Packaging & Manufacturing Forum

“Silicon Carbide for Power Devices: History, Evolution, Applications and Prospects” Dr. Ahmed Elasser (GE Global Research Center)

“Electrification Challenges in Aeronautics” Pascal Asfaux (Airbus)

"Novel Thermal & Packaging Paradigms” Dr. Christophe Lochot (Airbus)

"Reliability in Power Electronics Modules” Dr. Ercan Dede (Toyota Research Institute of North America)

“Reliability and System Level Design Considerations for SiC Power Modules” Dr. Ty Mcnutt (Wolfspeed, A Cree Company)

“Conducted Electromagnetic Interference in Power Electronics Systems” Dr. Aaron Brovont (The University of Alabama)

“Accelerating commercialization of WBG power electronics: PowerAmerica Systems and Circuits" Victor Veliadis (PowerAmerica, North Carolina State University) 

“Module level and system level integrations of WBG devices for high power applications" Jin Wang (Ohio State University) 

“Technology Challenges in SiC-based Medium Voltage Power Conversion" Rolando Burgos (Virginia Tech University)

“Metrology Considerations for Accurate Characterization of High-Bandwidth Power Electronics Components & Applications" Andy Lemmon (University of Alabama)

"Evaluation of the PCB-Embedding Technology for a 3 kW Converter" Remy Caillaud, Johan Le Leslé, Cyril Buttay (Univ. Lyon), Florent Morel, Roberto Mrad, Nicolas Degrenne, Stefan Mollov

“A New Packaging Concept for Highly Reliable Power Modules” Shiori Idaka (Mitsubishi Electric)

“ABB LinPak: smart design for efficient converters” Fabian Fischer (ABB)

“The Development of 1200 V SiC Hybrid Switched Power Modules” Puqi Ning (Chinese Academy of Sciences), Tianshu Yuan, Han Cao, Lei Li, Yuhui Kang

“Stacked DBC Cavitied Substrate for a 15-kV Half-Bridge Power Module” Amol Deshpande (University of Arkansas), Fang Luo, Ange Iradukunda, David Huitink, Lauren Boteler

“A Study of Dielectric Breakdown of a Half-Bridge Switching Cell with Substrate Integrated 650 V GaN Dies” Eduard Dechant (Technical University of Applied Sciences, Rosenheim), Norbert Seliger, Ralph Kennel

“Silver Sintering Die Attach – Myths & Physics” Gyan Dutt (Alpha)

“Advanced SiC Power Module Packaging: Layout, Material System and Integration” Fang Luo (U. of Arkansas), Amol Deshpande, Cai Chen

“Rate controlled sintering: A novel approach to improve quality and yield of die-attach interconnects” Merkert Simon, Aaron Hutzler, Thomas Krebs (Pink)

“Aerosol Jet Printing Process for Semi-Embedded Power Assembly” Stephane Azzopardi, (Safran Tech), Jérôme Lelièvre, Toni Youssef, Denis Labrousse, Elodie Pereira, Philippe Lasserre

“A PCB based Package and 3D Assembly for High Power Density Converters” Roberto Mrad, Julien Morand, Rémi Perrin Mitsubishi Electric), Stefan Mollov

“Reliability for Mission- and Safety-Critical Systems in Aerospace Applications” Zak Sorchini (UTC), Steve Savulak

“3D-FE electro-thermo-magnetic modeling of automotive power electronic modules - Wire-bonding and Copper clip technologies comparison” Abdoulahad Thiam (LAPLACE, CNRS, University of Toulouse), Emmanuel Sarraute, William Sanfins, Frédéric Richardeau, Maël Durand

“Prognostics and Reliability Assessment of Insulated Gate Bipolar Transistor Power Electronic Modules” Erick Gutierrez (University of Maryland), Kevin Lin, Patrick McCluskey

“Comparison of Silicon Carbide Packages with Different Solder Attach Materials under High Temperature, Fast Power Cycling Conditions” Lauren E. Kegley (Wolfspeed), Tim Foster, Sayan Seal, Robert Shaw, Brice McPherson, Brandon Passmore, Marcelo Schupbach, Ty McNutt

