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ON Semiconductor Continues to Expand IoT Portfolio with Sigfox Certification for North American Market
Robust, energy efficient and ready-to-use wireless connectivity solutions enable device-to-cloud for adoption of IoT in the energy sector
ON Semiconductor, driving energy efficient innovations, has announced the expansion of the certification of its Sigfox wireless connectivity-based solutions to the North American market at this year's European Utility Week. This complements the existing certification of the robust, easy-to-use Sigfox products for Europe, and precedes a planned roll-out to Australia, New Zealand, Japan and Korea by the end of 2016.
ON Semiconductor's Sigfox portfolio provides an important enabler for the implementation and proliferation of Internet of Things (IoT) applications across an almost limitless number of market sectors, including smart energy. The portfolio includes certified modules with protocol software stacks, transceivers, microcontrollers (MCUs) and System-on-Chip (SoC) solutions. In addition, a range of hardware and software development tools are available to help speed and ease new designs for customers.
"Robust and dependable wireless connectivity is an essential element of smart energy, an exciting market with huge potential for rapid growth," said Ryan Cameron, VP and GM of the Industrial and Offline Power Division at ON Semiconductor. "By achieving North American certification and FCC compliance for our Sigfox products, we are significantly extending the geographic coverage of our range of solutions."
"Sigfox certification for the North American market is an important milestone for both ON Semiconductor and Sigfox, and demonstrates our common commitment to enable a global IoT ecosystem for our customers," said Tony Francesca, Sigfox vice president of Global Ecosystem Partners.
In addition to featuring ON Semiconductor's Sigfox portfolio, the company's booth at European Utility Week 2016 will also include exhibits and demonstrations of a number of other products and technologies for the smart energy industry that support the energy efficiency and sustainable development goals of the sector. These include a connected PIR sensor developed in cooperation with Sigfox and running on thethings.IO IoT platform.
Another demonstration will feature ON Semiconductor's IoT Development Kit (IDK). This modular tool provides engineers with all of the hardware and software building blocks needed to speed the evaluation, design and implementation of industrial, medical and smart home IoT applications. Finally, visitors will be able to see a connected "smart" water meter, which utilizes ON Semiconductor's Sigfox products to provide a system for MODBUS and MBUS, pushes water meter data to the Sigfox cloud, and is able to connect to the meter and operate without the need for a power connection.
Visit www.onsemi.com for more detailed product information about ON Semiconductor's Sigfox solutions.
New Device Brings Greater Design Flexibility While Enabling Bridgeless Totem-Pole PFC Designs
Transphorm Inc., a leader in the design and manufacturing of JEDEC-qualified 650V GaN (gallium nitride) semiconductors, today announced its latest portfolio addition: the TPH3212PS. Available in a TO-220 package, the device has an on-resistance of 72 mOhms (mΩ) and targets AC to DC and DC to AC power supplies. When used inside the former, the TPH3212PS—along with its family members—makes implementing bridgeless totem-pole power factor correction (PFC) designs possible.
To date, Transphorm’s product portfolio consists of 600V and 650V discrete FETs spanning TO-220, TO-247, and PQFN88 packages for power levels up to 4.5 kilowatts. The TPH3212PS fills a power level gap in the company’s second generation product line, specifically between the 52mΩ and 110mΩ FETs. As a result, battery charger, PV inverter, server and servo motor manufacturers gain more design flexibility with Transphorm’s newest high-quality, high-reliability discrete device.
Release of the TPH3212PS remains in step with Transphorm’s mission to enable design engineers to effectively implement GaN technology into designs. The company develops its GaN in well-understood TO-XXX and PQFN88 packages. Further, Transphorm uses the high-reliability cascode configuration, which eliminates the need for custom drivers and—most importantly—considerably increases the GaN FET’s gate safety margin.
“Transphorm aims to enable the market by delivering GaN in the highest quality, highest reliability format as possible,” said Umesh Mishra, CTO, Transphorm. “We recognize GaN is not just a drop-in replacement for silicon MOSFETs used today. Board redesign and system modifications are required to capitalize on GaN’s complete set of benefits from performance through to system cost. If we can minimize that learning curve by working with well-known packages and a configuration that behaves similarly to a MOSFET—we believe the industry will move further faster.”
Notable TPH3212PS benefits include:
- 30 to 40 percent increase in system level power density
- 2x to 4x faster switching compared to silicon; lowering crossover losses to increase system efficiency
- Compatible with off-the-shelf gate drivers; increasing gate safety margin to an industry-leading, unmatched +/- maximum 18V gate drive
- For designs moving from standard PFC to bridgeless totem-pole: eliminates use of a bridge rectifier, parallel FETs, and additional passives as the power level increases; reducing overall system cost
Learn more at transphormusa.com.
- New BMR467 enables current sharing with up to four modules to deliver 480A
- Industry-leading power density of 15A/cm3 (250A/in3) achieves 120A in a 50.8 x 19.05 x 8.2mm SIP package
- Key features include Automatic Digital Compensation and a half-load efficiency of 93.2% at 12Vin, 1.8Vout
- Pin compatible with its predecessor, the BMR467 is also compliant with the new ‘teraAMP’ AMP (Architects of Modern Power) standard
Ericsson announced the launch of a new two-phase 120A 3E digital point-of-load (POL) DC/DC power module. The BMR467 is pin compatible with its predecessor, the BMR465, but its upgraded design delivers 30A more current. The module is also compliant with new ‘teraAMP’ standard developed by the AMP (Architects of Modern Power) Group™.
Multiple BMR467 products can easily be connected in parallel to provide loads of up to 480A, which makes it ideal for advanced network processors that require high performance power delivery with advanced software control for improved flexibility. These capabilities also make the BMR467 ready for future Software-Defined Power Architecture (SDPA) systems, which power system architects foresee as the way to achieving highly efficient and energy-optimized network architectures by 2020.
The BMR467 POL converter can be operated as a standalone unit delivering 120A at output voltages from 0.6V to1.8V, an output power up to 216W, as well as being part of a larger power system when processor boards require higher current. Built on a two-phase topology, four BMR467 modules can be connected in parallel together to deliver up to 480A. The BMR467 modules can become part of a multi-module and multiphase (up to eight-phase) power system that enables phase spreading, which reduces peak current and also the number of capacitors required by end systems. The module can easily be configured with support available via the downloadable Ericsson Power Designer software tool.
The BMR467 offers automatic digital compensation to provide stability, accurate line and load regulation, and excellent transient performance across a wide range of operating conditions, including switching frequency, input voltage, output voltage and output capacitance.
“The BMR467 delivers a high level of flexibility for power system architects, offering 120A as a stand-alone module or up 480A when paralleled with up to four modules,” said Martin Hägerdal, President, Ericsson Power Modules. “Integrating advanced power transistor technologies to provide industry-leading power density, this new point-of-load DC/DC module offers the latest in compensation-free technology as well as delivering superb line-regulation characteristics for modern advanced power applications.”
Like its previous family members, the BMR467 has been designed and manufactured by Ericsson to meet the highest standards available in the industry for DC/DC power converters. The device delivers the levels of quality and confidence expected by power system designers to develop reliable long-term and high-performance platforms.
For more information visit www.ericsson.com/powermodules.
ON Semiconductor Expands Support for IoT with Modular Development Platform for Industrial, Medical and Smart Home Markets
ON Semiconductor, driving energy efficient innovations, has introduced a modular IoT Development Kit (IDK) that provides engineers with all of the hardware and software building blocks needed to speed the evaluation, design and implementation of medical, home and industrial IoT applications.
ON Semiconductor offers a market-leading portfolio of power-efficient semiconductors for smart and connected IoT designs that includes sensors, power management, connectivity, processors and actuators. By combining these silicon solutions with a comprehensive software framework, the IDK offers a modular, easy-to-use and compact platform that provides developers with access to everything they need to rapidly develop cloud-based IoT designs.
The ON Semiconductor IDK incorporates a variety of module options for sensing, wired and wireless connectivity, and actuation. Its comprehensive software development framework encompasses an embedded operating system (ARM® mbedTM OS), drivers, APIs for hardware shields, a graphical user interface (GUI) and sample applications code. Built-in support for cloud software enables the platform to deliver data into the cloud for value-added services such as analytics. The extensible modular architecture includes a variety of industry-standard interfaces such as Arduino and PmodTM, allowing the seamless integration of existing and future modules from both ON Semiconductor and third parties.
"ON Semiconductor offers a one-stop-shop of leadership semiconductor elements for industrial, medical and home IoT applications. By providing a single, modular, extensible platform that combines hardware, software and support for integrating third parties, the new IDK allows engineers to quickly and easily harness the power of ON Semiconductor solutions and significantly simplify the prototyping of cloud-based applications," said Wiren Perera, IoT Strategist for ON Semiconductor.
