PSMA website
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Table of contents
  1. Planning for APEC 2018 Hits Mid-Point
  2. You Are Invited to the 2017 PSMA Planning Meeting
  3. Meet Your Directors
  4. About Our Members
  5. Welcome to PSMA
  6. Announcing the Formation of the PSMA Reliability Committee
  7. PSMA and PELS Magnetics Committee High Frequency Magnetics Workshop - Power Magnetics @ High Frequency
  8. PSMA Sponsoring Capacitor Workshop Saturday March 3, 2018 in San Antonio: Everything You Wanted to Know about Capacitors but Were Afraid to Ask
  9. PSMA Energy Harvesting Technical Committee Planning International Workshop
  10. APEC 2018 Sponsors Expand Student Travel Support Program
  11. The 22nd China Power Supply Society Conference (CPSSC’2017) to be held in Shanghai in November
  12. PwrSoC18 to be held in Hsinchu, Taiwan in Autumn/Fall 2018
  13. What’s happening at INTELEC® 2017?
  14. The 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2017)
  15. Who Really Needs GaN or SiC Power Devices?
  16. Solar Energy Stock Index Q2 2017
  17. Solar Energy DealReader Q2 2017
  18. EMS Stock Index Q2 2017
  19. EMS DealReader Q2 2017
  20. Events of Interest – Mark Your Calendar
Contents | Next->

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.


Previous issues of update: Q4_2016 | Q1_2017 | Q2_2017


PSMA UPDATE is published and distributed via e-mail quarterly by the Power Sources Manufacturers Association. Send editorial information and comments to:

Editor, PSMA UPDATE
P.O. Box 418
Mendham, NJ 07945-0418

  (973) 543-9660
(973) 543-6207 (Fax)
E-mail: power@psma.com
Web Site: www.PSMA.com

Publisher: Eric Persson   Managing Editor: Lisa Horzepa

Permission to reprint information and articles as published is granted: a courtesy line is appreciated.

Membership in PSMA is open to any organization or corporation involved in the power sources and supplies industry. For membership information, visit our website or contact us by fax, telephone or email.

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.

 

 


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Planning for APEC 2018 Hits Mid-Point

T he Final Planning for APEC 2018 is well underway.  The Call-for-Papers closed in July with a near-record 1,167 digests submitted. Now the committee and over 100 volunteers have the task of peer-reviewing all the digests in preparation for the mid-year program meeting in October. At that time, the tough task will be to select the top 500+ papers for inclusion in the APEC 2018 Program.

By early September, all the submissions of proposals for both the very popular Industry Sessions as well as the highly-informative Professional Education Seminars will be reviewed for consideration in the Program. The Industry Session tracks will run in parallel with the Technical Sessions and are expected to be as popular as ever.

In 2017, over 2,000 APEC attendees arrived early to take advantage of the weekend and Monday morning Professional Education Seminars. The committee is planning a repeat of this attendance in 2018.

Exhibit reservations for APEC 2018 have hit an all-time high with 257 exhibitors and 42,000 square feet of exhibit space. A very limited number of spaces remain, far exceeded by the number of companies on the waiting list.

We are excited to announce the brand-new APEC Conference website.  The new website not only has a fresh look but it is designed to allow easy navigation to find the information you are looking for. Take a few minutes to go the site, www.apec-conf.org and look around.

Registration opens October 16th.  In addition to making your registration reservations to attend, you will also be able to book your hotel accommodations. As usual, APEC has secured blocks of rooms at the hotels close to the convention center.  Make sure to book your room early, as these rooms will sell out long before next March.

The entire APEC Conference Committee is excited about bringing our "premier global event in applied power electronics" to San Antonio, Texas, March 4-8.

Provided by Greg Evans,
APEC 2017 Publicity Chair

 


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You Are Invited to the 2017 PSMA Planning Meeting

A ll members of PSMA companies are invited to attend and to offer their inputs and suggestions for the projects and activities the Association should focus on in the coming year The 2017 PSMA Planning Meeting will take place on Saturday October 7 in Conference Room 17-18 at the San Antonio Marriott Rivercenter in San Antonio, TX.

The Board of Directors relies on the inputs generated at the Annual Planning Meetings to identify, consider and select programs for the following year that will bring benefits to the PSMA membership. For example, initiatives generated at recent Planning Meetings have resulted in the Power Supply in Package and Power Supply on Chip project and workshops, the Energy Efficiency and Safety & Compliance Database projects and the 3D Power Packaging projects and 3D-PEIM Symposium.

This year's meeting will begin with a brief review of the year to date accomplishments and a summary of ongoing activities by Eric Persson, Chairman of the PSMA. This will be followed by an update of the six-quarter financial forecast and brief status reports from the active PSMA committees.

Most of the meeting will feature an open forum to introduce and discuss possible special projects, initiatives, and priorities for the coming months. All members of PSMA Companies are encouraged to provide inputs. If you cannot attend the meeting in person, email suggestions to power@psma.com and they will be considered and included in the discussions. In the coming months, the PSMA Marketing Committee will summarize the results of the meeting and prioritize which projects and initiatives should be included in the focus for the next year.

All members and guests attending are invited to remain after the Planning Meeting to participate in the October meeting of the Board of Directors, which will take place immediately following. After the Board Meeting, interested individuals are invited to tour the exhibit area space in the Henry B. González Convention Center and the meeting room facilities planned for APEC 2018.

The APEC 2018 Technical Program Committee will meet the following day, Sunday October 8, to discuss the technical abstracts submitted and to organize the technical sessions, professional education seminars, rap sessions, and industry presentations for APEC 2018 in March. Since PSMA is a co-sponsor of APEC and all members are invited to participate and contribute in this important activity.

To make your room reservations at the Marriott call (888) 236-2427. Please reference APEC 2018 Planning Meeting to receive the group rate of $199.00 USD plus taxes. You may also book online: (www.marriott.com). Room block reservations are available until September 15th.

If you plan to attend the 2017 PSMA Planning Meeting, please email the Association Office at power@psma.com. We look forward to seeing many of you at these important meetings.



 


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Meet Your Directors
Four members of the Board of Directors are elected at the PSMA Annual Meeting held every year during the APEC conference. Each Director serves a three year term and is eligible to be reelected for one additional term.

At the PSMA Annual Meeting in March 2017, Alain Chapuis was elected to his second term and new board members Dhaval Dalal, Fred Weber and Brian Zahnstecher were elected. In the last issue we introduced you to Dhaval and Brian. In this issue, we will introduce you to Alain and Fred.

 

Alain Chapuis – CTO Power Solutions, Bel Power Solutions Inc.

Alain joined Melcher/Power-One, now part of Bel Power Solutions (based in Uster, Switzerland), as a Design Engineer in 1991 where he designed highly efficient single stage power factor corrected isolated rectifiers and fully hybridized DC/DC converters for the avionics market. He moved quickly into engineering management functions with a strong focus on the development of technology intense AC/DC and DC/DC products.  In 2002 he was instrumental in conceiving and implementing the first board level digital power converters providing a system level power solution allowing configuring, controlling and monitoring of an array of POL converters through a serial bus and a graphical user interface. More recently he pushed the deployment of full digital controls in AC/DC front-ends along with leading edge efficiency and power density improvements for the server and storage market by using enhanced power conversion topologies in conjunction with GaN and SiC power components. Alain has held the positions of VP Engineering, VP Digital Controls & Software and now CTO.  Alain holds an MS Electronics with honors from Swiss Federal Institute of Technology in Zurich and is inventor of more than 50 US patents in the domain of power conversion and control.
 

