PSMA website
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Table of contents
  1. Plans Moving Ahead for APEC 2021
  2. You Are Invited to the 2020 PSMA Planning Meeting
  3. Meet Your Directors
  4. Message from the PSMA Executive Committee
  5. About Our Members
  6. Friends of PSMA
  7. Welcome to PSMA
  8. PSMA Core Loss Studies
  9. APEC 2021 Sponsors Continue Student Travel Support Program
  10. Power Magnetics @ High Frequency Workshop
  11. Design Techniques for the 21st Century – Behind the Scenes Make Sure You Use the Correct Capacitor
  12. 2020 International Power Supply-on-Chip (PwrSoC) Corridor Webinar Series November 5, 10 & 12 2020
  13. The Third International Symposium on 3D Power Electronics Integration and Manufacturing – 3D-PEIM
  14. International Workshop on Integrated Power Packaging (IWIPP 2021) Inviting Paper Submissions
  15. 120 Years of Technology Evolution Towards the Mythic 99% Efficiency!
  16. New EU Appliance Regulations Add Complexity, Reform Product Labeling
  17. iNEMI Publishes Best Practices for Protecting the Reliability and Integrity of Electronic Equipment when Disinfecting for COVID-19
  18. Events of Interest – Mark Your Calendar
Contents | Next->

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.


Previous issues of update: Q4_2019 | Q1_2020 | Q2_2020


PSMA UPDATE is published and distributed via e-mail quarterly by the Power Sources Manufacturers Association. Send editorial information and comments to:

Editor, PSMA UPDATE
P.O. Box 418
Mendham, NJ 07945-0418

  (973) 543-9660
(973) 543-6207 (Fax)
E-mail: power@psma.com
Web Site: www.PSMA.com

Publisher: Mike Hayes   Managing Editor: Lisa Horzepa

Permission to reprint information and articles as published is granted: a courtesy line is appreciated.

Membership in PSMA is open to any organization or corporation involved in the power sources and supplies industry. For membership information, visit our website or contact us by fax, telephone or email.

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.

 

 


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Plans Moving Ahead for APEC 2021

Plans are moving ahead for APEC 2021, the leading conference for practicing power electronics professionals which addresses a broad range of topics in the use, design, manufacture and marketing of all kinds of power electronics equipment.  APEC 2021 continues the longstanding tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer.

This is the first time APEC is scheduled to take place in the Grand Canyon State, in Phoenix, AZ. The committee is hard at work organizing an in-person event, while also planning for any eventualities.

Despite the current climate, there has been a positive response from companies planning to exhibit at APEC 2021. And the number of submissions for Technical Paper, Industry Sessions and Professional Education seminars has been very encouraging.

PSMA and PELS will again be sponsoring two workshops, the sixth High Frequency Magnetics Workshop and the fourth Capacitor Workshop. For more information see the articles on each workshop in this issue of the UPDATE.

Please visit the APEC website https://apec-conf.org/ for additional information and updates.

Provided by Greg Evans,
APEC 2021 Publicity Chair

 

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You Are Invited to the 2020 PSMA Planning Meeting

A ll members of PSMA companies are invited to attend the 2020 PSMA Planning Meeting and to offer their inputs and suggestions for the projects and activities the Association should focus on in the coming year. Since ongoing concerns with COVID-19 are preventing many from travelling, the meeting will be held virtually on October 20, beginning at 10 AM CDT (3 PM GMT).

The Board of Directors relies on the inputs generated at the Annual Planning Meetings to identify, consider and select programs for the following year that will bring benefits to the PSMA membership. For example, initiatives generated at recent Planning Meetings have resulted in the Power Supply in Package and Power Supply on Chip project and workshops, the Energy Efficiency and Safety & Compliance Database projects, the 3D Power Packaging projects and the 3D-PEIM Symposiums.

This year's meeting will begin with a brief review of the year to date accomplishments and a summary of ongoing activities by Mike Hayes, Chair of the PSMA. This will be followed by an update of the six-quarter financial forecast from Treasurer Tim McDonald.

Most of the meeting will feature reports from the active PSMA committees and an open forum to introduce and discuss possible special projects, initiatives, and priorities for the coming months. All members of PSMA Companies are encouraged to provide inputs. If you cannot attend the meeting we invite you to , email suggestions to power@psma.com. These will be considered and included in the discussions. In the coming months, the PSMA Executive and Marketing Committees will summarize the results of the meeting and prioritize which projects and initiatives should be included in the focus for the next year.

If you plan to attend the 2020 PSMA Planning Meeting, please email the Association Office at power@psma.com for joining information. We look forward to "seeing" many of you at this important meeting.



 


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Meet Your Directors

Four members of the Board of Directors are elected at the PSMA Annual Meeting held every year during the APEC conference. Each Director serves a three year term and is eligible to be reelected for one additional term.

In this issue we would like to introduce you to Ada Cheng and Brian Zahnstecher who were both reelected at the 2020 Annual Meeting.
 
Ada Cheng is a Technical Marketing Consultant with AdaClock since 2008. In addition, she has partnered with Anagenesis, to research and publish the "Power Supply in a Package (PSiP) and Power Supply on a Chip (PwrSoC) market reports. She has been involved with the PSMA since 2002 and joined the PSMA Board of Directors in 2019. Currently she is an active member of the Marketing, Energy Management and Reliability committees.

One of her biggest contributions was challenging the PSMA committees to support APEC in some tangible way such as creating and running industry sessions, producing professional education seminars, suggesting key speakers for plenary, etc. As a result, the amount of industry participation in APEC has grown, and the conference has flourished while many other technical conferences have not. Furthermore, Ada was an invited member of the APEC conference committee from 2003 to 2015 primarily as the OEM Initiative Chair which developed the Industry Sessions.

Previously Ada was a corporate marketing manager at International Rectifier (now Infineon), a market analyst at Gartner Dataquest for analog ICs, and held various electrical engineering roles at Motorola Semiconductor Products Sector (now NXP Semiconductors and ON Semiconductors). Ada received her MBA from Arizona State University and her BSEE from Carnegie Mellon.

Provided by Ada Cheng, Principal Marketing Consultant, AdaClock

 

Brian Zahnstecher is a Sr. Member of the IEEE, Chair (Emeritus) of the IEEE SFBAC Power Electronics Society (PELS), sits on the Power Sources Manufacturers Association (PSMA) Board of Directors, is Co-founder & Co-chair of the PSMA Reliability Committee, Co-chair of the PSMA Energy Harvesting Committee, and is the Principal of PowerRox. He Co-chairs the IEEE Future Directions (formerly 5G) Initiative webinar series and is the founding Co-chair of the IEEE 5G Roadmap Energy Efficiency Working Group and has lectured on this topic at major industry conferences.

Brian previously held positions in power electronics with industry leaders Emerson Network Power (now Advanced Energy), Cisco, and Hewlett-Packard. He has been a regular contributor to the industry as an invited keynote speaker, author, workshop participant, session host, roundtable moderator, and volunteer. He has over 15 years of industry experience and holds Master and Bachelor degrees from Worcester Polytechnic Institute

Provided by Brian Zahnstecher, Principal, PowerRox



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Message from the PSMA Executive Committee

I n the last quarter's PSMA newsletter, Mike Hayes, the new Chair of PSMA, offered a high-level outline of what PSMA and in particular the Executive Committee's goals are. It certainly is a challenging time with most working from home and every Conference and Exhibition cancelled or at best turned into a virtual event. Even with these challenges, the PSMA Executive Committee has been busy working on improving PSMA for the benefit of our membership and ecosystem at large.

As we prepare for next year's APEC in Phoenix, AZ, everyone is hard at work organizing an in-person event, while also planning for any eventualities. We certainly hope that the COVID pandemic of 2020 will be completely behind us and events will move forward in Phoenix. Given the lessons learned in 2020 we believe that should APEC once again be required to become virtual we will be prepared to make that transition faster and smoother than this year. Between now and then we are also working to advance our objectives.

Application Based Orientation

As the champion to move PSMA more towards an application-based orientation, I have worked with the PSMA Transportation Electronics, Energy Management and Capacitor Committees to create offerings that will begin that transition.

