New product announcements


Buffer modules offer an extra 380ms hold-up in an open frame package for 12V, 15V and 24V power supplies
Posted: 2021-4-12

TDK Corporation announces the introduction of the TDK-Lambda brand ZBM20 12V, 15V and 24V 20A rated open-frame buffer modules. The ZBM20 series provides an extended 380ms hold-up time to power supplies preventing data loss during brief power interruptions or allowing equipment to safely shutdown.  Applications include industrial automation, robotics, test, communication and semiconductor fabrication equipment.

Energy is stored in electrolytic capacitors, replacing the need for batteries and their associated maintenance and servicing.  A remote on/off function can be activated to avoid an unsafe discharge of stored energy. The charge and discharge status can be monitored locally or remotely via a DC OK relay, an LED indicator and photo-coupled signals. If a longer hold-up time is desired, modules can be connected in parallel.  The 24V model has a switch that can be used to select either fixed or variable voltage buffer levels. In fixed mode, it will provide power when the input voltage drops to 22.4V, in variable mode when the input decreases by 1V.

Measuring 175 x 85 x 57mm (L x W x H), the units will operate without derating in ambient temperatures of -25°C to +70°C.  The five-year warranty ZBM20 has protection against both input overvoltage and overcurrent conditions, has inrush current reduction and internal fusing.  Safety certification includes IEC/UL/CSA/EN 62368-1 with CE marking to the Low Voltage, EMC and RoHS Directives.

More information can be obtained at the following TDK-Lambda Americas website, https://product.tdk.com/en/power/zbm, or by calling 800-LAMBDA-4.  Product availability for the ZBM20 power supply can be found via the link to TDK-Lambda’s distributor network (see “Check Distributor Inventory”) at https://www.us.lambda.tdk.com.

Main applications

Industrial automation, robotics, test, communication and semiconductor fabrication equipment

Main features and benefits

  • Provides 380ms additional hold-up time at up to 448W
  • Utilizes electrolytic capacitors to store energy
  • Five year warranty
  • Parallel capable
  • Output remote on/off function

Key data         

Model

 

ZBM20-12

ZBM20-15

ZBM20-24

Input voltage range

Vdc

11.5 – 14.4

14.4 - 18

Fixed mode: 23 - 30, VIN-1 mode: 24 - 30

Output voltage

Vdc

11

13.8

22.4

Maximum current

A

20

Average buffer power

W

220

276

448

Signals and indicators

-

DC OK relay, photo-coupled signals and LED

Safety Certifications

-

IEC / UL / CSA / EN 62368-1 and CE mark

Size (Lx W x H)

mm

175 x 85 x 57

Warranty

-

Five years

 
TDK launches inductors for small power systems in TWS devices
Posted: 2021-4-2
New inductors feature a rated current of 500 mA in a small-sized component with an inductance of 2.2 μH , TDK’s unique magnetic shield structure reduces magnetic flux leakage

TDK Corporation has developed the PLEA67 Series of inductors for use in true wireless stereo (TWS)* devices. Mass production will begin in March 2021.
This new series of inductors is intended for use in power circuits incorporated into wireless earphones used with smartphones, portable players and similar devices. In addition to an impressive rated current of 500 mA, the PLEA67 series of inductors also boasts one of the industry’s smallest external sizes, measuring at 1.0 mm (L) x 0.6 mm (W) x 0.7 mm (H), respectively. The compact external size facilitates space saving in circuit board design and helps reduce the weight of earphones, providing users with mobility comfort. Their magnetic shield structure reduces magnetic flux leakage to pave the way for high density implementation. TDK’s original structure design and newly developed materials are used in its thin-film process to achieve a rated current of 500 mA, despite a high inductance of 2.2 μH for a size of 1.0 mm (L) x 0.6 mm (W) x 0.7 mm (H).
TWS devices are finding increasing applications with smartphones, smartwatches and other wearables and in turn, the demand for electronic components in this domain is rising. TDK will continue to broaden its lineup of inductor products with higher efficiency and smaller sizes to meet the demand of customers and the growing market.

Glossary
• TWS: Stands for True Wireless Stereo and refers to a technology for delivering stereo sound through completely cable-free earbuds. It is used for playback on smartphones, portable players and other devices.

Main applications
•TWS earphones and hearing aids, Communication module (GPS, Bluetooth, etc.)

Main features and benefits
•Compact size of 1.0 mm (L) x 0.6 mm (W) x 0.8 mm (H) to facilitate space saving
•Rated current of 500 mA attained in the compact size for space saving
•Flux leakage reduction structure opening the way for high density implementation.

Further information on the products can be found under https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_power_plea67bba_en.pdf

300W 20A buck-boost DC-DC converter models are optimized for 24V input applications
Posted: 2021-4-2

TDK Corporation announces the addition of 20A 300W rated models to the i7C non-isolated DC-DC converter series. These buck-boost board mount power modules have been optimized for 24V input with a range of 9 to 36Vdc and can be adjusted from 8 to 24V.  The i7C topology enables a seamless transition from buck (voltage reduction) to boost (voltage increase) operation.  The new models are ideal for generating additional high power outputs from 12 and 24V system voltages in medical, automated guided vehicles (AVG), drones, industrial, test, measurement and battery powered equipment.

Power losses are minimized with efficiencies up to 97%, allowing the product to operate and deliver high useable power in demanding thermal environments. Under light load conditions, the i7C’s control techniques significantly reduce power dissipation. A 5mA input current draw is typical under zero load conditions and can be reduced to typically 0.25mA when the module is in standby mode using the output inhibit function.  The low quiescent current allows battery powered equipment to remain functional longer during periods of non-operation.

The basic feature models include an output voltage adjustment pin, positive or negative logic remote on-off, positive remote sense, plus input under-voltage, over-current and thermal protection.  The full-featured models are equipped with a power good signal, output current monitoring and the ability to synchronize the operating frequency to minimize system noise. 

All the i7C2W converters measure 34mm x 36.8mm with a height of 14.7mm and follow the industry standard 1/16th brick pin-out.  The i7C design reduces the number of external       components, saving both cost and board space.

All models are certified to IEC/UL/CSA/EN 62368-1 and carry the CE mark for the Low Voltage and RoHS Directives.

More information on the 20A i7C2W models, including distributor inventory and evaluation boards, can be obtained from the TDK-Lambda Americas website at https://www.us.lambda.tdk.com.

Main applications

  • Medical, automated guided vehicles (AVG), drones, industrial, test, measurement and battery powered equipment

Main features and benefits

  • Up to 300W in a 1/16th brick pin-out
  • Up to 97% efficient with low off-load power consumption
  • Wide 8 to 24V output adjustment
  • Wide 9 to 36Vdc input range
  • Low component count with minimal external components
  • Low airflow with minimal derating requirements
TDK offers compact, current-compensated ring core chokes
Posted: 2021-3-25

TDK Corporation presents a new series of current-compensated EPCOS double-ring core chokes for the suppression of common-mode interferences. These chokes are available in three sizes with current handling capacities between 10 A and 17 A, and with a rated voltage of 250 V AC (50/60 Hz). Depending on the type, the inductance value is between 1.0 mH and 6.25 mH. The plastic material of the base plate and spacer in the middle of the ring core conforms with UL 94 V-0, and the highest CTI value of >600. In order to meet the high requirements for specific applications in domestic appliances, in accordance with IEC 60335-2-xx, the plastic meets specifications for GWIT (+775 °C), GWFI (850 °C) and Ball Pressure (+190 °C), as well as CTI >250. These high requirements are increasingly found in industrial applications, such as drives.

These EMC components offer extremely small dimensions in relation to the current capacity with dimensions of between 33 x 23 x 30 mm and 39 x 23 x 37 mm. Due to the leakage inductance of around 0.4%, the RoHS-compatible ring core chokes also suppress symmetrical interferences. The main areas of application are switch-mode power supplies, converters and domestic appliances.
-----

Main fields of application
• Switch-mode power supplies, converters and domestic appliances

Main features and benefits
• Higher insulation requirements according to IEC EN 60335-1/2 standards
• Current handling capacity of 10 A to 17 A at 250 V AC
• Compact dimensions of 33 x 23 x 30 mm to 39 x 23 x 37 mm
• Suppression of symmetrical interferences due to leakage inductance of 0.4%

You can find more information about the products at
https://www.tdk-electronics.tdk.com/en/power_chokes.

Small form factor PoL regulator offers high efficiency and excellent thermal performance
Posted: 2021-3-25

Flex Power Modules announces the PNA series, an analog non-isolated point of load (PoL) regulator that offers excellent efficiency and thermal performance in a small form factor. Its compact size and wide input voltage range of 9 V to 36 V mean that it is ideal for a range of industrial applications, including robotics, factory automation and process control, and that it is suitable for both 12 V and 24 V power systems.

