As an association and as an industry, we have many milestones and achievements to celebrate. On these pages, read about the vision of the six printed circuit board manufacturers that came together to create the Institute of Printed Circuits in the fall of 1957. Since that day, IPC has been dedicated to removing supply chain obstacles, creating industry standards, and supporting the advancement of the industry.
No matter what changes lay ahead, the strength of our volunteer leadership and commitment to serve the needs of our membership will continue to be the hallmark of IPC for many years to come.
Published Standards
IPC-A-610J March 2024, Acceptability of Electronic Assemblies
IPC-J-STD-001J-Redline March 2024, Requirements for Soldered Electrical and Electronic Assemblies – Redline
J-STD-001J March 2024, Requirements for Soldered Electrical and Electronic Assemblies
IPC-4922 January 2024, Requirements for Sintering Materials for Electronics Assembly
Proposed Standard for Ballot
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-HERMES-9852 V 1.6 The Global Standard for Machine-to-Machine Communication in SMT Assembly
Final Draft for Industry Review
IPC-8981 Quality and Reliability of E-Textiles Wearables
Working Draft
IPC-1602A Standard for Printed Board Handling and Storage
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2223F Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-4101F Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-6011A Generic Performance Specification for Printed Boards
IPC-6905 Qualification and Performance Specification for Additively Manufactured Electronics (AME)
IPC-6921 有机封装基板的要求与验收 Requirements and Acceptance Specification for Organic IC Substrate
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8922 Qualification and Performance Specification for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8953 Design Standard for Embroidered E-Textiles
IPC-8961 Guideline on E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-T-50P Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Description
IPC-CC-830D Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-HDBK-850A Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
Published Standards
IPC-6012FS February 2024 Space and Military Avionics Application Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
IPC-7711/21D January 2024 Rework, Modification and Repair of Electronic Assemblies
IPC-2221C December 2023 Generic Standard on Printed Board Design
IPC-1791D October 2023 Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC/WHMA-A-620E-S October 2023 Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620E.
Proposed Standard for Ballot
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4413 Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards
IPC-4556A Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards
IPC-4562B Metal Foil for Printed Board Applications
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC-A-610J Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
J-STD-004D Requirements for Soldering Fluxes
J-STD-005B Requirements for Soldering Pastes
J-STD-609C Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
Final Draft for Industry Review
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-4203C Cover and Bonding Material for Flexible Printed Circuitry
IPC-6018D Amendment 1 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7527A Requirements for Solder Paste Application
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-8401 Guidelines for In-Mold Electronics
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-HERMES-9852 V 1.6 The Global Standard for Machine-to-Machine Communication in SMT Assembly
IPC-J-STD-002F Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Project Approved
IPC-1602A Standard for Printed Board Handling and Storage
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-4204C Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6911 Acceptability of Additively Manufactured Electronics (AME)
IPC-6931 Requirements and Acceptance of Optical Module Printed Boards
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC/JEDEC J-STD-033E Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-609C Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
J-STD-001JA/IPC-A-610JA Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies
IPC Report Status of Standardization FEB 2024
Published Standards
IPC-7711/21D January 2024 Rework, Modification and Repair of Electronic Assemblies
IPC-2221C December 2023 Generic Standard on Printed Board Design
IPC/WHMA-A-620E-S October 2023 Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620E.
IPC-1782B September 2023 Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-6012F September 2023 Qualification and Performance Specification for Rigid Printed Boards
IPC-6012F-RL September 2023 Redline Standard: Qualification and Performance Specification for Rigid Printed Boards - Redline
Proposed Standard for Ballot
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4413 Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards
IPC-4562B Metal Foil for Printed Board Applications
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-6012FS Space and Military Avionics Application Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC-A-610J Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
J-STD-004D Requirements for Soldering Fluxes
J-STD-005B Requirements for Soldering Pastes
J-STD-609C Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
Final Draft for Industry Review
IPC-4556A Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards
IPC-6018D Amendment 1 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-8401 Guidelines for In-Mold Electronics
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-J-STD-002F Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Working Draft
IPC-2223F Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-4101F Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-4203C Cover and Bonding Material for Flexible Printed Circuitry
IPC-6011A Generic Performance Specification for Printed Boards
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-6921 有机封装基板的要求与验收 Requirements and Acceptance Specification for Organic IC Substrate
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8953 Design Standard for Embroidered E-Textiles
IPC-8961 Guideline on E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC-A-600M Acceptability of Printed Boards
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Status of Standardization for IPC
IPC-2221C December 2023 Generic Standard on Printed Board Design
IPC/WHMA-A-620E-S October 2023 Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620E.
IPC-1782B September 2023 Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-6012F September 2023 Qualification and Performance Specification for Rigid Printed Boards
IPC-6012F-RL September 2023 Redline Standard: Qualification and Performance Specification for Rigid Printed Boards - Redline
Translations
No entries available.
Proposed Standard for Ballot
Final Draft for Industry Review
IPC-4556A Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards
IPC-6018D Amendment 1 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-J-STD-002F Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Working Draft
IPC-1602A Standard for Printed Board Handling and Storage
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2223F Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2591 v 2.0 Connected Factory Exchange (CFX), Version 2.0
IPC-4101F Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-4203C Cover and Bonding Material for Flexible Printed Circuitry
IPC-6011A Generic Performance Specification for Printed Boards
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-6905 Qualification and Performance Specification for Additively Manufactured Electronics (AME)
IPC-6921 有机封装基板的要求与验收 Requirements and Acceptance Specification for Organic IC Substrate
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8922 Qualification and Performance Specification for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8953 Design Standard for Embroidered E-Textiles
IPC-8961 Guideline on E-Textiles Wearables
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC-A-600M Acceptability of Printed Boards
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-T-50P Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Project Approved
IPC-1602A Standard for Printed Board Handling and Storage
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4204C Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6911 Acceptability of Additively Manufactured Electronics (AME)
IPC-6931 Requirements and Acceptance of Optical Module Printed Boards
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7527A Requirements for Solder Paste Application
IPC-8401 Guidelines for In-Mold Electronics
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-CC-830D IPC-CC-830D Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
IPC/JEDEC J-STD-033E Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-609C Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
J-STD-001JA/IPC-A-610JA Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies
Published Standards
IPC-1791D October 2023 Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-1782B September 2023 Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-6012F September 2023 Qualification and Performance Specification for Rigid Printed Boards
IPC-6012F-RL September 2023 Redline Standard: Qualification and Performance Specification for Rigid Printed Boards - Redline
IPC-2591, V 1.7 August 2023 Connected Factory Exchange (CFX)
Translations
No entries available.
Proposed Standard for Ballot Final Draft for Industry Review
IPC-4413 Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards
IPC-4556A Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards
IPC-6012FS Space and Military Avionics Application Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
IPC-6018D Amendment 1 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-J-STD-002F Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Working Draft
IPC-1602A Standard for Printed Board Handling and Storage
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2223F Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2591 v 2.0 Connected Factory Exchange (CFX), Version 2.0
IPC-4203C Cover and Bonding Material for Flexible Printed Circuitry
IPC-6011A Generic Performance Specification for Printed Boards
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-6905 Qualification and Performance Specification for Additively Manufactured Electronics (AME)
IPC-6921 有机封装基板的要求与验收 Requirements and Acceptance Specification for Organic IC Substrate
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8922 Qualification and Performance Specification for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8953 Design Standard for Embroidered E-Textiles
IPC-8961 Guideline on E-Textiles Wearables
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-T-50P Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Working Draft
IPC-1602A Standard for Printed Board Handling and Storage
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2223F Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-4203C Cover and Bonding Material for Flexible Printed Circuitry
IPC-6011A Generic Performance Specification for Printed Boards
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-6905 Qualification and Performance Specification for Additively Manufactured Electronics (AME)
IPC-6921 有机封装基板的要求与验收 Requirements and Acceptance Specification for Organic IC Substrate
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8922 Qualification and Performance Specification for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8953 Design Standard for Embroidered E-Textiles
IPC-8961 Guideline on E-Textiles Wearables
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-T-50P Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Project Approved
IPC-1602A Standard for Printed Board Handling and Storage
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-4204C Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6911 Acceptability of Additively Manufactured Electronics (AME)
IPC-6931 Requirements and Acceptance of Optical Module Printed Boards
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7527A Requirements for Solder Paste Application
IPC-8401 Guidelines for In-Mold Electronics
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-CC-830D IPC-CC-830D Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-HDBK-850A Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
IPC/JEDEC J-STD-033E Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-609C Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
J-STD-001JA/IPC-A-610JA Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies
IPC Status of Standardization
Published Standards
None
Translations
No entries available.
Proposed Standard for Ballot
None
Final Draft for Industry Review
IPC-4413 Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards
IPC-4556A Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
Working Draft
IPC-2223F Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-4203C Cover and Bonding Material for Flexible Printed Circuitry
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-6921 有机封装基板的要求与验收 Requirements and Acceptance Specification for Organic IC Substrate
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8922 Qualification and Performance Specification for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8953 Design Standard for Embroidered E-Textiles
IPC-8961 Guideline on E-Textiles Wearables
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-T-50P Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Project Approved
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-4204C Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6905 Qualification and Performance Specification for Additively Manufactured Electronics (AME)
IPC-6911 Acceptability of Additively Manufactured Electronics (AME)
IPC-6931 Requirements and Acceptance of Optical Module Printed Boards
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7527A Requirements for Solder Paste Application
IPC-8401 Guidelines for In-Mold Electronics
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-CC-830D IPC-CC-830D Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC/JEDEC J-STD-033E Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-609C Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
J-STD-001JA/IPC-A-610JA Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies
Reaffirmation
No entries available.
Reaffirmed
No entries available.
No Longer Maintained
No entries available.
Test Methods Guage R&R Under Evaluation
No entries available.
