Semiconductor-Compatible Integrated Magnetics for MHz Power Delivery

Enabling the Next Generation of Integrated Power Delivery

s semiconductor systems continue pushing toward higher current densities, faster switching frequencies, and increasingly compact form factors, power delivery is becoming one of the defining challenges of modern electronics. Artificial intelligence accelerators, hyperscale data centers, advanced aerospace systems, and wide-bandgap (WBG) power electronics are all driving a transition toward vertically integrated power architectures operating in the multi-MHz regime.

Eneira's founding team was recognized in May 2026 for its leadership in NJ's Innovate100 event!

While semiconductor switches have advanced rapidly, magnetics have emerged as the limiting factor. Conventional discrete inductors occupy a significant portion of voltage regulator volume, struggle to scale with increasing power density requirements, and remain difficult to integrate into advanced packaging architectures such as chiplets and 3D heterogeneous integration.

Eneira LLC was founded to address this challenge

Based in Hillsborough, New Jersey, Eneira is developing semiconductor-compatible integrated magnetic technologies for next-generation power delivery applications. The company focuses on wafer-level inductors and transformers designed for MHz-frequency operation, high current density, and compatibility with advanced semiconductor packaging platforms.

At the core of Eneira's technology is a proprietary materials platform called CMA™ (Compositionally Modulated Magnetic Alloy), a wafer-level electroplated magnetic system engineered specifically for high-frequency integrated power applications. Unlike conventional laminated magnetic stacks that rely on multiple vacuum deposition and insulation steps, the CMA™ approach uses compositionally engineered magnetic alloys to create "virtual laminations" within a continuous electroplated structure. This architecture enables suppression of eddy-current losses while remaining compatible with scalable semiconductor fabrication processes.

In parallel, Eneira has developed ultra-thick electroplated copper winding technology capable of producing copper features significantly thicker than conventional thin-film approaches. The combination of thick copper conductors and engineered magnetic materials enables integrated magnetic components with high current handling capability, low resistance, and stable operation across the MHz switching range required by modern GaN power systems.

The company's development efforts are centered around several major industry transitions currently reshaping power electronics:

• AI accelerators and hyperscale computing platforms demanding dramatically higher current delivery and power density
  
• Growing adoption of GaN power devices operating at multi-MHz frequencies
  
• Advanced packaging architectures requiring lower-profile passive components
  
• Increasing demand for domestic U.S. manufacturing capability in critical power electronics technologies

Controlled μ & ρ modulation along z-axis Alternating high-μ and high-ρ layers suppress eddy currents up to 30 MHz

On–chip Inductor: CMA coated 150 μm thick Cu windings

Eneira believes integrated magnetics will be foundational to the next generation of vertical power delivery architectures powering AI and high-performance computing. The company has demonstrated wafer-level inductor platforms across multiple device footprints, with examples ranging from 1.2 mm² to 4.5 mm², and operation in the MHz frequency range. Platform geometry is adaptable to customer-specific requirements, with demonstrated operation in MHz frequency ranges. Current development efforts focus on improving current density, inductance-to-resistance ratio (L/R), thermal performance, and process scalability for future commercialization.

Eneira delivers customer-specific integrated magnetics solutions across the power electronics ecosystem serving semiconductor companies, aerospace and defense organizations, research institutions, and fabrication facilities through a fab-neutral model built on process licensing, design capabilities, and technology transfer. As the power electronics industry moves toward increasingly integrated architectures.

Eneira believes the future of power delivery will depend on magnetic technologies capable of scaling alongside semiconductors themselves. The transition from discrete to embedded and eventually monolithic power integration is already underway for active devices. Eneira's mission is to help make the same transition possible for magnetics.

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