New product announcements


Powerbox reveals breakthrough coreless power conversion technology for high magnetic field applications
Posted: 2017-1-26

Powerbox, one of Europe’s largest power supply companies and a leading force for four decades in optimizing power solutions for demanding applications, has announced the release of its new coreless technology platform to power medical and industrial equipment operating in very high magnetic field environments such as magnetic resonance imaging or particle accelerators. Using the latest technology in high-frequency switching topologies and digital control with proprietary firmware to optimize efficiency and voltage regulation, Powerbox’s GB350 buck-converter module is the first building block in its category that is able to operate safely when exposed to high radiation magnetic fields of 2 to 4 Tesla. GB350 delivers an output power of 350W and when higher power levels are required it can be paralleled using an interleaving mode thus reducing EMI.

Medical and industrial applications such as magnetic resonance imaging (MRI) and particle accelerators (PA) generate high magnetic fields to induce the RF energy required to activate the hydrogen nuclei in the case of imaging, or to accelerate particles in research and industrial equipment.

Modern MRI systems usually generate 1.5 to 4 Tesla, making conventional power supplies using ferrite material useless due to inductance saturation as a result of the MRI magnet disturbing the energy transfer. To prevent parasitic saturation, power supplies are traditionally positioned outside the shielded operation room.  Installing the power supplies remotely requires long cables with subsequent power losses, and it is also a big challenge to power the latest generation of measuring equipment that require stable and tightly regulated voltages under fast transient load conditions.

To reduce energy consumption and to guarantee the level of quality required by integrated equipment, systems manufacturers are now integrating local power supplies near to the load.  However, placing equipment directly in the radiated magnetic field requires an innovative power solution known as ‘coreless power units’ and a state of the art switching power stage.

Designed to respond to this demand and to guarantee the highest efficiency and tightly regulated output voltage at any load-condition, Powerbox’s GB350 coreless power unit is fully controlled by a digital processor that manages the complete power unit from switching parameters (e.g. dead-time and duty-cycle optimization) to output voltage characterization. To guarantee a high level of flexibility and the possibility to re-profile the power unit characteristics when equipment manufacturers upgrade new hardware or implement a software revision, the GB350 micro-controller can be programed with optimized configuration files downloaded through the digital interface.

“Combining the latest technology in digital power and very advanced coreless energy transfer, the GB350 is an important component of the Powerbox Custom Power Solution toolbox,” said Tomas Isaksson, Chief Technology Officer at Powerbox. “With more than 3,500 Custom Power projects delivered to market, it is very important to rely on a strong platform portfolio, reducing time to market in demanding applications such as medical magnetic resonance imaging.”

As part of Powerbox’s Custom Power Solution Toolbox, the GB350 and products based on that technology are tested, verified and qualified in accordance to end customers’ specifications.

For more information, visit www.prbx.com/

Texas Instruments: Maximize Battery and Sensor Life
Posted: 2017-1-25
Industry’s first precision nanopower operational amplifiers maximize battery and sensor life

TI introduces the first precision nanopower operational amplifiers (op amps) that enable power consumption as low as 320 nA without the use of duty cycling. The new LPV811 family of op amps – with up to 60 percent lower power consumption than competitive precision op amps – extends battery and sensor life for applications such as building automation, wired and wireless sensor nodes and wearables.

In addition, the LPV811 family of amplifiers can drive the ADS7042 family SAR analog to digital converter, helping to deliver an ultra-low power analog front end. 
 
Key features and benefits:

  • Low-power consumption to improve battery life and reduce replacement costs. 
  • High precision with offset voltage as low as 300 µV to help detect low concentrations of environmental gases.
  • Low-voltage operation for continuous performance under low-voltage battery conditions.
  • High EMI immunity to save design time for EMI-sensitive applications and enable rapid system qualification by international standards organizations. 

Learn more at www.ti.com/lit/an/snoa937/snoa937.pdf

 

Highly Integrated Capacitive-Digital Converter Delivers Superior Gesture Sensing and Enhanced Touch Performance to Automotive and Industrial Systems
Posted: 2017-1-18
Eight-channel device exhibits sensitivity up to 150 mm away to support gesture recognition

ON Semiconductor, driving energy efficient innovations, has introduced a new touch/proximity sensing solution that combines industry-leading performance, cost-effectiveness and convenience in a single chip. The LC717A30UJ high dynamic range capacitance-to-digital converter uses mutual capacitance to detect changes in capacitance down to femtofarad (fF) levels. Parasitic capacitance cancellation raises the detector sensitivity, while its built-in noise rejection mechanism combats the effects of electromagnetic interference (EMI).

The eight capacitance-sensing input channels make the LC717A30UJ highly optimized for use in systems where an array of switches is required. The device includes an integrated multiplexer for input channel selection, analog-to-digital converter, dual-stage amplifier that determines capacitance changes plus outputs analog amplitude values, system clock, power-on reset circuit, and all the necessary control logic to create a total solution. Both I2C and SPI interfaces are selectable based on the system application needs.

As the device's sensitivity has a range of 150 millimeters (mm) - beyond the scope of any competing device on the market - its higher sensitivity enables gesture motions as well as offering conventional touch functionality, thereby enhancing users' control options to address a wide range of application scenarios. In addition, it is capable of operating with an airgap between the sensor/PCB and the protective cover - so engineers can eliminate the inclusion of a light guide from the assembly and reduce overall complexity. This device also includes an integrated automatic calibration function which optimizes and self-calibrates total capacitance according to electrode, line capacitance, and surrounding environment, thus significantly accelerating system development cycle time as well as robustness in the field.

The LC717A30UJ delivers rapid responsiveness, with a measurement time of 16 milliseconds (ms) for its 8 sensing channels and runs off a +2.6 volt (V) to +5.5 V supply with a low-power standby mode of one microampere (µA). The high degree of integration means that minimal external components are required, thereby further reducing the bill of materials. To support the needs of automotive applications such as vehicle entry systems and dashboard controls, the device is AEC-Q100 compliant. With its high integration level and wide dynamic range, it can also be employed in a range of touch or gesture human interfaces in industrial and consumer end products such as induction cookers, refrigerators, home entertainment systems, building automation equipment, industrial equipment, and lighting controls.

"As we all know, touch technology has witnessed widespread uptake within the consumer electronics sector over the course of the last decade. Now there are an ever-increasing number of opportunities for its utilization in various nonconsumer sectors," said Ikuya Kawasaki, General Manager of the Intelligent Power Solutions Group at ON Semiconductor. "This new device possesses the key attributes needed to address these demands, by providing a robust, simple to deploy solution that successfully combines low price and superior performance."

 

Wolfspeed Introduces New SiC MOSFET for EV Drive Trains
Posted: 2017-1-10
New 900V, 10mΩ chip enables new improvements in range, battery usage and vehicle design

Wolfspeed, a Cree Company and a leader in silicon carbide (SiC) power products, has introduced a 900V, 10mΩ MOSFET rated for 196 A of continuous drain current at a case temperature of 25°C. This device enables the reduction of EV drive-train inverter losses by 78 percent based on EPA combined city/highway mileage standards. This efficiency improvement offers designers new options in terms of range, battery usage and vehicle design.

Recently Wolfspeed supplied Ford Motor Company—in a collaboration with the U.S. DoE―with a full-SiC, 400A power module designed around the 900V, 10mΩ chip.  The module, designed and produced by Wolfspeed, contains four MOSFETs connected in parallel to achieved a remarkable 2.5mΩ Rds(on). Wolfspeed engineers have since demonstrated the capability to use these chips to create an 800A, 1.25mΩ module.

“With the commercial release of the 900V 10mΩ device, electric vehicles can now reap the benefits of SiC in all aspects of their power conversion,” said John Palmour, CTO of Wolfspeed. “With the continued expansion of our Gen3 MOSFET portfolio in new package options, our devices can now support significant efficiency improvements in onboard chargers, offboard chargers, and now EV drive trains.

Commercially qualified and rated for a maximum operating temperature of 175˚C, Wolfspeed’s new chip offers high-reliability in harsh environments, like those found in vehicle drive-trains.