IPC
Status Of Standardization
Published Standards
IPC-9797A May 2023 Press-fit Standard for Automotive Requirements and other High-Reliability Applications
IPC-7352 May 2023 Generic Guideline for Land Pattern Design
Translations
No entries available.
Proposed Standard for Ballot Final Draft for Industry Review
IPC-4562B Metal Foil for Printed Board Applications
IPC-6018D Amendment 1 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
Working Draft
IPC-1602A Standard for Printed Board Handling and Storage
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2223F Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-6011A Generic Performance Specification for Printed Boards
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8922 Qualification and Performance Specification for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8953 Design Standard for Embroidered E-Textiles
IPC-8961 Guideline on E-Textiles Wearables
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-T-50P Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Project Approved
IPC-1602A Standard for Printed Board Handling and Storage
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2591 v 2.0 Connected Factory Exchange (CFX), Version 2.0
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4556A Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6905 Qualification and Performance Specification for Additively Manufactured Electronics (AME)
IPC-6911 Acceptability of Additively Manufactured Electronics (AME)
IPC-6931 Requirements and Acceptance of Optical Module Printed Boards
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7527A Requirements for Solder Paste Application
IPC-8401 Guidelines for In-Mold Electronics
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-CC-830D Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
IPC-HDBK-850A Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
IPC/JEDEC J-STD-033E Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-609C Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
J-STD-001JA/IPC-A-610JA Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies
Reaffirmation
No entries available.
Reaffirmed
No entries available.
No Longer Maintained
No entries available.
Status of Standardization
https://www.ipc.org/Status 8_8_2023
Published Standards
IPC-9797A May 2023 Press-fit Standard for Automotive Requirements and other High-Reliability Applications
IPC-7352 May 2023 Generic Guideline for Land Pattern Design
IPC-1791C March 2023 Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-2591, V 1.6 March 2023 Connected Factory Exchange (CFX)
Translations
No entries available.
Proposed Standard for Ballot
IPC-1782B Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-2221C Generic Standard on Printed Board Design
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-7711/21D Rework, Modification and Repair of Electronic Assemblies
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC/WHMA-A-620E-S Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620E.
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-1791D Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-4562B Metal Foil for Printed Board Applications
IPC-A-610J Acceptability of Electronic Assemblies
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
J-STD-609C Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
Working Draft for Industry Review
IPC-4562B Metal Foil for Printed Board Applications
IPC-A-610J Acceptability of Electronic Assemblies
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
J-STD-609C Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
Working Draft
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8922 Qualification and Performance Specification for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8953 Design Standard for Embroidered E-Textiles
IPC-8961 Guideline on E-Textiles Wearables
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-4556A Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6905 Qualification and Performance Specification for Additively Manufactured Electronics (AME)
IPC-6911 Acceptability of Additively Manufactured Electronics (AME)
IPC-6931 Requirements and Acceptance of Optical Module Printed Boards
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-850A Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
IPC/JEDEC J-STD-033E Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-609C Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
J-STD-001JA/IPC-A-610JA Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies
Reaffirmation
No entries available.
Reaffirmed
No entries available
No Longer Maintained
No entries available.
Test Methods Guage R&R Under Evaluation
No entries available.
Status of Standardization
Published Standards
IPC-9797A May 2023 Press-fit Standard for Automotive Requirements and other High-Reliability Applications
IPC-1791C March 2023 Trusted Electronic Designer, Fabricator and Assembler Requirements
Translations
No entries available.
Proposed Standard for Ballot Final Draft for Industry Review
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4562B Metal Foil for Printed Board Applications
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-7711/21D Rework, Modification and Repair of Electronic Assemblies
IPC-A-610J Acceptability of Electronic Assemblies
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
J-STD-609C Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
Working Draft Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-6905 Qualification and Performance Specification for Additively Manufactured Electronics (AME)
IPC-6911 Acceptability of Additively Manufactured Electronics (AME)
IPC-6931 Requirements and Acceptance of Optical Module Printed Boards
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC-HDBK-850A Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
IPC/JEDEC J-STD-033E Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-609C Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Reaffirmation
No entries available.
Reaffirmed
No entries available.
IPC Global Insight ipc@multibriefs 6/13/2023
Published Standards
IPC-9797A May 2023 Press-fit Standard for Automotive Requirements and other High-Reliability Applications
J-STD-003D January 2023 Solderability Tests for Printed Boards
Translations
No entries available.
Proposed Standard for Ballot
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4562B Metal Foil for Printed Board Applications
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-7711/21D Rework, Modification and Repair of Electronic Assemblies
IPC-A-610J Acceptability of Electronic Assemblies
IPC-A-630A Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
J-STD-609C Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
Working Draft
IPC-1791D Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-6905 Qualification and Performance Specification for Additively Manufactured Electronics (AME)
IPC-6911 Acceptability of Additively Manufactured Electronics (AME)
IPC-6931 Requirements and Acceptance of Optical Module Printed Boards
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-9716 Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
IPC/JEDEC J-STD-033E Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-609C Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Reaffirmation
No entries available.
Reaffirmed
No entries available
No Longer Maintained
IPC Status of Standardization 5/23/2023
Status of Standardization
Published Standards
IPC-9797A May 2023 Press-fit Standard for Automotive Requirements and other High-Reliability Applications
J-STD-003D January 2023 Solderability Tests for Printed Boards
IPC-8952 December 2022 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
Translations
No entries available.
Proposed Standard for Ballot
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4562B Metal Foil for Printed Board Applications
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC/WHMA-A-620E-S Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620E.
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Working Draft
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
Reaffirmation
No entries available.
Reaffirmed
No entries available.
No Longer Maintained
Published Standards
J-STD-003D January 2023 Solderability Tests for Printed Boards
IPC-8971 November 2022 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-9203A November 2022 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-HERMES-9852 V 1.5 November 2022 The Global Standard for Machine-to-Machine Communication in SMT Assembly
IPC/JEDEC J-STD-035A November 2022 Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F November 2022 Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
IPC-8952 December 2022 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
Translations
No entries available
Proposed Standard for Ballot
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-1782B Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-9797A Press-fit Standard for Automotive Requirements and other High-Reliability Applications
IPC-A-610J Acceptability of Electronic Assemblies
IPC/WHMA-A-620E-S Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620E.
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Working Draft
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
Reaffirmation
No entries available.
Reaffirmed
No entries available.
No Longer Maintained
No entries available
IPC Status of Standardization 3_21_2023
Standard are selected for use in Power Electric Design
Entire list of IPC Active Standards is available at https://www.ipc.org/Status
Published Standards
J-STD-003D January 2023 Solderability Tests for Printed Boards
IPC-8952 December 2022 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 November 2022 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-HERMES-9852 V1.5 November 2022 The Global Standard for Machine-to-Machine Communication in SMT Assembly
IPC/JEDEC J-STD-035A November 2022 Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F November 2022 Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
IPC-2228 October 2022 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A October 2022 Design Standard for Printed Electronics on Flexible Substrates
IPC-7092A October 2022 Design and Assembly Process Implementation for Embedded Circuitry and Devices
J-STD-004C-WAM1 October 2022 Requirements for Soldering Fluxes
Translations
No entries available.
Proposed Standard for Ballot
IPC-1791C Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-9797A Press-fit Standard for Automotive Requirements and other High-Reliability Applications
IPC-A-610J Acceptability of Electronic Assemblies
IPC/WHMA-A-620E-S Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620E.
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Working Draft
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
Reaffirmation
No entries available.
Reaffirmed
No entries available.
No Longer Maintained
No entries available.
Published Standards
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC/JEDEC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-9797A Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Working Draft
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
Reaffirmation-No entries available
Reaffirmed-No entries available
No Longer Maintained-No entries available
Status of Standardization
Published Standards
J-STD-003D January 2023 Solderability Tests for Printed Boards
IPC-8952 December 2022 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 November 2022 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-2228 October 2022 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A October 2022 Design Standard for Printed Electronics on Flexible Substrates
IPC-7092A October 2022 Design and Assembly Process Implementation for Embedded Circuitry and Devices
Translations
No entries available.
Proposed Standard for Ballot
IPC-1791C Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC/JEDEC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-9797A Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Working Draft
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic
Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Projects Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
Reaffirmation
No entries available
Reaffirmed
No entries available.
No Longer Maintained
No entries available.
Status of Standardization
Published Standards
IPC-2228 October 2022 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A October 2022 Design Standard for Printed Electronics on Flexible Substrates
IPC-7092A October 2022 Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-4592 August 2022 Requirements for Printed Electronics Functional Dielectric Materials
IPC-6018DS August 2022 Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Translations
No entries available.
Proposed Standard for Ballot
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC/JEDEC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
J-STD-003D Solderability Tests for Printed Boards
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-9797A Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Working Draft
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
Reaffirmation
No entries available.
Reaffirmed
No entries available.
No Longer Maintained
No entries available.
Published Standards
IPC-2292A October 2022 Design Standard for Printed Electronics on Flexible Substrates
IPC-7801A August 2022 Reflow Oven Process Control Standard
IPC-5262 July 2022 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC/DAC-2552 July 2022 International Standard for Model Based Design (MBD) for Digital Twin Factories
Proposed Standard for Ballot
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7352 Generic Guideline for Land Pattern Design
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC/JEDEC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
J-STD-003D Solderability Tests for Printed Boards
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC-9797A Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Working Draft
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
Reaffirmation
No entries available.
Reaffirmed
No entries available
No Longer Maintained
No entries available.
