3D PEIM

2018 International 3D Power Electronics Integration and Manufacturing Symposium Registration Open
Posted: 2018-6-7

The Second Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18) will be held June 25-27, 2018 at the University of Maryland, College Park.  The Symposium is being organized by two leading experts in this field: Prof. Patrick McCluskey of the University of Maryland, College Park is General Chair; Prof. Guo-Quan Lu from Virginia Tech is Technical Program Chair.

Professionals and Educators engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees a perfect opportunity to gain insight or broaden expertise in 3D power electronics  packaging and integration. The Symposium schedule is arranged to provide ample time between sessions  for people to share ideas, progress, and challenges with leading members of international associations and societies.

General Chair, Prof. Patrick McCluskey of the University of Maryland shares, "It is my pleasure to welcome power electronic professionals of all disciplines to attend the leading conference dedicated to 3D integration and additive manufacturing of power electronics.  The symposium promises to be filled with tutorial, technical, and interactive sessions highlighting the latest discoveries and developments that are making miniaturized, intelligent power electronic systems a reality in a wide range of applications."

Our Outstanding Program is Complete

All of the world-class speakers are lined up to provide you with an outstanding program encompassing additive, embedded, co-designed, and integrative packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power dense components and modules.

Technical Program Chair, Prof. Guo-Quan Lu from Virginia Tech in completing the 3D-PEIM program says, "It is an exciting time for professionals working in the field of power electronics. The world is moving into more and more electrified. We are seeing a rapid rise of research and commercial activities in power electronics.  One indication is the growing number of international conferences and workshops that bring together thousands of PE engineers and researchers. I am glad that our 3D PEIM symposium uniquely addresses the need for a dedicated forum on power electronics packaging and manufacturing. We have assembled many of the leading experts in the field. I am sure that the attendees will have a fruitful learning experience through the lectures and one-on-one interactions." 

Our program includes:

A keynote address by Prof. Mark Johnson Director of the EPSRC Centre for Power Electronics and holds a personal Chair at the University of Nottingham, England. His personal research expertise is in power devices, power electronics packaging, thermal management, reliability and integration. He was instrumental in establishing a nationwide collaborative program in Silicon Carbide (SiC) electronics and was a member of the Executive Committee for the EPSRC-funded Innovative Electronics Manufacturing Research Centre (IeMRC) and project manager for the IeMRC Flagship Project in Power Electronics.

A keynote address by Dr. Rolf Aschenbrenner, deputy director of the Fraunhofer IZM focused on chip interconnection technologies. He received the iNEMI International Recognition Award in 2005, the CPMT David Feldman Outstanding Contribution Award 2013 and the European Semi Award 2016. His research work has spanned from manufacturing process fundamentals, to applied manufacturing and 3D Packaging. From 2002-2015, Rolf Aschenbrenner was a member of the IEEE CPMT and during the term 2010-2011 he was IEEE CPMT President and in 2012 he became IEEE Fellow.

Filling out our 3-day program are outstanding invited speakers and events:

  • Three tutorials by invited specialists: Chris Williams of Virginia Tech; Doug Hopkin of NCSU; and Mike Ohadi of U. of MD.
  • Eight technical sessions of four (4) speakers each that include hardware demonstration and one-on-one discussions with the speakers
  • An interactive poster session.
  • Rapping up our Symposium, attendees will have a guided tour of the Center for Advanced Life Cycle Engineering (CALCE) at the U. of MD.
  • You can see from our program schedule that plenty of time is available for you to network with speakers and fellow attendees.

You can view the complete Symposium program here.

The Symposium will have exhibits

Those who sign up to be an exhibitor will have an oportunity to display and domonstrate their products and technologies on a Table Top. The exhibits are planned to be open several times each day during the Symposium. Each registered Exhibitor will be given one complementary conference registration.

Sponsorship is offered

All sponsors will be at one common level. Those who become sponsors will get: one table top exhibit, website recognition, and projector recognition. Company banners will be placed in seminar room. Sponsors will receive one complimentary conference registration and complimentary tutorial registration.

Registration, Exhibits, and Sponsorship Information for June 25, 26, 27 is readily available at http://www.3d-peim.org/registration/

If you have questions or would like additional information, please contact us at http://www.3d-peim.org/contact/ or Sponsor PSMA at power@psma.com.

