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It’s not too early for you to be making plans to attend. So mark your calendar now and be sure to include APEC2012 in the new fiscal year budget! Next year’s conference will feature a solid technical program with over 300 peer-review papers, exceptional plenary sessions, outstanding professional education seminars, a host of practical special presentation sessions plus the ever-popular “rap” sessions and micro-mouse competition. APEC 2012 will also feature a lively exhibit environment where companies will display their latest in power electronics hardware, software, services and publications. If you are involved in any aspect of the power electronics business, you should plan now to attend APEC 2012. APEC focuses on both the practical and applied aspects of the power electronics business. This is not just a conference for designers and engineers; APEC has something of interest for anyone involved in power electronics:
For complete information and to register to attend, please visit www.apec-conf.org.
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You Are Invited To The 2011 PSMA |
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The Board of Directors relies on the inputs generated at the annual planning meetings to identify, consider and select programs for the following year that will bring benefits to the PSMA membership. For example, the Power Technology Roadmap Workshops, the Energy Efficiency Database and other significant projects resulted from initiatives generated at previous planning meetings. The meeting will begin with a brief review of the accomplishments and a summary of ongoing activities by PSMA Chairman Dusty Becker which will be followed by an open forum and discussion of possible special projects, initiatives and priorities for the coming year. All members are invited to provide inputs and suggestions even if they cannot attend the meeting in person. Please email your suggestions to power@psma.com and they will be considered and included in the discussions. In the coming months, the Marketing Committee will summarize the results from the meeting and prepare a survey of members to solicit their priorities on which of the projects and initiatives should be the focus for the next year. Members and guests are invited to remain after the Planning Meeting to participate in the September meeting of the Board of Directors, which will take place immediately following. On the following day, Sunday September 25 the APEC 2012 Technical Program Committee will meet to select the technical papers and organize the technical sessions, rap sessions, special presentation sessions and professional education seminars for presentation at APEC 2012 that will February 5 thru 9 at the Disney Coronado Springs Resort in Orlando.
PSMA is a co-sponsor of APEC and all members are invited to participate in this important activity. For information on becoming a reviewer for submitted abstracts and digests, please register and sign-up on the APEC 2012 web site – www.apec-conf.org. If you do plan to attend these meetings, we have arranged for a group room rate at the Hilton Orlando Lake Buena Vista (ask for the APE group rate) - but make your reservations early. We look forward to seeing many of you at these important meetings and receiving your suggestions and recommendations for the activities of PSMA for the coming months. |
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The Marketing Committee meeting, since it included a luncheon, was well attended as usual. Frank Cirolia, Committee Co-Chair reviewed the activities over the past year and led the discussion of possible activities for the coming year. The past year was a very busy one – the committee issued several press releases, surveyed the membership on priorities for the coming year, set the prices for the latest PSMA publications and updated the slide presentation which introduces PSMA and explains the benefits of membership. The revised presentation has been added to the PSMA web site and a condensed version was shown before the APEC Plenary Session. The Magnetics Committee met and reviewed recent activities, which included a second reprint of the classic text on magnetic “Soft Ferrites” by Eric Snelling and plans for a second reprint of Nathan Grossner’s “Transformers for Electronic Circuits”. Co-chair Ed Herbert reported on the status of the Core Loss Project being conducted at Dartmouth University. The committee members discussed possible projects for the current year that would provide benefits to the membership and to the industry.
The Packaging Committee meeting was well attended and members had a lot to discuss, including the successful PwrSoC 2010 conference which was held in Cork, Ireland last fall and the Special Presentation Session at APEC 2011titled “Packaging Challenges with More Electric Vehicles”. Plans for the coming year were discussed including a proposed PwrSoC Workshop in 2012 and some possible Special Study projects.
The Energy Efficiency and Alternative Energy Committees each met and reviewed their accomplishments during the past year. The Energy Efficiency Database on the PSMA web site continues to attract visits from the membership and in the industry. It is being updated on a regular basis. The committee also discussed a possible workshop with participation from EPRI on “Grid to Load”. The Alternative Energy Committee discussed final plans for the Special Presentation at APEC 2011 titled “Power Electronics and Alternative Energy” and planning for APEC 2012.