Provided by Alain Chapuis, CTO Power Solutions, Bel Power Solutions Inc.
 



 
Fred Weber is the President and owner of Future Technology Worldwide, LLC  (FTW) which is a Manufacturers' Representative organization. Fred has more than 30 years of technical sales, account management, and business development experience. FTW has created a well-balanced portfolio of cutting edge power products and services suppliers for its customers. FTW maintains for its principals the highest level of sales representation for business, market development, and growth in the Great Lakes Territory. Fred offers a high level of practical experience, technical know-how, and a solid reputation for opening doors, and building relationships with engineering, purchasing, and management.

Fred Weber has an Electrical Engineering degree from the University of Evansville, and an MBA from the University of Michigan. He continues to actively improve his technical knowledge and place himself in positions to be aware of technology trends and advancements. Fred is very active in PSMA (Power Sources Manufacturers Association) and also AEC (Automotive Electronics Council). He is co-chair of the Capacitor Committee and the Transportation Power Electronics Committee at PSMA, and is an active participant of the Magnetics committee. Fred is also working on the AEC team that is updating the AEC-Q200 specification (passive components) for Automotive products.

Fred enjoys many outdoor activities including, scuba diving, sport clay shooting, and running. His wife, Tina, is a Purchasing Manager for GM, and they have two daughters, Jessica is working towards her PhD in Organic Chemistry at MIT, and Samantha is working as a Pediatric Nurse for Detroit Children's Hospital.
 

Provided by Fred Weber, President and owner of Future Technology Worldwide, LLC
 


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  About Our Members 
About Our Members

 


 
I CF (NASDAQ:ICFI) is a global consulting and technology services provider with more than 5,000 professionals focused on making big things possible for our clients. We are business analysts, policy specialists, technologists, researchers, digital strategists, social scientists and creatives. Since 1969, government and commercial clients have worked with ICF to overcome their toughest challenges on issues that matter profoundly to their success. Come engage with us at icf.com.

We are an affiliate member of PSMA, forming a crucial link between the industry and government agencies focused on energy efficiency such the U.S. Environmental Protection Agency and Natural Resources Canada. We support these clients' decision-making through industry relationships and technical insight and have been the lead consultant to the EPA ENERGY STAR program for over 20 years.


In addition to government programs, we also support private-sector clients, including more than 75 Fortune 500 companies for whom we provide support ranging from technical expertise in sustainable materials management (SMM) or lifecycle assessment (LCA) to comprehensive services that drive integrated sustainability programs.

The hallmarks of ICF's approach are experience and integration.  We recognize the need for credible, current data, and for consistent life-cycle boundaries and assumptions.  Having designed and implemented a framework to convert information on life-cycle processes into GHG and energy factors that are consistent with the Intergovernmental Panel on Climate Change guidance, we are uniquely well-qualified to apply our expertise to solve problems and identify opportunities for emission reductions for other firms. We have developed life-cycle greenhouse gas (GHG) emissions factors for more than 50 materials types and have examined the implications of emissions abatement during production and recycling among the international electronics industry.

Our team is equipped with in-house and commercial LCA tools, including SimaPro and openLCA software, and a license to the ecoinvent v3 database. We can further help with:

  • Environmental Performance Case Studies
  • Corporate Baseline Environmental Footprint Analysis
  • Facility Attribute and Activity Data for Sustainability Analyses
  • External Reporting support
  • Tracking Contributions to UN Sustainable Development Goals
  • Climate Risk Assessment and Mitigation

At ICF, our corporate philosophy is simple: Hire the best people. Reward their creativity and entrepreneurship. Maintain the highest standards of integrity, ethics, and quality. And do this always with a clear focus on our clients' needs. Let us know how we can help with your toughest sustainability challenges—please contact Matt Malinowski, Technical Specialist, electronics energy efficiency at Matt.Malinowski@icf.com or 202-862-2693 Bobby Renz, Manager, climate, sustainability, and materials management, at Bobby.Renz@icf.com or 212-656-9216. 

Provided by Matt Malinowski, Technical Specialist, ICF



 
D emonstrating core competence for more than 65 years and a proven reliable partner in the magnetics industry, Micrometals Inc. is an engineering driven company striving to exceed our customers' requirements for catalog or custom magnetic components.  Headquartered in Anaheim, California with two factories in the United States and two factories in China, Micrometals offers application engineering and technical support from North America and China as well as stocking warehouses located in Germany and Hong Kong.


Micrometals materials are organized into 4 product groups: Radio Frequency, Power Conversion, 200C Series™ High Temperature and MicroCubes.  Micrometals Alloy Powder Cores, formerly Arnold Powder Core Division of Arnold Magnetic Technology, are organized into 6 material groups: Sendust, Molypermalloy, FluxSan™, Hi-Flux™, Optilloy™ and the recently introduced SH High Frequency Sendust.


This new SH Material has high frequency losses that are one third that of traditional Sendust material. The lower loss of High Frequency Sendust will enable it to be used with switching frequencies up to about 5 MHz. This new material was developed to meet the demands of the Power Conversion Industry's move to the latest in GaN and SiC switching technologies.

Power Conversion Engineers are pushing switching frequencies higher in an effort to reduce cost, minimize size and increase device efficiency.  As a result, magnetic component design engineers are challenged to find materials that can operate at 1-20 MHz or higher.  The SH Sendust material or traditional carbonyl iron powder materials can be considered as an alternate option for MnZn ferrites which may have increased core loss and the gap losses at this higher frequency or NiZn ferrites for high cost and high hysteresis loss.  Sample core kits of both SH Sendust or high frequency iron powder materials are available by contacting the Micrometals sales department or local representative.

The wide variety of material choices can be daunting.  In order to assist the design engineer in the selection process Micrometals has introduced an on-line Inductor Design Software and Inductor Analyzer.  This engineering tool is FREE for registered users and is a web-based service that can be located at the Micrometals APC website (www.MicrometalsAPC.com).

The software part database includes standard catalog parts from both Micrometals and Micrometals Alloy Powder Cores.  Additionally, the user can create custom heights to precisely meet the customer application specifications.

The inductor design calculator accepts inputs for DC inductors or PFC chokes and generates core and winding suggestions based on user defined design parameters.

The design software outputs can be exported for further analysis or individual winding suggestions can be transferred to the Inductor Analyzer feature.  The Analyzer feature allows users to start with a wound core and customize or optimize to change number of turns, wire gauge or consider alternate materials or part sizes and immediately output electrical and dimension characteristics.

Micrometals will gladly extend engineering and design assistance to aid in your core selection.  Please direct application questions to Applications@Micrometals.com.  Additional information about high frequency magnetics and the inductor design software is available at our websites:  www.Micrometals.com, www.MicrometalsAPC.com

Questions about samples, price and availability of all products above can be directed to Sales@micrometals.com.

Provided by Joseph Barbeito, Director of Sales & Marketing, Micrometals, Inc.

 

Editors Note: We would like to feature your company in a future issue of the Update. Please contact the Association Office for information about how to submit an article for consideration.


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Welcome to PSMA
   
 
   We are pleased to welcome 4 new member companies this quarter. We hope your company is a member. To learn about the benefits of membership, please visit our website www.psma.com.
   
