June 21-23, 2021,
Osaka University, Japan

SMA, sponsor of the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2021) announces the postponement of the Symposium until June 21-23, 2021. We thank Osaka University for their commitment to being our 3D-PEIM 2021 Host.  We intentionally set a firm date of June 21 – 23 so that you could plan appropriately. Due to the uncertainty caused by COVID 19, the Symposium is planning for a mixed program of in-person and online presentations and attendance. Further details will be available in January.

The 2021 3D-PEIM Symposium will be led by General Chair Prof. Tsuyoshi Funaki of Osaka University, Japan and Technical Program Co-Chairs Prof. Katsuaki Suganuma, Osaka University, Japan; Dr. Minora Ueshima, Daicel, Japan; Prof. Guo-Quan Lu, Virginia Tech, USA.

Prof. Tsuyoshi Funaki, Osaka University

Prof. Katsuaki Suganuma, Osaka University

Prof. Guo-Quan (GQ) Lu, Virginia Tech USA

Minora Ueshima, Daicel, Japan

The 3rd biennial 3D-PEIM Symposium is planning on re-inviting as many of the original 2020 program world-class experts as possible, representing a far-reaching range of disciplinary perspectives to advance the development of future 3D power electronics systems. The Symposium encompasses additive, embedded, co-designed, and integrated packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power-dense components, and modules.

Professionals and Academics engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees an excellent opportunity to gain insight or broaden expertise in 3D power electronics packaging and integration. As in the past, we will arrange the Symposium schedule to provide ample time between sessions for attendees to share ideas, progress, and challenges with leading members of Universities, companies, and international associations and societies. On the last day of the Symposium, attendees will be invited for a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery.

General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. Hopefully, the COVID-19 threat will be over so that we can provide an amazing experience for the attendees because we will be re-assembling as many of the world's prominent experts in power electronics packaging and manufacturing that we had planned for this year. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this Symposium."

Other Organizing Committee Members

• Brian Narveson, Narveson Consulting, USA – Steering Committee Chairman and Finance Chairman
• Prof. Patrick McCluskey, University of Maryland, USA – Past General Chairman and Assistant to General Chairman
• John Bultitude, Kemet, USA – Publications Chairman
• Arnold Alderman, Anagenesis, Inc. USA – Publicity Chairman
• Prof. Doug Hopkins, North Carolina State University, USA – Past General Chairman and Advisor
• Joe Horzepa, U.S.A. – Executive Director of PSMA

If you wish to be a member of the Technical Program Committee, please contact http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

The technical sessions and chairs will be:

S1 Plenary I - Tsuyoshi Funaki, Osaka University, Japan
S2 Additive Manufacturing - Patrick McCluskey, University of Maryland, USA, and Douglas Hopkins, North Carolina State University, USA
S3 Systems Integration & Thermal Management - Christina DiMarino, Virginia Tech, USA
S4 Plenary II - Katsuaki Suganuma,Sanken Osaka University, Japan
S5 Multiphysics Design and Tools - Michihiro Shintani, Nara Institute of Science and Technology, (NAIST), Japan
S6 Materials - Jason Rouse, Sekisui America Corporation
S7 Manufacturing Technologies - John Bultitude, Kemet Corporation, USA
S8 Sponsors Session New for 2021! - Minora Ueshima, Daicel, Japan
S9 Quality and Reliability - Cyril Buttay, Laboratoire Ampère, France
S10 Heterogeneous Integration of Components - Tsuyoshi Funaki, Osaka University, Japan

The Symposium will also include:

• Tabletop demonstration exhibitions
• Networking & Laboratory Tours – Osaka University

Further announcements and the complete Symposium agenda will be posted on the 3D-PEIM Website later this year.

Some feedback from attendees at the 2016 & 2018 Symposiums:

• "The 3D-PEIM brings together a unique set of participants – those involved in power packaging who actually know and care about manufacturing and reliability."
• "Most valuable is the breadth of topics. I don't consider myself an expert in many topics presented so, touching on multiple topics is very helpful."
• "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

We look forward to seeing you in Osaka, Japan, in June 2021.

This autumn, we will start again looking for Media, Organizing, Financial, and Technical Partners contact info@3d-peim

For further information, you can contact: http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

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Sponsor:

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