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2016 Roadmap Presentations
Trends in High-Frequency Magnetics and Power Supply Design January 14
Abstract:In the last 10 years, great advances have been made in the density and efficiency of high-frequency power supplies. Outside the field of magnetics, new packaging and component technologies have made a huge difference to design approaches. However, in the world of magnetics, there have not been any really significant changes in many years despite pressure to reduce the cost and size of power systems. No radically new materials or technologies have eased the design of magnetics.
Instead, power supply designers have found ways to minimize the magnetics by using different circuit topologies and different regions of operation. By paying careful attention to time-proven analyses of winding proximity effects and core loss, engineers are making sure that their magnetics designs do not impede the progress of high-technology products.
This seminar will present some of the techniques being used in the industry, where counter-intuitive circuit design techniques have led to great improvements.
Presenter: Dr. Raymond B. Ridley, President, Ridley Engineering US and Ridley Engineering Europe
Dr. Ridley is a prominent researcher and teacher in the field of power electronics, offering hands-on training to industry and university power supply design engineers. He combines a unique combination of theory and practical considerations in the area of magnetics, control, and circuit design. For many years he has provided practical and useful power supply design tips on his website at www.ridleyengineering.com
He received his undergraduate degree from Boston University in 1981 working on a high-frequency ferroresonant LLC design for his senior project. He later attended Virginia Tech where he worked in research areas of magnetics, control, resonant conversion, parallel multiphase power supplies, and design optimization. He is also well known for his doctoral work in solving the problem of current-mode control analysis. He is currently the president of Ridley Engineering, based in Camarillo, California, a company offering training courses, frequency response analysis instruments, and power supply design and simulation software.
3D Embedded Substrate Technologies Increase Density and Performance of Power Supplies January 28
Abstract: This webinar provides an overview of how embedded substrate technology can be used to increase the power density and performance of packaged power sources. The webinar will present a variety of substrate technologies and where they are available. It will discuss component availability, industry standards and the challenges a designer faces to implement the technology.
The contents are derived from an extensive research study conducted by the Power Sources Manufacturers Association (PSMA) that was completed in March 2015.
Attend this webinar to learn:
- Why embedded substrate technologies are key to increasing power source density and performance
- Which embedded substrate technologies are already being used in power sources
- Which Components are available for immediate use in embedded substrate power sources
- What Challenges remain for implementing embedded substrate technology in power sources
Presenter: Brian C. Narveson received his BSEE from Iowa State University in 1972. He is currently the President of Narveson’s Innovative Consulting, which focuses on coaching Innovation in Engineering and Technical Marketing. Brian has been in the power industry for over 20 years. He joined Power Trends in 1992 shortly after it was founded as the Vice President of Engineering. His team developed the products which helped grow the company from less than $1M in sales in 1992 to over $60M in 1999 when it was purchased by Texas Instruments. After the acquisition held several Marketing roles in TI’s power business. From 2007 until he retired from TI in 2011 he was the Midwest Analog Applications Manager for Texas Instruments.
Brian has been co-chairman of the PSMA Packaging Committee for 9 years, which sponsored and facilitated the research project and technical report “Current Developments in 3D Packaging with Focus on Embedded Substrate Technologies” published in March 2015. He has been involved with PSMA since 2001 and currently serves on the board of directors.
Brian has published over 25 power electronics articles in the US, Asia and Europe.
Synergies between Power Electronics and Energy Harvesting February 11
Abstract: Energy harvesting (EH) has recently become a topic of much discussion with its potential to self-power heterogeneous devices for IoT (the internet of things). The need to replace batteries on a regular basis is one of the biggest impediments to the proliferation of IoT devices. So what relevance does this have for the power electronics community? This ‘applications based’ webinar attempts to address this question or at least to stimulate discussion based on the initial opinions of the recently re-formed PSMA Energy Harvesting Committee.