The IDK is capable of supporting numerous application areas, including industrial automation, intelligent lighting, building automation, smart cities and a wide range of medical monitoring solutions. The ON Semiconductor booth at Electronica 2016 will feature demonstrations built using the IDK, including wireless and PoE-based smart lighting, heart rate monitoring, energy harvesting wireless sensor-based fault prevention and an automated window shutter.
As well as the IDK-based demos, visitors to the ON Semiconductor Electronica booth will have the opportunity to see other examples of IoT designs such as a PIR-based motion alarm featuring Sigfox cloud connectivity, an intelligent water meter and a smart power application.
For more information, visit www.onsemi.com.
CUI’s Components Group today announced the addition of a high performance dc fan line to its existing thermal management portfolio. The CFM series with frame sizes of 40, 50, 60, 70, 80, 92 and 120 mm delivers airflow ranging from 10 CFM in the 40 mm series to over 200 CFM in the 120 mm series.
Available with rated voltages of 5, 12, 24 and 48 Vdc, all dc fans feature dual ball bearing construction for maximum reliability and come as standard with auto restart protection. Static pressure values for the CFM series range from 2.79 up to 19.8 mm H2O with low rated currents from 0.1 to 1.4 A. Options for tachometer signal, rotation detector and PWM control signal are also available depending upon the model.
The CFM series also carries UL/cUL 507 and TUV (EN 60950-1) safety approvals while complying with EN55022 Class B limits for conducted and radiated emissions. All models are RoHS compliant.
Thanks to their variety of frame sizes and superior airflow, CUI’s line of dc fans are the ideal cooling solution for IT and telecommunications equipment, medical devices and industrial applications.
For more information visit www.cui.com.
Cornell Dubilier Flat Aluminum Electrolytic Capacitors with Near-Hermetic, Welded Seals Offer 5,000 Hour Life at 125 °C, Rugged Design
Cornell Dubilier Electronics, Inc. (CDE) has introduced the latest in its series of Flatpack ruggedized flat aluminum electrolytic capacitor, the MLSG. This series targets compact power supply applications in military and aerospace, as well as other critical systems. Design enhancements and a new electrolyte push the MLSG to nearly double the operating life of its predecessor, at no added cost. Two principal package profiles are offered in this technology, the MLSG Flatpack which measures just 0.5” thick and 1.75” wide and the MLSG Slimpack measuring 0.5” thick by 1.00” wide, both offered in length increments of, 1.5”, 2.0”, 2.5” or 3.0”.
MLSG Flatpack capacitors can be made to withstand up to 50g vibrations (10g standard) and altitudes greater than 80,000 feet. With stainless steel cases and near hermetic welded seals, they are built for extended duty in very harsh conditions. Especially noteworthy is that a high level of performance is maintained over the full operating temperature range. Capacitance retention at -55 °C is very strong, with excellent high temperature performance up to +125 °C. The new electrolyte system is fully REACH compliant, allowing application of the components in a broad range of applications where space efficiency and extraordinarily long life are required.
A wide range of standard capacitance values from 220 µF to 24,000 µF are available, with voltage ratings up to 250 Vdc. The unique flat package design does more than save space. It is easily cooled, and can offer unique flexibility in ganging two or more devices in ways that conventional electrolytics can’t.
Options include High Vibration (HV), for performance to 50g and High Reliability (HR), with burn-in at rated voltage and 85 °C. Where a true glass-to-metal hermetic seal is required, CDE offers the MLSH Slimpack, which is similarly constructed in a flat stainless steel package. It is available in nine values, from 120 µF to 3,200 µF, with ratings up to 250 Vdc.
“The latest MLSG Flatpack capacitors are purpose-built for their mission,” said Mike McGeachie, design and application engineer. “They provide a very high level of electrical and environmental performance. Engineers don’t usually have such an option when selecting passives.”
For more information visit www.cde.com.
Industry First Intelligent Charge Controller from ON Semiconductor Meets the Exacting Demands of Next Generation Power Banks
Offering an intelligent feature set along with best-in-class integration to simplify and accelerate time to market
ON Semiconductor, driving energy efficiency innovations, has introduced a highly integrated single chip power bank solution for the development of next generation Li-Ion powered products. The LC709501F total Li-Ion battery solution offers broad power and voltage/current output range of 5 volt (V), 9 V and 12 V operation, with a maximum charge/discharge capability of up to 30 watts (W) through simple FET selection.
The LC709501F determines what type of device is connected and automatically selects the fastest available method for charging. Advanced users can even reprogram the LC709501F to support custom charge/discharge profiles, as well as USB Type-C and PD "Policy Engine" functions. This single-chip solution includes integrated fuel gauge function, configurable I/O, LED drivers, I2C interface, and pre-drivers for external power MOSFETs, providing system flexibility. A design reference kit is available to realize fast time to market. The LC709501F supports various output power levels up to 30 W, by changing external MOSFETs. In addition, there is an integrated USB 2.0 Full Speed host controller.
The LC709501F's USB host controller supports connectivity with iOS and Android apps that enable the device to communicate with the connected smartphone and subsequently make use of its display to show information concerning the battery health and the charging process (charging time, battery life, number of charging cycles completed, etc.). The device works with the proprietary charging protocols (such as Fast Charge and Qualcomm® Quick ChargeTM) now being utilized by smartphone manufacturers to accelerate the charging period. To ensure operational longevity, over-current, over-voltage, and redundant battery protection mechanisms are all included, as well as a thermistor for monitoring of temperature levels. The LC709501F supports an operational temperature range of -40 °C to +85 °C.
"With a growing need for on-the-go recharging of portable electronics, power banks are certain to become more prevalent over the coming years," states Matthew Tyler, Director Strategy and Product Roadmap Definition of the Digital and DC/DC Division at ON Semiconductor. "Accurate and reliable charge capacity indication and the ability to support the latest quick charging standards are becoming more critical, especially as power bank capacities have grown over time. The level of sophistication that power banks possess is destined to increase, so that batteries can be replenished as quickly as possible and inconvenience is minimized. The new, best-in-class LC709501F charger will enable the creation of compact, highly efficient, feature-rich power banks that will simplify and accelerate time to market of next generation power bank solutions. Its breadth of functionality will enhance the user experience and mean that high degrees of safety are maintained."
For more information, visit www.onsemi.com.
CUI’s Components Group announced an expansion to its existing portfolio of power, audio and signal connectors with the addition of a USB product line. The new connector family incorporates USB 2.0 and 3.0 connectors available in Type A, Type B, Micro AB, Micro B, Mini AB and Mini B USB versions. Able to support data rates up to 5 Gbps in USB 3.0 models, the new product family is ideal for a variety of I/O applications in consumer and portable electronic devices, including mobile computing equipment, digital audio devices and high volume storage products.
Offered in jack or plug connector types with horizontal or vertical orientations depending on the model, the new USB line boasts a number of mounting styles including surface mount, cable mount, mid mount SMT and through hole, allowing them to plug into virtually any design.
For more information visit www.cui.com.
- Quarter-brick power interface module (PIM) converter targets high-power Advanced Telecom Computing Architecture (ATCA) server applications
- Feature-packed ultra-high-efficiency module delivers 15A output current at 82°C with 1.5m/s (300 LFM) airflow
- Low-EMI design meets CISPR Class B with minimal external components
- Extensive range of energy monitoring functionalities via I2C or PMBus
Ericsson Power Modules today announced the PIM4710PD, an extension of the popular 3E* Power Interface Module (PIM) family and an even higher power version than its recently announced family member – the 600W PIM4610PD. The new module offers high current handling of 20A and increased power capability of 780W at the lower end of its input-voltage range with the capability to handle up to 1080W with a 54V input.
Compliant with the industry-standard quarter-brick footprint – measuring 57.9 x 36.8 x 21.33mm (2.28 x 1.45 x 0.84in) – the module has been optimised to simplify design in blade server applications based on ATCA and PICMG 3.7 systems. The PIM4710PD is also highly suited to server and storage systems in any industrial, telecom and data communications application that employs either distributed power or intermediate bus voltage architectures.
Martin Hägerdal, Head of Ericsson Power Modules, commented: “The PIM4710PD meets the demand for leading-edge and high-power 800W ATCA-based systems, especially in applications where there is minimal airflow. The world-class efficiency and high-power handling of this new module, in conjunction with its advanced digital capabilities, will deliver significant energy and cost savings to power system architects developing advanced blade server applications.”
Like the PIM4610PD, the new PIM offers built-in digital monitoring and an extensive range of energy-monitoring functionalities via its I2C/PMBus interface. The module also offers integrated hot-swap functionality and hold-up charge and discharge management. The inputs also include dual power feeds with OR’ing functionality and ‘enable’ signalling.
Protection features of the module include protection against input transients, reverse polarity, over-temperature, over-current, input under-voltage and inrush current. In addition, enabling the protection of processors and other key silicon devices including FPGAs, the module can be configured to enable a well-controlled shutdown procedure. The feature enables de-assertion of the Power Good pin following input power being below the assigned level.