The regulator has high efficiency of 95.5% at 12 Vin and 5.5 Vout, at full load. This reduces power losses and heat dissipation. It delivers an adjustable output of 0.9 V to 5.5 V, at up to 6 A output current, which translates to a maximum power output of 33 W.

The PNA series provides good thermal performance, and can operate at full load in ambient temperatures above 100°C. It has an operating temperature range of -40 °C to + 125 °C.

To save board space, the PNA series is provided in a small form factor, measuring 13 x 12.35 x 6.2 mm (0.51 x 0.48 x 0.24 in). This supports bottom-side PCB mounting, thus further reducing space requirements.

The regulator is available at a competitive cost, and provides an attractive price/performance ratio. It offers a mean time between failures (MTBF) of up to 71.84 million hours.

A voltage tracking function enables one regulator to use the output voltage of another as a reference to follow its turn-on and turn-off behavior. This simplifies the design required to make each device power-up in the correct sequence. The regulator also includes a power good (PG) function, for further control of sequencing, and supports soft start with time-based sequencing.

The PNA series can be synchronized to an external clock, which means that it eliminates beat frequencies reflected back to the input supply rail.

The first device in the series, the PNA2405S3S, will be available in Q2/2021. Samples are available now. Customers can obtain further information by contacting pm.info@flex.com.

High-Density, Quarter Brick Dc-Dc Converters for Railway Applications
Posted: 2021-3-25

CUI Inc, a Bel group company, today announced the addition of two 75 and 100 watt high-density, quarter brick dc-dc series to its isolated dc-dc converter line. These new compact products utilize the latest technology, allowing for a much smaller footprint while maintaining high operating efficiency up to 94%. These converters are additionally designed to meet the latest regulatory requirements for EN 62368-1.

These dc-dc converter models offer a wide input in a more compact quarter brick package, making it ideally suited for railway, data, telecom, and industrial applications where a large amount of power is needed in a smaller footprint.

Summary
Product series:
PRQ75W-D https://www.cui.com/product/dc-dc-converters/isolated/prq75w-d-series
PRQ100W-D https://www.cui.com/product/dc-dc-converters/isolated/prq100w-d-series
Applications: Railway, data, telecom, industrial
Distribution availability: Digi-Key, Mouser, Arrow
Datasheets:
PRQ75W-D https://www.cui.com/product/resource/prq75w-d.pdf
PRQ100W-D https://www.cui.com/product/resource/prq100w-d.pdf

Efficient Power Conversion (EPC) Revolutionizes Lidar System Design with Release of eToF™ Laser Driver IC Family of Products
Posted: 2021-3-11
Efficient Power Conversion (EPC) introduces the first of a new gallium nitride (GaN) integrated circuit (IC) product family offering higher performance and smaller solution size for time-of-flight (ToF) lidar applications including robotics, drones, 3D sensing, and autonomous cars.
EPC announces the introduction of a laser driver that integrates a 40 V, 10 A FET with integrated gate driver and 3.3 logic level input in a single chip for time-of-flight lidar systems used in robotics, surveillance systems, drones, autonomous cars, and vacuum cleaners.
The EPC21601 is a laser driver that is controlled using 3.3 V logic and is capable of very high frequencies exceeding 100 MHz and super short pulses < 2 ns to modulate laser driving currents up to 10 A. Turn-on and turn-off times are 410 ps and 320 ps respectively. The EPC21601 is a single-chip driver plus eGaN® FET using EPC’s proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.5 mm x 1.0 mm. With this small form factor and the integration of several functions, the overall solution that is 36% smaller on the printed circuit board (PCB) compared to an equivalent multi-chip discrete implementation.

The EPC21601 is the first offering in what will be a wide-range family of integrated laser drive ICs available in chip-scale package (CSP). Integrated devices in a single chip are easier to design, easier to layout, easier to assemble, save space on the PCB, increase efficiency, and reduce cost. This family of products will enable faster adoption and increased ubiquity of ToF solutions across a wider array of end-user applications.

“Recent advances in our GaN IC technology are poised to change the way time-of-flight lidar systems are designed,” said Alex Lidow, CEO, and co-founder of EPC. “Integrating an eGaN FET plus driver on one chip generates an extremely powerful, blazingly-fast IC and reduces size and cost wider adoption in consumer applications. This new family of GaN integrated circuits will dramatically improve the performance while reducing size and cost for time-of-flight lidar systems.”

Development Board

The EPC9154 development board features the EPC21601 eToF™ laser driver IC and is primarily intended to drive laser diodes with short, high current pulses. Capabilities include minimum pulse widths of < 2 ns, 10 A peak currents, and bus voltage rating of 30 V.

 
For more information, visit https://epc-co.com/epc/.
TDK expands embedded motor controller family to target high temperature environments
Posted: 2021-3-11

• HVC 4222F and HVC 4422F are Arm® M3 based motor drivers with 32k and 64k flash memory
• Fully specified and tested up to 160 °C junction temperature
• Target applications include automotive drive-train and thermal management systems

TDK Corporation has expanded its Micronas embedded motor controller portfolio to address higher temperature applications. The HVC 4222F and HVC 4422F were developed for operating smart actuators in applications with ambient temperature requirements up to 150 °C. HVC 4222F offers 32k flash memory while the HVC 4422F comes with 64k flash for more complex software implementations. These high temperature devices target applications in combustion vehicle drive trains, and emerging thermal management systems in electric and hybrid vehicles.

Samples are available; mass production will start in Q2 of 2021.

The new high temperature devices are part of the automotive-grade, motor controller family for LIN bus connected actuators. The HVC 4xxxF family integrates an Arm® standard microprocessor with six independent 500 mA half-bridge drivers and a wide range of additional functions to enable compact and cost-efficient motor-control applications. They are capable of driving small stepper, brushed (BDC) and brushless (BLDC) motors in applications with power requirements up to 1A peak current.

With its high processing power, the HVC family allows implementation of complex motor control algorithms such as Space Vector Modulation (SVM) for permanent magnet synchronous motors (PMSM), sensor-less commutation with back electro-magnetic force (BEMF), as well as various stepper algorithms with current limiting and stall detection. Eleven general-purpose input output pins (GPIO) enable integration of our large portfolio of hall switches or 2D/3D sensors for more precision motor control.

Main applications
• Radiator grille shutter
• Smart valves and pumps
• LIN bus connected actuators

Main features and benefits
• Supply voltage range from 8 V to 18 V (transient from 4.5 to 40 V)
• 6 x 500 mA (max) half-bridge drivers
• 32-bit Arm® Cortex®-M3 CPU core
• 20 MHz system oscillator, 35 kHz watchdog oscillator
• 32k or 64k flash memory versions with 2k or 4k SRAM
• 12-bit, 1 µs ADC for internal and external measurements
• 2x 8-bit current DAC for motor current limiting from 2 mA to 500 mA
• 12-bit PWM generators with center- and edge alignment and ADC triggering
• 16-bit timers for input and output PWM signal handling
• 11 GPIOs for application interfacing
• LIN transceiver for auto-addressing using the bus shunt method
• Small thermally efficient QFN40 package

For more information visit https://www.micronas.tdk.com/en/products/embedded-motor-controllers-smart-actuators

Sixteenth brick isolated analog DC/DC converter delivers superior price/performance ratio for telecoms applications
Posted: 2021-3-11

Flex Power Modules introduces the PKU4913D, the latest variant in its PKU-D series of analog DC/DC converters in the sixteenth brick format. The new converter delivers excellent electrical and thermal performance at an affordable cost.

Efficiency is high at typically 94.6% at Vin, 48 V at full load. Aimed primarily at telecoms applications, the new converter has an input voltage range of 36 V to 75 V, which meets the requirements of the European Telecom Standard ETS 300 132-2 for normal input voltage range in -48 and -60 Vdc systems.

It provides an output of up to 8.3 A at 12 V, thus delivering 100 W, with output voltage trimming of up to 10%. Input to output isolation is 2250 V.

The converter can be supplied with an optional baseplate, with cooling achieved mainly by conduction through a cold wall. In this configuration, performance is maintained, with no derating at 100°C.

The PKU4913D is supplied in an industry standard low-profile sixteenth brick format, measuring 33.02 x 22.86 x 11.30 mm (1.3 x 0.9 x 0.44 in). The converter includes sophisticated over-voltage, over-temperature and short-circuit protection mechanisms, which increase reliability and operational lifespan. It has a mean time between failures of 13.88 million hours.

As with all Flex Power Modules’ DC/DC converters, the PKU4913D meets safety standards according to IEC/EN/UL 62368-1. The devices have an operating temperature range of
-40°C to +125°C.