IPC Status of Standardization
Published Standards
IPC-2228 October 2022 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-9202A October 2022 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-4592 August 2022 Requirements for Printed Electronics Functional Dielectric Materials
IPC-6018DS August 2022 Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7801A August 2022 Reflow Oven Process Control Standard
IPC-5262 July 2022 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC/DAC-2552 July 2022 International Standard for Model Based Design (MBD) for Digital Twin Factories
Translations
IPC-A-610GR July 2022 电子组件的可接受性轨道交通补充标准
Proposed Standard for Ballot
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7352 Generic Guideline for Land Pattern Design
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC/JEDEC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
J-STD-003D Solderability Tests for Printed Boards
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
Working Draft
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9797A Press-fit Standard for Automotive Requirements and other High-Reliability Applications
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
Reaffirmation
No entries available
Reaffirmed
No entries available
No Longer Maintained
No entries available
IPC Global Insight
Status of Standardization
Standards for Ballot and Final Drafts
View IPC documents under development.
Published Standards
IPC-2228 October 2022 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-4592 August 2022 Requirements for Printed Electronics Functional Dielectric Materials
IPC-6018DS August 2022 Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Proposed Standard for Ballot
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7352 Generic Guideline for Land Pattern Design
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC/JEDEC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
IPC/WHMA-A-620E IPC/WHMA-A-620E: Requirements and Acceptance for Cable and Wire Harness Assemblies
J-STD-003D Solderability Tests for Printed Boards
J-STD-005B Requirements for Soldering Pastes
Final Draft for Industry Review
IPC-6012F Qualification and Performance Specification for Rigid Printed Board
Final Draft for Industry Review
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-9797A Press-fit Standard for Automotive Requirements and other High-Reliability Applications
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
Status of Standardization
Published Standards
IPC-7801A August 2022 Reflow Oven Process Control Standard
IPC-2591, Version 1.5 July 2022 Connected Factory Exchange (CFX)
IPC/DAC-2552 July 2022 International Standard for Model Based Design (MBD) for Digital Twin Factories
IPC-A-640A April 2022 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-HDBK-9798 April 2022 Handbook and Guide to Supplement IPC-9797, IPC-9797 - Press-Fit Standard for Automotive Requirements ...
Translations
IPC-A-610GR July 2022 电子组件的可接受性轨道交通补充标准
Proposed Standard for Ballot
None
Final Draft for Industry Review
None
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8971 Requirements for Electrical Testing of Printed Electronics E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
None
Reaffirmation
None
Reaffirmed
None
No Longer Maintained
None
Status of Standardization
Published Standards
IPC-2591, Version 1.5 July 2022 Connected Factory Exchange (CFX)
IPC/DAC-2552 July 2022 International Standard for Model Based Design (MBD) for Digital Twin Factories
IPC-A-640A April 2022 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-HDBK-9798 April 2022 Handbook and Guide to Supplement IPC-9797
IPC-A-610GR March 2022 Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies
IPC/WHMA-A-620CR March 2022 Rail Transit Addendum to IPC/WHMA-A-620C
Translations
IPC-A-610GR July 2022 电子组件的可接受性轨道交通补充标准
IPC/WHMA-A-620CR March 2022 线缆及线束组件的要求与验收轨道交通补充标准 Rail Transit Addendum to IPC/WHMA-A-620C
Proposed Standard for Ballot Final Draft for Industry Review
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
J-STD-004C Requirements for Soldering Fluxes
J-STD-005B Requirements for Soldering Pastes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8971 Requirements for Electrical Testing of Printed Electronics E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved Reaffirmation Reaffirmed No Longer Maintained
IPC-1402, Standard for Green Cleaners Used in Electronics Manufacturing Now Open for Public Review
IPC’s draft version of IPC-1402, Standard for Green Cleaners Used in Electronics Manufacturing, is now open for public review through July 15, 2022. Once published, the standard will provide a core set of foundational environmental, health and safety requirements, which aim at reducing impacts and improving the safety of cleaning products used in electronics manufacturing processes.
IPC APEX EXPO 2023 Call for Participation Deadline Extended
IPC has extended the deadline for IPC APEX EXPO 2023 technical conference and professional development abstracts to Monday, August 8, 2022. The IPC APEX EXPO 2023 technical conference will take place January 24-26 and professional development courses will run from January 21-26, 2023.
North American EMS Industry Up 9.4 Percent in May
IPC has announced the May 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.35.
North American PCB Industry Sales Up 3.4 Percent in May
IPC has announced the May 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.
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Industry Groups Urge U.S. Congress to Fix Weaknesses in Electronics Supply Chain
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Advocacy, Standards, Events, and Education — All Highlighted in IPC's New European Subsidiary
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Higher Costs Continue to Dominate Electronics Industry Narrative
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Opening New Opportunities in Mexico
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IPC Issues Call for Participation for IPC E-Textiles 2023
IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.
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IPC Calls for Robust Support of Advanced Packaging in European Chips Act
IPC called for robust support of advanced packaging in comments submitted to the European Commission on the European Chips Act and how to implement the strategy. Within its comments, IPC reiterated the critical role that advanced packaging plays in chip performance and supply chain resiliency.
IPC India Celebrates a Decade of Service to the Electronics Manufacturing Industry
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Build Electronics Better with IPC Standards
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PRODUCT SHOWCASE
Ultrasonic Stencil & Pallet Cleaner
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IPC Global Marketplace Delivers Intelligent Search Technology
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Tech Question of the Week
I'm looking for info regarding IPC recommendations about the minimum copper line width (I think it is normally called "sliver") that may create issues during etching if too narrow.
Status of Standardization
Standards for Ballot and Final Drafts
View IPC documents under development.
IPC Member Milestones
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Member Anniversaries
New Members
Invest in your company by joining IPC and experience the membership benefits of the industry's premier global association. Learn more about IPC membership.
IPC Certification Online or In-Person
IPC Training and Certification is available from Blackfox either online, at your facility, or at one of our worldwide training centers. Experience the Blackfox difference!
IPC CALENDAR
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PCB Design for Rigid-Flex Boards
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PCB Troubleshooting and Defect Analysis
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September 21-22 |
M-EXPO Wire Processing Technology, a WHMA/IPC Event
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Certified Electronics Program Manager (CEPM) Training Program and Certification Exam Bundle
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IPC Global Insights
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Status of Standardization
Published Standards
IPC-A-640A April 2022 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-A-610GR March 2022 Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies
IPC/WHMA-A-620CR March 2022 Rail Transit Addendum to IPC/WHMA-A-620C
IPC-9121A February 2022 Troubleshooting Printed Board Fabrication Processes
Translations
No entries available.
Proposed Standard for Ballot Final Draft for Industry Review
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-7352 Generic Guideline for Land Pattern Design
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC/JEDEC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
IPC/WHMA-A-620E IPC/WHMA-A-620E: Requirements and Acceptance for Cable and Wire Harness Assemblies
J-STD-004C Requirements for Soldering Fluxes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8971 Requirements for Electrical Testing of Printed Electronics E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
No entries available
Status of Standardization
Standards for Ballot and Final Drafts
Published Standards
IPC-9121A February 2022 Troubleshooting Printed Board Fabrication Processes
Translations
No entries available
Proposed Standard for Ballot Final Draft for Industry Review
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-7352 Generic Guideline for Land Pattern Design
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC/JEDEC J-STD-035A Acoustic Microscopy for Non-hermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
IPC/WHMA-A-620E IPC/WHMA-A-620E: Requirements and Acceptance for Cable and Wire Harness Assemblies
J-STD-004C Requirements for Soldering Fluxes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8971 Requirements for Electrical Testing of Printed Electronics E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
No entries available
Status of Standardization
IPC-9121A February 2022 Troubleshooting Printed Board Fabrication Processes Translations
Proposed Standard for Ballot Final Draft for Industry Review
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-2591, Version 1.5 Connected Factory Exchange (CFX)
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-7352 Generic Guideline for Land Pattern Design
IPC-8971 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC/JEDEC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
IPC/WHMA-A-620E IPC/WHMA-A-620E: Requirements and Acceptance for Cable and Wire Harness Assemblies
J-STD-004C Requirements for Soldering Fluxes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 Requirements for Electrical Testing of Printed Electronics E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Proposed Standard for Ballot
IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6018DS Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7525C Stencil Design Guidelines
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-D-640A Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-T-51 Terms and Definitions for the Design and Manufacture of Printed Electronics
IPC/DAC-2552 International Standard for Model Based Design (MBD) for Digital Twin Factories
J-STD-003D Solderability Tests for Printed Boards
Final Draft for Industry Review
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-2591, Version 1.5 Connected Factory Exchange (CFX)
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-7352 Generic Guideline for Land Pattern Design
IPC-8971 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-HDBK-9798 Handbook and Guide to Supplement IPC-9797
IPC/JEDEC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
IPC/WHMA-A-620E IPC/WHMA-A-620E: Requirements and Acceptance for Cable and Wire Harness Assemblies
J-STD-004C Requirements for Soldering Fluxes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 Requirements for Electrical Testing of Printed Electronics E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Eco-design for a Circular Economy: Best Practices in the Electronics Industry
Join IPC for a free webinar on March 17 to learn about eco-design best practices, interact with your peers, and get a grip on realistic and achievable eco-design action items.
READ MORE
Status of Standardization
Published Standards
IPC-1755A-AM1 October 2021 Responsible Sourcing of Minerals Data Exchange Standard
IPC-6012EA October 2021 Automotive Applications Addendum to IPC-6012E
Translations
No entries available.
Proposed Standard for Ballot
IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6018D Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7525C Stencil Design Guidelines
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-9121A Troubleshooting Printed Board Fabrication Processes
IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-D-640A Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC/DAC-2552 International Standard for Model Based Design (MBD) for Digital Twin Factories
Final Draft for Industry Review
IPC-4555 Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-6012E Amendment 1 Qualification and Performance Specification for Rigid Printed Boards
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7352 Generic Guideline for Land Pattern Design
IPC-HDBK-9798 Handbook and Guide to Supplement IPC-9797
IPC-T-51 Terms and Definitions for the Design and Manufacture of Printed Electronics
J-STD-003D Solderability Tests for Printed Boards
J-STD-004C Requirements for Soldering Fluxes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-6013EM Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8941 Guideline on Connections for E-Textiles
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8971 Requirements for Electrical Testing of Printed Electronics E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs) is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
IPC-7093A includes a step-by-step process on how to design and incorporate BTCs into any card layout. Comprehensive descriptions on how to successfully implement robust designs and assembly processes and troubleshooting guidance for common anomalies which can occur during BTC assembly are included.
