The Future of 3D Power Packaging Starts Here
oin leading researchers, innovators, and industry pioneers from around the world at 3D-PEIM 2026, the premier international symposium dedicated to 3D power packaging and heterogeneous integration. This year's event brings together breakthrough technologies, real-world applications, and unparalleled networking opportunities—all set against the vibrant backdrop and sunshine of the Southwest.

Whether you are advancing fundamental research or driving next-generation products to market, 3D-PEIM 2026 is where ideas spark collaboration and innovation accelerates.

Our Biggest and Most Dynamic Program Yet
3D-PEIM 2026 features our most ambitious technical program to date, including:

• 6 distinguished plenary speakers delivering visionary insights
  
• 7 in-depth technical sessions covering cutting-edge developments
  
• Expert-led tutorials designed to deepen your technical expertise
  
• Interactive poster sessions and industry showcases
  
• Exclusive guided lab tours of ASU's renowned MacroTechnology Works facility

The 3D-PEIM Organizing Committee is pleased to announce the addition of four 2-hr short tutorials which will be held on November 16 (Monday) 1:00 PM - 5:15 PM. You will be able to register for the tutorials you wish to attend at the time of conference registration, which will open in June. Tutorials programs are as follows:

• Advanced Packaging
  George Dogiamis (Deca Technologies), Chanyeop Park (ASU), Hongbin Yu (ASU), and Chris Bailey (ASU)
• Die-Attach by Metal Powder Sintering: The Science and Practice
  G.-Q. Lu (Virginia Tech)
• Digital Twin-Driven Reliability and Prognostics in Power Electronics Systems
  Jong Eun Ryu (North Carolina State University)
• Trends in Magnetic Material Properties to Meet the Challenges of Supporting High-Performance Computing
  Matt Wilkowski (Würth Electronics)

Following the tutorials, there will be panel session on "Key Challenges for 3D Power Electronics Packaging/Manufacturing" on November 16 (Monday) 5:30 PM – 7:00 PM from the following academic and industry experts:

Ravi Mahajan, Intel/HIR Chair

• Doug Hopkins, North Carolina State University/HIR Power Chapter
• Chris Bailey, Arizona State University/HIR Modeling and Simulation Chapter
• Pat McCluskey, University of Maryland/HIR Thermal Chapter
• George Dogiamis, Deca Technologies
• Francesco Carobolante, IoTissimo

Plenary Speakers
Meet our distinguished plenary speakers – visionary leaders who will share groundbreaking insights of power packaging:

• Madhavan Swaminathan, Pennsylvania State University
• Rinkle Jain, NVIDIA
• Cian O Mathuna, Tyndall National Institute
• Yi Zheng, Applied Materials
• Kaladhar Radhakrishnan, Intel
• Stephen Coates, Yuxuan Semi

Technical Focus Areas
The core of the Symposium will be 7 Technical Session with both invited and peer reviewed presentations.

• Advanced Packaging & 3D Integrated Modules
• Thermal Management
• Design, Modeling & Simulation
• Reliability & Failure Analysis
• Power Delivery & Energy Storage
• Passive Components
• Materials for Advanced Packaging

Be Part of What's Next
3D-PEIM 2026 is more than a symposium. It's a global community of researchers, engineers, and industry leaders working together to define the next era of 3D power packaging.

• Registration Opens: June 8, 2026

We warmly invite you to contribute your work, share your expertise, and connect with peers shaping the future of the field.
For full details—including information for sponsors and exhibitors—please visit: https://www.3d-peim.org/
 
We look forward to welcoming you to ASU in 2026!

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.