3D PEIM

Important Update: International 3D Power Electronics Integration and Manufacturing Symposium
Posted: 2020-3-16

 

International 3D Power Electronics Integration and Manufacturing Symposium

Initially planned for June 2020, Osaka University, Japan
 Postponed Due to Coronavirus Threat until June 21-23 2021 at Osaka University

The 3D-PEIM 2020 Steering Team met Friday March 6 to realistically assess the possible impact that the COVID-19 (Coronavirus) would have on our June 2020 Symposium. Presently there are many companies, universities, and countries banning travel. We expect that it may most likely become worse. Since we felt that we do not know what the situation will be in three months or six months, our decision is to postpone our Third Biennial 3D-PEIM Symposium until July 21 – 23, 2021.

We remain committed to holding the Symposium at Osaka University in Japan on our new date. Thanks to the Speakers, Session Chairs, and Members of the Technical Program Committee and Steering Committee that have worked hard and contributed to building an excellent technical program. We want to retain our original Program if possible. So we are encouraging those committed to our previous June 2020 event to remain committed to or to re-commit to our postponed 3D-PEIM Symposium in 2021. We intentionally set a firm date so that you could plan appropriately once the crisis is over.

In the meantime, we are going to leave the Website open and will provide updates as they become available, probably starting this fall. You can check progress at

http://3d-peim.org/

We will retain all partners and sponsors on the Website if they so choose.

 

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3D-PEIM 2020: The Third International Symposium on 3D Power Electronics Integration and Manufacturing
Posted: 2020-3-3
Registration is Now Open

June 22-24, 2020
Osaka University, Japan

PSMA, sponsor of the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2020) announces registration is open. The Symposium will be held June 22-24, 2020 at the Osaka University, Osaka, Japan. The Symposium is led by General Chair: Prof. Tsuyoshi Funaki of Osaka University, Japan with Technical Program Co-Chairs: Prof. Katsuaki Suganuma, Osaka University, Japan; Dr. Minora Ueshima, Daicel, Japan; and Prof. Guo Quan Lu, Virginia Tech, U.S.A.

The 3rd biennial 3D-PEIM Symposium has invited world-class experts representing a far-reaching range of disciplinary perspectives who are advancing the development of future 3D power electronics systems. The experts are Industry Professionals and Academics engaged in R & D of power electronics packaging design, and manufacturing processes. The Symposium encompasses additive, embedded, co-designed, and integrative packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power-dense components and modules.

This Symposium will provide attendees an excellent opportunity to gain insight or to broaden their expertise in 3D power electronics packaging and integration. The Symposium schedule is arranged to provide ample time between sessions for attendees to share ideas, progress, and challenges with leading members of Universities, companies from industry, and representatives from international associations and societies. On the last day of the Symposium, attendees are invited on a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery.

General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM is held here because there are many power device and peripheral packaging material manufacturers in Japan. I believe this Symposium will be an amazing experience for the attendees because we are assembling world prominent experts in power electronics packaging and manufacturing. I also believe that all attendees will gain significant advance packaging knowledge through discussions at this Symposium".

The Symposium schedule will include Plenary and Keynote Presentations, Technical Sessions, new this year - a Sponsors Round Table Discussion, Tabletop Demonstration Exhibits and Networking & Laboratory Tours. The technical program and session chairs are:

  • S1 Plenary I: Tsuyoshi Funaki, Osaka University, Japan
  • S2 Additive Manufacturing: Patrick McCluskey, University of Maryland, USA and Douglas Hopkins, North Carolina State University, USA
  • S3 Systems Integration & Thermal Management: Christina DiMarino, Virginia Tech, USA
  • S4 Plenary II: Katsuaki Suganuma, Sanken Osaka University, Japan
  • S5 Multiphysics Design and Tools: Michihiro Shintani, Nara Institute of Science and Technology (NAIST), Kansai Science City, Japan
  • S6 Materials: Jason Rouse, Sekisui America, USA
  • S7 Manufacturing Technologies: John Bultitude, Kemet Corporation, USA
  • S8 Sponsors Session: Minora Ueshima, Daicel, Japan
  • S9 Quality and Reliability: Steven Martell, Nordson Sonoscan, USA
  • S10 Heterogeneous Integration of Components: Cyril Buttay, Laboratoire Ampère, France

The complete Symposium agenda and latest updates are available on the 3D-PEIM Website: http://www.3d-peim.org/program/

If you are interested in being a 3D-PEIM 2020 PARTNER, contact info@3d-peim.org

Some feedback from attendees at the 2016 & 2018 Symposiums:

  • "The 3D-PEIM brings together a unique set of participants – those involved in power packaging who actually know and care about manufacturing and reliability."
  • "Most valuable is the breadth of topics. I don't consider myself an expert in many topics presented so, touching on multiple topics is very helpful."
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

Register now at http://www.3d-peim.org/registration/

We look forward to seeing you in Osaka, Japan, this coming June.