For further information, please visit www.ericsson.com/powermodules.
Meets growing demand for efficient electric vehicle fast battery chargers
Wolfspeed, a Cree Company and a leader in silicon carbide (SiC) power products, has introduced a 1000V MOSFET that enables a reduction in overall system cost, while improving system efficiency and decreasing system-size. The new MOSFET, specially optimized for fast charging and industrial power supplies, enables a 30 percent reduction in component-count while achieving more than 3x increase in power density and a 33 percent increase in output power.
“Supporting the widespread implementation of off-board charging stations, Wolfspeed’s technology enables smaller, more efficient charging systems that provide higher power charging at lower overall cost. This market requires high efficiency and wide output voltage range to address the various electric vehicle battery voltages being introduced by automotive suppliers,” explained John Palmour, CTO of Wolfspeed.
“Wolfspeed’s new 1000V SiC MOSFET offers system designers ultra-fast switching speeds with a fraction of a silicon MOSFET’s switching losses. The figure-of-merit delivered by this device is beyond the reach of any competing silicon-based MOSFET,” Palmour added.
With the introduction of its 1000V SiC MOSFET, Wolfspeed leads the market with the industry’s most complete device portfolio. Wolfspeed was the first company to release a commercially qualified SiC MOSFET in 2011 and remains a leader today, committed to delivering great technology and value.
Designers can reduce component-count by moving from silicon-based, three-level topologies to simpler two-level topologies made possible by the 1000 Vds rating of the SiC MOSFET. The increase in output power in a reduced footprint is realized by the ultra-low output capacitance―as low as 60pF― which significantly lowers switching losses. This device enables operations at higher switching frequencies, which shrinks the size of the resonant tank elements and decreases overall losses, thus reducing heatsink requirements. Wolfspeed has determined these proof-points by constructing a 20kW full-bridge resonant LLC converter and comparing it to a market-leading 15kW silicon system.
For more complete technical information about Wolfspeed’s new 1000V MOSFET, download its datasheet here. For all other inquiries about Wolfspeed power products, please visit www.wolfspeed.com/power/products.
CUI Inc today announced the expansion of its VOF open frame ac-dc power supply family with the introduction of 185, 225 and 280 W models. The VOF 185, VOF 225 and VOF 280 series are higher-power additions to CUI’s latest-generation open frame ac-dc power portfolio ranging from 6 to 150 W. Designed to offer a combination of economy and performance in a compact, industry standard 3” x 5” footprint, the single output power supplies deliver efficiencies up to 91% and no-load power consumption as low as 0.5 W at 230 Vac for energy-conscious ITE, industrial and consumer electronics applications.
The three new VOF series feature a wide universal input voltage range of 90 to 277 Vac and offer output voltage options of 12, 15, 24, 36 and 48 Vdc. All models provide an operating temperature range at full load from -20 up to +50°C with forced air cooling, derating to 50% load at +70°C. The new power supply family also carries UL/cUL and TUV 60950-1 safety certifications while meeting EN 55022 Class B and FCC Class B limits for radiated emissions.
For more information visit www.cui.com.
CUI announced that the majority of its line of external ac-dc power supplies now meet the European Union’s (EU) Code of Conduct (CoC) Tier 1 and CoC Tier 2 efficiency standards.
The European Union’s CoC Tier 1 effectively harmonizes the EU with US DoE Level VI and became effective as a voluntary requirement from January 2014, two years ahead of Level VI. Its adoption as an EU Ecodesign rule is currently under review to become law with an implementation date of January 2017. The more stringent CoC Tier 2 requirement became effective on a voluntary basis from January 2016 and is similarly under review to become law as an Ecodesign rule from January 2018.
The key difference between the CoC requirements and Level VI is the new 10% load measure, which imposes efficiency requirements under a low-load condition where historically most types of power supplies have been notoriously inefficient. While CoC Tier 1 includes the new 10% load measure, its no-load and active mode limits are less stringent than DoE Level VI. CoC Tier 2 further tightens the no-load and active mode power consumption limits for key classes of power adapters enacted by Level VI and covers both standard voltage and low voltage adapters.
“This announcement is a part of CUI’s ongoing effort to stay ahead of the rapidly evolving global efficiency regulations,” stated Kraig Kawada, VP of Product Management at CUI. “Though the EU’s CoC standards are still voluntary, we want to make sure our customers’ designs are properly future-proofed in the event that these tighter efficiency rules become law.”
For more information visit www.cui.com.
New 8-megapixel IT-EMCCD device, integrated cooler option for family provide new capabilities for medical, scientific & surveillance imaging
ON Semiconductor, driving energy efficient innovations, continues to strengthen its position in low-light imaging solutions for industrial markets with the introduction of new products based on interline transfer electron multiplying charge-coupled device (IT-EMCCD) technology.
The new 8-megapixel KAE-08151 image sensor is the second device to use the company's IT-EMCCD technology, delivering the same sub-electron noise floor and imaging versatility as the existing 1080p resolution KAE-02150 image sensor. With a 22 millimeter diagonal (4/3 optical format) that matches the imaging path of professional microscopes, the KAE-08151 directly targets high resolution microscopy and scientific imaging applications operating in lighting regimes that can range from sub-lux to bright-light imaging. In addition, a new packaging option is available for both devices in this family, which incorporates a thermoelectric cooler (TEC) directly into the package design. This integrated cooler simplifies development of a cooled camera that optimizes the performance available from these devices.
"The compelling combination of performance and flexibility provided by IT-EMCCD technology is providing significant benefits for low-light imaging across key industrial imaging applications," stated Herb Erhardt, Vice President and General Manager, Industrial Solutions Division, Image Sensor Group at ON Semiconductor. "By expanding our product portfolio with a new resolution node and options that simplify the integration process for camera manufacturers, end customers will be presented with even more ways to leverage the advantages of this unique technology."
IT-EMCCD devices combine two established imaging technologies with a unique output structure to enable a new class of low-noise, high-dynamic range imaging. While interline transfer CCDs combine superior image quality and uniformity with a highly efficient electronic shutter, this technology is not always ideal for very low-light imaging because of the overall noise floor of their outputs. Conversely, EMCCD image sensors excel at low-noise imaging, but historically have been available only as low resolution devices with limited dynamic range. Combining these technologies allows the low-noise architecture of EMCCD to be extended to multi-megapixel resolution image sensors for the first time, and an innovative output design allows both standard CCD (low-gain) and EMCCD (high-gain) outputs to be utilized for a single image capture - extending scene detection from sunlight to starlight in a single image.
For more information, visit www.onsemi.com.
Are you ready to boldly go where you’ve never gone before? For almost three decades, SIMPLE SWITCHER by TI has been synonymous with Easy-to-Use DC/DC Conversion. The new LMR16010/20/30 non-synchronous regulator family builds on that legacy with a host of new features sure to improve your power supply performance.
True 2.2MHz operation and 40µA standby IQ allow you to design small and with solid efficiency over the entire load spectrum. In addition, the entire pin-compatible family comes in a familiar, thermally-enhanced package that is very easy to use. Use LMR16010/20/30 with the full suite of WEBENCH® tools to design fast and prosper.
CUI Inc added to its line-up of isolated dc dc converters with the introduction of three new encapsulated models ranging from 10 W to 30 W. The PDQ10 D, PDQ15 D and PDQ30 D output 10 W, 15 W and 30 W of power respectively in an industry standard 1” x 1” package, making them ideal replacements for larger 1” x 2” modules. The PDQ D models also feature a 4:1 input voltage range of 9~36 or 18~75 Vdc with high typical efficiencies up to 90%.
Housed in a compact, low-profile DIP package with a five-sided, shielded metal case, the rugged, encapsulated modules measure just 25.4 x 25.4 x 10.16 mm (1 x 1 x 0.40 in) and come available with single regulated output voltages of 3.3, 5, 12 and 15 Vdc or dual regulated output voltages of ±5, ±12 and ±15 Vdc.
Thanks to its wide -40 to +105°C operating temperature range and encapsulated design, the PDQ D series is suitable for convection-cooled equipment and harsh environments with target applications that include telecom, industrial, remote sensor systems and portable electronics.
For more information visit www.cui.com.
Cornell Dubilier Hermetically Sealed Aluminum Electrolytic Capacitor Line Expands to Higher Voltages
The world’s only hermetic aluminum electrolytic capacitor line with a glass-to-metal seal, now available up to 250 Vdc
Cornell Dubilier Electronics, Inc. (CDE) has announced significantly higher voltage values for its MLSH Slimpack series of hermetically sealed aluminum electrolytic capacitors. These unique components feature a true glass-to-metal seal that prevents dry-out of the capacitor electrolyte. As a result, they provide extraordinarily long life (5,000 hours) to more than meet the most demanding applications for military and aerospace. With the line expansion just announced, they are now available in nine values, from 120 µF to 3,200 µF, with ratings up to 250 Vdc.
