architecture to meet the growing performance demands of real-time applications. AM263 also incorporates functional safety (ASIL-D/SIL3), security (Evita-Full HSM), AUTOSAR support and rich communication peripherals making it the ideal solution for many automotive and industrial applications.

Advanced real-time control (<2us control loops) and compute performance (3.2kDMIPS) enables:

 • Broad adoption of EV’s: 36% smaller motor size, 15% longer driving distance per charge, higher voltage and more efficient power conversion delivering faster charging and lower system cost

 • Automated factories: <800ns FOC loop delivering higher precision & performance motors with multiple axes simultaneously

These benefits will enable next-generation high-voltage power and motor control systems to accelerate adoption in applications such as electric vehicles, solar inverters, energy storage systems and motor drives.

Learn more here

We are pleased to introduce the EPC2221, a common source dual gallium nitride FET rated at 100 V, 58 mΩ, and 20 A pulsed output current. The EPC221 can be used in lidar systems for robots, surveillance systems, drones, autonomous cars, and even vacuum cleaners.

The low inductance and capacitance of the EPC2221 allow fast switching (100 MHz) and narrow pulse widths (2 ns) for high resolution and high efficiency. Additionally, the ultra-small size of 1.35 mm x 1.35 mm reduces PCB cost and total solution size.

The EPC2221 is the latest addition to a growing family of GaN FETs and ICs designed to meet the performance and reliability standards of demanding automotive applications.

While designed specifically for lidar applications, the EPC2221 is also perfectly suited for high frequency DC-DC conversion, wireless power applications, and synchronous rectification.

For more information, contact your local EPC representative.

Cornell Dubilier Electronics, Inc. announced that it has expanded its signature series of 380LX and 381LX aluminum electrolytic capacitors to include voltages up to 600 Vdc. The new ratings are designed to serve the company’s industrial electronics customers who continue to push the application boundaries for these components into higher voltages.

The 380LX and 381LX snap-in series are among the industry’s top performers with a published load life of 3,000 hrs. when tested at rated voltage and ripple current at rated temperature. The 380LX series is designed for 85 °C operation, while the 381LX series meets the same load life at 105 °C. These components demonstrate exceptional life in real-life applications where conditions are typically lower than the capacitor’s maximum specified ratings.

Newly added capacitance values in the range of 150 µF to 330 µF are offered at 550 and 600 Vdc in the 380 LX series and 140 µF to 340 µF at 500, 550, and 600 Vdc in the 381LX series. Developed at CDE’s technology center in Liberty, SC, these new ratings are offered with enhanced ripple current capability, up to 3.7A at full-rated conditions. The company’s latest advances in electrolyte development, materials, and processing technology make their higher voltage ratings and excellent performance possible.

CDE expects these higher voltage snap-in capacitors to be used in the latest inverter circuits for renewable energy, UPS systems, battery chargers, motor drives, welders, and other applications that require the highest performance components to improve system reliability.

Stock is available now from the company’s authorized distributors. For inquiries, contact: Matthew Redfern, Product Manager, mredfern@cde.com, (508) 996-8561, ext. 1190.   For more information on this series visit: https://www.cde.com/new-product/380lx-and-381lx

We are extremely pleased to announce the production release of the EPC2050, a 350 V GaN transistor with a maximum RDS(on) of 80 mΩ and a 26 A pulsed output current. The EPC2050 measures just 1.95 mm x 1.95 mm. This tiny size enables power solutions that occupy ten times less area than comparable silicon solutions.

The fast-switching speed and tiny size of these devices make them ideal for multi-level converters, EV charging, solar power inverters, lidar, and LED lighting.

Download the datasheet.

As USB Type-C becomes the dominant charging interface for electronic devices, design engineers face the challenge of fitting increasingly high-power USB Type-C ports into wall receptacles with limited space and ability to dissipate the extra heat they generate. We’ve got a solution for that.

A new design example (DER-916) from Power Integrations describes a 65 W wall outlet featuring current sharing between two USB Type-C ports, connected to dual InnoSwitch3-Pro flyback switcher ICs. The PowiGaN-based devices result in a compact design that requires no heatsinks or DC-DC converters and achieves 92% end-to-end efficiency.

Two InnoSwitch3-Pro ICs connect through a low-pin count USB PD controller and dynamically adjust output voltage and current. For example, when a laptop is plugged into either of the two ports, it can be charged at 65 W. When a mobile phone is then plugged into the other port, it can be charged at 20 W while the laptop is automatically adjusted to 45 W charging.

To learn more about this sophisticated design and InnoSwitch3-Pro’s high level of versatility, click the following links:

• Download DER-916 – 65 W USB PD 3.0 Type-C Shared-Capacity Dual-Port Wall Outlet
• InnoSwitch3-Pro for dynamically controllable voltage and current, including USB PD + PPS
• Try PI Expert and turn your specifications into ready-to-build designs within minutes

TDK Corporation announces the availability of FS1412 microPOL (μPOL™) power module. At 5.8. mm x 4.9 mm x 1.6 mm, the FS1412 is part of a new series of µPOL™ DC-DC converters with increased performance, smallest available size, ease of use, and simplified integration for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT networking, telecommunication, and computing enterprise. μPOL technology includes a DC-DC converter placed in the vicinity of complex chipsets such as ASICs, FPGAs, and others. By minimizing the distance between the converter and the chipset, the resistance and the inductance components are minimized, allowing fast response and accurate regulation with dynamic load currents. Mass production of FS1412 started in Q4 2021.

TDK has been developing this technology over several years to enable system level solutions to enhance electrical and thermal performance focusing on high-density cost-effective solutions for space-constrained applications which require a low-profile power source. These new solutions incorporate high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve unique system integration in a smaller size and lower profile by 3D integration. This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost to what is currently available today.

The new µPOL DC-DC converters series operates at a broad junction temperature range, from -40 °C to 125 °C and features a high current density of more than 1000 A per cubic inch. The series delivers at 12 A with the lowest commercially available height at 1.6 mm, while offering 50% less solution size than the other products available in its class. As a result, this minimizes system solution cost, reduces board size and assembly costs, as well as BOM and PCB costs.

TDK will be showcasing its µPOL technology and full line-up of compact power solutions at the APEC 2022 event from March 20-24, George R. Brown Convention Center in Houston, TX, USA at booth #814.

Glossary
•μPOL and nPOL are integrated DC-DC converters placed in the vicinity of complex ICs such as ASICs, FPGAs, and others

Main applications
•Network Storage: Enterprise SSD / Storage Area Network
•Servers: Mainstream Server, Rack and Blade Server, Micro Server
•Netcoms and Telecoms: Ethernet Switch and Router and 5G Small Cells and 5G Base Stations

Main features and benefits
•Footprint of 5.8 x 4.9 x 1.6 mm
•Output current rated at 12 A, with 50% less required capacitance than existing products
•Suitable for a junction temperature range from -40 °C to 125 °C
•Lead free and RoHS/WEEE compliant

This week our versatile InnoSwitch3-EP switcher IC family welcomes new members incorporating a silicon carbide (SiC) primary switching MOSFET and integrated controller. Suitable for industrial markets, these 1700 V-rated devices replace discrete controller-plus-MOSFET designs, saving space, time and cost while increasing reliability in applications such as renewables, industrial motor drives, battery storage and metering.

SiC-based InnoSwitch3-EP ICs deliver up to 70 W of output power while reducing the number of components required to implement a power supply by up to 50%. The inclusion of synchronous rectification and a quasi-resonant (QR) / CCM flyback controller achieves greater than 90% efficiency and less than 15 mW no-load consumption.

Offered in a compact InSOP-24D package, devices from the InnoSwitch3-EP family are now available with a choice of cost-effective silicon, high-efficiency gallium nitride (GaN) or high-voltage SiC transistors, permitting designers to optimize their power solution across a broad range of applications.

InnoSwitch3-EP ICs use a FluxLink feedback link, providing reinforced isolation up to 5000 VRMS for secondary-side control. FluxLink technology enables direct sensing of the output voltage, providing benefits such as accurate regulation and extremely fast transient response. Additional protection features include input under-voltage, output over-voltage and over-current limiting.

A new design example report (DER-913) showcases the high level of integration achieved by a 1700 V- rated InnoSwitch3-EP device in a 35 W high-voltage power supply. To learn more, download the InnoSwitch3-EP data sheet.

TDK Corporation has expanded its tried-and-tested range of CeraLink capacitors. Previously, only large, ready-to-fit sizes were available. Now, smaller versions with the classic chip design are included in the portfolio in order to increase the areas of application. The new portfolio starts with the EIA 2220 size, measuring 5.7 x 5 x 1.4 mm, is intended for 500 V, and offers a capacitance of 250 nF with very low parasitic coefficients. The new capacitors with the ordering code B58043* are available with both standard and soft termination. TDK will add further designs and voltage classes in the future.

At room temperature, the ESR at 1 MHz is only 40 mΩ, and the ESL is 3 nH, with the values even lower at higher temperatures. A high current capability of up to 9 ARMS is achieved at 200 kHz and 25 °C ambient temperature. The permissible temperature range lies between -40 °C and +150 °C.

Typical applications use the smaller designs in either snubber or output capacitors. Due to its smaller dimensions, the new CeraLink SMD variant can be placed even closer to fast-switching power semiconductors like IGBT modules, SiC-based or GaN-based semiconductors. Alongside the low ESL values, the lead inductance is kept very low.

CeraLink capacitors are based on PLZT ceramics (lead lanthanum zirconate titanate). In contrast to conventional ceramic capacitors, their maximum capacitance is at operating voltage and even increases as the proportion of the ripple voltage increases. The technical guide offers more explanation on the properties of anti-ferroelectric capacitors.

TDK will be showcasing its CeraLink capacitors and full line-up of compact power solutions at the APEC 2022 event from March 20-24, George R. Brown Convention Center in Houston, TX, USA at booth #814.

Main fields of application
•Snubber connection of fast-switching power semiconductors
•Output capacitor

Main features and benefits
•Compact dimensions of just 5.7 x 5 x 1.4 mm (EIA 2220)
•Low ESR of just 40 mΩ at room temperature
•Low ESL of just 3 nH
•High current capability of up to 9 ARMS at 200 kHz, 25 °

The TI DLP® LightCrafter™ Display 230NP EVM is an easy to use, plug-and-play evaluation platform for a wide array of ultra-mobile and ultra-portable display applications in consumer, industrial, medical and Internet of Things (IoT) markets, and is compatible with Raspberry Pi. The evaluation module (EVM) features the DLP230NP chipset comprised of the DLP230NP .23 1080p DMD, DLPC3436 display controller and the DLPA2005 PMIC/LED driver. This EVM comes equipped with a production-ready optical engine and processor interface supporting 18-bit RGB parallel video interface in a small form factor.

The DLPDLCR230NPEVM is small enough to fit in the palm of your hand.

For more information, click here

RECOM has announced the launch of their RAC10E-K/277 series of board-mount AC/DC encapsulated modules, rated at 10W in a compact 1.8 x 1 inch (45.7 x 25.4mm) footprint. Part of the RECOM ‘Economy’ series, the modules are available with single 3.3, 5, 12, 15 and 24V fully regulated outputs and with a wide input range that includes nominal 100, 115, 240 and 277VAC (120 – 430VDC). The parts are particularly suitable for harsh electrical environments such as in EV chargers with their Over Voltage Category OVC III rating up to 2000m and wide operating temperature of -40 to +90°C. The parts will also find applications in industrial, AV and ITE environments, with their safety certifications to IEC/EN/UL/CSA 62368-1 and compliance with OVC II up to 5000m. ‘Class B’ EMC limits are also met without external components and the parts are ErP-compliant with no-load losses of less than 100mW.

