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Positions the company to deliver next generation autonomous driving solutions
ON Semiconductor Corporation, driving energy efficient innovations, today announced it is establishing a new sensor fusion design center in Europe. This team has combined experience of more than 1,200 years in silicon design for digital and analog technologies. The center positions ON Semiconductor to extend its market leadership in image sensors for automotive ADAS and viewing applications with new capabilities in imaging and video signal processing for automated driving systems. By combining this design center with its recently acquired mmWave radar technology and design center in Israel, ON Semiconductor is uniquely positioned to provide sensor fusion solutions for next generation highly autonomous vehicles.
“The automotive image sensor market is growing rapidly driven through higher attach rates for ADAS and viewing systems and new applications for image sensors, such as driver monitoring, e-mirror and 360-degree sensing,” said Ross Jatou, vice president and general manager Automotive Solutions Division of the Image Sensor Group. “Expanding our design capacity positions us to extend our leadership in established segments and to deliver new, world-class solutions for emerging segments.”
The new United Kingdom design center for ON Semiconductor reports directly into the Automotive Solutions Division (ASD) within the Image Sensor Group. The new design center is located in Bracknell, England and expands a global sensor design footprint that now includes major locations in the United States, United Kingdom, Japan, India and Israel.
Complete ecosystem in a compact form-factor enables accelerated time-to-market & significant reductions in allocated engineering resources
Autonomous Vehicles - ON Semiconductor, driving energy efficient innovations, has introduced the Modular Automotive Reference System (MARS) that gives system and software developers a ready-to-use camera for research and development activities. The leading-edge MARS platform enables users to reconfigure cameras with different lenses, image sensors, image signal processors (ISPs) and communications options for rapid prototyping and experimentation. The system is so flexible that it can be used for the full spectrum of automotive camera applications including advanced driver assistance systems (ADAS), surround and rear viewing systems, in-cabin cameras (for gesture recognition, driver eye monitoring, or light level inspection purposes), and autonomous driving.
MARS enables shorter design cycles, reduced engineering costs, and assists automotive design teams in the implementation of imaging systems by providing them with a unique mix-and-match solution. Through it, various items of hardware can be combined in a robust and highly adaptable system with a compact form-factor. Due to the many different boards available, engineers have access to ON Semiconductor's broad portfolio of image sensors and co-processors, plus various automotive communications protocols from a select group of third party supply partners. This provides extensive scope in terms of finding the combination that best fits specific system requirements. The versatile platform can accommodate an almost limitless number of combinations due to consistent signal/power definitions for the interconnects utilized by these respective boards.
The ease of adapting this modular solution means that undertaking time-consuming activities such as creating custom boards (each capable of accommodating a different sensor option), testing out high-speed interface standards, or writing code for drivers, is no longer necessary. MARS is supported by a complete ecosystem, encompassing software development tools, schematics, gerbers, bill-of-materials (BOM) and much more. A comprehensive user guide is also included within the accompanying documentation.
"As image sensing proliferates in automotive applications, MARS will provide system and software developers tasked with turning concepts into reliable working applications with a valuable platform to simplify and speed proof of concept and development, and offer the scalability to get ideas from the lab to on-vehicle testing in real-world conditions," said Ross Jatou, General Manager and Vice President of Automotive Solutions Division of Image Sensor Group at ON Semiconductor. "The flexibility of MARS accelerates the component selection process by making the constituent sensors and co-processors totally interchangeable. The platform avoids the need to construct a multitude of custom boards to house different sensors for evaluation reducing engineering effort and shortening project times."
The support of commonly used communication standards (such as GMSL, FPD-Link, LVDS, MIPI, Ethernet) enables direct interfacing with existing vehicle electronic control units (ECUs). ON Semiconductor is working with an ecosystem of partners spanning lens developers, third party ISP vendors, communications IC vendors, software developers and SoC vendors. MARS modules are already prequalified with a range of these third party products and the company will expand these offerings going forward.
For more information, visit www.onsemi.com.
he 4th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA) was held November 7–9, 2016, in Fayetteville, Arkansas, USA. WiPDA is a fast-growing annual event with a focus on wide bandgap device development, applications of wide bandgap power devices, and related topics. This workshop, sponsored by IEEE and PSMA, provides a forum for device scientists, circuit designers, and application engineers from the IEEE Power Electronics and Electron Devices Societies to share technology updates, research findings, development experience, and ideas for novel applications. Topics of interest at WiPDA include:
- Heteroepitaxial & Bulk Materials Growth
- Gate Dielectrics & Surface Passivation
- Device Structures & Fabrication Techniques
- Device Characterization & Modeling
- Very High Efficiency and Compact Converters
- Safe Operating Areas of Wide Bandgap Devices, Including Short Circuit, Spike, & Transient Tolerance
- Harsh Environments (e.g. High Temperature) Operation & Reliability
- Packaging, Power Modules, & ICs
- Hard-Switched & Soft-Switched Application Analysis
- Gate Drive & Other Auxiliary Circuits
- High-Performance Passive Components
- Applications in Renewable Energy & Energy Storage, Transportation, Industrial Drives, & Grid Power Systems
- Wide-Band Gap System Design Philosophies & Strategies
The number of WIPDA attendees has grown quickly over the last four years, with attendees coming from multiple disciplines including materials science, device fabrication, and device application. Two hundred attendees participated in the workshop this year, including 105 from industry and 95 from academia or other research institutions. Of the 200 attendees, 165 were from the US and 35 were international.
WiPDA 2016 maintained the program from previous years and included tutorials, keynote sessions, university lab tours, a panel discussion, technical sessions, an exhibition, and, of course, a banquet at the University of Arkansas' Razorback Stadium! The banquet also included the workshop's poster session. The university lab tours included UA's High Density Electronics Center (HiDEC), their wide bandgap power packaging facilities, and the National Center for Reliable Electric Power Transmission (NCREPT), which is a 6 MVA/15 kV test facility. Further, IEEE's International Technology Roadmap for Wide Bandgap Semiconductors (ITRW) working group met at the workshop, as did JEDEC's working group on GaN power device reliability (GaNSPEC) to leverage the knowledge of the workshop attendees.
Keynote Talks and Technical Sessions
WiPDA has gained strong support from government agencies, academic institutions, and industry-leading companies, both nationally and internationally. This year's workshop featured keynote speakers from Wolfspeed, Ford, the Electric Power Research Institute (EPRI), Sandia National Laboratories, PowerAmerica, GaN Systems, MIT, Navitas, Eta-One, and Lockheed-Martin. They shared their views from different perspectives as the device manufacturer, the equipment designer, the researcher, and the system integrator. The technical program consisted of three parallel tracks of talks covering topics ranging from the physics of wide bandgap materials and devices, through wide bandgap power modules and circuits, to large-scale applications of such circuits.
Tutorial Sessions and Panel Discussion
There were two tutorial tracks encompassing four topics: SiC devices, GaN devices, device characterization, and applications of WBG devices. Speakers from Monolith Semiconductor, Infineon, and General Electric shared their knowledge concerning development of both SiC and GaN device applications, reliability considerations, and qualification, and engineers from Keysight covered techniques and tips related to accurate measurement of wide bandgap power devices and efficiency improvement of power circuits built from such devices. The panel discussion featured experts from industry, academia, and government, and addressed topics related to the supply-chain and manufacturing of wide bandgap devices, as well as their adoption by the power electronics community.
Student Travel Grants
Also this year, WiPDA provided travel grants of $625 per awardee to encourage student participation. 16 students received these awards, out of a total of 60 student participants.
All presented papers will be included in the conference proceedings and submitted to the databases of IEEExplore.
WiPDA 2017 will be hosted from Oct 30th to Nov 1st, by Sandia National Laboratories in Albuquerque, NM, USA. We look forward to your participation at next year's exciting event!
Provided by Dr. Fang Luo,
epending on what type of engineer you're speaking too, power packaging can mean a variety of different things – from a single semiconductor bare die package all the way up to a multi-level, vibration-ruggedized inverter design. With significant technical advances in the semiconductor market and increasing demands of customer applications, the field of power packaging is more critical than ever before. The International Workshop on Integrated Power Packaging seeks to bring industry professionals and researchers together to address the newest innovations in this rapidly evolving field. As material and semiconductor technologies continue to improve, fundamental device and system-level packaging approaches must also evolve in order to address challenges introduced by the increasing performance, reliability, and cost demands of next-generation power electronics applications. This workshop is an opportunity to engage in a meaningful discussion about the latest technologies and techniques in both industry and academia, ensuring that a cooperative learning environment is fostered for attendees of diverse technical backgrounds. The purpose of this workshop is to bring together researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to rapidly promote the development and commercialization of high-density and high-efficiency power converters.
IWIPP 2017 is specifically structured for inter-disciplinary learning opportunities, as evidenced by its diverse technical sponsors: the Power Supply Manufacturers Association (PSMA), the IEEE Power Electronics Society (PELS), the IEEE Components, Packaging, & Manufacturing Technology Society (CPMT), the IEEE Dielectrics and Electrical Insulation Society (DEIS), and the European Center for Power Electronics (ECPE).
In order to capture the inter-disciplinary knowledge of the workshop, IWIPP 2017 is introducing a new tutorial system. Each of the first two mornings of the conference will open with a technical tutorial, which will be open to all conference attendees. On Wednesday, April 5, Patrick McCluskey from the University of Maryland will present a tutorial on "Packaging and Thermal Management of Integrated Power Electronics". The following day, Thursday, April 6, Thierry Lebey of the University of Toulouse will present a tutorial on "Characterizing Electrical Insulation for Wide Bandgap Power Packaging".
In addition to education-based professional opportunities, IWIPP 2017 will also feature daily plenary sessions from a diverse group of invited industry professionals and technical society leaders, including:
- Alan Mantooth of the Univeristy of Arkansas / IEEE PELS speaking on "Serving Humanity Through a Dynamic Profession – The IEEE Power Electronics Society"
- Bram Ferreira, of the Delft University of Technology, & William Chen, of ASE US, speaking on "Power Packaging Society Roadmapping"
- Cian O'Mathuna of the Tyndall Institute speaking on "Integrated Passives in Power Electronics"
- Eckhard Wolfgang of ECPE speaking on "Ten Years of Robustness Validation Applied to Power Electronics Components"
- Peter Friedrich of Infineon speaking on "Advances in Wide Bandgap Power Devices & their Positioning in Various Applications"
- Chris Bailey of the University of Greenwich – EPSRC speaking on "Design & Modeling"
On Friday morning, IWIPP 2017 will feature an interactive panel session focusing on Modeling & Reliability, in lieu of a third tutorial. This panel is comprised of industry and academic experts from different levels of power packaging, including:
- Andy Lemmon, of the University of Alabama, sharing knowledge on Parasitic Extraction & Modeling
- Patrick McCluskey, of the University of Maryland, sharing knowledge on Reliability Modeling
- Brice McPherson, of Wolfspeed, sharing knowledge on Power Module Modeling
- Chris Bailey, of the University of Greenwich - EPSCRS, sharing knowledge on Mechanical Reliability Modeling
In addition to the invited papers, the conference program will include technical sessions on Systems & Circuits, Power Modules, Packaging & Interconnects, Thermal Management, Sensors & Passives, as well as a Poster Session covering a variety of different packaging topics. Since IWIPP is focused on collaborative research opportunities, it will also feature a limited number of exhibition spaces to select industry suppliers. These exhibition tables will provide participants an opportunity to interact with cutting-edge products and engineering-service suppliers capable of helping achieve their research goals.
