3D PEIM

International Symposium on 3D Power Electronics Integration and Manufacturing 3D-PEIM 2020
Posted: 2019-9-10

June 22-24, 2020
Osaka University, Japan

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

The Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-20) will be held on June 22-24, 2020.  This symposium will be held at the Osaka University, Suita Campus in Japan. This is the first time to have this symposium outside the USA. It will include worldwide experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Asia is the factory of the world and has a big customer base for advanced power electronics technology. 3D-PEIM is an excellent opportunity to learn about leading edge R&D innovations in 3D power packaging. The focus of the symposium will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature invited lectures highlighted by a keynote addresses from Industry experts.  There will also be tutorials, technical sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Tsuyoshi Funaki of the Osaka University, Japan.

Session topics during the 3-day symposium include:

  • Systems Integration & Thermal Management
  • Multiphysics Design and Tools
  • Materials
  • Manufacturing Technologies: equipment and processes
  • Heterogeneous Integration of Components
  • Quality & Reliability

University of Osaka School/Graduate School of Engineering

Osaka is located in the center of Kansai region, facing Osaka bay. About 9 million people live in Osaka, the largest component of the Keihanshin Metropolitan Area, the second largest metropolitan area in Japan. Osaka was historically developed as a town of merchants. It has also been known as the nation's kitchen. Osaka contains numerous urban canals and bridges, including its most famous urban canal, Dotonbori. Osaka Castle, one of the most famous landmarks in Osaka, played a major role in the Japanese history.

Osaka University School of Engineering, is a university born from the needs of industry. The Osaka Technology School, the predecessor of the School of Engineering, was founded as a powerful cooperative effort between the industry of the time and the government. The School of Engineering was the first in Japan to establish specialized academic departments for fields such as fermentation, welding, communications, and the environment. The nature of Osaka with its comparatively unrestricted atmosphere and the course of development in close cooperation with local industries has produced a unique set of departments that is not restrained by orthodox department structures. The Osaka School of Engineering utilizes a range of opportunities to maintain their important relationships with local communities, including the holding of courses that are open to the public, and University-Industry collaboration projects at the Center for Advanced Science and Innovation.

The Symposium will include a table top exhibition area. Interested organizations are invited to purchased exhibit space that will include a table to exhibit products and literature to a target group of technologists. Symposium Sponsorship is also available which includes one registration, tutorial registration, an exhibit table, Website and program recognition, lecture room recognition, and a banner displayed in the lecture room. Interested in being an exhibitor or sponsor of 3D-PEIM 2020, contact info@3d-peim.org.

 

Call for Papers coming in October. Visit http://www.3d-peim.org/call-for-papers/ for information when available.

If you are interested in learning more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  We look forward to seeing you in Osaka university this coming June 2020.

Prof. Tsuyoshi Funaki
Osaka University
General Chair,
3D-PEIM Symposium 2020

  Prof. Katsuaki Suganuma,
Osaka University,
Technical Program Co-Chairman

 

 

International Symposium on 3D Power Electronics Integration and Manufacturing
Posted: 2019-6-9

3D-PEIM 2020
Osaka University, Japan
June 22-24, 2020


PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

 

The Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-20) will be held on June 22-24, 2020.  This symposium will be held at the Osaka University, Suita Campus in Japan. This is the first time to have this symposium outside the USA. It will include worldwide experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Asia is the factory of the world and has a big customer base for advanced power electronics technology. 3D-PEIM is an excellent opportunity to learn about leading edge R&D innovations in 3D power packaging. The focus of the symposium will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature invited lectures highlighted by a keynote addresses from Industry experts.  There will also be tutorials, technical sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Tsuyoshi Funaki of the Osaka University, Japan.

If you are interested in learning more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  We look forward to seeing you in Osaka university this coming June 2020.

Prof. Tsuyoshi Funaki 
General Chair, 
3D-PEIM Symposium 2020
  Prof. Katsuaki Suganuma, 
Osaka University, Japan
Technical Program Co-Chairman

 

 

2018 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2018-10-15

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available on the Packaging Forum.

Unique 3D Power Electronics & Manufacturing Symposium a Great Success!
Posted: 2018-9-6
Presentations available to PSMA members now; available to public April 1st 2019

 


The second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 25-27, 2018, over 70 participants, 22 from outside the US, attended the eventin College Park, Maryland. Prior to the technical program, three tutorials were

 given by leading experts on additive manufacturing and power electronics system integration: "Additive Manufacturing" by Prof. Christopher Williams of Virginia Tech; "System Integration" by Prof. Douglas Hopkins of NC State University; and "Integrated Thermal Packaging" by Prof. Michael Ohadi of University of Maryland. Attendee reviews of the tutorials were outstanding with over 90% feeling that their knowledge was increased due to the presentations.

The Symposium was kicked off with two outstanding keynote talks given by two leading researchers in power packaging: "Small, Quiet, Robust, and Affordable: Delivering the Integrated Promise" byProf. Mark Johnson, University of Nottingham, UK; and "Embedding Technologies for Planar Power Electronics Modules" by Prof. Rolf Aschenbrenner, Fraunhofer Institute-Berlin, Germany.
The keynotes were followed by a single-track technical program featured 34 oral presentations divided into eight topical sessions, each with a keynote speaker followed by three invited/contributed talks. Over 80% of the oral talks were invited. The presenters and attendees engaged in lively discussions during the sessions and many networking breaks.  In addition, 19 posters were displayed during an exciting interactive session with the displaying students.  Participant feedback stated that 90% of attendees felt the presented material was high quality and were interested in attending a future 3D-PEIM.

The Symposium was sponsored by the Power Sources Manufacturers Association (www.psma.com), and chaired by Prof. Patrick McClusky, University of Maryland, IEEE EPS was a technical sponsor and with financial support by two industry sponsors, and three academic sponsors, CALCE at University of Maryland, CPES at Virginia Tech, and the FREEDM Systems Center at NCSU.

Plans are now underway for 3D-PEIM 2020 in Osaka, Japan, and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com

Provided by:
Technical Program Chair
Prof. Guo-Quan (GQ) Lu, 
Virginia Tech
    General Chair
Prof. Patrick McCluskey,
University of Maryland,
College Park

 

A Successful Inaugural Symposium
Posted: 2016-8-8
1st International Symposium on 3D Power Electronics Integration and Manufacturing

The first International Symposium on 3D Power Electronics and Manufacturing was a true success! On June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and began with three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.

A highlight was the Plenary Road Mapping session chaired by Brian Narveson, PSMA, with keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.

The Symposium was organized by the Power Sources Manufacturers Association (www.psma.com), chaired by Prof. Doug Hopkins of North Carolina State University, and supported by 15 exhibitors and sponsors, including the FREEDM Systems Center at NCSU, CPES at Virginia Tech, and CALCE at University of Maryland.

Of special note: SARDA Inc. selected the 3D-PEIM Symposium to announce its collaboration with UTAC and AT&S to implement its Heterogeneous Integrated Power Stage (HIPS). All three were exhibitors and/or presenters.

Plans are now underway for 3D-PEIM 2017 and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by
Prof. Douglas Hopkins,
General Chair

  Doug Hopkins

 

 

2016 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2016-7-5

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available on the Packaging Forum.

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