The hermetic Slimpack is an offshoot of the well-established non-hermetic Flatpack series. The new MLSH Slimpack can be used as a replacement for parallel and series banks of wet tantalum capacitors for both new and existing designs. This change is especially beneficial where bulk storage is paramount. MLSH Slimpack devices measure 1.0” x 1.5” x 0.5”, weigh less and have more capacitance than a parallel bank of three or more wet tantalum capacitors. High rated capacitance is maintained at temperatures as low as -55 °C, a key requirement for power supplies used in military and aerospace applications. Top-end temperature rating is 125 °C.
All devices in the MLSH Slimpack series feature rugged stainless steel cases with a vibration rating of 80g. In most applications, there are significant cost and space savings vs. a comparably rated bank of wet tantalum capacitors. The new high-voltage MLSH Slimpacks eliminate the need for series banking.
Since its founding in 1909, CDE has been dedicated to advancing capacitor technology for new applications. The company combines innovative products with engineering expertise to provide reliable component solutions for inverters, wind and solar power, electric vehicles, power supplies, motor drives, HVAC, motors, welding, aerospace, telecom, medical equipment and UPS systems.
For more information visit: www.cde.com/MLSHSlimpack
Microchip Releases Industry’s First End-to-End Security Solution for IoT Devices Connected to Amazon Web Services’ Cloud
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the industry’s first end-to-end security solution for Internet of Things (IoT) devices that connect to Amazon Web Services IoT (AWS IoT). Microchip and AWS collaborated to develop this integrated solution to help IoT devices quickly and easily comply with AWS IoT’s mutual authentication security model. Using Microchip’s new security solution will help companies implement these security best practices from evaluation through production. The solution adds a high level of security, simplifies the supply chain, and is now one of the fastest ways to connect to the AWS Cloud.
Currently, third party manufacturers of devices that connect to AWS IoT service must take specific actions to comply with the advanced security model. First, they must pre-register their security authority to AWS servers in order to establish a trust model. Second, for each IoT device they must generate unique cryptographic keys that are mathematically linked to the pre-registered security authority. Finally, the unique device keys must remain secret for the life of the device. In volume production, the generation and secure handling of these unique keys can be a daunting challenge in the chain of manufacturing especially where third parties with different trust and compliance levels are involved.
Microchip’s end-to-end security solution handles this process during three production steps. First, the AT88CKECC kit will allow customers to meet the security standard of AWS’s mutual authentication model and easily connect to the AWS IoT platform during the evaluation and engineering phase. Second, the AWS-ECC508 device assists with meeting security standards during the prototyping and pre-production phase. Finally, devices will be customized for production stages to ensure information security in customer applications.
Customers simply solder the device on the board and connect it over I2C to the host microcontroller (MCU) which runs an AWS Software Development Kit (SDK) leveraging the ECC508 device for AWS IoT. Once this is complete, there is no need to load unique keys and certificates required for authentication during the manufacturing of the device as the AWS-ECC508 is pre-configured to be recognized by AWS without any intervention. All the information is contained in a small (3x2 mm), easy to deploy crypto companion device.
AWS and the ECC508 device naturally complement each other with comprehensive mutual authentication security capabilities. The device has strong resistance against environmental and physical tampering including countermeasures against expert intrusion attempts. In addition, the device features a high quality random number generator, the internal generation of secure unique keys and the ability to seamlessly accommodate various production flows in the most cost-effective manner. A typical IoT device consists of a small [8-bit] microcontroller, and is battery powered. It is typically constrained for resources like central processing unit (CPU) performance to provide low latency responsiveness, memory and code space for security protocols and for how much power they can consume in order to preserve battery life. The ECC508 device has a low-power processor-agnostic cryptographic acceleration for compatibility with the widest range of resource constrained IoT devices.
“We understand the often complex nature of implementing AWS mutual authentication in microcontrollers,” said Nuri Dagdeviren, vice president and general manager of secure products at Atmel, a wholly-owned subsidiary of Microchip. “The customer would need to have some understanding of how to secure a software implementation, and this often creates a huge barrier. We have had a long standing relationship with AWS and are thrilled to have the opportunity to work with the world’s largest cloud provider to build a solution that helps our customers easily and securely connect to the AWS Cloud.”
“We have a strong relationship with Microchip and we are very excited to be able to offer a world-class solution to anyone who wishes to deploy secure and scalable IoT solutions on our cloud services,” said Marco Argenti, vice president, Mobile and IoT, Amazon Web Services, Inc. “For all companies we work with, embracing security best practices are an essential step in achieving our mutual goal of offering customers the best and most secure IoT platform available. We believe this new solution will be one of the simplest and most cost-effective ways for our customers to comply with our security best practices.”
For more information visit www.microchip.com.
A new power connector family that provides impressive sealing capability and can withstand harsh environments is being released by Positronic, a company known for its reliable products and configurable design.
The innovative new Panther line of rugged electronic connectors is the first produced by the company to offer IP65/IP67 sealing capability; conformance to N45525-2 HL3, a globally recognized standard for smoke and toxicity requirements; and the ability to operate reliably at temperatures up to 200ºC. Panther also boasts up to 35 amps per contact, shock and vibration performance to EIA-364-28F test condition IV, and has an LCP insulator.
The strong and versatile Panther family is ideal for use in rail, aerospace, battery, earthmoving and other related applications. For more information, visit www.connectpositronic.com.
CUI’s Components Group today announced new additions to its range of waterproof buzzers. The three new models carry an Ingress Protection (IP) rating up to IP68 and feature sound pressure levels (SPL) up to 95 dB at 30 cm, making them ideal for a range of industrial and outdoor applications where moisture and other environmental contaminants are a concern.
The CPT 1495C 300 and CPT 1495CI 300 are piezo transducer buzzers housed in a 14 mm diameter package with a height of 10 mm. Specified with a rated voltage of 30 V and a rated frequency of 4.25 kHz, both waterproof buzzers are externally driven and feature an IP67 rating, SPL of 84 dB at 10 cm and an operating temperature range of 30 to 85°C. The CPT 1495C 300 mounts via wire leads while the CPT 1495CI 300 is wave solder compatible for high-volume production.
For applications where design for continuous immersion below 1 meter is needed, the CPT 2521C 500 offers an IP68 rating and an operating temperature range of 30 to 85°C. Housed in a 25 mm diameter package with a height of 21 mm, this externally driven piezo transducer buzzer features wire leads and an SPL of 95 dB at 30 cm. The series also features a maximum operating voltage of 50 V and a rated frequency of 3.7 kHz.
For more information, visit www.cui.com.
ON Semiconductor Introduces Automotive Power Integrated Module Solution for Next Generation Automotive BLDC Systems
Highly integrated module featuring 30 A, 40 V MOSFETs enables development of more compact, streamlined motor drives exhibiting elevated degrees of reliability
ON Semiconductor (Nasdaq: ON), driving energy efficiency innovations, has further expanded its portfolio of automotive Power Integrated Modules (PIMs) with the introduction of the STK984-190-E. Optimized for driving 3-phase brushless DC motors in modern automotive applications, this module contains six 40 V, 30 A MOSFETs configured as a three-phase bridge with an additional 40 V, 30 A high-side reverse battery protection MOSFET. The MOSFETs are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with excellent thermal performance taking up only half of the board space used by an equivalent discrete solution.
The module is suitable for use in 12 V automotive electric motor drive applications with power ratings up to 300 W, such as electric pumps, fans and windscreen wipers. Used in combination with motor controllers, such as LV8907UW, designers can build high efficiency BLDC solution with best-in-class thermal performance, built-in diagnostics, and an ultra-small PCB that saves critical size and weight.
Using the module allows both the component count and the bill of materials costs to be reduced substantially. The DBC substrate reduces the thermal resistance, which reduces the operating temperature of the MOSFETs. This reduces power losses and increases reliability due to a reduced change in temperature during thermal cycling. Reliability is also improved by the isolation provided by the DBC substrate. STK984-190-E has a specified operational temperature range of -40°C to 150°C. The integrated MOSFETs are all AEC-Q101 qualified.
"At least 13-15 discrete components would typically be needed to develop an effective BLDC drive solution, whereas the STK984-190-E automotive power module needs less than half that," states Chris Chey, General Manager of System Solutions Group at ON Semiconductor. "In addition to its compact size, the strong thermal performance of the STK984-190-E allows a smaller heatsink to be employed. The marked reduction in system size and weight that it enables, mean the current challenges that engineers face in terms of boosting fuel economy and overcoming space constraints can be fully addressed."
For more information, visit http://www.onsemi.com.