For example, the Capacitor Committee has formed a sub-committee, Energy Storage & Applications, which is working with the Energy Management Committee to create an independent Industry Session for APEC2021 on Energy Storage. The expectation is that Energy Storage & Applications will eventually become its own Committee once critical mass is achieved. The goal will be to focus on the types of Energy Storage and methods to optimize the different technologies including everything from EV Car Battery or Fuel Cell Systems to Energy Harvesting from microwatts to megawatts.

Another activity that is now being worked on is a Webinar that will combine Transportation and Capacitors. This webinar will offer a process outlining critical parameters in choosing capacitors in Automotive applications. There will be separate Webinars for 12V, 48V and High Voltage (400V - 800V) transportation systems. The presenters will identify a needed capacitor, size it, and then evaluate the proper technology and specific component that should be chosen using product datasheets, and knowledge of the technologies.

Finally (for now), the Transportation Electronics Committee has dropped its reference to power (previously called Transportation Power Electronics) to allow inclusion of everything that supports Autonomous Vehicles. We believe this is a critical step to give PSMA and the Transportation Electronics Committee more exposure to the Vehicular Industry. We are working hard to help educate the engineers in the vehicle industry to the benefits and strengths of PSMA and value of membership (see IPC below). As can be seen from all of the above this also means a lot more interaction and synergies between the PSMA technical committees reflecting the need for technologies to be combined to better solve applications problems.

Engaging more with our industry and academic stakeholders

PSMA has presented in both the IFEC Conference (International Future Energy Challenge), and a Webinar with IPC titled - Automotive Electronics: Solutions to New Challenges. PSMA is a co-sponsor of IFEC and it was a privilege to present an overview of who and what PSMA is. Many attendees and participants of conferences never know details about the sponsoring organizations. The Executive Committee is working to change that, especially since we sponsor so many conferences in addition to APEC, by giving more detailed introductions at all of our events. The IPC Webinar was directed specifically to Automotive personnel. A quick survey showed that the majority of these Automotive engineers had never heard of PSMA or APEC. PSMA will continue participating in Automotive based activities to further our footprint in that industry.

The Executive Committee is always open to additional ideas and/or possible suggestions. I hope that by outlining some of our current activities, that I may have triggered an idea or two from you, the reader. I would look forward to hearing any feedback that you may have.

Fred Weber
PSMA President
Future Technology Worldwide

 

 


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  About Our Members 
About Our Members


Positronic builds premium power and signal connectors for a wide variety of global industries. But every product delivers the same outcome: Certainty. That's our master spec, our driving purpose.

 

Positronic was founded in 1966 with the vision to manufacture high quality, innovative connector products at a reasonable price. At the core of this vision is helping people, those who are advancing our world to make it a better place, those who are realizing new discoveries, developing technologies that help humans connect, and expanding commerce to advance economies. Positronic is serious about developing high reliability interconnect solutions because we believe in these missions and the need for trustworthy products. Failure is not an option when it comes to the critical systems that our customers are developing, they must perform.


Connector Products & Innovations

Positronic manufactures the most popular styles of connectors: D-subminiature (D-sub), high power, rectangular, modular and circular. While standard D-sub connectors are able to perform the function needed for many applications, Positronic has also developed innovative Dual Port D-sub connectors to save board space, combo D-sub connectors to allow for power and signal, and waterproof D-subs for outdoor applications.

Positronic is at the forefront of global requirements for power supplies and connectors. Positronic power connectors provide reliable connection for battery and power supply in applications that range from cleaning machines to data centers. In fact, in the 1990s, Positronic was approached by industry consortiums to develop completely new power connector types. Today, we are innovating new modular power connectors, including those being specified for the Open Compute Project (OCP). OCP is an organization that is creating open standards for hardware in data centers.

The modular power connectors used by OCP, called Scorpion, are manufactured using a unique injection molding process. This process allows the customer to choose the modules and configuration that meets their specification, and Positronic delivers a one-piece tooled product that is ready to perform upon arrival. This prevents the customer from having to assemble the modules themselves.

Our capability to quickly modify existing designs or create new products to meet customer-specific needs is one of our core competencies.


Positronic is well known for providing:

  • The broadest range of D-sub and Power connectors in the world
  • A wide variety of accessories for mounting, locking, hoods, and other applications
  • Customized connectors that meet the needs of our customers
  • Innovative technologies, such as our solid, machined contacts and PosiBand
  • Vertically integrated manufacturing, meaning we control all stages of production
  • Global service and support for new designs and existing projects
  • Connector products available for purchase and quick shipment from our ecommerce site, PosiShop

Energy Efficient Connectors

Positronic connectors help maximize efficiency in electrical distribution systems because of their contact design. Three technical elements produce ultra-low resistance electrical contacts, which save energy by reducing the amount of heat during operation. The Positronic contact design utilizes high conductivity materials, increases the electrical contact surface area, and optimizes the force between the areas in contact. These elements produce an ultra-low resistance contact, increasing the efficiency of the connector. The contact design is unique to Positronic, called PosiBand. PosiBand contact technology eliminates the weaknesses of the split-finger contact design, has greater surface engagement at the male and female contact interface, and has lower average insertion forces, resulting in greater ease in mating.

Operations

Positronic operates manufacturing facilities throughout the world, including the United States, France, Singapore, and Indonesia. Positronic is vertically integrated, allowing us to control the design and manufacturing processes, reduce costs, and improve efficiency. With knowledge and control of all processes and components, Positronic can provide connector designs faster and ensure that those designs are easily manufactured without excessive costs. Customers benefit from this unique capability because they are able to receive their connector designs quicker and for less cost than the competition. They can also rely on consistent lead times.

The Positronic mission is evident throughout our organization and we seek to build high reliability connectors for critical missions. From deep space discovery to medical breakthroughs, Positronic delivers The Science of Certainty.

For more information about Positronic, visit http://www.connectpositronic.com/. You can follow us on LinkedIn, Facebook, or Twitter or speak with our team of experts using our PosiLive online chat service or phone hotline (+1 417 855 2030).

Provided by Melanie Scott, Marketing Communications Manager, Positronic

 

Editors Note: We would like to feature your company in a future issue of the Update. Please contact the Association Office for information about how to submit an article for consideration.


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Friends of PSMA
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F riends of PSMA is a new feature added to this issue of the PSMA Update. This space will be used to introduce readers to organizations that PSMA has links with to better serve our memberships and the international power electronics industry. If you have suggestions on new links or ways that we can improve our current links with other industry associations, we would be delighted to hear from you.

In this article we introduce you to the China Power Supply Society (CPSS).


Founded in 1983, the China Power Supply Society (CPSS) is a non-profit and national class society in China. CPSS is dedicated to the scientific and technological progress of power electronics and furthering the development of the power supply industry. The focus on science and technology includes improvements in efficiency of energy conversion, improvements in quality and reliability, advances in semiconductor, components and battery technology, and development of alternative energy sources. This technology is used in all aspects of economic and social development.

CPSS currently includes over 9,000 individual members and more than 400 enterprise members. There are 14 professional committees and 10 working committees within CPSS as well as 10 local Power Supply Societies.

CPSS sponsors several academic and technical conferences every year, gathering power supply specialists and technicians. CPSSC (China Power Supply Society Conference), the largest academic conference focusing on power supplies in China, is held biennially. The 23rd conference was held in 2019 with more than 1600 attendees. The International Power Electronics and Applications Conference and Exposition (PEAC) has been held every four years, beginning in 2014. In 2018 the conference attracted 479 accepted papers and 803 attendees from 20 countries and regions. CPSS also organizes a number of annual symposiums on power supply and related areas.

CPSS edits and publishes three periodicals, CPSS Transactions on Power Electronics and Applications (in English, quarterly), Journal of Power Supply (Chinese core journal, bimonthly), Yearbook of China Power Supply Industry. In addition, CPSS has edited and published a series of monographs, handbooks, CPSS-Springer Series of English books as well as various proceedings of symposia.

Other CPSS activities include:

  • The "China Power Supply Society Science and Technology Award", which is considered the highest honor in China for both academia and industry of power supply. First awarded in 2011, 79 projects and 19 persons have been recognized over 5 sessions.
  • Since 2016, CPSS has annually reviewed standards in power supply technology and products. Currently, 16 CPSS standards have been released, 11 will be released in 2020, and 17 are being drafted.
  • CPSS also focuses on Continuing Studies and Technical Training, offering training courses and tutorials including switching power supply, power device, EMC, new energy, and electric vehicles
  • A Student Design Competition on Power Electronics (DcomPE) has been held annually by since 2015. with participation by teachers and students from more than 100 colleges and universities in China.
  • CPSS provides a variety of services for enterprises, such as Scientific and technological achievements, appraising, R&D popularization, and technical consultation.

