3D PEIM

3D-PEIM Discounted Advanced Registration Deadline April 30
Posted: 2021-4-19

3D Power Electronics Integration and Manufacturing Symposium

Hybrid (live/virtual) event

June 21-23, 2021, Osaka University, Japan

Photos | Osaka University | Japan      

The Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-21) will be held for the first time in Asia on June 21-23, 2021, at the Suita Campus of Osaka University Japan. Because Japan may not be open to foreign travelers, everyone can attend this live event virtuallyYou can switch between virtual and in-person attendance up to May 21st.

We are building on the continued 2016 and 2018 Symposia’s success with the 3D-PEIM-21, again assembling world-class experts representing far-reaching topics on additive, embedded, co-designed, and integrative packaging technologies. By creating the 3D-PEIM Symposium, the PSMA Packaging Committee offers power electronics researchers an excellent opportunity to learn about leading-edge R&D innovations in 3D power packaging. The focus of the Symposium will be on additive, embedded, co-designed, and integrative packaging technologies. Sessions will address mechanical, materials, reliability, and manufacturability issues in deploying smart power-dense components and modules, exploring the path to developing and manufacturing future 3D power electronics systems. Recognizing the importance of the Symposium, all previous speakers signed up for the postponed 2020 3D-PEIM event have committed to participating in our upcoming 2021 3D-PEIM.

Technical Program

The detailed program with time zone information for virtual attendees is available at www.3d-peim.org/program. The presentations will be live from both in-person and virtual presenters. Due to time zone challenges, all sessions will be recorded and available to paid attendees after the Symposium.

 

A brief program summary showing the session chairs, plenary speakers, and keynote speakers

 

 

The Symposium will feature table-top exhibits during the breaks, lunch periods, and evening networking sessions for in-person attendees. Virtual attendees will be able to interact with speakers and the audience during live question and answer sessions. On the last day of the Symposium, in-person attendees are invited on a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery. Additional information and registration details are available at www.3D-PEIM.org.

Opportunities Available for 3D-PEIM 2021 Exhibit Partnerships

Information can be found at  http://www.3d-peim.org/sponsors-exhibitors//.  If you have questions, contact info@3d-peim.

Media Partners

 

 

TECHNICAL SPONSORS

      HOST

SPONSOR        

 

 

       

 

 

 
3D Power Electronics Integration and Manufacturing Symposium Open for Registration
Posted: 2021-2-18
Registration is now open for the Third Biennial International 3D-PEIM-21 Symposium. Hybrid live/virtual event will occur on June 21-23, 2021, Osaka University, Japan
 

 

PSMA announces that registration is now open for the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-21) to be held June 21-23, 2021. The event will be hosted by Osaka University, Japan at their Graduate School of Engineering.

Due to the unforeseen status of the COVID-19 pandemic in the months ahead, the committee has cautiously decided to hold a hybrid in-person/virtual event. At the hybrid symposium, anyone can attend either in person or virtually. Presentations will be live from both in-person and virtual presenters. All presentations will be recorded and available to paid attendees. Attendees may switch registration between virtual and in-person up to one month before the Symposium.

3D-PEIM has successfully re-invited all the postponed 2020 program world-class experts to present in 2021. Continuing the 2016 and 2018 Symposia’s success, 3D-PEIM-21 again assembles world-class experts representing a far-reaching range of disciplinary perspectives exploring the path to the development and manufacture of future 3D power electronics systems. Created and supported by the PSMA Packaging Committee, the Symposium encompasses additive, embedded, co-designed and integrative packaging technologies. Sessions will address mechanical, materials, reliability and manufacturability issues in deploying smart power-dense components and modules.

PSMA is sponsoring the 3D-PEIM-21 Symposium as part of its ongoing commitment to educate and inform the power electronics industry. Other technical supporting organizations include CPES/Virginia Tech, Daicel Japan and the IEEE Electronics Packaging Society.

The Technical Program Co-Chairs are Professor Katsuaki Suganuma, Osaka University, Japan, Minoru Ueshima, PhD., Senior Manager, Daicel, Japan and Professor Guo-Quan Lu, Virginia Tech. 