The Diamond Industrial Partner for IWIPP 2017 is Wolfspeed, a Cree Company. In addition to sponsoring the daily plenary sessions, Wolfspeed is also supporting the official conference banquet / social event.
The first IWIPP was held in 1998 at the Congress Plaza hotel in Chicago, IL, USA; after the late 90's the conference went on a 16 year hiatus and returned to its Chicago roots in 2015. The 2015 revival of IWIPP was an exciting workshop which focused on cutting edge packaging approaches. The conference was moved to Europe for the 2017, and more supporting organization sponsors were engaged, to broaden the available audience and overall breadth of the event's technical discussion. This year, from April 5-7, the Delft University of Technology in Delft, Netherlands will be hosting the conference. The main conference event will be held in the Aula Conference Center, and the welcome reception will tour the High Voltage Research lab on campus. Early Registration pricing ends on March 1; for registration or partnership inquiries, please contact the IWIPP Organizing committee or visit www.IWIPP.org.
IWIPP 2017 is an opportunity for leaders in all levels of electronics packaging - from early-stage research to volume manufacturing – to meet and collaborate; we hope to see you and hear your ideas in Delft this spring.
Provided by Lauren Kegley, IWIPP 2017 Sponsorship & Publications Chair
Even though the free market rules the business world, government policies and regulations on trade can shape the industry structure. Usually companies prefer more free trade and less government regulation. Companies like access to markets that provide higher revenues and higher profits, while governments like higher employment for its citizens. Sometimes these intentions can be contradictory.
The electronic trade is vastly global. Although products from US companies are prominent and highly visible, most of these products, especially hardware, are manufactured in China. In addition, many components including active and passive devices are manufactured by multi-national companies located in Europe and Japan. From a trade perspective, the United States generally remains the most open country with the least restrictions. The new Trump administration has taken a staunch protectionist stance with its “America First” policy. It has promised to restrict trade by forcing companies to manufacture products in the U.S. to increase domestic employment.
So, what will be the impact of the Trump administration’s policies on the electronics industry? The electronics industry, primarily hardware manufacturing, has moved to China; President Trump has consistently mentioned China as a currency manipulator that is engaged in unfair trade practices and has gamed the system for its own gains resulting in America’s loss. It is true that despite having original and superior product design, America has failed to “scale up the products.” America designs products but China manufactures them. Thus, China’s employment in electronic manufacturing has increased significantly. Though Mr. Trump is addressing this issue today, America’s weakness in mass scale manufacturing was succinctly addressed by the late Mr. Andy Grove, former CEO of Intel. He wrote a landmark article, “How America Can Create Jobs”, in Bloomberg Businessweek almost 7 years ago. Dr. Grove, argued that just having R&D is not sufficient, scaling or mass manufacturing of the product is also important and necessary. He mentioned that “scaling is hard work but necessary to make innovation matter.” In addition, Mr. Grove stated that job creation must be the Number 1 objective of state economic policy. This has been Mr. Trump’s slogan all along, and many will be surprised to find that Mr. Grove’s views expressed in the Bloomberg BusinessWeek article were quite similar to that of Mr. Trump’s today.
On February 8, 2017, Intel’s CEO Mr. Brian Krzanich announced that the company will invest $7 billion in an Arizona plant that will employ 3,000 people. Mr. Krzanich made the announcement during a White House visit with Mr. Trump- but NPR’s Marketplace reported that this decision was 4 years in the making. Though Intel can manufacture its chips in the US, due to its highly-automated processes, most of the electronic hardware manufacturing has moved to China and is not expected to shift back to the United States anytime soon. China remains the global manufacturing center for the electronic hardware, including power supplies.
Will President Trump change this global order with tariffs, duties or quotas?
Apple’s iPhone provides an insight into the strength of Chinese manufacturing. It is not just about low-labor costs, rather China seems to have the entire manufacturing infrastructure in place together with strong government support and fire-in-the-belly attitude when it comes to manufacturing iconic electronic products like Apple’s iPhone.
For insight into Chinese manufacturing, one has to read an excellent article written by Charles Duhigg and Keith Bradsher of the New York Times, about why Apple makes iPhones and iPads in China instead of the United States. The essence of the article is that when Steve Jobs wanted to change iPhone’s screen from plastic to glass, only Foxconn in China could scale up and deliver the product in six weeks in very large quantities. Though the glass itself was made by Corning, a US company, there was no US company that could deliver the product in such high quantities in such a short timeframe. Duhigg and Bradsher reported that the end-to-end process of building the iPhones required 8,700 mid-level engineers. In the United States, Apple estimated it would have taken 9 months to hire these many engineers; in China, it took 15 days. The United States just could not match China’s manufacturing and infrastructure prowess. Within 3 months, Apple sold a million iPhones. Today iPhones are considered one of the greatest products of 21st century that have changed lives of millions of people.
At least in electronics hardware, the US has lost its super mass scale manufacturing to China. Power supplies also reflect this situation with about 70% of power supplies being manufactured in China. Mr. Trump wants to impose a 35% tariff on Chinese goods coming to US. China said it will retaliate. Will this increased tariff suddenly make the US into a mass-manufacturing haven for the electronic goods or just create a devastating trade war?
On February, 9, 2017, in a letter to President Xi Jinping, President Trump called for constructive US-China relationship. The future awaits in suspense.
Provided by Mohan Mankikar,
ubadue Wire is a name that stands for quality. Opened in 1977 by Edwin A. Rubadue, Rubadue Wire is celebrating 40 years of serving OEM’s around the globe. The company started in Southern California and moved to Greeley, Colorado in 1994.
Rubadue Wire is employee owned since 2014, our employee owners are proud to partner with customers and vendors to bring innovative solutions to the marketplace. The company is ISO 9001:2008 and ISO 14001:2004 certified and strives every day for continual improvement.
Rubadue Wire is primarily known for being the first company to design and manufacture Triple Insulated Wire, which revolutionized the way agency requirements for reinforced insulation could be achieved. This allowed engineers to utilize the entire winding window from bobbin wall to bobbin wall with products which meet requirements for IEC 60950, 60601, 61558, 61010 and 62368.
Rubadue Wire offers a wide range of insulations, sizes, types and configurations, with the majority of our products in the high temperature/high dielectric arena. We specialize in fine wire with thin wall applications without limiting our products to that segment. Our products are used in high profile consumer electronics and medical devices. Typical applications for products in medical are for MRI and CT scanners, defibrillators, wireless chargers and thermometers. Other markets include renewable energy, oil & gas, security, automotive and consumer electronics. We offer extensive options in AWM products.
Rubadue recently acquired Kerrigan-Lewis - KL is well-known name in the wire and cable community. Through this acquisition Rubadue now offers a range of uninsulated litz wires, served litz wires, and extruded litz wires.
Our newest products also include a range of 300C offerings as well as CoilBond™ - heat activated self-bonding fluoropolymer.
Rubadue Wire provides sustainable, safe, quality products at competitive pricing that are Performance Driven – Committed to Quality – People Matter.
Provided by Sue Welsh, President, Rubadue Wire
Four members of the Board of Directors are elected at the PSMA Annual Meeting held every year during the APEC conference. Each Director serves a three year term and is eligible to be reelected for one additional term.
In this issue we would like to introduce you to Mike Hayes and Kevin Parmenter who were both elected to their first term in 2015.
Mike Hayes has almost 30 years' experience working in Power Electronics industry & research and is an active member of PSMA. He joined the PSMA Board of Directors in 2015 becoming Vice President in 2016. He currently works at Tyndall, one of Europe's leading research centers and a world leader in PSiP (Power Supply in Package) & PowerSoC (Power Supply on Chip) domains, as an industry orientated program manager covering collaborative projects on power electronics & energy efficiency. He is also Tyndall's representative on the Cork Smart Gateway steering committee. At Tyndall he has secured around $6M in funding (from industry, government & the EU) leading to the creation of over 30 jobs & helping industry partners secure $3M in VC/research funding.
Mike's research activities are in the areas of energy harvesting, WSN (wireless sensor network) for micro-grid & factory efficiency and 3D power electronics packaging. He has an established track record promoting synergies between power electronics, energy harvesting and ICT domains and has written a number of publications, participated in EU studies, presenting & chairing conferences and workshops related to this. Technically he co-ordinates Tyndall energy harvesting and conditional monitoring research activities that has delivered the world's 1st indoor energy harvesting power management solution operating indefinitely in indoor lighting conditions and for 72 hours in darkness. His specialist area is power management solutions (hardware and models) for micro-power energy harvesting & is currently leading a program (MISCHIEF) developing a high efficiency multi-source micro-power energy harvesting PMIC (power management IC) in collaboration with MCCI (Microelectronic Circuits Centre Ireland).
Mike gained 20 years power electronics industry experience at Artesyn Technologies in various process development, power supply design & senior management roles developing custom power supplies for blue chip telecoms companies. A key part of his Engineering Manager role entailed building technical relations with key clients, gaining a technical holistic understanding of the overall system needs and helping clients realize optimized power solutions. During this time there in 1992 he published his M.Eng.Sc. thesis on 'Planar Magnetics for Switched Mode Power Supply (SMPS) Applications'.
Since 2013 Mike is an active member of the PSMA Packaging Committee providing leadership (phase 1)/guidance (phase 2) on the PSMA 3D reports and technology roadmaps. He has also been involved annually in reviewing presentations for APEC industry sessions and is PSMA's representative on the IWIPP steering committee for 2017. Mike chaired the Packaging and Manufacturing session of international workshop PwrSoC2014 and presented the PSMA 3D technology roadmap at an ECPE (European Centre for Power Electronics) workshop in 2015.