Cooperation With PSMA

CPSS and PSMA have maintained a good relationship of communication and cooperation for many years. Some recent activities include:

PSMA has hosted a meeting of CPSS and PSMA leadership at the APEC conference in the US since 2014 to promote in-depth exchanges and discuss areas for cooperation and collaboration.


CPSS & PSMA meeting during APEC 2018 in San Antonio, TX
 

CPSS & PSMA meeting during APEC 2019 in Anaheim, CA

CPSS & PSMA have also held meetings in conjunction with the CPSS conferences China Power Supply Society Conference (CPSSC) and the International Power Electronics and Application Conference and Exposition (PEAC). The CPSS & PSMA Joint Workshop on Power Supply Industry Innovation has been held three times since 2017 as a part of these conferences, to promote exchanges and cooperation between American and Chinese enterprises.


CPSS & PSMA Seminar in 2015 at Shenzhen

 

CPSS & PSMA Joint Workshop on Power Supply Industry Innovation during CPSSC'2017 in Shanghai



CPSS & PSMA Joint Workshop on Power Supply Industry Innovation during CPSSC2019

Join CPSS

Visit http://www.cpss.org.cn/En/Index to learn more about CPSS and for information on individual membership and enterprise membership.

Provided by Naifen Yang, Office Director, CPSS

 


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Welcome to PSMA
 
   We are pleased to welcome three new member companies this quarter. We hope your company is a member. To learn about the benefits of membership, please visit our web site www.psma.com.
  
 
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Elektrisola Incorporated
Ben Braggins
126 High Street
Boxcawen, NH 03303
Telephone: 603-796-3060
E-mail: bbraggins@elektrisola-usa.com
Website: https://www.elektrisola.com



Elektrisola Incorporated is a privately-owned company founded in Germany in 1948. They are the world's largest manufacturer of fine copper wire, with diverse products including specialty enameled alloy wires, brass, silver-plated and silver wires. They design and manufacture their own machinery. The Elektrisola Group consists of facilities in the United States, Germany, Italy, Switzerland, Mexico, Malaysia, and China.

The Elektrisola Incorporated facility in  New Hampshire is nearly 6 acres in size with state of the art manufacturing, an exemplary safety record, and excellent working conditions. They are a 24/7 production operation with a family-oriented culture.

 


Fedco Batteries
Peter Victor
1363 Capital Drive
Fond du Lac, WI 54937
Telephone: 920-238-3243
E-mail: pvictor@fedcobatteries.com
Website: http://www.fedcobatteries.com/


Fedco Batteries is a premier custom battery assembly manufacturer headquartered in Fond du Lac, Wisconsin. Since 1975, Fedco has designed, engineered, and manufactured the highest quality battery assemblies for a myriad of portable, mobile and stationary backup applications. Fedco uses only the foremost leaders in battery cell technology and accompanying components. Their Quality Management System is ISO9001:2008 and is now also ISO 13485:2003 (Medical) registered, plus the vast majority of their suppliers are ISO registered companies as well.

Fedco takes particular pride in absolute customer service excellence and are consistently rated among the best suppliers by their customers and vendors alike. Fedco's unique business model offerings are supported by an organizational structure that was built from the ground up to insure a best-in-class customer experience; saving time, allowing for ingenious and elegant designs and in the long run creating tremendous value for their customers.

 


POSITAL-FRABA
Tobias Best
30 Kallang Place
#04-16/17
Singapore 339159 Singapore
Telephone: +6598633503
E-mail: tobias.best@fraba.com
Website: https://www.posital.com/en/


FRABA is a group of enterprises focused on providing advanced products for the markets of industrial automation and motion control. With subsidiaries in Germany, The Netherlands, Poland, USA and Singapore, FRABA is offering global support to its customers worldwide.

POSITAL, the position and motion sensor specialist products, is a member of the international FRABA Group. POSITAL's products, which include rotary encoders, inclinometers and linear position sensors, are used in a wide range of settings, from manufacturing to mining, agriculture to energy.

 


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PSMA Core Loss Studies

O ver the past five years, the PSMA Magnetics Committee has sponsored five Special Projects to better understand the flux propagation in ferrites and the reasons why the performance of large inductor cores performed so poorly compared to the expectations based on published specifications from the suppliers.

The first three projects - PSMA -Dartmouth Core Loss studies- were undertaken by Dartmouth under the leadership of Professor Charles Sullivan and the results are available on the Magnetics Forum on the PSMA web site. Based on some of the insights from these projects formed the basis for the 2 most recent projects – PSMA- SMA Core Loss Studies Phase 1 and Phase 2.

The last two Core Loss Studies are now complete, and this article highlights some of the most interesting findings.  This article is not as comprehensive as the reports, and the reader is encouraged to read the full reports on the PSMA web site for more information.

PSMA–SMA Core Loss Study Collaboration

SMA Magnetics was interested in why large inductor cores performed so poorly compared to expectations based upon published specifications. At the the same time, PSMA was interested in flux propagation in ferrites and why the performance factor B*f was lower and peaked at a lower frequency for larger cores.

Charlie Sullivan (Dartmouth) recognized that there was significant overlap in these interests and arranged an introduction which resulted in the Phase I PSMA-SMA core Loss study. The findings of the Phase I study were so intriguing that a Phase II study followed, which built upon the data from Phase I.

The Phase I and Phase II test reports can be found on the PSMA website Core Loss Studies tab of the Magnetics Forum. The Phase I report is publicly available; Phase II is currently only available to PSMA members, and will be publicly available in late 2021.

PSMA - SMA special project – Phase I

The purpose of the Phase I PSMA-SMA Core Loss projects was to study the flux distribution within ferrite cores while operating.  The concept is that a small area internal to the core can be enclosed by a test winding inserted into drilled holes.  The voltage on the test windings shows the dφ/dt of the flux.

Initially, eight specially machined cores, two each of four materials, were made by Fair-Rite.  Three holes were drilled into each core so that flux in the innermost 1/9th of the core area could be compared to the excitation.  These cores were shipped to SMA for study.

 

Although the original scope was to test these eight cores, SMA drilled seven more 50 mm cores of various materials to provide a larger sample.

A surprising result for some of the cores was that the flux density in the center of the core was much higher than the average flux density, peaking at just over 2.5 times.  Further, it had a large leading phase.

 

PSMA - SMA special project – Phase II
Phase II was a larger study comprising five parts:

1. Large core testing–flux propagation in ferrites


Several large cores were drilled with nine holes so that three sets of wires enclosed progressively smaller internal areas.  In this way, the flux and flux density can be measured in three shells and the center for comparison with the excitation voltage.

 

Two other large cores were drilled so that the voltage can be measured around any of 49 segments.  Each segment is the same size, 1/49 of the total, so one-to-one comparisons could be made.

2. Core power loss comparison with different sized cores of the same material.

 

Large cores of the same material were found to have significantly higher losses when compared on the basis of mw/cm3.  This suggests that core loss for different core sizes cannot be calculated based on material specifications, which are usually taken using a "standard" core of about 2.5 cm outside diameter.

3. Core shape effect on power loss

 

Core losses were significantly lower for a core that was laminated.  The second core above has the same area, volume and weight as the first core, but it comprises 5 thinner laminations.

 

Core losses were significantly lower for a core that was hollowed out.  The second core has the same ID, OD and height as the first core.  Its area, volume and weight are lower, so higher losses may be expected at very low frequencies.

 

The four cores above all are the same weight and volume.  Cores 1, 2 and 3 have the same ID but cores 2 and 3 are stacked and have the same area, volume and weight as core 1. Core 4 has five times the area because it is wound with only one turn, but it has the same volume and weight as the others. 

The inductances of the four cores are very close to the same value, as are their other electrical properties except the core loss.  The multi-core stacks have significantly lower core loss.

4. Ferrites electrical properties

The electrical parameters (permittivity, permeability, and conductivity) of various ferrites were measured.  These must be known accurately to model the core performance successfully.

As an example, Finite Element Analysis (FAE) did not model the observed flux distribution very well using traditional parameters from data sheets.  Once the analysis was modified to use accurate parameters, the analysis was greatly improved.