As 2021 comes to a close, IPC would like to wish our members, partners and other industry professionals a safe and happy holiday season. As we reflect on the past year for the industry, we would like to provide our readers with a look at some of the most accessed articles from the past year. Our regular publication will resume Tuesday, Jan. 11.
IPC Promotes Sanjay Huprikar to President of Europe and South Asia Operations
From January 12: IPC has promoted Sanjay Huprikar to president of Europe and South Asia Operations. In his new role, Huprikar will lead IPC’s globalization initiative to expand the association’s standards, education and advocacy support to Europe, the United Kingdom, India, and several countries in Southeast Asia including Malaysia, Singapore, Indonesia, and the Philippines.
READ MORE
IPC Education Reaches Significant Milestones
From April 27: You may have heard about IPC’s new online course, “Electronics Assembly for Operators (EAO).” Like most IPC products and services, this course was developed in collaboration with industry to provide truly engaging, effective and efficient workforce training.
READ MORE
SPONSORED VIDEO
2022 IPC Certification Schedule
The New 2022 Solder Training and IPC Certification Schedule is here. EPTAC offers a variety of options for the way you like to learn. From In-Person (classes in 19 locations), Online, On-Site, or Dedicated Online (select the class, date and time and we deliver the program live), EPTAC has you covered.
WATCH VIDEO
Global Economic Recovery is Picking Up Speed, but Risks Remain
From May 4: The global economic recovery is picking up speed, but there remain risks. The global economy should grow roughly 5 percent in 2021, driven by growth in the United States and China, according to IPC’s April economic outlook report.
Economic Recovery Continues Across the Globe
From June 1: The economic narrative we’ve been building in recent months continues to play out. First, COVID will be the predominant force defining economic growth in the early months of the recovery.
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SPONSORED CONTENT
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- EPTAC is Hiring. Looking for a Flexible Career in IPC Certification and Love to Train? Contact Us Today.
- Why Manufacturers Need to Invest in Digital Transformation and How it Can Affect Your Manufacturing Firm.
- Become an IPC Certified Printed Circuit Board Designer and Earn Your CID or CID+ Certification Online.
EU Steps Up "Semiconductor Sovereignty" Plans
From September 21: The European Commission plans to introduce a "European Chips Act" to provide a European vision and strategy to boost cutting-edge semiconductor manufacturing capacity in the region.
PRODUCT SHOWCASE
Ersa EXOS 10/26 - Inline Reflow Soldering with Vacuum
- Maintenance-friendly and lubricant-free roller conveyor in the vacuum module
- 4-part conveyor system, supports dual track configuration
- Easy access to the vacuum chamber through lifting unit from above
- Optimum temperature profiles through medium-wave emitters in the vacuum module
- Innovative cleaning system SMART ELEMENTS®
- Award winning
For more information, visit our website or watch our product video.
North American PCB Industry Sales up 1 Percent in November
From January 5: IPC has announced November 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.05. Total North American PCB shipments in November 2020 were up 1.0 percent compared to the same month last year.
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SPONSORED VIDEO
Large Gauge Crimp Tools for All Production Environments
DMC 23 Series tools provide pneumatic, manual hydraulic and battery solutions for crimping large gauge contacts and terminals. These versatile tools feature interchangeable Mil-Qualified dies and locators that are capable of crimping 8 – 4/0 AWG. DMC also offers custom dies for your application.
Get Engaged with Sustainable Electronics
From February 16: IPC and iNEMI are calling on experts to participate in the development of a roadmap for sustainable electronics, provide insights in a technology integration group, and advance research projects that address recognized technology gaps.
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Promoted by Cadence Design Systems
- Assemble, Debug, and Rework PCBs Faster
- Run Multiple Displays at Once
- Unified Component Search
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Economic Recovery Continues Along a Bumpy Path
From September 7: Economic recovery continues along a bumpy path. In this month's economic outlook report from IPC, IPC's Chief Economist Shawn DuBravac offers five key observations.
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PRODUCT SHOWCASE
- Quite dust collection
- Quickest Conformal Coating Removal method
- Ergonomic shape for operator comfort
- Removes: Parylene, Silicones, Urethanes, Epoxies, Acrylics and Much More
- Catch pan for spent abrasive
- Great for low volume re-work
- Show with (optional) microscope
- IPC Recognized
North American PCB Industry Sales Up 6.3 Percent in June
From July 27: IPC has announced the June 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.15. Total North American PCB shipments in June 2021 were up 6.3 percent compared to the same month last year.
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IPC Commends US Senate on Passage of Bipartisan Infrastructure Bill
From August 17: On Aug. 10, IPC President and CEO John Mitchell released a news statement on the passage of the bipartisan infrastructure bill in the U.S. Senate.
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New Defense Electronics Group, USPAE, Invites Industry Participation
From February 23: The U.S. Partnership for Assured Electronics (USPAE) is inviting electronics manufacturers and related companies to participate in its programs, highlighting the opportunities to collaborate with industry peers and the U.S. government.
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IPC Certification Online or In-Person
IPC Training and Certification is available from Blackfox either online, at your facility, or at one of our worldwide training centers. Experience the Blackfox difference!
LEARN MORE
Test any JBC product for free
We give you the opportunity to test our products for 30 days without any obligation.
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IPC National Hand Soldering Competitions Return to Europe
From July 20: IPC's national hand soldering competitions return to Europe this year with events scheduled in France, Estonia, and Germany. Although the 2021 IPC Hand Soldering World Championship was canceled due to ongoing pandemic concerns, skilled competitors in Europe will participate in national competitions at scheduled live tradeshows.
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IPC
3000 Lakeside Drive, 105 N | Bannockburn, IL 60015
847-615-7100 | Contact Us | www.ipc.org
IPC Global Insight
Learn About IPC's Firmware Standard
IPC is developing a firmware requirements standard. To learn more about this standard or get involved in standards development, read IPC's blog. Next standards meeting will take place at IPC APEX EXPO on Monday, January 24.
Build Electronics Better with IPC Standards
For more than 50 years, IPC standards have been the processes, procedures and criteria that the global electronics industry implement daily to design and build electronics better with quality, reliability and consistency.
Leverage A.I. and Predictive Analytics Toward Zero-Downtime, Zero-Defects Manufacturing
A few percentages of scrap reduction can yield millions of dollars in savings for manufacturers. This has led manufacturing firms to embrace Digital Transformation and leverage the Industrial Internet of Things (IIoT) and Artificial Intelligence (AI) technologies and metrics to achieve greater efficiency and productivity on the shop floor.
SPONSORED VIDEO
2022 IPC Certification Schedule
The New 2022 Solder Training and IPC Certification Schedule is here. EPTAC offers a variety of options for the way you like to learn. From In-Person (classes in 19 locations), Online, On-Site, or Dedicated Online (select the class, date and time and we deliver the program live), EPTAC has you covered.
EMS Leadership Summit at IPC APEX EXPO 2022 Brings Together Current and Future Industry Leaders
New and experienced managers will gather at the EMS Leadership Summit at IPC APEX EXPO on January 24, 2022, to discuss strategies for advancing the industry and enhancing leadership skills.
Summit Interconnect — Toronto Earns IPC-1791, Qualified Manufacturers Listing (QML) as Trusted Electronics Fabricator
IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronics Fabricator Requirements Qualified Manufacturers Listing (QML) to a Summit Interconnect printed circuit board (PCB) manufacturing facility located in Toronto, Ontario, Canada.
VIDEO SHOWCASE
Smart ang highly flexible SMT solutions
Promoted By Essemtec AG
Current Conditions for the Electronics Supply Chain Remain Challenging
IPC has issued two new industry intelligence reports: the December sentiment of the global electronics manufacturing supply chain report and the December economic outlook report. Material and labor costs continue to be the two largest issues facing the electronics supply chain.
Are You Aware of the Latest Update to the Cybersecurity Maturation Model Certification?
To help industry cut through the noise and confusion surrounding Cybersecurity Maturation Model Certification, CMMC expert Leslie Weinstein, provides a detailed breakdown of the changes that have been announced from CMMC 1.0 to CMMC 2.0, including timelines for compliance in this webinar recording.
SPONSORED CONTENT
- New 2022 IPC Certification Schedule is Here! Find the Perfect Class for You - Either Online, In-Person, On-Site or Dedicated Online
- EPTAC is Hiring. Looking for a Flexible Career in IPC Certification and Love to Train? Contact Us Today.
- Why Manufacturers Need to Invest in Digital Transformation and How it Can Affect Your Manufacturing Firm.
- Become an IPC Certified Printed Circuit Board Designer and Earn Your CID or CID+ Certification Online.
- Find the Training Materials You Need for Your IPC and Soldering Certifications - From Standards, Exam Funds and Soldering Kits.
Jackie Mattox, Founder of Women in Electronics to Keynote Women in Electronics Reception at IPC APEX EXPO 2022
Does a disruptive climate help or hinder women in the workplace? Has diversity improved in electronics? These are just a few of the topics Jackie Mattox, founder, president and CEO of Women in Electronics, will address during the Women in Electronics Reception at IPC APEX EXPO on Jan. 25, 2022.
New Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in Advanced Packaging
A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic packaging ecosystem to meet increased production of semiconductor chips, without which the semiconductor supply chain is likely to remain weak and vulnerable.