Efficiency of the RAC10E-K/277 is high and up to 84%, depending on variant, resulting in a power-dense product allowing full load operation to 65°C ambient from 115 to 277VAC. The parts are fully protected against output short circuits, over-voltage and over-current and have a reinforced isolation rating of 4kVAC/1 minute. Isolation capacitance and leakage current are particularly low at 100pF and 50µA maximum respectively.

The RAC10E-K/277 parts are highly reliable achieving over 1.7M hours MTBF at 25°C according to MIL-HDBK-217F and are supported by the standard RECOM 3-year warranty.

Michael Schrutka, AC/DC product manager of RECOM comments - “Our compact RAC10E-K series with further compressed footprint is a great fit for many applications and at a very competitive price point”.

Samples and OEM pricing are available from all authorized distributors or directly from RECOM.

TDK Corporation announces the release of its newly developed AVRF041A150MT242 and AVRF061D2R4ST532 notch filters with ESD protection function. Volume production of these devices will begin in March 2022.

The new notch filters are compliant with the IEC61000-4-2 Level 4 immunity standard. They are well suited to ensuring EMC requirements are met in the audio circuits of key applications - including smartphones, wireless earbuds (TWS), and smart speakers. Thanks to TDK's proprietary materials and advanced structural design, the new products implement industry-leading attenuation characteristics for specific frequency bands. They are highly effective at noise suppression and improved reception sensitivity in wireless communication. Moreover, the products can simultaneously provide countermeasures against both noise and ESD via one single chip, both reducing costs and using less board real estate.

The AVRF041A150MT242 features a small footprint of only 0.4 x 0.2 x 0.2 mm and delivers ESD protection and noise suppression in the 2.4 GHz band. It has a maximum insertion loss of just -20dB at 2.4GHz, The AVRF061D2R4ST532, which is supplied in 0.6 x 0.3 x 0.3 mm form factor offers ESD protection and noise suppression in the frequency band up to 5.3 GHz. At that frequency, it has a -15dB insertion loss.

With accelerating 5G transition and advanced mutual coordination between connected equipment, the era of IoT is now here. In addition to the conventional demands for lower power consumption and increased functionality, electronic equipment is required to have higher quality design and exhibit ongoing operational reliability. By developing notch filter solutions with significantly smaller footprints and expanded frequency capabilities, TDK is able to address market expectations for more streamlined telecommunication devices, such as smartphones and TWS, while also expanding the frequency band in relation to the latest generation of Wi-Fi transmissions.

Moving forward, TDK will continue to expand its product lineup to meet the needs for diversified telecom applications.

Glossary
•EMC: Electromagnetic compatibility
•ESD: Electrostatic discharge
•TDMA noise: Unpleasant audible noise generated by speakers when high frequency communication signals intrude into a microphone line
•IEC61000-4-2: An immunity standard for electrostatic discharge established by ( the International Electrotechnical Commission (IEC)

Main applications
•Protection against noise and ESD for audio equipment using Wi-Fi, •Bluetooth and other wireless forms of communication in the frequency band between 1.0 GHz and 5.3 GHz

Main features and benefits
•Providing measures for both ESD protection and noise
•Compliant with IEC61000-4-2 Level 4
•The smallest footprint in the lineup (0402 size format)

The Power Sources Manufacturers Association (PSMA) announces the 2022 edition of the Power Technology Roadmap. This 780-page report forecasts the power technology and power delivery trends through 2026. The report is available as a feature-rich USB memory drive containing the report together with a record number of twenty-two recorded webinars with up-to-date explanations of the information contained in the final report. The webinars add much to the presentation materials because the listener can hear and understand the context and the subtext of the original presentation in the speaker's voice. The recordings also capture the interesting and informative question and answer periods.

This twelfth edition of the report largely follows the format of and keeps the improvements made in the 2019 report. In this edition, the chapter on University Research in Power Electronics has been strengthened to include contributions from twenty-eight universities compared to fourteen in 2019. The Product Technology chapter has been expended by including two new segments related to Electric Vehicle Power Electronics. The Component Technology chapter has also been enhanced by the inclusion of magnetics and packaging technology trends. The APEC 2022 Plenary Session included a presentation by Ritu Sodhi on the history of the PSMA Power Technology Roadmap Report. The presentation is available in the Report and to stream here.

The 2022 PSMA Power Technology Roadmap Report offers a consolidated view of the latest trends in the management, control, and delivery of state-of-the-art technologies by integrating the most recent inputs from webinars, surveys, analyses and discussions. The report is divided into five sections:

• Application Trends
• Component Technologies
• University Research
• Webinar Presentations
• Power Supply and Converter Trends

For more details and the Table of Contents on the report see the Report Preview.

Conor Quinn, Co-Chair of the Power Technology Roadmap Committee, noted that "This report is the collaborative effort of more than one hundred volunteer participants who are recognized as leading experts in their respective fields. The breadth and depth of the presentations, commentary, and discussions have been outstanding and together have captured the technical trends and issues facing the power sources industry."

Dhaval Dalal, Co-Chair of the Power Technology Roadmap Committee also commented "With a greater diversity contained in the 22 webinar presentations, and richer Applications Trends, Power Supply and Converter Trends, University Research and Component Technologies chapters, this edition of the roadmap provides an even more comprehensive look at the emerging trends in power electronics technology and captures the interdependency between technology, products, components and applications."

PSMA Regular Member companies have each been sent one copy of the USB flash drive of the 2022 edition as a benefit of their membership. Members can access the webinars on line at no cost and purchase additional copies of the full report for $290. The non-member price is $4,490. For information about purchasing the report, please to the PSMA website at: www.psma.com/publications.

TDK Corporation introduces the new PCM120T series of shielded SMT power inductors, optimized for high saturation currents and low DC resistances. The PCM120T product family includes 14 inductance values between 0.4 µH and 10 µH, whereby saturation currents of up to 80 A are reached depending on the L value. Optimal saturation properties are achieved through the use of an iron alloy core. Flat wire windings are used to keep losses as low as possible. This results in low ohmic resistance values (RDC) of 0.72 mΩ (0.4 µH) to 9 mΩ (10 µH). The new inductors have an outstanding EMC performance due to closed housing made of ferrite material without an external gap. They are ideal for automatic solder joint inspection (AOI) and achieve a coplanarity of <0.1 mm due to their lead frame structure. The product’s metal cores provide resistance against high voltage pulses in accordance with ISO7636. The components’ dimensions are 12.7 x 15.8 x 11.5 mm (W x L x H).. The powerful RoHS-compatible inductors are designed for a wide temperature range from -55 °C to +165 °C and are certified according to AEC-Q200.

Typical applications include primary DC/DC converters in automotive applications such as ADAS, power supplies for servers and base stations, and various types of DC/DC converters. The PCM120T components are also ideal for interference suppression, such as electric motors in vehicles.

TDK will be showcasing its shielded SMT power inductors and full line-up of compact power solutions at the APEC 2022 event from March 20-24, George R. Brown Convention Center in Houston, TX, USA at booth #814.

_____

Main fields of applications
•Primary DC/DC converters in automotive applications, e.g., for ADAS
•Power supplies for servers and base stations
•DC/DC converters
•Vehicle motor interference suppression

Main features and benefits
•High saturation currents of up to 80 A
•Wide range of inductance values from 0.4 µH to 10 µH
•Low RDC of min. 0.72 mΩ
•Wide temperature range from -55°C to +165 °C
•AEC-Q200 compliant and RoHS-compatible
•AOI suitability
•Excellent EMC properties
•High withstanding voltage
 

TDK Corporation expands its product lineup with a new chip varistor, type AVRH10C101KT4R7YA8, for automotive application Ethernet with strong resistance to ESD. Mass production will begin in March 2022.

Utilizing high-precision multilayer technology and optimizing the manufacturing process and process design, the product implements a tight tolerance of 4.7 ± 0.57 pF in the capacitance range and strong resistance to voltage ESD up to 25 kV. Moreover, it delivers the performance required for ESD protection devices by OPEN Alliance 100BASE-T1 ESD Device Specification ver.2.0 and is compliant with this standard. It achieves the industry's smallest size of 1005 (1.0 x 0.5 x 0.5 mm) as a chip varistor for automobile, supports a maximum circuit voltage of up to 70 V, and has a high operating temperature range from -55 °C to +150 °C.

As ADAS (advanced driver-assistance systems) and even more advanced autonomous driving systems require high-speed and low-delay telecommunication between ECUs, Ethernet for automotive applications is used as telecommunications infrastructure. This product provides ESD protection to automotive equipment without interfering with high-speed communication between ECUs. In addition to support for high-speed communications required for future automotive equipment, the new product offers higher reliability by achieving strong ESD resistance.

Moving forward, TDK will continue providing customers with flexible support to design their diversified automotive equipment by expanding the product lineup through further downsizing, increased operating voltage, and expansion of capacitance range, etc.

Glossary
•IEC61000-4-2: IEC61000-4-2: An immunity standard for electrostatic discharge established by the International Electrotechnical Commission (IEC)
•ADAS: Advanced driver-assistance systems
•ECU: Electronic Control Unit
•ESD: Electrostatic discharge

Main applications
•Ethernet for automotive application

Main features and benefits
•Low capacitance and tight tolerance
•ESD resistance of 25 kV
•Small footprint saves space
•Expansion of operating areas due to temperature range up to 150 °C
•Compliance with OPEN Alliance 100BASE-T1 ESD Device Specification ver.2.0

RECOM offers fully custom, semi-custom and modified-standard AC/DC and DC/DC converters from low power up to kilowatts.

RECOM is known globally for its cost-effective AC/DC and DC/DC converters, with a wide range of standard products from 0.25W up to tens of kW.

It may be less well known that we also manufacture full-custom, semi-custom and modified-standard products. Our engineering teams in China, Taiwan, Austria and Italy have extensive experience in product development and can design new products from the ‘ground up’ to increase the volume of production. Alternatively, semi-custom-designs and modifications to existing products are offered with very competitive pricing. Modification costs are kept low because RECOM’s automated production lines offer benefits due to its economies of scale through various methods such as by reusing existing tooling and production equipment with access to our extensive on-site component stock.

RECOM also has an extensive library of platform designs to call on, particularly through our Italian sister company PCS, who specializes in fast-turnaround, high-power and full-custom solutions. These proven platform designs can often be readily adapted for other applications without necessarily incurring extensive development or certification costs.

RECOM’s customization and standard product modification service includes low- to high-power AC/DCs and DC/DCs, battery chargers and conditioners, AC inverters, PFC front-ends and much, much more. All major application areas are covered – including industrial, medical, energy, aerospace, mobility and military COTS. According to customer requirements, fully customized and semi-custom products can also be supplied with the necessary safety and EMC certifications.

Martin Rausch, the CTO of RECOM comments, “For many years, we have offered customer-specific modifications to our standard products, so we may already have a version that matches your special requirements. If a full-or semi-custom design is the solution, RECOM can be your design partner for any application and market.”

Contact RECOM to discuss your project and for advice on how to specify your fully custom, semi-custom or modified-standard power converter for minimum cost and fastest delivery.

RECOM has added a 20W part to its ‘E-K’ range of encapsulated, PCB-mount AC/DC modules, the RAC20E-K/277. Even though it is economical designed the series is dimensionally of the same size as the existing 20W at just 52.7mm x 27.6mm footprint, but with a different pinning it is compatible with a further industry standards. It also features full load operation over a very wide input range of 85 – 305Vac. Single outputs of 5V, 12V or 24V are available, all at 80%+ efficiency, and no-load power consumption is less than 200mW to meet ECO directives. The ‘E-K’ range from RECOM is dimensionally the same as their ‘K’ series but with different pinning for compatibility with a wide range of industry standards.