5. Rectangular wave core loss tester

Part of the Phase II core loss program was developing an improved full-bridge rectangular wave driver for core loss testing.  The wave shape is determined by an arbitrary waveform generator under software control.  The voltage is controlled by a programmable power supply.  The time, voltage and current are measured using a high accuracy digital sampling oscilloscope and the parameters are exported to a spreadsheet for post processing and storage.  All of the software operations are written in Python.

PSMA Magnetics Committee

In addition to sponsoring these five core loss studies, the PSMA Magnetics Committee continues to be very active. They have organized 5 "Power Magnetics @ High Frequency" workshops in addition to conducting very successful APEC Industry Sessions each year.  They also presented two educational webinars as part of the "PSMA Basics of Magnetics for Switching Power Webinar Series" in early 2020. The committee meets about once a month by webconference and anyone interested is invited to participate. Contact the PSMA office at power@psma.com for more information.

Provided by Ed Herbert, PSMA Magnetics Committee Co-Chair


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APEC 2021 Sponsors Continue Student Travel Support Program

Travel support of up to $1,000 offered to graduate and undergraduate students enrolled in power electronics programs to assist in attendance at APEC 2021

T he joint sponsors of the Applied Power Electronics Conference (APEC) have announced the continuation of the popular Student Attendance Travel Support Program of up to $1,000 to cover a portion of the travel and conference expenses for eligible students to attend APEC 2021. Interested students must apply by March 1, 2021.

In its 16th year, this popular program, initiated by the Power Sources Manufacturers Association (PSMA), is now jointly underwritten by PSMA and the other co-sponsors of the APEC conference: the IEEE Power Electronics Society (PELS) and the IEEE Industry Applications society (IAS).

The recipients will be chosen by the APEC 2021 Student Travel Support Committee. Application forms are available at APEC Attendance Travel Support Application. The application criteria are:

  • The applicant must be an undergraduate or graduate student enrolled in a power electronics program at an accredited institution
  • Only students who have not received travel support in the past will be considered
  • The recipients must be an author or co-author of a paper that was accepted for presentation at APEC 2021
  • The recipient must attend APEC 2021 and submit expense receipts to the Committee for reimbursement
  • Applications must be made and received by the Committee by March 1, 2021
  • The recipients will be notified by the Committee by March 18, 2021

As part of the application process, students must provide information about their educational institution, degree program, the name of their faculty advisor and a brief description of their career interest and reasons for planning to attend APEC. The application also requires the title and ID number of their accepted APEC paper, as well as the name(s) of the co-author(s).

More information about the APEC Student Attendance Travel Support Program may be found at the PSMA's Education Forum page.

 


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Power Magnetics @ High Frequency

Prior to APEC 2021
Phoenix Convention Center
Phoenix, AZ 850040

T he PSMA Magnetics Committee and IEEE PELS will conduct the sixth "Power Magnetics @ High Frequency" workshop on Saturday, March 20, 2021, which is the day before and at the same venue as APEC 2021 in Phoenix, AZ.

The purpose and focus of this workshop are to identify the latest improvements in magnetic materials, coil (winding) design, construction and fabrication, evaluation and characterization techniques and modelling and simulation tools. This is to target the advancements that are deemed necessary by the participants for power magnetics in order to meet the technical expectations and requirements of new market applications for higher operating frequencies and emerging topologies that are being driven by continuous advances in circuits topologies and semi-conductor devices.

The target audiences for the 2021 Power Magnetics @ High Frequency workshop include the designers of power magnetic components for use in electronic power converters responsible to implement the most technologically advanced power magnetic components that are necessary to achieve higher power densities, specific physical aspect ratios such as low profile, higher power efficiencies and improved thermal performance. The target audiences also include people involved in the supply chain for the power magnetics industry ranging from manufacturers of magnetic materials and magnetic structures, fabricators of magnetic components, providers of modelling and simulation software as well as manufacturers of test and characterization equipment.

The 2021 Power Magnetics @ High Frequency will open with a keynote presentation and several lecture presentations regarding EMI issues caused by and solved by magnetic components. In addition to the brief Q&A period after each individual presentation there will be a panel of the presenters at the end of the session who will address topics requiring more detail as deemed by the workshop attendees.

During breakfast, lunch, and the networking hour at the end of the workshop there will be an interactive session of tabletop technology demonstrations each addressing specific technical disciplines and capabilities consistent with the workshop agenda. Each technology demonstration station will include a ten-minute presentation at fifteen-minute intervals. Interaction between the attendees and the presenters is highly encouraged during this portion of agenda as a segue from the opening keynote presentation and the technical issues session.

If anyone would like to participate as a presenter for the technical demonstration session, please contact the organizing committee through PSMA via e-mail to power@psma.com with a description of your proposed technical capabilities topic. We are limited to ten technology demonstration sessions.

Based upon responses to the survey for the previous 2020 workshop, the afternoon session of the workshop will be a series of technical presentations addressing topics associated with integrated magnetics. In addition to the brief Q&A period after each individual presentation there will be panel of the presenters to address topics requiring more detail as deemed by the workshop attendees.

The specifics for the workshop structure and the presentations for the workshop are currently in progress and are not finalized. If anyone is interested in presenting on the topics of EMI issues associated with magnetic components or integrated magnetics, please contact the organizing committee through PSMA via e-mail to power@psma.com .

More details regarding the agenda for the workshop as well as registration for the workshop will become available on the PSMA website (www.psma.com/technical-forums/magnetics/workshop) over the coming months.

Organizing Committee
Steve Carlsen, Raytheon Systems Company
Ed Herbert, PSMA
Rodney Rogers, Allstar Magnetics
George Slama, Wurth Elektronik
Fred Weber, Future Technology Worldwide
Chuck Wild, Dexter Magnetic Technologies Inc.
Matt Wilkowski, EnaChip

 


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The Third International Symposium on 3D Power Electronics Integration and Manufacturing – 3D-PEIM


June 21-23, 2021,
Osaka University, Japan

 


P SMA, sponsor of the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2021) announces the postponement of the Symposium until June 21-23, 2021. We thank Osaka University for their commitment to being our 3D-PEIM 2021 Host.  We intentionally set a firm date of June 21 – 23 so that you could plan appropriately. Due to the uncertainty caused by COVID 19, the Symposium is planning for a mixed program of in-person and online presentations and attendance. Further details will be available in January.

The 2021 3D-PEIM Symposium will be led by General Chair Prof. Tsuyoshi Funaki of Osaka University, Japan and Technical Program Co-Chairs Prof. Katsuaki Suganuma, Osaka University, Japan; Dr. Minora Ueshima, Daicel, Japan; Prof. Guo-Quan Lu, Virginia Tech, USA.


Prof. Tsuyoshi Funaki, Osaka University
 
Prof. Katsuaki Suganuma, Osaka University
 
Prof. Guo-Quan (GQ) Lu, Virginia Tech USA
 
Minora Ueshima, Daicel, Japan

The 3rd biennial 3D-PEIM Symposium is planning on re-inviting as many of the original 2020 program world-class experts as possible, representing a far-reaching range of disciplinary perspectives to advance the development of future 3D power electronics systems. The Symposium encompasses additive, embedded, co-designed, and integrated packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power-dense components, and modules.

Professionals and Academics engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees an excellent opportunity to gain insight or broaden expertise in 3D power electronics packaging and integration. As in the past, we will arrange the Symposium schedule to provide ample time between sessions for attendees to share ideas, progress, and challenges with leading members of Universities, companies, and international associations and societies. On the last day of the Symposium, attendees will be invited for a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery.

General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. Hopefully, the COVID-19 threat will be over so that we can provide an amazing experience for the attendees because we will be re-assembling as many of the world's prominent experts in power electronics packaging and manufacturing that we had planned for this year. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this Symposium."

