Technology Report – Current Developments in 3D Power Packaging with Focus on Embedded Substrate Technologies Preview
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Technology Report – Current Developments in 3D Power Packaging with Focus on Embedded Substrate Technologies Preview
The Table of Contents to the 2015 PSMA Technology Report – Current Developments in 3D Power Packaging with Focus on Embedded Substrate Technologies is available below.
PSMA Regular and Associate members receive a copy of the printed and USB memory drive versions of 2015 PSMA Technology Report – Current Developments in 3D Power Packaging with Focus on Embedded Substrate Technologies as a benefit of their membership. Additional copies may be purchased at the member price of $US190. PSMA Affiliate members may also purchase the report for $US190. The report is available to non-members for purchase for the price of $US2990.
| Attachment | Size |
|---|---|
| 3D Embedded Components Report ToC.pdf | 888.57 KB |
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