Mike resurrected the PSMA Energy Harvesting committee in Oct 2015 taking a system application oriented approach and putting an initial focus on data gathering ultra-low power (ULP) devices such as wireless sensors. The committee has held 2 webinars in 2016 (one with IEEE PELS) and will have an Energy Harvesting Industry Session at APEC 2017.
He has a passion & belief that commercialization of existing and emerging technologies can be accelerated through system integration getting stakeholders from various disciplines to collaborate. To do this requires articulation of the benefits to all power electronics stakeholders as well as providing an ecosystem to foster such collaboration. PSMA has a major role to play here & Mike leverages from his experience and network to help identify, promote & drive industry/academic synergies at an international level particularly between packaging & manufacturing & between ICT, energy harvesting & power management.
Provided by Senior Program manager, ICT for Energy Efficiency, Tyndall National institute
Kevin Parmenter, Vice President of Applications North America at Excelsys Technologies, has a career spanning over 30 years in the electronics and semiconductor industry. A long-time member and now Senior Member of IEEE, Kevin frequently speaks at technology tradeshows and has authored many technical articles and guest columns for industry publications. Currently, he is Chair of the PSMA's Safety and Compliance Committee and is a past president of the organization. He also was General Chair of APEC 2009.
Kevin has held positions at Freescale Semiconductor, Fairchild Semiconductor, ON Semiconductor and Motorola Semiconductor Products Sector. He was previously Director of Advanced Technical Marketing (digital power products) for Exar.
Kevin has a B.S.E.E. from Purdue University and B.S. in Business Administration from Colorado Technical University. He holds both Amateur Extra class F.C.C. license and an F.C.C. Commercial Radiotelephone License.
Provided by Kevin Parmenter, Vice President of Applications North America, Excelsys Technologies
incoln International is pleased to present you with the latest Solar Energy Stock Index from our Global Renewable Energy Group. This will provide you with:
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This data is included with the permission of Lincoln International. For more information, you may contact John McManus (firstname.lastname@example.org) or the Association Office.
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Powerbox, one of Europe’s largest power supply companies and a leading force for four decades in optimizing power solutions for demanding applications, has announced that Chief Marketing and Communications Officer Patrick Le Fèvre will present a paper on the subject of ‘smart grid security’ at the Applied Power Electronics Conferences (APEC).
Involved from the very early days with projects to add communication and intelligence to power supplies - which became known as “Digital Power” - Patrick Le Fèvre has frequently been asked about software security and how prepared the power supplies industry is to address such issues.
Although there is very little risk of a hacker reaching a single digital-POL at board level, the security risk increases exponentially as we move upward in the value chain, and in doing so the smart grid is probably the highest and the most exposed to attacks.
In February 2016, the US Department of Homeland Security (DHS) issued an alert, reporting a case that had happened in December 2015 in Ukraine, raising the information to a high level of attention by smart grid operators, motivating them to accelerate protection mechanisms and to develop preventative actions policies.
In his presentation, Patrick Le Fèvre will go through the history of the smart grid and talk about different cases that illustrate the growing threat, as well as explaining initiatives that will make the grid better protected against attacks. Step by step, the worldwide smart grid is getting stronger and safer, although the potential for threats remains high.
Join us at APEC (26 – 30, 2017 in Tampa, Florida) to meet our experts and to listen to Le Fèvre’s presentation on Thursday 30th of March, Industry Session 20 ‘Energy Management – Smart Micro-grid’.
BitCloud 4.0 Complete zigbee Software Development Kit is Available Now
The industry’s first zigbee alliance certified zigbee® platform with zigbee PRO and Green Power features (formerly known as zigbee 3.0) from a semiconductor company is now available from Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. With greater interoperability and lower latency than ever before, this software stack, and corresponding BitCloud 4.0 software development kit, is ideal for the design of home automation, commercial lighting, smart energy and Internet of Things (IoT) applications. For more information about the complete software development kit, visit: www.microchip.com/bitcloud.
The zigbee certified solution enables cross-functional device support and will be backward-compatible with existing zigbee certified products for seamless interoperability. Along with the zigbee PRO (2015) feature set, developers can expect to find features such as low latency suitable for RF remote applications, mesh networking for large networks such as lighting applications, and the Green Power benefits of an energy harvesting switch.
The zigbee PRO Green Power feature, making its debut on the new certified software stack, enables battery-less devices to securely join a network while leveraging eco-friendly energy sources such as light, vibration or motion. Additionally, zigbee Light Link and zigbee Home Automation device types are now fully supported.
“We’re proud to be the first silicon manufacturer to offer a zigbee certified platform with zigbee PRO and Green Power features,” said Steve Caldwell, vice president of Microchip’s Wireless Solutions Group. “With both our hardware and SDK, we’re able to provide best-in-class functionality for a wide range of applications from large-scale commercial lighting to ultra-low power battery-less devices.”
“Having a long-standing member company like Microchip continue to invest in the creation and commercialization of new platforms based on our latest standards shows the strength of the zigbee market,” said Victor Berrios, Vice President of Technology, zigbee alliance. “This zigbee platform enables developers to create new, ground-breaking and interoperable designs for connected applications.”
PSMA is pleased to announce that it is co-sponsorship of IWIPP 2017 (INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING) along with IEEE PELS, ECPE, CMPT & DEIS. The workshop will be held on April 5-7, 2017 at Delft Technical University, in the Netherlands.
The purpose of the workshop is to bring together researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to rapidly promote the development and commercialization of high-density and high-efficiency power converters. Technical Papers ranging from core material technologies to power converters are sought that address important challenges and present solutions to increase reliability and manufacturability of power electronic components and systems while targeting increased performance and reduced system cost. This workshop is an opportunity to engage in a meaningful discussion about the latest technologies and techniques ongoing in both industry and academia, ensuring that a cooperative learning environment is fostered for all.
The conference has moved from the US to Europe for 2017 with more supporting organization sponsors (such as PSMA) engaged to broaden the available audience and overall breadth of the discussion. The co-sponsors have collaborated to form a technical and steering committee for the event and are encouraging their members and affiliates to participate.
PSMA will be heavily involved with the packaging portion of the workshop, where there are clear synergies and common areas of interest. We encourage our members to consider challenges from materials and devices through systems (thermal mechanical, interconnect, reliability, manufacturability…etc.) and welcome engagement across all disciplines. Industry partnership and exhibit space are also available to spur a unique blend of academia, research, and industry collaboration throughout the event.
Key dates for the workshop are as follows:
Abstract Submission: December 2, 2016
Notice of Acceptance: December 16, 2016
Final Paper Submission: February 3, 2017
Further details can be found at iwipp.org/conference/call-for-papers/
General Chair: Ty McNutt | Wolfspeed
Technical Chair: Patrick McCluskey | Univ. of Maryland
Local Chair: Bram Ferreira | TU Delft
Finance: Shashank Krishnamurthy | UTRC
Sponsors & Publications: Lauren Kegley | Wolfspeed
Powerbox (PRBX), one of Europe’s largest power supply companies, and a leading force for four decades in optimizing power solutions for demanding applications, announced the addition of Fusion Sourcing Group as one of their manufacturing sales representative partners on the East Coast. Headquartered in NJ, with local offices in NY, NJ, Eastern PA, DE, MD, and VA, Fusion Sourcing Group brings to PRBX an immediate extended reach of highly capable, highly motivated, specialized power electronics sales professionals, who share in our common mission – to build lasting relationships with customer partners who value creative solutions to challenging power conversion problems in demanding applications.
According to Christopher Lins, Powerbox Vice President of Sales – North America, “Building a strong PRBX business in North America depends upon building strong partnership relationships with existing and potential customers. The pace at which we are able to accomplish this task is largely dependent on the pace at which we are able to find qualified opportunities in our target markets at the right time. The Fusion Sourcing Group team is laser-focused on power electronics. I am highly confident our combined efforts will offer customers a compelling safe-harbor in a sea of competing forces. When all you do is power, it matters.”
Adds Martin Sjöstrand, Powerbox CEO, “We are thrilled by this partnership, which by adding Fusion Sourcing Group local market knowledge, power product expertise, and a team of highly skilled sales professionals, will benefit all of our customers by bringing differentiated power solutions to their demanding applications.”
Gary Chessen, President of Fusion Sourcing Group, stated, "Powerbox' concentration on defining and creating innovative power solutions tailored to customer needs is a perfect addition for Fusion Sourcing Group in our mission to 'Be a Resource' for the customers we serve. Fusion's long-term commitment and history in the power electronics market place, coupled with Powerbox' extensive capabilities portfolio and product line up, puts us in a great position to meet our customers' requirements for current and future generations of products and applications. We are excited to be on board!"
ON Semiconductor Granted Trusted Test Status, Enhancing Credentials to Support U.S. Military and National Security Applications
Trusted Test complements company's existing Trusted accreditations, allowing ownership of end-to-end Trusted supply chain for its customers
ON Semiconductor, driving energy efficient innovations, has been granted Trusted Test status for its Pocatello, Idaho facility through the Department of Defense's (DoD)'s Defense MicroElectronics Activity (DMEA) accreditation program. The award adds to ON Semiconductor's existing Trusted Foundry, Trusted Design and Trusted Broker accreditations and improves overall program efficiency for Trusted projects, resulting in important customer benefits, including improved cycle time and reduced program costs.
Trusted Test Accreditation expands ON Semiconductor's commitment to the Trusted process flow, from design through product shipment, providing more control over Trusted supply chains. Combined with its Trusted Design and Trusted Foundry services, customers can also benefit from the company's Trusted Broker status where it will manage part or all of the complex Trusted services.
The accreditation program is part of the DoD's strategy to ensure that electronic components used in U.S. military and national security applications are trustworthy and secure. An assured "chain of custody," supply chain integrity, and prevention of tampering are critical for Application Specific Integrated Circuits (ASICs) used by national security agencies. A key part of the Trusted Foundry program is that it uniquely provides the U.S. Government with guaranteed access to leading edge trusted microelectronics services for low volume applications. ON Semiconductor's accreditation further demonstrates their investment in, and commitment to, meeting these stringent government requirements.
"The addition of Trusted Test Accreditation further demonstrates the high quality and security of our facility, processes and products," said Vince Hopkin, senior vice president, Digital and DC/DC division at ON Semiconductor. "Combined with previously awarded Trusted Foundry, Design and Broker accreditations, it allows us to offer improved project execution at reduced costs for new Trusted programs."
For more information, visit www.onsemi.com.
Positronic, a global manufacturer of high reliability electronic connector products based in Springfield, Missouri, USA, has appointed Powell Electronics as an authorized distributor for the full line of Positronic products in the North America market.
“We are pleased to establish a formal partnership with Powell Electronics, knowing their long-standing reputation and expertise for service and distribution in our industry”, states Positronic President and CEO, Mr John Gentry. “Powell is an excellent fit for us and a significant part of our channel to market strategy going forward,” he added.
