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For copies of Standards, please contact the appropriate agency. PSMA does not provide copies of standards.
IPC

As an association and as an industry, we have many milestones and achievements to celebrate. On these pages, read about the vision of the six printed circuit board manufacturers that came together to create the Institute of Printed Circuits in the fall of 1957. Since that day, IPC has been dedicated to removing supply chain obstacles, creating industry standards, and supporting the advancement of the industry.

No matter what changes lay ahead, the strength of our volunteer leadership and commitment to serve the needs of our membership will continue to be the hallmark of IPC for many years to come.

Locations: Global - Global
 
2021-09-14
Description:

IPC Status of Standardization Contribute to IPC Standards by Submitting Your Comments 

Individuals or companies are invited to submit a comment to IPC on standards improvement via the Standards Improvement form, found on the right. The purpose of this form is to provide the appropriate technical committee of IPC with input from the industry regarding recommendations for published standards or work in progress on new or revisions of standards being worked on. Complete the form on the right and just click on the submit button, a tech staff person will be in touch if there are any questions.

Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, design, manufacture of boards and finished assemblies. We are continually looking for ways to improve current standards but we are also looking for what might be that next standard the industry. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry. Once accepted a project is established and the great work of the industry committees starts. 

IPC encourages and welcomes individuals from the global electronics industry to submit their ideas or to request to be added to a ballot group as part of the standards development process. 

If you are located in Asia Pacific Market - 

IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Harryhan@ipc.org  Harry will contact you and review your comments to understand your interest and follow through with next steps. 

IPC Standardization Procedures - provides processes, structure and ANSI policy in developing standards for the electronics industry 

Status of Standardization

Published Standards

IPC-4552B May 2021  Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards

J-STD-001HS May 2021  Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

Translations

No entries available.

Proposed Standard for Ballot

IPC-1401A  Corporate Social Responsibility Management System Standard

IPC-1791B  Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2231A  DFX Guidelines

IPC-4412C  Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

IPC-4592     Requirements for Printed Electronics Functional Dielectric Materials

IPC-6013E  Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7526A  Stencil and Misprinted Board Cleaning Handbook

IPC-9121A  Troubleshooting Printed Board Fabrication Processes

IPC-9709A  Guidelines for Acoustic Emission Measurement Method During Mechanical Testing

Final Draft for Industry Review

IPC-6018D  Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

IPC-7091A  Design and Assembly Process Implementation of 3-D Components

IPC-7525C  Stencil Design Guidelines

IPC-9701B  Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

IPC-A-640A        Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies

IPC-D-640A        Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

IPC-T-50N  Terms and Definitions for Interconnecting and Packaging Electronic Circuits

J-STD-003D        Solderability Tests for Printed Boards 

J-STD-004C Requirements for Soldering Fluxes

Working Draft

IPC-1402               Standard for Green Cleaners Used in Electronics Manufacturing

IPC-1753A            Laboratory Report Standard

IPC-1792               Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain

IPC-2221C            Generic Standard on Printed Board Design

IPC-2228               Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards

IPC-2292A            Design Standard for Printed Electronics on Flexible Substrates

IPC-4202C            Flexible Base Dielectrics for Use in Flexible Printed Wiring 

IPC-4555               Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards

IPC-4922               Requirements for Sintering Materials for Electronics Assembly

IPC-5262               Design, Critical Process and Acceptance Requirements for Polymeric Applications

IPC-6012EA         Automotive Applications Addendum to IPC-6012E

IPC-6012F            Qualification and Performance Specification for Rigid Printed Boards

IPC-6013EM        Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7077               Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly

IPC-7092A            Design and Assembly Process Implementation for Embedded Circuitry and Devices

IPC-7251               Generic Requirements for Through-Hole Design and Land Pattern Standard

IPC-7352               Generic Guideline for Land Pattern Design

IPC-7621A            Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

IPC-8921A            Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires

IPC-8941               Guideline on Connections for E-Textiles

IPC-8952               Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles

IPC-8981               Quality and Reliability of E-Textiles Wearables

IPC-9202A            Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-9203A            Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

IPC-9242               Guidelines for Microsection Evaluation

IPC-A-610J           Acceptability of Electronic Assemblies

IPC-HDBK-005A Guide to Solder Paste Assessment

IPC-HDBK-9797  Handbook and Guide to Supplement IPC-9797

IPC-SM-840F      Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC/DAC-2552    International Standard for Model Based Design (MBD) for Digital Twin Factories

IPC/JPCA-8911   Requirements for Conductive Yarns for E-Textiles Applications

J-STD-001HA/A-610HA  Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

J-STD-001J           Requirements for Soldered Electrical and Electronic Assemblies

Project Approved

IPC-2201            Requirements for Physics of Failure Analysis for Components and Assemblies

IPC-2611A         Generic Requirements for Electronic Product Documentation

IPC-2612-1A     Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

IPC-2612A         Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

IPC-4557            Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications

IPC-7070            Guidelines for Printed Board Component Mounting

IPC-9205            Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes

IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A

2021-08-17
Description:

Status of Standardization

Published Standards

IPC-4552B            May 2021 Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards

J-STD-001HS        May 2021 Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

Translations

No entries available.

Proposed Standard for Ballot

IPC-1401A Corporate Social Responsibility Management System Standard

IPC-1791B Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2231A DFX Guidelines

IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

IPC-4592    Requirements for Printed Electronics Functional Dielectric Materials

IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7526A Stencil and Misprinted Board Cleaning Handbook

IPC-9121A Troubleshooting Printed Board Fabrication Processes

IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing

Final Draft for Industry Review

IPC-6018D Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

IPC-7091A Design and Assembly Process Implementation of 3-D Components

IPC-7525C Stencil Design Guidelines

IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

IPC-A-640A  Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies

IPC-D-640A  Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic Circuits

J-STD-003D   Solderability Tests for Printed Boards 

J-STD-004C   Requirements for Soldering Fluxes

Working Draft

IPC-1402    Standard for Green Cleaners Used in Electronics Manufacturing                              

IPC-1753A         Laboratory Report Standard

IPC-1792     Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain                               

IPC-2221C         Generic Standard on Printed Board Design

IPC-2228            Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards

IPC-2292A         Design Standard for Printed Electronics on Flexible Substrates

IPC-4202C         Flexible Base Dielectrics for Use in Flexible Printed Wiring 

IPC-4555            Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards

IPC-4922            Requirements for Sintering Materials for Electronics Assembly

IPC-5262            Design, Critical Process and Acceptance Requirements for Polymeric Applications

IPC-6012EA      Automotive Applications Addendum to IPC-6012E

IPC-6012F          Qualification and Performance Specification for Rigid Printed Boards

IPC-6013EM      Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7077            Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly

IPC-7092A         Design and Assembly Process Implementation for Embedded Circuitry and Devices

IPC-7251            Generic Requirements for Through-Hole Design and Land Pattern Standard

IPC-7352            Generic Guideline for Land Pattern Design

IPC-7621A         Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

IPC-8921A         Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires

IPC-8941            Guideline on Connections for E-Textiles

IPC-8952            Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles

IPC-8981            Quality and Reliability of E-Textiles Wearables

IPC-9202A         Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-9203A         Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

IPC-9242            Guidelines for Microsection Evaluation

IPC-A-610J        Acceptability of Electronic Assemblies

IPC-HDBK-005A      Guide to Solder Paste Assessment

IPC-HDBK-9797       Handbook and Guide to Supplement IPC-9797

IPC-SM-840F     Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC/DAC-2552  International Standard for Model Based Design (MBD) for Digital Twin Factories

IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications

J-STD-001HA/A-610HA       Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

J-STD-001J         Requirements for Soldered Electrical and Electronic Assemblies

Project Approved

IPC-2201          Requirements for Physics of Failure Analysis for Components and Assemblies

IPC-2611A       Generic Requirements for Electronic Product Documentation

IPC-2612-1A    Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

IPC-2612A       Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

IPC-4557          Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications

IPC-7070          Guidelines for Printed Board Component Mounting

IPC-9205          Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes

IPC-HDBK-001A      Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A

2021-08-10
Description:

Dear Colleagues:   

IPC has released several new standards to support the electronics manufacturing industry in building electronics better. Add these to your library of standards and stay ahead of the competition by using the most current standards from IPC.

Companion documents to IPC-J-STD-001H are available now:

IPC-HDBK-001H, Handbook and Guide to Supplement J-STD-001, provides guidance and supporting information for requirements found in the standard.

IPC-J-STD-001HS, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies, provides specific requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

If you use IPC-J-STD-001H you should be using IPC-A-610H, Acceptability of Electronic Assemblies.

Other documents that have been released:

IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

IPC-2591 V1.3, Connected Factory Exchange (CFX)

 

2021-08-03
Description:

IPC Report 2021 0803

Stay Competitive with IPC Standards

IPC has released several new standards to support the electronics manufacturing industry in building electronics better. Add these to your library of standards and stay ahead of the competition by using the most current standards from IPC.

Companion documents to IPC-J-STD-001H are available now:

IPC-HDBK-001H, Handbook and Guide to Supplement J-STD-001, provides guidance and supporting information for requirements found in the standard.

IPC-J-STD-001HS, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies, provides specific requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

If you use IPC-J-STD-001H you should be using IPC-A-610H, Acceptability of Electronic Assemblies.

Other documents that have been released:

IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

IPC-2591 V1.3, Connected Factory Exchange (CFX)

If you are missing any of the standards listed above, you can order online by visiting the IPC Online Store. Have questions about using a PO to order standards send them to contact.Us@ipc.org

Status of Standardization

Published Standards

IPC-4552B, May 2021, Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards

J-STD-001HS, May 2021, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

Translations

No entries available

Proposed Standard for Ballot

IPC-1791B, Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2231A, DFX Guidelines

IPC-4592, Requirements for Printed Electronics Functional Dielectric Materials

IPC-6013E, Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7526A, Stencil and Misprinted Board Cleaning Handbook

IPC-9121A, Troubleshooting Printed Board Fabrication Processes

IPC-9709A, Guidelines for Acoustic Emission Measurement Method During Mechanical Testing

 

Working Draft [there may duplicates in the list from the last list. AA

IPC-1402, Standard for Green Cleaners Used in Electronics Manufacturing

IPC-1753A, Laboratory Report Standard

IPC-1792, Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain

IPC-2221C Generic Standard on Printed Board Design

IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards

IPC-2292A Design Standard for Printed Electronics on Flexible Substrates

IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring 

IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

IPC-4555 Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards

IPC-4922 Requirements for Sintering Materials for Electronics Assembly

IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications

IPC-6012EA Automotive Applications Addendum to IPC-6012E

IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

IPC-6013EM ,Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly

IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices

IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard

IPC-7352 Generic Guideline for Land Pattern Design

IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

IPC-8941 Guideline on Connections for E-Textiles

IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

IPC-9242 Guidelines for Microsection Evaluation

IPC-A-610J Acceptability of Electronic Assemblies

IPC-HDBK-005A Guide to Solder Paste Assessment

IPC-HDBK-9797 Handbook and Guide to Supplement IPC-9797

IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC/DAC-2552 International Standard for Model Based Design (MBD) for Digital Twin Factories

IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications

J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies

Project Approved

IPC-2201, Requirements for Physics of Failure Analysis for Components and Assemblies

IPC-2611A, Generic Requirements for Electronic Product Documentation

IPC-2612-1A, Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

IPC-2612A, Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

IPC-4557, Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications

IPC-7070, Guidelines for Printed Board Component Mounting

IPC-9205, Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes

IPC-HDBK-001A, Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A

 

2021-07-20
Description:

Status of Standardization

Published Standards

J-STD-001HS-May 2021-Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

IPC-2591, Version 1.3-February 2021-Connected Factory Exchange (CFX)

IPC-6902-February 2021-Qualification and Performance Specifications for Printed Electronics on Flexible Substrates

IPC-9257-February 2021-Requirements for Electrical Testing of Flexible Printed Electronics

Translations

 

Proposed Standard for Ballot

IPC-1791B-Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2231A-DFX Guidelines

IPC-4552B-Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards

IPC-4592-Requirements for Printed Electronics Functional Dielectric Materials

IPC-6013E-Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7526A-Stencil and Misprinted Board Cleaning Handbook

IPC-9121A-Troubleshooting Printed Board Fabrication Processes

IPC-9709A-Guidelines for Acoustic Emission Measurement Method During Mechanical Testing

 

Final Draft for Industry Review

IPC-6018D-Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

IPC-7091A-Design and Assembly Process Implementation of 3-D Components

IPC-7525C-Stencil Design Guidelines

IPC-9701B-Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

IPC-A-640A-Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies

IPC-D-640A-Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

IPC-T-50N-Terms and Definitions for Interconnecting and Packaging Electronic Circuits

J-STD-003D-Solderability Tests for Printed Boards 

J-STD-004C-Requirements for Soldering Fluxes

Working Draft

IPC-1402-Standard for Green Cleaners Used in Electronics Manufacturing

IPC-1753A-Laboratory Report Standard

IPC-1792-Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain

IPC-2221C-Generic Standard on Printed Board Design

IPC-2228-Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards

IPC-2292A-Design Standard for Printed Electronics on Flexible Substrates

IPC-4202C-Flexible Base Dielectrics for Use in Flexible Printed Wiring 

IPC-4412C-Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

IPC-4555-Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards

IPC-4922-Requirements for Sintering Materials for Electronics Assembly

IPC-5262-Design, Critical Process and Acceptance Requirements for Polymeric Applications

