New product announcements

November 29, 2011 - Today’s mobile carting solutions are technology-rich with a variety of personal computing, ergonomic, power, security, and storage options. TDI Power’s focus is on the technology that powers the carts,
having created a solution that combines the latest battery technology with advanced engineering and design. TDI Power has recently developed a 12v standard medical power supply. The unit is targeted at hospitals that want to retrofit their existing carts with power.

Features include:
· Cart mountable power source suitable for multiple battery chemistries 
· Wide range AC Input (90-250VAC)
· 12VDC Battery Lithium Ion or SLA
· UL60601-1 Approved
· Easy to use interface
· 8-10 Hours of Battery Run Time
· Typical Charge in <3 Hours
· Charge & Power Full Load Simultaneously
· Solid State Transfer Design
· Light weight <7Lbs

For more information, please visit www.tdipower.com.

Good things come in threes: DRV8301-HC-C2-KIT Operates up to 60 V Supports up to 60 A Slashes board space up to 60% The new DRV8301 is the most highly integrated pre-driver available today – reducing board space in brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) applications up to 60% compared to other integrated solutions.

Integrates: 3-phase brushless gate driver 1.5-A step-down voltage regulator Dual current-sense amps SPI management interface Drives sub-10-A to 60-A external FETs, providing current scalability and improved thermal performance. Operating from 3.5 V to 60 V, the buck provides power for the MCU or other system components. Current sense amps support 4 gain settings, adjustable offset, and have built in DC offset calibration to reduce board space and system cost. Applications: Ventilation pumps, medical pumps, commercial refrigeration cooling systems, robotics, power tools, e-bikes and other low-voltage, high-torque applications.

For more information, please visit www.ti.com.

October 6, 2011 - Cree, Inc., a market leader in silicon carbide (SiC) power devices, continues its mission of advancing the adoption of SiC into mainstream power applications. Cree's advances in SiC technology are setting new standards in energy efficiency while reducing system costs and improving reliability when compared to silicon-based power devices. Cree's latest addition to its 1200V SiC Schottky diode product offering includes four new surface mount devices in 2A, 5A, 8A, and 10A current ratings and packaged in the industry-standard surface mount TO-252 D-Pak. Cree is the first manufacturer to offer this comprehensive range of current ratings for commercially available 1200V SiC Schottky diodes in the surface mount D-Pak package. Designers of systems, such as solar micro inverters, now have more options to develop smaller, lighter and less costly power conversion circuits. The new surface mount devices deliver the same proven performance as Cree's TO-220 Schottky diodes, but with a smaller PCB footprint and lower profile.

"These new surface mount devices provide all the proven benefits of SiC Schottky diodes - zero reverse recovery losses, temperature-independent switching, higher frequency operation with low EMI, and significantly higher surge and avalanche capability - with a smaller footprint and a lower board-mounted profile," explained Cengiz Balkas, Cree VP and GM, Power and RF. "The new 2A device is ideally suited for lower power applications allowing them to benefit from the advantages of SiC while providing the best performance and cost option.  With the addition of the 8A and 10A devices, the same space and cost savings can be extended to higher power applications"

"There are significant design advantages to implementing SiC power devices in high efficiency power electronics systems, including the ability to achieve higher current and voltage ratings with fewer components. By reducing the component count, designers can achieve lower overall system costs with increased reliability and maximum efficiency," continued Balkas. "When used in conjunction with Cree's new series of 1200V SiC Power MOSFETs in an all-SiC design, these Schottky diodes make it possible to achieve high-efficiency power electronics systems with switching frequencies that are 5x to 8x higher when compared to conventional silicon solutions. The higher switching frequencies enable smaller magnetic and capacitive elements, thereby shrinking system size, weight and cost."

For more information, please visit www.cree.com/power.

August 19, 2011 - For decades, D-subminiature connectors have been the interconnect of choice in many electronic systems. Over time, these connectors have evolved to meet changing requirements in a wide variety of applications. In many applications, EMI/RFI shielded backshell offerings have not kept pace with requirements. These types of back shells tend to be large, bulky, and heavy. This is a problem in applications where weight reduction is a growing concern, such as the aerospace industry.

Many EMI/RFI hoods have a limited cable opening size. This creates a problem when high-density contact configurations are used. As an example, shell size 6 D-subminiature connectors offer 104 contacts. Backshells may not have a large enough cable opening to fully support the number of conductors that must be brought into the back shell. This is especially true when the cable includes twisted, shielded pairs that must be terminated inside the backshell. The industry needed an improved EMI/RFI backshell.