It is presented in 4 sections:-
- Introduction to EH, what type of ambient energies are available, what are the challenges in converting (& storing) these energies into usable energy?
- Examples of real life use cases demonstrating that EH has already progressed from the laboratory to commercial applications
- Some power electronics related applications for EH
- Roadmap of where EH is likely to go in the next few years (relevant to power electronics community) – initial thoughts
In some cases EH is simply an expansion of market demand for related components/devices, in which cases such vendors need to understand market needs and trends. In other cases the technology itself has useful applications for enhancing power electronics functionality, for example in monitoring the performance of the PSUs and/or their operational environment and reporting on anomalies detected.
The webinar will conclude with some information on the purpose of the Energy Harvesting Technical Forum on the PSMA web site and plans to hold a face to face committee meeting during APEC 2016. This meeting will help set the strategic direction for the EH committee as well as capture inputs for the development of an EH roadmap for PSMA.
Presenters: All three presenters are members of the recently re-formed PSMA Energy Harvesting Committee:
Lorandt Fölkel (M.Eng) from Wurth Elektronik eiSos GmbH, is Business Development Manager for Energy Harvesting, Field applications engineer for Eastern Europe, Baltic countries, Russia and Turkey. He has > 29 years’ experience in electronic design, including 17 years in product management with widespread experience for EMC and efficiency improvement for SMPS (switched Mode Power Supply).
Mike Hayes (MEng. Sc) is Senior Program manager, ICT for Energy Efficiency, Tyndall National Institute, Ireland. He has almost 30 years of experience working in Power Electronics industry & research in the areas of energy harvesting, WSN (wireless sensor network) and 3D power electronics packaging. Mike promotes convergence between power electronics, energy harvesting and ICT domains. His team delivered the world’s 1st indoor energy harvesting power management solution for WSNs operating indefinitely in indoor lighting conditions and for 72 hours in darkness.
Ajinder Singh, TI, is Building Automation and Lighting General Manager – Industry and TI’s technical expert for building automation solutions. Ajinder has worked extensively in defining ground breaking, differentiated system architectures for low power Internet of Things (IoT) sensing nodes. In 2015, he was recognized by the Fortune Magazine as one of the Tech Industry’s “Accelerators” for his work in low power, connected devices. http://fortune.com/2015/06/04/fortune-500-accelerators/
Wide Bandgap Power Devices: Die Size Shrinking and Its Impact on Power Delivery Architecture February 25
Abstract: Wide bandgap (WBG) power devices based on SiC and GaN materials are being commercially introduced to the market. These devices, although currently are more expensive than silicon power devices, are offering leapfrog performance gains due to superior material properties of WBG than silicon, primarily the 10X higher electric field strength. The WBG device’s Figure of Merits (FOM) are significantly improved and over 65 times smaller chip size could be used for WBG FETs as compared to a Si MOSFETs. Because of this die size shrinking, the overall parasitic capacitance is also significantly smaller relative to the amount of current they are conducting. Hence much higher switching speed (i.e. higher dI/dt and dV/dt) could be achieved in these power switches such as SiC MOSFET and GaN HFET. On the other hand, better packaging and integrated gate driver technology with a smaller gate loop inductance and gate capacitance has introduced an opportunity to turn off the gate loop much faster than possible before. Due to this ultra-fast gate turn-off condition, zero drain turn-off loss is now feasible and has been demonstrated. Coupled with soft switched turn-on, zero switching loss is possible in these devices over all usable current ranges. So for the first time we have a device that is almost free of switching loss in high frequency operation. Implication of this is significant and will support more and more power supply design around soft switched converters with the aim to further improve the power delivery efficiency and power density. Several power delivery architecture changes are potentially possible due to the extremely high switching frequency capability of these devices.