IPC-6012EA-Automotive Applications Addendum to IPC-6012E

IPC-6012F-Qualification and Performance Specification for Rigid Printed Boards

IPC-6013EM-Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7077-Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly

IPC-7092A-Design and Assembly Process Implementation for Embedded Circuitry and Devices

IPC-7251-Generic Requirements for Through-Hole Design and Land Pattern Standard

IPC-7352-Generic Guideline for Land Pattern Design

IPC-7621A-Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

IPC-8921A-Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires

IPC-8941-Guideline on Connections for E-Textiles

IPC-8952-Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles

IPC-8981-Quality and Reliability of E-Textiles Wearables

IPC-9202A-Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-9203A-Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

IPC-9242-Guidelines for Microsection Evaluation

IPC-A-610J-Acceptability of Electronic Assemblies

IPC-HDBK-005A-Guide to Solder Paste Assessment

IPC-HDBK-9797-Handbook and Guide to Supplement IPC-9797

IPC-SM-840F-Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC/DAC-2552-International Standard for Model Based Design (MBD) for Digital Twin Factories

IPC/JPCA-8911-Requirements for Conductive Yarns for E-Textiles Applications

J-STD-001HA/A-610HA-Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

J-STD-001J-Requirements for Soldered Electrical and Electronic Assemblies

Project Approved

IPC-2201-Requirements for Physics of Failure Analysis for Components and Assemblies

IPC-2611A-Generic Requirements for Electronic Product Documentation

IPC-2612-1A-Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

IPC-2612A-Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

IPC-4557-Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications

IPC-7070-Guidelines for Printed Board Component Mounting

IPC-9205-Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes

IPC-HDBK-001A-Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A

2021-07-06
Description:

Published Standards

IPC-2591, Version 1.3-February 2021-Connected Factory Exchange (CFX)

IPC-6902-February 2021-Qualification and Performance Specifications for Printed Electronics on Flexible Substrates

IPC-9257-February 2021-Requirements for Electrical Testing of Flexible Printed Electronics

Proposed Standard for Ballot

IPC-1791B-Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2231A-DFX Guidelines

IPC-4552B-Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards

IPC-4592-Requirements for Printed Electronics Functional Dielectric Materials

IPC-6013E-Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7526A-Stencil and Misprinted Board Cleaning Handbook

IPC-9121A-Troubleshooting Printed Board Fabrication Processes

IPC-9709A-Guidelines for Acoustic Emission Measurement Method During Mechanical Testing

J-STD-001HS-Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

Final Draft for Industry Review

IPC-6018D-Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

IPC-7091A-Design and Assembly Process Implementation of 3-D Components

IPC-7525C-Stencil Design Guidelines

IPC-9701B-Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

IPC-A-640A-Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies

IPC-D-640A-Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

IPC-T-50N-Terms and Definitions for Interconnecting and Packaging Electronic Circuits

J-STD-003D-Solderability Tests for Printed Boards 

J-STD-004C-Requirements for Soldering Fluxes

Working Draft

IPC-1402-Standard for Green Cleaners Used in Electronics Manufacturing

IPC-1753A-Laboratory Report Standard

IPC-1792-Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain

IPC-2221C-Generic Standard on Printed Board Design

IPC-2228-Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards

IPC-2292A-Design Standard for Printed Electronics on Flexible Substrates

IPC-4202C-Flexible Base Dielectrics for Use in Flexible Printed Wiring 

IPC-4412C-Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

IPC-4555-Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards

IPC-4922-Requirements for Sintering Materials for Electronics Assembly

IPC-5262-Design, Critical Process and Acceptance Requirements for Polymeric Applications

IPC-6012EA-Automotive Applications Addendum to IPC-6012E

IPC-6012F-Qualification and Performance Specification for Rigid Printed Boards

IPC-6013EM-Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7077-Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly

IPC-7092A-Design and Assembly Process Implementation for Embedded Circuitry and Devices

IPC-7251-Generic Requirements for Through-Hole Design and Land Pattern Standard

IPC-7352-Generic Guideline for Land Pattern Design

IPC-7621A-Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

IPC-8921A-Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires

IPC-8941-Guideline on Connections for E-Textiles

IPC-8952-Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles

IPC-8981-Quality and Reliability of E-Textiles Wearables

IPC-9202A-Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-9203A-Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

IPC-9242-Guidelines for Microsection Evaluation

IPC-A-610J-Acceptability of Electronic Assemblies

IPC-HDBK-005A-Guide to Solder Paste Assessment

IPC-HDBK-9797-Handbook and Guide to Supplement IPC-9797

IPC-SM-840F-Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC/DAC-2552-International Standard for Model Based Design (MBD) for Digital Twin Factories

IPC/JPCA-8911-Requirements for Conductive Yarns for E-Textiles Applications

J-STD-001HA/A-610HA-Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

J-STD-001J-Requirements for Soldered Electrical and Electronic Assemblies

Project Approved

IPC-2201-Requirements for Physics of Failure Analysis for Components and Assemblies

IPC-2611A-Generic Requirements for Electronic Product Documentation

IPC-2612-1A-Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

IPC-2612A-Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

IPC-4557-Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications

IPC-7070-Guidelines for Printed Board Component Mounting

IPC-9205-Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes

IPC-HDBK-001A-Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision ABottom of Form

 

2021-06-29
Description:

IPC Status of Standardization

Contribute to IPC Standards by Submitting Your Comments 

Individuals or companies are invited to submit a comment to IPC on standards improvement via the Standards Improvement form, found on the right. The purpose of this form is to provide the appropriate technical committee of IPC with input from the industry regarding recommendations for published standards or work in progress on new or revisions of standards being worked on. Complete the form on the right and just click on the submit button, a tech staff person will be in touch if there are any questions.

Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, design, manufacture of boards and finished assemblies. We are continually looking for ways to improve current standards but we are also looking for what might be that next standard the industry. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry. Once accepted a project is established and the great work of the industry committees starts. 

IPC encourages and welcomes individuals from the global electronics industry to submit their ideas or to request to be added to a ballot group as part of the standards development process. 

If you are located in Asia Pacific Market - 

IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Harryhan@ipc.org  Harry will contact you and review your comments to understand your interest and follow through with next steps. 

IPC Standardization Procedures - provides processes, structure and ANSI policy in developing standards for the electronics industry 

Top of Form

Status of Standardization

Published Standards

IPC-6902

February 2021

Qualification and Performance Specifications for Printed Electronics on Flexible Substrates

IPC-9257

February 2021

Requirements for Electrical Testing of Flexible Printed Electronics

IPC-HDBK-001H

January 2021

Handbook and Guide to Supplement J-STD-001

Translations

No entries available.