A particular feature of the RAC20E-K/277 is its OVC III rating to 2000m altitude (OVC II to 5000m) and wide operating temperature range of -40°C to +90°C with derating, making it very suitable for harsh applications such as auxiliary supplies in roadside EV chargers as well as in industry, test and measurement and household generally, including applications with nominal 277Vac supply.

Isolation rating is also high at 4kVac and safety certifications include UL/IEC/EN 62368-1 and IEC/EN 61558-1/2-16. EN 55032 EMC ‘Class B’ limit is met without added external components.

As with all RECOM AC/DC products, comprehensive protection is included against output over-voltage, over-current and short circuits. Using high reliability components and advanced design techniques, the product MTBF is 830,000 hours at 25°C according to MIL-HDBK-217F (GB), supported by the standard RECOM 3-year warranty.

“The wide input range with no low-line restrictions makes these economical parts easy to design-in to world-wide applications,” said Michael Schrutka, AC/DC Product Manager of RECOM, “the high overvoltage category extends their potential usefulness even further”

Samples and OEM pricing are available from all authorized distributors or directly from RECOM.

A new member of PI’s acclaimed LinkSwitch-TN2 switch mode power supply IC family is now available. It increases the available output current from 360 to 575 mA without altering pin configurations, making it simple for design engineers to upgrade output power for appliances and industrial applications.

A high-current buck converter can be created using a minimal number of easily-available components while saving at least one diode over previous solutions. The new LNK3207 device also delivers high efficiency levels over 80% and no-load consumption of less than 30 mW.

The new IC targets appliances such as washers, dryers and coffee makers which benefit from its design simplicity. It’s also suitable for sensor-based, low-power applications such as home security cameras, smart thermostats, metering and IoT installations.

A new reference design kit, RDK-912, is available for purchase. It describes a 6.6 W non-isolated buck converter with 85-265 VAC input and 12 V, 550 mA output using the lowest possible component count. Download the reference design report: RDR-912.

To learn more, contact your PI sales representative.

The EPC9160 is a dual output synchronous buck converter reference design board operating at a 2 MHz switching frequency that converts an input voltage of 9 V to 24 V to a 3.3 V or 5 V output voltage and delivers up to 15 A continuous current for both outputs. Thanks to the high switching frequency the converter size is very small, only 23 mm x 22 mm for both outputs, and the inductor height is only 3 mm.

The high density and thickness of the design plus the 2 MHz switching frequency make this solution ideal for automotive console applications, where 2 MHz switching frequency is preferred, and computing, industrial, consumer, and telecom power systems requiring small size and a very thin profile. eGaN® FETs provide fast switching, high efficiency, and small size that can meet the stringent power density requirements of these leading-edge applications.

The efficiency of the EPC9160 is greater than 93 % for 5 V output and 24 V input. In addition to light load operating mode and adjustable dead time, the board offers UVLO, Over-current protection, and power good output.

The EPC9160 reference design uses the EPC2055 enhancement-mode GaN FET and the LTC7890 two-phase analog buck controller with integrated GaN drivers.

• The LTC7890 100 V low Iq, dual, 2-phase synchronous step-down controller is fully optimized to drive EPC eGaN FETs and integrates a half-bridge driver and smart bootstrap diode. It offers optimized near-zero deadtime or programmable deadtime and programmable switching frequency up to 3 MHz. The quiescent current of 5 uA (VIN = 48 V, VOUT = 5 V, CH1 only) enables very low standby power consumption and excellent light load efficiency.

• The EPC2055 40 V eGaN FETs offer 3 mOhm max RDS(on), 6.6 nC QG, 0.7 nC QGD, 1.3 nC QOSS, and zero QRR in a super small 2.5 mm x 1.5 mm footprint and can deliver up to 29 A continuous current and 161 A peak current. The excellent dynamic parameters allow very small switching losses at 2 MHz switching frequency.

TDK Corporation announces the introduction of 12V and 48V output models to the conduction cooled TDK-Lambda brand PFH500F series of AC-DC power modules.  The power supplies are rated at 504W, feature a compact 4” x 2.4” footprint with programming and communication through a PMBus™ interface.  These power supplies are ideal for a variety of applications including COTS (Commercial-Off-The-Shelf) applications, power amplifiers, LED displays and test equipment.

The PFH500F series utilizes GaN semiconductors, bridgeless power factor correction, synchronous rectification and digital control, enabling efficiencies of up to 92%. Opto-couplers have been replaced by digital isolators for long term reliability and stability.

Accepting an 85 to 265Vac input, the modules deliver 12V at 42A or 48V at 10.5A and can be adjusted from 9.6 to 14.4V or 38.4 to 52.8V using the trim pin or PMBus interface.  The droop mode current share option enables modules to be connected in parallel for additional power.  Baseplate cooling allows operation at temperatures ranging from -40 to +100°C.  The metal enclosure measures 4 x 2.4 x 0.53” (101.6 x 61.0 x 13.3mm) and is encapsulated for MIL-STD-810G shock and vibration.

Features include a 12V 200mA standby voltage, remote on/off, pre-biasing start-up, droop mode current share, a Power Good signal, output trim pin and a PMBus interface. The PMBus can be used to program (read-write) the output voltage and fault management functions and monitor the unit’s operating status.  The PFH500F series is fully protected against over voltage, under voltage, over current and over temperature conditions.

The series has been certified to the IEC/UL/CSA/EN 62368-1 safety standards and carries the CE and UKCA marks for the Low Voltage and RoHS Directives.  Input to ground isolation is 2,500Vac, input to output 3,000Vac and output to case 1,500Vdc.

More information on the PFH500F models, including distributor inventory and evaluation boards, can be obtained from the TDK-Lambda Americas website at https://www.us.lambda.tdk.com.

Main applications

• COTS (Commercial-Off-The-Shelf), power amplifiers, LED displays and test equipment

Main features and benefits

• 4” x 2.4” foot-print
• High Efficiency – up to 92%
• PMBus™ interface
• Parallel capability (droop mode)

Add new functionality to your satellite designs while keeping power supplies small. The TPS7H5001-SP rad hard PWM controller offers:

 • Best-in-class efficiency: Provides dual-channel synchronous rectification outputs, which can increase efficiency by as much as 5%

 •Higher radiation performance: Significantly improves radiation hardness by eliminating cross-conductive single-event transients (SETs).

 •Small package to reduce board space: 7.9-mm by 6.4-mm CFP package.

 •Flexibility to scale designs: Supports multiple power-supply topologies and FET architectures (silicon or GaN) to scale across designs.

PowiGaN Technology has enabled the creation of smaller, more efficient and more reliable USB PD chargers. With its outstanding capability to deliver PowiGaN-based IC products, Power Integrations is the ideal partner for manufacturers in the ultra-competitive fast-charger market.

Benefiting from the size-shrinking power of PowiGaN devices, Anker Innovations’ popular Nano and Nano Pro USB-C chargers became one of the most successful product lines in the electronic accessories market in 2021. Anker CEO Steven Yang said in a new video: ”PI is one of the most trusted partners of Anker charger products. Thanks to PI’s leading AC-DC technology and first-class delivery capacity, the shipment of Anker Nano and Nano Pro products has exceeded 10 million units this year.”

PowiGaN switches are seamlessly integrated into PI’s widely successful InnoSwitch3 ICs, achieving up to 95% efficiency and 100 W output in enclosed adapter applications without requiring a heatsink. PowiGaN devices allow manufacturers to make a stress-free transition from silicon to GaN. Click on the links below to learn more about the complete lineup of PowiGaN-based ICs.

• InnoSwitch4-CZ for ultra-small mobile device chargers, paired with ClampZero active clamp IC
• InnoSwitch3-Pro for dynamically controllable voltage and current, including USB PD + PPS
• InnoSwitch3-PD for low-component count USB PD adapters, with built-in USB PD controller
• MinE-CAP for reducing capacitor size in chargers, paired with InnoSwitch3 switcher ICs
• InnoSwitch3-MX for LED TVs, monitors and appliances utilizing LED displays
• InnoSwitch3-CP for constant power charging
• InnoSwitch3-EP for open frame power supplies

The EPC9167, a 3-phase BLDC motor drive inverter using the EPC2065 eGaN® FET delivers premium motor performance at a low cost. The extremely small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density, and lowest weight.

The EPC9167 operates from an input supply voltage between 14 V and 60 V (nominal 48 V) and has two configurations – a standard unit and a high current version:

• The EPC9167 standard reference design board is a 3-phase BLDC motor drive inverter board featuring the EPC2065 eGaN FET rated at 3.6 mΩ maximum RDS(on), 80 V maximum device voltage. This standard configuration uses single FETs for each switch position and can deliver up to 20 ARMS maximum output current.

• A high current configuration, the EPC9167HC, version of the reference design uses two paralleled FETs per switch position with the ability to deliver up to 42 Apk (30 ARMS) maximum output current.

Both versions of the EPC9167 contain all the necessary critical function circuits to support a complete motor drive inverter including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions. The boards also feature the ST Microelectronics, STDRIVEG600, smart motor drive GaN half-bridge driver.

Major benefits of a GaN-based motor drive are exhibited with these reference design boards, including lower distortion for lower acoustic noise, lower current ripple for reduced magnetic loss, lower torque ripple for improved precision, and lower filtering for lower cost. The EPC9167 boards’ lower weight and size enable incorporation of the drive into the motor housing and supports low inductance, higher power density motors.

The latest addition to RECOM’s railway portfolio is the RMD500-EW series. Featuring 500W rating with a wide 4:1 (43-154VDC) input range (170V peak) and 24V output, the product is suitable for nominal 72V and 110VDC inputs with tolerance and surges according to EN 50155. The RMD500-EW is designed for ‘plug and play’ use with all features required by EN 50155 included: reverse polarity protection, EMC and surge filtering, inrush current limiting and 10ms hold-up time. All relevant rail environmental standards are met for conducted and radiated EMI, mechanical shock and vibration, thermal shock, temperature cycling and fire protection.

Output power is 500W up to 95°C baseplate temperature without derating, allowing operation from -40°C to typically +70/85°C ambient temperature, meeting EN 50155 OT4 + ST1 and ST2 conditions. Efficiency is high at up to 95.5% over a wide input range and down to light loads, allowing high power density in a compact 209 x 141 x 48mm baseplate-cooled package, which can be mounted in any orientation. Screw terminals are provided for convenient input and output connections.

The product is certified to EN 62368-1 and EN 50155 (S2) with 3.5kVAC rated isolation. The product is extremely reliable and robust with full protection included against short-circuits, output over-voltage, over-current and over-temperature. Other features include DCOK volt-free relay contacts, remote ON/OFF, output trim, and active current sharing with OR-ing diodes for parallel operation, when increased power or n+1 redundancy is required.

Further products in the series are in the pipeline for launch in 2022 with power ratings of 300W and 150W for wider rolling stock and trackside applications.

Marco Kuhn, Mobility Product Manager of RECOM comments: “The RMD500-EW is the first in a standard range of ‘plug and play’ DC/DCs from RECOM for rail applications, such as traction and propulsion auxiliary supplies, braking, monitoring, safety, HVAC and door control systems, data loggers and much more. With all functions and features integrated, they are truly ‘plug and play’”.

Meet our new 3-GHz high-input-impedance buffer, the BUF802. This device allows design engineers to achieve higher bandwidth than ever before, eliminate dozens of discrete components and scale front-end designs across multiple data acquisition applications. Some of the device benefits include:

 • 10 times wider bandwidth than discrete solutions

 • Eliminates the need for custom ASICs

 • Adjustable quiescent current for various system bandwidth requirements (100GHz to 3GHz)

A new 2 kW, two-phase 48 V – 14 V bidirectional converter that operates with 96.8% peak efficiency in a small footprint. The board features the ePower™ 100 V, 65 A integrated circuit chipset. The chipset includes the EPC23101 eGaN® IC plus EPC2302 eGaN® FET for a solution capable of a maximum withstand voltage of 100 V, delivering up to 65 A load current, while capable of switching speeds greater than 1 MHz.

