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Wolfspeed, A Cree Company, a leading global supplier of silicon carbide (SiC) power products — including best-in-class SiC MOSFETs, Schottky diodes, and modules — won a 2016 R&D 100 Award for its high temperature, wide bandgap (WBG) underhood inverter for electric vehicles.
“It’s a great accomplishment to win an R&D 100 Award, so we’re very honored to have earned recognition for one of our latest innovations in the commercial SiC device industry,” said John Palmour, Wolfspeed’s chief technology officer. “Our SiC inverter is the first traction drive optimized for wide bandgap devices that utilizes a commercially available SiC power module. By increasing power in a smaller footprint, Wolfspeed is enabling hybrid and electric vehicles to become more attractive to end consumers, contributing further to a reduction in the domestic use of fossil fuels and greenhouse gas emissions. Additionally, through our partnerships with other industry leaders, Wolfspeed ensures that our technology is readily adoptable in vehicle applications.”
Wolfspeed’s high-temperature, WBG underhood inverter was developed in response to the need for smaller, lighter, and more efficient systems with higher power density in the electric vehicle market, and in collaboration with: the Toyota Research Institute of North America, the National Renewable Energy Laboratory, the University of Arkansas National Center for Reliable Electric Power Transmission, and the Department of Energy Vehicle Technologies Office.
Underhood inverters convert the DC power stored in hybrid, plug-in hybrid, or all-electric vehicle battery packs to three-phase AC power that can be used to energize one or more electrical loads, and traditionally employ industry standard silicon semiconductors. Utilizing Wolfspeed’s WBG semiconductor devices and advanced packaging techniques in an underhood inverter allowed engineers to achieve faster switching with reduced system-level losses during high ambient temperature operation (140°C). This WBG-based system significantly outperforms silicon technology and meaningfully extends the realm of possibility for vehicle inverters, for which it has been earned the achievement of being named one of the top technical breakthrough products released in 2015.
The core of Wolfspeed’s WBG underhood inverter consists of three commercial Wolfspeed CAS325M12HM2 SiC half-bridge power modules, which are rated for 1200V and 325A of continuous RMS current at high temperatures. The inverter assembly also includes: a liquid-cooled cold plate, which provides the thermal conduction path for energy losses; low inductance power bussing, which minimizes parasitic losses and maximizes switching efficiencies; snubber and filter components, which dampen over-voltage and over-current spiking and dampens resonances; control and drive circuitry, which performs the dynamic switching and provides users with feedback, control signals, and high current gate drive signals; and an enclosure, which provides the unit with EMI shielding, electrical cabling, and liquid cooling inlet/outlet connections.
By utilizing WBG materials, Wolfspeed eliminated the need for the secondary radiator and thermal management system in the vehicle. This inverter allows the onboard power electronics to be cooled by the same coolant loop as the primary radiator and combustion engine, which significantly decreases the overall mass and volume of the system. In addition to reducing the system footprint within the car, Wolfspeed’s WBG technology also increases the peak power delivery of the unit by 2–3x what is currently achievable, while operating at overall higher ambient temperatures.
Presented by the R&D 100 Awards Committee and R&D Magazine, the 54th annual R&D 100 Awards honors the 100 most innovative technologies and services of the past year. Selected by an independent panel of more than 50 judges, the award winners are recognized for their contributions to advancing science and technology across five primary categories: analytical/test, IT/electrical, mechanical devices/materials, processes/prototyping, and software/services, and four special recognition categories: market disrupter services, market disruptor products, corporate social responsibility, and green technology.
This year’s R&D 100 Award Winners were announced at a black-tie awards dinner during the R&D 100 Conference at the Gaylord National Resort and Convention Center in Oxon Hill, Maryland on November 3, 2016.
For more information, please visit www.wolfspeed.com/power/products.
1200V SiC half-bridge module awarded for efficiency and power density
Wolfspeed, a Cree company, has won the 2016 ECN (Electronic Component News) Impact Award in the Passive Components and Discrete Semiconductors category for its CAS325M12HM2 high performance, 1200V, 325A, 62mm SiC half-bridge module.
ECN Impact Awards honour excellence and innovation in engineering by recognising top products and services in 17 categories.
Released to market in May of this year, Wolfspeed's CAS325M12HM2 62mm module offers high efficiency and power density for high current power electronics, including converters/inverters, motor drives, industrial electronics, and high performance electric vehicle systems.