PRODUCT SHOWCASE
Ersa EXOS 10/26 - Inline Reflow Soldering with Vacuum
- Maintenance-friendly and lubricant-free roller conveyor in the vacuum module
- 4-part conveyor system, supports dual track configuration
- Easy access to the vacuum chamber through lifting unit from above
- Optimum temperature profiles through medium-wave emitters in the vacuum module
- Innovative cleaning system SMART ELEMENTS®
- Award winning
For more information, visit our website or watch our product video.
Better Electronics Start with Better Training
The term skills gap is used to describe a mismatch between the skills that employers need and the skills that job seekers possess. It seems straightforward enough, but it's often used as a catch-all phrase that oversimplifies more complex and multifaceted issues.
WHMA 29th Annual Wire Harness Conference Offers Technical Education Workshop on Federal Contract Opportunities
Representatives from the U.S. Small Business Association, Arizona District Office, will present a technical education workshop, "Selling to the Federal Government," on February 15 at the 2022 WHMA 29th Annual Wire Harness Conference in Tucson, Ariz.
SPONSORED VIDEO
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DMC 23 Series tools provide pneumatic, manual hydraulic and battery solutions for crimping large gauge contacts and terminals. These versatile tools feature interchangeable Mil-Qualified dies and locators that are capable of crimping 8 – 4/0 AWG. DMC also offers custom dies for your application.
How Can Government Help or Hurt You in 2022?
As we look towards 2022, we want to know what our members are worried about. What are the key challenges you are facing right now, and what about over the horizon? How can the IPC Government Relations team best advocate for you?
Stay Competitive with IPC Standards
IPC has released several new standards to support the electronics manufacturing industry in building electronics better. Add these to your library of standards and stay ahead of the competition by using the most current standards from IPC.
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- Assemble, Debug, and Rework PCBs Faster
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- Unified Component Search
- PCB Design Overlay Adjustment
WHMA/IPC Announces Dates for M-EXPO 2022
The fourth M-EXPO Wire Processing Technology exhibition will be held in Ciudad Juárez, Chihuahua, Mexico, Sept. 21-22, 2022. Due to ongoing COVID-19 health and welfare concerns, the event will not be held in 2021.
Help Build the Industry's Future: Become an IPC Emerging Engineer or Mentor
IPC launched the Emerging Engineer program in 2016 to provide professionals early in their careers an opportunity to learn from the dedicated industry volunteers who participate in standards development.
PRODUCT SHOWCASE
- Quite dust collection
- Quickest Conformal Coating Removal method
- Ergonomic shape for operator comfort
- Removes: Parylene, Silicones, Urethanes, Epoxies, Acrylics and Much More
- Catch pan for spent abrasive
- Great for low volume re-work
- Show with (optional) microscope
- IPC Recognized
Stay in Contact with IPC — Manage Your E-mail Preferences
In order to ensure that you receive the information you want from IPC, please manage your e-mail preferences! Please visit www.IPC.org for more information on our Privacy Policy.
IPC Global Marketplace Delivers Intelligent Search Technology
IPC Global Marketplace is an innovative buyer's guide that enables electronics industry professionals to easily locate the products and services they need to effectively run their business.
IPC Events and Education Calendar — For Your 2021/2022 Planning
Plan your professional development with IPC's Programs Calendar. Maximize your time and efforts by coordinating your schedule with ours.
Tech Question of the Week
Is there a lower limit of eutectic solder ball size where it becomes impossible to re-ball for immediate use of the IC in defense electronics? Is that because of the ball sizes available, or are there equipment limitations in removal and replacement? Are there serious problems with flux in this fine pitch application?
Status of Standardization
Standards for Ballot and Final Drafts
View IPC documents under development.
IPC Certification Online or In-Person
IPC Training and Certification is available from Blackfox either online, at your facility, or at one of our worldwide training centers. Experience the Blackfox difference!
IPC Member Milestones
Virginia Panel Corporation (Waynesboro, Va.) celebrated its 10th year as an IPC member. See other companies celebrating membership anniversaries.
Member Anniversaries
New Members
Invest in your company by joining IPC and experience the membership benefits of the industry's premier global association. Learn more about IPC membership.
Test any JBC product for free
We give you the opportunity to test our products for 30 days without any obligation.
IPC CALENDAR
Jan. 22-27 IPC APEX EXPO 2022
Feb. 15-17 2022 WHMA 29th Annual Wire Harness Conference
May 10-12 Electrical Wire Processing Technology Expo
Sept. 21-22 M-EXPO Wire Processing Technology, a WHMA/IPC Event
IPC
3000 Lakeside Drive, 105 N | Bannockburn, IL 60015
847-615-7100 | Contact Us | www.ipc.org
IPC Global Insight
Proposed Standard for Ballot
IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-9121A Troubleshooting Printed Board Fabrication Processes
IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
Final Draft for Industry Review
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-D-640A Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
J-STD-004C Requirements for Soldering Fluxes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4555 Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012EA Automotive Applications Addendum to IPC-6012E
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-6013EM Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7352 Generic Guideline for Land Pattern Design
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8941 Guideline on Connections for E-Textiles
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-HDBK-9797 Handbook and Guide to Supplement IPC-9797
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/DAC-2552 International Standard for Model Based Design (MBD) for Digital Twin Factories
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC Status of Standardization Contribute to IPC Standards by Submitting Your Comments
Individuals or companies are invited to submit a comment to IPC on standards improvement via the Standards Improvement form, found on the right. The purpose of this form is to provide the appropriate technical committee of IPC with input from the industry regarding recommendations for published standards or work in progress on new or revisions of standards being worked on. Complete the form on the right and just click on the submit button, a tech staff person will be in touch if there are any questions.
Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, design, manufacture of boards and finished assemblies. We are continually looking for ways to improve current standards but we are also looking for what might be that next standard the industry. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry. Once accepted a project is established and the great work of the industry committees starts.
IPC encourages and welcomes individuals from the global electronics industry to submit their ideas or to request to be added to a ballot group as part of the standards development process.
If you are located in Asia Pacific Market -
IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Harryhan@ipc.org Harry will contact you and review your comments to understand your interest and follow through with next steps.
IPC Standardization Procedures - provides processes, structure and ANSI policy in developing standards for the electronics industry
Status of Standardization
Published Standards
IPC-4552B May 2021 Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
J-STD-001HS May 2021 Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
Translations
No entries available.
Proposed Standard for Ballot
IPC-1401A Corporate Social Responsibility Management System Standard
IPC-1791B Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-2231A DFX Guidelines
IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-9121A Troubleshooting Printed Board Fabrication Processes
IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
Final Draft for Industry Review
IPC-6018D Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7525C Stencil Design Guidelines
IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-D-640A Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-003D Solderability Tests for Printed Boards
J-STD-004C Requirements for Soldering Fluxes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4555 Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012EA Automotive Applications Addendum to IPC-6012E
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-6013EM Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7352 Generic Guideline for Land Pattern Design
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8941 Guideline on Connections for E-Textiles
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-HDBK-9797 Handbook and Guide to Supplement IPC-9797
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/DAC-2552 International Standard for Model Based Design (MBD) for Digital Twin Factories
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
Economic Recovery Continues Along a Bumpy Path
Economic recovery continues along a bumpy path. In this month's economic outlook report from IPC, IPC's Chief Economist Shawn DuBravac offers five key observations.
IPC Urges Electronics Inclusion in US Tech R&D and Competitiveness Bill
IPC has called upon U.S. Congress to make improvements to critically important legislation that would boost investment in federal research and development in 10 high-tech fields.
Akrometrix Warpage Solutions and Testing Services
Akrometrix is the leading manufacturer of warpage solutions for the R&D Lab, and for SMT Production Lines. We are also a provider of Warpage Testing Services for our customers. We utilize Shadow Moiré, Digital Fringe Projection, and Digital Image Correlation (CTE) vision technologies. We apply the appropriate technology that provides the best quality data, specific to the given application.
- Akrometrix Software Products
- Thermal Warpage Solutions
- Room Temperature Solutions
- Testing Services Request Form
North American PCB Industry Sales Up 7.3 Percent in July
IPC announced today the July 2021 findings from its North American Printed Circuit Board Statistical Program. The book-to-bill ratio stands at 1.29.
SPONSORED CONTENT
SPONSORED CONTENT
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- --Take Your Favorite IPC Certification Class On-line, or Enroll in a New Certification and Expand Your Educational Portfolio.
- Find the Training Materials You Need for Your IPC and Soldering Certifications - From Standards, Exam Funds and Soldering Kits.
- We All Think Silicon in the Manufacturing of Semiconductor Chips is Here to Stay, or is it? Here are Some Materials that May Be Strong Contenders.
- Learn How the Internet of Things (IoT) is Shaping and Allowing Us, During These Times, to Promote the Efforts of Social Distancing.
- Find the Perfect Class for You and Choose How You Obtain Your Certification - Either Online, In-Person, On-Site or Dedicated Online.
STI Electronics, Inc. Requalifies for IPC Qualified Manufacturers Listing (QML)
IPC's Validation Services Program announces that STI Electronics, Inc., a multifaceted technical organization supporting the electronics manufacturing industry, has been requalified, at the Class 3 level, to IPC J-STD-001 and IPC-A-610, and IPC J-STD-001 Space & Military Addendum Qualified Manufacturers Listing (QML).
PRODUCT SHOWCASE
Kurtz Ersa HR600 XL – Automatic rework on large assemblies
- Active heating surface of 24 x 24 inches (625 x 625 mm)
- Highly efficient 800 W hybrid heating head
- Large-area IR Matrix bottom heater with 25 single heating elements (600 W each)
- Process observation with up to 8 thermocouples
- Automatic and precise component alignment with the help of machine vision
- Highly accurate, motor-driven axis system for component placement (+/- 0.025 mm)
- Guaranteed user-independent reproducible repair results
For more information, visit our website or watch our product video.