Other Organizing Committee Members

  • Brian Narveson, Narveson Consulting, USA – Steering Committee Chairman and Finance Chairman
  • Prof. Patrick McCluskey, University of Maryland, USA – Past General Chairman and Assistant to General Chairman
  • John Bultitude, Kemet, USA – Publications Chairman
  • Arnold Alderman, Anagenesis, Inc. USA – Publicity Chairman
  • Prof. Doug Hopkins, North Carolina State University, USA – Past General Chairman and Advisor
  • Joe Horzepa, U.S.A. – Executive Director of PSMA

If you wish to be a member of the Technical Program Committee, please contact http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

The technical sessions and chairs will be:

S1 Plenary I - Tsuyoshi Funaki, Osaka University, Japan
S2 Additive Manufacturing - Patrick McCluskey, University of Maryland, USA, and Douglas Hopkins, North Carolina State University, USA
S3 Systems Integration & Thermal Management - Christina DiMarino, Virginia Tech, USA
S4 Plenary II - Katsuaki Suganuma,Sanken Osaka University, Japan
S5 Multiphysics Design and Tools - Michihiro Shintani, Nara Institute of Science and Technology, (NAIST), Japan
S6 Materials - Jason Rouse, Sekisui America Corporation
S7 Manufacturing Technologies - John Bultitude, Kemet Corporation, USA
S8 Sponsors Session New for 2021! - Minora Ueshima, Daicel, Japan
S9 Quality and Reliability - Cyril Buttay, Laboratoire Ampère, France
S10 Heterogeneous Integration of Components - Tsuyoshi Funaki, Osaka University, Japan

The Symposium will also include:

  • Tabletop demonstration exhibitions
  • Networking & Laboratory Tours – Osaka University

Further announcements and the complete Symposium agenda will be posted on the 3D-PEIM Website later this year.

Some feedback from attendees at the 2016 & 2018 Symposiums:

  • "The 3D-PEIM brings together a unique set of participants – those involved in power packaging who actually know and care about manufacturing and reliability."
  • "Most valuable is the breadth of topics. I don't consider myself an expert in many topics presented so, touching on multiple topics is very helpful."
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

We look forward to seeing you in Osaka, Japan, in June 2021.

This autumn, we will start again looking for Media, Organizing, Financial, and Technical Partners contact info@3d-peim

For further information, you can contact: http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

Host:    


Minora Ueshima, Daicel, Japan

Sponsor:


 


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2020 International Power Supply-on-Chip (PwrSoC)
Corridor Webinar Series November 5, 10 & 12 2020

Sponsored by PSMA and IEEE PELS



T he Power Sources Manufacturers Association (PSMA) and IEEE Power Electronics Society (IEEE PELS) are sponsoring a webinar series during the first two weeks of November 2020. The webinar series is a corridor event made possible by the financial support of PSMA bridging the 2018 PwrSoC workshop and the 2021 PwrSoC Workshop rescheduled due to the COVID19 impact on the ability of attendees to travel to and attend a live event. The 2021 PwrSoC Workshop will be held October 24, through October 27, at the Singh Center for Nanotechnology on the campus of the University of Pennsylvania in Philadelphia PA

The (PwrSoC) webinar series will consist of three (3) two hour Webinar sessions. Each webinar session will address technology developments since the 2018 workshop and may well be ready for commercialization by the 2021 workshop. Each session will address a different set of applications and technology advances. The sessions will be on Thursday November 5, Tuesday November 10 and Thursday November 12. Each session will begin at 9:00 AM CST (GMT -6).  There will be three presentations per session. Each presentation will be approximately twenty-five minutes in length. There will be a panel question and answer session for the technical presentations at the end of each webinar event. Each webinar session will remain open until the presenters answer all the questions submitted. The agendas of the webinar events are as follows:


Attendees have always recognized the PwrSoC Workshop value as an event that brings together global academic and industry experts to formally and informally discuss issues to advance and productize power-supply-on-chip technologies. Mark Allen, Chair for the 2021 Workshop and the 2020 Corridor Webinar has indicated, "… the 2020 webinar series will fill a void in the timing of the live workshop series created by the COVID-19 situation by taking advantage of experiences with virtual workshops that have become more prevalent this past year to improve interaction for virtual global events and further develop the interactive experiences of a virtual format which may become more prevalent in the future … "

Registration for the corridor webinar is now open. Registration details are available at PwrSoC Corridor Webinar Series Registration. The webinar series will be free of charge but the number of attendees that can register will be limited; we advise you to register early.

Registered attendees for the workshop will have access to the presentations prior to the webinar series. This will allow registered attendees to submit questions in advance of the webinars. Recording of the panel Q&A will be made available to registered attendees after the webinar series is completed. This will allow registered attendees across global time zones to conveniently access the presentations and submit questions.

Throughout its history, the workshop has spotlighted advanced technologies to build granular and modular power supplies and compelling demonstrations of commercialized products that make a clear case for PwrSoC and PSiP technologies becoming more prominent and mainstream.

International Power Supply-on-Chip (PwrSoC) Workshop 2021

The technical program chairs for the 2021 workshop are Hanh-Phuc le of University of California at San Diego and Matt Wilkowski of EnaChip. Hanh-Phuc and Matt have both been presenters, session chairs and program chairs for past Power Supply on Chip workshops. A team of world-renowned experts, innovators and pioneers of the Power Supply on Chip technology has been assembled to chair the workshop's nine sessions.

  • Plenary Session - Jose Cobos, University Polytechnic Madrid
  • Systems and Applications - Francesco Carobolante, IoTissimo
  • Topologies and Control - Bruno Allard, Université de Lyon
  • Wideband Gap Integration - Brian Ma, University Texas Dallas
  • Integrated Capacitors & Energy Storage - Medhi Jatlaoui, Murata
  • Integrated Magnetics - Masahiro Yamaguchi, Tohoku University Japan
  • Sys Integ Manufacturing and Packaging - Baoxing Chen, Analog Devices
  • Granular Power - Santosh Kulkarni, Dialog Semiconductor
  • Posters - Minjie Chen, Princeton University

The planning of the technical program, supporting activities as well as identifying workshop partners to contribute to its success are in process. If interested to be a workshop partner, please contact the workshop financial chair, Trifon Liakopoulos, at the following e-mail address: trifon@enachip.com

Continuing the tradition of the enthusiasm, market relevance and success of past workshops, we are looking forward to a virtual corridor event in November 2020 bridging discussions and developments since the most recent PwrSoC workshop in Taiwan during October 2018, while progressing along the path to the 2021 PwrSoC Workshop in Philadelphia, PA.

General Chair:
Mark Allen  mallen@seas.upenn.edu

Technical Program Co-Chairs
Matt Wilkowski mwilkowski@enachip.com
Hanh-Phuc Le hanhphuc@ucsd.edu

For more information about previous and coming PwrSoC events, visit http://pwrsocevents.com.



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The Third International Symposium on 3D Power Electronics Integration and Manufacturing – 3D-PEIM


June 21-23, 2021,
Osaka University, Japan

 


P SMA, sponsor of the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2021) announces the postponement of the Symposium until June 21-23, 2021. We thank Osaka University for their commitment to being our 3D-PEIM 2021 Host.  We intentionally set a firm date of June 21 – 23 so that you could plan appropriately. Due to the uncertainty caused by COVID 19, the Symposium is planning for a mixed program of in-person and online presentations and attendance. Further details will be available in January.

The 2021 3D-PEIM Symposium will be led by General Chair Prof. Tsuyoshi Funaki of Osaka University, Japan and Technical Program Co-Chairs Prof. Katsuaki Suganuma, Osaka University, Japan; Dr. Minora Ueshima, Daicel, Japan; Prof. Guo-Quan Lu, Virginia Tech, USA.


Prof. Tsuyoshi Funaki, Osaka University
 
Prof. Katsuaki Suganuma, Osaka University
 
Prof. Guo-Quan (GQ) Lu, Virginia Tech USA
 
Minora Ueshima, Daicel, Japan

The 3rd biennial 3D-PEIM Symposium is planning on re-inviting as many of the original 2020 program world-class experts as possible, representing a far-reaching range of disciplinary perspectives to advance the development of future 3D power electronics systems. The Symposium encompasses additive, embedded, co-designed, and integrated packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power-dense components, and modules.

Professionals and Academics engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees an excellent opportunity to gain insight or broaden expertise in 3D power electronics packaging and integration. As in the past, we will arrange the Symposium schedule to provide ample time between sessions for attendees to share ideas, progress, and challenges with leading members of Universities, companies, and international associations and societies. On the last day of the Symposium, attendees will be invited for a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery.

General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. Hopefully, the COVID-19 threat will be over so that we can provide an amazing experience for the attendees because we will be re-assembling as many of the world's prominent experts in power electronics packaging and manufacturing that we had planned for this year. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this Symposium."