Provided by:

General Chair
Prof. Patrick McCluskey, University of Maryland, College Park

Technical Program Chair
Prof. Guo-Quan (GQ) Lu, Virginia Tech

Publicity Chair
Arnold Alderman, Anagenesis, Inc.

2018 International 3D Power Electronics Integration and Manufacturing Symposium is Open for Registration
Posted: 2018-2-19

PSMA, sponsor of the Second Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18), announces the opening of registration on February 1, 2018. The Symposium will be held June 25-27, 2018 at the University of Maryland, College Park. The Symposium program is being organized by two leading experts in this field: Prof. Patrick McCluskey of the University of Maryland, College Park is General Chair; Prof. Guo-Quan Lu from Virginia Tech is Technical Program Chair.

Once again, the 2nd biennial 3D-PEIM Symposium is assembling a group of world-class experts representing a far-reaching range of disciplinary perspectives to advance the development of packaging for future 3D power electronics systems. The Symposium encompasses additive, embedded, co-designed, and integrative packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power dense components and modules.

Professionals and Educators engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees a perfect opportunity to gain insight or broaden expertise in 3D power electronics packaging and integration. The Symposium schedule is arranged to provide ample time between sessions for people to share ideas, progress, and challenges with leading members of international associations and societies. On the last day of the Symposium, attendees are invited on a guided tour of the Center for Advanced Life Cycle Engineering (CALCE) at the U. of MD.

The symposium will feature five Segments:

  • Three tutorials by invited specialists: Chris Williams of Virginia Tech; Doug Hopkin of NCSU; and Mike Ohadi of U. of MD.
  • Two symposium keynote addresses by: Prof. Mark Johnson of the University of Nottingham; and Dr. Rolf Aschenbrenner of Fraunhofer Institute, Berlin.
  • Eight technical sessions, each includes:
    • one keynote address;
    • two invited presentations;
    • one contributed presentation;
    • hardware demonstrations and/or one-on-one discussions with the speakers.
    • An interactive poster session.
  • And a table top exhibition.

The eight technical sessions and keynote speakers are:

  • Additive Manufacturing: Prof. John Slotwinski of Applied Physics Lab/Johns Hopkins University
  • Systems Integration & Thermal Management: Prof. Douglas Hopkins, NSF FREEDOM LAB, NCSU
  • Multiphysics Design and Tools: TBD
  • Materials: Dr. Jung-Lae Jo, Mitsui Mining & Smelting Co, Ltd, Japan
  • Manufacturing Technologies: Dr. Bill Chen, ASE
  • Embedding Technologies: Dr. Maximilian Hofmann, Fraunhofer IISB, Germany
  • Heterogeneous Integration of Components: Arnold Alderman, Anagenesis
  • Quality and Reliability: Dr. Eckhard Wolfgang, ECPE, Germany
  • The complete Symposium agenda is on the 3D-PEIM Website.

The complete and up-to-date Symposium agenda is on the 3D-PEIM Website.

Attendees from the 2016 Symposium say it best:

  • "Good balance of academic and industry papers and attendance covering and illustrating research, development, and manufacturing technologies."
  • "It was a very important forum as we move into the post-Moore's Law/Heterogeneous Integrated era"
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

Register now at
http://www.3d-peim.org/registration/

Provided by:

General Chair, Prof. Patrick McCluskey, University of Maryland, College Park

Technical Program Chair
Prof. Guo-Quan (GQ) Lu, Virginia Tech

Publicity Chair
Arnold Alderman, Anagenesis, Inc.

CALL FOR PAPERS -International Symposium on 3D Power Electronics Integration and Manufacturing
Posted: 2017-11-17

PSMA is proud to announce the organizing of The Second Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18) to be held on June 25-27, 2018.  This Symposium will be held at the University of Maryland, College Park and will bring together world-class experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Prof. Patrick McCluskey of the University of Maryland, College Park is the General Chair and Prof. G.Q. Liu from Virginia Tech is Program Chair for the symposium.