IPC is Crowdsourcing for Artwork and Illustrations of Electronics Manufacturing
IPC members, you can help IPC help you by letting us know of any existing or potential sources of original artwork related to electronics manufacturing.
SPONSORED VIDEO
Strip Cable 5x Faster!
Stripping shielded twisted cable just got easier with DMC’s Twist-Strip™ tool. Available in two sizes, with a variety of interchangeable die sets, Twist-Strip™ can accommodate cables from .081 to .310 OD and provides a precise strip of the outer jacket in a fraction of the time.
- Consistent & Repeatable Stripping
- Reduced Shield Damage
- Ergonomic & User-Friendly
Better By Design — Bringing PCB Design Professionals Together
IPC Design brings printed board design professionals together to connect with other designers, enjoy education and training opportunities, mentor and encourage the next generation of designer engineers, and above all, help advance the art and science of printed board design.
PRODUCT SHOWCASE
Pillarhouse Jade MkII – World's best selling selective solding system.
- 1000+ systems sold
- Up to 457 x 508mm board handling size
- Drop-Jet fluxer as standard
- Fiducial correction as standard
- 1.5mm micro-nozzle capable (world’s smallest nozzle)
- New PillarCOMM_X control software
- Multiple process enhancements available
Post Covid-19 deals available. For more information visit our website.
IPC Launches Electronics Assembly for Engineers Course
To provide a market solution to address a need for a fundamentals training course on PCBA processes and electronics manufacturing, IPC is announcing the launch of "Electronics Assembly for Engineers" (EAE) as its newest workforce development training course.
Companies Commit to Improving Chemical Management Practices
The Clean Electronics Production Network announced a new program this week to improve chemical management practices and eliminate workers' exposure to hazardous chemicals across the global electronics manufacturing industry.
PRODUCT SHOWCASE
Doesn't your stockroom deserve better?
Lightning-fast pick times, minimized storage space, elimination of errors – these are just three of the benefits DELTEC Automotive achieved when they moved their high-running part numbers into Inovaxe’s Smart Storage platform. Click to learn more about DELTEC and the benefits Inovaxe has brought to their operation!
Jumping the Technology Curve — Collaboration with your Competition
Mike Carano, IPC Thought Leaders Program Chair details the four "Cs" of maintaining a company's competitiveness — collaboration, consortium, clusters and calls to action.
PRODUCT SHOWCASE
- Quite dust collection
- Quickest Conformal Coating Removal method
- Ergonomic shape for operator comfort
- Removes: Parylene, Silicones, Urethanes, Epoxies, Acrylics and Much More
- Catch pan for spent abrasive
- Great for low volume re-work
- Show with (optional) microscope
- IPC Recognized
IPC National Hand Soldering Competitions Return to Europe
IPC's national hand soldering competitions return to Europe this year with events scheduled in France, Estonia and Germany. Although the 2021 IPC Hand Soldering World Championship was canceled due to ongoing pandemic concerns, skilled competitors in Europe will participate in national competitions at scheduled live tradeshows.
IPC Certification Online or In-Person
IPC Training and Certification is available from Blackfox either online, at your facility, or at one of our worldwide training centers. Experience the Blackfox difference!
Share Your Knowledge at Electrical Wire Processing Technology Expo 2022
WHMA/IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts for the Electrical Wire Processing Technology Expo, to be held May 10-12, 2022, at the Wisconsin Center in Milwaukee, Wisconsin.
JBC's Resource center
Download! Free eBooks & Infographics about JBC Technology
Which Government Policies Worry You Most?
The IPC government relations team is here for you year-round, but the success of our work depends on the active engagement of IPC members. We invite you to join our efforts.
Stay Competitive with IPC Standards
IPC has released several new standards to support the electronics manufacturing industry in building electronics better. Add these to your library of standards and stay ahead of the competition by using the most current standards from IPC.
WHMA/IPC Announces Dates for M-EXPO 2022
The fourth M-EXPO Wire Processing Technology exhibition will be held in Ciudad Juárez, Chihuahua, Mexico, Sept. 21-22, 2022. Due to ongoing COVID-19 health and welfare concerns, the event will not be held in 2021.
Help Build the Industry's Future: Become an IPC Emerging Engineer or Mentor
IPC launched the Emerging Engineer program in 2016 to provide professionals early in their careers an opportunity to learn from the dedicated industry volunteers who participate in standards development.
Stay in Contact with IPC — Manage Your E-mail Preferences
In order to ensure that you receive the information you want from IPC, please manage your e-mail preferences! Please visit www.IPC.org for more information on our Privacy Policy.
IPC Global Marketplace Delivers Intelligent Search Technology
IPC Global Marketplace is an innovative buyer's guide that enables electronics industry professionals to easily locate the products and services they need to effectively run their business.
IPC Events and Education Calendar — For Your 2021/2022 Planning
Plan your professional development with IPC's Programs Calendar. Maximize your time and efforts by coordinating your schedule with ours.
Tech Question of the Week
I'm looking for a standard describing Axial and TH component lead forming that described the various options to prep the components for vertical mounting, vibration, different bend points, etc.
IPC Member Milestones
JPS Composite Materials Corp. (Anderson, S.C.) celebrated its 55th year as an IPC member. See other companies celebrating membership anniversaries.
Member Anniversaries
New Members
Status of Standardization
Standards for Ballot and Final Drafts
View IPC documents under development.
|
IPC CALENDAR |
| Sept. 3-Oct. 6, 2021 | PCB Troubleshooting & Defect Analysis (every Tuesday and Thursday) |
| Sept. 15 | |
|
Sept. 21 |
Certified Electronics Program Manager (CEPM) Training Program and Certification Exam Bundle |
| Oct. 26-Nov. 18 | PCB Troubleshooting & Defect Analysis |
|
Oct. 27 |
|
| Nov. 1-Nov. 17 | |
| Nov. 8-Dec. 15 |
PCB Design for Advanced Packaging Every Monday and Wednesday |
| Nov. 9-Nov. 23 | PCB Design for Manufacturability |
| Nov. 29-Dec. 1, 2021 | The 15th Electronic Circuits World Convention (ECWC15) |
Status of Standardization
Published Standards
IPC-4552B May 2021 Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
J-STD-001HS May 2021 Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
Translations
No entries available.
Proposed Standard for Ballot
IPC-1401A Corporate Social Responsibility Management System Standard
IPC-1791B Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-2231A DFX Guidelines
IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-9121A Troubleshooting Printed Board Fabrication Processes
IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
Final Draft for Industry Review
IPC-6018D Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7525C Stencil Design Guidelines
IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-D-640A Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-003D Solderability Tests for Printed Boards
J-STD-004C Requirements for Soldering Fluxes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4555 Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012EA Automotive Applications Addendum to IPC-6012E
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-6013EM Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7352 Generic Guideline for Land Pattern Design
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8941 Guideline on Connections for E-Textiles
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-HDBK-9797 Handbook and Guide to Supplement IPC-9797
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/DAC-2552 International Standard for Model Based Design (MBD) for Digital Twin Factories
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
Dear Colleagues:
IPC has released several new standards to support the electronics manufacturing industry in building electronics better. Add these to your library of standards and stay ahead of the competition by using the most current standards from IPC.
Companion documents to IPC-J-STD-001H are available now:
IPC-HDBK-001H, Handbook and Guide to Supplement J-STD-001, provides guidance and supporting information for requirements found in the standard.
IPC-J-STD-001HS, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies, provides specific requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
If you use IPC-J-STD-001H you should be using IPC-A-610H, Acceptability of Electronic Assemblies.
Other documents that have been released:
IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
IPC-2591 V1.3, Connected Factory Exchange (CFX)
IPC Report 2021 0803
Stay Competitive with IPC Standards
IPC has released several new standards to support the electronics manufacturing industry in building electronics better. Add these to your library of standards and stay ahead of the competition by using the most current standards from IPC.
Companion documents to IPC-J-STD-001H are available now:
IPC-HDBK-001H, Handbook and Guide to Supplement J-STD-001, provides guidance and supporting information for requirements found in the standard.
IPC-J-STD-001HS, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies, provides specific requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
If you use IPC-J-STD-001H you should be using IPC-A-610H, Acceptability of Electronic Assemblies.