According to Powell CEO, Mr Ernie Schilling, Jr, “Powell is honored to be a Positronic channel partner. We believe the synergies and similarities in corporate culture and shared market focus will lead to a very effective and successful engagement.”
Powell Electronics is now authorized to sell the entire Positronic connector product offering, which includes power and hybrid, D-sub, rectangular, modular and circular connectors. Many configurations of these series types will be stocked in the Powell Electronics warehouse in New Jersey and available for immediate shipping. Customized or tailored solutions are available as well.
Visit www.connectpositronic.com for more details.
ON Semiconductor Imaging Technology Plays Integral Role in World's First Multi-Aperture Computational Camera
Space saving, power-efficient customized image sensors prove instrumental in bringing performance and functionality normally associated with DSLRs into smartphone size designs
ON Semiconductor, driving energy efficiency innovations, has drawn on its extensive expertise in image sensor technology to help support Silicon Valley start-up Light. The company has provided Light with key imaging hardware for its game-changing L16 camera solution, which utilizes advanced computational processing to set new performance benchmarks.
ON Semiconductor recognized very early on that there would be an adoption of a multi-sensor approach to imaging within the consumer imaging markets. This has now been validated, with several dual camera systems. The Light L16 takes this trend much further, employing 16 image sensors that are distributed across the front surface of the camera to present the user with a light capture area equal to, or even exceeding, that of many digital single lens reflex (DSLR) cameras currently on the market. The L16 thereby enables dramatic improvements in resolution and optical zoom, while remaining aligned with the streamlined form factors of the handsets.
Through close collaboration with Light, ON Semiconductor was able to supply specially customized sensor devices, based on its 1/3.2-inch format AR1335 CMOS image sensor product offering. These had the cutting-edge pixel technology and inherent compactness necessary to meet both the unique configuration and elevated operational demands of the L16. With up to 10 sensor devices capturing image data simultaneously, this solution delivers an impressive 52 megapixel (MP) resolution, plus over 5X optical zoom without any degradation in image quality.
"Leveraging ON Semiconductor's deep imaging heritage and proven industry-leading technical capabilities to support the innovative ideas of an exciting start-up is a powerful combination," said Taner Ozcelik, Senior Vice President and General Manager of ON Semiconductor's Image Sensor Group. "For the L16, we leveraged our extensive product portfolio that covers a wide range of optical formats and resolutions for scientific, industrial, space, automotive and consumer sectors."
"Light is pleased to have worked with ON Semiconductor on the L16 camera. The input from their experienced engineering team has shown itself to be invaluable in the development of this camera," states Dr. Rajiv Laroia, co-founder and CTO of Light. "Thanks to their efforts we have been able to design a compact, power efficient image sensor subsystem that is fully optimized for our specific needs. This is the first commercially available imaging solution to contain such a large array of image sensing devices, and we expect it to have a major impact on the photography industry."
For more information, visit www.onsemi.com.
Driving new efficiencies through automotive electrification
Imagine electric cars dropping us off at our destinations, and then directing themselves to parking spaces to quickly recharge until needed again. Imagine these self-driving cars operating with zero-emissions throughout our cities, communicating with themselves and the infrastructure, while providing passengers with safety, comfort and convenience. Advanced electronics are driving many changes in automobiles to enable this vision.
Download and learn about:
- Trends and challenges with the changeover to electric vehicles (EVs), hybrid-electric vehicles (HEVs) and electronically assisted combustion engines.
- Technology requirements for a wide range of electrical/combustion configurations
- A dual 12-/48-V architecture for both battery-operated and power-hungry applications throughout the car
- Other advancements, including high-voltage technology, circuit isolation and GaN
Download at www.ti.com.
Non-Isolated Digital Point-of-Load Standard for 60 A Current Range Published by Architects of Modern Power®
New ‘gigaAMP™’ standard builds upon previous standards released by AMP Group for non-isolated platforms
The Architects of Modern Power® (AMP Group) consortium today announced an additional standard aimed at establishing common mechanical and electrical specifications for the development of advanced power conversion technology for distributed power systems. The ‘gigaAMP™’ standard, introduced to provide a higher current option in a land-grid array (LGA) footprint, builds on the previously-released ‘picoAMP™’ standard, published in September 2015, which defined standards for a lower range of non-isolated platforms ranging from 6 A to 18 A. The 60 A ‘gigaAMP’ standard defines a compact footprint of 25.1 x 14.1 mm in an LGA format.
The new ‘gigaAMP’ standard also adds to the previously released ‘teraAMP™’ standard for non-isolated digital point-of-load (POL) dc-dc converters, released in February 2015, and the ‘microAMP™’ and ‘megaAMP™’ standards released during electronica in November 2014. The first products to meet with this new ‘gigaAMP’ standard will be announced by AMP Group® members later in the year.
“The ‘gigaAMP’ standard is a continuation of the AMP Group’s efforts to establish industry standards that cover every aspect of board-level digital power technology,” stated Martin Hägerdal, President of Ericsson Power Modules. “And the addition of this new standard at 60 A helps to further address the growing demands on performance, complexity and flexibility in intelligent power supply infrastructures,” added Steve Pimpis, President & CEO of Murata Power Solutions.
The Architects of Modern Power consortium formed in October 2014 is an alliance between CUI, Ericsson Power Modules and Murata with the objective of providing the most technically advanced, end-to-end solutions with a complete ecosystem of hardware, software and support. Whereas other power supply standards groups are only focused on the mechanical specifications of board mount power supplies, the AMP Group has realized that the standardization of monitoring, control and communications functions, and the creation of common configuration files for plug-and-play interoperability will define the future of intelligent distributed power systems.
he world market for merchant power supplies is rose 3.9 percent year over year to reach $19.7 billion in 2015. Growth is expected to remain flat in 2016, before stabilizing to modest growth from 2017 to 2020. IHS Markit forecasts that the market will reach $23 billion in revenue by 2020.
AC-DC Non-Commodity Market to Exceed AC-DC Commodity Market in 2016
IHS Markit splits the market into “commodity” high-volume consumer power supplies and lower-volume “non-commodity” power supplies, in order to improve the clarity of the analysis.
The AC-DC non-commodity market is projected to be the fastest-growing market on a revenue basis from 2015 to 2020, with a compound annual growth rate (CAGR) of 9.2 percent, according to the IHS Markit Power Supplies Intelligence Service. The increase will be driven by strong growth in the lighting and military and aerospace markets, in particular. In 2016 the AC-DC non-commodity market is expected to exceed the AC-DC commodity market in revenue, becoming the largest merchant power-supply market by type.
Revenue for the AC-DC commodity market peaked in 2015, as demand declined in key commodity applications -- in particular, power supplies for computer and office and mobile devices and chargers.
Revenue for the DC-DC converter market is estimated to have grown by almost 4 percent in 2015. Much of this growth was driven by the server, networking and the military and aerospace markets. Growth is predicted to slow from 2016 to 2020, as demand for some segments of end-equipment weakens – particularly, cellular infrastructure.
LED Lighting Leads Growth in Non-Commodity Power Supplies
Lighting is projected to be the fastest-growing application from 2015 to 2020. The market for merchant power supplies in lighting applications is estimated to have been worth $1.26 billion in 2015, which accounted for 6.4 percent of total market revenues. The lighting market for power supplies is projected to increase to $5.2 billion in 2020 as LED lighting adoption penetrates the commercial markets.
Provided by Victoria Fodale,
Power Magnetics @ High Frequency
Transforming the Black Magic to Engineering
Date: Saturday March 25, 2017
The PSMA Magnetics Committee and IEEE PELS are organizing the second “Power Magnetics @ High Frequency – Transforming the Black Magic to Engineering” workshop to be held on Saturday, March 25, 2017 - the day before and in the same venue as APEC 2017 at the Tampa Convention Center.
The organizing committee is currently working on the specifics for the workshop structure and the presentations. The primary focus of the workshop is to address the latest improvements in magnetic materials, coil (winding) design, construction and fabrication, evaluation and characterization techniques and modelling and simulation tools so as to target the advancements that are deemed necessary to meet the evolving market needs. The technical expectations and requirements for higher application frequencies and emerging topologies are being driven by recent advances in circuits topologies and semi-conductor devices to satisfy new market applications.
The target audiences for the workshop include the designers of power magnetic components for use in electronic power converters to achieve higher power densities, specific physical aspect ratios such as low profile, higher power efficiencies, improved thermal performance etc. Other target audiences are the manufacturers of magnetic materials and magnetic structures, the fabricators of magnetic components, the providers of modelling and simulation software as well as the manufacturers of test and characterization equipment who are all critical participants in the supply chain for the power magnetics industry.
The agenda of the workshop is designed so that there will be keynote presentations by invited speakers followed by question and answer forum addressing the latest trends in:
- conductor geometries and magnetic core geometries for reducing physical size while minimizing ac power losses
- magnetic materials
- design and fabrication (manufacturing) techniques
- design techniques, simulation tools and modelling
- power conversion topologies and applications driving the reduction of the physical size while improving the efficiency of power magnetics technologies
The keynote presentations will be followed by an interactive session of table top technology demonstrations each addressing specific technical disciplines and capabilities consistent with the workshop agenda. The session will begin with a brief overview and mapping of up to nine technology demonstration stations. Current plans are for each technology demonstration station to provide a ten-minute presentation. Interaction between the attendees and the presenters will be encouraged during this portion of agenda as a segue from the opening keynote presentation and the technical issues session which will follow. The technical disciplines expected to be displayed during the technical demonstration session include:
- AC power loss measurements
- Core loss modelling and/or simulation with empirical verification
- Inductor modelling supported by empirical verification
- Near magnetic field measurements
- Thermal measurements
- Impedance measurements
- Engineering methodology specific to new structures and/or magnetic materials including both modeling and verification
- Roadmaps addressing the needs of the power magnetics industry
- Standardization activity addressing any of the above topics
The third session of the workshop will be a technical issues session. Three potential technical issues have been proposed based upon responses to the attendee survey conducted after last year’s workshop. These are:
- engineering magnetic materials and structures for emerging applications,
- engineering, physical, electrical and thermal integration of magnetics into power supplies, and
- engineering technical and manufacturing trade-offs to include safety agency requirements during commercial product development.
The presenter for each technical issue will provide typical traditional engineering solutions and discuss several alternative engineering approaches to the technical issue before focusing on the solution that they will propose.