The fast-switching speed and low losses of the gallium nitride (GaN) devices allow the converter to operate at 500 kHz, which significantly reduces the size of the solution and exceeds 96.5% efficiency between 60 A and 110 A with 95.8% efficiency at 140 A.

Key features of the EPC23101 integrated circuit used on the EPC9170 include integrated high-side FET with 3.3 mOhm max RDS(on) with gate driver, input logic interface, level shifting, bootstrap charging, gate drive buffer circuits and gate driver output to drive external low-side eGaN FET. The integration of the driver further simplifies the design and reduces parasitics.

The EPC2302 eGaN FET, featured on the EPC9170, offers a super small typical RDS(on), of just 1.4 mOhm, together with very small QG, QGD, and QOSS parameters for low conduction and switching losses.

Both the EPC23101 and EPC2302 feature a thermally enhanced QFN package with an exposed top with optimized pinout between the two devices. The combined chipset footprint is 7 mm x 5 mm, offering an extremely small solution size for the highest power density applications.

RECOM has extended its range of AC/DC open-frame power supplies with the RACM600-L series. The module can deliver 400/450W (115/230VAC) with convection cooling while 600W is available with continuously forced airflow. The product features a universal 80-275VAC input and a single 24V output, adjustable +/-20%, rated at 25A. A standby output at 5V/0.5A is also available.

The RACM600-L is designed for reliable and cost-effective operations in high-availability applications such as medical and process control, with high grade components and conservative design margins. Certifications include 2 x MOPP medical safety (IEC/EN/CSA/ ANSI/AAMI-ES 60601-1) up to 3000m, with leakage current suitable for BF applications. The module is also certified to IEC 62368-1 for IT/multimedia/industrial applications, with reinforced safety isolation to 5000m operation. EMC curve ‘B’ compliance to EN 55032 is achieved with a good margin without external components. Surge and burst immunity is at ‘Level 4’.

The RACM600-L series features an efficiency of up to 93% and the ability to be paralleled for redundancy or increased output with internal OR-ing diodes and active current sharing. ON/OFF control, a power good signal and remote sensing are included, along with a PMBusTM interface, for remote control and monitoring. Comprehensive protection against over-current, over-temperature, over-voltage and short circuits is also included.

The RACM600-L is in an open-frame, rugged, U-channel format of just 197mm x 102mm x 41mm (1U) and includes fixings for chassis-mounting. Operation is from -20°C to +70°C with derating.

RECOM’s AC/DC Product Manager Michael Schrutka, MSc. comments: “The RACM600-L is a versatile and cost-effective solution for systems that need high reliability and a full range of features, such as medical equipment and automation control”.

A new 2 kW, two-phase 48 V – 14 V bidirectional converter that operates with 96.8% peak efficiency in a small footprint. The board features the ePower™ 100 V, 65 A integrated circuit chipset. The chipset includes the EPC23101 eGaN® IC plus EPC2302 eGaN® FET for a solution capable of a maximum withstand voltage of 100 V, delivering up to 65 A load current, while capable of switching speeds greater than 1 MHz.

The fast-switching speed and low losses of the gallium nitride (GaN) devices allow the converter to operate at 500 kHz, which significantly reduces the size of the solution and exceeds 96.5% efficiency between 60 A and 110 A with 95.8% efficiency at 140 A.

Key features of the EPC23101 integrated circuit used on the EPC9170 include integrated high-side FET with 3.3 mOhm max RDS(on) with gate driver, input logic interface, level shifting, bootstrap charging, gate drive buffer circuits and gate driver output to drive external low-side eGaN FET. The integration of the driver further simplifies the design and reduces parasitics.

The EPC2302 eGaN FET, featured on the EPC9170, offers a super small typical RDS(on), of just 1.4 mOhm, together with very small QG, QGD, and QOSS parameters for low conduction and switching losses.

Both the EPC23101 and EPC2302 feature a thermally enhanced QFN package with an exposed top with optimized pinout between the two devices. The combined chipset footprint is 7 mm x 5 mm, offering an extremely small solution size for the highest power density applications.

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, has announced the release of the 1200W rated OFI1200A AC/DC power supply for industrial applications. Optimized for conduction cooling, the OFI1200A delivers high performance levels across a baseplate temperature range of -40 to +95 degrees C without the use of a fan. The power supply operates with a wide universal input range from 85 to 305VAC with power factor correction (PFC). Covering a large range of applications, its output voltage and current can be adjusted from near zero to the maximum allowed for each model.

A number of industrial applications require power supplies to operate with limited or no ventilation cooling. In this respect, those operating in harsh environments where electronic equipment is installed in a sealed box, radio communication systems subject to adverse weather conditions, outdoor displays and traffic signaling, and indoor equipment with very strict audible noise restrictions. In addition to environmental requirements, reliability and cost of maintenance are motivating systems designers not to use fans and blowers.

Conduction cooling requires very specific building practices and the PRBX OFI1200A has been designed to guarantee optimal heat transfer from the dissipating components to the baseplate, delivering a high level of performance within an operating temperature of -40 to +95 degree centigrade at baseplate. Depending on the assembly method and the overall cooling conditions, a derating may apply as specified in the technical documentation.

To cover a large range of applications, the OFI1200A operates with a wide universal input range from 85 to 305VAC (Nominal 100 to 277VAC). The unit includes a PFC with a coefficient of 0.98/0.95 (110VAC/230VAC).
The OFI1200A is available in three versions of single output DC voltage, 12V/84A ; 28V/43A and 48V/25A. Using a high efficiency topology, the typical efficiency for the 48V output unit at 230VAC input is an excellent 92%.
Industrial applications such as professional lighting or even low-power electrolyzers require the power supply to deliver constant current, and this must be easily adjustable. Often such equipments are operated in environments requiring the electronics to be enclosed and protected from hazards. This necessitates the power supply to offer an external control to adjust the output voltage and/or current from the maximum allowed to near zero.

To make it possible for customers to precisely adjust the voltage and current to their application, the OFI1200A offers two analog inputs, VTRM and ITRM. Using those functions, the output voltage and current can be adjusted from near zero up to the maximum specified per model. For example, the 28V output can be adjusted from near zero volts up to 33.6V, and the output current from near zero amps up to 43A. The output voltage can also be adjusted using the provided onboard potentiometer. The extended trimming and control function simplifies the utilization of the power supply in constant voltage (CV) or constant current (CC) mode, without adding external circuitry. For applications requiring redundancy or higher power, it is possible to connect up to nine units in parallel, delivering an impressive total power level of up to 9,720W in conduction cooling mode. To maintain the highest level of efficiency when operated in parallel or in redundancy-mode, optional active ORing circuitry deploying high performance FET technology (Option-O) is available on the OFI1200A28 and OFI1200A48.

In its open frame format, the OFI1200A measures 142 x 39 x 260mm (5.59 x 1.54 x 10.36 inches) and weighs 1.2kg max. An optional metal cover is available, adding just 1mm to the height and 200 grams to the weight (Option-N).
Benefiting from a design optimized for conduction cooling, the OFI1200A is suitable for applications requiring a silent power solution such as in a control room. Equally, it is suitable for industrial applications when forced air ventilation is not possible due to environmental constraints. Attached to a chassis or cold plate, the OFI1200A can deliver impressive power levels with a high level of reliability.

For more information, visit www.prbx.com.

RECOM has introduced two new cost-effective DC/DC products with outputs of 100W and 300W in a DOSA-compatible low-profile, through-hole eighth-brick format (58.4mm x 23mm).

The RPA100E-W 100W part has a wide 4:1 input range of 16-72V for nominal 24V, 28V and 48V supplies, and fully regulated 5V and 12V trimmable outputs are available. Full power is available to 50°C ambient in natural convection and to +85°C with forced air. Isolation is 1.5kVDC/1 min, basic grade.

The RPA300E 300W part has an input range of 36-75V for nominal 48V supplies and features an output trimmable over a wide range of 16-35V. Isolation of this part is 2.25kVDC/1 min, basic grade. The RPA300E has an integrated heat spreader that allows direct screw-fixing to a heatsink or cold wall. Full-load operation of this part without heatsinking is to 60°C with forced air and to 85°C with load derating.

Both product ranges have high power density with a typical efficiency of 94.8% (RPA300E) and 92% (RPA100E). High efficiency >90% is also maintained down to light loads, to suit applications with low standby loss requirements. The ranges include comprehensive protection against input under-voltage, short circuit, output over-current, over-voltage and over-temperature. Control features included are on/off control and remote sensing.

The RPA100E and RPA300E ranges are certified to UL/CAN/CSA 62368-1 safety standard for basic isolation and are compliant to EMC standard CISPR22 class B with an external filter.

The footprint of both parts is industry-standard DOSA-compatible, and the 100W part is just 11mm profile while the 300W part is 12.7mm. Pin-out is also standard and compatible with quarter-bricks allowing possible space saving in some applications without sacrificing power rating.

“The RPA100E and RPA300E eighth-brick DC/DCs are great examples of our commitment to develop high power-density converters” commented Matthew Dauterive, DC/DC product manager of RECOM. “They will find applications in all demanding industries from telecom, test and measurement, in data centers, industrial automation, and in PoE”.

For more information go to www.recom-power.com

RECOM has extended its range of DC/DC converters in a SOIC-16 package with new versions which offer even better value. The parts feature 5V (4.5-5.5V) inputs and a semi-regulated 5V output rated at either 0.5W (R05C05TE05S) or 1W (R05CTE05S). Line and load regulation figures are specified across the full temperature range, and there is no minimum load requirement, making the parts ideal for applications that have light-load operation modes.

Both parts have a 3kVDC/1 min (basic) insulation rating with greater than 8mm input/output creepage and clearance, and operate from -40°C to 125°C with derating. Isolation capacitance is just 7pF. Protection features include short-circuit, over-current, over temperature, and input undervoltage, making the parts highly suitable for applications that demand a high level of reliability and robustness. EMI levels are also particularly low compared with more expensive competing products.

The SOIC-16 package is just 10.35mm x 7.5mm footprint and 2.5mm profile, perfect for space-constrained designs. The two parts are pin compatible, allowing future upgrades from 0.5W to 1W if necessary. The DC/DCs are also partially pin compatible with the higher specification RECOM R05CT05S, which includes features such as remote on/off and reinforced isolation.

Applications for the two ranges include isolated COM port power supplies, gate drive power, current sensing/smart metering, medical devices, industrial PLC (I/O), and sensors for IoT/IIoT.

“These new DC/DCs are a low-cost alternative when all the features of our higher spec SOIC-16 parts are not needed”, commented Matthew Dauterive, DC/DC product manager of RECOM. “Even so, they still are manufactured with the same automated process with advanced transformer fabrication technology for the highest reliability in critical applications”.