“Ceramic Substrates and Liquids: Origin of Partial Discharges, and High Temperature Properties” Olivier Lesaint (Univ. Grenoble Alpes, CNRS, Grenoble INP), Joko Muslim, Rachelle Hanna

“Electrical Polymeric Insulation for Power Electronics: Physical Limits and New Tailored Composite Design Concepts” Sombel Diaham (LAPLACE, CNRS, University of Toulouse)

“Ceramic substrates for high voltage power electronics: past, present and future” Zarel Valdez-Nava (LAPLACE, CNRS, University of Toulouse), Driss Kenfaui, Marie-Laure Locatelli, Lionel Laudebat, Sophie Guillemet- Fritsch

“Drastic Change in Non-Linear Resistive Materials I(V) Characteristics” Guillaume Belijar (IRT Saint Exupéry), Loïc Hermette, Masahiro Kozako, Masayuki Hikita

“Effect of Film Thickness and Electrode Material on Space Charge Formation and Conductivity in Polyimide Films” Flora Carrasco (University of Toulouse), Laurent Berquez, Kunihiko Tajiri, Hirotaka Muto, Didier Marty-Dessus, Marie-Laure Locatelli, Sombel Diaham, Virginie Griseri, Thierry Lebey

“Robust On-line Junction Temperature Estimation of IGBT Power Modules Based on VON during PWM Power Cycling” Nicholas Degrenne (Mitsubishi Electric Research Center Europe), Stefan Mollov

“Packaging and integration of passive components to reduce board space with optimized thermal and electrical performance” John Bultitude (KEMET), Tony Burk, Allen Templeton, Nathan Reed, Galen Miller, John McConnell, Javaid Qazi, Abhijit Gurav, Lonnie Jones, Jim Magee, Manuel Ortiz, Mark Laps, Reggie Phillips, Kunihiro Kusano, Kenichi Chatani, Yoshihiro Saito

“Study of the impedance of the bypassing network of a switching cell – influence of the positioning of the decoupling capacitors” Yoann Pascal (Lab. SATIE and CNAM, France), Mickaël Petit, Denis Labrousse, François Costa

“Bus Snubber Optimization for Multi-Chip Power Modules” Brian T. DeBoi (University of Alabama), Andrew N. Lemmon

“PEEC Method and Hierarchical Approach Towards 3D Multichip Power Module (MCPM) Layout Optimization” Quang Le (University of Arkansas), Tristan Evans, Yarui Peng, Alan Mantooth

“Advanced Thermal Ground Planes for Power Electronics”  Ryan McGlen (Aavid, Boyd Corp)

“Thermal simulations of SiC MOSFETs under short-circuit conditions: influence of various simulation parameters” Yoann Pascal (Lab. SATIE and CNAM, France), Mickaël Petit, Denis Labrousse, François Costa

“Measurement of Space Charge Distribution Accumulated in Super Engineering Plastics at High Temperature Under High DC Electric Field” Maimi Mima (Tokyo City University), Yuuki Narita, Tokihiro Narita, Hiroaki Miyake, Yasuhiro Tanaka

“Thermal Management and Reliability of Power Electronics and Electric Machines” Sreekant Narumanchi (National Renewable Energy Laboratory)

Keynote Speaker:

“3D Printing Technology for Automotive Applications” Madhu Chinthavali, Oak Ridge National Laboratory

Lectures:

“Additive Manufacturing of Planar Inductor for Power Electronics Applications” Guo-Quan Lu, Virginia Tech

"Thermal Response of Additive Manufactured Aluminum” Tong Wu, Oak Ridge National Laboratory

"3D Printed Microchannel Heat Sink Design Considerations” Frank Wang, Crane EG

Keynote Speaker:

“Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components” Eric Dede, Toyota Research Institute of North America

Lectures:

“Thermal Management and Reliability of Power Electronics and Electric Machines” Sreekant Narumanchi, National Renewable Energy Laboratory

“A High Power-Density Three-Phase Inverter Adopting Double-End Sourced Power Module Structure” Dr. Fang Luo, The Ohio State University