The PKU4913D will be available in February 2021. Customers can obtain further information by contacting pm.support@flex.com

Microchip Releases the First IEEE 802.3bt Power over Ethernet to USB Type-C® Power and Data Adapter
Posted: 2021-3-11
Enables extended installation reach of USB Type-C devices while supporting a variety of input PoE standards up to 90W and output power up to 60W

There are many consumer, enterprise and industrial devices today that have a USB Type-C port as the only input power option. While USB-C® technology can offer high power and high data rate, it limits the range of the installation to a maximum of three meters from an AC outlet. As Power over Ethernet (PoE) becomes more prevalent and a more convenient solution to provide power over a standard Ethernet cable, it is the most practical solution to provide both power and data up to 100 meters. While most adapters on the market provide only power, they provide only limited power up to 25W. Microchip Technology Inc. (Nasdaq: MCHP) today announced a PoE to USB-C adapter with the highest power capability that converts both power and data while offering up to 60W USB output power via an Ethernet cable supported by PoE infrastructure.

The adapter (part number PD-USB-DP60) can accept up to 90W of PoE and convert it to 60W output over USB-C that will power most cameras, laptops, tablets and other devices using USB-C for input power. This adapter simplifies installation by reducing dependency on AC infrastructure. Without the dependency of an AC outlet, there is no longer a range limitation of three meters and power can be delivered over 100 meters. This adapter also enhances the remote power management capabilities of the USB-C power device. The remote power reset capability, provided by the PoE source, allows power cycling via web interface or Simple Network Management Protocol (SNMP) to reset the device, rather than having to manually unplug and restart at the location of the equipment.

Microchip’s PoE to USB-C adapter can connect to a variety of PoE sources with various standards deployed. It supports newer IEEE 802.3af/at/bt standards as well as legacy PoE standards. Having a versatile adapter is crucial due to the many different implementations of PoE already installed.

“This new device is ideal for easily deploying USB-C devices and providing them long-range power and data connectivity,” said Iris Shuker, director of Microchip's PoE business unit. “The adapters are built using Microchip’s USB power delivery ICs and PoE chipsets and are a perfect pairing with our latest PoE injectors and midspans.”

Having the capability of converting 90W input to 60W output enables devices requiring higher power charging to make use of PoE that could not have done so before. The adapter can be paired with Microchip’s cost-effective single-port and multi-port (up to 24) PoE injectors/midspans and switches that comply with IEEE 802.3af/at/bt industry standards and provide up to 90W power per port. If a lower power is needed to power the USB-C device, IEEE802.3af (15.4W) or IEEE802.3at (30W) PoE sources can be used.

Microchip also offers key integratFed circuit solutions that enable the PoE to USB-C adapter, including the PD70xxx family of PoE ICs and the LAN7800 USB-to-Ethernet bridge. Functionality is enabled by Microchip’s Power Delivery Software Framework (PSF), an open-source Power Delivery (PD) stack that runs on the UPD301C PD controller and provides full PD 3.0 capability and customization for Microchip’s PD controllers, microcontrollers and USB hubs.

For more information visit

Rugged Industrial Ac-Dc Power Supplies Rated from 35 up to 350 Watts
Posted: 2021-3-11

CUI Inc, a Bel group company, today announced the addition of three new lines to its VGS family of chassis mount, single-output ac-dc power supplies housed in a compact metal case. The VGS-C, VGS-D, and VGS-W series offer power ratings from 35 to 350 W, depending on the series, and an operating temperature range of -25 to +70 °C, with most series offering an operating temperature range of -30 to +70 °C. All three series are 62368-1 safety certified with low no-load power consumption for reducing standby power usage in industrial applications.

For budget-constrained applications, CUI's VGS-C series offers power ratings from 35 to 350 W and carries single output voltages of 5, 12, 15, 24, 36, and 48 Vdc. Featuring active power factor correction and over temperature protection, models in the VGS-D series offer power ratings from 75 to 320 W and carry voltages from 5, 12, 15, 24, and 48 Vdc. The VGS-W series is rated from 35 to 150 W and carries 5, 12, 15, 24, 36, and 48 Vdc. The VGS-D and VGS-W have a wide input range of 305 Vac and models across all three series are output adjustable.

While most models in the three series are convection cooled, the higher power VGS-350C and VGS-320D both use forced air cooling with a built-in temperature-controlled fan. All models further feature a screw terminal interface, along with short circuit, over current, and over voltage protections. Terminal cover and conformal coating options are also available.

The VGS-C, VGS-D, and VGS-W series are designed to meet IEC/EN 61558, IEC/EN 60335, and GB 4943 system requirements. The units also comply with 55032 Class B radiated/conducted emissions and meet 61000-3-2 harmonics and 61000-4-3 immunity.

For more information visit http://www.cui.com

ON Semiconductor Announces New 650V Silicon Carbide MOSFETs
Posted: 2021-2-24
Superior switching and improved reliability deliver power density improvements in a variety of challenging applications
ON Semiconductor, driving energy efficient innovations, has announced a new range of silicon carbide (SiC) MOSFET devices for demanding applications where power density, efficiency and reliability are key considerations. By replacing existing silicon switching technologies with the new SiC devices, designers will achieve significantly better performance in applications such as electric vehicles (EV) on-board chargers (OBC), solar inverters, server power supply units (PSU), telecoms and uninterruptible power supplies (UPS).
 
ON Semiconductor’s new automotive AECQ101 and industrial grade qualified 650 volt (V) SiC MOSFETs are based upon a new wide bandgap material that provides superior switching performance and improved thermals when compared to silicon. This results in improved efficiency at the system level, enhanced power density, reduced electromagnetic interference (EMI) and reduced system size and weight.
 
The new generation of SiC MOSFETs employ a novel active cell design combined with advanced thin wafer technology enabling best in class figure of merit Rsp (Rdson*area) for 650 V breakdown voltage. The NVBG015N065SC1, NTBG015N065SC1, NVH4L015N065SC1 and NTH4L015N065SC1 have the lowest Rdson (12 mOhm) in the market in D2PAK7L and To247 packages. This technology is also optimized around energy loss figure of merits, optimizing performance in automotive and industrial applications. An internal gate resistor (Rg) allows more flexibility to designers eliminating the need to slow down devices artificially with external gate resistors. Higher surge, avalanche capability and short circuit robustness all contribute to enhanced ruggedness that delivers higher reliability and longer device lifetimes.
 
Commenting on the new releases, Asif Jakwani, senior vice president of the Advanced Power Division at ON Semiconductor, said: “In modern power applications such as on-board chargers (OBC) for EV and other applications including renewable energy, enterprise computing and telecom, efficiency, reliability and power density are constant challenges for designers. These new SiC MOSFETs significantly improve performance over the equivalent silicon switching technologies, allowing engineers to meet these challenging design goals. The enhanced performance delivers lower losses that enhance efficiency and reduce thermal management needs as well as reducing EMI. The end result of using these new SiC MOSFETs is a smaller, lighter, more efficient and more reliable power solution.”
 
For more information, visit http://www.onsemi.com.
RSL10 Smart Shot Camera from ON Semiconductor Enables Event Triggered Imaging with AI
Posted: 2021-2-11
Ultra-low-power platform based on RSL10 SIP and ARX3A0 brings automatic image recognition to the IoT

ON Semiconductor, driving energy efficient innovations, is pleased to introduce the RSL10 Smart Shot Camera, combining cloud-based AI with ultra-low-power image capture and recognition, to enable a new generation of IoT endpoints.

The RSL10 Smart Shot Camera adds the power of AI-based image recognition to ultra-low-power IoT endpoints, such as surveillance cameras, restricted areas, factory automation, smart agriculture and smart homes. A companion smartphone application provides a user interface for the platform and acts as the gateway to cloud-based, AI-enabled object recognition services.

The platform brings together a number of ON Semiconductor innovations, including the RSL10 SIP, which provides ultra-low-power Bluetooth® Low Energy technology, and the ARX3A0 Mono 65° DFOV IAS Module. The module is a compact prototype used for developing compact cameras with 360 fps mono imaging based on the ARX3A0 CMOS image sensor. Complemented by advanced motion and environment sensors and power and battery management, these technologies provide a complete solution that can be used to autonomously capture images and identify objects within them.

Using the RSL10 Smart Shot Camera, developers can create an endpoint that automatically sends an image to the cloud for analysis when triggered by various elements including time or an environmental change, such as light or temperature. Equally, the camera platform can operate in low power mode while monitoring a specific part of its field of view, automatically taking an image when the scene's contents change. The image is then sent to the cloud for processing, using AI to determine the contents of the image and then taking the appropriate action.