For more information go to www.recom-power.com

TDK Corporation presents the new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

The pressure sensor element with ordering code B58601E35* works according to the piezoresistive principle via a Wheatstone bridge and is certified for an operating voltage of up to 10 V. Offering a high sensitivity of 110 mV/V/bar, C35 is well suited for applications with high demands of sensitivity, accuracy and long-term stability of 0.1% FSON. Furthermore, C35 is designed for a wide temperature range from -40 °C to +150 °C and is suitable for pressure measurements of non-aggressive gases and liquids. The main uses are in applications that require high reliability and extremely precise pressure measurement, such as medical engineering and the industrial and automotive sectors.
Main fields of application
Pressure measurement in demanding applications such as medical engineering as well as in the industrial and automotive sectors
Main features and benefits
•Measuring range of 0 to 100 mbar
•High sensitivity of 110 mV/V/bar
•High long-term stability (LTSV0) of 0.1% FSON
•Extremely low dimensions of just 2.05 x 2.05 x 1.2 mm
•Wide temperature range of -40 °C to +150 °C

Since the 2019 release of the 3rd edition textbook, GaN Transistors for Efficient Power Conversion, published by J. Wiley, there has been rapid adoption of GaN transistors and integrated circuits into a myriad of end-use applications such as robots, drones, AI computers, AC adapters, autonomous vehicles, and even vacuum cleaners.

This book, GaN Power Devices and Applications, provides an update on gallium nitride technology and applications by leading experts. The book starts with two years of new information on technology developments, design techniques, and reliability beginning right after the publication of the 3rd edition textbook. In a practical sense, this book includes detailed descriptions of the latest examples of GaN’s usage in power supplies, lidar, motor drives, and space applications.

MinDCet, a leading semiconductor house specializing in power and high-voltage IC design, announced the development of the first GaN-driven Dynamic Drive along with FTEX, the renowned specialist in precision motor control systems using gallium nitride (GaN) transistors.

FTEX develops variable DC bus motor drives for EVs which have been shown to play a significant role in increasing range and power of EV powertrains. However, legacy silicon DC-DC converters are too large to be integrated in an EV powertrain, taking up space otherwise used for batteries. Having the possibility to drastically increase the power density of a DC-DC power converter enables multiple architectures not previously commercially viable.

FTEX finds solutions to these problems by implementing novel topologies and gallium nitride transistors to overcome the size and efficiency issues of variable DC bus powertrains. GaN power transistors have multiple key advantages, such as lower On resistance compared to state-of-the-art silicon equivalents and very sharp commutations that enable high-frequency power conversion and ideal waveform generation. Provided they are designed and driven effectively, this technology can drastically reduce the size of DC-DC converters while maintaining ultra-high-efficiency operation.

FTEX is leaning on the high-performance gallium nitride transistors offered by EPC driven to their full potential thanks to the high-performance MinDCet MDC901 drivers. “With its advanced capabilities and flexibility by design, this single driver can achieve high-performance in various applications, either for power conversion or motor control,” said Alexandre Cosneau, CTO of FTEX. “Exclusive features such as charge pumps, 5V to 6V gate drive voltages, and advanced thermal dissipation allow this driver to get the best out of the EPC GaN transistors, for example. Considering the safety of the power conversion system, a shoot-through event, one of the worst failure scenarios that can occur in a half-bridge, can be greatly prevented by MinDCet’s driver, thanks to its numerous fail-safes.”

The gate driver precision and control directly influence the reliability and efficiency of the system. The gate driver controls the behavior of the half-bridge output, known as the switching node. By generating a near perfect waveform at the switching node, harmonics within the magnetic elements are minimized, resulting in very low losses. These harmonics arise from the over-/under-shoots and their subsequent ringing during commutation transitions, where harmonics are simply wasted energy and damage the circuitry over time. “Driving GaN transistors in a robust and reliable way requires a specifically developed gate driver,” explained Jef Thoné, CTO at MinDCet. “You want to maintain a perfect gate voltage control under high slew-rate conditions to ensure a long lifetime for your GaN power stage.”

The combination of EPC GaNs and the MinDCet driver allows FTEX to effectively use its expertise to design and implement high-performance algorithms and control methods to deliver a DC-DC converter with up to three times the power density compared to the existing state-of-the-art. The result is the FTEX Dynamic Drive, a high-performance, ultra-compact, variable DC bus motor drive that has been shown to provide up to 30% more range and power in a commercially viable, cost effective solution.

For more information:

• Check out FTEX Technology

• Learn about MinDCet Drivers

TDK Corporation (TSE:6762) announces the release of its newly developed ADL3225VM inductors for use in automotive Power over Coax (PoC) systems. Measuring at 3.2 x 2.5 x 2.5 mm (L xW x H), these inductors provide a compact solution for designers looking to reduce vehicle weight as manufacturers add more sensors and cameras to accommodate expanding automotive and advanced driver-assistance systems (ADAS) applications. The proprietary structural design and wire winding manufacturing process ensure high impedance over a broad bandpass of 1 MHz up to 1 GHz. The inductors are compliant with AEC-Q200 and achieve the highest-rated current in the industry for the 3225 size*. Volume production began in October 2021.

Performance advancements of ADAS applications have resulted in the increased production of electric control units (ECUs), particularly around view cameras and front sensing cameras, escalating the need for high-speed interfaces. Low-voltage differential signaling (LVDS) with transmission rates of up to 1.5 Gbit/s transfer image signals from automotive cameras to the control circuit board. This process involves PoC systems that relay data and power over the same coaxial cable. TDK’s ADL3225VM inductors serve as a blocking coil that separates ringing currents from the power supply, and increases the currents supplied by PoC systems. They support operating temperatures between -55 °C and +155 °C.

In the future, TDK will further expand the product portfolio to meet the needs of higher-speed and larger-volume transmission for an even wider variety of automotive applications.

Further information on the products can be found under
https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_automotive_decoupling_adl3225vm_en.pdf

Flex Power Modules has added 30 W dual output variants to its PKE range of through-hole, encapsulated, board-mounted DC/DC converters. The PKE532x series has an 18-75 Vdc (100 V peak) input range suitable for 24, 28 or 48 V nominals and the PKE332x series input range is 9-36 Vdc (50 V peak). Both parts are available with either +/-12V or +/15 V fully regulated dual outputs, with power ratings of 30 W total.

Encapsulation of the PKE series ensures mechanical protection and reliable operation in environments with high shock and vibration levels or with dust/humidity present. All parts are in a space-saving 1” x 1” x 0.4” format with 5-sided shielding from a metallic case.

A particular advantage of these new variants in the PKE series is their ability to operate to over 100°C ambient with airflow and derating. This is facilitated by their exceptional efficiency for this class of product.

Input-output Isolation of the DC/DC converters is 1500 VDC, meeting ‘basic’ insulation and safety requirements according to IEC/UL 62368-1. EN 55032, CISPR 32 and FCC part 15J EMC conducted emissions standards can be met with an external filter, specified in the product data sheets.
A remote on/off control is provided and both series include comprehensive protection against over temperature, input under-voltage, output over-voltage, over-current and short circuits.

Olle Hellgren Director Marketing and Product Management, Flex Power Modules comments: “These PKE range additions with higher powered dual outputs are positioned at an attractive price/performance point. They are a great fit for high reliability applications where cost is important, such as industrial and communication electronics, instrumentation devices and mobile and battery-operated systems”.

Flex Power Modules has been a technical pioneer in the development of power modules for more than 40 years with quality designed and built into products at every stage. The PKE series benefits from this long experience and has undergone comprehensive qualification, which, along with highly automated manufacturing, guarantees reliable operation. Flex Power Modules’ products are backed up by ISO 9001/14001 certification and unrivaled technical support.

• 30 W ratings in a compact 1” x 1” x 0.4” format
• 4:1 input, 9-36 V or 18-75 V with +/-12 V and +/-15 V outputs
• Encapsulated
• 1500 VDC isolation
• Competitive performance/price point

TDK Corporation announces the introduction of the TDK-Lambda brand CUS500M1 AC-DC power supplies. The series is rated at 500W and is packaged in a 3 x 5” footprint. It provides an alternative for the 600W CUS600M models and an easy cost reduction for lower power, more cost sensitive applications.  The CUS500M1 is suitable for use in a wide range of Class I or Class II (double insulated) applications, including home healthcare, medical, dental, test and measurement, broadcast and industrial equipment.

The CUS500M1 series accepts an 85 to 264Vac input and has a choice of seven output voltages: 12V, 19V, 24V, 28V, 32V, 36V and 48V.  An integral fan option with cover is also available.  The open frame models measure 76.2 x 127 x 37mm (WxLxH), or 85 x 157 x 42.5mm with the cover/fan assembly fitted.

Convection cooled the CUS500M1 can deliver 300W (500W peak) in -20^oC to +40^oC ambient temperatures, derating linearly to 150W load at +70^oC. With forced air cooling or the integral fan fitted, the series provides up to 500W in a +60^oC ambient, derating to 400W at +70^oC.  The efficiency of the series is up to 96%, reducing internal power losses.

The CUS500M1 has an input to output isolation of 4,000Vac (2 x MoPP), an input to ground isolation of 2,000Vac (1 x MoPP) and an output to ground isolation of 1,500Vac (1 x MoPP) for suitability in B and BF rated medical equipment.  The leakage current is <200µA and the touch current is <100µA.  The maximum operating, transportation and storage altitude is 5,000m.

Safety certifications include IEC/EN/ES 60601-1 and IEC/EN/UL 62368-1 with CE and UKCA markings for the Low Voltage, EMC and RoHS Directives.  The units also comply with EN 55011-B and EN 55032-B conducted and radiated emissions (for Class II applications, external filtering may be required), and meets the EN 61000-3-2 harmonics, IEC60601-1-2 Edition 4 and IEC 61000-4 immunity standards

More information can be obtained at the following TDK-Lambda Americas website https://product.tdk.com/en/power/cus-m or by calling 800-LAMBDA-4.  Product availability for the CUS500M1 power supplies can be found via the link to TDK-Lambda’s distributor network (see “Check Distributor Inventory”) at https://www.us.lambda.tdk.com.

KEMET, part of the YAGEO Group and leading global electronic components supplier, announces its new R53 series of miniature, polypropylene film X2 EMI (electromagnetic interference) suppression capacitors. This series fulfills the growing need for automotive, industrial, consumer, and energy applications that require a smaller, high-capacitance X2 class solution for suppressing EMI. The R53 series offers capacitance values from 0.1µF to 22µF, lead-spacing from 15mm to 37.5mmm, 85/85 THB Class IIIB classification, and long-life stability in harsh environmental conditions. Its volume, on average, is 60% smaller than competitive X2 class capacitors, enabling a smaller PCB area, reduced weight, lower costs and improved reliability. These features position R53 as an exceptional X2 class solution that addresses design engineers' size, capacitance, and reliability challenges across multiple industries.

Currently, available solutions comparable to the R53 series have either larger dimensions or require capacitors in parallel in the design. With a rated 310Vac at 50 or 60Hz, this series is intended for use in Class X2 line-to-line applications or in series with the AC mains. R53 is well-suited for AC/DC converters in onboard chargers for xEVs, smart grid hardware, EMI filtering in Variable Frequency Drivers (VFDs), LED drivers, and high energy density applications such as capacitive power supplies. R53 series features a metallized polypropylene film encapsulated in a self-extinguishing resin and a shell that meets UL 94 V-0 requirements. The metallized polypropylene film combined with an internal parallel construction provides self-healing properties to prevent catastrophic failure and extend service life.

Electronic component miniaturization and operation in harsh environmental conditions are growing in applications, such as onboard chargers, smart electric meters, capacitive power supplies, including connection in series with the mains, motor drives, wind, and solar inverters. R53 capacitors are AEC-Q200 qualified, designed for harsh environments, and meet the highest standards of reliability required for smart grid hardware, often located in limited access areas where regular service is not available.

The R53 series is available immediately via KEMET distributors. To learn more about its capabilities and applications, visit https://ec.kemet.com/film.

Power Integrations the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the InnoSwitch™3-PD family of ICs, the industry's most highly integrated solution for USB Type-C, USB Power Delivery (PD), and USB Programmable Power Supply (PPS) adapters. This compact InSOP™-24D-packaged IC includes a USB-C and PD controller, a high-voltage PowiGaN™ switch, a multi-mode quasi-resonant flyback controller, secondary-side sensing, FluxLink™ isolated digital feedback and a synchronous-rectification driver.