For more complete technical information about Wolfspeed’s new 900V, 10mΩ MOSFET, visit http://www.wolfspeed.com/cpm3-0900-0010a

ON Semiconductor and Hexius Semiconductor Expand Scope of Analog Functionality for Next Generation Mixed Signal ASICs
Posted: 2017-1-10
New intellectual property offering will accelerate time to market and reduce development-cycle risk

ON Semiconductor, driving energy efficient innovations, has announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process. This enables ON Semiconductor to better serve its customers with proven analog IP that can ultimately reduce design cycles and time-to-market. The eight initial designs resulting from this collaboration include a variety of analog-to-digital converters, digital-to-analog converters, voltage references and current references. There is provision, if needed, for the designs to be custom-tailored to match particular application demands. Further data converter and PLL designs are currently being developed for introduction later this year.

ON Semiconductor's ONC18 process relies on a 0.18 micrometer (µm) CMOS architecture and due to its high voltage capabilities is extremely well suited to automotive, industrial, military and medical deployment. By having access to an expansive portfolio of qualified IP that supports this process, customers will be able to benefit from ASIC implementations that are highly optimized for their specific requirements, without needing to allocate too much of their own engineering resources to the task. As a result, much quicker design cycles, reduced risk of re-spins and lower associated costs can all be realized.

"The mixed signal ASIC market continues to grow as systems need to utilize the real-word data that is captured by sensors and user interface," states Rocke Acree, Director of the Custom Foundry business unit at ON Semiconductor. "OEMs are looking to integrate more effective proprietary designs, rather than relying on standard off-the-shelf components. Through this, performance levels can be enhanced, board space saved and unit costs significantly lowered. By working together, ON Semiconductor and Hexius Semiconductor are delivering qualified analog IP needed to facilitate this migration and enabling a new era of mixed signal design."

"Through the combination of the respective skill sets that our two companies possess, we are in a position to supply the industry with qualified analog IP macrocells on superior semiconductor processes that will deliver clear performance and logistical advantages. This will allow OEMs to respond more quickly to market opportunities that they have identified by taking products from the concept phase right through to full commercial production in the shortest possible time," adds Chris Cavanagh, CEO at Hexius Semiconductor.

Visit ON Semiconductor's External Intellectual Property page for more information. 
 

Rollout of Microchip’s MOST150 Technology at Audi Continues with Launch of the Q2 Compact SUV
Posted: 2017-1-5
MOST150 Technology Ensures Highest Quality In-Vehicle Infotainment

Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that Audi has included MOST150 technology in their latest compact SUV model, the Q2. Media Oriented Systems Transport (MOST®) technology is designed for in-vehicle infotainment platforms. MOST enables the deployment of a large variety of automotive premium surround sound audio systems and driver information systems such as full digital instrument clusters and heads-up displays.

Audi has been using MOST150 technology for many years, also deploying it in their best-selling A4 Sedans, the Q7 SUV and TT Coupé models. This Q2 deployment utilizes the MOST150 Intelligent Network Interface Controllers (INIC) OS81110 and OS81118.

MOST technology is designed to ensure digital multi-channel audio streaming in the highest quality. It offers a robust and proven method of system management and control with superior and reliable Quality of Service (QoS). Compared with alternatives, it is an established deployment that comes with a complete scalable system solution that is low risk and allows for fast time-to-market.

MOST technology is a mature network solution and comes with a complete eco-system. The complete network solution comprises of a variety of tools from several different vendors, a software stack, schematics, layout reviews and multimedia companion IC products.

“The Audi Q2 is a compact SUV that meets and reflects the needs of today’s car drivers,” said Dan Termer, vice president of Microchip’s Automotive Division. “We have worked with Audi for many years and are proud to be a part of helping them deploy the latest models with the very best technology for infotainment and connectivity.”

The MOST Cooperation standards enable automotive OEMs and their Tier 1 suppliers with a proven and well-supported methodology for defining and implementing high-bandwidth infotainment and Advanced Driver Assistance (ADAS) systems, including a standard physical layer and a robust method for system management and control with superior reliability and Quality of Service (QoS). Using MOST technology also reduces weight for easier compliance with environmental regulations.

For more information, visit the Microchip website at www.microchip.com.

Ericsson scales new heights for power handling and thermal management with advanced bus converter
Posted: 2016-12-15
  • New advanced bus converter leverages Ericsson’s advanced Hybrid Regulated Ratio (HRR) topology to deliver up to 450W and 37.5A for high-power, high performance applications
  • PKB4413D offers up to 96% efficiency at 12V output, significantly reducing energy and cooling costs
  • Advanced design offers excellent thermal derating, making it ideal for use in environments with high ambient temperatures or limited airflow
  • High-performance DC/DC converter delivers tightly regulated power for intermediate bus conversion applications in telecom and networking markets

Ericsson has launched a low-profile, 450W DC/DC converter module that is designed to deliver a tightly regulated 12V output voltage at up to 37.5A to point-of-load (POL) DC/DC converters. Offered in a 5-pin 1/8-brick footprint, compatible with the DOSA (Distributed-power Open Standards Alliance) standard, the new PKB4413D advanced bus converter has an input range from 36V to 60V and is ideal for intermediate bus conversion in ICT (Information and Communication Technologies) applications.

The PKB4413D incorporates the company’s cutting-edge HRR (Hybrid Regulated Ratio) technology to deliver high-power conversion from a wide input voltage range, while keeping power losses low. Offering class-leading performance in thermally challenging environments and delivering a typical efficiency of 96%, with a 48V input and 12V output at half-load, the module significantly reduces energy and cooling costs. Competitive products typically dissipate 18% or more of their input power at 30A loads.

Meeting the deployment requirements for distributed power and intermediate bus voltage architectures, the module particularly targets high-power and high-performance use in networking and telecommunications equipment, servers and data storage applications, as well as industrial equipment.

Ericsson has leveraged its highly innovative HRR topology in the development of the PKB4413D. Initially introduced in the company’s high-end quarter-brick PKM-NH family, the technology has been further enhanced to deliver even better utilization of the powertrain. The module’s excellent response to line and load transients guarantees the output voltage will remain stable and immune from voltage deviations that are due to power disturbances on the system bus. This retains intermediate bus voltage integrity within the tolerance band required by power system architects.

Delivering excellent thermal performance in challenging circumstances, the converter provides higher useable power in high ambient temperatures or limited-airflow environments leading to higher reliability. The use of tellurium copper pins provides excellent thermal transport, and a baseplate connects the module to a heatsink or coldplate as standard. In addition, careful attention was given to the design of the thermal path from the thermally critical components to the baseplate. This has resulted in a flat thermal profile for the critical components and outstanding heat transfer to the baseplate or heatsink.

“Targeting customers looking for high power capabilities in telecom, networking and industrial applications, the new 450W PKB4413D is the second in a new series of high-power advanced intermediate bus converters,” said Martin Hägerdal, Head of Ericsson Power Modules. “The module builds upon the company’s HRR topology to offer high power and current handling, together with high efficiency, tightly regulated voltage capabilities and best-in-class thermal handling.”

The PKB4413D has been designed and manufactured by Ericsson to meet the highest standards available for DC/DC power converters in the industry, delivering the levels of quality and confidence that are required by power system designers to develop long-term and high-performance platforms.

For more information, visit www.ericsson.com/powermodules.

Pagani Huayra BC Supercar Features Microchip’s MOST® Technology
Posted: 2016-12-13
MOST Enables Premium Surround Sound Audio and Feature-rich Infotainment in One of the World’s Most Technologically Advanced Sports Coupes

One of the most technologically advanced sports coupes in the world features Media Oriented Systems Transport (MOST®) technology for powering the vehicle’s premium surround sound audio and infotainment system. Pagani Automobili’s Huayra BC supercar is using MOST technology Intelligent Network Interface Controllers (INICs) from Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions.

MOST INICs are powering the infotainment systems in all ranges of vehicles from compact cars to ultra-high end sports cars like the Huayra BC. Pagani is using Microchip’s OS81050 INIC to transport video, audio, packet and control data throughout the vehicle.

“MOST technology gives Pagani the highest quality network on which we can develop a no-compromise, exclusive, premium high-end audio system for the Huayra BC,” said Hannes Zanon, marketing director of Pagani Automobili S.p.A. “We are delighted that MOST technology gives us a flexible platform to further develop exciting applications for our demanding customers.”