The image data is transferred to the cloud through a gateway, connected over Bluetooth Low Energy, using the RSL10 SIP. The low power credentials of the components used in the platform mean it can operate for extended periods of time from a single primary or secondary cell. The triggers are configured using the companion app, also over Bluetooth Low Energy.

“Hyper automation is the next evolutionary step in the IoT,” said Wiren Perera, who heads IoT at ON Semiconductor. “The RSL10 Smart Shot Camera embraces that concept, by bringing the power of vision based AI closer to the edge to enable capabilities such as automatic object recognition and scene changes. We have been consistently delivering on a variety of device-to-cloud wireless sensor solutions. Enabling the seamless addition of vision takes this to another tier.”

Typical applications may include adding smart cameras to wearable safety equipment, such as hard hats. In a commercial environment, a smart camera could be used to monitor the contents of a shopping cart, to support automated checkout. In vehicles, smart cameras will be used to monitor the occupants, such as small children in rear seats, to provide early warning of any safety issues. Around the home, smart cameras can scan the contents of cupboards to build shopping lists.

For more information, visit http://www.onsemi.com.

 

RECOM Launches Cost Effective, High Specification Board-Mount AC/DCs
Posted: 2021-2-2
2W and 3W AC/DCs are low cost

RECOM is announcing the launch of two ranges of board-mount AC/DC converters, the RAC02E-K/277 and RAC03E-K/277, rated at 2W and 3W respectively. Inputs include nominals of 100VAC up to 277VAC for use in a wide variety of applications worldwide. Regulated outputs available include 3.3V, 5V, 12V, 15V and 24V with operation without derating up to 80°C (RAC02E-K/277) or 75°C (RAC03E-K/277). Isolation is 4kVAC with safety certification to industrial, domestic, household (RAC03E-K/277) and ITE standards while EMC compliance for both ranges is to EN55032 Class B with a wide margin. The parts meet ErP requirements with maximum 75mW no-load power consumption and because of their excellent light load efficiency, significant standby mode power can be delivered without exceeding 0.5W input.

The RAC02E-K/277 has a footprint of 33.7mm x 22.2mm and the RAC03E-K/277 is 37mm x 24mm, while both ranges have a low profile of just 15.4mm. Terminations are through-hole and pinout is industry-standard.

“These compact AC/DCs are very versatile with their wide AC input and temperature ranges” comments Michael Schrutka, AC/DC Product manager of RECOM. “Their comprehensive safety certifications and low cost also make them ideal for applications ranging from automation control, industry 4.0 and IoT, to home automation”.

For more information, visit www.recom-power.com

EPC's New 40 eGaN® FET Ideal for High Power Density Solutions for USB-C Battery Chargers and Ultra-thin Point-of-Load Converters
Posted: 2021-1-10
The EPC2055, a 40 V, 3 milliohm eGaN FET, offers designers a device that is smaller, more efficient, and more reliable than currently available devices for high performance, space-constrained applications.
 
This device is ideal for applications with demanding requirements for performance in space-constrained form factors including USB-C batter chargers and ultra-thin point-of-load (POL) converters. Other low-voltage applications benefiting from the fast-switching speeds and ultra-high efficiency of the EPC2055 include LED lighting, 12 V – 24 V input motor drivers, and lidar systems for robotics, drones, and autonomous cars.

BrightLoop Converters has greatly reduced the size, cost and improved reliability of its latest BB SP DC-DC buck converters thanks to the 80 V, EPC2029 eGaN FET. By switching from silicon transistors to GaN, BrightLoop was able to increase the switching frequency of their design from 200 kHz to 600 kHz, while keeping the same efficiency. This design change increased the power density of the solution by a factor of approximately two and this resulted in lower cost by enabling the implementation of a smaller enclosure.

EPC also recently announced the availability of the EPC9151, a 300 W bidirectional DC-DC voltage regulator in the in the very small 16th brick format which is just 33 mm x 22.9 mm (1.3 x 0.9 in). The EPC9151 power module features Microchip’s dsPIC33CK digital signal controller (DSC) with the EPC2152 ePower™ Stage integrated circuit from EPC to achieve greater than 95% efficiency in a 300 W 48 V to/from 12 V converter design. Additional phases can be added to this scalable 2-phase design to further increase power..

For more information, visit www.epc-co.com.

 

Power Control Reference Design Enables a Secondary Side Microcontroller to Control Primary Power
Posted: 2021-1-10
New AC-DC controller plus Inde-Flux™ transformer technology licensed to Würth Elektronik eiSos simplifies design, reducing size and cost

In modern offline AC-DC power solutions, programmability and adaptive control offer the flexibility and intelligence needed by smart home devices to better interface with their power systems. In these systems, a secondary side microcontroller (MCU) is typically not capable of starting a system without the use of a separate bias power supply. A new reference design from Microchip Technology Inc. solves this problem using the MCP1012 high voltage auxiliary AC-DC controller, demonstrating the ability to remove the independent bias power supply in many applications. The MCP1012 offline auxiliary device enables the system to transfer control of the power and duty cycle to a secondary MCU. The control between the system and the load can be more precise and purposefully coupled, through a design that can be simplified, reducing size and cost.

The reference design uses a patented isolation technique for isolated feedback. This patented isolation technique called Inde-Flux transformer technology is being licensed to Würth Elektronik eiSos. Inde-Flux technology is used in the Inde-Flux Transformer (Part Number 750318659), the first transformer made by Würth Elektronik eiSos using this IP and sold as part of Microchip’s 15W MCP1012 offline reference design. This transformer combines the signal power and signal communication into one device, eliminating the need for optical feedback or an independent signal transformer. The option is also available to use more traditional approaches with a planar pulse transformer on the reference design, as well as the ability of the design to work with more traditional optocouplers and signal transformers. The secondary-side control is then enabled through a combination of the transformer and Microchip’s newly released MCP1012 AC-DC controller along with the SAM D20 series 32-bit MCU.

The MPC1012 primary-side auxiliary controller provides for system start up, gating and protecting an offline flyback converter for the secondary MCU. The device enables a range of benefits such as direct measurement and active regulation of voltage and/or current, high loop bandwidth by direct loop closure and simplified communication for load-referenced systems.

The 15W MCP1012 offline reference design provides the principal working elements for a 15W offline power design with the necessary firmware to enable the elimination of the auxiliary power supply on the primary side. This can reduce the complexity of the system including eliminating the need for optocouplers in many applications such as appliances and smart speakers. This Inde-Flux transformer technology, in cooperation with Würth Elektronik eiSos, can be scaled to standard and custom transformer designs for different voltages and power levels as needed.

“The combination of our Inde-Flux technology in a Würth Elektronik eiSos transformer, our MCP1012 AC-DC controller and our SAM D20 series 32-bit MCU creates a unique solution to offline power management,” said Rich Simoncic, senior vice president of Microchip’s analog, power and interface business unit. “These devices enable a simpler, more reliable implementation of complex bi-directional communication between the primary and secondary elements used in many isolated applications utilizing offline power. Where this solution is used in systems with a secondary MCU, customers can realize up to 60% savings of the bias supply area and reduce the bias supply bill of materials costs by $3 or more.”

CUI Introduces Compact 120 W Power Adapters for Medical and Dental Applications
Posted: 2020-12-16

CUI Inc today announced the addition of two 120 watt ac-dc external power supply series, expanding its existing 60601 certified medical power supply family. The new series footprint is 35% smaller than its non-medical counterpart, providing a lighter and less cumbersome adapter that can power a wide range of medical and dental devices.

The SDM120-U is available with a C14 inlet and the SDM120-UD comes with a C8 inlet. Both series meet the current average efficiency and no-load power specifications mandated by the US Department of Energy (DoE) under the Level VI standard, as well as the European Union’s (EU) Ecodesign 2019/1782 and CoC Tier 2 directives for external power supplies.

These compact adapters are certified to the medical 60601-1 edition 3.1 safety standards for MOPP applications and 4th edition EMC requirements, making them suitable for medical, dental, and home healthcare applications.

Features and Benefits

  • Up to 130 W of continuous power
  • No-load power consumption less than 0.21 watts
  • Universal input voltage range
  • Level VI, EU 2019/1782, and CoC Tier 2 compliant
  • Medical 60601-1 edition 3.1 certified
  • UL/cUL, TUV, CE, and FCC safety approvals
  • Compact footprint
  • Customizable

For more information, visit www.cui.com.

Flex Power Modules Quarter Brick Isolated DC/DC Converter Delivers up to 2450 W for Datacom Applications
Posted: 2020-12-16

Flex Power Modules has introduced a new device in its BMR491 series of high-density DC/DC converters with built-in digital interfaces. The new BMR491 converter can deliver 2450 W peak power for periods of up to one second, with a continuous output power rating of up to 1540 W, thus making it the highest power density digital DC/DC isolated converter available today.