Proposed Standard for Ballot

IPC-1791B

Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2231A

DFX Guidelines

IPC-4552B

Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards

IPC-4592

Requirements for Printed Electronics Functional Dielectric Materials

IPC-6013E

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7526A

Stencil and Misprinted Board Cleaning Handbook

IPC-9709A

Guidelines for Acoustic Emission Measurement Method During Mechanical Testing

J-STD-001HS

Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

 

Final Draft for Industry Review

IPC-6018D

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

IPC-7091A

Design and Assembly Process Implementation of 3-D Components

IPC-9701B

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

IPC-A-640A

Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies

IPC-D-640A

Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

IPC-T-50N

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

J-STD-003D

Solderability Tests for Printed Boards 

J-STD-004C

Requirements for Soldering Fluxes

Working Draft

IPC-2221C

Generic Standard on Printed Board Design

IPC-2292A

Design Standard for Printed Electronics on Flexible Substrates

IPC-4202C

Flexible Base Dielectrics for Use in Flexible Printed Wiring 

IPC-4412C

Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

IPC-4555

Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards

IPC-4922

Requirements for Sintering Materials for Electronics Assembly

IPC-5262

Design, Critical Process and Acceptance Requirements for Polymeric Applications

IPC-6012EA

Automotive Applications Addendum to IPC-6012E

IPC-6012F

Qualification and Performance Specification for Rigid Printed Boards

IPC-6013EM

Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7077

Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly

IPC-7092A

Design and Assembly Process Implementation for Embedded Circuitry and Devices

IPC-7251

Generic Requirements for Through-Hole Design and Land Pattern Standard

IPC-7352

Generic Guideline for Land Pattern Design

IPC-7621A

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

IPC-8921A

Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires

IPC-8941

Guideline on Connections for E-Textiles

IPC-8952

Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles

IPC-8981

Quality and Reliability of E-Textiles Wearables

IPC-A-610J

Acceptability of Electronic Assemblies

IPC-SM-840F

Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC/JPCA-8911

Requirements for Conductive Yarns for E-Textiles Applications

J-STD-001HA/A-610HA

Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

J-STD-001J

Requirements for Soldered Electrical and Electronic Assemblies

 

Project Approved

IPC-2201

Requirements for Physics of Failure Analysis for Components and Assemblies

IPC-2611A

Generic Requirements for Electronic Product Documentation

IPC-2612-1A

Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

IPC-4557

Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications

IPC-7070

Guidelines for Printed Board Component Mounting

IPC-9205

Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes

 

 

 

2021-06-22
Description:

Dear Colleagues:   

IPC has released several new standards to support the electronics manufacturing industry in building electronics better. Add these to your library of standards and stay ahead of the competition by using the most current standards from IPC.

Companion documents to IPC-J-STD-001H are available now:

IPC-HDBK-001H, Handbook and Guide to Supplement J-STD-001, provides guidance and supporting information for requirements found in the standard.

IPC-J-STD-001HS, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies, provides specific requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

If you use IPC-J-STD-001H you should be using IPC-A-610H, Acceptability of Electronic Assemblies.

Other documents that have been released:

IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

IPC-2591 V1.3, Connected Factory Exchange (CFX)

If you are missing any of the standards listed above, you can order online by visiting the IPC Online Store.

2021-06-08
Description:

Published Standards

IPC-2591, Version 1.3   February 2021  Connected Factory Exchange (CFX)

IPC-6902   February 2021    Qualification and Performance Specifications for Printed Electronics on Flexible Substrates

IPC-9257   February 2021    Requirements for Electrical Testing of Flexible Printed Electronics

IPC-HDBK-001H      January 2021 Handbook and Guide to Supplement J-STD-001

Proposed Standard for Ballot

IPC-1791B Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2231A DFX Guidelines

IPC-4552B Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards

IPC-4592    Requirements for Printed Electronics Functional Dielectric Materials

IPC-6013E  Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7526A Stencil and Misprinted Board Cleaning Handbook

IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing

J-STD-001HS  Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

Final Draft for Industry Review

IPC-6018D  Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

IPC-9121A  Troubleshooting Printed Board Fabrication Processes

IPC-9701B  Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

IPC-A-640A   Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies

IPC-D-640A    Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

IPC-T-50N  Terms and Definitions for Interconnecting and Packaging Electronic Circuits

J-STD-003D   Solderability Tests for Printed Boards 

J-STD-004C Requirements for Soldering Fluxes

Working Draft

IPC-1402               Standard for Green Cleaners Used in Electronics Manufacturing

IPC-2221C            Generic Standard on Printed Board Design

IPC-2292A            Design Standard for Printed Electronics on Flexible Substrates

IPC-4202C            Flexible Base Dielectrics for Use in Flexible Printed Wiring 

IPC-4412C            Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

IPC-4555               Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards

IPC-4922               Requirements for Sintering Materials for Electronics Assembly

IPC-5262               Design, Critical Process and Acceptance Requirements for Polymeric Applications

IPC-6012EA         Automotive Applications Addendum to IPC-6012E

IPC-6012F            Qualification and Performance Specification for Rigid Printed Boards

IPC-6013EM        Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7077               Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly

IPC-7091A            Design and Assembly Process Implementation of 3-D Components

IPC-7092A            Design and Assembly Process Implementation for Embedded Circuitry and Devices

IPC-7251               Generic Requirements for Through-Hole Design and Land Pattern Standard

IPC-7352               Generic Guideline for Land Pattern Design

IPC-7621A            Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

IPC-8952               Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles

IPC-8981               Quality and Reliability of E-Textiles Wearables

IPC-9202A            Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-9242               Guidelines for Microsection Evaluation

IPC-A-610J           Acceptability of Electronic Assemblies

IPC-HDBK-005A Guide to Solder Paste Assessment

IPC-SM-840F      Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC/DAC-2552    International Standard for Model Based Design (MBD) for Digital Twin Factories

J-STD-001HA/A-610HA  Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

J-STD-001J           Requirements for Soldered Electrical and Electronic Assemblies Project Approved

IPC-2201            Requirements for Physics of Failure Analysis for Components and Assemblies

IPC-2611A         Generic Requirements for Electronic Product Documentation

IPC-2612-1A     Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

IPC-2612A         Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

IPC-4557            Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications

IPC-7070            Guidelines for Printed Board Component Mounting

IPC-9205            Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes

IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A

2021-06-01
Description:

IPC CALENDAR

June 2   Factory of the Future Webinar Series: The ABC’s of DfX in Electronics Manufacturing