The fourth and final session is currently planned to be a combination of a wrap-up session followed by small focus group discussions. The first portion of this session would be identification of items to be addressed by a roadmap for the magnetics industry covering de-facto industry practices and standards and emerging trends as well as both short term goals covering incremental improvements and longer term evolutions that are on the horizon. The second portion of this session will allow additional interaction between the attendees and the presenters on a one on one or in small focus groups.
The organizing committee welcomes suggestions for specific topics that would be of general interest to the magnetics and the power industries. In addition, the committee welcome proposals for participating as a presenter in the technical demonstration session and proposals for technical issues that should be addressed. Please contact email@example.com with your suggestions and proposals or contact Matt Wilkowski of the organizing committee at firstname.lastname@example.org.
The latest information on agenda as well as registration information for the workshop will become available on the PSMA website over the next few months at: www.psma.com/technical-forums/magnetics/workshop .
Steve Carlsen, Raytheon Systems Company
Rodney Rogers, VAC Magnetics LLC
Fred Weber, Future Technology Worldwide
Chuck Wild, Dexter Magnetic Technologies Inc.
Matt Wilkowski, Altera
PSMA Offers Power Supply Safety & Compliance Database as Free Resource for All Industry Professionals
On-line database provides comprehensive review of international operational, environmental and safety standards; access offered free to PSMA members and non-members
The Power Sources Manufacturers Association (PSMA) announces the availability of a new on-line Safety & Compliance Database. The continually updated resource lists the many state, national and worldwide organizations currently active in establishing and maintaining safety, electromagnetic compatibility, material toxicity and environmental standards for power supplies used in commercial applications. Recognizing the database as an invaluable tool for power electronics industry professionals, the PSMA is offering it free of charge to both PSMA members and non-members alike.
Intended users of the Safety & Compliance Database are those who design power systems for products that will be offered in the global marketplace, and who therefore need to comply with current and evolving safety and standards for their target markets. The database can be searched by specific applications; giving the most recent status of standards, identifying key documents, meetings and milestones associated with each standard, and providing links to the appropriate websites of controlling organizations.
“As companies design their new products for global markets, they have to grapple with current, new – and sometimes conflicting – safety standards and regulations,” reported Kevin Parmenter and Jim Spangler, co-chairs of the PSMA Safety & Compliance Committee. “Our new Safety & Compliance Database provides a vital resource for engineers and product planners as they keep abreast of standards, including ongoing activities, proposed changes and updates, and information on the latest versions.”
The PSMA contracted with Anagenesis Inc. to create and provide continual updates to the database. Interested users can opt in to receive weekly email alerts about new information and changes. The database also features the ability for users to request permission to direct and track information on emerging standards, which enables the database to evolve and improve.
The Safety & Compliance Database is easily accessible from the Quick Links on the upper right of the PSMA homepage or the Safety Database tab of the Safety & Compliance Technical Forum. Anyone who already has an account on the PSMA website, just needs to log in to access the database. Those who have not yet registered must follow an easy registration process to request access.
ON Semiconductor Joins Automotive Equipment Supplier Association That Champions Business Interests of Members
Enables Closer Collaboration on Important Policy Issues, Such as Advanced Driver Assistance Systems
ON Semiconductor, driving energy efficiency innovations, today announced that it is joining the Original Equipment Suppliers Association (OESA), which champions the business interests of more than 430 member automotive suppliers. All members also belong to the parent Motor and Equipment Manufacturers Association (MEMA), which represents more than 1,000 companies from both the original equipment and aftermarket segments of the light vehicle and commercial vehicle industries.
Joining these organizations enables ON Semiconductor to work more closely with its customers on the policy issues that matter to the automotive industry, such as the promotion of advanced driver assistance systems (ADAS). MEMA estimates that ADAS technologies alone have the potential to prevent 30 percent of all crashes, and ON Semiconductor is a leading supplier of the components that are used in these systems.
"As the No. 2 ranked non-microcontroller automotive semiconductor supplier, we have long recognized the importance of working closely with customers to promote the policies and technologies that will advance innovation in vital areas like safety and sustainability," said Lance Williams, vice president of automotive strategy and OEM development at ON Semiconductor. "OESA and MEMA are two of the automotive industry's most well respected trade associations, and we look forward to expanding our collaborations with their more than 1,000 member companies."
About OESA and MEMA
The Original Equipment Suppliers Association (OESA) champions the business interests of more than 430 member organizations. Since 1998, the association is committed to addressing issues of common concern throughout the supply chain, and advocating on behalf of the automotive supplier community. OESA strives to foster collaboration throughout the supply chain and help members make critical business decisions. Through industry events, peer group councils, research and analysis, OESA provides relevant, timely and unique information and resources to and for the automotive supplier industry.
OESA is one of four divisions of the Motor and Equipment Manufacturers Association (MEMA). MEMA is the trade association for motor vehicle and mobility suppliers and parts manufacturers and remanufacturers. Its members supply both the original equipment and aftermarket segments of the light vehicle (car and truck) and commercial vehicle (on- and off-road) industries. MEMA serves the industry as the voice of the motor vehicle and mobility supplier industry, speaking out on behalf of the largest manufacturing sector in the United States.
For more information, visit www.onsemi.com.
Power Magnetics @ High Frequency- Solving the Black Magic!
Date: Saturday March 19 2016
APEC 2016 Long Beach California
he inaugural “Power Magnetics @ High Frequency – Solving the Black Magic!” workshop sponsored by the PSMA Magnetics Committee and IEEE PELS was held on the day before APEC 2016, Saturday March 19, 2016 from 7:00 AM thru 5:00 PM in Long Beach California.
The workshop has been described by a number of attendees as an unprecedented number of magnetics expertise in a single meeting. The number of workshop attendees was 130+ with about 85% of the attendees from industry and 15% of the attendees from academia/research. The agenda of the workshop included panel discussions and technology demonstrations to supplement traditional lecture type presentations which led to high energy dialogue between the attendees and the invited experts throughout the workshop.
The purpose and the focus of the inaugural workshop was to:
- identify the latest improvements in areas of magnetic materials, coil (winding) design, construction and fabrication,
- identify, discuss and demonstrate evaluation and characterization techniques as well as modelling and simulation tools needed to meet the technical expectations and requirements for power magnetics operating at higher frequencies
- identify and discuss the technical expectations and requirements of higher application frequencies and emerging topologies that are being driven by continuous advances in circuits topologies, semi-conductor devices driven by new market applications.
Many thanks to the invited presenters and panelists which included Dr. Charles Sullivan (Dartmouth), Dr. David Perreault (MIT), Dr. Ray Ridley (Ridley Engineering), Bruce Carsten, Dr. Khurram Afridi (University of Colorado, Boulder), Jenna Pollack, James Lau (CWS), Mark Christini, (Ansys), Len Crane (Coilcraft), Ruska Patton (EMSCAN), Colin Warwick (Keysight Technologies), Mike Wens (MinDCet), Tom Wilson (Simplis Technologies), Jason Cuadra (Transphorm), Rodney Rogers (Vac Magnetics), J. C. Sun (Bs&T Technologies), Cem Som (Wurth Elektronik), Chuck Wild (Dexter Magnetics), Joel Salas (Ferroxcube), Anuj Sharma (Hitachi), Chris Oliver (Micrometals), Brian Hatley (Miles Platts), Kyle Jensen (Rubadue Wire).
Based on post workshop survey results, the High Frequency Magnetics workshop series will continue, and plans are for a second workshop in conjunction with APEC 2017 in Tampa Florida. In an effort to increase the interaction during the second workshop, an increased emphasis on the technology demonstration sessions will be pursued so as to increase the “hands on” and “how to” dialogue. The second workshop will also continue to drive efforts to improve the characterization and specification of magnetic materials and magnetic core to support the power electronics industry and identify efforts to move the industry forward in terms of magnetic material and magnetic structure development.
Anyone interested in participating as a presenter or as part of the technology demonstration session during the workshop in Tampa Florida should contact Matt Wilkowski (email@example.com). We are looking forward to the second workshop and driving the industry forward to meet the expectations of the workshop attendees.
Steve Carlsen Raytheon
Ed Herbert Independent Inventor
Rodney Rogers VAC Magnetics LLC
Matt Wilkowski Altera
he total market for power semiconductors based on wide-band-gap materials, such as silicon carbide (SiC) and gallium nitride (GaN), is forecast to pass the $1 billion mark in the next five years. Energized by demand from hybrid and electric vehicles, power supplies, and photovoltaic (PV) inverters, global revenue from SiC and GaN power semiconductors is projected to rise to $3.7 billion in 2025, up from just $210 million in 2015, according to IHS Inc., the leading global source of critical information and insight. Revenue is projected to grow with a double-digit annual growth for the next decade.
All AC-DC power supplies rated at 75 watts (W) and above, and power supplies used in lighting applications rated at 25W and above, are required to include power factor correction (PFC), according to the latest IHS SiC & GaN Power Semiconductors Report. SiC devices, starting with SiC Schottky diodes, have generally only been used in the power factor correction circuit for AC-DC power supplies. The use of SiC Schottky barrier diodes in power supplies, particularly in the power factor correction (PFC) stage of AC-DC power supplies, has been increasing rapidly. The main benefits of using SiC diodes is that faster switching can be achieved, resulting in lower power conversion losses and increased power density.
In contrast to SiC, GaN power semiconductors may offer a viable competitor to silicon diodes and transistors across a full range of high and low voltages; and they could be used in all areas of power-supply design. Although GaN devices could potentially be used in more power supplies eventually, they will not account for the majority of SiC and GaN revenue in the power supply application, over the next 10 years. In fact, revenue from GaN sales comprise less than a third of total revenue in 2025.
Most single-phase electricity mains power supplies in consumer and office equipment typically use 600V–650V devices, making them an ideal target for GaN power transistors. However, apart from telecommunications and server supplies with special requirements, these power supplies will most likely continue to rely on Si semiconductors. Industrial three-phase mains power supplies requiring 1200V-rated devices are better suited to SiC technology.
Since IHS began studying the SiC and GaN power market in 2009, GaN Schottky diode development has almost completely stopped, because GaN diodes do not offer very compelling benefits over Si Schottky diodes below 600V. It has proved too costly to develop GaN diodes to the point where they could be made price competitive with silicon diodes. Furthermore, SiC Schottky diodes are considered to have adequate performance and a competitive pricing roadmap. The first GaN Schottky diodes are not expected to be commercially available before 2020, at the earliest.
The forecast shown in the figure below summarizes specific power supply applications: computing, telecommunication, consumer devices, and all other power supplies. For the sake of consistency, device prices and their declines are assumed to be the same for each power supply application.
Computing Power Supplies
An average of over 15 percent of all computing power supplies contained PFC circuitry in 2015, but this proportion is expected to decline – falling to less than 7 percent in 2025. As equipment power efficiency improves over time, shipments of commodity power supplies for computing applications without PFC circuits are expected to grow faster than non-commodity power supplies with PFC circuitry.