It operates over an input voltage range of 48 V to 60 V and delivers a nominal 12 V output, making it suitable for data center applications. Efficiency is 97.5% at 48 Vin at half load, and the BMR491 can provide output current of up to 205 A.

The converter is supplied in an industry standard low-profile quarter-brick format, measuring 58.4 x 36.8 x 14 mm (2.30 x 1.45 x 0.55 in) with baseplate, and is also available with an integrated heatsink with a height profile of 19 mm. The converter has an operational temperature range of -40°C to +125°C.

The BMR491 uses Flex Power Modules’ proprietary hybrid regulated ratio (HRR) technology, which enables it to deliver extended power capabilities, as well as the efficiency and resilience to voltage transients that would more commonly be expected from a fixed-ratio converter.

Operating lifespan is increased through the inclusion of advanced over-voltage, over-temperature and short-circuit protection mechanisms, and mean time between failures (MTBF) is over 7 million hours. Heat dissipation is helped by the inclusion of a baseplate and the use of enhanced thermal conduction techniques, with an integrated heatsink option also being available.

As with all Flex Power Modules’ DC/DC converters, the new device complies with IEC/EN/UL 62368-1 safety standards. Input to output isolation is 1500 V.

A digital interface is available in either 4 or 7-pin DOSA standard and the BMR491 is supported by the Flex Power Designer software tool.

For more information, visit flexpowermodules.com

KEMET Introduces Nanocrystalline Single-Phase Filters for Industrial, Commercial, and Medical Applications
Posted: 2020-12-15
GTX series offers superior attenuation performance with a compact, lightweight, and high-density design

KEMET, part of the Yageo Group and leading global supplier of electronic components, today announces the launch of the GTX series plastic box single-phase filters. These filters suppress excess electromagnetic interference (EMI) generated from power lines within 250VAC single-phase electrical systems. Conducted electromagnetic noise is a common occurrence, but if left unchecked it may cause disruptions in the operation of a circuit or other electronic components used in power supply systems. According to a February 2020 report by Stratistics Market Research Consulting, the global industrial power supply market is expected to grow at a CAGR of 6.4% to reach USD 15 billion by 2027 from USD 8 billion in 2018.*

The GTX series filter uses a unique material and design which provides superior EMI attenuation performance. The filter contains a nanocrystalline core, which offers higher permeability and lower losses than ferrite material cores found in other EMI filters. This nanocrystalline core allows for a compact, lightweight, and high-density design resulting in the highest attenuation capability and smallest volumetric package compared to other EMI filters now available in the market. As a result, GTX’s design not only uses less circuit board space but also improves performance in single-phase power supply systems for commercial, industrial, and medical applications. Additionally, the GTX series offers five rated current ranges (6 - 30 A) which can be paired with six Class-Y capacitors, resulting in 30 different component combinations supporting general-purpose inverters in machine tools, welders, 3D printers, and other industrial applications.

The GTX plastic box single-phase filters are available immediately via KEMET distributors. To learn more about their capabilities and applications, visit https://ec.kemet.com/emc/.

RECOM ‘3D Power Packaging®’ Enables Increased Current From RPMH High Input Voltage Switching Regulator Range
Posted: 2020-12-9
Switching regulators have 3 x output current

RECOM, industry leader in power conversion, has extended the current rating of its RPMH range of non-isolated switching regulators from 0.5A to 1.5A, with no increase in size, leveraging the company’s expertise in 3D Power Packaging®. In a tiny 12.19 x 12.19 x 3.75mm package, the high-efficiency parts are available with trimmable outputs at nominal 3.3V, 5V, 12V, 15V, and 24V. Inputs for each type can range up to 60VDC, and operating temperature is as high as 100°C with no derating, or higher still at reduced power.

Features include on/off control, remote sensing, a power good signal, and comprehensive protection against output short-circuits, over-current, and over-voltage. The products meet EN55032 class B EMI limits with a simple external filter.

The advance in power handling of the RPMH-1.5 is enabled by RECOM’s 3D Power Packaging® techniques resulting in a 25-pad LGA package with six-sided shielding for optimal EMC and thermal performance. Evaluation boards are available which allow performance and all features to be tested.

“We have increased the current rating of our RPMH series by a factor of three”, commented Matthew Dauterive, DC/DC Productmanager of RECOM. “This improvement opens up a much wider range of applications for the product. The wide input range, up to 60V, will be particularly attractive for 48V systems or applications such as automotive where high voltage surges can occur”.

For more information, visit www.recom-power.com

1/16th brick footprint, 500W step-down DC-DC buck converter has an output range of 3.3 to 24V
Posted: 2020-11-27

TDK Corporation (TSE 6762) announces the introduction of the 500W rated i7A non-isolated DC-DC converters. Capable of operating from an input voltage of 18V to 60V, the step-down converters deliver an output voltage that can be adjusted from 3.3 to 24V with an output current of up to 33A.  The series is designed to be used in a wide range of applications including medical, communications, industrial, test, measurement and battery powered equipment.

The i7A series utilizes the industry standard 1/16th “brick” pinout, potentially offering cost reduction and efficiency improvements over isolated converters. They can be used in conjunction with a single output 24V, 36V or 48V AC-DC power supply to generate multiple additional regulated outputs, with or without battery back-up.

Operating efficiencies are up to 98%, minimizing power losses and allowing operation in harsh ambient temperatures of -40oC to +125oC even under low airflow conditions.  With low output ripple and an excellent dynamic response, the i7A’s design reduces the number of required external components, saving both cost and board space.

The converters measure 34mm x 36.8mm and follow the industry standard 1/16th brick pin-out.  Three mechanical configurations are available - a low 11.5mm high open frame model, a baseplate construction for conduction cooling or with an integral heat sink for convection or forced air cooled environments. The i7A has an output voltage adjustment pin, positive or negative logic remote on-off, positive remote sense, plus input under-voltage, over-current and thermal protection. 

All models are certified to IEC/UL/CSA/EN 62368-1 and carry the CE mark for the Low Voltage and RoHS Directives.

More information on the i7A 33A series, including distributor inventory and evaluation boards, can be obtained from the TDK-Lambda Americas website at https://www.us.lambda.tdk.com.

Main applications

  • Medical, communications, industrial, test, measurement and battery powered equipment

Main features and benefits

  • Up to 500W in a 1/16th brick pin-out
  • Up to 98% efficient.
  • Wide 3.3 to 24V output adjustment
  • Wide 18 to 60Vdc input range
  • Low component count with minimal external components
  • Low airflow with minimal derating requirements
EPC New 170 eGaN® FET Offers Best-in-Class Synchronous Rectification Performance and Cost to Seize High End Server and Consumer Power Supply Applications
Posted: 2020-11-10

The EPC2059 is a 170 V, 6.8 milliohm eGaN FET, offering designers a device that is smaller, more efficient, more reliable, and lower cost than currently available devices for high performance 48 V synchronous rectification.

This device is the latest in a family of 100 V - 200 V solutions suitable for a wide-range of power levels and price points. They are designed to meet the increasing demands of 48 V – 56 V server and data center products as well as an array of consumer power supply applications for high end computing, including gaming PCs, LCD/LED TVs, and LED lighting.

The EPC2059 is ideal for DC-DC secondary-side synchronous rectification in AC/DC adapters, fast chargers, and power supplies with power ranges between 100 W and 6 kW. The performance advantage of gallium nitride devices helps designers achieve the demanding efficiency requirements for 80 Plus Titanium power supplies, while providing smaller, faster, cooler, and lighter systems with lower system costs then currently available solutions.

For more information, visit https://epc-co.com/epc

Harness the Power of Renewable Energy with TI's Reference Design and C2000™ Real-Time Microcontrollers
Posted: 2020-11-10

Real-time control meets system cost optimization and performance scalability with the C2000 F28002x series of of real-time MCU's. Built for server power, single-axis servo, variable frequency AC drives, appliances, smart sensing, solar inverters and automotive on-board charging and DC/DC applications.

Harness the power of renewable energy

  • 10kW 3-phase 3-level bidirectional SiC AC/DC converter
  • Increased efficiency and power density
  • Higher voltage input for reduced loss

Technical Article
Stay ahead of the energy storage and solar game with bidirectional PFC and hybrid inverter solutions.

Reference Design
This reference design provides an overview on how to implement a three-level, three-phase, SiC-based AC/DC converter with bi-directional functionality.

F28002x controlCARD EVM
This controlCARD is a robust, modular plug-in card with a standardized pin-out designed for prototyping and system evaluation.