 
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Mean Well USA
Leo Cheong
44030 Fremont Blvd
Fremont, CA 94538
Telephone: 510-683-8886
E-mail: leo@meanwellusa.com
Website: www.meanwellusa.com



Founded in 1982, Mean Well is one of few manufacturers dedicated to standard power supply in the world. Almost 99% of MEAN WELL's sales turnovers comes from standard power supply products sold under their own brand name.

Mean Well USA is the North American sales office for Mean Well Enterprises.  Established in 1999, Mean Well USA is the sales and support center for their North American customers.  Located in Fremont, CA, Mean Well USA provides customers with pre/post-sales support including product selection, engineering and technical support, training, as well as a logistics warehousing to provide immediate and just-in-time delivery.  Their trained staff of sales and technical engineers work closely with direct OEM's as well as distribution partners to provide standard off-the-shelf and customized power solutions to fit most applications.

 


Robert Pilawa
University of Illinois Urbana-Champaign
4042 ECE Building MC 702
306 North Wright Street
Urbana, IL 61801-2332
Telephone: 217-244-0181
E-mail: pilawa@illinois.edu
Website: pilawa.ece.illinois.edu



J Robert Pilawa-Podgurski is currently an Assistant Professor in the Electrical and Computer Engineering Department at the University of Illinois, Urbana-Champaign, and is affiliated with the Power and Energy Systems group. His research interests include renewable energy applications, electric vehicles, energy harvesting, CMOS power management, high density and high efficiency power converters, and advanced control of power converters. Dr. Pilawa-Podgurski received the Chorafas Award for outstanding MIT EECS Master's thesis, the Google Faculty Research Award in 2013, and the 2014 Richard M. Bass Outstanding Young Power Electronics Engineer Award of the IEEE PELS. In 2015, he received the Air Force Office of Scientific Research Young Investigator Award, the UIUC Dean's Award for Excellence in Research in 2016, the UIUC Campus Distinguished Promotion Award in 2017, and the UIUC ECE Ronald W. Pratt Faculty Outstanding Teaching Award in 2017. Since 2014, he serves as Associate Editor for IEEE Transactions on Power Electronics, and for IEEE Journal of Emerging and Selected Topics in Power Electronics. He is co-author of eight IEEE prize papers.

 


Setec
Louise Bayliss
19 Henderson Road
Melbourne Victoria, 3180
Australia
Telephone: 0392138403
E-mail: louise.bayliss@setec.com.au
Website: www.setec.com.au



Since 1968, Setec has been creating world class products and providing custom-designed power supply solutions. Setec's history reflects a deep commitment to innovation as well as excellence in design, manufacturing and customer service. In 1999, Setec moved into an all-new purpose built manufacturing facility consisting of over 2,500 square metres of modern factory and stores floor space which incorporated the latest best practice anti-static, electro-static discharge floor proofing.

As a result of Setec's hard work and networking in industry over the years, their customer base expanded significantly into gaming, communications, medical/scientific, recreational vehicles, lighting, information technology equipment and the automotive industry. Today, Setec is led by a new generation of technologies with export markets extending across the globe.

 


VisIC Technologies
Lizi Cohen
Golda Meir 7
Nes Ziona, 7403650 Israel
Telephone: 0545645550
E-mail: lizi.cohen@visic-tech.com
Website: visic-tech.com


VisIC Technologies was founded in 2010 to develop and market high power component products based upon compound semiconductor Gallium Nitride (GaN) aiming to replace most of the Silicon (Si) products used in power conversion systems. VisIC's products are unique, differentiated products providing the features system designers need, along with significant cost and performance advantages.

VisIC's unique, patented technology is based on deep knowledge of GaN transistor physics. It employs GaN die design for high efficiency and advanced embedding packaging to create fast devices. Their devices have a small foot print and a record performance to price ratio.

 



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Announcing the Formation of the PSMA Reliability Committee

T he Power Sources Manufacturers Association (PSMA) is proud to announce the formation of a new Technology Committee - the Reliability Committee. The PSMA Reliability Committee was formed to identify key industry initiatives related to the reliability and performance of power supplies and associated products and will be Co-chaired by Tony O'Brien of Cisco Systems and Brian Zahnstecher of PowerRox.

The Committee held an inaugural meeting on Thursday August 10. The committee already has 10 members representing a mix of industry professionals including power supply vendors, OEMs/customers and semiconductor component vendors, ensuring broad coverage of issues that affect the whole power electronics industry. The first action of the Committee is to survey selected industry veterans to develop a prioritized list of the most pertinent initiatives related to reliability. The output of this survey will be combined with a focus on the robustness of software/firmware in digital power solutions and will determine the initial, tangible issues and direction for the Committee efforts.

If you are interested in having a direct hand in identifying and addressing key industry issues that plague developments, inhibit customer applications, delay schedules, increase costs, and drive field infant mortality rates, then please join us. Monthly meetings will be held via teleconference on the 2nd Wednesday of each month at 11am Central Time, with the next scheduled call on September 13.

For more information and to join the membership list for the Reliability Committee , please contact the PSMA Association Office at power@psma.com.

Provided by Tony O'Brien and Brian Zahnstecher, PSMA Reliability Committee Co-chairs

 


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PSMA and PELS Magnetics Committee High Frequency Magnetics Workshop

Power Magnetics @ High Frequency
Date: Saturday March 3 2018

APEC 2018 San Antonio Texas

The PSMA Magnetics Committee and IEEE PELS will conduct the third "Power Magnetics @ High Frequency" workshop on Saturday, March 3 2018, which is the day before and at the same venue as APEC 2018 in San Antonio, TX.

The purpose and focus of the workshop is to identify the latest improvements in magnetic materials, coil (winding) design, construction and fabrication, evaluation and characterization techniques and modelling and simulation tools so as to target the advancements that are deemed necessary by the participants for power magnetics to meet the technical expectations and requirements of new market applications for higher operating frequencies and emerging topologies being driven by continuous advances in circuits topologies and semi-conductor devices.

The target audiences for the workshop include the designers of power magnetic components for use in electronic power converters responsible to implement the most technologically advanced power magnetic components to achieve higher power densities, specific physical aspect ratios such as low profile, higher power efficiencies and improved thermal performance. The target audiences also include people involved in the supply chain for the power magnetics industry ranging from manufacturers of magnetic materials and magnetic structures, fabricators of magnetic components, providers of modelling and simulation software as well as manufacturers of test and characterization equipment.

The workshop will begin with a keynote presentation by Charles Sullivan from The Thayer School of Engineering at Dartmouth College providing a technical overview of the topics to be covered within the workshop. The keynote presentation will be complemented by a Q&A session to address specific details of interest of the workshop attendees.