The technical session program and session chairs are:

S1 Plenary I: Tsuyoshi Funaki, Osaka University, Japan
S2 Systems Integration & Thermal Management: Christina DiMarino, Virginia Tech, USA
S3 Multiphysics Design and Tools: Michihiro Shintani, Nara Institute of Science and Technology (NAIST), Kansai Science City, Japan
S4 Additive Manufacturing: Patrick McCluskey, University of Maryland, USA and Douglas Hopkins, North Carolina State University, USA
S5 Plenary II: Katsuaki Suganuma, Osaka University, Japan
S6 Manufacturing Technologies: John Bultitude, Kemet Corporation, USA
S7 Materials: Jason Rouse, USA
S8 Heterogeneous Integration: Cyril Buttay, Laboratoire Ampère, France
S9 Quality and Reliability: Steven Martell, Nordson Sonoscan, USA
S10 NEW! Partners Session: Minora Ueshima, Daicel, Japan

A detailed program with time zone information for virtual attendees is available at www.3d-peim.org/program. Due to time zone challenges, all sessions will be recorded and available to paid attendees after the Symposium.

General Chair Professor Tsuyoshi Funaki states, “I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. We are planning on providing an amazing on-site or virtual experience for all attendees. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this event”.

The Symposium will feature table-top exhibits during the breaks, lunch periods and evening networking sessions. On the last day of the Symposium in-person attendees are invited on a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery. Additional information and registration details are available at www.3D-PEIM.org.

Interested in being a 3D-PEIM 2020 Exhibit Partner?  Information can be found at www.3d-peim.org/sponsors-exhibitors.  If you have questions, contact info@3d-peim.org.

2018 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2018-10-15

The presentations from the 2018 International Symposium on 3D Power Electronics Integration and Manufacturing are available on the Packaging Forum.

Unique 3D Power Electronics & Manufacturing Symposium a Great Success!
Posted: 2018-9-6
Presentations available to PSMA members now; available to public April 1st 2019

 


The second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 25-27, 2018, over 70 participants, 22 from outside the US, attended the eventin College Park, Maryland. Prior to the technical program, three tutorials were

 given by leading experts on additive manufacturing and power electronics system integration: "Additive Manufacturing" by Prof. Christopher Williams of Virginia Tech; "System Integration" by Prof. Douglas Hopkins of NC State University; and "Integrated Thermal Packaging" by Prof. Michael Ohadi of University of Maryland. Attendee reviews of the tutorials were outstanding with over 90% feeling that their knowledge was increased due to the presentations.

The Symposium was kicked off with two outstanding keynote talks given by two leading researchers in power packaging: "Small, Quiet, Robust, and Affordable: Delivering the Integrated Promise" byProf. Mark Johnson, University of Nottingham, UK; and "Embedding Technologies for Planar Power Electronics Modules" by Prof. Rolf Aschenbrenner, Fraunhofer Institute-Berlin, Germany.
The keynotes were followed by a single-track technical program featured 34 oral presentations divided into eight topical sessions, each with a keynote speaker followed by three invited/contributed talks. Over 80% of the oral talks were invited. The presenters and attendees engaged in lively discussions during the sessions and many networking breaks.  In addition, 19 posters were displayed during an exciting interactive session with the displaying students.  Participant feedback stated that 90% of attendees felt the presented material was high quality and were interested in attending a future 3D-PEIM.

The Symposium was sponsored by the Power Sources Manufacturers Association (www.psma.com), and chaired by Prof. Patrick McClusky, University of Maryland, IEEE EPS was a technical sponsor and with financial support by two industry sponsors, and three academic sponsors, CALCE at University of Maryland, CPES at Virginia Tech, and the FREEDM Systems Center at NCSU.

Plans are now underway for 3D-PEIM 2020 in Osaka, Japan, and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com

Provided by:
Technical Program Chair
Prof. Guo-Quan (GQ) Lu, 
Virginia Tech
    General Chair
Prof. Patrick McCluskey,
University of Maryland,
College Park

 

A Successful Inaugural Symposium
Posted: 2016-8-8
1st International Symposium on 3D Power Electronics Integration and Manufacturing

The first International Symposium on 3D Power Electronics and Manufacturing was a true success! On June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and began with three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.

A highlight was the Plenary Road Mapping session chaired by Brian Narveson, PSMA, with keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.

The Symposium was organized by the Power Sources Manufacturers Association (www.psma.com), chaired by Prof. Doug Hopkins of North Carolina State University, and supported by 15 exhibitors and sponsors, including the FREEDM Systems Center at NCSU, CPES at Virginia Tech, and CALCE at University of Maryland.

Of special note: SARDA Inc. selected the 3D-PEIM Symposium to announce its collaboration with UTAC and AT&S to implement its Heterogeneous Integrated Power Stage (HIPS). All three were exhibitors and/or presenters.

Plans are now underway for 3D-PEIM 2017 and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by
Prof. Douglas Hopkins,
General Chair

  Doug Hopkins

 

 

2016 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2016-7-5

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available on the Packaging Forum.

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