June 8    Supply Chain Disruption, Economic Recovery, and What to Expect in the Post-Pandemic World

June 29    Critical Environmental Requirements for Electronics

July 5-Aug. 11  PCB Design for Extreme Environments (every Monday and Wednesday)

July 6-Aug. 12   Introduction to PCB Design I (every Tuesday and Thursday)

July 13  Leveraging USG Trade Assets for Sales Support

July 15  Factory of the Future Webinar Series: Smart Industry 4.0 Enablement in Security-Critical Applications

Aug. 24-Sept. 16   PCB Troubleshooting & Defect Analysis (every Tuesday and Thursday)

Aug. 28-Sept. 2   IPC SummerCom

Aug. 30-Oct. 6     PCB Design for Military & Aerospace Applications (every Monday and Wednesday)

Aug. 30-Oct. 6   PCB Design for Rigid-Flex Boards (every Monday and Wednesday)

Aug. 31-Oct. 21   Introduction to PCB Design II (every Tuesday and Thursday)

Sept. 15    IPC Hermes Introduction: "Smart Manufacturing Begins At the Machines" – Brought to you by the IPC EMS Management Council

Published Standards

IPC-2591, Version 1.3  February 2021 Connected Factory Exchange (CFX)

IPC-6902  February 2021 Qualification and Performance Specifications for Printed Electronics on Flexible Substrates

IPC-9257  February 2021 Requirements for Electrical Testing of Flexible Printed Electronics

IPC-HDBK-001H   January 2021  Handbook and Guide to Supplement J-STD-001

IPC-2551  December 2020 International Standard for Digital Twins

Proposed Standard for Ballot

IPC-1791B Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-4552B Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards

IPC-4592   Requirements for Printed Electronics Functional Dielectric Materials

IPC-6013E  Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7526A Stencil and Misprinted Board Cleaning Handbook

IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing

J-STD-001HS  Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

Final Draft for Industry Review

IPC-7525C  Stencil Design Guidelines

IPC-9121A  Troubleshooting Printed Board Fabrication Processes

IPC-9701B  Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

Working Draft

IPC-1402  Standard for Green Cleaners Used in Electronics Manufacturing

IPC-1753A  Laboratory Report Standard

IPC-1792   Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain

IPC-2221C   Generic Standard on Printed Board Design

IPC-2228  Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards

IPC-2292A   Design Standard for Printed Electronics on Flexible Substrates

IPC-4202C   Flexible Base Dielectrics for Use in Flexible Printed Wiring 

IPC-4412C  Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

IPC-4555     Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards

IPC-4922    Requirements for Sintering Materials for Electronics Assembly

IPC-5262  Design, Critical Process and Acceptance Requirements for Polymeric Applications

IPC-6012D MBB Addendum   Metal Base Printed Boards Addendum to IPC-6012D

IPC-6012F    Qualification and Performance Specification for Rigid Printed Boards

IPC-6013DM   Medical Applications Addendum to IPC-6013D Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7077    Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly

IPC-7091A   Design and Assembly Process Implementation of 3-D Components

IPC-7092A   Design and Assembly Process Implementation for Embedded Circuitry and Devices

IPC-7251   Generic Requirements for Through-Hole Design and Land Pattern Standard

IPC-7352  Generic Guideline for Land Pattern Design

IPC-7621A  Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

IPC-8921A   Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires

IPC-8941   Guideline on Connections for E-Textiles

IPC-8952   Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles

IPC-8981   Quality and Reliability of E-Textiles Wearables

IPC-9202A    Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-9203A     Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

IPC-9242        Guidelines for Microsection Evaluation

IPC-A-610J     Acceptability of Electronic Assemblies

IPC-HDBK-005A    Guide to Solder Paste Assessment

IPC-HDBK-9797    Handbook and Guide to Supplement IPC-9797

IPC-SM-840F   Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC-T-50N    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC/DAC-2552   International Standard for Model Based Design (MBD) for Digital Twin Factories                            

J-STD-001HA/A-610HA  Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

J-STD-001J     Requirements for Soldered Electrical and Electronic Assemblies

J-STD-003D    Solderability Tests for Printed Boards 

J-STD-004C    Requirements for Soldering Fluxe

Project Approved

IPC-2201    Requirements for Physics of Failure Analysis for Components and Assemblies

IPC-2611A      Generic Requirements for Electronic Product Documentation

IPC-2612-1A    Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

IPC-2612A   Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

IPC-4412B Am 3      Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards - Amendment 3

IPC-4557     Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications

IPC-7070     Guidelines for Printed Board Component Mounting

IPC-9205    Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes

IPC-HDBK-001A  Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A

2020-12-01
Location: Illinois
Description:

IPC Releases New "H" Revision to Two Leading Standards for Electronics Assembly, IPC J-STD-001 and IPC-A-610

IPC has released H revisions of two leading standards for the electronics assembly industry: IPC J-STD-001H, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610H, Acceptability of Electronic Assemblies

 

Archived Events: (Click to expand/collapse)
2020-10-16
Location: Illinois
Description:

PC-A-610 Acceptability of Electronics Assemblies Training and Certification Program

Translated Training Materials

Translated training materials for this program are available. Additional languages are continuously being added.

Targeting Excellence in Electronics Assembly

Support for Lead Free and Modular Training at the Application Level!

IPC-A-610, Acceptability of Electronic Assemblies is the most widely used standard published by the IPC. With multiple language versions, it has an international reputation as the source for end product acceptance criteria for consumer and high reliability printed wiring assemblies.

An industry developed and approved program that includes training, certification and instructional materials based on the IPC-A-610 is available to your company. This certification will demonstrate your commitment to customer requirements and greatly assists any company dedicated to ISO-9000 or other quality assurance initiatives.

This training and certification has immediate recognition, legitimacy and value throughout the electronics industry. Thousands of individuals have been trained to be IPC-A-610 Certified IPC Trainers. A comprehensive and technically accurate program, IPC-A-610 Training and Certification provides Certified IPC Trainers with high quality materials and detailed instructional plans for training Application Specialists at all levels, including buyers, sales teams and management.

How the IPC Certification Program Works

IPC-A-610 Training and Certification program has two tiers of instruction. Certified IPC Trainer candidates are sent by their parent companies to receive intensive training on the IPC-A-610 from an IPC authorized certification center. Candidates are certified once they complete their course of study and pass the certification examinations. If they feel they do not need the training course, candidates may opt to take a "challenge test" administered by one of the certification centers. Certified IPC Trainers are provided instructional materials for training Application Specialist in a modular training program. Certified IPC Trainers are considered certified for two years after the course completion date. They must then re-certify at an IPC authorized certification site.