The second session of the workshop will be a technical presentation session addressing various topics associated with ac power losses. In addition to the brief Q&A after each individual presentation there will be a panel of the presenters at the end of the session who will address topics requiring more detail as deemed by the workshop attendees.  The proposed topics for this session are as follows:

  • Methods to characterize and model ac power loss
  • Presentation formats of magnetics performance data to facilitate component design
  • Impact of various effects (for example dimensional effects of magnetic core physical size) on ac power losses
  • Influence of magnetic materials and conductors on ac power loss
  • Design techniques, simulation tools and modelling
  • Power conversion topologies and applications driving reduction of physical size while improving the efficiency of power magnetics technologies

The third session of the workshop will be an interactive session of table top technology demonstrations each addressing specific technical disciplines and capabilities consistent with the workshop agenda. The session will begin with a brief overview and mapping of the technology demonstration stations. Each technology demonstration station will provide a ten minute presentation at fifteen minute intervals. Interaction between the attendees and the presenters is highly encouraged during this portion of agenda as segue from the opening keynote presentation and the technical issues session. The technical disciplines expected to be displayed during the technical demonstration session include:

  • Ac power loss measurements
  • Core loss modelling and/or simulation with empirical verification
  • Inductor modelling supported by empirical verification
  • Near magnetic field measurements
  • Thermal measurements
  • Impedance measurements
  • Engineering methodology specific to new structures and/or magnetic materials including both modeling and verification
  • Roadmaps addressing the needs of the power magnetics industry
  • Standardization activity addressing any of the above topics

If anyone would like to participate as a presenter for the technical demonstration session, please contact Matt Wilkowski at matt.wilkowski@intel.com with a description of your proposed technical capabilities topic. We are limited to nine technology demonstration sessions.

The fourth session of the workshop will be a technical presentation session addressing topics associated with fringing based upon responses to the survey for the previous 2017 workshop. In addition to the brief Q&A after each individual presentation there will be panel of the presenters at the end of the to address topics requiring more detail as deemed by the workshop attendees. The proposed topics for this session are:

  • Impact of coil winding,
  • Impact of core shape,
  • Impact of distributed gap cores,
  • Impact on measured ac power losses
  • Near magnetic field considerations.

The specifics for the workshop structure and the presentations for the workshop are currently in progress and are not finalized. If anyone can support a strong position for a specific topic that would be of general interest to the magnetics and the power industries, please contact Matt Wilkowski at matt.wilkowski@intel.com.

More details regarding the agenda for the workshop as well as registration for the workshop will become available on the PSMA website (www.psma.com/technical-forums/magnetics/workshop) over the coming months.

Organizing Committee

Khurram Afridi, University of Colorado Boulder
Ali Bazzi, University of Connecticut
Steve Carlsen, Raytheon
Ed Herbert
Rodney Rogers, All Star Magnetics
Laili Wang, Xi'an Jiaotong University
Fred Weber, Future Technology Worldwide
Chuck Wild, Dexter Magnetics
Matt Wilkowski, Intel

 


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PSMA Sponsoring Capacitor Workshop Saturday March 3, 2018 in San Antonio

Everything You Wanted to Know about Capacitors but Were Afraid to Ask

Remember back in school when we learned about capacitors. The first thing we learned is that there are two types: polarized and non-polarized. The second lesson was, do not plug in polarized capacitors backward! After that, we moved on to inductors. As any engineer who has worked with capacitors knows, there is so much more to them.

The PSMA Capacitor Committee is organizing the first capacitor workshop at APEC 2018 in San Antonio, TX, the day before the conference begins, Saturday March 3, 2018. The workshop's title sets the tone for the packaged day: "(Almost) Everything You Wanted to Know About Caps but Were Afraid to Ask."

Designers of dc-dc converters, frequency drives, inverters, and other power conversation applications will benefit from this workshop. The content is designed to introduce, or re-introduce, fundamentals of capacitor technologies and how they affect end user applications.

Unlike what we learned in school, there are more than two kinds of capacitors. The materials used to construct the dielectric and the electrodes, alter their characteristics and behavior. What happens when you replace the electrolyte in an aluminum capacitor? How does the film type change the self-healing of a film capacitor? Is it possible to avoid ceramics cracking on a PCB? These are the kinds of questions that will be addressed.

The workshop's organizing team is working on the presentations and structure now. The focus is on capacitor fundamentals, but not their basics. The agenda addresses the design of different capacitor types, how their characteristics change in your application, the effect of the operating environment, and considerations for their operational lifetime.

With capacitors being used across the electronics industry and in every electronic design, it is tough to create content that applies to every engineer at APEC. For this reason, the team is grouping content into three sessions.

Three technical content sessions are planned.

  • Low Voltage. This course focuses on embedded or low voltage type applications. The most common example are DC-to-DC converters. Low voltage includes applications using less than 100 VDC. These applications could be 48 V automotive, 48 V data center, 12 V distribution, or lower voltage rails for microprocessors and FPGAs.
  • High Voltage / Power. This session focuses on motor drives, inverters, and AC Line related applications.  Much focus will be on considerations when choosing a capacitor technology for DC Link applications.
  • Failure Modes. Understanding how a capacitor, or any device, fail means you can design to avoid it.

In addition to the formal technical sessions, there will be several keynote presentations, and an interactive applications session. During breakfast, lunch and the end-of-day networking period there will be demonstrations of products, technologies, equipment, and measurements.

Presentations are designed to answer questions engineers have, or will have, when working with different capacitor dielectrics. As we finalize topics, the organizing committee is eager to hear additional topic suggestions.  Please contact Pierre Lohrber (pierre.lohrber@we-online.de) or James Lewis (jameslewis@kemet.com) of the organizing committee.

The latest agenda, registration, and additional information will be available at http://www.psma.com/technical-forums/capacitor/workshop.

Related: Capacitor Industry Session

The PSMA Capacitor committee will also be holding a half day Industry Session during APEC 2018. The topic for this session is focused on new capacitor technologies and products. The Industry session will start, where the workshops ends to help guide you through new capacitor developments and solutions for your specific applications.

Capacitor Workshop Organizing Team
  • Fred Weber, Future Technology Worldwide
  • Pierre Lohrber, Wurth Electronics
  • James Lewis, KEMET Electronics

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PSMA Energy Harvesting Technical Committee Planning International Workshop

F ollowing on the surge of interest in energy harvesting within the power electronics community the PSMA Energy Harvesting Committee has decided to organize an international workshop in May 2018 to enable interested parties from industry and academia to learn, share, collaborate and demonstrate.

Over the past 18 months since its reorganization, the PSMA Energy Harvesting Committee has increased from 7 to 32 members with representation by industry and academic organizations from US, Europe and Asia involved in semiconductor devices, sensors, storage devices, transducers, system and service providers.

There is an appetite both in the power sources industry and Internet of Things (IoT) industry to learn more about energy harvesting, understand its potential as well as it constraints in real-world applications. The need to replace batteries in ultra-low power IoT devices has become a major technical, cost and logistical issue that is significantly impeding the potential growth in this sector. However, this presents a major opportunity for the power electronics community to develop and introduce a new generation of ultra-low power devices with some kind of embedded regeneration capability.

The international workshop will follow the very successful format used at the PSMA Energy Harvesting Industry Session of APEC 2017, which will be a two-day event to enable more depth and to engage a broader audience providing participants with ample time to network, learn, form links and hopefully develop collaborative partnerships.

The workshop will also feature dedicated demonstrations from many top tier vendors of parts and systems to allow participants to view the technologies (hardware, visualization and simulation tools, etc.) in operation and interact directly with the developers. Whilst primarily targeting IoT, other applications will be considered subject to presentation material and demos collated as well as suggestions from intending participants. The workshop will demonstrate examples of successful energy harvesting products already created via synergies between the energy harvesting source and the load demand developers. A key workshop message and driver is that emerging technologies, if properly guided and integrated, will enable a dramatic penetration of energy harvesting solutions into a broader range of applications.