Configured in a half-bridge topology with seven 1.2kV 25mΩ C2M SiC MOSFETs and six 1.2kV 50A Z-Rec Schottky diodes per switch position, the module allows systems designers to realise lighter weight systems that are up to 67 percent smaller, achieving efficiencies of over 98 percent, and up to ten times higher power density compared to systems built with silicon-based technologies.
The module’s ability to operate at a higher switching frequency without any compromise in system efficiency enables a reduction in both the number and size of magnetic and passive components required for the balance of the system, says Wolfspeed. Additionally, its superior thermal characteristics, combined with SiC-optimized packaging design and materials, allow the module to operate at 175degC.
The module’s optimised package allows end users to achieve the benefits of SiC technology, specifically a 66 percent reduction in module inductance: 5.5nH compared to competitive power products' 15nH.
"Winning an ECN Impact Award for the year's top product introduction in the passive components and discrete semiconductors category is a significant tribute to the ground-breaking innovation and engineering excellence that we strive for as a company," said John Palmour, Wolfspeed's chief technology officer.
"Our high-performance 62mm SiC half-bridge module, which was the first fully qualified commercial power product released by Wolfspeed's Fayetteville operation, represents a new generation of all-SiC power modules that - by enabling unprecedented efficiency and power density for high current power electronics - will meaningfully contribute to the continued advancement of the power electronics industry."
"ECN has a legacy heavily steeped in recognising the best products on the market for engineers and companies, and the tradition continues today in print and online," said Janine Mooney, the editorial director of Advantage Media's Design Engineering Group and the editor in chief of both ECN and Wireless Design & Development. "The 2016 ECN Impact Awards are the culmination of a Product Technology Awards history stretching back 60 years, and seek to honour ingenuity and creativity among companies large and small who are making a difference in the industry and in the lives of engineers."
AC Series Sets New Industry Benchmark: 94 Percent “True System Efficiency” Within A More Than 30 Percent Smaller Footprint
Telcodium, a leader in power supply design, in collaboration with Transphorm Inc. today released the industry’s first redundant power supplies using gallium nitride (GaN) field-effect transistors (FETs).
Telcodium’s AC Series replaces a typical three-module power supply architecture (two power supply bricks and one intermediate bus converter (IBC)) with a single power module with redundant AC feeds. Telcodium’s power module operates at 94 percent True System Efficiency (TSE)* or higher—reducing average energy loss by 13 percent or more. To achieve the same TSE with the typical three-module power supply, the bricks and IBC would each need to yield a 97 percent efficiency—which exceeds the 80Plus Titanium specification and has yet to be demonstrated by any power supply manufacturer.
Further, the new module is 30 percent smaller than the abovementioned two bricks and eliminates the standalone IBC—freeing considerable, critical space inside a host system.
The high TSE and size reduction are made possible by Telcodium’s innovative design. This design pairs patented front-end circuitry with the market’s only JEDEC-qualified 650V GaN FET, available from GaN semiconductor design and manufacturing leader Transphorm. The resulting AC Series enables data center, server and telecommunication manufacturers to develop smaller, high-performing systems that can virtually eliminate power supply-related failures. For Series details, see telcodium.com.
Highlighted Features and Benefits
The following features combined with others not highlighted here can potentially reduce an average system’s total cost of ownership by 19 percent.
Patented front-end circuit design integrated with 650V GaN FETs
Over 30 percent size reduction + standalone IBC elimination
Reduced internal system temperature
Internal supply monitoring (voltage, current and frequency)
ORing function elimination
Machine assembly (no hand-soldering)
Transphorm is a global semiconductor company that designs and manufactures gallium nitride (GaN) devices for high-voltage power conversion applications. Built on an industry-leading IP portfolio and over 300 years of combined GaN engineering expertise, Transphorm delivers the highest performance and highest reliability GaN devices and best-in-class system-level design support to a growing customer base. Transphorm creates innovations that move beyond the limitations of silicon to achieve over 99 percent efficiency and reduce energy loss by more than 40 percent. Learn more at transphormusa.com.
Telcodium produces the world’s most efficient and most reliable line of redundant power supplies. Designed and made in North America to ensure product quality that customers deserve and delivery delays they demand, Telcodium’s power supply products offer unmatched performance and reduced total cost of ownership. Learn more at telcodium.com.