Instructor Training Course Topics

  • Establishing and maintaining integrity of the certification program
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered requirements for connecting to terminals
  • Soldered connection requirements for plated-through holes
  • Surface mounting criteria for chip components, leadless and leaded chip carriers
  • Swaged hardware and heatsink requirements of mechanical assemblies
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements
  • Solder fillet dimensional criteria for all major SMT component groups
  • Soldering, such as tombstoning, dewetting, voiding and others
  • Criteria for component damage, laminate conditions, cleaning and coating
  • Steps to effectively using the lesson plan and materials, tips on inspection and a review of important Certified IPC Trainer skills

Who Should Become a Certified Trainer

Anyone responsible for the quality and reliability of electronic assemblies should consider becoming an IPC-A-610 Certified IPC Trainer. Trainers and quality supervisors versed in electronic assembly are excellent candidates for A-610 training, as are engineering and manufacturing supervisors with assembly responsibilities.

"An excellent course of study on an excellent document… My students were nervous about testing, but we have had high pass rates and a lot of personal satisfaction gained from participating in the training. Without question, the greatest strength of the program is its relevance: it is used by our operators every day. The program has given the entire facility a much higher level of common knowledge about terminology and important concepts."

~ Bernie Schaeffer, Kimball Electronics Group

Program Benefits

The IPC-A-610 Training and Certification Program offers those interested in company-wide quality assurance initiatives in an industry traceable, IPC-sponsored program to support their commitment to continuous improvement of product quality and reliability. The program provides individuals with a portable credential that represents their understanding of the IPC-A-610.

Download the course synopsis (schedule format).

All IPC-A-610 Certified IPC Trainers receive materials for participating in the A-610 training as well as instructional materials for conducting the Modular Application Specialist training. The modular approach lets users control cost by tailoring training to the specific needs of their work force.

These include:

  • A CD-ROM with full color teaching visuals illustrating every aspect of the IPC-A-610 document and training information, and all reports and forms required for conducting Application Specialist training
  • An Instructor Guide, providing complete instructions for conducting the Application Specialist training and testing
  • IPC-A-610 Acceptability of Electronic Assemblies and IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits
  • Open and closed book Application Specialist Written Examinations
  • IPC certificate of course completionApplication Specialist training materials, including official, serialized IPC certificates, may be purchased from IPC only by Certified IPC Trainers and the companies they represent. Certified IPC Trainers may teach the course at any location and to any audience and may set a training fee, if applicable.

The term for an IPC-A-610 Certified IPC Trainer is two years. Re-certification training is conducted at the IPC Licensed Certification Centers.

Support for Training A-610 Certified Instructors

  Last Updated
IPC Training and Certification Policies and Procedures 4/22/2019
Certification Portal User’s Guide 10/4/2018
A-610G Training Materials Checklist 12/7/2017

Back to top of page

Support for Training A-610 Application Specialists

  Last Updated
IPC Training and Certification Policies and Procedures 4/22/2019
Certification Portal User’s Guide 10/4/2018
IPC-A-610G for CIT to train CIS – Editorial updates slides 6/13/2018
A-610G Training Materials Checklist 12/7/2017

* If this is your first time using the Certification Help Desk, you will be prompted to create an account. You must create an account to receive a response.

Updates to Training Materials for Amendments

These files are being made available to update existing training PowerPoints in each of the indicated courses with the changes in the Amendments for each course.

To use the files:

  1. Click on the link for the desired course.
  2. Download the zipped files.
  3. Edit your existing full training course PowerPoint files to include or replace the existing training slides as appropriate.

Included with each zipped file is a “How to” PowerPoint. The “How To” PowerPoint includes step-by-step instructions for adding the amended slides (to train CITs) and for replacing the original slides with the amended slides (to train CIS).

Updates to Training Materials for Policy & Procedure:

The slides in the downloadable Zip files are the complete, module Policy and Procedure modules. The slides are intended to be used with revision 6 of the Policy and Procedures document.

Instructions for use:

  1. Download the files
  2. Unzip the PPT presentation
  3. Remove the existing PPT presentation from the training program
  4. Use the new, downloaded PPT presentation for presenting in training classes.

 

2020-10-13
Description:

For information about IPC standards with DRM protection, visit www.ipc.org/drm.

This standard describes materials, methods and acceptance criteria for producing soldered electrical and elec-tronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levelsduring the manufacture of products. It is not the intent of this standard to exclude any procedure, such as for componentplacement or for applying flux and solder used to make the electrical connection.The soldering operations, equipment, and conditions described in this document are based on electrical/electronic circuitsdesigned and fabricated in accordance with the specifications listed in Table 1-1.

Table 1-1 Design, Fabrication and Acceptability Specifications

Board Type Design Fabrication/Acceptability Specification
Generic Requirements IPC-2221 IPC-6011
Rigid Printed Boards IPC-2222

IPC-6012

IPC-A-600

Flexible Circuits IPC-2223 IPC-6013
Rigid Flex Board

IPC-2222

IPC-2223

IPC-6013

https://e.ipc.org/public/viewmessage/html/39015/28hogrbzehh9c52itsf1ju46kucxr/dd18d14e624b63840af69610b0423007

Application: Electronic Assembly
IPC-J-STD-001H - Start year: : 2020
Description:

IPC-J-STD-001H: Requirements for Soldered Electrical and Electronic Assemblies- Multi Device License

Notes:

IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.

IPC-J-STD-001H is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. J-STD-001 is developed in synergy with IPC-A-610 and is supported by IPC-HDBK-001 for those wanting additional information and explanation on the requirements. If you purchased IPC-J-STD-001H you should also purchase and use IPC-A-610H, they work together.

Multiple-Device License (MDL), Digital Rights Management (DRM) - Protected Document. The MDL DRM product can be purchased starting with a 12 device license and any quantity larger than that. NOTE: The pricing shown is for 1 device. Upon check out the price will be updated for the total devices purchased. A 10% discount is applied to any quantity of 20 and more when purchased on the same order. Users of this MDL document will only be able to open it on the number of devices specific to the product order. (Example: If you placed an order for a MDL of 12 then you would be able to open the document on 12 devices) For information about IPC standards with DRM protection, visit www.ipc.org/mdl

Start Year / Status
IPC-A-610 - Start year: : 2020
Description:

The IPC-A-610 Endorsement is included of the following IPC Certification Programs: Certified IPC Specialist (CIS), Certified IPC Trainer (CIT/MIT), Certified Standards Expert (CSE/SCSE). Specific program information is outlined in the Policies and Procedures.