The targeted workshop attendees are a broad audience ranging from potential adopters of energy harvesting for IoT devices for specific applications (building management, medical technologies, assisted living, environmental, conditional monitoring of equipment, systems, power supplies) to industrial and academic developers of materials and devices (active and passive) to systems integrators and installers of IoT solutions.

Mike Hayes, PSMA Energy Harvesting Technical Committee, will co-chair the event which will be hosted Tyndall National Institute in Cork, Ireland. Tyndall is a major leading European epicenter for EU and industry funded research in energy harvesting and related IoT technologies.

Brian Zahnstecher, Principal of PowerRox, will co-chair the workshop, leveraging both his PSMA Energy Harvesting Committee experience as well as his experiences in IEEE PELS in running similar workshops nationally. PowerRox is a firm dedicated to solving power problems for those seeking to establish or enhance their position in the enterprise and consumer power electronics marketplace. 

If anyone is interested in learning more about the workshop or interested in organizing, guiding or participating in the workshop please contact Mike or Brian. The latest information on the workshop can be found at http://www.psma.com/technical-forums/energy-efficiency/news.

Provided by Mike Hayes (Michael.hayes@tyndall.ie)
and Brian Zahnstecher (bz@powerrox.com)
PSMA Energy Harvesting Workshop Co-Chairs


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APEC 2018 Sponsors Expand Student Travel Support Program

Travel support of up to $1,000 offered to graduate and undergraduate students enrolled in power electronics programs to assist in attendance at APEC in March 2018; Up to $60,000 in travel support will be distributed; Deadline for applications is Oct. 27, 2017

The joint sponsors of the Applied Power Electronics Conference (APEC) have announced the expansion of the popular Student Attendance Travel Support Program. Awarding up to $1,000 per student to cover a portion of their travel and conference expenses, the program has been expanded to disperse up to $60,000 to as many as 60 students who are participating in APEC 2018, being held in San Antonio, Texas, March 4-8, 2018. Interested students must apply by Oct. 27th, 2017.

In its 13th year, this popular program, initiated by the Power Sources Manufacturers Association (PSMA), is now jointly underwritten by PSMA and the other co-sponsors of the APEC conference: the IEEE Power Electronics Society (PELS) and the IEEE Industry Applications society (IAS).

The recipients will be chosen by the APEC 2018 Student Travel Support Committee. Application forms are available at APEC Attendance Travel Support Application. The application criteria are:

  • The applicant must be an undergraduate or graduate student enrolled in a power electronics program at an accredited institution
  • Only students who have not received travel support in the past will be considered
  • The recipients must be an author or co-author of a paper that was accepted for presentation at APEC 2018
  • The recipient must attend APEC 2018 and submit expense receipts to the Committee for reimbursement
  • Applications must be made and received by the Committee by October 27, 2017
  • The recipients will be notified by the Committee by November 17, 2017

As part of the application process, students must provide information about their educational institution, degree program, the name of their faculty advisor and a brief description of their career interest and reasons for planning to attend APEC. The application also requires the title and ID number of their accepted APEC paper, as well as the name(s) of the co-author(s).

More information about the APEC Student Attendance Travel Support Program may be found at the PSMA's Education Forum page.


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The 22nd China Power Supply Society Conference (CPSSC'2017) to be held in Shanghai in November

The CPSS & PSMA Joint Workshop on Power Supply Industry Innovation Running in Parallel with CPSSC'2017


T he 22nd China Power Supply Society Conference (CPSSC'2017) will be held in Shanghai, China, Nov. 3-6, 2017. Convened biennially, CPSSC'2017 is considered  the largest, highest-level and most representative academic conference of power supplies in China. It has attracted over than 460 papers this year, and is expected to have more than 1,000 people. The attendees will exchange ideas and discuss extensively the new theories, technologies, achievements and processing in various fields of the power supply industry through plenary lectures, tutorials, technical sessions, industry seminars, poster sessions, and a new product exhibition. The conference will promote technological innovation and advancement in China's power supply industry.

Conference topics include:

  • Switching Power Supply
  • DC/DC Converter, Power Factor Correction Converter
  • Inverter and Control
  • DC/AC Inverter, Modulation and Control
  • New Power Devices and applications
  • Si, SiC, and GaN devices
  • High Frequency Magnetic Components and Integrated Magnetics
  • Conversion Technologies for Renewable Energy and Energy Saving
  • Power Quality Technologies, Distributed Systems, Smart Grid and Micro-grid
  • Lighting Power Supply, Customer Electronics and Related Technologies
  • Special Power Supply
  • EMC Technology
  • Wireless Power Transfer Technology
  • Power Supply Technologies for information systems: UPS, DC Power Supply
  • Battery Management
  • Clean Energy Vehicle and Propulsion Technology
  • and other related areas of power supply

Based on the topics above, CPSSC'2017's program will include 7 invited plenary speeches, 8 tutorials, 40 technical sessions, 8 industry sessions, 2 poster sessions, and 50-enterprise exhibitions. The Final of the Student Design Competition on Power Electronics 2017, the 4th China Power Supply Society Science & Technology Award Ceremony and Achievements Show, the Youth Power Supply Scientific Researcher Forum and other activities will also be held at the same time.

During the conference, in particular, there will be a Workshop on Power Supply Industry Innovation, hosted jointly by China Power Supply Society (CPSS) and Power Sources Manufacture Association (PSMA) The workshop aims at promoting  China-U.S. cooperation in multiple areas of the power supply industry, exploring the development trends of power supply technology in the future based on the current development status in the two countries while pushing forward the growth in the power supply industry in both China and the U.S. High-ranking leaders from both organizations, senior management staff and senior engineers from the Chinese and the U.S. member companies will attend the workshop.

Registration for CPSSC'2017 is open now, please visit the CPSSC'2017 website for further information and online registration: http://meeting.cpss.org.cn

We look forward to seeing you in Shanghai.


Provided by Lei Zhang, Deputy Secretary General & Executive Director, China Power Supply Society (CPSS)


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PwrSoC2018 to be held in Hsinchu, Taiwan in Autumn/Fall 2018

I n 2018, the International Workshop on Power Supply on Chip (PwrSoC) will be 10 years old. And to celebrate the 10th anniversary, PSMA, in partnership with IEEE PELS, is organizing the next workshop in Hsinchu, Taiwan in the autumn/fall of 2018 – a definite date will be announced shortly.

The workshop will focus on the integration of electrical power converters for multiple applications, and address a broad range of technologies. The complete integration on-die (PwrSoC) and integration within package (PwrSiP) are of prime interest.

Since the initial events, hosted by Tyndall National Institute in Cork, Ireland in 2008 and 2010, the workshop has, under the joint leadership of PSMA and PELS, gone from strength to strength. From 100 attendees in Cork, the Workshops in the USA, in San Francisco and Boston, attracted 200 people, in both 2012 and 2014. In 2016, the workshop was hosted by UPM in Madrid and again attracted more than 150 people, coming from both industry and academia.

At the Madrid workshop in October 2016, the increasing commercial interest in integrated power was clearly evident. More than 150 participants were in attendance with more than fifty percent attending from companies across the broad microelectronics supply-chain from semiconductor equipment vendors to foundry and fabrication facilities and OSATs (outsourced assembly and test houses) to power converter and passive component suppliers, system-on-chip (SOC) and electronic system companies.