*True System Efficiency is defined by power supply module efficiency plus IBC efficiency.
ON Semiconductor is Only Company Recognized for All Nine Years of Awards Program
ON Semiconductor, driving energy efficiency innovations, today announced it has been awarded a 2015 Total Cost of Ownership (TCOOTM) Supplier Award from Celestica, a global leader in the delivery of end-to-end product lifecycle solutions. Celestica's awards program recognizes suppliers that provide the best TCOOTM performance to Celestica and support the company's overall business objectives. ON Semiconductor is the only company to receive an award in each of the nine years since Celestica began this program.
"ON Semiconductor is proud to be recognized by Celestica," said Jeff Thomson, vice president of Global Channel Sales at ON Semiconductor. "Celestica is one of our highly influential electronics manufacturing services customers. Once again receiving their 'Best Sustainability Partner Award' is a testament to our long-term commitment to provide the electronics marketplace with a broad range of innovative, energy efficient semiconductor products that offer industry-leading levels of performance and reliability. Celestica's steadfast collaboration and support enables us to maximize the effectiveness of our global supply chain network for meeting customers' operational and engineering goals."
Celestica's TCOO Supplier Awards program evaluates and recognizes the top performers in Celestica's global network of over 4,000 suppliers. Celestica's TCOO system is focused on evaluating supplier performance by measuring the total cost to produce, deliver and support products and services beyond the supplier invoice price. As such, it considers the following supplier attributes: quality, delivery, price, flexibility, innovation and technology.
One of Six Electronic Components and Semiconductors Companies Honored
ON Semiconductor, driving energy efficiency innovations, today announced it has been named a 2016 World's Most Ethical Company® by the Ethisphere Institute, a global leader in defining and advancing the standards of ethical business practices. This is the 10th anniversary of Ethisphere and the World's Most Ethical Companies designation, which recognizes organizations that align principle with action by working tirelessly to make integrity part of their corporate DNA. These efforts shape future industry standards by introducing tomorrow's best practices today.
ON Semiconductor is one of only six companies being honored in the Electronic Components and Semiconductors category, highlighting its leadership among global companies in ethical business standards and practices. The company attributes this prestigious recognition to its longstanding and active pursuit of the total alignment of all business objectives with exercising the utmost care and commitment to ethical stewardship, across the entire organization of more than 24,000 employees in 26 countries. Starting with the CEO and the chief compliance and ethics officer, the principles of compliance, ethics and corporate social responsibility are modeled from the top and instilled in each employee, in accordance with ON Semiconductor's core values of integrity, respect and initiative. That results in trust from customers and partners, who count on the company to be honest and equitable, even in the toughest of times.
"Given our competitive marketplace and the rapid consolidation occurring in our industry, the ability to consistently demonstrate ethical operations and culture is more critical than it has ever been," said Keith Jackson, ON Semiconductor president and chief executive officer. "Companies who build their organizations on a foundation of integrity and accountability will outpace their competitors. In the current global environment, one of the biggest differentiators that companies can leverage is their ethical practices. I want to personally thank all of our employees for their dedication to maintaining a strong corporate culture of compliance and ethics."
"Companies rely on Ethisphere to continually raise and measure the standards of corporate behavior," said Timothy Erblich, Ethisphere CEO. "Those that demonstrate leadership in areas like citizenship, integrity and transparency create more value for their investors, communities, customers and employees, thus solidifying a sustainable business advantage. Congratulations to everyone at ON Semiconductor for being recognized as a World's Most Ethical Company."
Methodology and Scoring
The World's Most Ethical Company assessment is based upon the Ethisphere Institute's Ethics QuotientTM framework, developed over years of research and vetted and refined by the expert advice from Ethisphere's World's Most Ethical Company Methodology Advisory Panel. This EQ offers a quantitative method for assessing a company's performance that is objective, consistent and standardized. The information collected provides a comprehensive sampling of definitive criteria for core competencies, rather than all aspects of corporate governance, risk, sustainability, compliance and ethics.
Scores are generated in five key categories: ethics and compliance program (35%), corporate citizenship and responsibility (20%), culture of ethics (20%), governance (15%), and leadership, innovation and reputation (10%). These scores are then provided to all companies who participate in the process.