Other Organizing Committee Members

  • Brian Narveson, Narveson Consulting, USA – Steering Committee Chairman and Finance Chairman
  • Prof. Patrick McCluskey, University of Maryland, USA – Past General Chairman and Assistant to General Chairman
  • John Bultitude, Kemet, USA – Publications Chairman
  • Arnold Alderman, Anagenesis, Inc. USA – Publicity Chairman
  • Prof. Doug Hopkins, North Carolina State University, USA – Past General Chairman and Advisor
  • Joe Horzepa, U.S.A. – Executive Director of PSMA

If you wish to be a member of the Technical Program Committee, please contact http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

The technical sessions and chairs will be:

S1 Plenary I - Tsuyoshi Funaki, Osaka University, Japan
S2 Additive Manufacturing - Patrick McCluskey, University of Maryland, USA, and Douglas Hopkins, North Carolina State University, USA
S3 Systems Integration & Thermal Management - Christina DiMarino, Virginia Tech, USA
S4 Plenary II - Katsuaki Suganuma,Sanken Osaka University, Japan
S5 Multiphysics Design and Tools - Michihiro Shintani, Nara Institute of Science and Technology, (NAIST), Japan
S6 Materials - Jason Rouse, Sekisui America Corporation
S7 Manufacturing Technologies - John Bultitude, Kemet Corporation, USA
S8 Sponsors Session New for 2021! - Minora Ueshima, Daicel, Japan
S9 Quality and Reliability - Cyril Buttay, Laboratoire Ampère, France
S10 Heterogeneous Integration of Components - Tsuyoshi Funaki, Osaka University, Japan

The Symposium will also include:

  • Tabletop demonstration exhibitions
  • Networking & Laboratory Tours – Osaka University

Further announcements and the complete Symposium agenda will be posted on the 3D-PEIM Website later this year.

Some feedback from attendees at the 2016 & 2018 Symposiums:

  • "The 3D-PEIM brings together a unique set of participants – those involved in power packaging who actually know and care about manufacturing and reliability."
  • "Most valuable is the breadth of topics. I don't consider myself an expert in many topics presented so, touching on multiple topics is very helpful."
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

We look forward to seeing you in Osaka, Japan, in June 2021.

This autumn, we will start again looking for Media, Organizing, Financial, and Technical Partners contact info@3d-peim

For further information, you can contact: http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

Host:    


Sponsor:


 


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International Workshop on Integrated Power Packaging (IWIPP 2021)
Inviting Paper Submissions

I WIPP 2021, a PSMA co-sponsored workshop, will be held April 28th-30th, 2021, on the beautiful campus of Aalborg University, in Aalborg, Denmark. IWIPP is a growing and successful power technology workshop with excellent speakers and networking opportunities.

Under the leadership of General Chairman Dr. Francesco Iannuzzo, Professor, Aalborg University, the International Workshop on Integrated Power Packaging (IWIPP) brings together industry, academic and government researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to facilitate and promote the development and commercialization of high-density and high-efficiency power converters. Invited presentations and contributed papers will range from core materials technology and components to power converters. Presenters will address important challenges and present solutions to increase reliability and manufacturability while targeting improved performance and reduced system cost.

This IWIPP 2021 program includes an exciting set of power technology and packaging Keynote addresses which include:

    1. "Packaging, Integration and Fast switching: what has been achieved and what´s next?" - Eckart Hoene, Fraunhofer
      1. Only close interaction between packaging end circuit engineers will bring power electronics to the next step. This presentation will give an overview on achievements in packaging and its implementation into commercial products as well as new concepts intended to reduce the technological market barrier.
    2. "Environmental Trends and Challenges on Power Packaging" - Garron Morris and Chris Genthe, Rockwell Automation
      1. This keynote covers the challenges of increasing power densities, coupled with new environmental stresses stemming from changing customer locations, behaviours, and applications.
    3. Electrical Topology of a Pure EV: The Porsche Taycan - Thomas Krauss, Porsche
      1. This presentation gives a vivid overview on grid topology, components, construction and packaging in an EV and the issues of its implementation.
    4. Paving the Way to Automotive GaN: The Importance of Packaging - Tamara Baksht, ViSiC
      1. This presentation will discuss the arrival of the D3GaN era with the novel Depletion-mode Direct Drive GaN technology emerging as an eminently suitable technology meeting the demand of highly reliable and extremely robust product needed in critical drive applications of the electric vehicle market.

Packaging and related technologies are the key to creating high-density power sources. Attendance and participation at this important workshop can keep you and your colleagues on the cutting edge. If you have technology advancements or research accomplishments to present to the community, Technical Chairman Nick Baker, Aalborg University invites you to submit a digest for review by the technical committee.

The call for papers is available at http://iwipp.org/conference/call-for-papers/. The submission portal of the website http://iwipp.org/conference/abstract-submission-page/ opened Sept. 14, 2020. Additional information regarding the workshop can be found at the conference website: https://iwipp.org/ .

TRAVEL RESTRICTIONS DUE TO COVID-19

IEEE, PSMA and the IWIPP 2021 organizing committee are carefully monitoring the developing COVID-19 outbreak. The IWIPP 2021 leadership is committed to supporting conference participants who may be unable to travel to Aalborg, Denmark from affected regions. If an attendee has an accepted paper but does not wish to travel because of COVID concerns, or has concerns with obtaining a VISA, the committee will provide opportunities for remote participation, presentation of her/his paper, and networking.

IWIPP is co-sponsored by the PSMA Packaging Committee, which is co-chaired by Brian Narveson, Ernie Parker and John Bultitude. They look forward to seeing all of you at Aalborg University April 28th-30th, 2021.


Sponsored by:
Power Sources Manufacturers Association (PSMA)
IEEE Power Electronics Society (PELS)
IEEE Electronic Packaging Society (EPS)
IEEE Dielectrics and Electrical Insulation Society (DEIS)
European Center for Power Electronics (ECPE)

 


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120 Years of Technology Evolution Towards the Mythic 99% Efficiency!

F rom the very early days when power electronics equipment utilized vacuum tubes, power engineers have been concerned with energy efficiency, power optimization and how to make power supplies more reliable, smaller and smarter. Probably few of us remember the introduction of the Thyratron or the 1925 patent by Julius Edgar Lilienfeld for the Field Effect Transistor, but the electronics industry is full of amazing inventions and innovations all contributing to achieving the mythical 99% efficiency level.


With the growing concerns for the environment and for reducing energy consumption, the need to meet governmental regulations, and of course individual initiatives, the demand on power designers to develop very efficient power solutions has been great. But simultaneously, and creating even more difficulties, emerging applications have required smaller power supplies with unprecedented power density expectations.

The laws of physics are the laws of physics, and despite many evolutions in switching topologies, power designers have run into road blocks requiring a solution that is able to switch faster, with less power losses and if possible maintaining good performances at higher temperatures.

Despite technological advancements in conventional semiconductors, it became difficult to increase the switching frequency by a magnitude of 10 while reducing the physical size of the power supplies while also reducing power losses. Among the different routes taken to achieving this, the exploration of materials offering higher performance such as higher-energy electronic band gaps has revealed the potential of Gallium Nitride and Silicon Carbide. Both materials have been used before e.g. SiC diodes and GaN LEDs, but the use of Wide Bandgap FET appeared relatively recently in the power electronics history.

As for all new technologies, GaN FET and SiC FET went through the classic process starting with the Innovators, to the early adopters and now reaching the early majority. What is very interesting is that probably due to a large number of innovators, GaN and SiC manufacturing was very quick off the mark in addressing niches markets with a very high growth potential.


Wide Bandgap (WBG) technologies have been presented at many conferences but I consider the real kick-off to have taken place in 2018 when "challengers" demonstrated the commercial potential of WBG technology. It is impossible to name all of them but among the leaders promoting GaN, I would say that the Efficient Power Conversion (EPC) Idea to implement GaN in LIDAR (Light Detection and Ranging) was really interesting, especially with that technology becoming preponderant in the new generation of vehicles. 2018 was also the year in which USB adapter manufacturers started to consider implementing WBG. Navitas is another example of an innovative company, which in the early days pushed GaN integration to a higher level by packaging drivers and switches on same substrate. If intelligent GaNFET is becoming standard today, it was not the case when Navitas introduced that concept.