The Nanotechnology Committee, co-chaired by Chuck Mullett and Tony Laviano, had a successful year, which included putting together another Special Presentation Session for APEC 2011 titled “Nanotechnology: Enabling the Next Generation of Power Electronics”. The committee discussed a Special Project to update Nano 100 – which is currently available in the PSMA web site as an e-learning course and to develop a Nano 200 as an e-learning course.
The newly reestablished Capacitor Committee had a meeting during APEC that was co-chaired by Ian Clelland and Laird Macomber. The committee was successful in creating a Special Presentation Session for APEC 2011 titled “Capacitors in Power Electronics” and the committee provided input to the Power Technology Roadmap. They plan to continue their monthly meetings and discussed plans for the coming year. The Power Technology Roadmap Committee met to discuss their successful report and to consider the efforts necessary to publish the next report which is tentatively scheduled for 2013. The 2011 Power Technology Roadmap report is the most comprehensive to date and was a major undertaking that involved significant effort and focus by the co-chairs and many individuals over the past year.
A complete listing of all PSMA committees can be found on the PSMA web site. All of the committees manage their own Technical Forums on psma.com which provide information on their current activities, upcoming industry events and resources, including links to useful web sites. You are encouraged to join a committee and get involved in their activities. Most committees meet about once a month for about one hour by teleconference. View a list of upcoming committee meetings. You are welcome to attend a committee meeting before making a decision to join the group. If you are interested in attending one of the meetings, please contact the Association Office for call-in information. |
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 Ernie Parker is Director of Technology for the Power Solutions organization within Crane Aerospace & Electronics. Through a multi-site team of principal engineers he is responsible for research & development, IP, technology roadmaps, and technical oversight of development programs. Ernie’s involvement with power electronics began accidentally in 1980 with an assignment at his first post graduation employer, Sundstrand Aviation. He has been involved in power electronics for commercial aerospace and military applications ever since, remaining in a design role through most of the 80’s before transitioning into engineering management. While Ernie has only been involved in PSMA for a few years, he has come to greatly appreciate the relationships and industry knowledge that this involvement has provided. He is co-chair of the Packaging Committee and active on the Nanotechnology and Technology Roadmap committees, including co-chairing the special presentation sessions on Packaging and Nanotechnology at APEC 2011 that were organized by these committees. He has personally enjoyed this involvement and the people that it has given him the opportunity to meet, and believes he can bring value to PSMA from his experience and knowledge of the harsh environment, high reliability applications of power electronics that has defined his career. Ernie wants to help PSMA continue to thrive and adapt to the changing environment so as to be increasingly relevant to the power electronics industry. Provided by Ernie Parker,  Eric Persson is a 30-year veteran of the power electronic industry. He graduated from the University of Minnesota with a BSEE in 1981, and took additional graduate courses in power electronics and magnetics. After several years at Telex, 3M and a startup company, he formed a design consultancy business specializing in analog and power electronics. During this time, he designed numerous power supplies, converters, motor drives and inverters ranging from small implantable medical devices to 75 kW arc power supplies. Eric joined International Rectifier in 2000 as a design manager for power IC applications, and then moved to Field Applications Engineering and to management roles. He is currently the Executive Director of Field Applications Engineering. He has remained active in IEEE, as Section Executive officer in the ‘90s, and more recently as an officer of the Twin Cities Section PELS chapter and was co-chair of the Professional Education Seminars for APEC 2011. Eric has presented more than 60 tutorials and papers at conferences including APEC, PESC, IAS, IECON, PCIM Europe, HFPC, and EPE among others. He is also a regular lecturer presenting short courses and tutorials at University of Wisconsin in Madison, the University of Minnesota and Purdue University. Eric holds 12 patents, and is a recipient of the IEEE Third Millennium Medal. Eric is pleased to serve on the PSMA Board of Directors to help support the power supply industry on which we all depend. Provided by Eric Persson, Executive Director, |
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 About Our Members |
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A recognized leader in quality and reliability, Magnetics’ products are manufactured to conform to international standards for electrical, dimensional and visual requirements. In addition, Magnetics' products comply with global environmental initiatives.