For the professional or educator engaged in the research and development of power electronics packaging design, and manufacturing processes, this Symposium is the ideal event to share your ideas, progress and challenges with leading members of international associations and societies active in these fields of expertise. The program will focus on additive, embedded, co-designed, and integrative packaging technologies. Sessions will address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

Abstracts of candidate papers are sought that address important challenges related to the design, packaging and manufacturing of smaller, lighter, more efficient, and sustainable power electronic products, especially in the following topic areas:

  • Additive Manufacturing
  • Embedded Components and Embedding Technologies
  • Systems Integration and Thermal Management for High-density Packaging
  • Multi-physics Modeling and Simulation of Integrated Packaging and Circuit Solutions
  • Materials (e.g., interconnects, encapsulants, substrates)
  • Heterogeneous Integration
  • Manufacturability of circuits and packaging (manufacturing processes, equipment, and standards)
  • Quality and Reliability, including Prognostics and Condition Monitoring

We invite you to respond to our Call for Papers by submitting an abstract. Applicants can choose if they wish to present a) at a lecture session or b) at an e-poster session. Authors of accepted abstracts are expected to prepare both a power point presentation/or e-poster and an IEEE formatted paper so your material can be published in IEEE Explore. On the day of their presentations, all presenters will have free tabletop space in the exhibit area to demonstrate hardware and hold one-on-one discussions.

You can submit your Abstract at our symposium website www.3D-PEIM.org.
Abstracts are due December 18, 2017.

This is an outstanding opportunity to learn more about advanced fields of power electronics packaging and manufacturing. The symposium will feature 26 invited presentations, highlighted with a keynote address by Prof. Mark Johnson of the University of Nottingham, who is the Director of the Center for Power Electronics under the UK Engineering and Physical Sciences Research Council (EPSRC). There will be three tutorials by invited specialists, eight sessions that include invited and contributed presentations, an interactive poster/demonstration session, and plenty of networking time set aside.

The Symposium will include a table top exhibition area. Interested organizations are invited to purchased exhibit space that will include one registration and a table to exhibit products and literature to a target group of technologists.

Symposium Sponsorship is also available which includes one registration, tutorial registration, an exhibit table, Website and program recognition, lecture room recognition, and a banner displayed in the lecture room.

We will let attendees from the 2016 Symposium say it in their words:

  • "Good balance of academic and industry papers and attendance covering and illustrating research, development, and manufacturing technologies."
  • "It was a very important forum as we move into the post-Moore's Law/Heterogeneous Integrated era"
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

Want to learn more? Contact mailto:info@3D-PEIM.org, or the PSMA office at power@psma.com.

We look forward to seeing you in College Park this coming June.

For more information, please visit the Symposium website: www.3D-PEIM.org

Questions pertaining to the 3D-PEIM Symposium may be addressed to:

General Chair: Prof. Patrick McCluskey, Univ, of Maryland (mcclupa@umd.edu)
Technical Program Chair: Prof. Guo-Quan Lu, Virginia Tech (gqlu@vt.edu)
Past General Chair: Prof. Douglas Hopkins, NC State University (dchopkins@ncsu.edu)

International Symposium on 3D Power Electronics Integration and Manufacturing
Posted: 2017-9-11

June 25-27, 2018

Adele H. Stamp Student Union, University of Maryland, College Park, MD USA

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

Please visit www.3d-peim2018.org for the latest information on the 2018 symposium.

A Successful Inaugural Symposium
Posted: 2016-8-8
1st International Symposium on 3D Power Electronics Integration and Manufacturing

The first International Symposium on 3D Power Electronics and Manufacturing was a true success! On June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and began with three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.

A highlight was the Plenary Road Mapping session chaired by Brian Narveson, PSMA, with keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.

The Symposium was organized by the Power Sources Manufacturers Association (www.psma.com), chaired by Prof. Doug Hopkins of North Carolina State University, and supported by 15 exhibitors and sponsors, including the FREEDM Systems Center at NCSU, CPES at Virginia Tech, and CALCE at University of Maryland.

Of special note: SARDA Inc. selected the 3D-PEIM Symposium to announce its collaboration with UTAC and AT&S to implement its Heterogeneous Integrated Power Stage (HIPS). All three were exhibitors and/or presenters.

Plans are now underway for 3D-PEIM 2017 and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by
Prof. Douglas Hopkins,
General Chair

  Doug Hopkins

 

 

2016 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2016-7-5

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available to PSMA members here

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