F28002x devices
Check out device features, compare products and access the data sheet, user’s guide, and The Essential Guide to C2000™ real-time microcontrollers to learn more.

Motor Development Kit from ON Semiconductor Prioritizes Energy Efficiency
Posted: 2020-11-9
New ecosystem for developing motor control solutions combines hardware, software and power modules for rapid development

ON Semiconductor, driving energy efficient innovations, has introduced its advanced and flexible Motor Development Kit to accelerate the development of more efficient motor control solutions for applications ranging from less than 1 kW to over 10 kW.

Electric motors account for over half of all the power generated and consumed by industrialized countries. The majority of those motors are AC induction motors, which have an average efficiency of just 44%. In order to improve efficiency, motor drive designers must understand how these and other types of motors operate under all load conditions, and intelligently compensating for variable conditions. The Motor Development Kit addresses the urgent need for improved energy usage.

The Motor Development Kit (MDK) comprises one of a growing number of Power Boards, connected to a Universal Controller Board (UCB). The Power Boards feature various incarnations of ON Semiconductor inverter solutions for motor drive, from high voltage integrated modules to low voltage, discrete MOSFETs. The UCB is a common control platform that interfaces with any Power Board to enable engineers to evaluate alternative motor control techniques for various types of motors and at a wide variety of power levels.

Intelligent motor control requires a flexible and programmable approach. The UCB is based on the Zynq®-7000 SoC family from Xilinx, Inc. This powerful device integrates two ARM® Cortex™-A9 processor cores alongside an FPGA fabric, providing the optimum combination of software and hardware configuration. The board also features a 10-channel differential ADC, 12 PWM channels and a number of configurable digital peripherals. Communication ports include USB, JTAG and UART, as well as a Gigabit Ethernet PHY.

Efficient motor control represents a major focus of ON Semiconductor. The company is applying its extensive experience and large portfolio of discrete devices, Intelligent Power Modules (IPMs) and Transfer Molded Power Integrated Modules (TM PIMs) to increase efficiency. The MDK brings together its expertise and technologies to help engineers quickly develop solutions that deliver greater energy efficiency, in any application that uses electric motors.

ON Semiconductor's MDK provides an 'out of the box' experience for evaluating variable speed motor inverter solutions. To enable this, the modular ecosystem includes the UCB and a number of power evaluation boards, developed using ON Semiconductor's best in class power components. Support for software development comes from Xilinx in the form of the Vivado® Design Suite for High-Level Synthesis. The UCB can also be programmed using Python, through Xilinx's open source project, PYNQ.

“ON Semiconductor already offers a broad portfolio of power solutions optimized for variable motor control,” said Ali Husain, Sr. Manager, Corporate Strategy & Marketing at ON Semiconductor. “The Motor Development Kit brings these technologies together into a single ecosystem that can really help design teams accelerate the process of developing more efficient motor control solutions.”

“Optimizing energy efficiency in motors has an enormous impact on the carbon footprint of factories and industrial equipment across the planet,” said Chetan Khona, director, Industrial, Vision, Healthcare & Sciences at Xilinx. “Technology from ON Semiconductor together with high-performance motor control in Xilinx Zynq SoCs reduces operational cost drastically, offers the most adaptability for user customization, and makes a positive contribution to the environment. The new Motor Development Kit from ON Semiconductor makes this accessible and facilitates migration from prototype to production.”

The MDK currently supports two motor power boards; the SECO-1KW-MCTRL-GEVB, which is suitable for driving motors up to 1 kW, and the SECO-MDK-4KW-65SMP31-GEVB, for driving motors up to 4 kW. Both of these power boards use ON Semiconductor's IPM technology and will be available in Q4, 2020. An additional motor power board will be released in Q1, 2021 based on ON Semiconductor's TMPIM technology, designed to drive motors up to 10 kW. Expect further power boards and expanded design support to be added to the MDK ecosystem.

 For more information, visit www.onsemi.com.

SiPM dToF LiDAR Platform from ON Semiconductor Provides Ready-to-Use Design for Industrial Range Finding Applications
Posted: 2020-11-9

ON Semiconductor, driving energy efficient innovations, has introduced a single point direct Time-of-Flight (dToF) LiDAR solution enabled by the company's Silicon Photomultiplier (SiPM) technology.

The application of light detection and ranging, or LiDAR, is growing across all sectors, including robotics and industrial proximity sensing where millimetre range accuracy is mandatory. It is typically based upon the dToF method, which measures the time it takes for a pulse of light, normally in the Near Infrared (NIR) wavelength range, to travel to and from an object.

While the principle is simple, its application can pose challenges, for example, environmental factors such as high levels of ambient solar light. To determine range accurately, the receiver needs to capture as much of the signal as possible. Traditional photodiodes suffer here, in terms of response time and sensitivity. The Silicon Photomultiplier (SiPM) sensor, developed by ON Semiconductor, overcomes these shortfalls by providing faster response times and high detection efficiency. The reference platform uses the RB-Series, ON Semiconductor's second generation of SiPM sensors, which deliver improved performance in red and the NIR range.

The SiPM dToF LiDAR Platform developed by ON Semiconductor provides a complete solution for low cost, single point LiDAR that OEMs can adapt and take into production to create industrial range finding applications. It includes the NIR laser diode, SiPM sensor and optics, as well as the digital processing necessary to convert the detected signals into elapsed time, and elapsed time into distance.

To accelerate customers' time to market, ON Semiconductor has made all of the design data for the reference platform available, covering the schematics, BoM, gerber files, and PCB design files. A PC-based GUI is also accessible, which provides a graphical representation of the measurements over time. The histograms generated provide further evidence of the system's capabilities in applications such as range finding, collision detection and 3D mapping.

“Range finding using dToF LiDAR delivers on a critical need for many applications, extending from autonomous navigation through mapping to monitoring. However, developing such a system based on dToF LiDAR can be challenging,” said Wiren Perera, who heads IoT at ON Semiconductor. “This platform clearly demonstrates the effectiveness of this leadership technology. The availability of a proven design enables our customers to get to a proof of concept much faster, and rapidly deliver their product to market.”

The SiPM dToF LiDAR Platform can detect objects at distances between 10 cm and 23 m. It offers an out-of-the-box experience using the provided GUI, which allows engineers to start evaluating the technology immediately. The design is FDA Class 1 certified and compliant with IEC / EN 60825-1:2014 and 21 CFR 1040.10/ 1040.11 laser safety standards.

For more information, visit www.onsemi.com.

TDK-Lambda 48V Output 4080W 3-Phase Industrial Power Supply Operates From 400/440/480Vac Delta and Wye Inputs
Posted: 2020-11-5

TDK Corporation announces the addition of the TDK-Lambda brand TPS4000-48 power supply, further extending the existing 3kW to 4kW rated TPS series.  Delivering up to 4080W output power (48V at 83.3A) in a 2U high package, the TPS4000 series operates from a wide range Delta or Wye 350 - 528Vac three phase input.  This industrial power supply is ideal for use in many applications including test and measurement equipment, semiconductor fabrication, additive manufacturing, printers, lasers and RF power amplifiers.  The high voltage, three-phase input avoids the requirement for costly step down transformers and assists phase load current balancing.

The TPS4000 series is fully featured with isolated AC Fail, DC Good and dropped phase signals, remote on/off, remote sense and a 12V 0.3A standby supply.  A PMBus™ communications interface allows remote monitoring of the output voltage, output current, internal temperature, status signals and fan speed.  In addition, the output voltage, over current limit and the remote on/off can be programmed by the PMBus™.  The output voltage can also be adjusted from 38.4 to 58V and the current limit point by 70-105% using front panel potentiometers or an analog 0-5Vdc voltage.  Up to eight units can be connected in parallel for higher power and internal ORing FETs allow redundant operation. 

The 92% efficient unit can operate at full load in ambient temperatures of up to 50oC, and deliver up to 55% load at 70oC.  Cooling is provided by an internal temperature controlled fan to reduce acoustical noise. The case measures 107 x 84.4 x 335mm, making it suitable for 2U high racking systems. The weight of the product is just 4kg.

The power supply has 3kVac input to output, 2kVac input to ground and 500Vdc output to ground isolation.  All TPS models are certified to IEC/EN/UL/CSA 62368-1and carry the CE mark for the Low Voltage, EMC and RoHS Directives.  The TPS4000 also complies with EN55032-A (conducted and radiated emissions), SEMI F47-0706 (line dips), IEC 61000-3-2 (harmonics), IEC 61000-4 (immunity), and is designed to meet the MIL-STD-461F/G CS101, CS114 (Army Ground), CS115, CS116 immunity standard.

