3D PEIM

The Third International Symposium on 3D Power Electronics Integration and Manufacturing – 3D-PEIM
Posted: 2020-9-30

June 21-23, 2021,
Osaka University, Japan

 

 

PSMA, sponsor of the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2021) announces the postponement of the Symposium until June 21-23, 2021. We thank Osaka University for their commitment to being our 3D-PEIM 2021 Host.  We intentionally set a firm date of June 21 – 23 so that you could plan appropriately. Due to the uncertainty caused by COVID 19, the Symposium is planning for a mixed program of in-person and online presentations and attendance. Further details will be available in January.

The 2021 3D-PEIM Symposium will be led by General Chair Prof. Tsuyoshi Funaki of Osaka University, Japan and Technical Program Co-Chairs Prof. Katsuaki Suganuma, Osaka University, Japan; Dr. Minora Ueshima, Daicel, Japan; Prof. Guo-Quan Lu, Virginia Tech, USA.


Prof. Tsuyoshi Funaki, 
Osaka University
 
Prof. Katsuaki Suganuma, 
Osaka University
 
Prof. Guo-Quan (GQ) Lu,
Virginia Tech USA
 
Minora Ueshima, 
Daicel, Japan

The 3rd biennial 3D-PEIM Symposium is planning on re-inviting as many of the original 2020 program world-class experts as possible, representing a far-reaching range of disciplinary perspectives to advance the development of future 3D power electronics systems. The Symposium encompasses additive, embedded, co-designed, and integrated packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power-dense components, and modules.

Professionals and Academics engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees an excellent opportunity to gain insight or broaden expertise in 3D power electronics packaging and integration. As in the past, we will arrange the Symposium schedule to provide ample time between sessions for attendees to share ideas, progress, and challenges with leading members of Universities, companies, and international associations and societies. On the last day of the Symposium, attendees will be invited for a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery.

General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. Hopefully, the COVID-19 threat will be over so that we can provide an amazing experience for the attendees because we will be re-assembling as many of the world's prominent experts in power electronics packaging and manufacturing that we had planned for this year. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this Symposium."

Other Organizing Committee Members

  • Brian Narveson, Narveson Consulting, USA – Steering Committee Chairman and Finance Chairman
  • Prof. Patrick McCluskey, University of Maryland, USA – Past General Chairman and Assistant to General Chairman
  • John Bultitude, Kemet, USA – Publications Chairman
  • Arnold Alderman, Anagenesis, Inc. USA – Publicity Chairman
  • Prof. Doug Hopkins, North Carolina State University, USA – Past General Chairman and Advisor
  • Joe Horzepa, U.S.A. – Executive Director of PSMA

If you wish to be a member of the Technical Program Committee, please contact http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

The technical sessions and chairs will be:

S1 Plenary I - Tsuyoshi Funaki, Osaka University, Japan
S2 Additive Manufacturing - Patrick McCluskey, University of Maryland, USA, and Douglas Hopkins, North Carolina State University, USA
S3 Systems Integration & Thermal Management - Christina DiMarino, Virginia Tech, USA
S4 Plenary II - Katsuaki Suganuma,Sanken Osaka University, Japan
S5 Multiphysics Design and Tools - Michihiro Shintani, Nara Institute of Science and Technology, (NAIST), Japan
S6 Materials - Jason Rouse, Sekisui America Corporation
S7 Manufacturing Technologies - John Bultitude, Kemet Corporation, USA
S8 Sponsors Session New for 2021! - Minora Ueshima, Daicel, Japan
S9 Quality and Reliability - Cyril Buttay, Laboratoire Ampère, France
S10 Heterogeneous Integration of Components - Tsuyoshi Funaki, Osaka University, Japan

The Symposium will also include:

  • Tabletop demonstration exhibitions
  • Networking & Laboratory Tours – Osaka University

Further announcements and the complete Symposium agenda will be posted on the 3D-PEIM Website later this year.

