3D Power Electronics Integration and Manufacturing Symposium Open for Registration

Registration is now open for the Third Biennial International 3D-PEIM-21 Symposium. Hybrid live/virtual event will occur on June 21-23, 2021, Osaka University, Japan


PSMA announces that registration is now open for the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-21) to be held June 21-23, 2021. The event will be hosted by Osaka University, Japan at their Graduate School of Engineering.

Due to the unforeseen status of the COVID-19 pandemic in the months ahead, the committee has cautiously decided to hold a hybrid in-person/virtual event. At the hybrid symposium, anyone can attend either in person or virtually. Presentations will be live from both in-person and virtual presenters. All presentations will be recorded and available to paid attendees. Attendees may switch registration between virtual and in-person up to one month before the Symposium.

3D-PEIM has successfully re-invited all the postponed 2020 program world-class experts to present in 2021. Continuing the 2016 and 2018 Symposia’s success, 3D-PEIM-21 again assembles world-class experts representing a far-reaching range of disciplinary perspectives exploring the path to the development and manufacture of future 3D power electronics systems. Created and supported by the PSMA Packaging Committee, the Symposium encompasses additive, embedded, co-designed and integrative packaging technologies. Sessions will address mechanical, materials, reliability and manufacturability issues in deploying smart power-dense components and modules.

PSMA is sponsoring the 3D-PEIM-21 Symposium as part of its ongoing commitment to educate and inform the power electronics industry. Other technical supporting organizations include CPES/Virginia Tech, Daicel Japan and the IEEE Electronics Packaging Society.

The Technical Program Co-Chairs are Professor Katsuaki Suganuma, Osaka University, Japan, Minoru Ueshima, PhD., Senior Manager, Daicel, Japan and Professor Guo-Quan Lu, Virginia Tech. 

The technical session program and session chairs are:

S1 Plenary I: Tsuyoshi Funaki, Osaka University, Japan
S2 Systems Integration & Thermal Management: Christina DiMarino, Virginia Tech, USA
S3 Multiphysics Design and Tools: Michihiro Shintani, Nara Institute of Science and Technology (NAIST), Kansai Science City, Japan
S4 Additive Manufacturing: Patrick McCluskey, University of Maryland, USA and Douglas Hopkins, North Carolina State University, USA
S5 Plenary II: Katsuaki Suganuma, Osaka University, Japan
S6 Manufacturing Technologies: John Bultitude, Kemet Corporation, USA
S7 Materials: Jason Rouse, USA
S8 Heterogeneous Integration: Cyril Buttay, Laboratoire Ampère, France
S9 Quality and Reliability: Steven Martell, Nordson Sonoscan, USA
S10 NEW! Partners Session: Minora Ueshima, Daicel, Japan

A detailed program with time zone information for virtual attendees is available at www.3d-peim.org/program. Due to time zone challenges, all sessions will be recorded and available to paid attendees after the Symposium.

General Chair Professor Tsuyoshi Funaki states, “I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. We are planning on providing an amazing on-site or virtual experience for all attendees. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this event”.

The Symposium will feature table-top exhibits during the breaks, lunch periods and evening networking sessions. On the last day of the Symposium in-person attendees are invited on a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery. Additional information and registration details are available at www.3D-PEIM.org.

Interested in being a 3D-PEIM 2020 Exhibit Partner?  Information can be found at www.3d-peim.org/sponsors-exhibitors.  If you have questions, contact info@3d-peim.org.

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