"It is truly an honor to be awarded the World's Most Ethical designation," said Sonny Cave, ON Semiconductor executive vice president, general counsel, chief compliance and ethics officer, chief risk officer and corporate secretary. "This honor is a further testament of our steadfast dedication to the core values and the ethical foundation upon which we have built our company. Employees, customers and suppliers have seen the evidence of our actions, which continually reinforce the fact that they are doing business with a company that has high standards and a culture of compliance."
ON Semiconductor is also a full member, active participant and benchmarking leader of the Electronics Industry Citizens Coalition.
The full list of the 2016 World's Most Ethical Companies can be found at http://worldsmostethicalcompanies.ethisphere.com/honorees/. The Ethisphere Institute plans to release best practices and insights from the 2016 honorees, in the form of a whitepaper and infographics, over the next few months.
As full member of System Management Interface Form (SMIF), company adds its expertise to promote adoption of the PMBus™ open-architecture communications protocol; plans to extend PMBus interface beyond existing offering on its Xsolo product line
February 16, 2016—Excelsys Technologies, a leader in high-efficiency power supply design, has signed the PMBus adopter agreement and is now a full member of the Systems Management Interface Forum (SMIF). Excelsys currently offers the PMBus interface on its Xsolo series of 1U, single-output power supply units (PSUs). In becoming a full member, the company aims to expand its role in the development of future standardized digital power management platforms.
“We are excited to become a SMIF member, which allows us to join forces and share ideas with other top electronics companies and customers who have adopted the PMBus standard,” says Gary Duffy, Excelsys Technologies’ Chief Executive Officer. “Adopting this open industry standard will facilitate power management at the systems level and will enable us to offer new features and functionality in upcoming product introductions."
Typical applications for Excelsys power supplies include industrial applications, such as test and measurement, automation, semiconductor production, robotics, printing equipment and lasers, and medical imaging and diagnostic equipment. As a world-class power supply manufacturer, Excelsys has a global applications team to support and assist customers with their specific system needs.
The Power Management Bus (PMBus) is an open-standard digital power management protocol: simple, standard, flexible, extensible, and easy to program for. The PMBus command language enables communication between components of a power system: CPUs, power supplies, power converters, and more. For more information, please go to the PMBus.org website and download an Introduction to PMBus.
For more information, visit www.excelsys.com.
Wolfspeed SiC MOSFETs provide innovative power solutions for industrial battery chargers, enabling a 40 percent reduction in size and a 20 percent reduction in system cost
February 3, 2016 — Wolfspeed, A Cree Company, announced today that Gruppo PBM, a leader in industrial battery chargers, is using Wolfspeed™ SiC MOSFETs in its new HF9 battery charger family to enable higher efficiency and power density at a lower overall system cost.
Demand for safe, efficient, and fast-charging industrial batteries has increased exponentially along with the proliferation of power electronics. The HF9 product family is designed to provide the highest possible efficiency while achieving easy scalability for power ranging from six to 16 kilowatts. These benefits are made possible in part by Wolfspeed 1200V SiC MOSFET technology.
“We selected Wolfspeed SiC Planar MOSFETs for our new HF9 battery charger family because they enabled us to improve our battery chargers while achieving operational savings, increased productivity and increased safety. This was not possible with the best IGBTs in the market,” said both Marco Mazzanti and Giancarlo Ceo, who respectively serve as CTO and R&D engineer at Gruppo PBM.
Based in Italy, Gruppo PBM specializes in rugged high-frequency battery chargers, dischargers, and testers. By using Wolfspeed SiC MOSFETs in its latest HF9 family, Gruppo PBM not only achieves improved efficiency, but also a reduction in component count, improving the overall reliability in the system by lowering the operating temperatures and—most importantly—reducing overall system cost.
“Wolfspeed’s SiC MOSFETs, especially our new C3M 900V family, are enjoying rapid adoption in the growing battery charger market segment,” explained Edgar Ayerbe, Wolfspeed’s power MOSFET marketing manager. “Our products increase power density and dramatically lower switching losses, making it possible to introduce smaller, cooler, and lower cost chargers for the automotive and industrial markets.”
Please refer to www.wolfspeed.com for additional product and company information.