Other documents that have been released:
IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
IPC-2591 V1.3, Connected Factory Exchange (CFX)
If you are missing any of the standards listed above, you can order online by visiting the IPC Online Store. Have questions about using a PO to order standards send them to contact.Us@ipc.org
Status of Standardization
Published Standards
IPC-4552B, May 2021, Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
J-STD-001HS, May 2021, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
Proposed Standard for Ballot
IPC-1791B, Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-2231A, DFX Guidelines
IPC-4592, Requirements for Printed Electronics Functional Dielectric Materials
IPC-6013E, Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7526A, Stencil and Misprinted Board Cleaning Handbook
IPC-9121A, Troubleshooting Printed Board Fabrication Processes
IPC-9709A, Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
Working Draft
IPC-1402, Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A, Laboratory Report Standard
IPC-1792, Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-4555 Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012EA Automotive Applications Addendum to IPC-6012E
IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
IPC-6013EM ,Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7352 Generic Guideline for Land Pattern Design
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8941 Guideline on Connections for E-Textiles
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-HDBK-9797 Handbook and Guide to Supplement IPC-9797
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/DAC-2552 International Standard for Model Based Design (MBD) for Digital Twin Factories
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201, Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A, Generic Requirements for Electronic Product Documentation
IPC-2612-1A, Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A, Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557, Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070, Guidelines for Printed Board Component Mounting
IPC-9205, Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A, Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
Status of Standardization
Published Standards
J-STD-001HS-May 2021-Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
IPC-2591, Version 1.3-February 2021-Connected Factory Exchange (CFX)
IPC-6902-February 2021-Qualification and Performance Specifications for Printed Electronics on Flexible Substrates
IPC-9257-February 2021-Requirements for Electrical Testing of Flexible Printed Electronics
Translations
Proposed Standard for Ballot
IPC-1791B-Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-2231A-DFX Guidelines
IPC-4552B-Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
IPC-4592-Requirements for Printed Electronics Functional Dielectric Materials
IPC-6013E-Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7526A-Stencil and Misprinted Board Cleaning Handbook
IPC-9121A-Troubleshooting Printed Board Fabrication Processes
IPC-9709A-Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
Final Draft for Industry Review
IPC-6018D-Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7091A-Design and Assembly Process Implementation of 3-D Components
IPC-7525C-Stencil Design Guidelines
IPC-9701B-Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
IPC-A-640A-Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-D-640A-Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-T-50N-Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-003D-Solderability Tests for Printed Boards
J-STD-004C-Requirements for Soldering Fluxes
Working Draft
IPC-1402-Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A-Laboratory Report Standard
IPC-1792-Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C-Generic Standard on Printed Board Design
IPC-2228-Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A-Design Standard for Printed Electronics on Flexible Substrates
IPC-4202C-Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4412C-Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-4555-Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-4922-Requirements for Sintering Materials for Electronics Assembly
IPC-5262-Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012EA-Automotive Applications Addendum to IPC-6012E
IPC-6012F-Qualification and Performance Specification for Rigid Printed Boards
IPC-6013EM-Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7077-Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7092A-Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251-Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7352-Generic Guideline for Land Pattern Design
IPC-7621A-Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A-Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8941-Guideline on Connections for E-Textiles
IPC-8952-Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8981-Quality and Reliability of E-Textiles Wearables
IPC-9202A-Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A-Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242-Guidelines for Microsection Evaluation
IPC-A-610J-Acceptability of Electronic Assemblies
IPC-HDBK-005A-Guide to Solder Paste Assessment
IPC-HDBK-9797-Handbook and Guide to Supplement IPC-9797
IPC-SM-840F-Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/DAC-2552-International Standard for Model Based Design (MBD) for Digital Twin Factories
IPC/JPCA-8911-Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA-Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J-Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201-Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A-Generic Requirements for Electronic Product Documentation
IPC-2612-1A-Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A-Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557-Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070-Guidelines for Printed Board Component Mounting
IPC-9205-Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A-Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
Published Standards
IPC-2591, Version 1.3-February 2021-Connected Factory Exchange (CFX)
IPC-6902-February 2021-Qualification and Performance Specifications for Printed Electronics on Flexible Substrates
IPC-9257-February 2021-Requirements for Electrical Testing of Flexible Printed Electronics
Proposed Standard for Ballot
IPC-1791B-Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-2231A-DFX Guidelines
IPC-4552B-Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
IPC-4592-Requirements for Printed Electronics Functional Dielectric Materials
IPC-6013E-Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7526A-Stencil and Misprinted Board Cleaning Handbook
IPC-9121A-Troubleshooting Printed Board Fabrication Processes
IPC-9709A-Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
J-STD-001HS-Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
Final Draft for Industry Review
IPC-6018D-Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-7091A-Design and Assembly Process Implementation of 3-D Components
IPC-7525C-Stencil Design Guidelines
IPC-9701B-Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
IPC-A-640A-Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-D-640A-Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-T-50N-Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-003D-Solderability Tests for Printed Boards
J-STD-004C-Requirements for Soldering Fluxes
Working Draft
IPC-1402-Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A-Laboratory Report Standard
IPC-1792-Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C-Generic Standard on Printed Board Design
IPC-2228-Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A-Design Standard for Printed Electronics on Flexible Substrates
IPC-4202C-Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4412C-Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-4555-Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-4922-Requirements for Sintering Materials for Electronics Assembly
IPC-5262-Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012EA-Automotive Applications Addendum to IPC-6012E
IPC-6012F-Qualification and Performance Specification for Rigid Printed Boards
IPC-6013EM-Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7077-Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7092A-Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251-Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7352-Generic Guideline for Land Pattern Design
IPC-7621A-Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A-Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8941-Guideline on Connections for E-Textiles
IPC-8952-Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8981-Quality and Reliability of E-Textiles Wearables
IPC-9202A-Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A-Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242-Guidelines for Microsection Evaluation
IPC-A-610J-Acceptability of Electronic Assemblies
IPC-HDBK-005A-Guide to Solder Paste Assessment
IPC-HDBK-9797-Handbook and Guide to Supplement IPC-9797
IPC-SM-840F-Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/DAC-2552-International Standard for Model Based Design (MBD) for Digital Twin Factories
IPC/JPCA-8911-Requirements for Conductive Yarns for E-Textiles Applications
J-STD-001HA/A-610HA-Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J-Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
IPC-2201-Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A-Generic Requirements for Electronic Product Documentation
IPC-2612-1A-Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A-Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557-Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070-Guidelines for Printed Board Component Mounting
IPC-9205-Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A-Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision ABottom of Form
IPC Status of Standardization
Contribute to IPC Standards by Submitting Your Comments
Individuals or companies are invited to submit a comment to IPC on standards improvement via the Standards Improvement form, found on the right. The purpose of this form is to provide the appropriate technical committee of IPC with input from the industry regarding recommendations for published standards or work in progress on new or revisions of standards being worked on. Complete the form on the right and just click on the submit button, a tech staff person will be in touch if there are any questions.
Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, design, manufacture of boards and finished assemblies. We are continually looking for ways to improve current standards but we are also looking for what might be that next standard the industry. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry. Once accepted a project is established and the great work of the industry committees starts.
IPC encourages and welcomes individuals from the global electronics industry to submit their ideas or to request to be added to a ballot group as part of the standards development process.
If you are located in Asia Pacific Market -
IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Harryhan@ipc.org Harry will contact you and review your comments to understand your interest and follow through with next steps.
IPC Standardization Procedures - provides processes, structure and ANSI policy in developing standards for the electronics industry
Top of Form
Status of Standardization
Published Standards
February 2021
Qualification and Performance Specifications for Printed Electronics on Flexible Substrates
February 2021
Requirements for Electrical Testing of Flexible Printed Electronics
January 2021
Handbook and Guide to Supplement J-STD-001
Translations
No entries available.
Proposed Standard for Ballot
Trusted Electronic Designer, Fabricator and Assembler Requirements
DFX Guidelines
Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
Requirements for Printed Electronics Functional Dielectric Materials
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Stencil and Misprinted Board Cleaning Handbook
Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
Final Draft for Industry Review
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Design and Assembly Process Implementation of 3-D Components
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Solderability Tests for Printed Boards
Requirements for Soldering Fluxes
Working Draft
Generic Standard on Printed Board Design
Design Standard for Printed Electronics on Flexible Substrates
Flexible Base Dielectrics for Use in Flexible Printed Wiring
Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
Requirements for Sintering Materials for Electronics Assembly
Design, Critical Process and Acceptance Requirements for Polymeric Applications
Automotive Applications Addendum to IPC-6012E
Qualification and Performance Specification for Rigid Printed Boards
Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
Design and Assembly Process Implementation for Embedded Circuitry and Devices
Generic Requirements for Through-Hole Design and Land Pattern Standard
Generic Guideline for Land Pattern Design
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
Guideline on Connections for E-Textiles
Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
Quality and Reliability of E-Textiles Wearables
Acceptability of Electronic Assemblies
Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
Requirements for Conductive Yarns for E-Textiles Applications
Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
Requirements for Soldered Electrical and Electronic Assemblies
Project Approved
Requirements for Physics of Failure Analysis for Components and Assemblies
Generic Requirements for Electronic Product Documentation
Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
Guidelines for Printed Board Component Mounting
Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
Dear Colleagues:
IPC has released several new standards to support the electronics manufacturing industry in building electronics better. Add these to your library of standards and stay ahead of the competition by using the most current standards from IPC.
Companion documents to IPC-J-STD-001H are available now:
IPC-HDBK-001H, Handbook and Guide to Supplement J-STD-001, provides guidance and supporting information for requirements found in the standard.
IPC-J-STD-001HS, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies, provides specific requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
If you use IPC-J-STD-001H you should be using IPC-A-610H, Acceptability of Electronic Assemblies.
Other documents that have been released:
IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
IPC-2591 V1.3, Connected Factory Exchange (CFX)
If you are missing any of the standards listed above, you can order online by visiting the IPC Online Store.