To meet these challenges, Positronic Industries developed a new generation back shell for D- subminiature connectors. The “A” series back shell combines a number of features that meet the needs of many of today’s most challenging requirements for EMI/RFI protection for cable connectors.

“A” Series back shell features include:

•   Lightweight aluminum material with a zinc content of less then 1%, an important factor in applications restricting the use of zinc. Wall thickness provides a robust product while maintaining the goal of a lightweight back shell.

•   A larger aperture and strain relief which is appropriate for high density wire bundles using twisted, shielded pairs. Cable clamps can be “spooned” to provide strain relief for smaller wire bundles. Wide form factor allows the user to easily meet bend radius requirements.

MENDHAM, NJ – March 3, 2011 – The Power Sources Manufacturers Association (PSMA) announces today that the 2011 PSMA Power Technology Roadmap report is available for PSMA members and the industry. It is the seventh roadmap in a series, previously completed every three years to look at the power technology and power delivery trends over the next four to five years. In response to requests from our members and to provide more up-to-date information to the power sources industry, this roadmap report is being published after only two years.

The 490-page 2011 PSMA Power Technology Roadmap report includes a new segment on application trends which covers key metrics, market drivers and challenges in computing, communications, digital power, industrial, lighting, medical, military and solar PV power. The report also includes presentations from 25 leading experts from the power sources industry covering power architectures, components and technology and market forces. Finally, the heart of the report is a set of tables that provide the trends for 2012 and 2015 covering four product sets of ac-dc front-end power supplies, external ac-dc supplies, isolated and non-isolated dc-dc converters – with detail trends on key requirements, circuit design, components and packaging/assembly techniques.

Aung Thet Tu, co-chair of the organizing committee, noted that “the breadth and depth of the presentations, commentary and discussions are unprecedented and together have captured the technical trends and issues facing the power sources industry.”

Carl Blake, co-chair of the organizing committee also commented, “adding the third segment of applications provides a more comprehensive look at the dependency between multiple cross segments of technology, products, components and applications.

Copies of the printed and CDROM versions of “2011 PSMA Power Technology Roadmap” have been sent to PSMA regular and associate member companies as a benefit of their membership. PSMA affiliate members can purchase the report for $US150. The report is also available to non-members for purchase on the PSMA website (www.psma.com) for the price of $US2490.

Mendham, New Jersey — April 16, 2009 — The Power Sources Manufacturers Association (PSMA) announced today that it has issued a new publication entitled “Technology Report – Review of Commercial Developments in Power-Supply in Package and Power Supply on a Chip.” This report documents the final phase of a two-phase special project whose objective is to provide insight to both PSMA members and the broader electronics industry on the impact that power supply miniaturization and integration is having and the opportunities for new business that it enables. The technology report builds on the work of the first phase of the effort – an in depth survey of this emerging market – documented in the PSMA publication, “Market and Technology Report – Power Supply in Package - Power Supply on a Chip” issued in February 2008. The second phase focused on benchmarking six leading-edge commercial products, evaluating their performance, identifying the technologies and materials used to fabricate them and determining the progress and likely future direction of the technology based on these findings. The work was carried out by Tyndall National Institute (Cork, Ireland) with significant inputs from both the Power Electronics Research Laboratory (PERL) at University College Cork (Ireland) and Anagenesis Inc. (El Segundo, CA, USA). Commenting on the importance of the work, Dr. Cian Ó Mathuna, co-chair of the Steering Committee for the project, said “the report provides a very intense and comprehensive insight into the current trends and state-of-the-art in packaging, components and technologies required for this evolution and highlights the associated challenges that lie ahead.” A copy of the printed and CDROM versions of “Market and Technology Report on Power Supply in a Package – Power Supply on a Chip” have been sent to PSMA Regular and Associate member companies as a benefit of their membership. PSMA affiliate members can purchase the report for $150. The report is also available to non-members for the price of $4,990. Click to view the list of currently available PSMA publications About PSMA PSMA is an active organization consisting of power supply manufacturers, users, power component suppliers, academics and consultants interested in furthering the cause of the power supply industry. It is a non-profit, democratic and participative organization whose main and common goal is to enhance the stature of the power supply industry and provide education and information about this unique industry through published reports, educational seminars, technical workshops and conference exhibits. PSMA provides leadership to the industry through its membership which includes most major power supply companies.