CUI’s Components Group announces several new additions to its range of micro buzzers. The three new models are housed in compact, surface mount packages as small as 4 mm x 4 mm. Featuring profile depths as low as 1.9 mm and sound pressure levels (SPL) ranging from 65 dB up to 80 dB at 10 cm, these micro buzzers are ideal for a range of portable equipment applications.
The CMT 4023S SMT and CMT 5023S SMT are magnetic transducer buzzers housed in compact footprints of 4 mm x 4 mm and 5 mm x 5 mm, respectively. Both buzzers feature a low profile of 2 mm, a rated voltage of 3 V and a rated frequency of 4 kHz. The CMT 4023S SMT with its 4 mm x 4 mm package is among the smallest in the industry while carrying an SPL of 70 dB and an operating temperature range of -20°C to 70°C. The 5 mm CMT 5023S SMT features an SPL of 80 dB with an operating temperature range of 30°C to 70°C. For applications where electrical noise is more of a concern, the 9 mm x 9 mm CPT 9019S SMT features piezoelectric technology and a profile depth of 1.9 mm – making it one of the lowest profile piezo buzzers on the market. The series delivers a maximum peak-to-peak voltage of 25 V, a rated frequency of 4 kHz and an SPL of 65 dB. The operating temperature range for the CPT 9019S SMT is -30°C to 70°C. All three models are externally driven and suitable for use in designs requiring reflow solder assembly for high-volume production.
For more information, visit www.cui.com,
- New third-generation BMR458 quarter-brick advanced bus converter delivers up to 650W for range of Information and Communication Technologies (ICT) applications
- Tightly regulated output voltage over the full operational input range of 40V to 60V
- Designed to meet the demands of high-end and high power applications based on intermediate bus conversion (IBC) and dynamic bus voltage (DBV) architectures
- Output current monitoring of +/-1A, delivers highly accurate system monitoring capability
Ericsson Power Modules announces the BMR458, a third-generation 3E* quarter-brick advanced bus converter that delivers industry-leading performance to system architects developing equipment for Information and Communication Technology (ICT) applications, including datacom and server and storage systems. The module is ideal for high-power applications that are powered by multi-cell batteries or rectifiers commonly used in the ICT industry and employ intermediate bus conversion (IBC) or dynamic bus voltage (DBV) architectures.
The BMR458 represents the cutting edge of technology for advanced bus converters and comes with a host of features. These include the highest power delivery (650W) in the industry for a quarter-brick advanced bus converter, thereby reducing the number of required modules in very high power applications; and highly accurate current sharing, as well as it being the only advanced bus converter available today to offer active- or droop-current sharing. Other key features including dynamic load compensation, snapshot parameter capture, and a PMBus v1.3 interface.
“This is a major product introduction by Ericsson and further strengthens its position as the leader in delivering the world’s most advanced power modules, while also meeting growing industry demands for ever higher power,” said Martin Hägerdal, Head of Ericsson Power Modules. “The BMR458 is the highest power advanced bus converter available today and comes with feature-packed innovation to deliver best-in class reduction in energy consumption for today’s power system architects.”
Key electrical characteristics of the module include class-leading high efficiency of up to 96.6% at half load and 96.3% at full load; maximum current output of 54.2A; tightly regulated 12V output (+/–2mV, typical) across the 40 to 60V input voltage range; output current monitoring of +/-1A to enable highly accurate system monitoring capability; and a fast transient recovery time of only 1ms. Further specifications include: an MTBF of 8.2 million hours; and I/O functional isolation of 2250Vdc, which meets the latest IEC/EN/UL60905 safety standard.
The module’s dynamic bus voltage capability is important for the most advanced power systems and enables the module’s output voltage to be adjusted to suit the load, thereby maximising overall system efficiency and reducing energy consumption. The module also delivers highly accurate current sharing with both active and droop options for paralleling up to more than six modules, delivering higher reliability and greater available power.
The BMR458’s dynamic load compensation (DLC) feature adjusts the control loop to meet the capacitance load. To help engineers further, the DLC feature can also be used in conjunction with the Ericsson Power Designer software tool, which has been developed for the initial development and prototyping of digital power systems, via the module’s PMBus (revision 1.3) interface, which also enables advanced digital energy-monitoring and control functionality.
Further important features include: the snapshot parameter capture analysis tool, which stores the last known measurement; adaptive ramp time, which modifies ramp time to suit output capacitive load; and automatic backward current protection when paralleling modules, which simplifies OR’ing circuitry.
Available in the industry-standard quarter-brick format with dimensions of 57.9 x 36.8 x 12.7mm (2.28 x 1.45 x 0.5in), the module also offers excellent performance in challenging thermal environments. Delivering higher reliability overall, it provides higher useable power in applications that have a high ambient temperature and/or limited airflow. However, the module is also available with an optional baseplate, enabling connection to a heatsink or cold plate for the most extreme environments.
The groundbreaking BMR458 has been built to the highest quality design and manufacturing standards, enabling Ericsson to deliver to customers a continued high level of confidence in its power modules.
* Enhanced Performance, Energy Management, and End-user Value are the key benefits delivered by Ericsson’s range of 3E digitally controlled DC/DC converters.
For further information, please visit www.ericsson.com/powermodules
CUI announces a new line of DoE Level VI and CoC Tier 2 compliant wall plug-in ac-dc power supplies featuring an integrated USB connector. The 10 W SMI10 USB, SWI10 N USB and SWI10 E USB are all designed to meet the stringent average efficiency and no load power requirements mandated by the US Department of Energy (DOE) in effect since February 2016. Any domestic or global manufacturer seeking to market their end product with an external adapter in the United States must meet the new Level VI standards which aim to significantly lower the amount of power consumed when the end application is not in use or is no longer connected to the system. The models also meet the European Union’s January 2018 CoC Tier 2 directive that will add additional power consumption limits at 10% load levels.
The SWI10 N USB and SWI10 E USB are ultra-compact, fixed blade, wall plug adapters with footprints as small as 2.03 x 1.52 x 0.93 inches (51.5 x 38.5 x 23.5 mm), making them among the industry’s smallest 10 W ac-dc power supplies to integrate a USB connector. The ac-dc adapters both feature single 5 Vdc regulated outputs with a wide universal input voltage range from 90 to 264 Vac. Both series also feature no load power consumption less than 0.075 W and provide over current, over voltage and short circuit protections.
With fixed input blades for North American and Japanese applications, the SWI10 N USB offers UL/cUL and PSE safety approvals while the SWI10 E USB with European fixed input blades offers CE and GS safety approvals.
Designed for global applications, the SMI10 USB includes interchangeable ac blade options for North America, Europe, the United Kingdom, Australia and China. The 10 W multi-blade adapter also features a 5 Vdc single regulated output and a wide universal input voltage range of 90 to 264 Vac. The series meets the Level VI standard’s no load power consumption requirement of less than 0.1 W while carrying UL/cUL, CE, GS, RCM, CCC and PSE safety approvals. Protections for over voltage, over current and short circuit are also included.
All three models meet Class B limits for conducted and radiated emissions and are ideally suited for a wide range of consumer applications, including media players, e-readers, GPS and other mobile devices.
Visit www.cui.com for more information.
- 600W quarter-brick power interface module (PIM) converter optimised for Advanced Telecom Computing Architecture (ATCA) based server applications
- Low-EMI design meets CISPR Class B with minimal external components
- Module delivers 12A output current at 80°C with 1.5m/s (300 LFM) airflow
- Extensive range of energy monitoring functionalities via I2C or PMBus
Ericsson Power Modules today announced the PIM4610PD, an extension of its popular 3E* Power Interface Module (PIM) family that are compliant with the industry-standard quarter-brick footprint. The new module has been optimised especially to simplify design in blade server applications based on ATCA and PICMG 3.7 systems. The module is also highly suited to server and storage systems in any industrial, telecom and data communications application that employs either distributed power or intermediate bus voltage architectures.
Importantly, the employment of Ericsson’s low-EMI design techniques in the PIM4610PD ensures that minimal external filtering is needed to meet the CISPR Class B EMC standards required for Information and Communications Technology systems. Ripple and noise characteristics have been minimised, while circuit design has been simplified leading to reduced component count and system costs without compromising performance.
Based on Ericsson’s leading-edge energy-optimisation platform, the PIM4610PD operates over an input range of 36V to 75V. The module also offers industry-leading high-power performance delivering 864W with a 54V input, 768W at 48V, and 600W at 37.5V. Efficiency performance is again industry leading – offering up to 98.8% at 600W for the main unit – resulting in reduced energy and cooling costs.
Martin Hägerdal, Head of Ericsson Power Modules, commented: “The PIM4610PD employs Ericsson’s low-EMI design capabilities, which means that an absolute minimum of external filtering components are required by customers developing ATCA-based blade server applications. Overall, the package of advanced features offered by this new product, such as digital monitoring capability via the PMBus, world-class efficiency and high-power handling characteristics for applications where there is minimal airflow, all combines to make the PIM4610PD a compelling product for power engineering architects looking to save energy and cost.”