The MOST Cooperation standards enable automotive OEMs and their Tier 1 suppliers to ensure digital multi-channel audio streaming in the highest quality. This proven and well-supported methodology for defining and implementing high-bandwidth infotainment provides a robust method for system management and control with superior reliability and Quality of Service (QoS). Using MOST technology also results in reduced weight by transmitting control and audio data over lightweight plastic optical fiber (POF).

“The Huayra BC is a fascinating supercar, and we are excited about the selection of our MOST technology in its infotainment system to provide high quality digital audio,” said Dan Termer, vice president of Microchip’s Automotive Information Systems Division. “Pagani chose MOST for what they call their ‘most technologically advanced Huayra Coupe yet,’ which is now benefiting from a flexible and feature-rich infotainment system.”

To facilitate development, MOST technology comes with a complete ecosystem of tools, software and support. Tools vendors include the OptoLyzer® MOCCA family and OptoLyzer Studio, both from K2L; the software stack can be MOST Linux® driver or MOST NetServices; schematics and layout reviews such as MOST Check are available; and multimedia companion IC products include video encoding, DTCP content protection, I/O expansion and power management.

To learn more about Microchip’s MOST products, visit www.microchip.com/PaganiMOST530.

 

New Low-Power PIC24 “GA7” Microcontroller Family Now Available
Posted: 2016-12-13
Microchip’s New Low-Power Family Enables Cost-Effective, Space-Constrained Designs

The new PIC24 “GA7” family of microcontrollers (MCU) is now available from Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. As the lowest-cost 256 KB Flash memory 16-bit MCUs available today, these PIC24 devices enable extremely cost-effective designs for Internet of Things (IoT) sensor nodes, portable medical devices and industrial control applications. 

The PIC24 “GA7” family enables developers to cut power consumption, cost and space. The devices offer low-power modes including multiple sleep modes, down to 190 nA, to greatly decrease power consumption for extended battery life in portable applications at a fraction of the cost of previous solutions. The new devices also offer up to 256 KB Flash and 16 KB RAM and are available in 28, 44 and 48 pin count package options, some as small as 4 x 4mm.

Products in the PIC24 “GA7” family support Core Independent Peripherals (CIPs) such as configurable logic cell (CLC), Multi-output Capture Compare Pulse Width Modulation module (MCCP) and Direct Memory Access (DMA), which allow developers to accomplish tasks in hardware while freeing up the central processing unit (CPU) to do other tasks or to go to sleep. The new microcontrollers also features a robust peripheral set including 12-bit, 200 ksps Analog to Digital Converter (ADC), up to seven timers and two Universal Asynchronous Receiver/Transmitters (UARTs).

“Designers are demanding more program memory in smaller pin count packages. With the PIC24 ‘GA7’ family, Microchip offers a cost-effective solution packing 256 KB Flash into small 4 x 4 mm packages,” said Joe Thomsen, Vice President of Microchip’s MCU16 Division. “This PIC24 family also offers various power-down modes for power-sensitive and handheld applications.”

For more information, visit the Microchip website at www.microchip.com.

Lin Engineering Partners with CUI to Release a Highly Efficient and Reliable Stepper Motor and Encoder Combo
Posted: 2016-12-8

CUI Inc announces a partnership with Lin Engineering, a leading manufacturer of stepper motors, to integrate CUI’s innovative AMT encoder technology with Lin’s latest, high performance motor series.

Lin Engineering’s G3718V series is a NEMA 17 sized motor with a length of 0.90 inches (22.86 mm) that can produce up to 50% more torque than motors of a similar size. Thanks to its design, the G3718V also features improved passive cooling, increasing overall efficiency and lowering operating costs.

With a step angle of 1.8°, the G3718V offers smooth motion and high accuracy similar to a 0.9° motor. The series also provides up to 25 oz-in (0.18 N-m) of holding torque. Various shaft options are available and windings can be customized to ensure maximum torque at desired operating speeds.

Integrating with Lin Engineering’s top-of-line stepper motor will be CUI’s innovative AMT encoder technology. CUI’s AMT series is a range of rugged, high accuracy modular encoders available in incremental, absolute and commutation versions. Thanks to its innovative design, the AMT series is not susceptible to contaminants such as dirt, dust and oil that typically plague encoders in industrial environments.

Due to the digital nature of the encoder design, the AMT series also comes with a number of programmable features, including resolutions up to 4096 PPR, zero position, line drivers, and in the case of the absolute version, a 12-bit absolute output. Combined with an operating temperature from -40 up to +125°C, high accuracy, simple assembly and low current draw, the AMT provides a compelling solution for a range of applications.

“Lin Engineering is excited to partner with a well-respected company like CUI. The adoption of their AMT encoder technology with our latest stepper motor provides a uniquely rugged and efficient all-in-one solution unrivaled in the industry,” stated Mindy Cheng, R&D Manager at Lin Engineering.

“The high performance and reliability of Lin Engineering’s stepper motor paired with our innovative AMT encoders presented a tremendous opportunity for both companies,” said Jeff Smoot, CUI’s VP of Motion Control and Application Engineering. “This partnership is the culmination of those efforts to provide a motor and motion control solution in one package and we are thrilled to work with Lin Engineering moving forward,” Smoot concluded.

For more information, visit www.cui.com.

ON Semiconductor to Debut First to Market, Truly Scalable Design Platform for Next Generation Wearable Technology at CES 2017
Posted: 2016-11-29
Flexible development kit comprises hardware, firmware, integrated development environment (IDE) & downloadable SmartApp to support creation of everything from simple fitness trackers to complex smart watches

ON Semiconductor, driving energy efficient innovations, has utilized its strength and depth in a broad range of semiconductor disciplines - including analog, power management, sensor interface and signal conditioning - to introduce a comprehensive development resource for the wearable electronics sector. The new Wearable Development Kit (WDK1.0) combines a wide array of highly optimized components, with the objective of assisting OEMs in bringing differentiated products to market. Using it can significantly accelerate design cycles for wearable electronics while mitigating heavy engineering costs.

"Despite the growing interest in wearable electronics, to date there is simply not a solution on the market that provides the scope needed by OEMs to help them develop feature rich designs that will attract strong consumer uptake," states AJ ElJallad, senior manager, corporate strategy and business development at ON Semiconductor. "The WDK1.0 is a multi-faceted design asset that will allow wearable technology projects to be expedited - shortening time to market and curbing the associated investment in engineering by leveraging the extent of ON Semiconductor's product portfolio."

For this new offering, a high efficiency programmable NCP6915 DC-DC converter has been specified to take care of the power management tasks. An NCP1855 battery charger IC, plus an LC709203F fuel gauge and a 10 watt (W) rated SCY1751 wireless charging front-end controller (supporting AirFuel compatible magnetic resonance charging) have also been incorporated. The kit's sensor capabilities stem from the MEMS-based FIS1100 inertial measurement unit (IMU), with 3-axis gyroscope and 3-axis accelerometer operation enabling accurate multi-dimensional motion tracking. There is also an embedded temperature sensor included and an LC898301 driver IC for initiating haptic feedback.

Critical to the WDK1.0 is its wireless connectivity, which is addressed via an ultra-lower power nRF52832 multi-protocol system-on-chip (SoC) from Nordic Semiconductor. This features a 32-bit ARM® CortexTM processor core and a 2.4GHz transceiver - offering support for Bluetooth Low Energy (BLE) and other relevant wireless technologies. The kit is complemented by a SmartApp which can be downloaded directly from Android PlayStore and Apple AppStore. Using this, various pieces of information can be transposed, such as the steps taken, calories burnt, distance covered and activity period, as well as human machine interface aspects like screen brightness adjustment, clock face control, alarm settings and establishing fitness goals. An Eclipse-based IDE accompanies the kit. This presents engineering teams with all the resources they need to rapidly create and subsequently debug code necessary for designs. A highly intuitive Project Wizard further facilitates the development process, by giving engineers access to numerous useful wearable-related project examples.

For more information, visit www.onsemi.com.