Presenter: Dr. Alex Huang received his B.Sc. degree from Zhejiang University, China in 1983 and his M.Sc. degree from Chengdu Institute of Radio Engineering, China in 1986, both in electrical engineering. He received his Ph.D. from Cambridge University, UK in 1992. From 1994 to 2004, he was a founding member and a professor of Center for Power Electronics System (an NSF ERC) at Virginia Tech. Since 2004, he has been a professor of electrical engineering at North Carolina State University and he is currently the Progress Energy Distinguished Professor of Electrical and Computer Engineering. He established the NSF FREEDM Systems ERC in 2008. As part of the FREEDM System concept, he developed the original concept of Energy Internet with the Solid State Transformer serving as an Energy Router. Today, FREEDM Systems ERC is one of the most successful ERCs in the USA with support from many companies. Dr. Huang is also the lead PI and visionary leader behind NCSU’s recent success in establishing the next generation Wide bandgap power electronics manufacturing innovation institute.
Dr. Huang’s research areas are power semiconductor devices, power management integrated circuits, power electronics and its emerging applications such as those in future electric power delivery and management systems. A very active and productive research leader, Dr. Huang has mentored and graduated more than 70 Ph.D. and master students and has generated more than $200m external R&D funding in the last 20 years. Dr. Huang has published more than 400 papers in journals and conference proceedings, and holds 20 US patents. Dr. Huang is the inventor and developer of the ETO thyristor technology. Dr. Huang is a fellow of IEEE and the recipient of the prestigious 2003 R&D 100 award and 2011 MIT Technology Magazine awards.
GaN Power ICs and the High Frequency Eco-System April 21
Abstract: The power GaN market is forecast to be US$2.6B by 2022, driven by the efficiency, size and cost-benefits of high frequency switching. Designs can be implemented simply, quickly, reliably and cost-effectively using AllGaN™ monolithically-integrated 650V GaN Power ICs to overcome frequency, complexity and cost limitations.
This presentation introduces the technology behind the world’s highest performance 650V GaN FET, drive and logic circuits, and the low inductance, low profile industry-standard packaging which combine to make a simple yet powerful powertrain building block for off-line AC-DC, 400V DC-DC or inverter systems.
Real-life application examples - with schematics, layout, waveforms and thermal results – prove higher system efficiency, higher power density and lower cost by addressing issues such as gate drive, layout, availability of MHz magnetics and controllers, EMI performance, etc.
Presenter: Stephen Oliver is VP Sales & Marketing for Navitas Semiconductor. He has over 20 years’ experience in the power semiconductor and power supply industries in computing, industrial, automotive and telecom markets with Motorola and Philips (NXP) in the UK, and International Rectifier and Vicor in the USA. He holds a B.Eng (Hons) in Electrical & Electronic Engineering from Manchester University, UK and an MBA in Global Marketing & Strategy from UCLA, USA. Stephen hold several patents in power semiconductors, is a Chartered Engineer and is currently President of the PSMA.
An Overview of Wireless Power Transfer and Standards May 5
Abstract: Pioneered by scientists such as Tesla in the late 19th and early 20th century, wireless power transfer has been the subject of research interest for over a century. The earlier research combined with the later advances in technology and devices for high-frequency power conversion enabled the growth of wireless power applications. The mobile electronics era triggered more R&D work in this field and has resulted in the emergence of wireless power consortium and alliances. This presentation is an introduction to wireless power transfer for mobile devices. It also includes an overview of the available standards.
Presenter: Siamak Abedinpour is currently a Senior Director, IC Design Engineering, with the Wireless Power Division at Integrated Device Technology Inc., Tempe, AZ, designing wireless power IC products. He is a Director of the Board of AirFuelTM Alliance, representing IDT. Formerly he was a Senior Member of Technical Staff with the RF, Analog, and Sensors Group at Freescale Semiconductor Inc., Tempe, AZ, designing highly integrated power management ICs.