The PIM also offers built-in digital monitoring and an extensive range of energy-monitoring functionalities via its I2C/PMBus interface. Other features of the PIM4610PD include: protection against input transients, reverse polarity, over-temperature, over-current, input under-voltage and inrush current. Additionally, the PIM has a configurable feature that enables a well-controlled shutdown procedure. The feature enables de-assertion of the Power Good pin when it determines that input power is below a certain level, enabling the protection of semiconductor devices such as CPUs and FPGAs.
The module also has integrated hot-swap functionality and hold-up charge and discharge management. The inputs also include dual power feeds with OR’ing functionality and ‘enable’ signaling. Further specifications include: management power output of 3.3V and up to 7A; an MTBF of 2.66 million hours, according to Telcordia SR-332 Issue 2, Method 1, and isolation of 2250Vdc, which meets the latest IEC/EN/UL62368-1 safety standard.
Available in the industry-standard quarter-brick format, measuring 57.9 x 36.8 x 21.33mm (2.28 x 1.45 x 0.84in), the PIM4610PD has been built to the highest quality design and manufacturing standards, which have been employed by Ericsson for many years and deliver extremely high levels of confidence to customers.
* Enhanced Performance, Energy Management, and End-user Value are the key benefits delivered by Ericsson’s range of 3E digitally controlled power modules.
For more information, please visit http://www.ericsson.com/powermodules
Cornell Dubilier Electronics, Inc. (CDE) introduces the world’s only hermetic aluminum electrolytic capacitor with a glass-to-metal seal. With no dry-out mechanism and high capacitance retention at low temperatures, this technology is poised to replace banks of costly wet tantalum capacitors.
Cornell Dubilier Electronics, Inc. (CDE) introduces its Slimpack, type MLSH, the first in a series of hermetically sealed aluminum electrolytic capacitors that the company plans to introduce over the next several months. With its glass-to-metal seal that prevents dry-out, this capacitor technology has extraordinarily long life to meet the most demanding applications for military and aerospace.
The hermetic Slimpack is a spin-off of the non-hermetic Flatpack series that the company has been supplying to military and aerospace customers for more than 20 years. The company expects this technology to replace parallel and series banks of wet tantalum capacitors for new and existing designs, especially where bulk storage is paramount. According to the company, the MLSH Slimpack measuring 1.0” x 1.5” x 0.5” will weigh less and will have more capacitance than a parallel bank of 3 or more wet tantalum capacitors as at -55 °C. High capacitance at low temperature is a key requirement for power supplies used in military and aerospace applications.
In addition to its performance advantages at low temperature, the technology is expected to have a significantly lower cost than a comparable bank of wet tantalum capacitors.
Since its founding in 1909, CDE has been dedicated to advancing capacitor technology for new applications. The company combines innovative products with engineering expertise to provide reliable component solutions for inverters, wind and solar power, electric vehicles, power supplies, motor drives, HVAC, motors, welding, aerospace, telecom, medical equipment and UPS systems.
For more information on this series visit: http://www.cde.com/
ON Semiconductor Further Extends Scope of IGBT Offering with 1200 V Devices Based on 3rd Generation Ultra Field Stop Technology
Setting new benchmarks in power efficiency for high power switching systems
ON Semiconductor Corporation, driving energy efficiency innovations, has introduced a new series of insulated gate bipolar transistors (IGBTs) which utilize its proprietary Ultra Field Stop trench technology. The NGTB40N120FL3WG,NGTB25N120FL3WG and NGTB40N120L3WG are designed to deliver elevated levels of operational performance in order to meet the exacting demands of modern switching applications. These 1200 volt (V) devices are able to achieve industry-leading total switching loss (Ets) characteristics; the remarkable improvement in performance is attributable in part to a very wide highly activated field-stop layer & optimized co-pack diode.
The NGTB40N120FL3WG has an Ets of 2.7 millijoules (mJ), while the NGTB25N120FL3WG has an Ets of 1.7 mJ. Both devices have a VCEsat of 1.7 V at their respective rated currents. The NGTB40N120L3WG is optimized for low conduction losses and has a VCEsat of 1.55 V, at rated current, with an Ets of 3 mJ. The new Ultra Field Stop products are co-packaged with a fast recovery diode that has soft turn-off characteristics and still offers minimal reverse recovery losses. The NGTB25N120FL3WG and NGTB40N120FL3WG are highly suitable for use in Uninterruptible Power Supplies (UPS) and solar inverters, whereas the NGTB40N120L3WG is mainly targeted at use in motor drives.
“Our new Ultra Field Stop IGBTs along with optimized fast recovery diodes we manage to hit the sweet spot that perfectly balances VCEsat and Ets, thereby resulting in reduced switching losses, and enhanced power efficiency in hard switching applications, across a broad range of switching frequencies. At the same time it still offers the robust operation and cost effectiveness that engineers expect from IGBTs,” states Asif Jakwani, senior director and general manager for ON Semiconductor’s Power Discrete Division.
For more information, visit http://www.onsemi.com.
The industry appetite for improved shielding effectiveness is constantly increasing. In keeping with this trend, Positronic is releasing the EM360 banding backshell for D-sub connector applications where 360° shield termination is required. The EM360 product boasts the following features:
- 360° shield termination capability using a Band-It®-style clamp
- Top opening, side opening and low-profile options
- Split-body design
- Lightweight, low magnetic aluminum alloy (EN AW 5083)
- Electroless nickel plating
- Various cable entry diameters available
- Captive jackscrews
The EM360 product is targeted to spaceflight and commercial aerospace applications where overall shielding is a necessity.
Visit www.connectpositronic.com for more details.
The TPS25810 is the industry’s first single chip USB Type-C rev 1.1 compliant DFP controller. It delivers a total solution to implement Type-C DFP in a
3mm x 4mm package with only one external resistor. The device provides up to 15W power and SuperSpeed connectivity for PCs, powerbanks, industrial, telecom, and automotive infotainment applications.
Features and Benefits
- USB Type-C rev 1.1 compliant and UL recognized DFP controller
- < 1µA IDDQ with no attachment for lower standby power and longer battery life
- Intelligent power management for multiport control
CUI Inc’s Components Group today announced a new line of compact, low-profile micro-speakers housed in packages as small as 13 mm x 13 mm. The CDS series, with profile depths as low as 3 mm, offers a variety of power ratings from 0.3 W to 6 W and come with impedance of 4 ohms or 8 ohms.
Available in square frame, rectangular frame or oval frame packages, the micro-speaker series provides a number of mounting styles depending on the user’s need, including wire leads, solder pads/eyelets and spring terminals. Two surface mount versions are also available for use in designs requiring reflow solder assembly for high-volume production. Sound pressure levels range from 86 db up to 102 db at 0.1 meters. All models are RoHS compliant.
Target applications include consumer electronics, industrial automation, portable and stationary medical equipment, safety and security, and more. With its numerous performance and size configurations, the CDS series is able to match a wide range of application requirements.
Visit www.cui.com for more information.
TI's LM53600-Q1 (650mA) and LM53601-Q1 (1A) 36V, 2.1 MHz fully synchronous step-down DC/DC converters operate under a wide range of automotive conditions including cranking and load dump. WSON package with wettable flanks allows customers to perform optical inspection of PCBs to reduce production cost and increase reliability.
What sets the converters apart?
- Compact design and spread spectrum improve EMI performance.
- 150°C operating temperatures improve reliability and simplify thermal design.
- Low quiescent current reduces battery drain.
- Package with wettable flanks speeds production and increases reliability.
Latest edition of Power Technology Roadmap includes a 542-page report plus USB drive with recorded webinars
The Power Sources Manufacturers Association (PSMA) announces that the 2015 edition of its The Power Technology Roadmap is now available. The report, which forecasts the power technology and power delivery trends through 2019, includes a printed report along with a feature-rich USB memory drive containing recorded webinars with up-to-date explanations of the information contained in the final report. The recordings are extremely helpful in that they enable the listener to understand the context and the subtext of the report materials, as explained by the actual presenters. Non-PSMA members may purchase the report at psma.com. PSMA Regular and Associate member companies have been sent copies of the printed report and USB memory drive versions of 2015 edition as a benefit of their membership.
New this year to the PSMA Power Technology Roadmap report is a retroactive study that examines how the past roadmap trends from 2003 to 2013 compared with the current trends in this report. This study was added because the goal of the PSMA is not only to identify future trends, but also to examine its earlier predictions to see how they turned out. This study provides a very interesting review of the developments of trends to help industry professionals understand the micro-transitions that may have turned into major inflection points in power electronics history. Key results of this study, as well as the summary that was presented at the APEC2015 Plenary Session, are also included.