 

CUI: Ultra-Compact Open Frame Ac-Dc Power Supplies are Ideal for Space-Constrained Applications
Posted: 2016-11-18

CUI Inc announces a family of ultra-compact ac-dc power supplies in an open frame SIP package. The 3 W and 5 W configurations of the PBO series measure as small as 35 x 11 x 18 mm (1.38 x 0.43 x 0.71 in), allowing them to occupy less board real-estate than other power solutions. The 3 W models are also available in low-profile, right-angle versions measuring as small 35 x 18 x 11 mm (1.38 x 0.71 x 0.43 in), making them ideal for applications where vertical board space is at a premium.

Available with typical efficiencies up to 80%, the high density PBO series offers a wide input voltage range of 85 to 264 Vac or 70 to 400 Vdc for high voltage dc-dc systems. Single output voltages of 3.3, 5, 9, 12, 15 and 24 Vdc are available depending upon the series. For use in challenging environments, the 3 W models offer a wide operating temperature range of -40 to +85°C while the 5 W models provide a range from -25 to +85°C.  Additionally, all models are designed to provide 3,000 Vac input to output isolation.

The PBO series also meets UL60950-1/EN 60950-1 standards, complies with EN55022 Class B limits for conducted and radiated emissions and includes over current and short circuit protections. The ultra-compact models are ideally suited for a variety of applications including industrial systems, automation equipment, security, telecommunications and smart home devices.

For more information, please visit www.cui.com or contact CUI at www.cui.com/contact

ON Semiconductor Continues to Expand IoT Portfolio with Sigfox Certification for North American Market
Posted: 2016-11-16
Robust, energy efficient and ready-to-use wireless connectivity solutions enable device-to-cloud for adoption of IoT in the energy sector

ON Semiconductor, driving energy efficient innovations, has announced the expansion of the certification of its Sigfox wireless connectivity-based solutions to the North American market at this year's European Utility Week. This complements the existing certification of the robust, easy-to-use Sigfox products for Europe, and precedes a planned roll-out to Australia, New Zealand, Japan and Korea by the end of 2016.

ON Semiconductor's Sigfox portfolio provides an important enabler for the implementation and proliferation of Internet of Things (IoT) applications across an almost limitless number of market sectors, including smart energy. The portfolio includes certified modules with protocol software stacks, transceivers, microcontrollers (MCUs) and System-on-Chip (SoC) solutions. In addition, a range of hardware and software development tools are available to help speed and ease new designs for customers.

"Robust and dependable wireless connectivity is an essential element of smart energy, an exciting market with huge potential for rapid growth," said Ryan Cameron, VP and GM of the Industrial and Offline Power Division at ON Semiconductor. "By achieving North American certification and FCC compliance for our Sigfox products, we are significantly extending the geographic coverage of our range of solutions."

"Sigfox certification for the North American market is an important milestone for both ON Semiconductor and Sigfox, and demonstrates our common commitment to enable a global IoT ecosystem for our customers," said Tony Francesca, Sigfox vice president of Global Ecosystem Partners.

In addition to featuring ON Semiconductor's Sigfox portfolio, the company's booth at European Utility Week 2016 will also include exhibits and demonstrations of a number of other products and technologies for the smart energy industry that support the energy efficiency and sustainable development goals of the sector. These include a connected PIR sensor developed in cooperation with Sigfox and running on thethings.IO IoT platform.

Another demonstration will feature ON Semiconductor's IoT Development Kit (IDK). This modular tool provides engineers with all of the hardware and software building blocks needed to speed the evaluation, design and implementation of industrial, medical and smart home IoT applications. Finally, visitors will be able to see a connected "smart" water meter, which utilizes ON Semiconductor's Sigfox products to provide a system for MODBUS and MBUS, pushes water meter data to the Sigfox cloud, and is able to connect to the meter and operate without the need for a power connection.

Visit www.onsemi.com for more detailed product information about ON Semiconductor's Sigfox solutions.

Ericsson 120A dual-phase DC/DC converter delivers up to 480A in parallel configurations
Posted: 2016-11-9
  • New BMR467 enables current sharing with up to four modules to deliver 480A
  • Industry-leading power density of 15A/cm3 (250A/in3) achieves 120A in a 50.8 x 19.05 x 8.2mm SIP package
  • Key features include Automatic Digital Compensation and a half-load efficiency of 93.2% at 12Vin, 1.8Vout
  • Pin compatible with its predecessor, the BMR467 is also compliant with the new ‘teraAMP’ AMP (Architects of Modern Power) standard

Ericsson announced the launch of a new two-phase 120A 3E digital point-of-load (POL) DC/DC power module. The BMR467 is pin compatible with its predecessor, the BMR465, but its upgraded design delivers 30A more current. The module is also compliant with new ‘teraAMP’ standard developed by the AMP (Architects of Modern Power) Group™.

Multiple BMR467 products can easily be connected in parallel to provide loads of up to 480A, which makes it ideal for advanced network processors that require high performance power delivery with advanced software control for improved flexibility. These capabilities also make the BMR467 ready for future Software-Defined Power Architecture (SDPA) systems, which power system architects foresee as the way to achieving highly efficient and energy-optimized network architectures by 2020.

The BMR467 POL converter can be operated as a standalone unit delivering 120A at output voltages from 0.6V to1.8V, an output power up to 216W, as well as being part of a larger power system when processor boards require higher current. Built on a two-phase topology, four BMR467 modules can be connected in parallel together to deliver up to 480A. The BMR467 modules can become part of a multi-module and multiphase (up to eight-phase) power system that enables phase spreading, which reduces peak current and also the number of capacitors required by end systems. The module can easily be configured with support available via the downloadable Ericsson Power Designer software tool.

The BMR467 offers automatic digital compensation to provide stability, accurate line and load regulation, and excellent transient performance across a wide range of operating conditions, including switching frequency, input voltage, output voltage and output capacitance.

“The BMR467 delivers a high level of flexibility for power system architects, offering 120A as a stand-alone module or up 480A when paralleled with up to four modules,” said Martin Hägerdal, President, Ericsson Power Modules. “Integrating advanced power transistor technologies to provide industry-leading power density, this new point-of-load DC/DC module offers the latest in compensation-free technology as well as delivering superb line-regulation characteristics for modern advanced power applications.”

Like its previous family members, the BMR467 has been designed and manufactured by Ericsson to meet the highest standards available in the industry for DC/DC power converters. The device delivers the levels of quality and confidence expected by power system designers to develop reliable long-term and high-performance platforms.

For more information visit www.ericsson.com/powermodules.

 

ON Semiconductor Expands Support for IoT with Modular Development Platform for Industrial, Medical and Smart Home Markets
Posted: 2016-11-7

ON Semiconductor, driving energy efficient innovations, has introduced a modular IoT Development Kit (IDK) that provides engineers with all of the hardware and software building blocks needed to speed the evaluation, design and implementation of medical, home and industrial IoT applications.

ON Semiconductor offers a market-leading portfolio of power-efficient semiconductors for smart and connected IoT designs that includes sensors, power management, connectivity, processors and actuators. By combining these silicon solutions with a comprehensive software framework, the IDK offers a modular, easy-to-use and compact platform that provides developers with access to everything they need to rapidly develop cloud-based IoT designs.

The ON Semiconductor IDK incorporates a variety of module options for sensing, wired and wireless connectivity, and actuation. Its comprehensive software development framework encompasses an embedded operating system (ARM® mbedTM OS), drivers, APIs for hardware shields, a graphical user interface (GUI) and sample applications code. Built-in support for cloud software enables the platform to deliver data into the cloud for value-added services such as analytics. The extensible modular architecture includes a variety of industry-standard interfaces such as Arduino and PmodTM, allowing the seamless integration of existing and future modules from both ON Semiconductor and third parties.

"ON Semiconductor offers a one-stop-shop of leadership semiconductor elements for industrial, medical and home IoT applications. By providing a single, modular, extensible platform that combines hardware, software and support for integrating third parties, the new IDK allows engineers to quickly and easily harness the power of ON Semiconductor solutions and significantly simplify the prototyping of cloud-based applications," said Wiren Perera, IoT Strategist for ON Semiconductor.

The IDK is capable of supporting numerous application areas, including industrial automation, intelligent lighting, building automation, smart cities and a wide range of medical monitoring solutions. The ON Semiconductor booth at Electronica 2016 will feature demonstrations built using the IDK, including wireless and PoE-based smart lighting, heart rate monitoring, energy harvesting wireless sensor-based fault prevention and an automated window shutter.