For further information, contact the 3D-PEIM Symposium organizers at http://www.3d-peim.org/contact/ or Sponsor PSMA at power@psma.com

General Chair, 3D-PEIM Symposium 2020

Prof. Tsuyoshi Funaki, Osaka University
Technical Program Co-Chairs:

Prof. Katsuaki Suganuma,
Osaka University

Minora Ueshima,
Daicel, Japan

Prof. Guo-Quan (GQ) Lu,
Virginia Tech USA

 

CALL FOR PAPERS
Posted: 2019-12-6

The Third International Symposium on
3D Power Electronics Integration and Manufacturing

June 22-24, 2020
Osaka University, Osaka, Japan

Members of the worldwide electronics community are encouraged to submit abstracts for the third international symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). This symposium will bring together practitioners and researchers to share, discuss, and roadmap the latest developments in circuits and systems enabled through advancements in 3D packaging, integration, and manufacturing technologies. The symposium will have a full program of keynotes, invited presentations, contributed papers, interactive sessions, table-top exhibits, and laboratory tours.

Contributed papers are sought that address important challenges related to the packaging and manufacturing of smaller, lighter, more efficient, and sustainable power electronic products, especially in the following topic areas:

  • Additive Manufacturing
  • Embedded Components and Embedding Technologies
  • Systems Integration and Thermal Management for High-density Packaging
  • Multiphysics Modeling and Simulation of Integrated Packaging and Circuit Solutions
  • Materials (e.g., interconnects, encapsulants, substrates)
  • Heterogeneous Integration
  • Manufacturability of circuits and packaging (manufacturing processes, equipment, and standards)
  • Quality and Reliability, including Prognostics and Condition Monitoring

ABSTRACT FORMAT:The abstract should consist of two pages of text with sections on the purpose of the study, the approach,  the results and the significance to power electronics community, plus one page of figures, tables, and references.

ABSTRACT DEADLINE: January 20, 2020
• Submission information 
http://www.3d-peim.org/call-for-papers/submission-information/

Questions pertaining to the 3D-PEIM Symposium may be addressed to:

General Chair:
Prof. Tsuyoshi Funaki, Osaka Univ. (funaki@eei.eng.osaka-u.ac.jp)

Technical Program Co-Chairs:
Prof. Katsuaki Suganuma, Osaka Univ. (Suganuma@sanken.osaka-u.ac.jp)
Prof. Guo-Quan Lu, Virginia Tech (gqlu@vt.edu)

Past General Chairs:
Prof. Patrick McCluskey, Univ. of Maryland (mcclupa@umd.edu)
Prof. Douglas Hopkins, NC State Univ. (dchopkins@ncsu.edu)

International Symposium on 3D Power Electronics Integration and Manufacturing 3D-PEIM 2020
Posted: 2019-9-10

June 22-24, 2020
Osaka University, Japan

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

The Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-20) will be held on June 22-24, 2020.  This symposium will be held at the Osaka University, Suita Campus in Japan. This is the first time to have this symposium outside the USA. It will include worldwide experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Asia is the factory of the world and has a big customer base for advanced power electronics technology. 3D-PEIM is an excellent opportunity to learn about leading edge R&D innovations in 3D power packaging. The focus of the symposium will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature invited lectures highlighted by a keynote addresses from Industry experts.  There will also be tutorials, technical sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Tsuyoshi Funaki of the Osaka University, Japan.

Session topics during the 3-day symposium include:

  • Systems Integration & Thermal Management
  • Multiphysics Design and Tools
  • Materials
  • Manufacturing Technologies: equipment and processes
  • Heterogeneous Integration of Components
  • Quality & Reliability

University of Osaka School/Graduate School of Engineering

Osaka is located in the center of Kansai region, facing Osaka bay. About 9 million people live in Osaka, the largest component of the Keihanshin Metropolitan Area, the second largest metropolitan area in Japan. Osaka was historically developed as a town of merchants. It has also been known as the nation's kitchen. Osaka contains numerous urban canals and bridges, including its most famous urban canal, Dotonbori. Osaka Castle, one of the most famous landmarks in Osaka, played a major role in the Japanese history.

Osaka University School of Engineering, is a university born from the needs of industry. The Osaka Technology School, the predecessor of the School of Engineering, was founded as a powerful cooperative effort between the industry of the time and the government. The School of Engineering was the first in Japan to establish specialized academic departments for fields such as fermentation, welding, communications, and the environment. The nature of Osaka with its comparatively unrestricted atmosphere and the course of development in close cooperation with local industries has produced a unique set of departments that is not restrained by orthodox department structures. The Osaka School of Engineering utilizes a range of opportunities to maintain their important relationships with local communities, including the holding of courses that are open to the public, and University-Industry collaboration projects at the Center for Advanced Science and Innovation.