More information can be obtained at the following TDK-Lambda Americas website, https://product.tdk.com/en/power/tps

TDK Releases ModCapTM
Posted: 2020-11-4
a modular capacitor concept for DC link applications

TDK Corporation presents ModCap™ − a modular capacitor concept for DC link applications. The newly developed power capacitors are available for rated voltages of 1100 V to 2300 V and cover a 365 µF to 2525 µF capacitance range. The rated currents between 105 A and 180 A are type-conditioned with all types designed for 5 kA recurrent pulse currents. The maximum permitted hot spot temperature is 90 °C.

In contrast to conventional cylindrical designs, the B25645A* capacitor series are cubic in design and available in two versions of either 243 x 169.5 x 90 mm or 258 x 215 x 115 mm. Due to this design, the capacitors can be fitted very close to IGBT modules, thus producing very short lead lengths. This, combined with a very low 14 nH self-inductance of the capacitors, stops any substantial voltage overshooting at the IGBT modules when the current is shut off. As a result, generally no snubber capacitors are needed. This design also makes parallel connections of capacitors easy. Typical applications are compact converters for traction, renewable energies and industrial applications.

The artificial resin-filled plastic housings comply with UL94 V-0. In addition, the fire and smoke formation requirements, in line with IEC 61071, IEC 61881-1, EN 45545-2 HL3 R23, are met. This makes these capacitors well suited for use in trains.

Main fields of application

  • Compact converters for traction
  • Renewable energies
  • Industrial applications

Main features and benefits

  • Modular concept
  • Wide voltage range from 1100 V to 2300 V
  • Wide capacitance range from 365 µF to 2525 µF
  • A maximum 90 °C hot spot temperature
  • Qualified according to IEC 61071, IEC 61881-1, EN 45545-2 HL3 R23 regarding fire and smoke formation
  • Plastic housing corresponding to UL94 V-0

For more information about the products, please visit www.tdk-electronics.tdk.com/pec

RECOM Announces the Launch of its RACM40-K Series of Versatile 40W AC/DC Power Supplies
Posted: 2020-11-4
Tiny AC/DCs boast medical certification

RECOM has extended its range of industrial and medically-approved AC/DC power supplies rated at 40W in a tiny 1.6” x 3” footprint for open frame versions and 1.8” x 3.2” for potted versions. The RACM40-K series typically achieves 90% efficiency across a wide line and load range and despite the ultra-compact size, operates up to 60°C at full load and to 85°C with airflow or derating. Full load is also available across the line range, 90 – 264VAC.

Single outputs available are 5V, 12V, 15V, 18V, 24V, 36V and 48V, with full protection against short circuit, overload and over-voltage. No-load consumption is below 0.1W at 240VAC.

The RACM40-K series holds 2MOPP medical certification up to 4000m altitude and is suitable for B and BF applications. Additional certifications are IEC/EN 62368-1 for audio-visual/IT, IEC 61558-1 for industrial, IEC/EN 61010 for test and measurement and IEC/EN 60335 for household appliances. In-built EMC filtering achieves ‘Class B’ compliance with a good margin and meets the requirements of medical EMC standard IEC/EN 60601-1-2 4th edition.

Various mounting options are available: the open frame part can be mounted on stand-offs with Molex connectors for input and output or the /PCB option incorporates pins for direct PCB mounting. For backwards-compatibility, a 2” x 3” footprint version is available on request. The potted version with additional mechanical fixings for stability. Has inverted pinning compared with the /OF/PCB version.

According to Michael Schrutka, AD/DC Product manager at RECOM: “These tiny power supplies are ideal for cost- and space-sensitive applications from industrial, consumer, IT and all the way to patient-connect medical. The high efficiency and standby losses also make them ideal for IoT applications.”

For more information, visit www.recom-power.com.

Powerbox Announces High Efficiency 750V DC/DC Converter for Light-Rail and Industrial Applications
Posted: 2020-10-28

Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, has announced the release of its new high efficiency 750VDC input DC/DC converter for light-rail and industrial applications. The switching stage of the new PRBX ENR500D is based on an enhanced resonant topology providing a high efficiency of 95% typical across the low to high load range. Designed for railway applications, the ENR500D fulfills the stringent standard EN 50124-1 and delivers full performance across the temperature range of -40 to +70 degrees C. The ENR500D shortens time-to-market when a custom solution is required.

Dependent upon their location and the technology available at the time of installation, a wide variety of electrically powered traction systems are used in rapid transit systems around the world. Most metros operate from dc power either at 750VDC with a third rail, or 1.5kV with a third rail or from an overhead catenary. 750VDC is very common in light rail, powering both the rolling-stock equipment as well trackside signaling systems. The same voltage is also used in industrial equipment and in applications such as mining.

Taking into account the large range of applications and environmental conditions, PRBX designers have to consider where a power converter will be installed and as such, the environmental conditions it has to withstand. As specified in the European Standard EN 50124-1, Macro-environmental conditions (PD1 to PD4B), power converters can be part of a hermetically sealed equipment varying from no ventilation up to forced ventilation using clean filtered air from outdoors, and requiring a flexible, robust design able to meet such a large range of environmental conditions.

With more than 40 years of experience in designing power solutions for demanding applications in railway and industrial applications, PRBX designers have developed the 500W ENR500D platform that is built on a resonant topology combined with the latest MOSFET technology and the use of high performance magnetics. The ENR500D is designed to comply with the EN 50124-1 standard and for the so-called Pollution Degree 2 (PD2) such as control cabinets in the driver’s cabin or passenger compartments. The ENR500D has ingress protection to IP20, and input to output double reinforced isolation. The unit complies with EMC emissions and immunity as specified in both EN 50124-1 and EN 50124-5.

The ENR500D has a nominal input voltage of 750VDC and operates within a range of 500 to 900VDC. The nominal output voltage is set to 48VDC, though it can be adjusted up to 60VDC. Nominal output power is 500W constant across the temperature range of -40 to +70 degrees C in natural cooling conditions. The enhanced topology confers to the ENR500D a high efficiency of up to 95% from 20% to 100% load conditions. Designed to reduce systems energy consumption, at no load the ENR500D input power is less than 5W.

In accordance with EN50124-1, rated impulse voltage of 4.4kV, the input to output has a double reinforced insulation of 1000V, with a clearance 8.0mm, creepage ISO Class I and 10.0mm, ISO Class II 14.2mm.

In railway applications robustness is a must and the ENR500D is enclosed in an aluminum chassis with integral heatsink. It measures 163 x 230 x 80mm and has an ingress protection level of IP20. For reliability and availability all printed circuit boards have a protective coating.

As designed for a large range of light-rail and industrial applications, the ENR500D can be modified to offer other output voltages such as 12V, 24V or any other required by the system designer. Different output powers can also be provided in optimized mechanical formats.

The ENR500D platform’s emission and immunity EMC figures are in accordance with EN50124-1 and EN50124-5.

For more information, visit www.prbx.com.

Power Integrations’ New MinE-CAP IC Reduces Volume of AC-DC Converters by Up to 40%
Posted: 2020-10-28
Novel MinE-CAP device dramatically reduces the input bulk capacitor size, reduces in-rush current by up to 95%, eliminates NTC thermistors and associated losses

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the MinE-CAP™ IC for high power density, universal input AC-DC converters. By halving the size of the high-voltage bulk electrolytic capacitors required in offline power supplies, this new type of IC enables a reduction in adapter size of up to 40%. The MinE-CAP device also dramatically reduces in-rush current making NTC thermistors unnecessary, increasing system efficiency and reducing heat dissipation.

Comments Power Integrations’ product marketing director, Chris Lee: “The MinE-CAP will be a game-changer for compact chargers and adapters. Electrolytic capacitors are physically large, occupy a significant fraction of the internal volume and often constrain form factor options – particularly minimum thickness – of adapter designs. The MinE-CAP IC allows the designer to use predominantly low voltage rateding capacitors for a large portion of the energy storage, which shrinks the volume of those components linearly with voltage. USB PD has driven a major market push towards small 65 W chargers and many companies have concentrated on increasing switching frequency to reduce the size of the flyback transformer. MinE-CAP provides more volume saving than doubling the switching frequency, while actually increasing system efficiency.”

The MinE-CAP leverages the small size and low RDSon of PowiGaN™ gallium nitride transistors to actively and automatically connect and disconnect segments of the bulk capacitor network depending on AC line voltage conditions. Designers using MinE-CAP select the smallest high-line rated bulk capacitor required for high AC line voltages, and allocate most of the energy storage to lower voltage capacitors that are protected by the MinE-CAP until needed at low AC line. This approach dramatically shrinks the size of input bulk capacitors without compromising output ripple, operating efficiency, or requiring redesign of the transformer.