Computing and server power supplies will be the most valuable sector for wide bandgap semiconductors, because the efficiency benefits will provide the best energy cost savings in this application sector.
Telecommunication Power Supplies
Of these areas, backbone, networking equipment and cellular phone infrastructure employ PFC in most power supplies used. Base-station power supplies usually have 48Vdc outputs and are commonly known in the market as “48V rectifiers.”
Many power supply vendors have already been using SiC Schottky diodes in the PFC circuits for years. There is interest in wider adoption of SiC and GaN devices in the future, as increased switching frequency and efficiency improvements appear possible. However, this increase in adoption is not predicted to happen until reliability is proven and prices fall to roughly double those of the silicon discretes they replace.
In contrast, the adoption of GaN power transistors is only just beginning. GaN power devices offer many of the same advantages over silicon as SiC devices; but they should, in theory, cost less than SiC power devices. However, GaN is a much newer technology, with far less life-test data to prove reliability. The first high-end switch-mode power supplies for telecom and data center applications using GaN transistors will start mass production in 2016.
Consumer Electronics Power Supplies
Of these products, approximately 13 percent employed power factor correction (PFC) in 2015. Again, this proportion is expected to decline slowly, falling to under 10 percent in 2023, as equipment becomes more power efficient and fewer power supplies exceed the 75W threshold above which PFC is required. Only 1 percent of power supplies in consumer electronics use DC-DC converters.
Other Power Supplies
Less than 3 percent of power supplies for products, other than those listed above, used PFC in 2015, but the proportion of “other” power supplies requiring PFC is expected to increase to 6 percent in 2025. Shipments of power supplies for lighting applications, which require PFC above 25W output, are forecast to grow faster than other applications in this group. Fewer than 2 percent of power supplies in “other” applications use DC-DC converters.
Although the market for power supplies for “other” applications is very large, only a small proportion require PFC. Like consumer electronics, adoption of SiC and GaN power semiconductors will remain very low until device prices fall close to parity with Si MOSFETs and IGBTs.
IHS estimates that revenue from SiC and GaN power semiconductors used in power supplies exceeded $100 million in 2015, with SiC Schottky diodes accounting for over 80 percent of the total. Sales of SiC MOSFETs, other SiC transistors (including SiC JFETs and SiC bipolar junction transistors) and SiC power modules will increase as the market adopts wide-band-gap semiconductors, but will only increase the total market by a relatively small amount.
In contrast, the device type with the fastest growing market is projected to be GaN power transistors. Prices for GaN transistors are closing in on Si prices, and are anticipated to match Si alternatives in about 2018 or 2019. They are already low enough to trigger power supply manufacturers to start designing in GaN, leading to revenue taking off in 2018. The wide-band-gap market share of GaN power discretes (transistors and diodes) is forecast to rise from 4 percent in 2015 to 24 percent in 2025. The integration of GaN transistors into GaN modules is forecast to cause a rise in module sales to over $22 million (7 percent market share) by 2025.
SiC Schottky diodes will remain the most valuable wide bandgap semiconductor type overall, but their share of the market will fall below 50 percent by 2025, as the total market passes $450 million.
Power supplies are already an important market for silicon carbide, with the power supplies market for SiC devices set to triple in the next 10 years. The power supplies market for GaN devices is forecast to grow from only 5 percent of the market in 2015, to more than 30 percent in 10 years’ time.
Twelve-member board of directors brings together industry leadership and expertise covering the gamut of technological advances impacting the power sources industry
The Power Sources Manufacturers Association (PSMA) is pleased to announce that a new slate of officers has been elected to lead its board of directors for the 2016-2018 term. The new officers are Chairman Eric Persson (Infineon), President Stephen Oliver (Navitas Semiconductor), Vice President Michael Hayes (Tyndal National Laboratories), and Secretary/Treasurer Michel Grenon, (Gaia Converter Inc.).
“Power conversion has emerged as an enabling technology in the electronics industry,” said Ernie Parker, PSMA’s new chairman. “Our Association’s critical work in producing its Technology Roadmap plus the influential work being carried out by PSMA coommittees, including Packaging, Alternative Energy, Energy Harvesting, and many others relies on the active participation of our members. We welcome and encourage all companies in our industry to become part of the organization.”
The twelve members of the board are elected by the member company representatives to serve three-year terms, with four members rotating off each year. In addition to the new officers, the following members round out PSMA’s board of directors for 2016-17:
Dusty Becker, Emerson Energy Systems
Alain Chapius, Bel Power Solutions
Ed Herbert, Independent Inventor
Brian Narveson, Narveson Innovative Consulting
Ernie Parker, Crane Electronics
Kevin Parmenter, Excelsys Technologies
Conor Quinn, Artesyn Embedded Technologies
Donald Woodard, Venable Corporation
Wolfspeed Launches the New SpeedFit Online Circuit Simulation Tool to Help Accelerate SiC Device Evaluation and Adoption
Developed using Plexim’s PLECS web-based simulation platform, Wolfspeed’s SpeedFit online simulation tool is the industry’s only such tool that is 100% dedicated to simulating and evaluating SiC power devices
Wolfspeed, A Cree Company, a leading global supplier of silicon carbide (SiC) power products — including best-in-class SiC MOSFETs, Schottky diodes, and modules — has introduced a free online circuit simulation tool that allows power electronics design engineers to simulate and evaluate the performance of SiC-based power circuits, and to aid in the selection of the optimum SiC devices for each application.
“The SpeedFit™ simulation tool allows designers to determine the right SiC device for their power system in mere seconds, a process that previously required hours examining datasheets and making calculations,” said Guy Moxey, Wolfspeed’s senior director of power marketing. “We’re confident this tool will increase the rate and ease of SiC-device adoption worldwide.”
Developed using the proven PLECS® web-based simulation platform from Plexim, the new SpeedFit circuit simulation tool features a simple, intuitive interface that power electronics design engineers can use to simulate any SiC-based power converter circuit topology: DC/DC, AC/DC, or DC/AC. Users simply input their specific application parameters, and the SpeedFit tool generates a comprehensive analysis of SiC device performance, including: voltage and current waveforms, average switching and conduction losses, and maximum junction temperature for specific operating conditions.
Engineers have the ability to select a topology, specify their recommended SiC power device or choose one from the library, define their thermal interface parameters and cooling method, and see the results immediately. The Speedfit simulation tool also allows users to specify external gate resistance, as well as major passive component values present in the circuit, allowing them to compare performance results for several different circuit configurations and devices. The tool quickly, easily, and accurately summarizes system parameters, device part numbers, and simulation results in a single, concise report.
“Since the SpeedFit simulation tool was successfully developed using our widely-adopted simulation engine, Wolfspeed has made files containing loss and thermal impedance information for their SiC devices available on their website so current PLECS platform users can download and access models for Wolfspeed™ SiC power devices,” said Kristofer Eberle, business development manager, Plexim. “Our PLECS Standalone tool features a free demo mode that provides access to a collection of pre-built designs, and can be accessed, along with free PLECS trial licenses for custom model development, on the Plexim website.”
Power electronics design engineers can access the free SpeedFit simulation tool now at www.wolfspeed.com/speedfit.
Course helps students understand connected embedded systems from microcontroller to cloud
Imagination Technologies (IMG.L) and Microchip Technology, together with Digilent Inc. announce the Connected MCU Lab, a new course developed through the companies’ respective university programs. The semester-long curriculum, available to universities worldwide, is designed to be an introductory and first microcontroller (MCU) class taken by undergraduate electronic engineering and computer science students. It delivers an interactive and compelling start to connected embedded systems education – covering MCUs and input/output (I/O), real-time operating system concepts, advanced MIPS processor architecture and cloud connectivity – all presented in a fresh and jargon-free style.
The Connected MCU Lab takes a hands-on approach, leveraging a Wi-Fi® enabled development board, tools, software, and cloud services – everything needed to design innovative Internet of Things (IoT) solutions. Lessons are based around the chipKIT™ Wi-FIRE board from Digilent Inc., which uses Microchip’s popular PIC32MZ MCU incorporating a 32-bit MIPS M-Class CPU from Imagination. A chipKIT Basic I/O Shield is used for expansion along with a PICkit™ 3 In-Circuit Debugger from Microchip. Teachers and students have free access to professional software tools including MPLAB® X Integrated Development Environment, MPLAB XC32 C compiler, and MPLAB Harmony Software Development Framework from Microchip, as well as Imagination’s cloud technologies.
The Connected MCU Lab curriculum, authored by Dr. Alexander Dean of North Carolina State University, includes presentation slides for each module, student guide, exercises, tests, solutions, and an Instructor’s Guide.
Says Robert Owen, manager, Worldwide University Programme at Imagination: “The need for internet connectivity and the demand for ease of development are rapidly driving the embedded world towards 32-bit MCUs. As a result, the next generation of embedded system designers and developers need to understand the techniques of connecting embedded systems to the cloud. This is an urgent teaching requirement as many college courses today are still using 8-bit and 16-bit MCUs. The Connected MCU Lab course makes it easy to give the next generation of engineers the skills they need. The 32-bit MIPS CPUs at the heart of Microchip’s popular PIC32 MCUs are ideal for teaching and projects, and the Wi-FIRE board is powerful enough to support very ambitious projects, enabling this course to provide a foundation on which students can grow throughout their degree.”
The MIPS CPU IP core in the PIC32 MCU is part of the same family as “MIPSfpga,” a soft IP core used in many computer architecture and SoC courses, thereby creating powerful synergy between two vital branches of engineering education.
Says Derek Carlson, vice president, development tools at Microchip Technology: “This latest offering demonstrates our ongoing commitment to delivering the highest standard of embedded education to the academic communities. By providing access to our popular PIC32MZ family of high-performance MCUs, we are empowering next-generation engineers and research students to better understand the increasing demands of future applications and gain hands-on experience of IoT design. Additionally, our MPLAB X Integrated Development Environment and MPLAB Harmony Integrated Software Framework will help students accelerate software integration, and gain deeper insight into product development cycles.”
Says Steve Johnson, president at Digilent Inc.: “At Digilent, our mission is to make electrical engineering and design technologies understandable and accessible to all, by providing high-value, industry-relevant educational tools and curriculum to educators and students. We are proud to partner with Imagination and Microchip to offer this new course that introduces students to the exciting world of cloud-connected embedded devices. As part of the Connected MCU Lab, the chipKIT Wi-FIRE boards will help students get projects up and running quickly, and open a large selection of options they can utilize in the development process to empower them to create ambitious solutions.”
