3D PEIM

International Symposium on 3D Power Electronics Integration and Manufacturing
Posted: 2017-9-11

June 25-27, 2018

Adele H. Stamp Student Union, University of Maryland, College Park, MD USA

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

Please visit www.3d-peim2018.org for the latest information on the 2018 symposium.

A Successful Inaugural Symposium
Posted: 2016-8-8
1st International Symposium on 3D Power Electronics Integration and Manufacturing

The first International Symposium on 3D Power Electronics and Manufacturing was a true success! On June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and began with three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.

A highlight was the Plenary Road Mapping session chaired by Brian Narveson, PSMA, with keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.

The Symposium was organized by the Power Sources Manufacturers Association (www.psma.com), chaired by Prof. Doug Hopkins of North Carolina State University, and supported by 15 exhibitors and sponsors, including the FREEDM Systems Center at NCSU, CPES at Virginia Tech, and CALCE at University of Maryland.

Of special note: SARDA Inc. selected the 3D-PEIM Symposium to announce its collaboration with UTAC and AT&S to implement its Heterogeneous Integrated Power Stage (HIPS). All three were exhibitors and/or presenters.

Plans are now underway for 3D-PEIM 2017 and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by
Prof. Douglas Hopkins,
General Chair

  Doug Hopkins

 

 

2016 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2016-7-5

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available to PSMA members here

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