Topics Covered in the IPC-A-610 Endorsement Program

  • Establishing and maintaining integrity of the certification program
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered requirements for connecting to terminals
  • Soldered connection requirements for plated-through holes
  • Surface mounting criteria for chip components, leadless and leaded chip carriers
  • Swaged hardware and heatsink requirements of mechanical assemblies
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements
  • Solder fillet dimensional criteria for all major SMT component groups
  • Soldering, such as tombstoning, dewetting, voiding and others
  • Criteria for component damage, laminate conditions, cleaning and coating
  • Steps to effectively using the lesson plan and materials, tips on inspection and a review of important Certified IPC Trainer skills

Who Should Earn an IPC-A-610 Endorsement

Anyone responsible for the quality and reliability of electronic assemblies should consider becoming an IPC-A-610 Certified IPC Trainer. Trainers and quality supervisors versed in electronic assembly are excellent candidates for A-610 training, as are engineering and manufacturing supervisors with assembly responsibilities.

"An excellent course of study on an excellent document… My students were nervous about testing, but we have had high pass rates and a lot of personal satisfaction gained from participating in the training. Without question, the greatest strength of the program is its relevance: it is used by our operators every day. The program has given the entire facility a much higher level of common knowledge about terminology and important concepts." ~ Bernie Schaeffer, Kimball Electronics Group

Notes:

For information about IPC standards with DRM protection, visit www.ipc.org/drm.

This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard doesnot provide criteria for cross-section evaluation.

This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, elec-tronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. For a more completeunderstanding of this document’s recommendations and requirements, one may use this document in conjunction withIPC-HDBK-001, IPC-AJ-820 and J-STD-001.

The criteria in this standard are not intended to define processes to accomplish assembly operations nor is it intended to autho-rize repair/modification or change of the product. For instance, the presence of criteria for adhesive bonding of components doesnot imply/authorize/require the use of adhesive bonding and the depiction of a lead wrapped clockwise around a terminal doesnot imply/authorize/require that all leads/wires be wrapped in the clockwise direction.

Users of this standard should be knowledgeable of the applicable requirements of the document and how to apply them, see1.3 Classification.

IPC-A-610 has criteria outside the scope of J-STD-001 defining mechanical and other workmanship requirements.

Table 1-1 is a summary of related documents

Documet Purpose      

Spec #

Definition

Design Standard

IPC-2220-FAM

IPC-7351

IPC-CM-770

Design requirements reflecting three levels of complexity (Levels A, B, and C) indicat-ing finer geometries, greater densities, more process steps to produce the product.Component and Assembly Process Guidelines to assist in the design of the bareboard and the assembly where the bare board processes concentrate on land pat-terns for surface mount and the assembly concentrates on surface mount andthrough-hole principles which are usually incorporated into the design process and the documentation.

Printed Board – Requirement

IPC-6010-FAM

IPC-A-600

Requirements and acceptance documentation for rigid, rigid flex, flex and other types of Substrates.

End Item Documentation

Ipc-D-325  

Documentation depicting bare board or assembly requirements. Details may or maynot reference industry specifications or workmanship standards as well as the User’sown preferences or internal standard requirements.

Process Requirement Standard

J-STD-001

Requirements for soldered electrical and electronic assemblies depicting minimumend product acceptable characteristics as well as methods for evaluation (test meth-ods), frequency of testing and applicable ability of process control requirements.

Acceptability Standard

IPC-A-610

Pictorial interpretive document indicating various characteristics of the board and/orassembly as appropriate relating to desirable conditions that exceed the minimumacceptable characteristics indicated by the end item performance standard andreflect various out-of-control (process indicator or defect) conditions to assist the shop process evaluators in judging need for corrective action.

Training Programs (Optional)

 

Documented training for process, procedures, techniques, and requirements.

Rework and Repair

IPC-7711/7721

Documentation providing the procedures to accomplish conformal coating and com-ponent removal and replacement, solder resist repair, and modification/repair of lami-nate material, conductors, and plated through-holes.

.IPC-AJ-820 is a supporting document that provides information regarding the intent of this specification content and explains oramplifies the technical rationale for transition of limits through Acceptable to Defect condition criteria. In addition, supporting infor-mation is provided to give a broader understanding of the process considerations that are related to performance but not com-monly distinguishable through visual assessment methods.

The explanations provided in IPC-AJ-820 should be useful in determining disposition of conditions identified as Defect, processes associated with Process Indicators, as well as answering questions regarding clarification in use and application for defined con-tent of this specification. Contractual reference to IPC-A-610 does not additionally impose the content of IPC-AJ-820 unless specifically referenced in contractual documentation.

Start Year / Status
Application: Reporting
IPC-1751A - Start year: : 2010
Description:

Amendment 1 to IPC-1751A standard provides the principles and details for declarations necessary between members of a supply chain relationship. This standard is the first in a series of standards that permits segmentation of declaration details based on the subject and scope of the declaration as well as the manufacturing domain. This standard contains general information and is supplemented by Sectional standards requiring more detailed information such as material declarations, quality profiles, or codes of conduct.

The 175x family of supplier declaration standards include: manufacturing process declaration (IPC-1751), materials declaration (IPC-1752), printed board declaration (IPC-1753), conflict minerals declaration (IPC-1755) assembly technology declaration (IPC-1756), and declaration of shipping, packing and packaging materials (IPC-1758).

In this revision of the 175x series, only the data format and functional requirements are specified. Development of human readable data entry and viewing tools are intentionally left in the domain of third party software providers.

Amendment 1 released November 2012.

Notes:

This standard provides the principles and details necessary for declarations between members of a supply chain. Although this 1751A standard contains only generic information regarding trading partners, when combined with another specific 175x Sectional standard, the resulting document set is used to define and maintain the declaration information. The requirements pertain to both hard copy and electronic data descriptions. This standard provides for the creation of a record between trading partners, and therefore the data communicated may be used to help support and demonstrate due diligence in any subsequent representation based upon its contents.

1.1 Purpose

The purpose of the standard is to establish a methodology for a product or business attribute declaration process between suppliers and their customers which will define the form, structure, and content of the declaration to such an extent that it may be conveyed electronically without the necessity of human intervention. The standard benefits its adherents by providing consistency, efficiency, and integrity to the declaration process. 

The purpose of this document is also to describe in text what the electronic data content consists of, so that its capabilities can be assessed, judged, and adopted by those in need of such a standardized approach to information exchange.

 Because organizations may choose to verify information provided under this standard, brief procedures are described within this standard for such verification (see Section 8).

1.2 Intent

The intent of the 175x standard set is to establish a standard data exchange format that will facilitate, improve, and secure data transfer between all members of a supply chain.

The intent of the 1751A standard is to define the generic information comprising the basis for such data exchange: who is  requesting or making the declaration, basic identification and contact information for the party or parties involved, if there  is a requester, then who is the recipient of the request, when is this happening, and similar basic information. The 1751A standard then intends to provide definition of the electronic data exchange format sufficient to convey mandatory and  optional data contents.