He received the B.S. and M.S. degrees from Iran University of Science and Technology, and Ph.D. degree from Arizona State University in 2004, all in Electrical Engineering. He has served as a chair, organizer, committee member, and advisory board member in several international conferences, including: IEEE APEC, RFIC, ISCAS, and International Wireless Power Summit.
Power and Sensor Devices Driving Automotive Semiconductor Applications June 2
Abstract: Cars are increasingly driven by electronics to reduce human error, improve traffic flow and to meet environmental regulations. The semiconductor components that enable this functionality range from medium voltage discretes to replace relays to integrated, high-voltage motor drivers with re-programmability at high temperature. In this talk we will review the technology trends underlying the improvements in power discretes, such as IGBTs and GaN HEMT devices, the scaling trends and integration needs of high-voltage BCD CMOS flows, as well as the adjacent assembly challenges of power devices and power integrated modules.
Presenter: Dr. Johannes M.C. (Hans) Stork is Senior Vice President and Chief Technology Officer at ON Semiconductor. He oversees the development of wafer process technologies, modeling and design kits, IP libraries, as well as packaging technologies and assembly support.
Prior to joining ON Semiconductor, Dr. Stork was Group Vice President and Chief Technology Officer of the Silicon Systems Group at Applied Materials.
From 2001 to 2007 he was Senior Vice President and the Chief Technology Officer of Texas Instruments. Before that, Dr. Stork was various R&D and management positions at Hewlett Packard Laboratories and at IBM’s T.J. Watson Research Center.
Dr. Stork serves on the supervisory board of ASML, is a member of the Scientific Advisory board at IMEC, and has previously served on the boards of Sematech and the SRC, and is a longstanding member of the SIA Technology Strategy Committee.
He authored over 100 cited papers and holds eleven US patents. He was elected IEEE Fellow in 1994, and served on several IEEE sponsored conference program committees. He currently chairs the IEEE A. Grove Technical Field Award committee and is vice-chair of the Technical Field Awards council.
Dr. Stork was born in Soest, The Netherlands, and received the Ingenieur degree in electrical engineering from Delft University of Technology, Delft, The Netherlands, and holds a PhD in EE from Stanford University
SiC Power MOSFETs and Applications Status in 2016 June 23
Abstract: Silicon carbide MOSFETs, first released commercially in 2011, have started to rapidly be adopted in applications ranging from PV inverters, DC-DC converters, industrial power supplies, EV chargers, telecom power supplies, and industrial power supplies. We will discuss the maturity of the SiC MOSFETs in terms of product offerings, reliability data, and product support such as gate drivers and reference designs. The value proposition of initial applications adopting SiC MOSFETs will also be discussed in a time appropriate manner.
Topics covered during the short course include:
- SiC historical progress and maturity
- SiC performance relative to Si and GaN switches (very brief comparison)
- Status of SiC power MOSFETs from 650V to 3.3kV
- Applications using SiC MOSFETs today
- Future trends in SiC devices and applications
Biography: Dr. Casady has 20+ years of management experience in business development, marketing, semiconductor research, and manufacturing experience in a combination of industry / academic settings: Cree (NASDAQ: CREE), Northrop Grumman (NYSE: NOC), SemiSouth Laboratories, Inc. (start-up), University of Missouri, Auburn University, & Mississippi State University. Dr. Casady has published over 80 technical publications, three book chapters, and seven patents, all in SiC power semiconductor technology.
From 2012 through today Dr. Casady is working for Cree, in various roles including SiC Product Management, SiC Power Marketing Director, and since 2013 in Business Development and Program Management. He works with major automotive, solar, and UPS inverter OEMs interested in SiC power conversion. From 2003-2012, Dr. Casady served as a corporate officer & co-founder of SemiSouth, a small private start-up focused on SiC power device development and manufacturing. From 1999-2003, he served as an Assistant Prof. of Electrical Engineering at Mississippi State University while helping to found SemiSouth and being active in several SiC power semi programs.