Aditya Kulkarni, senior product marketing engineer at Power Integrations said: “InnoSwitch3-PD ICs target designers seeking the ultimate in charger power density. This requires the highest level of integration and maximum efficiency to limit self-heating. Our latest addition to the InnoSwitch3 family dramatically simplifies the development and manufacturing of compact, energy-efficient USB PD power supplies for smartphones, tablets, notebooks, and other devices that benefit from fast charging. InnoSwitch3-PD ICs reduce the BOM count to half that of conventional designs, reducing design time and simplifying high-volume manufacture for slim, ultra-compact OEM and aftermarket chargers.”

Featuring no-load power consumption as low as 14 mW, power supply designs using InnoSwitch3-PD ICs meet all global energy-efficiency regulations. The high efficiency of these devices ensures low heat dissipation, eliminating the need for bulky heatsinks. Power Integrations’ FluxLink high-speed communications feedback link ensures fast, accurate secondary-side regulation. InnoSwitch3-PD ICs are also fully protected, with input voltage monitoring, accurate brown-in/brown-out and overvoltage protection, and output over- and under-voltage fault detection with independently configurable fault responses.

Availability & Resources

A new design report, RDR-838, describes a 60 W USB PD 3.0 Power Supply with 3.3 V – 21 V PPS output using the InnoSwitch3-PD PowiGaN-powered INN3879C-H801. The new InnoSwitch3-PD ICs are priced from $1.30 per unit in 10,000-unit quantities. For further information, contact a Power Integrations sales representative or one of the company’s authorized worldwide distributors: Digi-Key, Farnell, Mouser and RS Components.

Power Integrations (Nasdaq: POWI), the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced its new plug-and-play SCALE-iFlex™ LT dual gate-drivers. The new drivers improve the performance of multiple parallel EconoDUAL modules by 20%, allowing users to eliminate one of every six modules from power inverters and converter stacks. In addition to saving the cost of the driver and module, this reduces control complexity and costs related to modules, wiring, hardware, and heatsinking. SCALE-iFlex LT targets multiple applications in renewable energy generation and storage, and is particularly applicable to offshore wind turbines in the 3 to 5 MW range.

Thorsten Schmidt, product marketing manager at Power Integrations commented: “Dynamic and static current sharing is critical for robust operation of modules arranged in parallel. For the same power output, systems using SCALE-iFlex LT require just five parallel modules whereas competitive approaches need six. This substantial saving of cost and complexity is achieved by guaranteeing less than 20 ns of variance in turn-on and turn-off commands between modules and less than 20 A of variance between modules when conducting the rated 600 A. This allows the modules to operate reliably without current derating, which is obligatory with less advanced driver solutions.”

Up to six EconoDUAL 3, or equivalent, power modules can be paralleled from the same Isolated Master Control (IMC) unit which has a more compact outline than conventional products. The Module Adapted Gate drivers (MAGs), which fit the footprint of the EconoDUAL module, each featuring two SCALE-2 ASICs – one per channel – to optimize symmetrical paralleling, efficiency and protection.

The new SCALE-iFlex LT gate-driver modules reduce switching losses by three to five percent, due to the fast turn-on and turn-off of the SCALE-2 ASIC which features an integrated booster stage. Power Integrations’ Advanced Active Clamping (AAC) protection enables higher DC link voltages to be achieved. A full suite of other protection features, including short-circuit, are provided. Drivers feature reinforced isolation to 1700 V and may be ordered naked or conformally coated.

As well as renewable energy, other applications include power quality, commercial air-conditioning units and medium-voltage drives. The new SCALE-iFlex LT gate drivers are available now. For more information, please visit www.power.com/scale-iflex-lt.

• Compatible with high durability soldering in 150 ºC environments
• Designed for automotive applications such as ECM, ABS, EPS, EV-EHV, inverters and LED headlights

TDK Corporation today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ºC environments. This series marks the industry’s first* high-reliability chip bead specifically designed for automotive applications associated with engine control modules (ECM), anti-lock brake systems (ABS), electric power steering (EPS), electric and hybrid electric vehicles (EV/EHV), inverters and LED headlights.

In high-temperature automotive environments, such as engine compartments, high-durability solder is increasingly used to prevent solder cracks in the bonds between chip components and the mounting substrate. Since high-durability solders do not stretch easily and impart higher stress compared with conventional solders, they place a large load on chip components and do not meet the reliability requirements of existing chip beads. With improvements to the terminal electrode material and plating process, the MMZ1608-HE series improves the bonding strength between the terminal electrode and plating, making it ideal for use with high-durability solder in 150 ºC environments.

The four products in the series have a rated current max ranging from 200 to 300 at 150 ºC, DC resistance max between 0.15 to 0.5, and impedance from 120-1000, respectively.

TDK will continue to expand its lineup of compact sizes and various impedances to support a wide range of automotive specifications and designs.

For more information, visit www.product.tdk.com.

TDK Corporation (TSE:6762) today announced the development of its KCZ1210AH series of miniaturized common-mode filters for automotive applications. The series is extremely compact, measuring 1.25 (L) x 1.0 (W) x 0.5 mm (H), which contributes to a smaller footprint on substrate and provides a noise control function for different transmission signal lines for automobiles.

With an increase in advanced driver-assistance systems (ADAS), demands for automotive cameras are rapidly growing. Forward sensing cameras and cameras for around view monitors utilize common-mode filters as anti-noise products. However, as the conventional multilayer common-mode filter operates within a temperature range of -40 and +105℃, it cannot be used for ADAS cameras and was principally used in automotive accessories.

TDK's series uses proprietary materials technology and structural design to achieve a temperature range from -55 to +125℃; it also has a rated current max of 100 and a rated voltage max of 5. By adopting a conductive resin-based electrode, it controls product cracks due to thermal shock and increases durability against mechanical stresses, such as substrate strains.

TDK is working to enhance its inductive devices for ADAS and will expand its line of miniaturized common-mode filters supporting higher-speed differential signals. Mass-production of this series will begin in September 2021.

Further information on the products can be found under https://product.tdk.com/system/files/dam/doc/product/emc/emc/cmf_cmc/catalog/cmf_automotive_signal_kcz1210ah_en.pdf.

TDK Corporation has developed the TCM0403M Series of miniaturized thin-film common-mode filters for mobile devices. The 0403 case size (0.45 x 0.3 x 0.23 mm) is 58 % smaller and 56 % lighter than previous products. With its high common-mode attenuation characteristic, these products reduce intruding noise and improve wireless signal reception sensitivity. The common mode attenuation at 2.4 GHz is 21 dB, and 28 dB at 5.0 GHz, with a maximum permissible current of 50 mA. Mass production started in August 2021.

Due to the growing multifunctionality of wireless devices such as smartphones, wearables and other mobile products, noises generated inside the devices are deteriorating wireless signals. It is critical to prevent the deterioration of signal reception sensitivity and to prevent external noise that has the potential to cause device malfunction; this series addresses those common challenges.

The products are mountable in ultra-small spaces due to their 58 % footprint reduction, which was previously impossible with the existing TCM0605 Series (0.65 x 0.5 mm case size). By improving TDK’s proprietary fine pattern technology and optimizing design, the products feature a common-mode attenuation characteristic that equals existing products and a differential transmission characteristic capable of supporting high-speed signal transmission.

TDK’s wide array of products meets the needs for common filters for high-speed differential signal lines, including for USB, MIPI and HDMI.

Further information on the products can be found under https://product.tdk.com/system/files/dam/doc/product/emc/emc/cmf_cmc/catalog/cmf_commercial_signal_tcm0403m_en.pdf.

KEMET, part of the YAGEO Group and leading global electronic components supplier, announces its new high-performance supercapacitors for automotive electronics, the FMD and FU0H series. These series deliver 1,000 hours at 85°C/85% RH-rated voltage and operational temperature ranging from -40°C to 85°C. The FMD series offers the highest lifetime with up to 4,000 hours. These supercapacitors are qualified to an automotive testing protocol. These capacitors are manufactured in an ISO TS 16949 certified plant and are subjected to PPAP/PSW and change control. They are ideal for automotive applications needing a main power system backup during a power loss, such as ADAS, autonomous vehicles, and central gateway ECUs. Supercapacitors are ideal for maintaining the main power system’s real-time clock or volatile memory when it is removed, such as during a power failure or when the main power system’s battery has been removed for replacement. Additionally, these supercapacitors offer power backup in equipment ranging from IoT devices, smart meters, medical devices, and industrial computing.

Using supercapacitors for automotive electronics enables freedom from the design limits imposed by finite battery lifetimes. The supercapacitor’s benign open-circuit failure mode contrasts with typical short-circuit battery failures that may result in outgassing or ignition. Furthermore, supercapacitors are a cost-effective alternative to small backup batteries. Depending on the type of load and current demand, they can store enough energy to provide backup for durations ranging from a few seconds to several hours.

KEMET’s miniature supercapacitors use a proprietary aqueous electrolyte solution that provides high durability against liquid leakage, vibrations, and thermal shock, thus high reliability in harsh environments. Aqueous electrolytes are highly conductive, have a low environmental impact, and are non-toxic and non-flammable. Unlike a battery, supercapacitors store and release energy quickly through physical adsorption and the ions desorption in the electrolyte between its electrodes. With the supercapacitor’s low internal resistance, these devices can fully charge within a few seconds. In contrast, a secondary battery cell can take from ten minutes to several hours to fully charge. Moreover, there is no theoretical limit to the life cycle, whereas a lithium-ion secondary cell has a finite lifetime of about 500 cycles. They also typically have a greater resistance to moisture absorption than organic compounds, resulting in a longer life with better stability.

According to an Allied Market Research report, the global supercapacitor market generated $3.27 billion in 2019 and is estimated to reach $16.95 billion by 2027, with a CAGR of 23.3% from 2020 to 2027.* An increase in demand for automotive applications, renewable energy systems, and supportive government regulations is boosting the growth of the global supercapacitor market.

KEMET supercapacitors are available immediately via KEMET distributors. To learn more about their capabilities and applications, visit https://www.kemet.com/en/us/new-products.html

*Source: “Supercapacitor Market by Product Type (Double-Layer Capacitor, Pseudocapacitors, and Hybrid Capacitors), Module Type (Less Than 10 Volts Modules, 10 Volts to 25 Volts Modules, 25 Volts to 50 Volts Modules, 50 Volts to 100 Volts Modules, and Above 100 Volts Modules), Material (Activated carbon, Carbide Derived Carbon, Carbon Aerogel, and Others), and Application (Automotive, Industrial, Energy, Consumer Electronics, and Aerospace & Defense): Global Opportunity Analysis and Industry Forecast, 2020–2027."

A recent Design Example Report (DER-928) describes the use of two PowiGaN-based IC products to achieve 30.3 W/ in³ power density in a 60 W USB PD 3.0 adapter that is up to 93% efficient. The combination of the new InnoSwitch4-CZ zero-voltage-switching flyback switcher IC (with its companion active-clamping ClampZero IC) and the MinE-CAP bulk capacitor miniaturization IC ushers in a new class of ultra-compact mobile device chargers.

Typical eBike and power tool adapters come in bulky packages, with much of their volume devoted to thick, heavy metal heatsinks that siphon away wasted energy when they are charging. InnoSwitch3-CP offline flyback switcher ICs featuring PowiGaN Technology enable heatsink-free charger designs that are smaller, lighter, have ultra-high efficiency and low no-load consumption. Thanks to PowiGaN, you can slip your charger into your backpack and charge anywhere you can find an outlet.

