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For copies of Standards, please contact the appropriate agency. PSMA does not provide copies of standards.
Agency (an Agency can be National, International, or a Non-Government Organization or NGO):
IPC
IPC-A-610 - Start year: 2020
Location: Global - Global

Description:

The IPC-A-610 Endorsement is included of the following IPC Certification Programs: Certified IPC Specialist (CIS), Certified IPC Trainer (CIT/MIT), Certified Standards Expert (CSE/SCSE). Specific program information is outlined in the Policies and Procedures.

Topics Covered in the IPC-A-610 Endorsement Program

  • Establishing and maintaining integrity of the certification program
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered requirements for connecting to terminals
  • Soldered connection requirements for plated-through holes
  • Surface mounting criteria for chip components, leadless and leaded chip carriers
  • Swaged hardware and heatsink requirements of mechanical assemblies
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements
  • Solder fillet dimensional criteria for all major SMT component groups
  • Soldering, such as tombstoning, dewetting, voiding and others
  • Criteria for component damage, laminate conditions, cleaning and coating
  • Steps to effectively using the lesson plan and materials, tips on inspection and a review of important Certified IPC Trainer skills

Who Should Earn an IPC-A-610 Endorsement

Anyone responsible for the quality and reliability of electronic assemblies should consider becoming an IPC-A-610 Certified IPC Trainer. Trainers and quality supervisors versed in electronic assembly are excellent candidates for A-610 training, as are engineering and manufacturing supervisors with assembly responsibilities.

"An excellent course of study on an excellent document… My students were nervous about testing, but we have had high pass rates and a lot of personal satisfaction gained from participating in the training. Without question, the greatest strength of the program is its relevance: it is used by our operators every day. The program has given the entire facility a much higher level of common knowledge about terminology and important concepts." ~ Bernie Schaeffer, Kimball Electronics Group

Notes:

For information about IPC standards with DRM protection, visit www.ipc.org/drm.

This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard doesnot provide criteria for cross-section evaluation.

This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, elec-tronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. For a more completeunderstanding of this document’s recommendations and requirements, one may use this document in conjunction withIPC-HDBK-001, IPC-AJ-820 and J-STD-001.

The criteria in this standard are not intended to define processes to accomplish assembly operations nor is it intended to autho-rize repair/modification or change of the product. For instance, the presence of criteria for adhesive bonding of components doesnot imply/authorize/require the use of adhesive bonding and the depiction of a lead wrapped clockwise around a terminal doesnot imply/authorize/require that all leads/wires be wrapped in the clockwise direction.

Users of this standard should be knowledgeable of the applicable requirements of the document and how to apply them, see1.3 Classification.

IPC-A-610 has criteria outside the scope of J-STD-001 defining mechanical and other workmanship requirements.

Table 1-1 is a summary of related documents

Documet Purpose      

Spec #

Definition

Design Standard

IPC-2220-FAM

IPC-7351

IPC-CM-770

Design requirements reflecting three levels of complexity (Levels A, B, and C) indicat-ing finer geometries, greater densities, more process steps to produce the product.Component and Assembly Process Guidelines to assist in the design of the bareboard and the assembly where the bare board processes concentrate on land pat-terns for surface mount and the assembly concentrates on surface mount andthrough-hole principles which are usually incorporated into the design process and the documentation.

Printed Board – Requirement

IPC-6010-FAM

IPC-A-600

Requirements and acceptance documentation for rigid, rigid flex, flex and other types of Substrates.

End Item Documentation

Ipc-D-325  

Documentation depicting bare board or assembly requirements. Details may or maynot reference industry specifications or workmanship standards as well as the User’sown preferences or internal standard requirements.

Process Requirement Standard

J-STD-001

Requirements for soldered electrical and electronic assemblies depicting minimumend product acceptable characteristics as well as methods for evaluation (test meth-ods), frequency of testing and applicable ability of process control requirements.

Acceptability Standard

IPC-A-610

Pictorial interpretive document indicating various characteristics of the board and/orassembly as appropriate relating to desirable conditions that exceed the minimumacceptable characteristics indicated by the end item performance standard andreflect various out-of-control (process indicator or defect) conditions to assist the shop process evaluators in judging need for corrective action.

Training Programs (Optional)

 

Documented training for process, procedures, techniques, and requirements.

Rework and Repair

IPC-7711/7721

Documentation providing the procedures to accomplish conformal coating and com-ponent removal and replacement, solder resist repair, and modification/repair of lami-nate material, conductors, and plated through-holes.

.IPC-AJ-820 is a supporting document that provides information regarding the intent of this specification content and explains oramplifies the technical rationale for transition of limits through Acceptable to Defect condition criteria. In addition, supporting infor-mation is provided to give a broader understanding of the process considerations that are related to performance but not com-monly distinguishable through visual assessment methods.

The explanations provided in IPC-AJ-820 should be useful in determining disposition of conditions identified as Defect, processes associated with Process Indicators, as well as answering questions regarding clarification in use and application for defined con-tent of this specification. Contractual reference to IPC-A-610 does not additionally impose the content of IPC-AJ-820 unless specifically referenced in contractual documentation.

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Agency (an Agency can be National, International, or a Non-Government Organization or NGO):
IPC
IPC-J-STD-001H - Start year: 2020
Location: Global - Global

Description:

IPC-J-STD-001H: Requirements for Soldered Electrical and Electronic Assemblies- Multi Device License

Notes:

IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.

IPC-J-STD-001H is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. J-STD-001 is developed in synergy with IPC-A-610 and is supported by IPC-HDBK-001 for those wanting additional information and explanation on the requirements. If you purchased IPC-J-STD-001H you should also purchase and use IPC-A-610H, they work together.

Multiple-Device License (MDL), Digital Rights Management (DRM) - Protected Document. The MDL DRM product can be purchased starting with a 12 device license and any quantity larger than that. NOTE: The pricing shown is for 1 device. Upon check out the price will be updated for the total devices purchased. A 10% discount is applied to any quantity of 20 and more when purchased on the same order. Users of this MDL document will only be able to open it on the number of devices specific to the product order. (Example: If you placed an order for a MDL of 12 then you would be able to open the document on 12 devices) For information about IPC standards with DRM protection, visit www.ipc.org/mdl

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Agency (an Agency can be National, International, or a Non-Government Organization or NGO):
IPC
IPC-J-STD-001HS - Start year: 2021
Location: Global - Global

Description:

Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

Notes:

Space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

  Sort by Start year / Status
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