Dr. Casady previously worked for Northrop Grumman Science and Technology Center from 1996-99 as a Senior Engineer in SiC device development. He holds a Ph.D. in Electrical Engineering from Auburn University, and graduate and undergraduate degrees from the University of Missouri.
Present and Projected Safety-Regulatory and Compliance Requirements for Power Conversion and Power Supplies July 28
Abstract: Regulatory requirements for power conversion and power interface equipment will continue to have an increasing rate of change. The wholesale changes in product safety and EMC/EMI standards, and new social and environmental legislation and directives, are part of an attempt to address new technologies, and increasingly different societal expectations and concerns. The presentation is a structured and (necessarily) shallow overview of the most significant regulatory changes that could affect the design, testing, approval, and marketing processes for power supplies in the principal industry sectors.
Biography: Brian O'Connell is currently the Senior Product Safety/Reliability Engineer for Tamura Corporation of America, and has special interests in the development of automation methods for test, quality, and production. He has received B.S. degrees in Computer Science and Math.
Nanofluids for Electronic Cooling October 6
Abstract: The colloidal dispersion of nanoparticles is known as “nanofluids.” Such engineered fluids offer the potential for enhancing transport phenomena, particularly heat transfer while avoiding drawbacks (i.e. erosion, settling, clogging) that hindered the use of particle-laden fluids in the past. This enhanced heat transfer properties of nanofluids make them a very good potential candidate for compact liquid-cooled electronics.
Due to rapid development in modern technology, current electronic systems generate a huge amount of heat, which deteriorates the performance of the devices and decreases their reliability. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. Heat transfer in engineering systems is complex and includes phenomena such as conduction (thermal conductivity), convection (laminar and turbulent), and boiling heat transfer. In particular, boiling heat transfer is vital for direct immersed electronic cooling of high power electronics.
Therefore, this presentation provides an overview of the current stage of nanofluid technology, the state of the art on nanofluid thermos-physical properties, convective heat transfer (laminar and turbulent) as well as boiling heat transfer of nanofluids. The presentation will finish by providing various potential electronic cooling applications that nanofluid can be beneficial.
Biography:Reza Azizian, Ph.D., is a research scientist at Advanced Thermal Solution (ATS). Before joining ATS, Dr. Azizian was a postdoctoral associate at the Massachusetts Institute of Technology. His areas of technical expertise are nanofluid technology, nano-engineered surfaces, fluid dynamics, heat transfer and two-phase flow. He received his Ph.D., from the University of Newcastle in Australia in 2013. He is the author and co-author of 20 articles in refereed journals and peer-reviewed conference proceedings. His paper on magnetite nanofluids in IJHMT ranked as the 4th most read article in 2013 in that journal.
Technology trends and advances in Multilayer Chip Ceramic (MLCC) and Metallized Polypropylene Film Capacitors November 3
Abstract: Capacitors manufacturers strive to provide more capacitance into smaller packages, while keeping low cost in mind. Meanwhile, power converters continue to rise in frequency and those adopting new transistor technology, like wideband gap, are pushing operating temperatures higher. Beyond voltage and capacitance, secondary parameters like the operational lifetime, maximum operating temperature, switching frequency, or volumetric efficiency become the deciding factors in choosing the right capacitor.
The technology of Multilayer Chip Ceramic Capacitors is often overlooked because of their incredibly low price and common usage. And as application temperatures continue to rise, advancements in high temperature Metallized Polypropylene Film Capacitors offer energy densities acceptably close to those achieved with aluminum electrolytic capacitors while bringing low heat dissipation and long operational life to large DC capacitor banks.
This webinar will provide a brief overview of different capacitor technologies with an in-depth look at the latest technologies and trends in both multilayer chip ceramic capacitors (MLCCs) and high-temperature polypropylene film capacitors.