A new design example report, DER-915, describes a 84 W (42 V / 2 A) adapter with 160-264 VAC high-line input for eBikes and power tools. The low component-count design fits neatly on a 3.2 in x 1.9 in circuit board; that’s about the size of a bank card. It’s greater than 93% efficient and consumes less than 70 mW of no-load power at 230 VAC.

Utility meters need to work without interruption and often under adverse conditions. From full load to light load, through line surges, or even when being tampered with, meters require rugged and efficient power supplies to deliver power without fail. A new design example report (DER-711) addresses these challenges with a 6.6 W dual-output flyback converter using a LinkSwitch-XT2 offline switcher IC. With a low-RDS (ON), 900 V MOSFET, LinkSwitch-XT2 improves efficiency at full load, maintains efficiency at light load, and resists magnetic tampering.

Meter tampering is often done by placing a strong magnet close to the meter’s power supply to interfere with transformer inductance. LinkSwitch-XT2 features an ON/OFF control that compensates for the primary inductance reduction by increasing operating frequency to maintain output power level. The ON/OFF control enables high efficiency at light load, allowing utility providers to minimize energy consumption during normal meter operation.

No EMI or Thermal Issues

The DER-711 circuit design utilizes the high current limit of LinkSwitch-XT2 to operate at very low frequency, making it capable of withstanding severe magnetic tampering. When operating frequency increases to 60 kHz due to proximity to a magnet, the design wouldn’t incur thermal or electromagnetic interference issues. In the extreme case when a magnet is in physical contact with the transformer, the drop in system efficiency is limited to 4-6%, and IC temperature increases by merely 16°C at full load. The DER-711 board layout places the transformer in the center, maximizing distance from possible external magnetic interference.

A True Universal Design

The LinkSwitch-XT2 IC’s integrated 900 V MOSFET provides valuable safety margin for meters in regions with high and unstable mains voltage. DER-711 has an ultra-wide 85-350 VAC input range and can withstand 6 kV of differential line surge.

To learn more download DER-711

TDK Corporation (TSE: 6762) has developed a series of thin-film metal power inductors for automotive power circuits. The new TFM201210ALMA inductors feature a mounting area downsized approximately 22 % from TDK’s conventional product, TFM201610ALMA (2.0 mm (L) x 1.6 mm (W) x 1.0 mm (H)). Mass production will begin in August 2021.

Demand has recently increased in ECU* mounting for the electrification of various automotive controlling functions, autonomous driving, information communication and other purposes. Downsized inductors for power circuits contribute to space-saving in a mounting substrate, at a time when quick advances in ADAS** performance increase the number of components typically used in system architectures.

In addition to its compact dimension of 2.0 mm (L) x 1.25 mm (W), this series uses the TDK proprietary metallic magnetic material as its core material. The thin-film inductors support a wide range of operating temperatures from -55 °C to +150 °C, the highest level in the industry***. Moreover, it features increased robustness against mechanical stress, such as vibrations and shocks due to the resin electrode structure.

In addition to the new items, TFM series includes a lineup of products with a rated voltage of 40 V, allowing use on an automotive power circuit side directly connected with a 12 V battery.

For more information see tdk.com

PI’s newest AEC-Q100 qualified Qspeed diode has the lowest reverse recovery charge (Qrr) of any 600 V silicon diode. Expanding our portfolio of automotive-qualified diodes, the QH12TZ600Q diode offers the same low switching-loss performance as a silicon carbide (SiC) device without the higher price tag.

Automotive on-board charger applications require higher switching frequency to reduce volume and weight. Our QH12TZ600Q diode has a Qrr of just 14 nC at 25 °C – half the Qrr of competing silicon diodes. It improves the efficiency of power factor correction (PFC) stages in the on-board charger while significantly reducing thermals in PFC MOSFETs.

Like our other Qspeed diodes, QH12TZ600Q uses merged PiN and Schottky diode technology to achieve high performance. Its smooth reverse recovery current transition characteristics not only increase efficiency, but reduce EMI and peak reverse voltage stress, eliminating the need for snubbers when used as output rectifiers.

QH12TZ600Q diodes are available in the compact, 2.5 kV isolated TO-220 package, enabling direct mounting to metal heat sinking and facilitating excellent thermal performance. They can be used as a single or interleaved continuous conduction mode (CCM) PFC boost diode or an output rectifier diode in on-board chargers.

To learn more download the QH12TZ600Q Data Sheet

Explore the low-cost MSP430FR243x family of FRAM-based microcontrollers

TI’s MSP430 microcontroller platform is based on an ultra-low-power FRAM system architecture that increases performance while lowering energy consumption. The MSP430FR2433 is TI’s lowest-cost family of MCUs for sensing and measurement applications.

Learn more

MSP430F2xx family: Get more from power from your MCU with integrated analog

MSP430FR21xx devices are ultra-low-power, low-cost MCUs built on the FRAM architecture. These devices provide integrated peripherals and combine low-power modes to achieve extended battery life in portable, battery-powered sensing applications.

Learn more

MSP430FR247x family: Delivering integrated analog at extended temps

MSP430FR247x MCUs are created to support industrial applications, leveraging the FRAM data-logging capabilities. This device integrates a 12-bit SAR ADC and one comparator, and offers an extended temperature range from –40°C up to 105°C.

Learn More

Capacitive sensing MSP430™ MCUs: Easiest to use capacitive touch solutions

The MSP430FR267x MUC family provides ultra-low-power microcontroller solutions for capacitive touch sensing applications supporting buttons, slides, wheel and proximity solutions. MSP430 MCUs with CapTIvate technology operate through thick glass, plastic enclosures, metal, and wood with operation in harsh environments including wet, greasy, and dirty environments.

Learn more

Simplify gas and liquid measurement with ultrasonic sensing MCUs

Ultrasonic sensors help with the level sensing for liquids and gases to measure liquid concentration, leak detection, level sensing and oxygen concentration. The MSP430FR604x microcontroller families are low-cost, single-chip solutions with integrated ultrasonic sensing analog front end. Its unique waveform capturing technology with high speed ADC and cross correlation method enables high accuracy measurements with low power.

Learn more

Easy to use development kit for sensing solutions

Get everything you need to start developing your sensing solutions using MSP430™ microcontrollers. The LaunchPad™ development kit includes an ambient light sensor, connector for external analog sources and probes for programming, debugging and energy measurements.

Learn more

Typical discrete AC zero-cross detection circuits require many components and consume as much as half of the standby power budget. Power Integrations’ new LinkSwitch-TNZ IC family solves this problem by combining offline power conversion, lossless zero-cross detection and optional X-capacitor discharge functions in a compact SO-8C package. With integrated lossless AC zero-cross detection, LinkSwitch-TNZ ICs provide best-in-class light-load efficiencies.

LinkSwitch-TNZ ICs provide an accurate signal indicating that the sinusoidal AC line is at zero volts. This signal is used by Smart Home and Building Automation (HBA) products and appliances to control the switching of relays, IGBTs and TRIACs to minimize switching stress and system in-rush current. The device’s detection of the zero-cross point consumes less than 5 mW, allowing systems to reduce standby power losses versus alternative approaches that require 10 or more discrete components and burn 50 to 100 mW of continuous power.

This highly efficient switcher can be used for non-isolated buck and buck-boost power supplies up to 575 mA output current and can provide up to 12 W output for universal input isolated flyback designs. For more information visit www.power.com

TDK Corporation (TSE:6762) has extended its range of coupled inductors to include the new EPCOS series B82472D6*. The nine series types cover an inductance range of 2 x 2.2 µH to 2 x 47 µH and are designed for maximum rated currents of 1.1 A to 4.3 A. The RoHS-compliant chokes are certified in line with AEC-Q200 and feature high saturation currents of up to 7.95 A. The magnetically shielded inductors have dimensions of just 7.3 x 7.3 x 4.8 mm and are designed for a wide temperature range of between -55 °C and +150 °C. Depending on the type, the chokes offer very high coupling factors of the two windings from 97 to 99 percent.

These compact, robust components proof to be useful in a wide range of applications: They are ideal in various galvanically non-insulated DC/DC converter topologies such as SEPIC, Cuk and Zeta and can also be used as transformers in flyback and multi-output buck topologies. In the latter, coupled inductors provide a second output voltage. Furthermore, they can be utilized as common-mode chokes in power supply lines. The insulation voltage between the two windings is >500 V.

Further information on the products can be found under http://www.tdk-electronics.tdk.com/power_inductors

The RAC05-K/PD3/H from RECOM is a board-mounted 5W Class II AC/DC converter series, intended for ‘fixed installations’ where higher levels of transients according to over-voltage category III are experienced, along with increased environmental pollution levels.

The converters are available with 5V, 12V or 15V single outputs and include enhanced clearances to meet OVCIII up to 5000m altitude. Nominal input ratings are 100VAC to 277VAC but the parts will withstand 480Vac without damage continuously. The series is rated for operation in ‘Pollution Degree 3’ environments, where pollution can become conductive if condensation occurs.

The RAC05-K/PD3-H series is fully protected against short circuits and over-voltage in case of internal abnormalities’ and meets EN 55032 Class B EMI emissions level (floating output), without external components. No-load consumption is less than 0.5W to meet eco-design directives. The parts are offered in a 2” x 1” x 1” high package and operate to 70°C in free air and to 85°C (12V part) with 40% derating. Certifications include IEC/EN 62368-1 and UL 61010-1.

Michael Schrutka, RECOM AC/DC product manager comments “Our new 5W AC/DC converters provide real value when compliance with over-voltage category III is required especially along with higher levels of protection against ambient air pollution in harsh environments. By elimitated or at least significantly reduced need for external suppression components. The parts will find applications in smart grid, renewable energy, smart metering and IoT systems, as well as monitoring food and beverage processing appliances.”

For more information go to www.recom-power.com

TDK Corporation developed new HPL505032F1 power inductors for use in automotive circuits. The inductors enable level 5 ADAS applications for cameras by offering high-current and low-inductance for power circuits in central processing units and graphic processing units, such as advanced driver-assistance systems (ADAS).

The new products achieve high power efficiency by adopting a low-resistance frame for the highly permeable and low-loss ferrite made of high BS material and low-RDC that is fully developed in-house. Its rated current is 1.5 times higher than TDK's existing product (HPL505028), accommodating currents as high as 40 A to 50 A. While the proprietary structural design generates magnetic flux canceling effects contributing to noise control, the frame that integrates internal with external electrodes reduces the risk of an open circuit and short circuit, ensuring high reliability.

The need for high-speed, large-capacity camera footage in ADAS is increasing as vehicles grow more autonomous. Cameras are an essential part of cars with ADAS capabilities to assure that everything is aligned within a vehicle and no dangerous situations occur. TDK’s product line for ADAS systems includes a range of automotive inductors for these applications. Mass production of these new inductors will begin in July 2021.

Further information on the products can be found under https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_automotive_power_hpl505032f1_en.pdf.

Green energy and electric transportation systems have pushed explosive growth in inverter markets. Many of these applications present harsh operating environments for power electronics circuitry. Often, these applications demand a high percentage of uptime, increasing the need for highly reliable components. In response, CDE’s BLH series of DC Link capacitors have been designed and tested to exceed the industry’s most stringent requirements for high humidity, vibration testing and thermal cycling.

 The Temperature, Humidity at Bias (THB) test exposes parts to the harsh conditions of 85 °C at 85% relative humidity with rated voltage applied. This demanding test simulates the harsh operating conditions encountered in many commercial and industrial inverter applications. Such conditions can cause non-THB rated capacitors to fail early from moisture penetration. While most capacitor makers validate their THB components for 1,000 hours under these conditions, CDE’s BLH series has been validated for 1,500 hours.