There is no bigger stage for technology than the Consumer Electronics Show (CES). One TI device has received one of the coveted awards that are given to companies who develop innovative leadership products. The winners are center stage for hundreds of thousands of people to see.
The TPS65982 USB Type-C and power delivery controller has been recognized as innovative among technologies that will be displayed at the massive tradeshow in Las Vegas. It will be on display at CES next to dozens of other award winning technologies. A three-member judging team, including an industrial designer, an engineer and a member of the trade press, used a variety of judging criteria from engineering qualities, to the product’s intended use/function, and user value to select the winners. At the end of judging, TI walked away an honoree in "Best of Innovations" for Computer Hardware and Components.
The TPS65982 is the only USB Type-C™ and USB Power Delivery device in the market that manages not only the power delivery communication, but fully integrates the needed power paths to complete a full featured design. For faster and easier time to market, designers should also consider the USB Type-C & USB PD Controller Power Switch & High Speed Multiplexer Reference Design as an additional resource.
ON Semiconductor Named to Board of Directors of AirFuel Alliance, the Industry Leader in Wireless Charging Technologies
Representing the company on the board will be Robert Klosterboer, executive vice president and general manager of ON Semiconductor's Application Products Group
ON Semiconductor, driving energy efficient innovations, has been elected to the board of directors (BOD) of the newly announced AirFuel Alliance. The new consortium is focused on establishing a single, core, wireless charging standard to support a wide range of consumer, industrial, medical and military applications. Robert Klosterboer, executive vice president and general manager of the ON Semiconductor's Application Products Group, will represent the company on the board.
"AirFuel Alliance is positioned as the industry leader in wireless power technologies and poised to drive the significant shift from traditional wall plug powering to the comprehensive adoption of a wireless charging ecosystem," said Klosterboer. "Wireless charging is expected to become widely adopted for the convenient powering of devices ranging from smartphones and wearables, to tablets, notebooks, hearing aids, power tools and more. I applaud the alliance's dedication to establishing one global standard for wireless charging. Supporting this effort and representing ON Semiconductor on the board of directors will be a privilege."
AirFuel Alliance currently has more than 195 member companies. The board member companies include AT&T, Broadcom, Flextronics, Gill Electronics, Integrated Device Technologies, Intel, MediaTek, Powermat Technologies, Duracell, Qualcomm, Samsung Electronics, Samsung Electro-Mechanics, Starbucks, WiTricity, Semtech, and ON Semiconductor.
"ON Semiconductor brings to the Board a depth of expertise in power electronics and breadth of customer and market knowledge," said Dr. Kamil Grajski, chairman of the board of AirFuel Alliance. "These are critical inputs to the delivery of timely, high quality technical specifications, backed by a world-class certification program, that support members' innovative power solutions in consumer, commercial and industrial applications."
For more information, visit www.onsemi.com.
World-class power supply manufacturer awarded the Continuing Professional Development (CPD) standard in recognition of its investment in maintaining in technology and sustainability.
February 19, 2015 — Excelsys Technologies is pleased to announce that the company has been awarded the CPD (Continuing Professional Development) Accredited Employer standard by Engineers Ireland. Excelsys, a leading power supply manufacturer and designer of high efficiency, low profile power supplies for a variety of markets, recognizes the value of CPD as essential in achieving growth and success.
Commenting on the achievement, John Power, Chartered Engineer and Director General of Engineers Ireland said, “Investment in professional development is essential for engineering organizations to gain a competitive edge and achieve results on both a local and international level. Well done to all those at Excelsys who have dedicated time and resources into securing the CPD Accredited Employer status.”
Speaking about the award, Gary Duffy, Excelsys CEO said, “We have an uncompromising commitment to maintaining technology leadership and ensuring employees are equipped with training in sustainability issues. Our employees play a vital role in the organization’s success and it is important that they are fully involved in delivering the group’s organizational vision and goals. The Engineers Ireland CPD framework provides support to assist us in achieving these goals. And we are proud to be accredited.”
Excelsys Technologies is a world-class power supply manufacturer supplying best-in-class products to the world’s leading OEM’s. They are market leaders in high efficiency, high reliability, AC/DC power supplies serving medical, industrial and hi rel industry segments.