IPC-1751A is ‘‘generic’’ because it specifies only basic identification and communication information which form the basis for further specific declarations. IPC-1751A is therefore intended to be used in conjunction with other 175x standards as needed which may be employed similar to menu items, building on the 1751A foundation.

Part of the intent is also to provide mechanisms for securing the integrity of the information exchanged.

1.3 Documentation Hierarchy

This 1751A standard establishes the generic requirements for a declaration process used to provide information with respect to a specified product or products on subjects of concern arising in the course of conducting business.

Declaration specifics are defined by each standard in the IPC-175x series of standards. Each standard has a specific focus and shall

be used, as appropriate, to describe a particular declaration process. The Sectional standards and their focus are:

Version 2.0:

IPC-1751A Generic Requirements for Declaration Process Management

IPC-1752A Materials Declaration Management

IPC-1756 Manufacturing Process Data Management

IPC-1758 Declaration of Shipping, Packing and Packaging Materials

Start Year / Status
IPC-1752A - Start year: : 2014
Description:

IPC-1752A establishes a standard reporting format for material declaration data exchange between supply chain participants and supports reporting of bulk materials, components, printed boards, sub-assemblies, and products. This standard is not supported directly by a PDF form. Third party software developers are invited to supply the implementation tool, and one organization has already made a free download implementation tool available. In the A revision, the data exchange format is specified as Extensible Markup Language (XML).

Amendment 2 provides important enhancements to the standard including: new Reportable Application field for use with new IEC 62474 Declarable Substances list in Appendix F to align with IEC 62474; clarification on the use of SubProduct in Class D XMLs to align with IEC 62474; clarification on reporting RoHS Exemptions tied to RoHS Exemption Lists in Class D XMLs and: addition of a new list for ELV exemptions in Appendix B. 53 pages. Released 2014.

While IPC-1751 defines the generic requirements for declaration process management, IPC-1752 establishes a standard reporting format for material declaration data exchange between supply chain participants and supports reporting of bulk materials, components, printed circuit boards (PCBs), sub-assemblies, and products. This standard defines the content and requirements for four distinct classes of declarations that can be used between members of a supply chain relationship.

1752 - Class A: Declaration Query/Reply

1752 - Class B: Material Group Declaration

1752 - Class C: Material Composition Summary Declaration - Product Level

1752 - Class D: Material Composition Declaration - Homogeneous Material Level, with JIG-101 (latest revision) list

The initial focus of material reporting is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003, on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). In April, 2005 the Electronic Industries Alliance, Japan Green Procurement Survey Standardization Initiative and the Joint Electronic Device Engineering Council (JEDEC) published the Joint Industry Guide Material Composition Decla-

ration for Electronic Products (JIG-101), which established the materials and substances to be disclosed by suppliers when those materials and substances are present in products and subproducts that are incorporated into electrical and electronic

equipment. The IPC-1752 standard supports the substance disclosure requirements outlined by the latest version of JIG-101 and accommodates disclosure of additional substance information.

There are several appendices to the 1752 which represent various lists taken from legal directives and other standard bodies. These lists are subject to change; therefore, corresponding appendices in this standard will be amended to reflect those changes at regular intervals. In addition, some substances/materials may exist on more than one list, and since a requester may require meeting more than one material reporting convention described in the appendices, users should be aware that duplicate reporting of a single substance in a material could result from adhering to the reporting conventions of more than one appendix. Tool designers for 1752 implementation are cautioned to consider screening to remove duplication prior to

summing the mass or calculating mass percentages.

This standard will be updated to reflect changes affecting the global market. The methodology for update is described in the section on standard maintenance.

Version 1.1 of this standard was supported by two Portable Document Format (PDF) forms (1752-1 and 1752-2) and the

Users Guide (1752-3). However, starting with version 2.0, this standard will not be supported directly with a PDF form.

Third party software developers are invited to supply the implementation tool, and one organization has already made a free

download implementation tool available. In version 2.0 the data exchange format is specified as Extensible Markup Language (XML).

Using a software tool of the user’s choice, relevant data can be saved locally and submitted electronically back to the requester. The data structure is based on an underlying Unified Modeling Language (UML) model, which in turn is represented by an XML schema which is used to validate the XML data files. The schema and model are included in Figure 4-1and Appendix E.

End product producers and customers throughout the supply chain are requesting that suppliers provide material declarations so that the recipient is aware of the presence and amount of certain chemicals in the products it procures. This standard defines the creation of a document or electronic record that will serve as a standard way for reporting and collecting this type of data.

Notes:

This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for electrical and electronic product. This standard applies to products, components, subproducts and materials that are

supplied to producers of electrical and electronic products for incorporation into their products. It covers materials and substances that may be present in the supplied product or sub-product. It does not apply to process chemicals, unless those process chemicals constitute part of the finished product or sub-product.

This standard applies to business-to-business transactions. It is not intended to be used by the general public when making purchasing decisions. The standard is not a compliance guide. As revisions to the European Union’s Restriction of Hazardous Substances (RoHS) Directive and the European Union’s REACH Regulation are released, this standard will be updated.

Exemptions are for specific applications as defined, and management of usage and expirations are between the requester and the supplier.

1.1 Purpose

This standard is intended to benefit suppliers and their customers by providing consistency and efficiency to the material declaration process. It establishes standard electronic data exchange formats that will facilitate and improve data-transfer along the entire global supply chain.

1.2 Classes

This standard establishes four classes for declaration of materials. Classes may be combined as desired.

 

Start Year / Status
Application: Semiconductor Assembly
IPC-J-STD-001H - Start year: : 2020
Description:

IPC-J-STD-001H: Requirements for Soldered Electrical and Electronic Assemblies- Multi Device License

Notes:

IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.

IPC-J-STD-001H is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. J-STD-001 is developed in synergy with IPC-A-610 and is supported by IPC-HDBK-001 for those wanting additional information and explanation on the requirements. If you purchased IPC-J-STD-001H you should also purchase and use IPC-A-610H, they work together.

Multiple-Device License (MDL), Digital Rights Management (DRM) - Protected Document. The MDL DRM product can be purchased starting with a 12 device license and any quantity larger than that. NOTE: The pricing shown is for 1 device. Upon check out the price will be updated for the total devices purchased. A 10% discount is applied to any quantity of 20 and more when purchased on the same order. Users of this MDL document will only be able to open it on the number of devices specific to the product order. (Example: If you placed an order for a MDL of 12 then you would be able to open the document on 12 devices) For information about IPC standards with DRM protection, visit www.ipc.org/mdl

Start Year / Status
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