James Lewis, Kemet
Pierre Lohrber, Wurth
Ralph Kerrigan, NWL
Isolation Technologies: It's All About the Insulation November 17
Abstract: Over the past 16 years the digital isolator has grown from a cool idea into a mature constellation of products from about 10 different manufacturers. With that growth has come many ways to compare insulation, data, power, and noise performance. The combinations of isolator properties have tended to become linked together because of choices that the major manufacturers have made. For example the use of capacitive vs. inductive coupling have become associated with SiO2 and Polyimide insulation respectively. But these were design choices, not hard and fast associations.
To a large extent it is all about the plastic or glass, everything else is secondary to the integrity of the insulation. That is not to say that other measures of performance are not important. In this Webinar we will peal back the different aspects of making a digital isolator, and compare it with the older optical technology. This should allow you to make a more informed choice for your needs. You will get an understanding of what performance parameters are linked and which are independent. This will allow you to know when to keep looking for that special combination of performance and safety. In the course of the discussion we will touch on many of the new products coming into the market place and trends in isolation.
Biography: Mark Cantrell has a Master’s Degree in Physics from Indiana University. He worked in radiation effects and flight hardware test for Lockheed Martin Missiles and Space for 17 years. After that he provided Applications engineering support for NEC optocouplers and solid state relays At California Eastern Labs for six years.
For the past 10 years he has been an Applications Engineer for Analog Devices in the isolation group. He supports all of the certification activities for the non-optical isolators as well as being on several IEC and UL safety standards committees.
Energy Storage January 12
Abstract: Lithium Ion technology has been dominant as consumer product rechargeable battery platform. It is now beginning to establish itself as the platform in automotive energy storage applications and is emerging as a key option in grid storage.
The iNEMI Energy Storage Roadmap has been monitoring developments in the consumer, automotive and grid storage platforms. This webinar will present the iNEMI approach to the Energy Storage Roadmap, and some of the key findings from 2017 iNEMI Energy Storage roadmapping effort.
Biography: Ravi M. Bhatkal, Ph.D.Ravi Bhatkal serves as Vice President, Energy Technologies, at Alpha Assembly
Solutions, a MacDermid Performance Solutions Business, where he is building and scaling a new business in the Alternative Energy and Energy Efficiency value chains. Previously, Ravi served as VP and General Manager of the global Engineered Products business and led Global Strategic OEM Marketing, Strategic Planning, and the corporate New Business Development initiatives at Cookson Performance Materials, a global >$1 billion specialty and electronic materials company.
Prior to Cookson, Ravi served as Vice President, Strategy and Business Development at AgION Technologies, a venture financed startup focused in the controlled release antimicrobials space, where he helped build a profitable business in an emerging industry within 5 years. Prior to AgION, Ravi served as Project Manager at IBIS Associates, a management consulting firm (MIT spin-off) focused on quantitative modeling of materials and manufacturing economics and value, where he consulted to Fortune 500 corporations and US Government Agencies on investment allocation and choices in building new businesses and products, including acquisitions.
Ravi earned a Ph.D. in Materials Science and Engineering and M.B.A. from Rensselaer Polytechnic Institute, an M.S. in Materials Science and Engineering from Vanderbilt University, and a B.E. in Mechanical Engineering from the College of Engineering, Pune, University of Pune, India.
Ravi currently serves as Member of the Global Board of Directors of iNEMI, the global electronics industry consortium with cumulative member revenues in excess of $750 billion and serves on the Industrial Advisory Board of the RPI Smart Lighting Engineering Research Center.
Ravi is widely published and is a co-inventor on two granted and six pending patents.
Paultre on Power - PSMA's Technology Roadmap Chairmen at PCIM 2014
In this video Alix Paultre of Power Systems Design interviews Eric Persson and Aung Tu, the co-chairs of the Power Sources Manufacturers' Association technology roadmap committee about the upcoming update. Consisting of a series of web-based international presentations and a roundtable, the technology roadmap committee creates a strategic view of the next two years and some of the predicted trends in the marketplace and the laboratory.