Published Standards
IPC-2591, Version 1.3 February 2021 Connected Factory Exchange (CFX)
IPC-6902 February 2021 Qualification and Performance Specifications for Printed Electronics on Flexible Substrates
IPC-9257 February 2021 Requirements for Electrical Testing of Flexible Printed Electronics
IPC-HDBK-001H January 2021 Handbook and Guide to Supplement J-STD-001
Proposed Standard for Ballot
IPC-1791B Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-2231A DFX Guidelines
IPC-4552B Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
J-STD-001HS Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
Final Draft for Industry Review
IPC-6018D Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-9121A Troubleshooting Printed Board Fabrication Processes
IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-D-640A Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-003D Solderability Tests for Printed Boards
J-STD-004C Requirements for Soldering Fluxes
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-2221C Generic Standard on Printed Board Design
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-4555 Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012EA Automotive Applications Addendum to IPC-6012E
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-6013EM Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7352 Generic Guideline for Land Pattern Design
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/DAC-2552 International Standard for Model Based Design (MBD) for Digital Twin Factories
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
IPC CALENDAR
June 2 Factory of the Future Webinar Series: The ABC’s of DfX in Electronics Manufacturing
June 8 Supply Chain Disruption, Economic Recovery, and What to Expect in the Post-Pandemic World
June 29 Critical Environmental Requirements for Electronics
July 5-Aug. 11 PCB Design for Extreme Environments (every Monday and Wednesday)
July 6-Aug. 12 Introduction to PCB Design I (every Tuesday and Thursday)
July 13 Leveraging USG Trade Assets for Sales Support
Aug. 24-Sept. 16 PCB Troubleshooting & Defect Analysis (every Tuesday and Thursday)
Aug. 28-Sept. 2 IPC SummerCom
Aug. 30-Oct. 6 PCB Design for Military & Aerospace Applications (every Monday and Wednesday)
Aug. 30-Oct. 6 PCB Design for Rigid-Flex Boards (every Monday and Wednesday)
Aug. 31-Oct. 21 Introduction to PCB Design II (every Tuesday and Thursday)
Published Standards
IPC-2591, Version 1.3 February 2021 Connected Factory Exchange (CFX)
IPC-6902 February 2021 Qualification and Performance Specifications for Printed Electronics on Flexible Substrates
IPC-9257 February 2021 Requirements for Electrical Testing of Flexible Printed Electronics
IPC-HDBK-001H January 2021 Handbook and Guide to Supplement J-STD-001
IPC-2551 December 2020 International Standard for Digital Twins
Proposed Standard for Ballot
IPC-1791B Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-4552B Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
J-STD-001HS Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
Final Draft for Industry Review
IPC-7525C Stencil Design Guidelines
IPC-9121A Troubleshooting Printed Board Fabrication Processes
IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Working Draft
IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing
IPC-1753A Laboratory Report Standard
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-4412C Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards
IPC-4555 Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-6013DM Medical Applications Addendum to IPC-6013D Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7352 Generic Guideline for Land Pattern Design
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8941 Guideline on Connections for E-Textiles
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-610J Acceptability of Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-HDBK-9797 Handbook and Guide to Supplement IPC-9797
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC/DAC-2552 International Standard for Model Based Design (MBD) for Digital Twin Factories
J-STD-001HA/A-610HA Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
J-STD-003D Solderability Tests for Printed Boards
J-STD-004C Requirements for Soldering Fluxe
Project Approved
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4412B Am 3 Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards - Amendment 3
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
IPC Releases New "H" Revision to Two Leading Standards for Electronics Assembly, IPC J-STD-001 and IPC-A-610
IPC has released H revisions of two leading standards for the electronics assembly industry: IPC J-STD-001H, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610H, Acceptability of Electronic Assemblies
PC-A-610 Acceptability of Electronics Assemblies Training and Certification Program
- IPC Help for Instructors and Users
- Training Course Topics
- Program Benefits
- Support for Training A-610 Certified Instructors
- Support for Training A-610 Application Specialists
- Updates to Training Materials for Amendments
- Ordering information for 610E Translated Training Materials
- Authorized Training Centers
Translated Training Materials
Translated training materials for this program are available. Additional languages are continuously being added.
Targeting Excellence in Electronics Assembly
Support for Lead Free and Modular Training at the Application Level!
IPC-A-610, Acceptability of Electronic Assemblies is the most widely used standard published by the IPC. With multiple language versions, it has an international reputation as the source for end product acceptance criteria for consumer and high reliability printed wiring assemblies.
An industry developed and approved program that includes training, certification and instructional materials based on the IPC-A-610 is available to your company. This certification will demonstrate your commitment to customer requirements and greatly assists any company dedicated to ISO-9000 or other quality assurance initiatives.
This training and certification has immediate recognition, legitimacy and value throughout the electronics industry. Thousands of individuals have been trained to be IPC-A-610 Certified IPC Trainers. A comprehensive and technically accurate program, IPC-A-610 Training and Certification provides Certified IPC Trainers with high quality materials and detailed instructional plans for training Application Specialists at all levels, including buyers, sales teams and management.
How the IPC Certification Program Works
IPC-A-610 Training and Certification program has two tiers of instruction. Certified IPC Trainer candidates are sent by their parent companies to receive intensive training on the IPC-A-610 from an IPC authorized certification center. Candidates are certified once they complete their course of study and pass the certification examinations. If they feel they do not need the training course, candidates may opt to take a "challenge test" administered by one of the certification centers. Certified IPC Trainers are provided instructional materials for training Application Specialist in a modular training program. Certified IPC Trainers are considered certified for two years after the course completion date. They must then re-certify at an IPC authorized certification site.
Instructor Training Course Topics
- Establishing and maintaining integrity of the certification program
- Purpose and application of IPC-A-610
- Hardware installation
- Soldering criteria, including lead free connections
- Soldered requirements for connecting to terminals
- Soldered connection requirements for plated-through holes
- Surface mounting criteria for chip components, leadless and leaded chip carriers
- Swaged hardware and heatsink requirements of mechanical assemblies
- Component mounting criteria for DIPS, socket pins and card edge connectors
- Jumper wire assembly requirements
- Solder fillet dimensional criteria for all major SMT component groups
- Soldering, such as tombstoning, dewetting, voiding and others
- Criteria for component damage, laminate conditions, cleaning and coating
- Steps to effectively using the lesson plan and materials, tips on inspection and a review of important Certified IPC Trainer skills
Who Should Become a Certified Trainer
Anyone responsible for the quality and reliability of electronic assemblies should consider becoming an IPC-A-610 Certified IPC Trainer. Trainers and quality supervisors versed in electronic assembly are excellent candidates for A-610 training, as are engineering and manufacturing supervisors with assembly responsibilities.
"An excellent course of study on an excellent document… My students were nervous about testing, but we have had high pass rates and a lot of personal satisfaction gained from participating in the training. Without question, the greatest strength of the program is its relevance: it is used by our operators every day. The program has given the entire facility a much higher level of common knowledge about terminology and important concepts."
~ Bernie Schaeffer, Kimball Electronics Group
Program Benefits
The IPC-A-610 Training and Certification Program offers those interested in company-wide quality assurance initiatives in an industry traceable, IPC-sponsored program to support their commitment to continuous improvement of product quality and reliability. The program provides individuals with a portable credential that represents their understanding of the IPC-A-610.
Download the course synopsis (schedule format).
All IPC-A-610 Certified IPC Trainers receive materials for participating in the A-610 training as well as instructional materials for conducting the Modular Application Specialist training. The modular approach lets users control cost by tailoring training to the specific needs of their work force.
These include:
- A CD-ROM with full color teaching visuals illustrating every aspect of the IPC-A-610 document and training information, and all reports and forms required for conducting Application Specialist training
- An Instructor Guide, providing complete instructions for conducting the Application Specialist training and testing
- IPC-A-610 Acceptability of Electronic Assemblies and IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits
- Open and closed book Application Specialist Written Examinations
- IPC certificate of course completionApplication Specialist training materials, including official, serialized IPC certificates, may be purchased from IPC only by Certified IPC Trainers and the companies they represent. Certified IPC Trainers may teach the course at any location and to any audience and may set a training fee, if applicable.
The term for an IPC-A-610 Certified IPC Trainer is two years. Re-certification training is conducted at the IPC Licensed Certification Centers.
Support for Training A-610 Certified Instructors
| Last Updated | |
| IPC Training and Certification Policies and Procedures | 4/22/2019 |
| Certification Portal User’s Guide | 10/4/2018 |
| A-610G Training Materials Checklist | 12/7/2017 |
Support for Training A-610 Application Specialists
| Last Updated | |
| IPC Training and Certification Policies and Procedures | 4/22/2019 |
| Certification Portal User’s Guide | 10/4/2018 |
| IPC-A-610G for CIT to train CIS – Editorial updates slides | 6/13/2018 |
| A-610G Training Materials Checklist | 12/7/2017 |
* If this is your first time using the Certification Help Desk, you will be prompted to create an account. You must create an account to receive a response.
Updates to Training Materials for Amendments
These files are being made available to update existing training PowerPoints in each of the indicated courses with the changes in the Amendments for each course.
To use the files:
- Click on the link for the desired course.
- To train CIT - ZIP file, 9.6 MB
- To train CIS - ZIP file, 13.9 MB
- Download the zipped files.
- Edit your existing full training course PowerPoint files to include or replace the existing training slides as appropriate.
Included with each zipped file is a “How to” PowerPoint. The “How To” PowerPoint includes step-by-step instructions for adding the amended slides (to train CITs) and for replacing the original slides with the amended slides (to train CIS).
Updates to Training Materials for Policy & Procedure:
The slides in the downloadable Zip files are the complete, module Policy and Procedure modules. The slides are intended to be used with revision 6 of the Policy and Procedures document.
Instructions for use:
- Download the files
- PP6CIT.zip file to use for MITs to train CITs
- PP6CIS.zip file to use for CITs to train CISs
- Unzip the PPT presentation
- Remove the existing PPT presentation from the training program
- Use the new, downloaded PPT presentation for presenting in training classes.
For information about IPC standards with DRM protection, visit www.ipc.org/drm.
This standard describes materials, methods and acceptance criteria for producing soldered electrical and elec-tronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levelsduring the manufacture of products. It is not the intent of this standard to exclude any procedure, such as for componentplacement or for applying flux and solder used to make the electrical connection.The soldering operations, equipment, and conditions described in this document are based on electrical/electronic circuitsdesigned and fabricated in accordance with the specifications listed in Table 1-1.
Table 1-1 Design, Fabrication and Acceptability Specifications
| Board Type | Design | Fabrication/Acceptability Specification |
| Generic Requirements | IPC-2221 | IPC-6011 |
| Rigid Printed Boards | IPC-2222 |
IPC-6012 IPC-A-600 |
| Flexible Circuits | IPC-2223 | IPC-6013 |
| Rigid Flex Board |
IPC-2222 IPC-2223 |
IPC-6013 |