Utilizing the most advanced materials and processes, these board mounted capacitors have been designed and tested to meet the rigors of automotive AEC-Q200 testing. Their solvent-resistant plastic case and epoxy encapsulation system are UL Recognized and meet IEC61071. Tin-plated copper RoHS-compliant terminations ensure excellent solderability. With their superior resistance to moisture and robust design, these capacitors are well suited for solar, wind, UPS, EV chargers, and other inverter applications that may be subjected to wide-ranging environmental conditions.

The series is optimized for DC link applications in medium to high-power inverters. Capacitance ranges from 1.0 to 170 µF at 450-1,200 Vdc, with high rms ripple current ratings up to 36 Arms. When operated at a 70 °C hot-spot temperature with rated voltage applied, their life expectancy is 100,000 hours.

BLH Series film capacitors are available now from the company’s authorized distributors. For more information contact CDE: Product Manager: Larry Bromley, 508-996-8561 x1120 email:  lbromley@cde.com

The Wireless Power Consortium (WPC) has recently released the Qi 1.3 specification that requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver.

To meet the requirements of the specification, Microchip Technology Inc. announced today a new Qi^® 1.3 wireless charging reference design providing developers of wireless charging systems for automotive and consumer applications with the necessary tools and support for the seamless integration and certification of new-generation product designs.

For wireless charging system developers launching certified Qi 1.3 transmitters under tight timelines, Microchip’s three-coil Qi 1.3 reference design provides a head start for product development. The reference design fully integrates secure storage subsystem software with the wireless power microcontroller (MCU) and is a flexible solution, enabling custom topologies and foreign object detection (FOD) implementation.

As a regular member in the WPC, which sets global standards for wireless charging of mobile devices, Microchip provided expertise during development of the recently released Qi 1.3 specification. Qi 1.3 is a significant update from Qi 1.2.4 and mandates hardware-based authentication between transmitter and receiving devices for power transfer above 5W. By adhering to the new authentication standard, designers can ensure phones receiving 15W are receiving it from a Qi-certified authenticated transmitter to ensure safety.

“Wireless charging makes it easy and convenient for consumers to charge devices and, as a result, demand for these systems in the automotive and consumer segments is on the rise,” said Joe Thomsen, vice president, MCU16 business unit. “Microchip’s Qi 1.3 reference design, tools and support help engineers to meet rapidly evolving development requirements and enable easy certification of the new Qi 1.3 transmitter designs, speeding time to market and easing end-product certification.”

Included in Microchip’s reference design solution for wireless charging systems are all required elements: Qi controller, Qi application software, provisioned authentication controller that is a WPC-approved secure storage subsystem and crypto software libraries that execute on the Qi controller. The reference design includes complete schematics, bill of materials, software and design guidelines. Microchip is partnering with Avnet to make evaluation boards for the Qi reference design available to qualified customers around the world.

To support its Qi 1.3 wireless power solution, Microchip provides the dsPIC33C family of devices to run the Qi application software and the ECC608/TA100 secure storage subsystem provisioned by Microchip as a licensed WPC Manufacturing Certificate Authority. As a total system solution, this reference design also incorporates MIC4605 and MCP14700 gate drivers, MCP16331 and MCP1725 regulators, an MCP6C02 current sense device, an ATA6563 CAN transceiver and an MCP9700 temperature sensor.

For pricing and additional information, contact a Microchip sales representative, authorized worldwide distributor, or visit Microchip’s website https://www.microchip.com/wireless-power.

TDK Corporation presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals. The new components are designed for rated voltages between 400 V DC and 500 V DC and cover a capacitance range of 820 µF to 15,000 µF.

A special feature is the high-rated current capability of up to 56.1 A AC (100 Hz, 85 °C). In case of standard operating conditions (for example, at 300 Hz, 60 °C, 2 m/s), currents of up to 100 A can even be reached. These values mean an approx. 25 percent increase in the current capability in the case of rated conditions in contrast to previous series.

The robust capacitors are designed for a service life of 12,000 hours at 85 °C. A precise service life calculation can be performed with the online AlCap Tool (www.tdk-electronics.tdk.com/en/alcap_tool). Similar to other EPCOS screw terminal series, a range of options such as heat sink mounting or special terminals are available as reverse polarity protection.

The new capacitors are particularly well suited to frequency converters and industrial power supplies as well as UPS systems. Furthermore, the capacitors can be effectively used for converters in the renewable energies sector, such as wind power and photovoltaic systems.

Further information on the products can be found under www.tdk-electronics.tdk.com/en/alu_screw.

RECOM has launched an eighth-brick DC/DC converter series with 9-60VDC input and optional 12, 24 or 48V outputs rated at 150W. The RPA150E series has an industry standard pin-out with outputs trimmable over a wide +/-20% range to include 28V for avionic systems and 57V for PoE applications. The 6:1 input range covers nominal 12, 24, and 48V system rails with sufficient margin to include 48V battery charging voltage and 12V battery cranking voltage dips.

Efficiency of the RPA150E series is high, up to 92% typical, allowing operation to +85°C with minimal derating with airflow or baseplate cooling. Isolation is rated at 3kVDC, and standard control and protection feature include remote on/off, under-voltage lockout, over-voltage, over-current, and over-temperature.

Safety certifications for the converter include UL 62368-1, CAN/CSA-C22 No. 62368-1, and the parts are EMC-compliant to EN 55032 and EN 55011 with a recommended external filter network. With suitable external components, the RPA150E series is compliant with EN 50155 and EN 45545-2 railway functional and safety standards along with EN 50121-3-2 railway EMC standard.

Matthew Dauterive, DC/DC product manager of RECOM comments: “The wide input range of our RPA150E series means it can provide cost effective power conversion from battery voltages in EVs, rail, and E-mobility designs as well as in a broad range of industrial applications”.

For more information contact www.recom-power.com

The Power Sources Manufacturers Association (PSMA) announces publication of its ground-breaking Power Supply Software/Firmware Reliability Improvement Report. This report, the result of a year-long project undertaken by PSMA’s  Reliability Technical Committee, addresses recommended reliability improvements for power supply digital control software and firmware. This new report attempts to present key findings related to the challenges of and solutions to reliability in the digital control of power electronics.

“This is the first report from the work of PSMA’s newest committee, which aims to spearhead industry initiatives that identify and attempt to address the pertinent industry challenges related to the reliability performance of power supplies and associated products,” noted Brian Zahnstecher, Co-Chair of the PSMA Reliability Committee. Tony O’Brien, Reliability Committee Co-Chair, added “Moving from power electronics with analog control to power electronics with digital control is a significant transition. Software engineering best practices are being adopted for digital power electronics control for power supplies to ensure that reliability does not suffer with the transition to digital control. Some of the best practices are relatively new, evolving and unfamiliar to the power electronics world”

This 166-page report, divided into nine chapters, examines a wide array of problems and challenges in the field of digitally controlled power supplies, then proceeds to present observed and proposed improvements and best practices. Brian Zahnstecher further noted, “The ongoing tasks of the PSMA Reliability Committee will include efforts to support adoption of the recommended best practices and to update and refine our findings. We welcome the involvement of knowledgeable industry experts in this important work.” 

A copy of the printed and USB memory drive versions of the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report has been sent to PSMA Regular member companies as a benefit of their membership. Additional copies may be purchased at the member price of $US290. PSMA Affiliate members may also purchase the report for $US290. The report is available to non-members for purchase on the PSMA website (www.psma.com) for the price of $US2490.

A preview of the report is available here.

The Power Sources Manufacturers Association (PSMA) announces the 2019 edition of the Power Technology Roadmap. The report, which forecasts the power technology and power delivery trends through 2023, includes a printed report along with a feature-rich USB memory drive containing a record number of seventeen recorded webinars with up-to-date explanations of the information contained in the final report. The webinars add much to the presentation materials because the listener can hear and understand the context and the subtext of the original presentation in the speaker's voice. The recordings also capture the interesting and informative question and answer periods.

In this edition a new section on University Research in Power Electronics has been added. University research provides a window into what products and technologies are in store for Power Electronics. Leading power electronics research universities were asked about their research areas and priorities and their responses were analyzed to extract most common research areas, least common/missing research areas and unique research areas.

The overall structure of this year’s PTR largely follows the format of and keeps the improvements made in the 2017 report. It offers a consolidated view of the latest trends in the power management, power control, and power delivery technologies by integrating the most recent inputs from webinars, surveys, analyses and discussions. The report is divided into five sections:

• Application Trends
• Component Technologies
• University Research
• Webinar Presentations
• Power Supply and Converter Trends

“As power technology continues to emerge from the shadows to play a more central role in the next phase of electronics industry revolution, the PTR report provides many relevant pointers to the current and future industry stakeholders,” said Conor Quinn, Co-Chair of the Power Technology Roadmap committee.

Dhaval Dalal, Co-Chair of the committee, said, “In many emerging fields, such as electric vehicles, alternative energy converters and energy harvesting devices, power technology assumes a more central and driving role and the PTR captures how the industry is shaping up to play this role.”

PSMA Regular Member companies have each been sent one copy of the printed report and USB memory drive versions of the 2019 edition as a benefit of their membership. Members can access the webinars on line at no cost and purchase additional copies of the full report for $290. The non-member price is $4,490. For information about purchasing the report, please to the PSMA website at: www.psma.com/publications.

The Power Sources Manufacturers Association (PSMA) Packaging Committee announces the publication of its latest report titled, “3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies.” This is the third in a series of reports focused on using embedded substrate technology for building power sources. It is the first extensive study of embeddable passive components both available and in development for use in the power path of power sources. The report contains extensive research and product illustrations geared to an audience of technology executives and design engineers.

Miniaturization of passive components without compromising their power handling and efficiency and their integration with actives has always been a key focus for power packaging. There is also an increasing trend to vertical or 3D package integration to address the performance issues by eliminating parasitics from interconnections. Embedding gives lowest package inductance and enables co-integration of power systems and drivers in a single package with direct interconnection between gate driver circuits and switches with shortest interconnection length. This has become even more important with the rapid emergence of wide bandgap power switching devices. This, however, leads to several process integration and reliability challenges that need to be systematically addressed.

Georgia Tech Packaging Research Center, under contract from PSMA systematically surveyed the recent advances in passives, active embedding and 3D passive-active integration to generate this report, with emphasis on 3D power packaging enabled by advances in passive components and embedding of actives in power packages. A detailed literature study was conducted on key advances in embedded passive technologies and related topics. Emerging nanomaterials, processes and technologies are described in detail for inductors, capacitors and resistors. Nanostructured materials provide additional degrees of freedoms in enhancing the properties to improve the performance metrics such as volumetric density and efficiency of the components. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted in advancing the components to improve performance. Industry leaders were surveyed to get the recent technology advances in each category. Roadmaps are projected for passive component advances and active embedding technologies.

The trends and roadmaps in 3D power packaging are also described in three categories: low power (1-100 W), medium power (100-1000 W) and high power (10-100 kW). Integration in each category is classified into lead-frame-based, substrate-embedding based and traditional ceramic substrates. Active embedding with panel-scale substrate manufacturing is also reviewed in detail. Recent innovations in substrate materials and associated reliability challenges such as via cracking, dielectric cracking or electric breakdown are highlighted. Advances in die-attach solutions with sintered nanocopper are reviewed, highlighting the evolution of low-stress sintered copper-based die-attach solutions.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded passives in 3D power packaging to create the significantly higher power densities.

The PSMA report on 3D packaging was provided free of charge to PSMA Regular and Associate Company members.  Additional copies may be purchased at the member price of $290. PSMA Affiliate members may also purchase the report for $290. The report is available to non-members for purchase on the PSMA website (www.psma.com/publications) for the price of $3,490.

Provided by the PSMA Packaging Committee.

Brian Narveson Co-chairman

Ernie Parker  Co-chairman