Magnetics® Powder Core products, Kool Mu®, MPP, High Flux and XFLUX® materials, are distributed air gap cores that are primarily used in power inductor applications, specifically in switched-mode power supply (SMPS) output filters, also known as DC inductors. Other power applications include differential inductors, boost inductors, buck inductors, and flyback transformers. Notable characteristics of Magnetics’ powder core materials are high resistivity, low hysteresis and eddy current losses and excellent inductance stability under both DC and AC conditions. In addition, Magnetics powder core materials are not pressed with an organic binder; therefore, there is no thermal aging. Magnetics powder cores are available in a variety of shapes including toroids, E cores, U cores and blocks.
Magnetics® Soft Ferrite Cores are commonly referred to as manganese zinc ferrites. They have a low coercivity and are also known as soft magnetic ferrites. Because of their comparatively low losses at high frequencies, they are extensively used in switched-mode power supply (SMPS) and radio frequency (RF) transformers and inductors. Ferrite cores for the high frequency power supply and high quality communication markets are produced in a variety of shapes and sizes for inductors, pulse transformers, high frequency transformers, and noise filters. Notable characteristics of Magnetics ferrite materials are high permeability, good temperature properties, and low disaccommodation. Magnetics offers nine materials. The materials range in permeability from 900µ to 10,000µ and are available in a variety of geometries including toroids, shapes and pot cores.
Magnetics® Tape Wound Cores are often key components of complicated electronic circuitry found in high reliability applications including military, aerospace, communications, down hole drilling, and nuclear reactors. Tape wound cores and bobbin cores (miniature tape wound cores) are made from thin strips of high permeability nickel-iron alloys such as Square Orthonol®, Square Permalloy 80, Round Permalloy, Supermalloy, and 48 Alloy, or grain oriented silicon iron known as Magnesil®. Supermendur, a cobalt-iron alloy is also available by special order. Specific applications for tape wound cores include magnetic amplifiers (MagAmps), converter and inverter transformers, current transformers, and static magnetic devices. For more information on Magnetics and our products, please visit www.mag-inc.com. Provided by Kimberly Holcombe,
  elebrating 60 years in business, Micrometals Inc. is leading the powder core market with the widest selections shapes, sizes and materials available to the electronics industry. Micrometals, headquartered in Anaheim, California, is a privately held corporation with 2 factories in the United States, 2 factories in China, offering application engineering and technical support in North America and China as well as stocking warehouses located in Germany and Hong Kong.
In 2010, Micrometals acquired the Arnold Powder Core business unit from Arnold Magnetic Technologies. Micrometals formed an autonomous division with this acquisition and renamed the group Micrometals Arnold Powder Cores. This purchase added a second China factory, a sales and logistics office in Hong Kong and a greatly expanded selection of material options. Primarily an engineering driven company, Micrometals is committed to supplying consistent high quality, low cost powder cores. As new technologies emerge in the electronics industry, new shapes and materials are developed to meet the changing demands. Micrometals cores are organized into 4 product groups; Radio Frequency, Power Conversion, 200C Series™ High Temperature and MicroCubes. Micrometals Arnold Powder Cores are organized into 5 material groups; Super-MSS™ Sendust, Molypermalloy, FluxSan™, Hi-Flux™ and Optilloy™
Powder cores are made from discrete particles of ferromagnetic powder. Prior to being formed into a core, the particles are covered in a thin layer of electrically insulated material to ensure electrical isolation of each particle. The particles are then compacted under high pressure to form the core geometry. The electrical insulation between particles enables the materials to be used at high frequency. The insulation also forms a distributed air gap throughout the core material, giving the material the ability to maintain inductance linearity with a DC biasing field. These soft magnetic products are most commonly used in inductor and choke applications. Questions about samples, price and availability of all products above can be directed to Sales@micrometals.com Provided by Joseph Barbeito, Editors Note: We would like to feature your company in a future issue of the Update. Please contact the Association Office for information about how to submit an article for consideration. |
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Cooper Bussmann
Espey Mfg. & Electronics Corp
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 recent article in The New York Times, "Atop TV Sets, a Power Drain That Runs Nonstop" by Elisabeth Rosenthal, created a mild uproar among the energy efficiency hawks. The article clearly identified that these little boxes that sit on the top of a TV (or on the bottom shelf) can be a big drain on the power grid and on consumer utility bills, mainly because they never stop working. Even when the TV set is switched off, these boxes generally work at full power drain because there is no mandated requirement for power savings or willingness from the "Set Top Box" manufacturer to deploy sophisticated hardware/software to put them in a "sleep mode". There is no power management scheme integrated in the device to improve energy efficiency. Most users are unaware of the situation that these small devices consume a significant amount of power that increases their electricity bills.