If WBG is a very promising technology, we should keep in mind another symbolic milestone for a technology called 'Digital Power' that emerged in 2003 as a promising technology. As it was for digital power 17 years ago, GaN, having started its journey only a few years ago has followed a similar path, gradually migrating from a 'technical curiosity' to a 'commercial product'. Digital power and GaN are both technologies that were challenged and highly debated when introduced to the market, and it is interesting to link both of them in this way, especially when the outcome of combining the best of the two technologies results in truly outstanding commercial products.

Step by step to maturity

As it is for any new technology - especially when disruptive – the transition from research level to high volume production is a long process, one that includes new learning for electronics engineers and in the case of GaN, the implementation of zero-voltage switching topologies requiring very specific drivers and new ways of controlling them. Despite the huge benefits of GaN transistors, for many years the lack of drivers limited the interest level from industrial designers. Thankfully, the increased number of semiconductors players investing in GaN in the last two years has made this technology simpler to implement.

Many technical barriers have been removed. Manufacturing processes have gradually been optimized to increase yield and reduce cost, quality processes specific to this technology have been implemented, and in November 2017 the JEDEC organization announced the formation of a new committee to set standards for Wide Bandgap Power Semiconductors (JC-70). Then, February 2019 saw the release of the publication JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices. Step by step, the puzzle is being solved and if GaN has been widely used in LED and RF applications for many years, power supply manufacturers for commercial products deployment are now adopting it.

Digital power combined with GaN heads towards 99% efficiency

What makes power designers' lives so exciting is the ever-present levels of innovation making it possible to improve performance levels, thus contributing to reducing our environmental impact and the creation of a sustainable society. Combining the benefits of digital power with GaN performance and the ability to switch at high frequencies with low power losses makes it possible for designers to develop very high power density units. That combination results in smaller products with lower power dissipation that are ready for stringent, future regulations foreseen in the coming years (e.g. micro-amps for standby power). One practical example is USB chargers where by combining digital and GaN, several companies are in some cases almost tripling the power density for a standard USB charger. That is without talking about multi kilowatts power factor correction equipment fitting into an existing 500W footprint. We are all aiming to break limits and there is no doubt we are moving fast towards the 99% efficiency, but as power designers we have to consider a new dimension that includes a larger eco-system.

Smart power becoming a reality

WBG and digital power have brought strategic, exiting technologies to the power designers' toolbox, and every day we are achieving new limits, but in today's world and as an effect of the industry's transformation, power supplies have to be both energy efficient and perform equally well within the eco-system in which they are integrated. From a USB-PD +PPS for charging and communicating with a battery, to a huge factory automation system where all power supplies are dynamically controlled and optimized to reduce factory energy consumption, power supplies designers will have to include a new dimension when designing the next generation of power solutions.


If previously, the well-known PMBus communication between a power supply and a power/site manager was well understood, then including Machine-to-Machine (M2M) communication with direct control of the power supply is relatively new and only at the beginning of its journey.

Industry 4.0 will introduce a higher level of software integration and if many power supplies remain as standalone units, we foresee a significant number of applications requiring power supplies to interoperate within their eco-system in a very advanced way. Smart Power for a Smart Industry is becoming a reality, and a very exciting one at that.

In conclusion, Smart Factories will use Smart Power solutions designed by Smart Power Designers all aiming for 99% efficiency, but with another eye on the ambitious target of 99.99%!

Provided by Patrick Le Fèvre
Chief Marketing and Communications Officer, Powerbox

 

 

Editor's Note: Article reproduced with courtesy of Power Electronics News and Powerbox (PRBX)


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New EU Appliance Regulations Add Complexity, Reform Product Labeling

G lobally there are a plethora of energy efficiency regulations for almost anything that consumes energy. These regulations cover both operating mode efficiency as well as standby power consumption. Some of these energy efficiency regulations are mandatory and some such as Energy Star in the U.S. are voluntary and more marketing than regulatory in nature. And while there are challenges in meeting regulatory requirements in many regions, the European regulations are possibly the strictest in the world.

In Europe there are newer, updated regulations for energy efficiency targeting consumer white goods which we could see adopted as best practices globally. The new regulations also include changes in the labeling for appliances. In many cases, the product ratings used on labels have been simplified. The main purpose of these labeling changes is to allow consumers to make better purchasing decisions. Ultimately, the goal of these changes in energy efficiency and labeling requirements is to achieve energy efficiency objectives for the region.

Specifically, there is a mandate from the European Commission (EC) for the EU to achieve an improvement of 32.5% over 2018 energy consumption by the year 2030. The regulations are to reduce energy used in refrigerator products, dishwashers, washing machines and dryers, TVs and monitors, and lighting products.

These new European standards impose energy efficiency regulations on a product's standby, idle, and off modes of operation. Also there are new levels of energy consumption in the use mode. This is a complex calculation given in the details of each regulation.  

Many of the appliances have motors, which have raised concerns not only about their energy consumption but also regarding the noise they produce. As a result, the new EU regulations also contain emissions levels for audible noise. These noise limits may require the use of brushless dc motors (also known as electronically commutated motors or ECMs) to reduce the noise and increase energy efficiency in the operating mode.


This article presents highlights of Power Integrations' upcoming
webinar "EU Ecodesign and Energy Labeling Directives".

These changes in EU appliance regulations are the subject of an upcoming webinar by Power Integrations (PI) on "EU Ecodesign and Energy Labeling Directives," which will be presented by PI's David Chen on Tuesday, May 19, 2020 at 9:00 AM U.S. Pacific time (1600 UTC). This article highlights some of the key regulatory changes to be discussed in this webinar. To learn more, you can register for the webinar at PI's events page.

We would like to thank Power Integrations for sharing information from their webinar with How2Power Today in advance of the broadcast and for David Chen's input for this article. In addition, we'd also like to thank PI for the resources they have provided in the form of a free database and for their support of the PSMA Energy Efficiency database. 

Label Reform

Under the emerging regulatory changes, the label on each of the appliance products changes and there are new requirements for each product. For example, the labeling required in the old (EC) no 642/2009 and (EU) 1062/2010, which apply to TVs and monitors, changes in the new regulation. While the existing product ratings assign A, A+, A++, and A+++, the new rating system goes from A through G (more on this in the section on Displays).

Refrigeration Appliances

In this product category, the current regulation is (EU) 1060/2010, which offers product ratings from A+++ (most efficient) to G (least efficient). These ratings take into account energy consumption, storage volume, and a freezer compartment. In contrast, the newer standard (EU) 2019/2016 has a label with ratings ranging from A (most efficient) to G (least efficient). There is also a new sound emissions requirement which governs noise produced by the compressor for cooling.

The most effective means of energy savings is to keep ice from forming around the cooling coils. The removal of this ice is called a defrost cycle. This is described in the new standard.

Dishwashers

The older regulation (EU) 1059/2010 has been replaced by (EU) 2019/2017. This new regulation takes into account standby energy, idle energy, and operating energy. The label for the product has changed with added icons to help the consumer to make an informed decision about energy use and acoustic noise emissions.

This regulation has a similar rating scale as the refrigerators, ranging from A to G. In addition, there's a figure of merit for the product's efficiency. The Energy Efficiency Index (EEI) is a ratio of two numbers, the ECO Program Energy Consumption (EPEC, measured in kWh/cycle) divided by the Standard Program Energy Consumption (SPEC, also measured in kWh/cycle):

The new regulation goes into greater detail on the measurement and the ratings.

Acoustic noise emission is one of the important consumer ratings. This requires the use of sound insulation and the use of an ECM.

Washing Machines

The current regulation (EU) 1061/2010 has been replaced with (EU) 2019/2014. Like the above appliances, the rating system goes from A (most efficient) to G (least efficient). The new rating is defined by the following equation:

where EW is the weighted energy consumption (kWh/cycle) and SCEW is the standard cycle energy consumption (kWh/cycle), and these terms are defined as:

where c is the rated capacity.

The new standard defines water consumption along with how well the water is removed from the clothes in the last spin cycle. This is important, as it affects the energy used for drying clothes. 

Displays

The European Union will lump TV sets and monitors together in the new regulation. 