As well as the IDK-based demos, visitors to the ON Semiconductor Electronica booth will have the opportunity to see other examples of IoT designs such as a PIR-based motion alarm featuring Sigfox cloud connectivity, an intelligent water meter and a smart power application.

For more information, visit www.onsemi.com.

 

CUI Introduces High Performance Dc Fan Line to Bolster Thermal Management Portfolio
Posted: 2016-11-2

CUI’s Components Group today announced the addition of a high performance dc fan line to its existing thermal management portfolio. The CFM series with frame sizes of 40, 50, 60, 70, 80, 92 and 120 mm delivers airflow ranging from 10 CFM in the 40 mm series to over 200 CFM in the 120 mm series.

Available with rated voltages of 5, 12, 24 and 48 Vdc, all dc fans feature dual ball bearing construction for maximum reliability and come as standard with auto restart protection. Static pressure values for the CFM series range from 2.79 up to 19.8 mm H2O with low rated currents from 0.1 to 1.4 A. Options for tachometer signal, rotation detector and PWM control signal are also available depending upon the model.

The CFM series also carries UL/cUL 507 and TUV (EN 60950-1) safety approvals while complying with EN55022 Class B limits for conducted and radiated emissions. All models are RoHS compliant.

Thanks to their variety of frame sizes and superior airflow, CUI’s line of dc fans are the ideal cooling solution for IT and telecommunications equipment, medical devices and industrial applications.

For more information visit www.cui.com.

Cornell Dubilier Flat Aluminum Electrolytic Capacitors with Near-Hermetic, Welded Seals Offer 5,000 Hour Life at 125 °C, Rugged Design
Posted: 2016-11-1

Cornell Dubilier Electronics, Inc. (CDE) has introduced the latest in its series of Flatpack ruggedized flat aluminum electrolytic capacitor, the MLSG.  This series targets compact power supply applications in military and aerospace, as well as other critical systems.  Design enhancements and a new electrolyte push the MLSG to nearly double the operating life of its predecessor, at no added cost.  Two principal package profiles are offered in this technology, the MLSG Flatpack which measures just 0.5” thick and 1.75” wide and the MLSG Slimpack measuring 0.5” thick by 1.00” wide, both offered in length increments of, 1.5”, 2.0”, 2.5” or 3.0”.

MLSG Flatpack capacitors can be made to withstand up to 50g vibrations (10g standard) and altitudes greater than 80,000 feet.  With stainless steel cases and near hermetic welded seals, they are built for extended duty in very harsh conditions.  Especially noteworthy is that a high level of performance is maintained over the full operating temperature range.  Capacitance retention at -55 °C is very strong, with excellent high temperature performance up to +125 °C.   The new electrolyte system is fully REACH compliant, allowing application of the components in a broad range of applications where space efficiency and extraordinarily long life are required.

A wide range of standard capacitance values from 220 µF to 24,000 µF are available, with voltage ratings up to 250 Vdc.   The unique flat package design does more than save space.  It is easily cooled, and can offer unique flexibility in ganging two or more devices in ways that conventional electrolytics can’t. 
Options include High Vibration (HV), for performance to 50g and High Reliability (HR), with burn-in at rated voltage and 85 °C.  Where a true glass-to-metal hermetic seal is required, CDE offers the MLSH Slimpack, which is similarly constructed in a flat stainless steel package.  It is available in nine values, from 120 µF to 3,200 µF, with ratings up to 250 Vdc.

“The latest MLSG Flatpack capacitors are purpose-built for their mission,” said Mike McGeachie, design and application engineer. “They provide a very high level of electrical and environmental performance.  Engineers don’t usually have such an option when selecting passives.”

For more information visit www.cde.com.

Industry First Intelligent Charge Controller from ON Semiconductor Meets the Exacting Demands of Next Generation Power Banks
Posted: 2016-10-18
Offering an intelligent feature set along with best-in-class integration to simplify and accelerate time to market

ON Semiconductor, driving energy efficiency innovations, has introduced a highly integrated single chip power bank solution for the development of next generation Li-Ion powered products. The LC709501F total Li-Ion battery solution offers broad power and voltage/current output range of 5 volt (V), 9 V and 12 V operation, with a maximum charge/discharge capability of up to 30 watts (W) through simple FET selection.

The LC709501F determines what type of device is connected and automatically selects the fastest available method for charging. Advanced users can even reprogram the LC709501F to support custom charge/discharge profiles, as well as USB Type-C and PD "Policy Engine" functions. This single-chip solution includes integrated fuel gauge function, configurable I/O, LED drivers, I2C interface, and pre-drivers for external power MOSFETs, providing system flexibility. A design reference kit is available to realize fast time to market. The LC709501F supports various output power levels up to 30 W, by changing external MOSFETs. In addition, there is an integrated USB 2.0 Full Speed host controller.

The LC709501F's USB host controller supports connectivity with iOS and Android apps that enable the device to communicate with the connected smartphone and subsequently make use of its display to show information concerning the battery health and the charging process (charging time, battery life, number of charging cycles completed, etc.). The device works with the proprietary charging protocols (such as Fast Charge and Qualcomm® Quick ChargeTM) now being utilized by smartphone manufacturers to accelerate the charging period. To ensure operational longevity, over-current, over-voltage, and redundant battery protection mechanisms are all included, as well as a thermistor for monitoring of temperature levels. The LC709501F supports an operational temperature range of -40 °C to +85 °C.

"With a growing need for on-the-go recharging of portable electronics, power banks are certain to become more prevalent over the coming years," states Matthew Tyler, Director Strategy and Product Roadmap Definition of the Digital and DC/DC Division at ON Semiconductor. "Accurate and reliable charge capacity indication and the ability to support the latest quick charging standards are becoming more critical, especially as power bank capacities have grown over time. The level of sophistication that power banks possess is destined to increase, so that batteries can be replenished as quickly as possible and inconvenience is minimized. The new, best-in-class LC709501F charger will enable the creation of compact, highly efficient, feature-rich power banks that will simplify and accelerate time to market of next generation power bank solutions. Its breadth of functionality will enhance the user experience and mean that high degrees of safety are maintained."

For more information, visit www.onsemi.com.

New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio
Posted: 2016-10-16

CUI’s Components Group announced an expansion to its existing portfolio of power, audio and signal connectors with the addition of a USB product line. The new connector family incorporates USB 2.0 and 3.0 connectors available in Type A, Type B, Micro AB, Micro B, Mini AB and Mini B USB versions. Able to support data rates up to 5 Gbps in USB 3.0 models, the new product family is ideal for a variety of I/O applications in consumer and portable electronic devices, including mobile computing equipment, digital audio devices and high volume storage products.

Offered in jack or plug connector types with horizontal or vertical orientations depending on the model, the new USB line boasts a number of mounting styles including surface mount, cable mount, mid mount SMT and through hole, allowing them to plug into virtually any design.

For more information visit www.cui.com.

Ericsson raises the bar with high-current 780W power interface module for ATCA applications
Posted: 2016-10-16
  • Quarter-brick power interface module (PIM) converter targets high-power Advanced Telecom Computing Architecture (ATCA) server applications
  • Feature-packed ultra-high-efficiency module delivers 15A output current at 82°C with 1.5m/s (300 LFM) airflow
  • Low-EMI design meets CISPR Class B with minimal external components
  • Extensive range of energy monitoring functionalities via I2C or PMBus

Ericsson Power Modules today announced the PIM4710PD, an extension of the popular 3E* Power Interface Module (PIM) family and an even higher power version than its recently announced family member – the 600W PIM4610PD. The new module offers high current handling of 20A and increased power capability of 780W at the lower end of its input-voltage range with the capability to handle up to 1080W with a 54V input.

Compliant with the industry-standard quarter-brick footprint – measuring 57.9 x 36.8 x 21.33mm (2.28 x 1.45 x 0.84in) – the module has been optimised to simplify design in blade server applications based on ATCA and PICMG 3.7 systems. The PIM4710PD is also highly suited to server and storage systems in any industrial, telecom and data communications application that employs either distributed power or intermediate bus voltage architectures.