The article quotes a recent study that found: "...One high-definition DVR and one high-definition cable box use an average of 446 kilowatt hours a year, about 10 percent more than for a 21-cubic foot energy-efficient (Energy Star) refrigerator,...These set-top boxes are energy hogs primarily because their drivers, tuners and other components are generally running full tilt, or nearly so, 24 hours a day, even when not in active use...". There are technical options available to shut down or put the Set Top Box in a sleep mode when not in use - but cable operators state that "...customers will not tolerate the time it takes to reboot the system once the system has been shut down or put to sleep..." The premise that customers will not tolerate any minor immediate inconvenience has been an industry's "slogan" for many years. There may be some truth to that paradigm, because nobody likes inconvenience or perceived inconvenience and many power saving devices do cause some inconvenience: A computer in a sleep mode takes some amount of time to wake up before becoming fully functional. An efficient compact fluorescent light (CFL) bulb is not as bright at turn on as the old incandescent bulb. Besides the “warm up” period these bulbs have an additional inconvenience of disposal, due to the mercury contamination. The emerging LED light bulb technology is highly efficient in its energy use, but at the present time too expensive for general consumer use. Most new power saving or energy efficient technologies do bring with them a certain level of inconvenience. For this reason, public education is important. Consumers should be informed that a minor change in habit or convenience can have long term benefits. For example, using an efficient Set Top Box may save the consumer about $10/month. This may not seem to be a major amount, especially when one may have to pay a slightly higher price for an efficient Set Top Box and perhaps wait for the TV set to switch on. The consumer has already shown that they are already willing to pay a small premium for an “Energy Star” rated appliance. And over a reasonable time period, the savings in electric utility bills will pay not only the premium but also the price for the Set Top Box itself. A small, short term inconvenience, for a long term gain. Moreover, there are already technologies available that will not only improve efficiency but also reduce the wait state. However, I have observed that in any new technology argument, there are two competing groups: regulators (mostly engineers and environmentalists) who are aware of technical solutions and what is advantageous for the environment and the product manufactures who claim to “understand” their customers. Typically many manufacturers will initially resist any new technology that improves efficiency by saying either it is too expensive or too inconvenient. Actual consumer inputs is rarely regarded or taken into account. For example, Ms. Rosenthal's article mentions opinions from well known scientists and engineers (e.g. Noah Horowitz of NRDC) and Set Top Box manufacturers, but not a word from what the users' want or prefer. There is no input from the consumers. In my opinion, given the facts and the benefits of "value proposition for energy efficiency", most consumers will choose energy efficient systems for the long term, even though they may be a bit more costly and inconvenient in the short term. This has been the demonstrated trend in auto safety, fuel efficiency, and appliances. For engineers to succeed in advancing new green technologies, it is important for them to examine their implementation from the users' acceptance as much as their technical feasibility. Any new energy efficiency technology is often initially perceived as inconvenient or expensive and met with resistance from the manufacturers. There are issues of habit, inertia, existing product lines and an inherent resistance to change. With regards to the Set Top Box situation, any consumer resistance or concerns can be overcome first by education, cost savings and perhaps by establishment of government standards for efficiency – an Energy Star designation for Set Top Boxes.