Eighteen universities across Australia, China, Germany, Israel, Portugal, Russia and the United Kingdom participated in the Connected MCU Lab beta program. Academics are welcome to visit www.imgtec.com/universityhttp://www.imgtec.com/university to register and access the course materials.
Online seminar series will provide expert forums discussing power technology trends; twice-monthly events throughout 2016 will set the stage for the 2017 PTR edition
The Power Sources Manufacturers Association’s Power Technology Roadmap Committee announces a year-long series of webinars as a lead-up to the next edition of the PTR, to be published in March 2017. The webinar series, hosted by the PSMA, will gather experts from different fields to offer a range of technological perspectives. In addition to setting the groundwork for the upcoming roadmap, the webinars will provide participants with first-hand access to expert opinions on technology trends. The webinars will be held on the second and fourth Thursday of each month from 10:00-11:00 a.m. (Central time), beginning Jan. 14.
“PSMA members will automatically receive email invitations to register for each seminar in the series,” reported Conor Quinn of Artesyn Embedded Technologies and Dhaval Dalal of ON Semiconductor, co-chairs of the 2017 edition of the Power Technology Roadmap. “Non-members can also attend the events, free of charge, by sending an email to firstname.lastname@example.org to request an invitation.”
The webinar series will include a number of highly regarded industry speakers covering components, systems, packaging and applications. Renowned industry expert, Ray Ridley, PhD, will kick off the series with the webinar: “Trends in High-Frequency Magnetics and Power Supply Design.” Other scheduled topics include: 3D packaging concepts (Brian Narveson, Narveson Innovative Consulting), wireless power transfer (Dr. Siamak Abedinpour, IDT), and GaN power ICs (Stephen Oliver, Navitas Semiconductor). For updates to the schedule and news of webinars to be added, please visit: http://www.psma.com/technical-forums/roadmap/news-events.
“The PTR webinars provide a window into technology trends and are unique in terms of their diversity of perspectives, commercial-free tone and the opportunity they offer for audience interaction with industry experts. We are always looking to enrich and expand our panel of webinar presenters and we welcome any proposal from prospective speakers,” said Joe Horzepa, Executive Director, PSMA.
The 2017 edition will be introduced at APEC 2017 with a summary of the key findings to be presented as part of the APEC 2017 Plenary Session. For those interested, Horzepa added: “the PTR Committee welcomes subject matter experts who are willing to actively participate and contribute in the development of the 2017 PSMA Power Technology Roadmap.”
About the Power Technology Roadmap
The Power Technology Roadmap provides a consolidated outlook of trends in power conversion technology for the next two to five years. The trends provided in the report are intended to give a broad outlook of the power conversion technologies, components and applications. The complete Roadmap document is published every two years, incorporating the content of the Roadmap Webinars Series conducted over the months prior to publication.
A Tool for Current Benchmarking and Future Strategic Planning
ecently PSMA published its biennial Power Technology Roadmap, The PTR 2015. Beginning in 1994, this is 9th edition of the Roadmap. Though originally started as a triennial project, the roadmap is now published once every two years, because of rapidly changing technology, quick obsolescence of existing technologies and ever widening scope of power/energy landscape.
The Technology Roadmap is an extensive report that not only projects forecasts of various power supply-related parameters, but also provides essays and presentations on various power supply-related technology topics. It is a multidimensional document that covers a wide spectrum of power supply related subjects in both a quantitative and qualitative manner. It is an anthology of power supply related technologies.
At the heart of the Roadmap report are the quantitative trends of important technical parameters such as efficiency, power density, control topologies and many other in four different power supplies. For the 2015 Roadmap Edition, these power supplies are: AC-DC front end, AC-DC external power supplies, isolated DC-DC converters and non-isolated, point of load converters (POLs). These four types of power supplies are selected because they currently represent the majority of product spectrum. They are offered by many power supply companies and widely used in many applications. The parametric trends are time-based and projected out to 2019. This is very useful for learning the trajectory of the power supply technologies for various aspects of product development. Though these are mostly technology related parameters, they are also useful in the marketing of power supplies. From that perspective, the Roadmap provides inputs for future product development and successful business practice.
The data and trends included in the Roadmap report are not easily available in the power supply industry, as it mainly consists of many small private companies. The information is generally not publicly or widely available and that can lead to wrong forecasts and computations. For example, not too long ago, during a Server Consortium meeting, some participants were using the baseline efficiency of a front-end power supply at 77 percent, and showed that an efficiency gain of 92 percent would result in "significant saving" in electricity use and resulting carbon emission. It was unknown to many of the participants that the front end power supply efficiency had already reached 88 percent at that time and the gain in efficiency would be of 4 percent instead of 15 percent, as initially forecasted. So the savings in electricity use and carbon emission would be less than predicted. A document like the PSMA Power Technology Roadmap would have come handy in their assumption, methodology and computation. Most participants in this meeting were server manufacturers, university professors and government agency representatives and their assumptions about existing power supply efficiency were arbitrary and not up to date.
The PSMA Power Technology Roadmap provides the time relevant objective market information, because the organizers and contributing participants are part of the power supply/electronics industry; the market data is from a wide number of sources directly involved in the respective industries.
Interestingly, the 2015 Roadmap also provides some retrospective analysis. An analysis was made of the projected data from previous roadmaps and checked against the current data to see if the projections were on track. For example, they looked at the efficiency projections forecasted in 2010 versus actual efficiency achieved in 2015. It was projected that for a 48 VDC front end power supply, the efficiency in 2015 would be 93 percent, while the actual efficiency in 2015 turned out to be 96 percent. So the projections were pessimistic in this case. Depending on the parameters, some projections were pessimistic and while others were optimistic. But the retrospective analysis provides a deeper understanding of various trends that should be helpful in future forecasting. In that respect, the PSMA 2015 Roadmap is an important report that can provide companies with technology data for benchmarking their current products, and technology trends for strategic planning.
In addition to the trend analyses, the PSMA 2015 Roadmap also contains essays and presentations on a wide variety of technology topics including: 3D packaging, power SoCs, additive manufacturing, high frequency magnetics, wireless charging, smart grid, energy storage and smart buildings. The scope of this report is very extensive and can be viewed in the table of contents at:www.psma.com/sites/default/files/uploads/psmaptr2015toc.pdf
Producing the biennial Power Technology Roadmap is one of the crowning achievements for PSMA. It is no easy task to organize and energize many participants to volunteer their time and efforts to produce a document that is as complex and comprehensive in a wide variety of power supply related technologies. Participating in this project in a true volunteer spirit as well as a great learning experience for the participants and the industry and is invaluable in understanding the technical evolution and applications of power supplies.
Provided by Mohan Mankikar,
The views expressed in this article are solely of Mohan Mankikar. They do not represent the views of PSMA. Mohan Mankikar has been a part of the power supply industry for over thirty years. An active member of the PSMA since its founding, he had been a board member of the PSMA and currently serves on the Advisory Council. He can be reached at:
SMA is pleased to announce the formation of a new technical committee, the Safety & Compliance Committee. If you or your company is involved with the design and marketing of power products it is critical that they comply with the safety and emission standards where they are sold. You are invited to participate in the Safety & Compliance Committee and benefit from the discussions and alerts on existing and changing standards.
The PSMA Safety & Compliance Committee mission is to provide a resource for our members and the power electronics community in the dynamic area of safety, regulatory and compliance issues and requirements concerning power electronics. These include:
The committee will support a comprehensive on line data base which will be a repository of standards and requirements that affect the power supplies and which will be periodically updated to include the status, trends and issues and upcoming changes by region and country. It is expected that the database would be updated and administrated using a similar process as for the PSMA Energy Efficiency database currently on the PSMA website.
Members of the Committee are encouraged to participate in monthly calls – in general each of the PSMA technical committees meet once a month via teleconference.
We would like to invite all parties interested in regulatory and safety aspects of power electronics to attend and participate. Help us to understand and to communicate the challenge and impact facing our industry in conforming to these evolving global standards. We encourage you to join our meetings or invite others in your organization involved in these areas.
So, let us know if you or others in your organization are interested in becoming an active member of the PSMA Safety & Compliance Committee. We expect you will find that you will get as much out or more than you put into it.
Provided by Kevin Parmenter, Safety & Compliance Committee Chair
he PSMA is a not-for-profit organization incorporated in the state of California whose purpose is to enhance the stature and reputation of its members and their products, to improve their knowledge of technological and other developments related to power sources, and to educate the entire electronics industry, plus academia, as well as government and industry agencies as to the importance of, and relevant applications for, all types of power sources and conversion devices.
By joining with other leaders in the Industry, you and your company will have a greater voice and influence on the directions of the Power Sources Industry. Some specific benefits of membership include:
PSMA membership dues are modest in comparison to the benefits offered. Is your company a member of PSMA? If not, why not? You can find the membership application on the PSMA web site at http://www.psma.com/webforms/psma-membership-application.
We look forward to receiving your application in the near future so you can take advantage of the registration discount at APEC. The 2015 Power Technology Roadmap will be available in mid March and all Regular and Associate members of PSMA will receive a free copy of the report as a benefit of membership. Affiliate members will receive a discount on the Roadmap and other PSMA reports.
|SMA membership provides many benefits for you and your company. It gives you personally the opportunity to meet, network and interact with your counterparts in other companies on an ongoing basis. It also provides an opportunity to be involved with the planning and managing of APEC, as well as giving you and your colleagues a discount on registration fees for attending APEC.
Your company gets a listing on the PSMA web site with a hyperlink directly to your company web site. In addition, your company has an invitation to provide a Spotlight Banner to showcase its latest product on the PSMA Home Page
Your company also receives free or discounted copies of PSMA publications and reports,
An important membership benefit is the opportunity to join and participate in one or more of the PSMA Technical Committees. Participating in one or more committees is the best way to increase the benefits from your company and your personal PSMA membership. People involved in PSMA Technical Committees all agree that their investment returns multiple benefits that surpass the time spent participating – both for their company and for their own careers. Just ask someone who is a committee member. The committee provides the opportunity to network with knowledgeable people who are influencing the power sources industry.
You are encouraged to join a committee and get involved in their activities. Most committees meet about once a month for about one hour by teleconference. You are welcome to attend a committee meeting before making a decision to join the group. If you are interested in attending one of the meetings, please contact the Association Office for call-in information.
This is an open invitation to participate in or join any committee. Bring your experience, interest and enthusiasm. Currently PSMA has the following committees:
Your participation will contribute added value to the subject and enhance your own knowledge.
It’s a great way to network with your colleagues.
For more information describing the committees and the dates for the next meetings, please view the PSMA web site or contact the PSMA office at email@example.com.