Some feedback from attendees at the 2016 & 2018 Symposiums:

  • "The 3D-PEIM brings together a unique set of participants – those involved in power packaging who actually know and care about manufacturing and reliability."
  • "Most valuable is the breadth of topics. I don't consider myself an expert in many topics presented so, touching on multiple topics is very helpful."
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

We look forward to seeing you in Osaka, Japan, in June 2021.

This autumn, we will start again looking for Media, Organizing, Financial, and Technical Partners contact info@3d-peim

For further information, you can contact: http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

Host:    


 

 

Sponsor:


 

 

2018 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2018-10-15

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available on the Packaging Forum.

Unique 3D Power Electronics & Manufacturing Symposium a Great Success!
Posted: 2018-9-6
Presentations available to PSMA members now; available to public April 1st 2019

 


The second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 25-27, 2018, over 70 participants, 22 from outside the US, attended the eventin College Park, Maryland. Prior to the technical program, three tutorials were

 given by leading experts on additive manufacturing and power electronics system integration: "Additive Manufacturing" by Prof. Christopher Williams of Virginia Tech; "System Integration" by Prof. Douglas Hopkins of NC State University; and "Integrated Thermal Packaging" by Prof. Michael Ohadi of University of Maryland. Attendee reviews of the tutorials were outstanding with over 90% feeling that their knowledge was increased due to the presentations.

The Symposium was kicked off with two outstanding keynote talks given by two leading researchers in power packaging: "Small, Quiet, Robust, and Affordable: Delivering the Integrated Promise" byProf. Mark Johnson, University of Nottingham, UK; and "Embedding Technologies for Planar Power Electronics Modules" by Prof. Rolf Aschenbrenner, Fraunhofer Institute-Berlin, Germany.
The keynotes were followed by a single-track technical program featured 34 oral presentations divided into eight topical sessions, each with a keynote speaker followed by three invited/contributed talks. Over 80% of the oral talks were invited. The presenters and attendees engaged in lively discussions during the sessions and many networking breaks.  In addition, 19 posters were displayed during an exciting interactive session with the displaying students.  Participant feedback stated that 90% of attendees felt the presented material was high quality and were interested in attending a future 3D-PEIM.

The Symposium was sponsored by the Power Sources Manufacturers Association (www.psma.com), and chaired by Prof. Patrick McClusky, University of Maryland, IEEE EPS was a technical sponsor and with financial support by two industry sponsors, and three academic sponsors, CALCE at University of Maryland, CPES at Virginia Tech, and the FREEDM Systems Center at NCSU.

Plans are now underway for 3D-PEIM 2020 in Osaka, Japan, and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com

Provided by:
Technical Program Chair
Prof. Guo-Quan (GQ) Lu, 
Virginia Tech
    General Chair
Prof. Patrick McCluskey,
University of Maryland,
College Park

 

A Successful Inaugural Symposium
Posted: 2016-8-8
1st International Symposium on 3D Power Electronics Integration and Manufacturing

The first International Symposium on 3D Power Electronics and Manufacturing was a true success! On June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and began with three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.

A highlight was the Plenary Road Mapping session chaired by Brian Narveson, PSMA, with keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.

The Symposium was organized by the Power Sources Manufacturers Association (www.psma.com), chaired by Prof. Doug Hopkins of North Carolina State University, and supported by 15 exhibitors and sponsors, including the FREEDM Systems Center at NCSU, CPES at Virginia Tech, and CALCE at University of Maryland.

Of special note: SARDA Inc. selected the 3D-PEIM Symposium to announce its collaboration with UTAC and AT&S to implement its Heterogeneous Integrated Power Stage (HIPS). All three were exhibitors and/or presenters.

Plans are now underway for 3D-PEIM 2017 and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by
Prof. Douglas Hopkins,
General Chair

  Doug Hopkins

 

 

2016 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2016-7-5

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available on the Packaging Forum.

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