| Agency (an Agency can be National, International, or a Non-Government Organization or NGO): IPC |
| IPC-7093A - Start year: 2020 Location: Global - Global Description: Design and Assembly Process Implementation for Bottom Termination Components (BTCs) |
| Notes: The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs. |
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· Assembly Process |
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| Agency (an Agency can be National, International, or a Non-Government Organization or NGO): IPC |
| IPC-7095E Location: Global - Global Description: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs) |
| Notes: -21F Ball Grid Array Task Group Chair Robert Rowland, Axiom Electronics, LLC Staff Liaison Andres Ojalill Committee Charter This task group is responsible for the maintenance and further development of IPC-7095, Design and Assembly Process Implementation for BGAs. This document covers the characteristics for all elements of developing a cohesive product that uses BGA packages as components in the electronic assembly. In addition, there are recommendations for void acceptability and defect analysis. |
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· Assembly Process |
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