For more information on Excelsys products and distributors worldwide, please visit Excelsys.com
December 3, 2014 – Cree, Inc., a leading global supplier of silicon carbide (SiC) and gallium nitride (GaN) wafers and devices, announces that EDN has named its 1200V, 25mΩ SiC MOSFET (C2M0025120D) as one of the “100 Hot Products of 2014.” The 2014 EDN Hot 100 Award recognizes the electronics industry’s most significant products of the year based on innovation, significance, usefulness, and popularity.
Cree’s C2M0025120D is the industry’s first commercially available 1200V SiC MOSFET with an RDS(ON) of 25mΩ in an industry standard TO-247-3 package. Based on Cree’s proven C2M™ SiC MOSFET technology, the new device has a pulsed current rating (IDS Pulse) of 250A, which makes it suitable for pulsed power applications, and a positive temperature coefficient, which allows the devices to be paralleled to achieve even higher power levels. Additionally, the higher switching frequency of the new MOSFET can help design engineers reduce the size, weight, cost, and complexity of power systems in applications including: PV inverters, high voltage DC/DC converters, induction heating systems, EV charging systems, and medical CT applications. The new MOSFET has already been proven to provide a 5X reduction in switching losses, higher power density, and improved thermal characteristics in medical CT applications, as well as to reduce installation costs for rooftop PV inverters by enabling a compact and highly efficient 50kW grid-tied solar inverter with an impressive power to weight ratio of 1kW/kg.
“Cree is honoured to have been recognized by the industry veterans that comprise EDN’s editorial staff and audience for developing and introducing one of the 100 most innovative, significant, useful, and popular electronic products of 2014,” said Edgar Ayerbe, Cree Power Marketing. “One of the most important objectives for power engineers is to build smaller, cooler and lower cost power conversion solutions. Our new 1200V, 25mΩ SiC MOSFET can help achieve these goals.
“Of the many thousands of products announced during the past year, the EDN Hot 100 are the products that especially caught the attention of our editors and readers. We are pleased to share the tradition of showcasing these technologies as we celebrate the 21st anniversary of this program,” said Rich Pell, Executive and Chief Technical Editor, EDN.
For more information about Cree’s award-winning 1200V, 25mΩ SiC MOSFET, please visit www.cree.com to access specifications and supporting documentation, including datasheets and application notes. To view the complete list of EDN’s Hot 100 products, please visit www.edn.com.
Ericsson has won the Best Application award and Best Non-Isolated Digital Power Module categories in the Top 10 Power Product Awards run by the media outlet Electronics Products China. The prizes were awarded to Ericsson’s BMR461, the company’s advanced digital POL point-of-load (POL) regulator that features Dynamic Loop Compensation (DLC) based on ‘state-space’ or ‘model-predictive’ control, guaranteeing stability and achieving the optimum dynamic performance without requiring any external components.
Electronics Products China, which celebrates the very best of innovation in power electronics, has run its prestigious awards event for several years. In 2014, the judging panel included a professor from the Nanjing University of Aeronautics and Astronautics alongside a senior engineer from China Power Supply Society with a close affiliation to Shanghai Association for Science and Technology.
The Dynamic Loop Compensation circuitry built into the BMR461 negates the requirement for external components such as RC networks to adjust control loop compensation parameters. As some board designs employ 30 or more 12A POL regulators, the BMR461 significantly simplifies the design and maintenance process for power designers. Additionally, the BMR461 represents significant savings both in terms of cost and time while also improving reliability.
“The successfully launched BMR461 came to fruition as a result of close cooperation between Ericsson R&D and product development teams based in Sweden and China,” commented Patrick Le Fèvre, Marketing and Communication Director, Ericsson Power Modules. “We have won several awards within the Chinese electronics industry in just a couple of years, which demonstrates the highly efficient and innovative products being developed by Ericsson.”
Based on the ‘state-space’ mathematical model rather than traditional proportional-integral-derivative (PID) regulation, the BMR461 uses closed-loop pole placement and a model based on the resonant frequency of the output filter, thereby reducing the number of output capacitors required for filtering and stability. This technology is highly suitable for FPGA and processor applications where low-ESR decoupling capacitors are currently being used.
The BMR461 features several algorithms that optimize efficiency across a wide range of operating conditions. Compared to the conventional technology that is currently implemented in analog and digital-hybrid POL regulators, the device’s combination of energy optimization algorithms and low bias technology requires up to five times lower current, and therefore further improving overall efficiency.