The current regulation (EU) 1062/2010 for televisions sets forth the following conditions:

  • Labels scale from A+++ (most efficient) to D (least efficient).
  • Screen size is shown, but not resolution or high dynamic range (HDR).
  • Annual energy use shown on the label assumes the television is turned on for four hours/day, every day of the year.
  • It does not apply to computer monitors or to signage displays.

The new regulation (EU) 2019/2013 for electronic displays (TVs and monitors) imposes the following changes:

  • This regulation becomes effective on March 1, 2021, repealing the current regulation.
  • Labels are re-scaled from A (most efficient) to G (least efficient), with a lowering of the maximum power consumption limits (i.e. the new limits are more stringent).
  • New and old classes are not comparable, as the new scaling system is improved and better takes into account the screen area.
  • New labels will also show the efficiency of the product in HDR as well as information on the diagonal size of the display and the resolution.

Under the new regulation for electronic displays, there is a new energy efficiency calculation:

where A represents the viewing surface area in dm2, Pmeasured is the measured power in the on-mode in watts in the normal configuration and corr1 is a correction factor set as indicated in Table 3 (in the regulation).

The new label has the following format:


Figure. New label format for (EU) 2019/2013 for electronic displays.

Lighting Products

Lighting is a major user of energy. In many cases, LEDs have replaced incandescent, fluorescent and halogen lamps. The LED luminaire is a complete electric light fixture that distributes, filters and transforms light from one or more light sources to an open room or wall.
Many of these newer fixtures do not have replacement parts like the lamp or standard Edison A lamp. The fixture is complete with no replacement parts internal.

The current regulation (EU) 874/2012 for lighting products imposes the following conditions:

  • Ratings range from A++ (most efficient) to E (least efficient).
  • Luminaires have labels showing what lamps are suitable for use.

Under the new regulation (EU) 2019/2015 for light sources, the following changes take effect:

  • As of 25 December 2019, labeling of luminaires is no longer required.
  • This regulation goes into effect 1 September 2021, repealing the current regulation.
  • Labels are re-scaled from A (most efficient) to G (least efficient).
  • Labels will show energy consumption in kilowatt-hours (kWh) per 1000 hrs and include a QR-code link to more information in an online database.

Summary

The following is a list of the EU regulations for appliances.

  • (EU) 2019/2013    Electronic displays including TV and monitors
  • (EU) 2019/2014    Washing Machines
  • (EU) 2019/2015    Lighting
  • (EU) 2019/2016    Refrigerators
  • (EU) 2019/2017    Dishwashers

There are many details in each of the regulations and a Google search on each one will lead you to more-detailed information. It is beyond the scope of this article to provide the complete information on these requirements. However the two best practical resources on this subject are PI's Energy Efficiency Resources page (https://ac-dc.power.com/green-room/energy-efficiency-resources/) and the PSMA's Energy Efficiency database (https://www.psma.com/technical-forums/energy-management/database).

Many of the appliance types discussed above have standby power supplies. The new appliance regulations impose limits on the energy consumption in the standby, idle, and off modes. Therefore, it is in the best interest of engineers developing products in these markets to become aware of these regulations before the design phase to make sure the product development will meet or exceed the target requirements so that the product can be viable for sale in Europe and elsewhere. This along with EMC, safety and materials declarations requirements constitute most of what products will have to meet to be marketable.

Authors:
Kevin Parmenter
Director of Applications Engineering
Taiwan Semiconductor America

  Jim Spangler
President
Spangler Prototype Inc. (SPI)

Editor's Note: This article was first published in the May 2020 issue of  How2Power Today
( http://www.how2power.com/newsletters/index.php ).



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iNEMI Publishes Best Practices for Protecting the Reliability and Integrity of Electronic Equipment when Disinfecting for COVID-19

T he International Electronics Manufacturing Initiative (iNEMI) has announced publication of "Recommended Best Practices for Protecting the Reliability and Integrity of Electronic Products and Assemblies when Disinfecting for SARSCoV- 2 (COVID-19)."

Developed by a team of experts from across the member organizations of the International Electronics Manufacturing Initiative (iNEMI), this document provides guidance on how to mitigate the possible detrimental impact of disinfecting procedures on electronic equipment and assemblies. Groups such as the U.S. EPA, CDC and the World Health Organization (WHO) have published general guidelines regarding cleaning and disinfecting for COVID-19, but none of these specifically address the impact of disinfectants and their application methods on electronic equipment and assemblies. Many commonly recommended disinfection substances and/or application methods could potentially cause failures in electronic equipment.

To develop these best practices, the iNEMI team reviewed key industry, government and technical sources. They also assessed the chemicals included in the U.S. EPA List N: Disinfectants for Use Against SARS-CoV-2 (COVID-19) and common application methods, identifying those substances that minimize the risk of negative impact on electronic equipment when applied in an appropriate manner.

"With the COVID-19 crisis, several of our members have contacted iNEMI for guidance on how to mitigate the possible detrimental impact of disinfecting procedures on electronic equipment and assemblies," said Marc Benowitz, iNEMI CEO. "There are guidelines from groups such as the U.S. EPA, CDC and the World Health Organization (WHO) regarding cleaning and disinfecting for COVID-19, but none of these address the impact of disinfectants and their application methods on electronic equipment and assemblies."

"Many commonly recommended disinfection substances and/or application methods could potentially cause failures in electronic equipment if the internal electronics were inadvertently exposed to them," continued Benowitz. "This is an obvious concern for electronics manufacturers who are wanting to ensure the safety of their employees, supply chain partners and customers, while protecting the reliability and integrity of their products."

Benowitz explains that, in response to this industry need, a team of experts from across iNEMI member organizations reviewed key industry, government and technical sources and assembled a best practices document. The team assessed the chemicals included in the U.S. EPA List N: Disinfectants for Use Against SARS-CoV-2 (COVID-19) and common application methods, identifying those substances that minimize the risk of negative impact on electronic equipment when applied in an appropriate manner.

iNEMI's has provided this publication to PSMA, and it is available for download here.

Provided by:
Cynthia Williams, iNEMI


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Events of Interest - Mark Your Calendar
Sep 23, 2020 - Sep 25, 2020
Virtual
Sep 25, 2020 - Sep 27, 2020
Greater Noida
India
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Virtual
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Glasgow
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Ramada Plaza Hotel
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Radisson Blu Greater Noida
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Gliwice
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Savannah, GA
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Frankfurt
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Frankfurt
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Aalborg
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Hartford, CT
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Stuttgart
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Londrina, Paraná
Brazil
May 24, 2021 - May 27, 2021
Singapore
Singapore
Jun 1, 2021 - Jun 4, 2021
San Diego, CA
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Rochester, NY
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Rochester, NY
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Sawgrass Marriott Golf Resort & Spa
Jacksonville, FL
Jun 9, 2021 - Jun 13, 2021
Phoenix, AZ
Jun 15, 2021 - Jun 16, 2021
Aachen
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Jun 21, 2021 - Jun 23, 2021
Osaka University
Osaka
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Le Bourget Du Lac
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Chicago, IL
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Chicago, IL
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Oslo
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Malaysia
Sep 6, 2021 - Sep 8, 2021
Vaasa
Finland
Sep 6, 2021 - Sep 10, 2021
Ghent
Belgium
Sep 14, 2021 - Sep 16, 2021
Novi, MI
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Sofitel Jinan Silver Plaza
Jinan
China
Sep 24, 2021 - Sep 26, 2021
India
Oct 10, 2021 - Oct 14, 2021
Vancouver, BC
Canada
Oct 24, 2021 - Oct 27, 2021
Philadelphia, PA
Oct 24, 2021 - Oct 27, 2021
University of Pennsylvania
Philadelphia, PA
Nov 16, 2021 - Nov 18, 2021
Munich
Germany
Dec 14, 2021 - Dec 16, 2021
Luxor
Egypt
Mar 7, 2022 - Mar 11, 2022
Jacksonville, FL
Mar 20, 2022 - Mar 24, 2022
Houston, TX
May 17, 2022 - May 20, 2022
Cleveland, OH
Sep 5, 2022 - Sep 9, 2022
Hannover
Germany
Sep 18, 2022 - Sep 22, 2022
Tampa
FL USA
Mar 13, 2023 - Mar 17, 2023
Reno
Nevada
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Orange County Convention Center
Orlando, FL

If you know of any upcoming conferences or events of interest to
PSMA members please notify the Association office.

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Fax: 973-543-6207

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