The views expressed in this article are solely of Mohan Mankikar. They do not represent the views of PSMA. Mohan Mankikar has been a part of the power supply industry for over twenty five years. An active member of the PSMA since its founding, he had been a board member of the PSMA and currently serves on the Advisory Council. |
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The Next Phase Of Power Conversion - |
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 n power conversion, smaller size and resulting higher density has driven product development for the past 30 years as shown in Figure 3. Achieving higher power density in front end, ac-dc power conversion stages has been difficult, complicated and costly; often at the sacrifice of efficiency. However, 600 V GaN diodes and transistors that switch efficiently at high frequencies enable the size reduction trend to continue, without sacrificing efficiency.
The potential of AlGaN/GaN devices to improve the density/efficiency trade-off depends upon a part of the same voltage rating and equivalent RDS (ON) having lower switching losses. Achieving this level of performance requires more than just low reverse leakage and low nominal resistance under static conditions. To have lower switching losses, the devices must have minimal internal capacitances so that it switches fast. The best and most accurate way to validate the performance of power semiconductor device under dynamic switching conditions is to measure its performance in a real power conversion circuit such as the boost circuit used to obtain the results shown in figure 4.
This high efficiency was obtained by reducing the switching losses by high dv/dt transitions that depend upon the trends described in the last newsletter. These transitions are in fact faster than those obtained using any SiC devices to date. SiC devices may have their place in the future as well as GaN but the range of voltages over which SiC will dominate is predicted to be much narrower than the range over which GaN devices will dominate as recent product introductions over the range of 40 volt to 600 volt would prove.
Parasitic capacitances, inductances and package pin outs have been designed to minimized parasitic inductance and capacitance within the EZ-GaNTM devices, in order to not impede their fast switching speeds as shown above. The EZ-GaN HEMT internally contains two devices which are connected in a cascode configuration. EZ-GaNTM is a registered trademark of Transphorm Inc.
Editor's note: :This article is an excerpt from a briefing about GaN power devices by Carl Blake. We welcome articles from our members. Please contact the Association Office (power@psma.com) if you would like to contribute an article.
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Miniature Integrated Power Converters Continue To Take |
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 his past decade saw the development of two emerging miniature integrated power converter products, The Power Supply in a Package, or PSiP, and the Power Supply on a Chip, or PwrSoC. The PSiPs first made their debut in 2005. By 2010, the market had grown to the point that there were over 70 product introductions from 15 companies out of a field of approximately 20 players.
Simply Stated but Challenging to Effect As many of you already know, PSiP is a packaging solution with the complete circuit, consisting of several components, housed within a single package. The challenge comes from the variety of components required to make up the PSiP. At the highest level of integration, a typical PSiP includes a single-chip Power integrated circuit (IC) semiconductor, power inductor (L) and capacitor (C) passives, and small signal passives. The Power IC consists of control, monitoring, protection, and status reporting functions along with at least a couple of power transistors. Each of these components comes from very diverse sources: the semiconductor supplier, the power passive suppliers — with the power inductor (L) often coming from a source other than the power capacitor (C) supplier. This has created a technical wall between the power passives and the semiconductor processes. In fact, none of the many low-density (below 0.001 amperes/mm3) power supply converter manufacturers has attempted to enter the high-density market. PSMA Saw the Possibilities for These Products Very Early Members of PSMA, under the joint sponsorship of the Packaging Technical Committee and the Semiconductor Technical Committee, started looking at these devices in 2007. As the result of this effort, a Special Project was developed and approved by the PSMA Board of Directors and a Study was commissioned. The result were the publication of two PSMA reports - in 2008, PSMA released a technical marketing study, and in 2009 released a benchmark packaging analysis of six available PSiP devices, along with a technical marketing update. There is Plenty of Opportunity Yet for Late Entries As new players have entered the market, we have seen a variety of methods used to merge these two component categories into a single product. The challenges and difficulties are clearly visible when examining the number of failures that occurred in the effort to introduce products to the market. Of the 19 top suppliers participating today, less than six have appropriate technology and kill strength to be a sustainable PSiP producer. In the past, the power supply manufacturer played the role of designer/assembler for power supplies. However, at output currents below 15 amperes, the semiconductor suppliers now dominate the power supply content. Only five of the top-19 suppliers are power supply companies, with the highest current density PSiPs now coming from the semiconductor suppliers. The 2011 roll call sees fewer PSiP product introductions while players quietly grab more market share. The market drivers fueling the PSiP growth are 1) the need for ease of design-in and 2) the need for increased power density. This year and beyond… We saw the first PSiP digital-controlled dc-dc converter introduced this year. The next step for the PSiP will be further density increase and further cost reduction. Today, there is a wide gap between the highest and lowest market prices in $/ampere which may be due mainly to marketing methods and the applications targeted. We see this moving toward less diverse pricing in the future, especially as high-volume sales become more prevalent. The growth opportunity for the miniature integrated power converters will far exceed the market for printed circuit (PC) board power supply products such as Bricks, point-of-load (POL) power supply boards, and voltage regulator modules (VRMs). Besides picking up a major portion of low current (below 25 amperes) POLs, they will also pick up a respectable portion of the over-30-times-larger high-end “down” market now served by various ICs, power MOSFETs, and power ICs. Also, the market will develop far beyond just the brick and POL due to the wide variety of PSiP and PwrSoC circuits. Already, we see new circuits that include battery chargers, LED Drivers, and RS485 and RS422 transceivers. The circuit portfolios will continue to increase, especially with the market leaders and the niche players.