February 14, 2008 — The Power Sources Manufacturers Association (PSMA) announced today that it has issued a report entitled “Market and Technology Report on Power Supply in a Package – Power Supply on a Chip”. This report documents the first phase of a two-phase special project whose objective is to provide insight to both PSMA members and the broader electronics industry as to the potential impact of this paradigm shift within the power supply industry. Cian Ó Mathuna, co-chair of the Steering Committee for this project, commented, “At this early stage in the Power Supply in Package and Power Supply on a Chip evolution, this report presents a valuable opportunity for the industry to take stock and obtain an overview of the technology and product trends that are evolving, what the technology and market drivers are and what the market opportunities will be over the coming years. The study will also provide valuable insights into future technology roadmaps and R&D challenges that need to be addressed.” The Market and Technology Report is the result of a comprehensive survey undertaken by Anagenesis, Inc. that involved in-depth interviews with major players, as well as reviews of industry and academic reports and literature — all of which have been subject to detailed analysis and assessments by the consultants. Brian Narveson, Steering Committee co-chair, stated, “The proliferation of functionally integrated hardware solutions is a move away from the traditional power supply manufacturing route of using discrete components to an increasing emphasis on power supply products employing functionally integrated devices directly from the semiconductor and microelectronics industries. Advances in semiconductor, magnetic, capacitor and packaging materials and technologies that will deliver products operating at multi-MHz frequencies are augmenting this trend.” A copy of the printed and CD-ROM versions of Market and Technology Report on Power Supply in a Package – Power Supply on a Chip has been sent to PSMA Regular and Associate member companies as a benefit of their membership. PSMA Affiliate members can purchase the report for US$490. The report is also available to non-members for purchase on the PSMA website (www.psma.com) for US$2490. PSiP2PwrSoC Market and Technology Report On Power Supply-in-a-Package and Power Supply-on-a-Chip ©2008 PSMA All Rights Reserved.

• 252 Pages • 90 Pages of Appendices • 105 Figures • 31 Tables • 24 Companies’ Products Analysed

Table of Contents

Executive Summary Introduction PSiP Terminology, Definitions, Origins and Development Recent PSiP Products Summary Market Survey.Interview Results Future – PSiP Trend Analysis Technologies Enabling PSiP

o Technology-Influencing and Application-Enabling Map – PSiP o PSiP Influencing Technologies o PSiP Application Enablers

PwrSoC Terminology PwrSoC Definitions PwrSoC Origins and Development

o Fully Integrated Power ICs o Integrating the Inductor o Integrating the Capacitor

Recent PwrSoC Products Comments on Present PwrSoC product Future PwrSoC

o Technologies Enabling PwrSoC o Technology-Influencing and Application-Enabling Map – PwrSoC o PwrSoC Influencing Technologies o Power Passives – Developing Integrated Devices

Appendix I PSiP Datasheets Appendix II PwrSoC Datasheets Appendix III: Glossary of Terms Appendix IV: Bibliography Appendix V: HTML Links Appendix VI Market Players To order directly from PSMA please complete the "members order form" or the "non-members order form".

MENDHAM, NJ — November 30, 2007 — The Power Sources Manufacturers Association (PSMA) announces the publication of “Follow the Power: A Report on an Energy Efficiency Workshop.” Based on a Feb. 2007 workshop co-sponsored by the Electric Power Research Institute (EPRI) and PSMA, the 200-page benchmark report offers key findings on possible energy efficiency improvements spanning the entire power network from generation to load. “The PSMA / EPRI energy efficiency report promises to influence industry efforts for the next decade,” said Arnold Alderman, PSMA Director and workshop co-chair. “The workshop was remarkable for assembling so many knowledgeable contributors under one roof to share their expertise and perspectives on the full realm of power. Anyone involved in increasing energy efficiency, which is of particular concern today, will find this report extremely helpful.” The report captures thought-provoking solutions to today’s energy efficiency challenges that were discussed during the workshop’s breakout sessions. Designed to facilitate a better understanding of the industry, it covers essential elements of the electric power chain, including:  Power generation (traditional and alternative)  Power transmission and distribution  Customer-side utilization  Power delivery at the facility and rack level  Power delivery to the IC level (the load) “Follow the Power: A Report on an Energy Efficiency Workshop” is available through both PSMA and EPRI. Copies are available for purchase on the PSMA website (www.psma.com) for the price of $US 2,490.00.