Huawei may not exactly be a household name in the United States, but it is a massive company. In 2013 it had global sales of $39.5 billion, a 13% increase from 2012. Most of its revenue comes from the sale of equipment used to build out telecommunication networks. It also has more consumer-facing efforts. Huawei is the 3rd ranked smartphone vendor globally. More recently, it has started to focus on data center products and services. Just how much can Huawei shake up an industry that has been dominated by incumbents?
Huawei has two groups of offerings for data centers residing within their “Enterprise” segment, which turned over $2.5 billion itself last year. The first group is their IT product line that includes servers, storage, and networking. The second group, called Network Energy, offers power and cooling systems. The name of the latter section bears a striking resemblance to Emerson’s Network Power division, a longtime leader in critical power systems.
Huawei’s Network Energy business arose very quickly. In less than five years it has gone from nothing to having full lines of UPS, row and rack cooling, power distribution and rack enclosures. Huawei is also betting on the emergence of future markets like data center infrastructure management software (DCIM) where it joins a crowded supplier environment. While it is just ramping up these product lines, Huawei has gotten off to a fast start as a major manufacturer of containerized data center systems; to the extent that it will likely race into the upper echelon of vendor ranks in the next containerized data center market analysis produced by IHS. Such containers not only benefit from pre-engineered and tested designs, but also from low cost labor when assembled in China.
The fact that Huawei has these two groups relevant to data centers makes it unique. Their presence in IT puts them in competition with heavyweights like HP, IBM, and Cisco, while the DCI market is dominated by the likes of Schneider Electric, Emerson and Eaton. In many respects, the IT and facilities side of the data center business is highly segregated and the supplier landscape reflects this. Should Huawei create sufficient scale to their operations they would be one of the only vendors to be a major player on both sides. In the relentless quest of companies to become “one stop shops” for their customer bases, Huawei has quietly carved out a unique position.
This does not mean you should look for Huawei-badged gear on your next data center tour here in the states. Currently, Huawei’s distribution is regionalized and most of its sales in the data center area come from its home market in China or in developing markets like Africa, the Middle East, and South America. Penetrating mature markets is difficult where name recognition, long-standing reputation, and familiarity are tremendous barriers to entry into an industry that defines risk aversion.
Breaking into the US market is a particular challenge. Aside from the arduous and expensive UL certifications which must be obtained, rightly or wrongly, there is serious political opposition to the sale and use of Huawei gear in the United States. Facing congressional backlash, Huawei announced at the end of 2013 it would be exiting the US market in terms of telecommunication equipment. It is hard to imagine data center equipment would enjoy a better fate. In all likelihood, Huawei will not have access to the single largest data center market.
However, if Huawei has the patience to make a long term play, future growth in data centers reside outside of United Sates and Western Europe. Opportunity will come from “connecting the next 4.4 billion unconnected,” a reference Huawei used to highlight the fact that two-thirds of the world’s population does not have access to the internet. This was a recurring theme at their analyst summit this year. Huawei sees bringing connectedness to all as a moral cause and a shrewd strategic decision. We can only assume its data center appetites will follow this doctrine.
While its current presence in the data center market is limited, the scale and ambition of a company like Huawei means that it may be a formidable force in data centers of the future.
The Gail S. Carter Award recognizes individuals who have made giant contributions to the industry over the course of their long careers. Each recipient is known for their consummate leadership, their long service, and their active role in the association. Past honorees include Brian McNally, Frank Flynn, Jim Bruorton, Phil Gallagher and Roy Vallee.
Jim Kaplan has had a long career in the industry. For over 50 years he has been a huge advocate for various industry trade associations including the EIA, the ECA and now the ECIA, for which he had a hand in forming. In recognizing Jim, ECIA Chairman Michael Knight said, “We are blessed to know and work with you, grateful for the role you have played in shaping the evolution of our industry, and the tremendous amount of time and energy you have given to industry associations, including this one. We are thrilled to add you to the short roster of Gail S Carter award winners.”
