3D PEIM

CALL FOR PAPERS -International Symposium on 3D Power Electronics Integration and Manufacturing
Posted: 2017-11-17

PSMA is proud to announce the organizing of The Second Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18) to be held on June 25-27, 2018.  This Symposium will be held at the University of Maryland, College Park and will bring together world-class experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Prof. Patrick McCluskey of the University of Maryland, College Park is the General Chair and Prof. G.Q. Liu from Virginia Tech is Program Chair for the symposium.

For the professional or educator engaged in the research and development of power electronics packaging design, and manufacturing processes, this Symposium is the ideal event to share your ideas, progress and challenges with leading members of international associations and societies active in these fields of expertise. The program will focus on additive, embedded, co-designed, and integrative packaging technologies. Sessions will address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

Abstracts of candidate papers are sought that address important challenges related to the design, packaging and manufacturing of smaller, lighter, more efficient, and sustainable power electronic products, especially in the following topic areas:

  • Additive Manufacturing
  • Embedded Components and Embedding Technologies
  • Systems Integration and Thermal Management for High-density Packaging
  • Multi-physics Modeling and Simulation of Integrated Packaging and Circuit Solutions
  • Materials (e.g., interconnects, encapsulants, substrates)
  • Heterogeneous Integration
  • Manufacturability of circuits and packaging (manufacturing processes, equipment, and standards)
  • Quality and Reliability, including Prognostics and Condition Monitoring

We invite you to respond to our Call for Papers by submitting an abstract. Applicants can choose if they wish to present a) at a lecture session or b) at an e-poster session. Authors of accepted abstracts are expected to prepare both a power point presentation/or e-poster and an IEEE formatted paper so your material can be published in IEEE Explore. On the day of their presentations, all presenters will have free tabletop space in the exhibit area to demonstrate hardware and hold one-on-one discussions.

You can submit your Abstract at our symposium website www.3D-PEIM.org.
Abstracts are due December 18, 2017.

This is an outstanding opportunity to learn more about advanced fields of power electronics packaging and manufacturing. The symposium will feature 26 invited presentations, highlighted with a keynote address by Prof. Mark Johnson of the University of Nottingham, who is the Director of the Center for Power Electronics under the UK Engineering and Physical Sciences Research Council (EPSRC). There will be three tutorials by invited specialists, eight sessions that include invited and contributed presentations, an interactive poster/demonstration session, and plenty of networking time set aside.

The Symposium will include a table top exhibition area. Interested organizations are invited to purchased exhibit space that will include one registration and a table to exhibit products and literature to a target group of technologists.

Symposium Sponsorship is also available which includes one registration, tutorial registration, an exhibit table, Website and program recognition, lecture room recognition, and a banner displayed in the lecture room.

We will let attendees from the 2016 Symposium say it in their words:

  • "Good balance of academic and industry papers and attendance covering and illustrating research, development, and manufacturing technologies."
  • "It was a very important forum as we move into the post-Moore's Law/Heterogeneous Integrated era"
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

Want to learn more? Contact mailto:info@3D-PEIM.org, or the PSMA office at power@psma.com.

We look forward to seeing you in College Park this coming June.

For more information, please visit the Symposium website: www.3D-PEIM.org

Questions pertaining to the 3D-PEIM Symposium may be addressed to:

General Chair: Prof. Patrick McCluskey, Univ, of Maryland (mcclupa@umd.edu)
Technical Program Chair: Prof. Guo-Quan Lu, Virginia Tech (gqlu@vt.edu)
Past General Chair: Prof. Douglas Hopkins, NC State University (dchopkins@ncsu.edu)

International Symposium on 3D Power Electronics Integration and Manufacturing
Posted: 2017-9-11

June 25-27, 2018

Adele H. Stamp Student Union, University of Maryland, College Park, MD USA

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

Please visit www.3d-peim2018.org for the latest information on the 2018 symposium.

A Successful Inaugural Symposium
Posted: 2016-8-8
1st International Symposium on 3D Power Electronics Integration and Manufacturing

The first International Symposium on 3D Power Electronics and Manufacturing was a true success! On June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and began with three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.

A highlight was the Plenary Road Mapping session chaired by Brian Narveson, PSMA, with keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.

The Symposium was organized by the Power Sources Manufacturers Association (www.psma.com), chaired by Prof. Doug Hopkins of North Carolina State University, and supported by 15 exhibitors and sponsors, including the FREEDM Systems Center at NCSU, CPES at Virginia Tech, and CALCE at University of Maryland.

Of special note: SARDA Inc. selected the 3D-PEIM Symposium to announce its collaboration with UTAC and AT&S to implement its Heterogeneous Integrated Power Stage (HIPS). All three were exhibitors and/or presenters.

Plans are now underway for 3D-PEIM 2017 and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by
Prof. Douglas Hopkins,
General Chair

  Doug Hopkins

 

 

2016 International Symposium on 3D Power Electronics Integration and Manufacturing Presentations
Posted: 2016-7-5

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available to PSMA members here

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