The Power Sources Manufacturers Association has drafted a power electronics timeline and a "corporate" genealogy chart for the industry to review. As we get inputs, we will be updating these files on a periodic basis. Consequently these files are subject to change until we hear from all affected parties or until enough time has transpired at which time the files will be finalized.
The PSMA Marketing Committee has prepared this presentation describing PSMA. You can use this presentation to inform your colleagues about the benefits of PSMA membership. You can also show this presentation at meetings you are attending on behalf of PSMA.
The Handbook of Standardized Terminology For The Power Sources Industry-Third Edition - has been made available as a download on the Members Only area of the PSMA website. Revised and expanded, this unique publication includes definitions for more than 1200 terms related to power electronics which were especially selected for the power electronics professional. The Third Edition also contains illustrations and four new appendices, including a listing of EMI specifications, excerpts from international standards of units and symbols, along with guides for authors of technical papers. Many new magnetic terms are described in this new 126-page third edition that are of particular interest to the practicing designer and marketer of power supplies and related products. Valuable information regarding worldwide power sources, standards agencies, and military specifications has been retained, updated and expanded from the previous edition. Titles of the appendices are: Testing and Standards Agencies; Designer's Reference; World Voltages and Frequencies; Military Specifications; EMI Specifications; Writing Technical Papers for Archival Publications; Units, Symbols and Style Guide; A Brief Writing Guide. These added resources provide concise, easy-to-use references for engineeers involved in technical writing and presentations. If your company is a member of PSMA, you may register for the "Members Only" area using your email address. The registration form requires you to enter your company PSMA member number. You may contact the Association Office if you do not know the member number.
A letter to the Membership from Chuck Mullett, PSMA Chairman March 18, 2003
In a recent monthly teleconference of our Membership Committee we had a lively discussion about how we are serving our membership, what projects we are doing, and how we might communicate better with you, our member companies. Realizing that communication is always a key ingredient, I volunteered to write to you and give you a personal snapshot of what’s going on.
Mission: To integrate the resources of the power sources industry to more effectively and profitably serve the needs of the power sources users, providers and PSMA members.
As it is with many trade organizations, membership can be a spectator sport. The organization appreciates your support in the form of dues, because there’s always overhead that must be paid. But, what good is an organization that simply collects dues, pays the phone bills and mailing costs, and tries to survive until the next wave of dues submittals? Clearly, this would be a waste of time. In organizations like PSMA, the worth of the group is directly and totally a result of the efforts of its members. This is not a new concept. Service organizations around the world have always operated in just this way. Think about Rotary International, comprised of business leaders who volunteer their time in an environment of fellowship to help each other succeed in their businesses and help students with scholarships, etc. They take on meaningful projects in their communities, help their communities, and have fun doing it. It is possible to maintain membership in Rotary by simply paying dues and attending meetings. But---it is clear that those who get the most out of their membership are the ones who get involved in the projects. They get to know the other members, gaining friendships and insight into their own businesses. In addition, and perhaps most importantly, they have a lot of fun. When people ask us about PSMA, we usually recite a couple of sentences about the organization, its membership and mission, and then we’re bragging joyfully about the projects recently completed and the ones in process. For me, personally, the projects are exciting, as they give me valuable insight It has become a tradition over the past few years to make use of the Saturday preceding APEC (usually in late February or early March) to hold a major workshop, taking advantage of the presence of the leaders of the power electronics industry. Two years ago Lou Pechi culminated the work of his Low Voltage Workshop team in an all-day meeting that resulted in the book that’s probably on you bookshelf. Leaders from several end users and power supply manufacturing companies spent countless hours preparing papers and presentations, and then more volunteers transcribed the workshop and edited the final report. If you’re involved in the move toward lower voltage power delivery, I hope you’ve had a chance to use it. Last year that pre-APEC Saturday was spent in PSMA’s Integration Workshop, organized by Arnold Alderman. We hope this project saved many of our member companies tens of thousands of dollars trying to figure out how to advance their power supply technology by the use of semi-custom or fully-custom ICs. The question, “Should I go into the silicon design business, joint venture with a semiconductor manufacturer or simply wait for the next wave of ICs” can be difficult to answer. Your Association decided that tackling this question rigorously and publishing the answers would be of considerable value to the membership. We enlisted the help of our colleagues in Ireland, PEI Technologies, after a bidding process involving several candidate organizations. Both volumes of this report have been sent to PSMA Regular and Associate member companies as a benefit of membership. This study cost under $35,000, because of the hundreds of volunteer hours spent by several PSMA members. Prior to this, we had spent well over a year and around $40,000 on the Status of Power Electronics Packaging (StatPEP) project, also using the crew in Ireland to analyze ten dc-dc converters and ten 500-watt ac-dc power supplies. They dissected these units after a battery of electrical measurements, took countless photos and x-rays, and reported the findings in the now-famous “StatPEP Report” that we hope is in your possession and has been of benefit to your company. Again, hundreds of hours were spent by PSMA volunteers overseeing the PEI work, writing papers, presenting them at the workshop and also presenting a half-day summary seminar at APEC 2000. We have now held the fourth Power Technology Roadmap Workshop, which took place on the Saturday preceding APEC 2003 in February. Don Staffiere started this triennial study in 1994 and faithfully repeated it in 1997 and 2000. It involves heavy effort of over 20 volunteers, not only from PSMA but also from other companies. The final product will be a comprehensive publication containing trending of all aspects of power electronics technology---design, manufacturing, components technology, marketing, sales and in-depth information from the users about their needs over the next five years. This exercise will be done without any outside contracts, except the printing of the reports. So---what else has PSMA done for me? Well, let me introduce you to the PSMA Web site! It’s hard to believe, but it consistently receives over 16,000 hits per month! If you supplied the requested information, there’s a link to your Web site, and your company name scrolls by continuously on the home page. Please, if you haven’t done so, drop by and give your mouse a little exercise---you’ll be pleasantly surprised. Be sure to look at the quarterly newsletter, UPDATE. The current edition goes on for 18 pages; including many APEC 2003 pictures and scenes of your PSMA team at work (Joe Horzepa has one of those wonderful digital cameras with the cheap film!) What MORE can PSMA do for me? Plenty! We’re strong, eager and capable. Over half of the sales revenue of the power supply manufacturers in the US is represented in PSMA’s membership. Membership from the components community is also very strong, and so is our membership from academia and leading consultants. As one of the three sponsors of APEC, we share in the financial outcome of the conference, and it’s been very positive over the past few years. Our financial net worth is over $70,000. As a non-profit organization, we simply return our revenues from APEC, member dues and publication sales, to our membership as efficiently and effectively as we can. In addition to the present system of value exchange here’s how you can “milk” much more out of your membership. I thought I would make a list, but as the thoughts rolled around in my head, I realized they all comprised a single theme. It’s extremely simple. “Get involved.” I can tell you, and so can my colleagues, that the benefits from being truly active in an organization like PSMA far outstrip all of the many publications that attempt to summarize its activities. There’s much more in store for you than simply hearing what goes on in our committee meetings, workshops and research projects. What happens in these activities is (and I’ll be the first to admit it doesn’t happen all the time) almost magical. After many years of sticking my neck out and getting involved in these activities I’ve come to some revelations. As I wrote in my paper for APEC 2000 about “Defining your own excellence,” these volunteer organizations have an unusually high population density of effective people. It’s partly because the volunteer aspect acts as an input filter---everyone had to exercise some initiative to be there in the first place. 1. They had to “show up” (it’s been written that this is 80% of success). 2. They had to say, “I’ll do that,” when the discussion rolled around to figuring out how to organize the project. 3. They had to deliver. The level of performance is extremely high, because the people are “turned on” about what they’re doing. Some valuable friendships are formed while working together on these projects. As many of them involve research about power supply technology, components, reliability, marketing and sales, this work may uncover valuable information that you might otherwise not find. More important than the content of the work, in my opinion, is the interaction with exciting colleagues who are really enjoying their careers. I can’t tell you how many times my life has been enriched by these experiences. One of the reasons I’m taking the time to write this is to share this with you. I hope you’ll accept my invitation to get involved yourself. I hope, even more, that you will pick one or two of your co-workers to get involved with us. Please pick up your phone and call me at my office in California, 805 933-4607, or drop an email to me at firstname.lastname@example.org. We can chat further about how your membership in PSMA can become much more valuable to you and your company. Sincerely, Chuck Mullett Chairman, PSMA
Years ago we had to surround ourselves with printed reference material to provide the data on components used in our designs and applications papers to help in their use. Many of these were free, but some others cost over $100 each and became obsolete almost as fast as we obtained them. Today, the picture has changed dramatically. Most of this information is available at no cost through the Internet; the amount of information is so huge that the new challenge is sorting it out. When the semiconductor committee of PSMA began to study the problem of helping engineers find the information needed, the change in the way we do our jobs became blatantly obvious. Even this task has been made easier, because of help from the Internet.
Here is our conclusion: Google is perhaps the most advanced search engine in the world at this time. Surprisingly, it’s not just for lay people who are looking for new recipes or ways to remodel their bedrooms. Its capability to provide us with the sophisticated technical help we need is astounding. It has the capacity to improve its performance, on its own, as it is used. Our job in helping our members and others in the industry has been reduced from one of searching, rating and cataloging materials to one of simply providing a few hints about using Google. We suggest you try it for yourself, get familiar with its capability, and use it the next time you need information. Here are some examples for you to try:
1. Go to Google.com and type in power factor correction. Our result was that 2,190,000 references were retrieved in 0.23 seconds. Now, type in “power factor correction” and see the difference. We got 155,000 references in about the same amount of time. What is even more amazing is that the references were valid! Even in the first case---we looked through the first 120 on the list, and didn’t find even one irrelevant citing.
2. Try “mag amp” and retrieve 8,870 references. All were valid until we got down to the 29th one on the list, which referred to a slow-release garden fertilizer. 28 out of 29 is a validity score of 96.6%---not bad for software!!!
In Example 1 we saw the difference of enclosing the phrase in quotation marks. Doing so causes the search engine to look for precisely that phrase. Without this, the search engine will find hits on each of the words individually, inviting irrelevant references.
To the right of the search window on the home page you will find “Advanced Search.” Clicking on it will produce a page full of easy-to-use tricks to improve the search, including “Advanced Search Tips” on the top line of the page. This gives even more useful information to produce more effective results. Google is so easy that if you’ll spend only 5 minutes with it, you’ll be producing better results than you can find in a world-class library, without leaving your desk. Try it first, then try other search engines. We did this, and found a plethora of irrelevant “hits.” We invite your comments.
A discussion of criteria to consider when deciding whether you should make or buy power supplies when creating equipment.