“Novel Packaging and Thermal Measurement for 3D Heterogeneous Stacks” Theodore Harris, NC State University

Keynote Speakers:

“2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights” Chuck Richardson, iNEMI

“International Technology Roadmap for Wide Band-gap Power Semiconductors” Bram Ferreira, Technical University of Delft

“Heterogeneous Integration for IoT, Cloud and Smart Things” Bill Chen, ASE-US and IEEE CPMT

Keynote Speaker:

“Automatic Thermal Calibration of Detailed IC Package Models” John Wilson, Mentor Graphics

Lectures:

“Parasitic Induction Extraction and Verification for 3D Planar Bond All Module” Fei Yang, University of Tennessee, Knoxville

“FEA-Based Thermal-Mechanical Design Optimization for DBC Based Power Modules” Yang Xu, NC State University

“Decomposition and Electro-Physical Model Creation of the CREE 1200V, 50A 3-Ph SiC Module” Adam Morgan, NC State University

Keynote Speakers:

“Ag Sinter Joining and Stress Migration Bonding for WBG Die Attach”  Katsuaki Suganuma, Osaka University 

Lectures:

“Materials for 3D Integration” Patrick McCluskey, University of Maryland

“Photocurable Dielectrics for Electronic Packaging and Encapsulant Applications” Wuttichai Reainthippayasakul, Penn State

Keynote Speaker:

“Towards Better Power Electronic Building Blocks” Bram Ferreira, Technical University of Delft

Lectures: 

“Design and Manufacturability of a High Power Density M2C Inverter” Joseph Kozak, University of Pittsburgh

“3D System in a Package (3D SiP) with Embedded Chip, Providing Integration Solutions for Power Applications” Lee Smith, UTAC

“Parametric Power Electronic Module Design Techniques for Rapid Analysis, Prototyping, and Transition to Manufacturing” Brice McPherson, Wolfspeed

“Advanced Multi-physics Simulation for High Performance Power Electronic Design”,poster Xin Zhao, Yang Xu, NC State University 

“Application of 3D Printing for Rapid Prototyping of Adv. Power Electronic Modules” Yang Xu, NC State University

“A Folded GaN VRM with High Electrical and Thermal Performance”, poster Bo Gao, NC State University

“Developments for Copper-Graphite CTE-Matched Thermal Cores for High Reliability GaN Systems”, “Developments for Copper-Graphite Composite Thermal Cores for High Reliability RF Systems” David Saums, DS&A, LLC

“Metallic TIM Testing and Selection for IC, Power, and RF Semiconductors” David Saums, DS&A, LLC

“Enabling High Reliability Power Modules: A Multidisciplinary Task” Li Ran, University of Warwick

Keynote Speakers:

“Power System-in-Package” Cian O'Mathuna, Tyndall National Institute, University of Cork

“Significant developments and trends in embedded substrate and component technologies for power applications” Brian Narveson, PSMA

“On Size and Magnetics: Why Small Efficient Power Inductors Are Rare” Charlie Sullivan, Dartmouth

Lectures:

“Batch Fabrication of Radial Anisotropy Toroidal Inductors” Charlie Sullivan, Dartmouth

“Small, Fast Voltage Regulators using Heterogeneous Integration” Greg Miller, Sarda Tech

“High Efficiency Power Solutions by Chip Embedding” Kay Essig, ASE-EU

“High performing vertical Silicon Capacitors for RF power modules” Catherine Bunel, Ipdia

“Increase Power Density and Simplify Designs with 3D SiP Modules” Jim Moss, Texas Instruments

Keynote Speaker:

“An Overview of Die Attach and Wire Bond Fatigue Models and Test Results” Craig Hillmann, DFR Solutions

Lectures:
“An Evaluation of BME C0G Multilayer Ceramic Capacitors as Building Blocks for DCLink Capacitors in 3D Power Electronics” John Bultitude, Kemet

“Heavy Cu Wedge Bonding Ready for Mass Production” Bill Maldonado, Hesse-Mechatronik

“Development of a Particle Erosion Model for Silicon Microchannel Coolers” David Squiller, University of Maryland