In 2018, the workshop will be hosted by the National Chiao Tung University in Hsinchu, Taiwan. Professor Ke-Horng Chen, Chair of the Department of Electrical and Computer Engineering in NCTU will take on the role of General Co-Chair together with Prof. Cian Ó Mathúna, Tyndall National Institute, the originator of the workshop. Given the aforementioned level of current industry interest in the commercialization of the technology, it is appropriate that the 10th anniversary workshop will be held in Taiwan, the global center of microelectronics production.

Preparations are well underway for the workshop with Prof. Chen having already hosted visits from both Matt Wilkowski and Cian Ó Mathúna, over the last few months with the objective of discussing logistics around venues and facilities.

The Technical Program Chair for the 2018 workshop is Prof. Hanh-Phuc Le, Dept. of Electrical, Computer and Energy Engineering, University of Colorado at Boulder. Prof. Le, who is a very familiar participant in PwrSoC events, will be starting to assemble a Technical Program Committee together over the coming months. Anyone interested in participating on the committee, please contact Prof. Le directly.

A great aspect of past PwrSoC workshops has been the manner in which it has attracted both industry and academia in equal numbers ensuring two and a half days (and nights!) of in-depth discussions focused on the technical and business opportunities and challenges associated with this emerging technology. The PwrSoC2018 Workshop will follow the successful formula from previous workshops with a single track of invited presentations and posters. Because of the intense and specific nature of this workshop, attendance will be limited to individuals actively involved with this emerging technology.

We are looking forward to delivering another successful event in 2018.

General Co-Chairs:
Professor Ke-Horng Chen. khchen@cn.nctu.edu.tw
Prof. Cian Ó Mathúna. Cian.omathuna@tyndall.ie

Technical Program Chair
Prof. Hanh-Phuc Le. hanhphuc@Colorado.edu


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What's happening at INTELEC® 2017?

Will Power Empower the Electronics Industry?

22-26 October 2017

One of the key aspects of INTELEC® 2017 is that it will be held a tantalizing block away from the sun, surf and sandy shores of the Pacific Ocean at the magnificent Gold Coast Conference and Exhibition Centre in Broadbeach, Queensland, Australia.

Most readers of this Newsletter will know and recognize INTELEC as the long-standing, respected annual IEEE conference exploring the science and engineering of energy systems for Information and Communications Technology (ICT) infrastructure.  What some may not know is that this will be only the second time in the 39-year history of this global conference that the event has been held in the Southern Hemisphere.  As you can appreciate, there is a local and regional industry buzz about this rare opportunity in having INTELEC 'down-under'.

The theme for INTELEC® 2017 is 'Driving Innovation in ICT Energy Infrastructure'.  In a global sense, it is an exciting time in the ICT energy systems space.  Digital convergence continues to drive increasing demands on ICT energy infrastructure in terms of consumption and resilience, and there is great opportunity in leveraging established know-how and practicalities with new and emerging technologies.

The innovation theme for INTELEC® 2017 also has been applied directly to the conference itself, and those attending will see some departures from the traditional INTELEC line-up.  The deadline for this providing this article has just preceded the finalization of the conference program, and at the time of writing, full details of the program cannot be revealed.  Keep a watch at www.intelec.org/program.php for updates and announcements.

Conference Program
The conference consists of the traditional technical program and parallel industry exposition.  Content for the technical program has been selected by a blind-peer process, and approximately 130 technical papers and posters, and four Special Seminars will be presented throughout parallel sessions during the conference.  The program kicks off on the Monday morning with keynote addresses from operators giving their view of future trends and expectations in the energy infrastructure space.  Each day, a topic-specific plenary session precedes the parallel technical sessions across the six general topic domains – ICT infrastructure, energy efficiency and thermal management, batteries and energy storage, power electronics, power system architectures, and renewable and alternative energy sources.
One of the innovations this year is the introduction of specific 'end-to-end thread' streams, which start with plenary session content, go through grouped papers sessions, and end with a facilitated, interactive forum.  Three such streams - one on advanced batteries, one on thermal management of plant, and the other on remote-line powering – are interspersed throughout the technical program schedule.  To accommodate the increased program, the conference will close on around 4pm on the Thursday afternoon, rather than at lunchtime.
Educational tutorials will be held on the Sunday preceding the start of the conference.  To cater for the wide range of subject matter within the INTELEC scope, four very different tutorials are offered covering the topics - 5G & energy harvesting, solar & hybrid system design, designing power electronics for batteries, and cooling and energy management of base transceiver stations.  Registrants for the tutorials can obtain continuing education credits.

Industry Exposition
There has also been some innovation of the Exhibition side of the conference.  INTELEC's success has always been due to the unique mix of academia & researchers, industry product developers and vendors, end-users and infrastructure operators.  The exhibition space is the mixing pot for productive networking and the exchange of ideas.  For INTELEC® 2017, there is increased focus on the exhibition and exhibitors.  To maximize focus and impact, the Exhibition will be first seen and opened in a separate and specific lunchtime opening on Monday, after the conference opening and keynote addresses.  This means the traditional Sunday evening Welcome Reception will be held elsewhere (another surprise).  In addition, as part of the parallel technical program, the Commercial Product Exposure stream, which allows exhibitors and product developers to give formal technical presentations to conference delegates, will be held in the exhibition area to attract interest from the floor.  Exhibitors will also have access to a purpose specific video presentation room to host small customer groups.  The Exhibition will stay open and host the close of the conference on Thursday afternoon.

Conference Experience
The Gold Coast is an icon visitor destination in an icon destination country.  Delegates at INTELEC® 2017 will have the chance to be up close with kangaroos, koalas and wombats, as well as participate in other memorable social events.  INTELEC® 2017 will therefore be a different, if not unique, conference experience.  The exchange rate is very favorable, so be sure you get to INTELEC® 2017!




Provided by John M Hawkins, Convener, INTELEC 2017

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The 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2017)

Monday, October 30 – Wednesday, November 1, 2017
Hyatt Regency Tamaya Resort, Albuquerque, NM USA

The 5th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, www.wipda.org ), sponsored by IEEE and PSMA, is a fast-growing yearly event which provides a forum for device scientists, circuit designers, and application engineers to share technology updates, research findings, development experience, and application knowledge. The 5th WiPDA will be held from Oct. 30 to Nov. 1, 2017, at Hyatt Regency Tamaya Resort, Albuquerque, NM.

What to see in Albuquerque?

Albuquerque is home to the University of New Mexico (UNM), Kirtland Air Force Base, Sandia National Laboratories, the National Museum of Nuclear Science & History, and the Lovelace Respiratory Research Institute. The Sandia Mountains run along the eastern side of Albuquerque and the Rio Grande river flows through the city, north to south. Albuquerque is also the home of the International Balloon Fiesta, the world's largest gathering of hot-air balloons from around the globe. The workshop venue is the Hyatt Regency Tamaya Resort just north of Albuquerque. It offers a perfect combination of luxurious amenities, culture, history, and stunning landscapes that create a one-of-a-kind experience. Visitors can play a round of championship golf at the Twin Warriors golf course, ride a rescue horse, or watch a radiant sunset while dining on fresh, regional cuisine at the Corn Maiden restaurant. This year's poster session and banquet will be held at the Cottonwoods Pavilion, located on the Tamaya grounds along the banks of the Rio Grande river.