Martin Hägerdal, Head of Ericsson Power Modules, commented: “The PIM4710PD meets the demand for leading-edge and high-power 800W ATCA-based systems, especially in applications where there is minimal airflow. The world-class efficiency and high-power handling of this new module, in conjunction with its advanced digital capabilities, will deliver significant energy and cost savings to power system architects developing advanced blade server applications.”

Like the PIM4610PD, the new PIM offers built-in digital monitoring and an extensive range of energy-monitoring functionalities via its I2C/PMBus interface. The module also offers integrated hot-swap functionality and hold-up charge and discharge management. The inputs also include dual power feeds with OR’ing functionality and ‘enable’ signalling.

Protection features of the module include protection against input transients, reverse polarity, over-temperature, over-current, input under-voltage and inrush current. In addition, enabling the protection of processors and other key silicon devices including FPGAs, the module can be configured to enable a well-controlled shutdown procedure. The feature enables de-assertion of the Power Good pin following input power being below the assigned level.

For further information, please visit www.ericsson.com/powermodules.

Wolfspeed Delivers Industry’s First 1000V SiC MOSFET
Posted: 2016-10-6
Meets growing demand for efficient electric vehicle fast battery chargers

Wolfspeed, a Cree Company and a leader in silicon carbide (SiC) power products, has introduced a 1000V MOSFET that enables a reduction in overall system cost, while improving system efficiency and decreasing system-size. The new MOSFET, specially optimized for fast charging and industrial power supplies, enables a 30 percent reduction in component-count while achieving more than 3x increase in power density and a 33 percent increase in output power.

“Supporting the widespread implementation of off-board charging stations, Wolfspeed’s technology enables smaller, more efficient charging systems that provide higher power charging at lower overall cost. This market requires high efficiency and wide output voltage range to address the various electric vehicle battery voltages being introduced by automotive suppliers,” explained John Palmour, CTO of Wolfspeed.

“Wolfspeed’s new 1000V SiC MOSFET offers system designers ultra-fast switching speeds with a fraction of a silicon MOSFET’s switching losses. The figure-of-merit delivered by this device is beyond the reach of any competing silicon-based MOSFET,” Palmour added.

With the introduction of its 1000V SiC MOSFET, Wolfspeed leads the market with the industry’s most complete device portfolio. Wolfspeed was the first company to release a commercially qualified SiC MOSFET in 2011 and remains a leader today, committed to delivering great technology and value.

Designers can reduce component-count by moving from silicon-based, three-level topologies to simpler two-level topologies made possible by the 1000 Vds rating of the SiC MOSFET. The increase in output power in a reduced footprint is realized by the ultra-low output capacitance―as low as 60pF― which significantly lowers switching losses. This device enables operations at higher switching frequencies, which shrinks the size of the resonant tank elements and decreases overall losses, thus reducing heatsink requirements. Wolfspeed has determined these proof-points by constructing a 20kW full-bridge resonant LLC converter and comparing it to a market-leading 15kW silicon system.

For more complete technical information about Wolfspeed’s new 1000V MOSFET, download its datasheet here. For all other inquiries about Wolfspeed power products, please visit www.wolfspeed.com/power/products.

Economical Open Frame Ac-Dc Power Supplies Deliver up to 280 W in a Compact Package
Posted: 2016-10-4

CUI Inc today announced the expansion of its VOF open frame ac-dc power supply family with the introduction of 185, 225 and 280 W models. The VOF 185, VOF 225 and VOF 280 series are higher-power additions to CUI’s latest-generation open frame ac-dc power portfolio ranging from 6 to 150 W. Designed to offer a combination of economy and performance in a compact, industry standard 3” x 5” footprint, the single output power supplies deliver efficiencies up to 91% and no-load power consumption as low as 0.5 W at 230 Vac for energy-conscious ITE, industrial and consumer electronics applications.

The three new VOF series feature a wide universal input voltage range of 90 to 277 Vac and offer output voltage options of 12, 15, 24, 36 and 48 Vdc.  All models provide an operating temperature range at full load from -20 up to +50°C with forced air cooling, derating to 50% load at +70°C.  The new power supply family also carries UL/cUL and TUV 60950-1 safety certifications while meeting EN 55022 Class B and FCC Class B limits for radiated emissions.

For more information visit www.cui.com.
 

CUI: Waterproof Buzzers Developed for High-Moisture Environments
Posted: 2016-8-16

A new power connector family that provides impressive sealing capability and can withstand harsh environments is being released by Positronic, a company known for its reliable products and configurable design.

The innovative new Panther line of rugged electronic connectors is the first produced by the company to offer IP65/IP67 sealing capability; conformance to N45525-2 HL3, a globally recognized standard for smoke and toxicity requirements; and the ability to operate reliably at temperatures up to 200ºC. Panther also boasts up to 35 amps per contact, shock and vibration performance to EIA-364-28F test condition IV, and has an LCP insulator.

The strong and versatile Panther family is ideal for use in rail, aerospace, battery, earthmoving and other related applications. For more information, visit www.connectpositronic.com.

2015 Edition of PSMA Roadmap Report Projects Future Power Technology Developments
Posted: 2015-6-5
Latest edition of Power Technology Roadmap includes a 542-page report plus USB drive with recorded webinars

The Power Sources Manufacturers Association (PSMA) announces that the 2015 edition of its The Power Technology Roadmap is now available. The report, which forecasts the power technology and power delivery trends through 2019, includes a printed report along with a feature-rich USB memory drive containing recorded webinars with up-to-date explanations of the information contained in the final report. The recordings are extremely helpful in that they enable the listener to understand the context and the subtext of the report materials, as explained by the actual presenters. Non-PSMA members may purchase the report at psma.com. PSMA Regular and Associate member companies have been sent copies of the printed report and USB memory drive versions of 2015 edition as a benefit of their membership.

New this year to the PSMA Power Technology Roadmap report is a retroactive study that examines how the past roadmap trends from 2003 to 2013 compared with the current trends in this report. This study was added because the goal of the PSMA is not only to identify future trends, but also to examine its earlier predictions to see how they turned out. This study provides a very interesting review of the developments of trends to help industry professionals understand the micro-transitions that may have turned into major inflection points in power electronics history. Key results of this study, as well as the summary that was presented at the APEC2015 Plenary Session, are also included.

Continuing from previous editions are essay contributions by industry experts contained in the reports’ Applications Trends and Emerging Technologies sections. The 2015 Application Trends topics cover a range of segments, such as automotive, battery charging, computing, consumer, renewables, industrial, LED lighting, medical, mil/aerospace, and motor control.  This years’ Emerging Technologies section includes topics on 3D packaging, power SoCs, servers, additive manufacturing, high-frequency magnetics, high-power wireless charging, smart grid, energy storage and smart buildings.

“The culmination of the PSMA’s webinars, surveys, presentations and discussions is a comprehensive and consolidated view of the latest trends in power management, power control and power delivery technologies,” said Aung Thet Tu, Co-Chair of the organizing committee. “The 2015 report offers a trove of information both in the written report and recorded webinars.”

Eric Persson, Co-Chair of the organizing committee, said: “The breadth and depth of the information we’ve compiled for the 2015 report is unprecedented. By capturing the technical trends and issues facing the power sources industry, we hope and expect industry professionals to find this report useful, thought-provoking and valuable.”

For information about purchasing the report, please to the PSMA website at: www.psma.com. The non-member price is $2,790. For PSMA members companies who may want to purchase additional copies, the member price is $170. PSMA Affiliate members may also purchase the report for $170.

New Technology Report Introduced at APEC 2015
Posted: 2015-3-21
Current Development in 3D Packaging With Focus on Embedded Substrate Technologies

At APEC 2015, the PSMA Packaging Committee will introduce the first comprehensive study of the feasibility of using Embedded Substrate Technologies to build power sources. The report entitled “Current Developments in 3D Packaging with Focus on Embedded Substrate Technologies” will also be discussed at the Industry Session on 3D Packaging. The report was prepared under contract by LTEC Corporation with work subcontracted to Anagenesis and Fraunhofer-Institute. The intent of this article is to provide PSMA members a high level preview of the contents of Technical Report.

The PSMA Packaging Committee believes the 340 page report with extensive illustrations of the leading edge product technologies will provide valuable insights to executives and managers in their own analysis of how currently available materials and processes could be best used for the creation of advanced high efficiency, high power-density power electronic products. The report builds upon the findings of the Phase I report - 3D Power Packaging - issued by the Power Sources Manufacturers Association (PSMA) Packaging Committee in 2014.