Continuing from previous editions are essay contributions by industry experts contained in the reports’ Applications Trends and Emerging Technologies sections. The 2015 Application Trends topics cover a range of segments, such as automotive, battery charging, computing, consumer, renewables, industrial, LED lighting, medical, mil/aerospace, and motor control. This years’ Emerging Technologies section includes topics on 3D packaging, power SoCs, servers, additive manufacturing, high-frequency magnetics, high-power wireless charging, smart grid, energy storage and smart buildings.
“The culmination of the PSMA’s webinars, surveys, presentations and discussions is a comprehensive and consolidated view of the latest trends in power management, power control and power delivery technologies,” said Aung Thet Tu, Co-Chair of the organizing committee. “The 2015 report offers a trove of information both in the written report and recorded webinars.”
Eric Persson, Co-Chair of the organizing committee, said: “The breadth and depth of the information we’ve compiled for the 2015 report is unprecedented. By capturing the technical trends and issues facing the power sources industry, we hope and expect industry professionals to find this report useful, thought-provoking and valuable.”
For information about purchasing the report, please to the PSMA website at: www.psma.com. The non-member price is $2,790. For PSMA members companies who may want to purchase additional copies, the member price is $170. PSMA Affiliate members may also purchase the report for $170.
Current Development in 3D Packaging With Focus on Embedded Substrate Technologies
t APEC 2015, the PSMA Packaging Committee will introduce the first comprehensive study of the feasibility of using Embedded Substrate Technologies to build power sources. The report entitled “Current Developments in 3D Packaging with Focus on Embedded Substrate Technologies” will also be discussed at the Industry Session on 3D Packaging. The report was prepared under contract by LTEC Corporation with work subcontracted to Anagenesis and Fraunhofer-Institute. The intent of this article is to provide PSMA members a high level preview of the contents of Technical Report.
The PSMA Packaging Committee believes the 340 page report with extensive illustrations of the leading edge product technologies will provide valuable insights to executives and managers in their own analysis of how currently available materials and processes could be best used for the creation of advanced high efficiency, high power-density power electronic products. The report builds upon the findings of the Phase I report - 3D Power Packaging - issued by the Power Sources Manufacturers Association (PSMA) Packaging Committee in 2014.
Let’s begin with a little background. The power electronics industry and the semiconductor industry are inseparably intertwined with one another, and both are facing unprecedented market challenges for efficiency, cost, construction and thermal issues which provide many opportunities for innovation. These industries are in the focal point of the “energy challenge” a multifaceted problem that involves mobile and cloud infrastructure systems, Internet-of-Things, renewable energy, smart grid, vehicle electrification, and across-the-board power efficiency enhancements in order to keep up with the industry's rapid growth in data consumption. These are the competiveness and sustainability challenges of the twenty-first century.
The paradigm shift we have been experiencing in semiconductor packaging technology was brought about by advanced deep submicron semiconductor technology reaching a “cost barrier” that prevented further cost reduction by adding more functions to the semiconductor die. This barrier was circumvented through the development of wafer thinning that enabled through-silicon-via (TSV) technology, and the eventual introduction of 2.5D and 3D integration that facilitated heterogeneous (“More than Moore”) integration. It will allow the power requirements of the digital load to increase 2 to 5 times, within the same footprint, in a single generation. The power sources community must now find ways to package power sources that will meet this demand, but with no increase in footprint.
In parallel, power semiconductor technology has been facing a “construction barrier” that prevents realization of the huge benefits new technology can offer in terms of increased power efficiency and higher power density. These new technologies which include gallium-nitrogen (GaN), silicon-carbon (SiC), and gallium-arsenic (GaAs) power semiconductor devices all require operation in an environment that is free of bond wires and minimizes parasitic interconnect elements. The best possible packaging technology to achieve this is embedding active and passive components in organic or inorganic substrates.
Overview of the Report
The report begins with a discussion of PCB embedding technology, which is fueled by the rapid evolution of low-power embedding and 3D packaging technologies, which are in high volume production. These technologies will in turn enable power electronic systems to deliver higher efficiency and higher power density.
Embedding Actives and Passives in Substrate using Shinko Electrics Molded Core Embedded
In addition to substrates the report dedicates entire chapters to each of the passive components (resistors, capacitor, and inductors) as well interposers and additive manufacturing.
Embedding using Formed or
The report also discusses high temperature die and component attach technologies that are evolving rapidly in the research labs; however, a single, low-cost, “one-size-fits-all applications” high-lead solder-substitution technology is currently unavailable and addresses the fact that high power-density component embedding and 3D packaging of power semiconductor devices also have to overcome a “thermal barrier.” Simply stated, it is more challenging to remove heat generated within the body of a 3D integrated system than from a planar, two-dimensional surface. This leads to a discussion of advanced thermal management technologies which are key enablers for 3D packaging as well as PCB embedding.
The authors acknowledge and devote a chapter to the fact that high power-density component embedding and 3D packaging of power semiconductor devices also have to overcome a “thermal barrier.” Simply stated, it is more challenging to remove heat generated within the body of a 3D integrated system than from a planar, two-dimensional surface. This leads to a discussion of advanced thermal management technologies which are key enablers for 3D packaging as well as PCB embedding.
In addition to their primary research, the team conducted a worldwide literature review and analysis of research and development (R&D) published by participating organizations in the USA, Asia-Pacific Region, and the EU, and identified several potentially high-impact technologies of interest to the power electronics and the semiconductor industries.. In terms of leadership positions, Germany and the EU appear to lead in the area of high-power PCB embedding and research into vertical interconnect/high-lead replacement technology, while Japan is leading in low power, high-density embedding, high performance, low CTE, high modulus (low warpage) substrates, and organic interposer technologies.
Finally the report highlights some of the technology gaps as well as a recognition that this new technology requires updated or additional standards for manufacturing and testing. This report reviews the existing and pending new standards for PCB embedding which the IPC Association has taken the lead to author. However, much additional standard action is needed since the manufacturing supply chain is still evolving. Procedures need to evolve to establish compatibility of up-top metal-die design and PCB layout rules, testing, quality control, and for assigning ownership of failure.
In summary, there has been substantial progress and excellent opportunities lie ahead for the power electronics and semiconductor industries and the entire manufacturing ecosystem to embrace PCB embedding and 3D packaging technologies for power electronic applications. The intersection of these technologies with the emerging wide-bandgap power semiconductor technology creates truly exciting possibilities at the same time the power electronics industry faces unprecedented challenges to help mitigate the fast growing demand for electricity and environmental problems our world faces. Embedded substrate packaging technologies can be, and will be deployed in hybrid and electric vehicles, alternative energy generation and distribution systems, smart grid, industrial, and military aerospace applications in the coming years and beyond. These technologies, combined with wide-bandgap semiconductor devices will literally re-vitalize the entire power electronic infrastructure block by block, module by module, for the twenty-first century.
As a benefit of PSMA membership, the Current Development in 3D Packaging with Focus on Embedded Substrate Technologies report will be sent to all PSMA Regular and Associate member companies and Affiliate companies will be able to purchase the report at a reduced price. The report will also be offered to others in the industry at a price of $2990. You can view the report at the PSMA Exhibit booth at APEC 2015 and shortly the Table of Contents will be available on the PSMA website: www.psma.com.
Submitted by the PSMA Packaging Committee.
PSMA Publishes Technology Report: “Current Development in 3D Packaging With Focus on Embedded Substrate Technologies”
Comprehensive report is the first to address “More than Moore” digital power demands by accelerating the development of higher density power sources using new, disruptive packaging technologies
March 16, 2015—The PSMA (Power Sources Manufacturers Association) Packaging Committee announced today that it has published a report titled “Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies.” The first comprehensive study on using embedded substrate technology for building power sources, the report contains extensive research and product illustrations geared to an audience of technology executives and design engineers. Its purpose is to offer an in-depth industry perspective on how currently available materials and processes can be best used for the creation of advanced high-efficiency, high-power-density power products.
The PSMA created the 3D packaging report to address the pressing demands in the power industry to accelerate the development of higher density power sources. The first challenge arose from digital semiconductor packaging technology hitting a “cost barrier” brought about when advanced deep-submicron semiconductor technology could no longer reduce cost with the addition of more functions to the semiconductor die. This barrier was circumvented through the development of wafer thinning that enabled through-silicon-via (TSV) technology and the eventual introduction of 2.5D and 3D integration, which facilitated heterogeneous (“More than Moore”) integration. This integration allowed the power requirements of the digital load to increase two to five times, within the same footprint, in a single generation. Now the power industry is tasked with finding ways news ways to package power sources that will meet this demand, but without increasing footprint.
In parallel, power semiconductor technology is facing a “construction barrier” that prevents the realization of the significant benefits new technology can offer in terms of increased power efficiency and higher power density. These new technologies, including gallium-nitride (GaN), silicon-carbide (SiC), and gallium-arsenic (GaAs) power semiconductor devices, all require operation in a package that is free of bond wires and that minimizes parasitic interconnect elements. Both of these challenges can be addressed with power packaging utilizing embedded substrate technologies and are addressed in the report.