This year's event will have a similar structure as previous years, including an extensive program of tutorials; keynote, technical, and poster sessions; a panel discussion; an exhibition; and a banquet. The topics of interest include, but are not limited to:

  • Heteroepitaxial and bulk materials growth
  • Gate dielectrics and surface passivation
  • Device structures and fabrication techniques
  • Device characterization and modeling
  • Very high efficiency and compact converters
  • SOAs including short-circuit, spike, and transient tolerance
  • Harsh environment (e.g. high temperature) operation and reliability
  • Packaging, power modules, and ICs
  • Hard-switched and soft-switched applications
  • Common-mode and EMI management
  • Gate drive and other auxiliary circuits
  • High-performance passive components
  • Applications in renewable energy and storage, transportation, industrial drives, and grid power systems

Technical Papers: Technical papers addressing all aspects of wide-bandgap power electronics are welcome. Technical oral sessions will be held Tuesday and Wednesday, and a poster session will be held Tuesday night. All presented papers will be included in the conference proceedings and submitted to the IEEExplore database.

Featured Keynote Sessions:

WIPDA 2017 keynote sessions will be held Tuesday and Wednesday, in which leading experts from government, academia, industry, and research institutes will share their insights on technology developments and future trends. As some highlights of this year, we can expect keynote speeches including: "Current and Future Directions in Power Electronic Devices and Circuits based on Wide Band-Gap Semiconductors" from Dr. Isik C. Kizilyalli (Program Director from ARPA-E), "GaN Power ICs: Device Integration Delivers Application Performance" by Dr. Nick Fichtenbaum (Navitas Semiconductor), and "Electrical and Thermal Considerations for Wide Bandgap Power Electronics" by Dr. Andrew Alleyne from University of Illinois Urbana-Champaign. Speakers from the U.S. Army Research Laboratory (ARL) and Infineon will share their experience and vision on SiC and GaN development and applications in their talks "Enabling the Development of Power Electronics Applications through Advancements in SiC Power Devices" and "600V GaN Power Device: The Long Journey to Market Success", respectively. More keynote summaries can be found at www.wipda.org.

Tutorials, Panel Session, and Exhibitions

WiPDA 2017 will offer tutorials covering both device and application topics on Monday afternoon. The tutorial speakers are from both universities (Purdue University, North Carolina State University, Virginia Tech, and University of Alabama) and companies (John Deere, Texas Instruments, and Infineon Technologies). As one of the highlight, Dr. James Cooper from Purdue University will share his vision on SiC devices in his tutorial "SiC Power Devices: Physics, Current Status, and Future Trends". More tutorial summaries can be found at www.wipda.org.

Two panel sessions focused on high-voltage SiC and high-frequency GaN featuring leading experts from US federal agencies, industry, and academia will be part of the meeting. Also, a number of booths will be available for exhibition.

Student Travel Grants

The organizing committee anticipates being able to fund student travel grants at supported equally by PELS and PSMA.

If you have any questions, please contact the organizing committee:

Robert Kaplar, Sandia National Labs (rjkapla@sandia.gov )
Maryam Saeedifard, Georgia Tech (maryam@ece.gatech.edu)
Sameh Khalil, Infineon (sameh.khalil@infineon.com)
Mike Mazzola, Mississippi State (mazzola@ece.msstate.edu)
Fang Luo, University of Arkansas (fangluo@uark.edu)

We are looking forward to meeting you in Albuquerque, New Mexico!

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Who Really Needs GaN or SiC Power Devices?

G aN versus SiC technology is a recurring subject that is being debated and hyped and you may be overwhelmed by it. We are sorry but much of what has been said about the markets for Gallium Nitride (GaN) and Silicon Carbide (SiC) power devices in the past haven't served the Power Electronics community very well. At PntPower we want to make things right and to be clear on the subject. Here is our point of view.

We do not support the usual message that Wide Band Gap (WPG) devices are awesome and will change the world. We are a market research company, and we believe it is not about the relative performances - it's about the product/market fit. So a better question might be:

What will GaN and SiC technologies bring to power electronics system applications that IGBT, MOSFET and Super Junction MOSFET cannot bring?

Do you have an answer to this question? Because we do, through working on applications oriented market analysis we could list the market segments where GaN can bring awesome competitive advantage now - not in performance but in real end-product competitive advantages, that is expected by users. There are also other market segments where GaN penetration will happen – but only when prices drop and people who say otherwise are trying to sell a wonderful world with marketing nonsense.

It's not very different analysis for SiC. This technology has been around for a while, and since there were no perfect product/market fit at the time, the market has had to be patient. This is primarily because the SiC product/market fit is at a much higher voltage than current products require.

GaN Power Devices market penetration is not comparable with SiC Power Devices

There have been several market reports that indicate there will be fierce competition between the two Wide Band Gap materials, GaN and SiC. Why would GaN and SiC technologies be in direct competition on the Power devices markets when one gives its best at 10 kV (or so) and the other is good at the 0.6kV range (600V). These power devices do not compare; thus their market penetration will not compare. Don't try to measure different technologies with different advantages on the same scale.


Extract from a Fairchild Semiconductor (now ON Semiconductor) presentation. Designed originally by Alex AVRON, founder of PntPower)


GaN is made for lower voltages, high-end products. We know you have seen this infographic picture somewhere (or different versions of it). We drew it a few years ago, inspired by so many that looked alike but were missing some pieces of information (like SiC and GaN integration). It happens to be quite true even now.

GaN is in direct competition with Super Junction MOSFET. SiC is in competition with IGBT. MOSFET are still used on their own low-cost markets. The only voltage range shared by SiC and GaN could be for 600V kilowatt range applications. We believe that GaN will quickly be cheaper and kill SiC competition at birth, in this voltage range. We think there is no competition for this application area and we would recommend designers to start focusing on the one technology matching their products.

Now, looking at GaN performances, we realize it is mainly going to be used at 600V. It may go to 1200V later, when the technology becomes available, but so far it's not.

We have talked a lot with many devices makers, system designers and end-users. The person using the product (the customer) is the only one who is able to let you know about the product/market fit. The responses we had were very different from one application to another and the analysis of it is synthesized in our market report. The main result of the interviews is that the first markets to adopt GaN will be for consumer applications.

GaN Power Devices are for consumer markets first and SiC will be for transportation

At this time, Wide Band Gap power devices are not cheap. So, the initial applications that will adopt them will be for a non-negligible benefit in using them instead of another cheaper device. Our analysis led us to this reasoning -  GaN pushes further the limits of Super Junction MOSFETs. The latter brought smaller and more efficient power supplies to consumer applications. So, future GaN users will look for smaller and more efficient power supplies and the benefits will justify this feature at a high price (to pay for the device's production costs). This is what leads us to say that GaN will be used in consumer high-end power supplies.

Many have been struggling to define what will be the future application for Silicon Carbide MOSFET. Going back to its characteristics, this is a technology that provides devices with a very high-blocking voltage (much higher than GaN, MOSFET and even IGBT). This characteristic will make it very attractive for a certain type of applications. These applications including rail traction or grid and T&D, are already applying these devices. However these applications have very long product lifecycles, which makes production introduction and adoption as long.

The Next Steps for GaN & SiC in Power Electronics

Don't expect Wide Band Gap to be quickly adopted in the power electronics world. It will take time because designers are reluctant to change (and we all know it!).