The next step in integration is the Power Supply on a Chip, or PwrSoC. The market has yet to see this product, although there is a fair chance of a product announcement later this year. Key to this entry is the ability to create the power inductor on a semiconductor substrate. Although there are only a few commercial companies having the ability to manufacture the power inductor on silicon, there are a number of companies and universities deeply engaged in the development of a semiconductor-processed power inductor. Interest continues to be high, and the development efforts continue with technologists convening every two years to report their progress and compare notes. Business projections for the PSiP and PwrSoC are presently quite optimistic growing respectively in the two and three-digit percentage points annually. 1 “PowerSoC 2008 International Workshop on Power Supply on Chip,” held in Cork Ireland, September 2008; “PowerSoC 2010 International Workshop on Power Supply on Chip,” held in Cork Ireland, October 2010 2 Market Report: The PSiP & PwrSoC - The Ultimate Power Density Challenge 2008 – 2011, by Arnold Alderman and Ada Cheng, published by Anagenesis, Inc., May, 2011
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Get More From Your PSMA Membership – Join |
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Your company gets a listing on the PSMA web site with a hyperlink directly to your company web site. In addition, your company has an invitation to provide a Spotlight Banner to showcase its latest product on the PSMA Home Page Your company also receives free or discounted copies of PSMA publications and reports, An important membership benefit is the opportunity to join and participate in one or more of the PSMA Technical Committees. Participating in one or more committees is the best way to increase the benefits from your company and your personal PSMA membership. People involved in PSMA Technical Committees all agree that their investment returns multiple benefits that surpass the time spent participating – both for their company and for their own careers. Just ask someone who is a committee member. The committee provides the opportunity to network with knowledgeable people who are influencing the power sources industry. You are encouraged to join a committee and get involved in their activities. Most committees meet about once a month for about one hour by teleconference. You are welcome to attend a committee meeting before making a decision to join the group. If you are interested in attending one of the meetings, please contact the Association Office for call-in information.
This is an open invitation to participate in or join any committee. Bring your experience, interest and enthusiasm. Currently PSMA has the following committees:
Your participation will contribute added value to the subject and enhance your own knowledge. |
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If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and
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our members of the PSMA Board of Directors are elected at the Annual Meeting held every year during the APEC conference. Each Director serves a three year term and is eligible to be reelected for one additional term.
agnetics® is a leading world supplier of precision soft magnetic components and materials to the electronics industry. We specialize in research, design and production of a broad range of high-quality powder cores, ferrite cores and tape wound cores for applications such as chokes, inductors, filter, transformers and power supply components for use in alternative energy, telecommunications, aerospace, military, computer, medical and other electronics systems. 
SMA membership provides many benefits for you and your company. It gives you personally the opportunity to meet, network and interact with your counterparts in other companies on an ongoing basis. It also provides an opportunity to be involved with the planning and managing of APEC, as well as giving you and your colleagues a discount on registration fees for attending APEC.
