This is a comprehensive Technology report on how to make magnetics smaller using embedded magnetics in organic substrates, integrated magnetics on silicon or glass and hybrid packages. With power rail count increasing, current demand increasing both efficiency and miniaturization of power delivery system is the need of the hour. This report has three main focus areas:
1) Magnetics with magnetic materials embedded in organic substrate
2) Magnetics with magnetic films integrated on silicon or glass
3) Magnetics for hybrid packaging – discrete magnetic components in package substrate
Some of the key takeaways include:
Eemerging application need and the quest for improving
the system-level efficiency and reliability are the main driving force towards embedded and integrated magnetics.
Availability of embeddable magnetic materials and thermal managements are key roadblock towards embedded and integrated magnetics.
Key R&D opportunities in embedded and integrated magnetics are:
Developing high-performance CMOS compatible magnetic material
Developing thermally conductive magnetic material for superior thermal management
Improved metrology to assess material and device performances at higher frequencies
Usage of AI-ML for predicting and optimizing magnetic material properties, modelling non-linearity, and improving designs
This report is available in digital form only.