The PSMA’s 340-page report, prepared under contract by LTEC Corporation with work subcontracted to Anagenesis and Fraunhofer-Institute, is based on the Packaging Committee’s extensive research of over 750 articles and papers, analysis of 450 presentations/papers, and by conducting 30 industry expert interviews. Information was also derived from attendance at 10 industry conferences, workshops and seminars. The report contains 172 links and 394 citations.
The report provides detailed analysis of substrates (organic and inorganic), components (actives and passives), thermal management, high temperature die, packaging technologies, interposers, as well as additive manufacturing and laser fabrication. Each passive component (resistors, capacitors, inductors) has an entire chapter detailing which suppliers are currently shipping products usable in power sources. Every chapter covers manufacturing issues and includes references to contract manufacturing companies already producing power products utilizing embedded substrate technology. Embedded substrate packaging leverages the large investment made by the digital industry in advanced packaging technologies and is being used to resolve the power source construction challenge. As the report demonstrates, 3D power packaging using embedded substrate technology is a disruptive technology, in that it enables large increases in power density and efficiency.
Co-chairs of the PSMA Packaging Committee, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, described the report as “the first comprehensive document to discuss the challenges companies will face to implement embedded substrate 3D power packaging to create the significantly higher power densities driven by the “More than Moore” digital power demands.”
The PSMA report on 3D packaging will be provided free of charge to PSMA Regular and Associate members. Affiliate members can purchase the report for the reduced price of $190. Others interested in the report may order a copy from PSMA for $2,990.
MENDHAM, N.J. – June 23, 2011 − The Power Sources Manufacturers Association (PSMA) announced that it is again making available Nathan Grossner's classic treatise, Transformers for Electronic Circuits - Second Edition. The first reprint of this work sold out and this second reprint is now available. PSMA members may now purchase this important text online, directly from PSMA, at the discounted price of $55. The non-member PSMA online price is $75. Non-members may also purchase it through How2Power or through Amazon. This text is a complete, one-stop guide to transformer and inductor design and applications for everyone who designs, builds, or uses power magnetics components. Throughout this book, the author combines analysis and synthesis and all theory is related to the solution of real-world problems.
Sections of the text provide guidance in the use of transformers and inductors in power electronics and in digital and pulse circuits. Also included is design information about other forms of high-frequency magnetics such as transmission-line transformers, hybrid transformers, ferroresonant tranformers, flyback converter magnetics and inductors used in switch-mode power converter designs.
Special attention is given in the book to the proper control of dielectric stress, corona and thermal factors in high-voltage magnetics designs. Modeling methods for magnetic parts are also included and treated in some detail. This book is an essential reference book for any engineer involved in the design and development of modern-day magnetic components.
According to Steve Carlsen, co-chair of the PSMA Magnetics Committee, “Grossner's book should be an essential part of every power supply designer’s technical library. The initial PSMA reprint edition sold out and thanks to PSMA, it is once again available after being out of print for several years.”
Mendham, New Jersey—June 1, 2010—The Power Sources Manufacturers Association (PSMA) has announced the renewed availability of SOFT FERRITES – Properties and Applications - Second Edition, authored by Eric Snelling. The book had been out of print for several years and was reprinted in limited quantity by the PSMA in 2006. Due to continued demand, a second reprinting is now available. The book was initially published in 1969 and was extensively revised by Snelling in 1988 to bring all eleven chapters in line with current design practices and applications of ferrite cores used in modern-day inductors and transformers. The aim of this unique 366-page reprint is to provide all the information on ferrite properties and wound-component design necessary for efficient applications of these materials. Data in the book are represented by means of extensive use of graphs and tables, and design procedures are supported by many working examples of inductors and transformers. According to Stephen Carlsen, PSMA Magnetics Committee Chair, “Snelling’s book is considered by many working design engineers as the ‘ferrite user’s bible’ and PSMA is pleased to make this wonderful text available once again.” Copies of Snelling’s classic treatise on magnetics, SOFT FERRITES – Properties and Applications - Second Edition, are available for sale at www.psma.com. The cover price for the reprint is $150 but PSMA members, as a benefit of their membership, can purchase the text for $100. The PSMA-reprint text is also available at the non-member price at www.amazon.com.
Database offered as a free service to the industry; provides “one-click” access to details of standards by world region, agency and application.
Mendham, New Jersey — April 9, 2009 — The Power Sources Manufacturers Association (PSMA) announces availability of its On-line Energy Efficiency Database (EEDB) as a service to the industry. The number of energy efficiency standards and the world wide agencies that generate them continue to grow daily. It is time consuming for an individual or company to keep track of the many actions and activities by government and industry groups. The PSMA on-line energy efficiency standards database provides “one click” access to the very latest global standards and initiatives.
As a result of user feedback on an earlier version of the database, PSMA has incorporated a number of improvements. Some of the useful features:
•Quick access to world region, agency, or standards application
•Expanded data includes list of specific standards generated by an agency and parametric specifications for each regulation
•Expanded description of regulations and agencies
•Enhanced descriptions that include html code for quick linking to agency site or database location
•Latest schedule of standards meetings
Dusty Becker, PSMA Board Chairman and chair of the PSMA Energy Efficiency Committee, states that "The PSMA On-line Energy Efficiency Data Base, which incorporates a number of improvements suggested by product planners to keep current, is a valuable resource for engineers. We are pleased to offer this resource free of charge to our membership and to the industry."
Though access to the PSMA EEBD is free, users are required to register on www.psma.com/green/ so PSMA can provide notice of special database announcements and associated PSMA activities.
PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its membership which includes most major power supply companies.
New reprint is the fourth title in PSMA's out-of-print Classic Book Series
MENDHAM, N.J. - February 4, 2008 ─ The Power Sources Manufacturers Association (PSMA) is pleased to announce availability of a reprint of the classic book "Applications Of Magnetism" authored by the late J. K. Watson and originally published by John Wiley and Sons in 1980. According to Ed Bloom "This classic book, written by one of the most respected teachers in the field of magnetics, makes the principles of applied magnetics accessible to the practicing electronics engineer. With emphasis on practical design, the text presents the relevant principles of physics, circuit analysis, simple models and the calculations involved in designing a circuit or a magnetic device. No prior knowledge of the physics of magnetism is assumed ─ material properties are explained in a step-by-step manner, with special attention to their effects on the volt-ampere characteristics of a magnetic device, and to the physics of magnetic domain processes. Applications of magnetics, including those associated with power electronics circuits, are covered as well as reluctance modeling methods for transformers and inductors." Copies of this practical design treatment of magnetics will be available for sale at this year's Applied Power Electronics Conference (APEC 2008) to be held in Austin, Texas, February 24-28, 2008 and through the PSMA web site - www.psma.com. Copies will sell for US$100, but members of PSMA companies can obtain a copy for US$50. To order directly from PSMA please complete the "members order form" or the "non-members order form". In the past three years, PSMA has reprinted three other classic books on magnetics including Transformers for Electronic Circuits by the late Nathan R. Grossman, Soft Ferrites - Properties and Applications by E.C. Snelling and Electronic Transformers and Circuits by the late Reuben Lee and associates. A limited number of the Snelling and Lee books are still available through www.psma.com. About PSMA PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants, interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization, whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its members, which include most major power supply companies.
Third edition includes print and CD versions; provides comprehensive resource of power sources industry terminology
MENDHAM, N.J.,—October 5, 2007—The Power Sources Manufacturers Association (PSMA) is pleased to announce publication of The Handbook of Standardized Terminology for the Power Sources Industry–3rd Edition. Revised and expanded, this unique handbook contains hundreds of added terms, especially selected for the power electronics professional. The third edition also contains illustrations and four new appendices, including a listing of EMI specifications, excerpts from international standards of units and symbols, along with guides for authors of technical papers. These added resources provide concise, easy-to-use references for engineers involved in technical writing and presentations. Many new magnetic terms are described in this new 126-page third edition that are of particular interest to the practicing designer and marketer of power supplies and related products. Valuable information regarding worldwide power sources, standards agencies, and military specifications has been retained, updated and expanded from the previous edition. Titles of the appendices are: • Testing and Standards Agencies; Designer's Reference; • World Voltages and Frequencies; • Military Specifications; • EMI Specifications; • Writing Technical Papers for Archival Publications; Units, Symbols and Style Guide; A Brief Writing Guide. The book comes in hard copy along with a CD containing a PDF version that can easily be searched for terms and words within the definitions, making it a valuable tool for posting on your internal network. The book price is $25 to PSMA members and $50 to nonmembers. To order directly from PSMA please complete the "members order form" or the "non-members order form".