Background

Let’s begin with a little background. The power electronics industry and the semiconductor industry are inseparably intertwined with one another, and both are facing unprecedented market challenges for efficiency, cost, construction and thermal issues which provide many opportunities for innovation. These industries are in the focal point of the “energy challenge” a multifaceted problem that involves mobile and cloud infrastructure systems, Internet-of-Things, renewable energy, smart grid, vehicle electrification, and across-the-board power efficiency enhancements in order to keep up with the industry's rapid growth in data consumption. These are the competiveness and sustainability challenges of the twenty-first century.

The paradigm shift we have been experiencing in semiconductor packaging technology was brought about by advanced deep submicron semiconductor technology reaching a “cost barrier” that prevented further cost reduction by adding more functions to the semiconductor die. This barrier was circumvented through the development of wafer thinning that enabled through-silicon-via (TSV) technology, and the eventual introduction of 2.5D and 3D integration that facilitated heterogeneous (“More than Moore”) integration. It will allow the power requirements of the digital load to increase 2 to 5 times, within the same footprint, in a single generation. The power sources community must now find ways to package power sources that will meet this demand, but with no increase in footprint.

In parallel, power semiconductor technology has been facing a “construction barrier” that prevents realization of the huge benefits new technology can offer in terms of increased power efficiency and higher power density. These new technologies which include gallium-nitrogen (GaN), silicon-carbon (SiC), and gallium-arsenic (GaAs) power semiconductor devices all require operation in an environment that is free of bond wires and minimizes parasitic interconnect elements. The best possible packaging technology to achieve this is embedding active and passive components in organic or inorganic substrates.

Overview of the Report

The report begins with a discussion of PCB embedding technology, which is fueled by the rapid evolution of low-power embedding and 3D packaging technologies, which are in high volume production. These technologies will in turn enable power electronic systems to deliver higher efficiency and higher power density.

Embedding Actives and Passives in Substrate using Shinko Electrics Molded Core Embedded Package
Embedding Actives and Passives in Substrate using Shinko Electrics Molded Core Embedded Package (MceP®)

In addition to substrates the report dedicates entire chapters to each of the passive components (resistors, capacitor, and inductors) as well interposers and additive manufacturing.

Embedding using Formed or Inserted Components
Embedding using Formed or Inserted Components

The report also discusses high temperature die and component attach technologies that are evolving rapidly in the research labs; however, a single, low-cost, “one-size-fits-all applications” high-lead solder-substitution technology is currently unavailable and addresses the fact that high power-density component embedding and 3D packaging of power semiconductor devices also have to overcome a “thermal barrier.” Simply stated, it is more challenging to remove heat generated within the body of a 3D integrated system than from a planar, two-dimensional surface. This leads to a discussion of advanced thermal management technologies which are key enablers for 3D packaging as well as PCB embedding.

The authors acknowledge and devote a chapter to the fact that high power-density component embedding and 3D packaging of power semiconductor devices also have to overcome a “thermal barrier.” Simply stated, it is more challenging to remove heat generated within the body of a 3D integrated system than from a planar, two-dimensional surface. This leads to a discussion of advanced thermal management technologies which are key enablers for 3D packaging as well as PCB embedding.

In addition to their primary research, the team conducted a worldwide literature review and analysis of research and development (R&D) published by participating organizations in the USA, Asia-Pacific Region, and the EU, and identified several potentially high-impact technologies of interest to the power electronics and the semiconductor industries.. In terms of leadership positions, Germany and the EU appear to lead in the area of high-power PCB embedding and research into vertical interconnect/high-lead replacement technology, while Japan is leading in low power, high-density embedding, high performance, low CTE, high modulus (low warpage) substrates, and organic interposer technologies.

Finally the report highlights some of the technology gaps as well as a recognition that this new technology requires updated or additional standards for manufacturing and testing. This report reviews the existing and pending new standards for PCB embedding which the IPC Association has taken the lead to author. However, much additional standard action is needed since the manufacturing supply chain is still evolving. Procedures need to evolve to establish compatibility of up-top metal-die design and PCB layout rules, testing, quality control, and for assigning ownership of failure.

In summary, there has been substantial progress and excellent opportunities lie ahead for the power electronics and semiconductor industries and the entire manufacturing ecosystem to embrace PCB embedding and 3D packaging technologies for power electronic applications. The intersection of these technologies with the emerging wide-bandgap power semiconductor technology creates truly exciting possibilities at the same time the power electronics industry faces unprecedented challenges to help mitigate the fast growing demand for electricity and environmental problems our world faces. Embedded substrate packaging technologies can be, and will be deployed in hybrid and electric vehicles, alternative energy generation and distribution systems, smart grid, industrial, and military aerospace applications in the coming years and beyond. These technologies, combined with wide-bandgap semiconductor devices will literally re-vitalize the entire power electronic infrastructure block by block, module by module, for the twenty-first century.

As a benefit of PSMA membership, the Current Development in 3D Packaging with Focus on Embedded Substrate Technologies report will be sent to all PSMA Regular and Associate member companies and Affiliate companies will be able to purchase the report at a reduced price. The report will also be offered to others in the industry at a price of $2990. You can view the report at the PSMA Exhibit booth at APEC 2015 and shortly the Table of Contents will be available on the PSMA website: www.psma.com.

 

Submitted by the PSMA Packaging Committee.
Brian Narveson
Co-chairman
  Brian Narveson   Ernie Parker  
Ernie Parker 
Co-cha

 

PSMA Publishes Technology Report: “Current Development in 3D Packaging With Focus on Embedded Substrate Technologies”
Posted: 2015-3-17
Comprehensive report is the first to address “More than Moore” digital power demands by accelerating the development of higher density power sources using new, disruptive packaging technologies

March 16, 2015—The PSMA (Power Sources Manufacturers Association) Packaging Committee announced today that it has published a report titled “Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies.” The first comprehensive study on using embedded substrate technology for building power sources, the report contains extensive research and product illustrations geared to an audience of technology executives and design engineers. Its purpose is to offer an in-depth industry perspective on how currently available materials and processes can be best used for the creation of advanced high-efficiency, high-power-density power products.

The PSMA created the 3D packaging report to address the pressing demands in the power industry to accelerate the development of higher density power sources. The first challenge arose from digital semiconductor packaging technology hitting a “cost barrier” brought about when advanced deep-submicron semiconductor technology could no longer reduce cost with the addition of more functions to the semiconductor die. This barrier was circumvented through the development of wafer thinning that enabled through-silicon-via (TSV) technology and the eventual introduction of 2.5D and 3D integration, which facilitated heterogeneous (“More than Moore”) integration. This integration allowed the power requirements of the digital load to increase two to five times, within the same footprint, in a single generation. Now the power industry is tasked with finding ways news ways to package power sources that will meet this demand, but without increasing footprint.

In parallel, power semiconductor technology is facing a “construction barrier” that prevents the realization of the significant benefits new technology can offer in terms of increased power efficiency and higher power density.  These new technologies, including gallium-nitride (GaN), silicon-carbide (SiC), and gallium-arsenic (GaAs) power semiconductor devices, all require operation in a package that is free of bond wires and that minimizes parasitic interconnect elements. Both of these challenges can be addressed with power packaging utilizing embedded substrate technologies and are addressed in the report.

The PSMA’s 340-page report, prepared under contract by LTEC Corporation with work subcontracted to Anagenesis and Fraunhofer-Institute, is based on the Packaging Committee’s extensive research of over 750 articles and papers, analysis of 450 presentations/papers, and by conducting 30 industry expert interviews. Information was also derived from attendance at 10 industry conferences, workshops and seminars. The report contains 172 links and 394 citations.
The report provides detailed analysis of substrates (organic and inorganic), components (actives and passives), thermal management, high temperature die, packaging technologies, interposers, as well as additive manufacturing and laser fabrication. Each passive component (resistors, capacitors, inductors) has an entire chapter detailing which suppliers are currently shipping products usable in power sources.  Every chapter covers manufacturing issues and includes references to contract manufacturing companies already producing power products utilizing embedded substrate technology. Embedded substrate packaging leverages the large investment made by the digital industry in advanced packaging technologies and is being used to resolve the power source construction challenge. As the report demonstrates, 3D power packaging using embedded substrate technology is a disruptive technology, in that it enables large increases in power density and efficiency.

Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the  challenges companies will face to implement embedded substrate 3D power packaging to create the significantly higher power densities driven by the “More than Moore” digital power demands.”

The PSMA report on 3D packaging will be provided free of charge to PSMA Regular and Associate members.  Affiliate members can purchase the report for the reduced price of $190.  Others interested in the report may order a copy from PSMA for $2,990. 
 

Power Sources Manufacturers Association Reprints Classic Magnetics Text
Posted: 2011-7-25

 

MENDHAM, N.J. – June 23, 2011 − The Power Sources Manufacturers Association (PSMA) announced that it is again making available Nathan Grossner's classic treatise, Transformers for Electronic Circuits - Second Edition. The first reprint of this work sold out and this second reprint is now available. PSMA members may now purchase this important text online, directly from PSMA, at the discounted price of $55. The non-member PSMA online price is $75. Non-members may also purchase it through How2Power or through Amazon. This text is a complete, one-stop guide to transformer and inductor design and applications for everyone who designs, builds, or uses power magnetics components. Throughout this book, the author combines analysis and synthesis and all theory is related to the solution of real-world problems.

Sections of the text provide guidance in the use of transformers and inductors in power electronics and in digital and pulse circuits. Also included is design information about other forms of high-frequency magnetics such as transmission-line transformers, hybrid transformers, ferroresonant tranformers, flyback converter magnetics and inductors used in switch-mode power converter designs.

Special attention is given in the book to the proper control of dielectric stress, corona and thermal factors in high-voltage magnetics designs. Modeling methods for magnetic parts are also included and treated in some detail. This book is an essential reference book for any engineer involved in the design and development of modern-day magnetic components.

According to Steve Carlsen, co-chair of the PSMA Magnetics Committee, “Grossner's book should be an essential part of every power supply designer’s technical library. The initial PSMA reprint edition sold out and thanks to PSMA, it is once again available after being out of print for several years.”

PSMA Answers Continued Demand for Snelling Magnetics Text with 2nd Reprint
Posted: 2010-10-4

Mendham, New Jersey—June 1, 2010—The Power Sources Manufacturers Association (PSMA) has announced the renewed availability of SOFT FERRITES – Properties and Applications - Second Edition, authored by Eric Snelling. The book had been out of print for several years and was reprinted in limited quantity by the PSMA in 2006. Due to continued demand, a second reprinting is now available. The book was initially published in 1969 and was extensively revised by Snelling in 1988 to bring all eleven chapters in line with current design practices and applications of ferrite cores used in modern-day inductors and transformers. The aim of this unique 366-page reprint is to provide all the information on ferrite properties and wound-component design necessary for efficient applications of these materials. Data in the book are represented by means of extensive use of graphs and tables, and design procedures are supported by many working examples of inductors and transformers. According to Stephen Carlsen, PSMA Magnetics Committee Chair, “Snelling’s book is considered by many working design engineers as the ‘ferrite user’s bible’ and PSMA is pleased to make this wonderful text available once again.” Copies of Snelling’s classic treatise on magnetics, SOFT FERRITES – Properties and Applications - Second Edition, are available for sale at www.psma.com. The cover price for the reprint is $150 but PSMA members, as a benefit of their membership, can purchase the text for $100. The PSMA-reprint text is also available at the non-member price at www.amazon.com.

PSMA Announces Availability of On-Line Energy Efficiency Standards Database
Posted: 2009-4-12
Database offered as a free service to the industry; provides “one-click” access to details of standards by world region, agency and application.

Mendham, New Jersey — April 9, 2009 — The Power Sources Manufacturers Association (PSMA) announces availability of its On-line Energy Efficiency Database (EEDB) as a service to the industry. The number of energy efficiency standards and the world wide agencies that generate them continue to grow daily. It is time consuming for an individual or company to keep track of the many actions and activities by government and industry groups. The PSMA on-line energy efficiency standards database provides “one click” access to the very latest global standards and initiatives.

As a result of user feedback on an earlier version of the database, PSMA has incorporated a number of improvements. Some of the useful features:

•Quick access to world region, agency, or standards application
•Expanded data includes list of specific standards generated by an agency and parametric specifications for each regulation
•Expanded description of regulations and agencies
•Enhanced descriptions that include html code for quick linking to agency site or database location
•Latest schedule of standards meetings

Dusty Becker, PSMA Board Chairman and chair of the PSMA Energy Efficiency Committee, states that "The PSMA On-line Energy Efficiency Data Base, which incorporates a number of improvements suggested by product planners to keep current, is a valuable resource for engineers. We are pleased to offer this resource free of charge to our membership and to the industry."

Though access to the PSMA EEBD is free, users are required to register on www.psma.com/green/ so PSMA can provide notice of special database announcements and associated PSMA activities.

About PSMA

PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its membership which includes most major power supply companies.

PSMA Announces Reprint Availability of J. K. Watson's “Applications of Magnetism”
Posted: 2008-2-4
New reprint is the fourth title in PSMA's out-of-print Classic Book Series

MENDHAM, N.J. - February 4, 2008 ─ The Power Sources Manufacturers Association (PSMA) is pleased to announce availability of a reprint of the classic book "Applications Of Magnetism" authored by the late J. K. Watson and originally published by John Wiley and Sons in 1980. According to Ed Bloom "This classic book, written by one of the most respected teachers in the field of magnetics, makes the principles of applied magnetics accessible to the practicing electronics engineer. With emphasis on practical design, the text presents the relevant principles of physics, circuit analysis, simple models and the calculations involved in designing a circuit or a magnetic device. No prior knowledge of the physics of magnetism is assumed ─ material properties are explained in a step-by-step manner, with special attention to their effects on the volt-ampere characteristics of a magnetic device, and to the physics of magnetic domain processes. Applications of magnetics, including those associated with power electronics circuits, are covered as well as reluctance modeling methods for transformers and inductors." Copies of this practical design treatment of magnetics will be available for sale at this year's Applied Power Electronics Conference (APEC 2008) to be held in Austin, Texas, February 24-28, 2008 and through the PSMA web site - www.psma.com. Copies will sell for US$100, but members of PSMA companies can obtain a copy for US$50. To order directly from PSMA please complete the "members order form" or the "non-members order form". In the past three years, PSMA has reprinted three other classic books on magnetics including Transformers for Electronic Circuits by the late Nathan R. Grossman, Soft Ferrites - Properties and Applications by E.C. Snelling and Electronic Transformers and Circuits by the late Reuben Lee and associates. A limited number of the Snelling and Lee books are still available through www.psma.com. About PSMA PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants, interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization, whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its members, which include most major power supply companies.

PSMA Announces Latest Edition of Standardized Terminology Handbook
Posted: 2007-10-6
Third edition includes print and CD versions; provides comprehensive resource of power sources industry terminology

 

 

 

MENDHAM, N.J.,—October 5, 2007—The Power Sources Manufacturers Association (PSMA) is pleased to announce publication of The Handbook of Standardized Terminology for the Power Sources Industry–3rd Edition. Revised and expanded, this unique handbook contains hundreds of added terms, especially selected for the power electronics professional. The third edition also contains illustrations and four new appendices, including a listing of EMI specifications, excerpts from international standards of units and symbols, along with guides for authors of technical papers. These added resources provide concise, easy-to-use references for engineers involved in technical writing and presentations. Many new magnetic terms are described in this new 126-page third edition that are of particular interest to the practicing designer and marketer of power supplies and related products. Valuable information regarding worldwide power sources, standards agencies, and military specifications has been retained, updated and expanded from the previous edition. Titles of the appendices are: • Testing and Standards Agencies; Designer's Reference; • World Voltages and Frequencies; • Military Specifications; • EMI Specifications; • Writing Technical Papers for Archival Publications; Units, Symbols and Style Guide; A Brief Writing Guide. The book comes in hard copy along with a CD containing a PDF version that can easily be searched for terms and words within the definitions, making it a valuable tool for posting on your internal network. The book price is $25 to PSMA members and $50 to nonmembers. To order directly from PSMA please complete the "members order form" or the "non-members order form".

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