The Symposium will include a table top exhibition area. Interested organizations are invited to purchased exhibit space that will include a table to exhibit products and literature to a target group of technologists. Symposium Sponsorship is also available which includes one registration, tutorial registration, an exhibit table, Website and program recognition, lecture room recognition, and a banner displayed in the lecture room. Interested in being an exhibitor or sponsor of 3D-PEIM 2020, contact info@3d-peim.org.

If you are interested in learning more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  We look forward to seeing you in Osaka university this coming June 2020.

Prof. Tsuyoshi Funaki
Osaka University
General Chair,
3D-PEIM Symposium 2020

  Prof. Katsuaki Suganuma,
Osaka University,
Technical Program Co-Chairman

 

 

International Symposium on 3D Power Electronics Integration and Manufacturing
Posted: 2019-6-9

3D-PEIM 2020
Osaka University, Japan
June 22-24, 2020


PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

 

The Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-20) will be held on June 22-24, 2020.  This symposium will be held at the Osaka University, Suita Campus in Japan. This is the first time to have this symposium outside the USA. It will include worldwide experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Asia is the factory of the world and has a big customer base for advanced power electronics technology. 3D-PEIM is an excellent opportunity to learn about leading edge R&D innovations in 3D power packaging. The focus of the symposium will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature invited lectures highlighted by a keynote addresses from Industry experts.  There will also be tutorials, technical sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Tsuyoshi Funaki of the Osaka University, Japan.

If you are interested in learning more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  We look forward to seeing you in Osaka university this coming June 2020.

Prof. Tsuyoshi Funaki 
General Chair, 
3D-PEIM Symposium 2020
  Prof. Katsuaki Suganuma, 
Osaka University, Japan
Technical Program Co-Chairman

 

 

2018 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2018-10-15

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available on the Packaging Forum.

Unique 3D Power Electronics & Manufacturing Symposium a Great Success!
Posted: 2018-9-6
Presentations available to PSMA members now; available to public April 1st 2019

 


The second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 25-27, 2018, over 70 participants, 22 from outside the US, attended the eventin College Park, Maryland. Prior to the technical program, three tutorials were

 given by leading experts on additive manufacturing and power electronics system integration: "Additive Manufacturing" by Prof. Christopher Williams of Virginia Tech; "System Integration" by Prof. Douglas Hopkins of NC State University; and "Integrated Thermal Packaging" by Prof. Michael Ohadi of University of Maryland. Attendee reviews of the tutorials were outstanding with over 90% feeling that their knowledge was increased due to the presentations.

The Symposium was kicked off with two outstanding keynote talks given by two leading researchers in power packaging: "Small, Quiet, Robust, and Affordable: Delivering the Integrated Promise" byProf. Mark Johnson, University of Nottingham, UK; and "Embedding Technologies for Planar Power Electronics Modules" by Prof. Rolf Aschenbrenner, Fraunhofer Institute-Berlin, Germany.
The keynotes were followed by a single-track technical program featured 34 oral presentations divided into eight topical sessions, each with a keynote speaker followed by three invited/contributed talks. Over 80% of the oral talks were invited. The presenters and attendees engaged in lively discussions during the sessions and many networking breaks.  In addition, 19 posters were displayed during an exciting interactive session with the displaying students.  Participant feedback stated that 90% of attendees felt the presented material was high quality and were interested in attending a future 3D-PEIM.

The Symposium was sponsored by the Power Sources Manufacturers Association (www.psma.com), and chaired by Prof. Patrick McClusky, University of Maryland, IEEE EPS was a technical sponsor and with financial support by two industry sponsors, and three academic sponsors, CALCE at University of Maryland, CPES at Virginia Tech, and the FREEDM Systems Center at NCSU.

Plans are now underway for 3D-PEIM 2020 in Osaka, Japan, and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com

Provided by:
Technical Program Chair
Prof. Guo-Quan (GQ) Lu, 
Virginia Tech
    General Chair
Prof. Patrick McCluskey,
University of Maryland,
College Park

 

A Successful Inaugural Symposium
Posted: 2016-8-8
1st International Symposium on 3D Power Electronics Integration and Manufacturing

The first International Symposium on 3D Power Electronics and Manufacturing was a true success! On June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and began with three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.

A highlight was the Plenary Road Mapping session chaired by Brian Narveson, PSMA, with keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.

The Symposium was organized by the Power Sources Manufacturers Association (www.psma.com), chaired by Prof. Doug Hopkins of North Carolina State University, and supported by 15 exhibitors and sponsors, including the FREEDM Systems Center at NCSU, CPES at Virginia Tech, and CALCE at University of Maryland.

Of special note: SARDA Inc. selected the 3D-PEIM Symposium to announce its collaboration with UTAC and AT&S to implement its Heterogeneous Integrated Power Stage (HIPS). All three were exhibitors and/or presenters.

Plans are now underway for 3D-PEIM 2017 and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by
Prof. Douglas Hopkins,
General Chair

  Doug Hopkins

 

 

2016 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2016-7-5

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available on the Packaging Forum.

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