Provided by
Alex Avron, PntPower
 


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Solar Energy Stock Index: Q2 2017

Lincoln International is pleased to present you with the latest Solar Energy Stock Index from our Global Energy & Power Group. This will provide you with:

  • Quarterly performance of the Solar Energy Stock Index versus the S&P Index
  • Relative market valuations of each Solar Energy sector
  • Current financial data for each company in the index  
 solar_energy_stock_index_q2_2017.pdf
(799k pdf)

This data is included with the permission of Lincoln International. For more information, you may contact John McManus (jmcman@optonline.net) or the Association Office.


 


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Solar Energy DealReader: Q2 2017

Lincoln International is pleased to present you with the latest DealReader from our Global Renewable Energy Industry Group. This will provide you with:

  • Q2 2017 deal volume comparison by total transactions, deal type, geography, and target company sector
  • Recent Solar Energy transaction announcements
  • Margin Performance in the Solar Energy Industry
 solar_dealreader_q2_2017.pdf
(775k pdf)

This data is included with the permission of Lincoln International. For more information, you may contact John McManus (jmcman@optonline.net) or the Association Office.


 


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EMS Stock Index: Q2 2017

Lincoln International is pleased to present you with the latest EMS Stock Index from our Global Electronics Industry Group. This report will provide you with:

  • Quarterly performance of the EMS Stock Index versus the S&P Index
  • Relative market valuations of each EMS sector
  • Current financial data for each company in the index
 ems_stock_index_q2_2017.pdf
(388k pdf)

This data is included with the permission of Lincoln International. For more information, you may contact John McManus (jmcman@optonline.net) or the Association Office.


 


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EMS DealReader: Q2 2017

Lincoln International is pleased to present you with the latest EMS DealReader from our Global Electronics Industry Group. This will provide you with:

  • Q2 2017 deal volume comparison by total transactions, deal type, geography and size
  • Recent EMS transaction announcements
  • Margin performance in the EMS industry
 ems_dealreader_q2_2017.pdf
(607k pdf)

This data is included with the permission of Lincoln International. For more information, you may contact John McManus (jmcman@optonline.net) or the Association Office.


 


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Events of Interest - Mark Your Calendar
Aug 28, 2017 - Aug 29, 2017
Ballerup
Denmark
Aug 29, 2017 - Sep 1, 2017
Tinos
Greece
Sep 4, 2017 - Sep 6, 2017
Pilsen
Czech Republic
Sep 5, 2017 - Sep 6, 2017
Nairobi
Kenya
Sep 7, 2017 - Sep 8, 2017
Shanghai
China
Sep 11, 2017 - Sep 14, 2017
Warsaw
Poland
Sep 12, 2017 - Sep 14, 2017
Novi, Michigan
Sep 18, 2017 - Sep 19, 2017
Catania
Italy
Sep 19, 2017 - Sep 21, 2017
Gliwice
Poland
Sep 27, 2017 - Sep 29, 2017
COEX Hall A
Korea
Sep 29, 2017 - Oct 5, 2017
Cincinnati, OH
Oct 1, 2017 - Oct 5, 2017
Cincinnati, OH
Oct 4, 2017 - Oct 6, 2017
Nice
France
Oct 9, 2017 - Oct 11, 2017
Messe Stuttgart
Germany
Oct 9, 2017 - Oct 11, 2017
Messe Stuttgart
Germany
Oct 12, 2017 - Oct 13, 2017
Riga
Latvia
Oct 19, 2017 - Oct 21, 2017
NOVI SAD
REPUBLIC OF SERBIA
Oct 22, 2017 - Oct 26, 2017
Gold Coast Convention & Exhibition Centre
Broadbeach, Queensland,
Australia
Oct 23, 2017 - Oct 24, 2017
Germany
Oct 24, 2017 - Oct 26, 2017
Sands Expo & Convention Centre
Marina Bay Sands
Singapore
Oct 25, 2017 - Oct 26, 2017
Oct 30, 2017 - Nov 1, 2017
Santa Ana Pueblo, NM
Oct 31, 2017 - Nov 1, 2017
Arlington, VA
Nov 2, 2017 - Nov 3, 2017
Hyatt Regency
Bethesda, MD
Nov 5, 2017 - Nov 8, 2017
San Diego, CA
Nov 7, 2017 - Nov 8, 2017
Aalborg
Denmark
Nov 7, 2017 - Nov 9, 2017
Long Beach Convention Center
Long Beach, California
Nov 13, 2017 - Nov 14, 2017
Spain
Nov 13, 2017 - Nov 14, 2017
Tehran Shahr Exhibition Complex (Goftegoo Park), Golestan Hall
Tehran
Iran
Nov 14, 2017
Huntsville, AL
Nov 16, 2017 - Nov 17, 2017
Germany
Nov 19, 2017 - Nov 22, 2017
Nov 21, 2017 - Nov 22, 2017
Emagine Digital, an L+L Company
San Francisco, CA
United States
8589263313
Dec 4, 2017 - Dec 8, 2017
Puerto Varas
Chile
Dec 5, 2017 - Dec 6, 2017
Brisbane
Australia
Dec 13, 2017 - Dec 16, 2017
Pune
India
Jan 23, 2018 - Jan 24, 2018
Oulu
Finland
Jan 26, 2018
Leuven
Belgium
Jan 29, 2018 - Feb 1, 2018
Germany
Feb 8, 2018 - Feb 9, 2018
Switzerland
Feb 27, 2018 - Mar 1, 2018
Aschaffenburg
Germany
Feb 28, 2018 - Mar 2, 2018
Tokyo
Japan
Mar 4, 2018 - Mar 8, 2018
Henry B. Gonzalez Convention Center
San Antonio, TX
Mar 12, 2018 - Mar 14, 2018
Calgary, Alberta
Canada
Mar 12, 2018 - Mar 13, 2018
Italy
Mar 19, 2018 - Mar 23, 2018
Omni Hotel
Fort Worth, TX
Mar 20, 2018 - Mar 22, 2018
Stuttgart
Germany
Mar 26, 2018 - Mar 29, 2018
Fort Lauderdale, FL
Apr 17, 2018 - Apr 19, 2018
Liverpool
United Kingdom
Apr 23, 2018 - Apr 25, 2018
Greenville, SC
May 6, 2018 - May 8, 2018
Memphis, TN
May 15, 2018 - May 17, 2018
Hanover
Germany
May 24, 2018 - May 26, 2018
Shenzhen
China
Jun 5, 2018 - Jun 7, 2018
Nuremberg
Germany
Jun 13, 2018 - Jun 15, 2018
Long Beach, CA
Jun 25, 2018 - Jun 28, 2018
Charlotte, NC
Jun 25, 2018 - Jun 28, 2018
Padova
Italy
Jul 9, 2018 - Jul 10, 2018
London
United Kingdom
Jul 16, 2018 - Jul 18, 2018
Beijing
China
Aug 26, 2018 - Aug 30, 2018
Budapest
Hungary
Sep 17, 2018 - Sep 21, 2018
Latvia
Sep 23, 2018 - Sep 27, 2018
Portland, OR
Mar 4, 2019 - Mar 8, 2019
Jacksonville, FL
Mar 17, 2019 - Mar 21, 2019
Anaheim, CA
Apr 28, 2019 - May 1, 2019
Bloomington, MN
May 11, 2019 - May 15, 2019
San Diego, CA
Sep 29, 2019 - Oct 3, 2019
Baltimore, MD

If you know of any upcoming conferences or events of interest to
PSMA members please notify the Association office.

e-mail: Power@PSMA.com
Fax: 973-543-6207

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