Conventional power conversion solutions reduce power supply size by increasing switching frequency to allow the use of a smaller transformer. The innovative MinE-CAP IC achieves just as significant overall power supply size reduction while using fewer components and avoiding the challenges of higher EMI and the increased transformer/clamp dissipation challenges associated with high-frequency designs. Applications include smart mobile chargers, appliances, power tools, lighting and automotive.

Said Bhaskar Thiagaragan, Director of Power Integrations India Ltd.: “MinE-CAP ICs are excellent for all locations with wide ranging input voltages. In India we often design for voltages from 90 VAC to 350 VAC, with a generous surge de-rating above that. Engineers here often complain about the forest of expensive high-voltage capacitors required. MinE-CAP dramatically reduces the number of high-voltage storage components, and shields lower voltage capacitors from the wild mains voltage swings, substantially enhancing robustness while reducing system maintenance and product returns.

Housed in the miniature MinSOP-16A package, the new devices work seamlessly with Power Integrations’ InnoSwitch™ family of power supply ICs with minimal external components. MinE-CAP MIN1072M ICs are available immediately from PI offices and franchised distributors and are priced at $1.75 for 10 Ku. Two initial design example reports (DERs) pair the MinE-CAP IC with Power Integrations’ InnoSwitch3-Pro PowiGaN IC, INN3370C-H302. A 65 W USB PD 3.0 power supply with 3.3 V – 21 V PPS output for mobile phone / laptop chargers is described in DER-626, and DER-822 describes a 60 W USB PD 3.0 power supply for USB PD/PPS power adapters using INN3379C-H302.

Learn more about the family and download the reference designs at the Power Integrations website: https://www.power.com/products/MinE-CAP.

Ground-breaking PSMA Report Addresses Reliability of Power Supply Digital Control Software/Firmware
Posted: 2019-9-19
Comprehensive study on digital implementations of power supplies addresses challenges and solutions to reliability of digital control of power supplies and recommends best practices

The Power Sources Manufacturers Association (PSMA) announces publication of its ground-breaking Power Supply Software/Firmware Reliability Improvement Report. This report, the result of a year-long project undertaken by PSMA’s  Reliability Technical Committee, addresses recommended reliability improvements for power supply digital control software and firmware. This new report attempts to present key findings related to the challenges of and solutions to reliability in the digital control of power electronics.

“This is the first report from the work of PSMA’s newest committee, which aims to spearhead industry initiatives that identify and attempt to address the pertinent industry challenges related to the reliability performance of power supplies and associated products,” noted Brian Zahnstecher, Co-Chair of the PSMA Reliability Committee. Tony O’Brien, Reliability Committee Co-Chair, added “Moving from power electronics with analog control to power electronics with digital control is a significant transition. Software engineering best practices are being adopted for digital power electronics control for power supplies to ensure that reliability does not suffer with the transition to digital control. Some of the best practices are relatively new, evolving and unfamiliar to the power electronics world”

This 166-page report, divided into nine chapters, examines a wide array of problems and challenges in the field of digitally controlled power supplies, then proceeds to present observed and proposed improvements and best practices. Brian Zahnstecher further noted, “The ongoing tasks of the PSMA Reliability Committee will include efforts to support adoption of the recommended best practices and to update and refine our findings. We welcome the involvement of knowledgeable industry experts in this important work.” 

A copy of the printed and USB memory drive versions of the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Report has been sent to PSMA Regular member companies as a benefit of their membership. Additional copies may be purchased at the member price of $US290. PSMA Affiliate members may also purchase the report for $US290. The report is available to non-members for purchase on the PSMA website (www.psma.com) for the price of $US2490.

A preview of the report is available here.

PSMA Power Technology Roadmap Provides Critical Insights into Technology and Research Advancing Power Conversion Developments
Posted: 2019-4-16
2019 edition of bi-annual publication provides multidimensional perspectives on power technology growth and trends; latest edition adds new section surveying global academic research activities

The Power Sources Manufacturers Association (PSMA) announces the 2019 edition of the Power Technology Roadmap. The report, which forecasts the power technology and power delivery trends through 2023, includes a printed report along with a feature-rich USB memory drive containing a record number of seventeen recorded webinars with up-to-date explanations of the information contained in the final report. The webinars add much to the presentation materials because the listener can hear and understand the context and the subtext of the original presentation in the speaker's voice. The recordings also capture the interesting and informative question and answer periods.

In this edition a new section on University Research in Power Electronics has been added. University research provides a window into what products and technologies are in store for Power Electronics. Leading power electronics research universities were asked about their research areas and priorities and their responses were analyzed to extract most common research areas, least common/missing research areas and unique research areas.

The overall structure of this year’s PTR largely follows the format of and keeps the improvements made in the 2017 report. It offers a consolidated view of the latest trends in the power management, power control, and power delivery technologies by integrating the most recent inputs from webinars, surveys, analyses and discussions. The report is divided into five sections:

  • Application Trends
  • Component Technologies
  • University Research
  • Webinar Presentations
  • Power Supply and Converter Trends

“As power technology continues to emerge from the shadows to play a more central role in the next phase of electronics industry revolution, the PTR report provides many relevant pointers to the current and future industry stakeholders,” said Conor Quinn, Co-Chair of the Power Technology Roadmap committee.

Dhaval Dalal, Co-Chair of the committee, said, “In many emerging fields, such as electric vehicles, alternative energy converters and energy harvesting devices, power technology assumes a more central and driving role and the PTR captures how the industry is shaping up to play this role.”

PSMA Regular Member companies have each been sent one copy of the printed report and USB memory drive versions of the 2019 edition as a benefit of their membership. Members can access the webinars on line at no cost and purchase additional copies of the full report for $290. The non-member price is $4,490. For information about purchasing the report, please to the PSMA website at: www.psma.com/publications.

PSMA Publishes Technology Report: 3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies
Posted: 2018-9-6
Comprehensive report is the first to address higher power embeddable passives that will accelerate the development of higher density power sources using new, 3D disruptive packaging technologies

The Power Sources Manufacturers Association (PSMA) Packaging Committee announces the publication of its latest report titled, “3D Power Packaging with Focus on Embedded Passive Component and Substrate Technologies.” This is the third in a series of reports focused on using embedded substrate technology for building power sources. It is the first extensive study of embeddable passive components both available and in development for use in the power path of power sources. The report contains extensive research and product illustrations geared to an audience of technology executives and design engineers.

Miniaturization of passive components without compromising their power handling and efficiency and their integration with actives has always been a key focus for power packaging. There is also an increasing trend to vertical or 3D package integration to address the performance issues by eliminating parasitics from interconnections. Embedding gives lowest package inductance and enables co-integration of power systems and drivers in a single package with direct interconnection between gate driver circuits and switches with shortest interconnection length. This has become even more important with the rapid emergence of wide bandgap power switching devices. This, however, leads to several process integration and reliability challenges that need to be systematically addressed.

Georgia Tech Packaging Research Center, under contract from PSMA systematically surveyed the recent advances in passives, active embedding and 3D passive-active integration to generate this report, with emphasis on 3D power packaging enabled by advances in passive components and embedding of actives in power packages. A detailed literature study was conducted on key advances in embedded passive technologies and related topics. Emerging nanomaterials, processes and technologies are described in detail for inductors, capacitors and resistors. Nanostructured materials provide additional degrees of freedoms in enhancing the properties to improve the performance metrics such as volumetric density and efficiency of the components. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted in advancing the components to improve performance. Industry leaders were surveyed to get the recent technology advances in each category. Roadmaps are projected for passive component advances and active embedding technologies.

The trends and roadmaps in 3D power packaging are also described in three categories: low power (1-100 W), medium power (100-1000 W) and high power (10-100 kW). Integration in each category is classified into lead-frame-based, substrate-embedding based and traditional ceramic substrates. Active embedding with panel-scale substrate manufacturing is also reviewed in detail. Recent innovations in substrate materials and associated reliability challenges such as via cracking, dielectric cracking or electric breakdown are highlighted. Advances in die-attach solutions with sintered nanocopper are reviewed, highlighting the evolution of low-stress sintered copper-based die-attach solutions.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded passives in 3D power packaging to create the significantly higher power densities.

The PSMA report on 3D packaging was provided free of charge to PSMA Regular and Associate Company members.  Additional copies may be purchased at the member price of $290. PSMA Affiliate members may also purchase the report for $290. The report is available to non-members for purchase on the PSMA website (www.psma.com/publications) for the price of $3,490.

Provided by the PSMA Packaging Committee.

Brian Narveson
Co-chairman
  Brian Narveson   Ernie Parker  
Ernie Parker 
Co-chairman

 

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