- Industry’s first 750W Hybrid Regulated Ratio DC/DC converter wins two awards from Electronic Products China
- High-power-density quarter-brick PKM-NH gains ‘2013 Top-10 Power Product’ and ‘2013 Technology Innovation Product’ awards
- Quarter-brick module delivers high power density of 31.12W/cm3 per cm3 (508W per cubic inch)
- Highly-innovative regulated-ratio topology module delivers high-efficiency flat-curve characteristics of up to 97%
Ericsson has been named as a winner in two categories in the annual Electronic Products China Top Product Awards. The industry’s first 750W Hybrid Regulated Ratio (HRR) DC/DC converter – the PKM-NH platform – was named in both the ‘2013 Top-10 Power Product’ and ‘2013 Technology Innovation Product’ award categories by the magazine. Implementing the new hybrid-regulated topology, the PKM-NH platform is optimized for datacom board applications that have a 52V/54V system bus distribution and require regulated high-power quarter-brick-format intermediate bus converters able to deliver up to 750W.
The awards are recognition of the company’s world-class expertise in consistently developing innovative and highly efficient products that significantly reduce the environmental impact of electronics equipment. Ericsson has finely honed the efficiency of its research and development activities across the company, implementing a lean and agile R&D methodology. This has resulted in shortened feedback loops, improved communication and rationalized processes across all the company’s product development, including its leading-edge technologies used in digital power modules.
“The development of the PKM-NH platform is a result of the extremely close cooperation between Ericsson R&D and product development centers in Sweden and China to deliver this innovative technology and product in an exceptional fast timeframe,” said Patrick Le Fèvre, Marketing and Communication Director, Ericsson Power Modules. “This is the first time that has Ericsson won two awards within the Chinese electronics industry, which is a clear recognition of the high level of innovation being demonstrated by Ericsson.”
For further information, please visit https://www.ericsson.com/powermoduleswww.ericsson.com.
In 2012, Lincoln International’s team continued expansion in key global economies and developed additional capabilities and sector coverage to best serve our clients worldwide. Key figures for Lincoln international in 2012 include:
Through disciplined and passionate process execution, Lincoln International’s banking team was able to close more than 115 transactions in 2012. Additionally, over 50% of Lincoln International’s transactions in 2012 were cross-border, making Lincoln International the leading global independent mid-market investment bank.
A few highlights from 2012 include:
- Expanded geographic reach and completed coverage of the BRIC countries by opening new offices in São Paulo, Brazil and Beijing, China
- Deepened industry expertise with addition of eight Managing Directors with extensive sector knowledge
- Continued growth in the Lincoln International team both domestically and internationally, with an increase of nearly 20%
With an unmatched global reach in the mid-market, integrated deal teams and deep industry expertise, Lincoln International has the knowledge and experience to provide the best strategic advice and produce the best price and terms for our clients.
More information about Lincoln International can be obtained at www.lincolninternational.com.
President Obama Tours Cree’s Durham Manufacturing Facilities, Cree CEO Chuck Swoboda Participates in Jobs and Competitiveness Council Meeting
DURHAM, N.C., June 15, 2011 —President Barack Obama visited leading LED manufacturer Cree, Inc. on Monday, June 13, 2011, touring Cree’s Durham, N.C. manufacturing and speaking with Cree employees and other guests. During his visit, President Obama met with his Jobs and Competitiveness Council to discuss initiatives and policies to spur economic growth, promote job creation and accelerate hiring across the United States.
President Obama made remarks to a crowd that included Senator Kay Hagan, Representatives David Price, Brad Miller, G.K. Butterfield and other local and state leaders as well as hundreds of Cree employees. In his remarks, President Obama stated, “So today the small business that a group of N.C. State engineering students founded almost 25 years ago is a global company…Next month, your new production line will begin running 24/7. So you’re helping to lead a clean energy revolution. You’re helping lead the comeback of American manufacturing. This is a company where the future will be won.”
Cree currently employs over 5,000 employees globally, keeping pace with a growing international market for energy-efficient LED lighting. Most recently, Cree has added LED fixture manufacturing lines in Durham, N.C. President Obama joined Swoboda on a tour of these new production lines, which include world’s most efficient troffers, the CR series. These new lights are designed to replace fluorescent troffer lighting commonly seen in office and other commercial buildings, delivering higher quality light and increased efficiency at prices comparable to their fluorescent counterparts.
“President Obama’s visit yesterday highlighted topics critical to the success of the LED lighting revolution, including workforce training and education,” said Swoboda. “Cree remains committed to innovating, growing and successfully addressing the global appetite for energy-efficient technologies.”