PSMA website
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Table of contents
  1. Plans Moving Ahead for APEC 2021 – Stay Tuned
  2. PSMA 2020 Annual Meeting
  3. Meet Your Directors
  4. Message from the PSMA Executive Committee
  5. About Our Members
  6. Welcome to PSMA
  7. 35th Anniversary of PSMA & APEC
  8. PSMA Launches Webinar Series to Prepare for the Next Power Technology Roadmap
  9. PSMA Energy Efficiency and Safety & Compliance Databases Access Now Open
  10. Power Magnetics @ High Frequency Workshop
  11. How to Choose and Define Capacitor Usage for Various Applications, Wideband Trends and New Technologies
  12. EnerHarv 2020 – Important Update
  13. 3D-PEIM 2021: The Third International Symposium on 3D Power Electronics Integration and Manufacturing
  14. 2021 International Power Supply-on-Chip (PwrSoC) Workshop
  15. WiPDA 2020 Workshop: The 8th Workshop on Wide Bandgap Power Devices and Applications
  16. Announcing the International Workshop on Integrated Power Packaging (IWIPP 2021)
  17. Department of Energy Seeks Input on Energy Conservation Standards for External Power Supplies – Call to Action!
  18. Automotive 4.0 – The New Revolution?
  19. Events of Interest – Mark Your Calendar
Contents | Next->

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: Be sure to include your name and the name of your company.

Previous issues of update: Q3_2019 | Q4_2019 | Q1_2020

PSMA UPDATE is published and distributed via e-mail quarterly by the Power Sources Manufacturers Association. Send editorial information and comments to:

P.O. Box 418
Mendham, NJ 07945-0418

  (973) 543-9660
(973) 543-6207 (Fax)
Web Site:

Publisher: Stephen Oliver   Managing Editor: Lisa Horzepa

Permission to reprint information and articles as published is granted: a courtesy line is appreciated.

Membership in PSMA is open to any organization or corporation involved in the power sources and supplies industry. For membership information, visit our website or contact us by fax, telephone or email.

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: Be sure to include your name and the name of your company.



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Plans Moving Ahead for APEC 2021 – Stay Tuned

As we all remain impacted by the effects of COVID-19 and as we start to see some early movement toward slowing reopening the world economy, plans for APEC2021 are now being developed. The Call for Papers (CfP) has been distributed, along with a request for reviewers. Stay tuned for additional details and I encourage everyone to check with for updates over the coming weeks.

I'm rather sure everyone who reads this newsletter has seen the announcement regarding the effects of the cancellation of APEC2020. The three sponsors, including PSMA, have taken a serious financial impact. Regardless, we continue to see movement toward full recovery.

To "close the book" on APEC2020, here is how the APEC website reported on the complex efforts involved in providing refunds and making available the great conference content:

The Steering Committee and the Sponsors of the APEC conference, IEEE PELS and IAS in partnership with the PSMA, wish to thank our loyal community for their patience as we worked through the complex business negotiations required legally to reach our desired goal of maximizing your refund. Always, the health and safety of our APEC community was paramount in actions taken and our decision making.

The IEEE Societies and PSMA acknowledge the economic strain this situation has placed on our exhibitors, attendees, and vendor/provider partners. All of whom we consider part of our APEC community. To that end, dozens of individuals have worked tirelessly for weeks to assure a responsible and equitable outcome.

We would like to assure our community that the Sponsors have, since the beginning of this process, agreed to take no financial proceeds and in fact agreed to absorb a significant loss to settle obligations to vendors in order to maximize the refund to attendees and our valued and loyal Exhibitors.

To that end, the Sponsors have also agreed to absorb additional costs allowing us to now offer the following refund schedule:

  • Exhibitors will receive a 100% refund
  • Partners (i.e. APEC exhibiting companies who purchased APEC partnerships) will receive a 100% refund
  • Attendees will receive a 40% refund
  • Spousal tours and any extras (extra social tickets, proceedings/workbooks) will be returned at 100%

To date, all the technical and program materials have been distributed electronically via the APEC mobile app, website, or other electronic means to our registered attendees for download. We will continue to make other elements available as they become available. Furthermore, for our author community, we have arranged for all submitted papers to be published in IEEE Xplore (waiving the requirement for the papers to be presented).

As a multi-tiered and large-scale event, we hope our community can appreciate that APEC requires multiple years of planning and thousands of hours of labor, representing a significant investment across conference partners and service providers. Added to that complexity this year was the daunting task of interpreting and navigating the evolving national, state, and city-wide policies in the early days of the COVID-19 epidemic. Information regarding travel bans and health commission decisions were in flux right up to our decision point.

We wish the APEC community to please know that our decision to cancel when we did was to absolutely cap or limit those financial obligations and expenses so that the organizers and sponsors would be in a final position to return as much money as possible to our attendees and valued exhibitors.

We thank you all for your continued support and patience, and pledge to continue to work hard to advocate on your behalf.

Since this statement was published, APEC has also announced that select additional recordings and other content will become available on, or around, July 1st. Again, check for more details. PSMA is also doing it's part and will present some of the Industry Session content that it had planned in webinar format.

As a long-standing participant in APEC for over 30 years, I have personally witnessed and benefitted from this truly amazing industry event. My hope and frankly my prayers are that we will return to the growth and excitement of our work together in 2021. In the meantime, please stay safe. 

Provided by Greg Evans,
APEC 2021 Publicity Chair



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PSMA 2020 Annual Meeting

Outgoing Chair
Stephen Oliver
Incoming Chair
Mike Hayes

T he PSMA Annual Meeting, originally scheduled to be held in New Orleans, was changed to a virtual meeting due to the Covid-19 pandemic and the cancellation of the in-person APEC. Almost 60 PSMA members and guests attended the meeting.

Outgoing Chair Stephen Oliver opened the meeting at 10 a.m. CDT. He welcomed all attendees and introduced Mike Hayes who was elected Chair by the Board of Directors at the February Board meeting.

Mike Hayes introduced the Executive Team that will serve 2020 -2022:

  • Chair
  • President
  • Vice President
  • Secretary/Treasurer
  Mike Hayes
Fred Weber
Trifon Liakopoulos
Tim McDonald

Next on the agenda was the election of four people to the Board of Directors. Each candidate introduced themselves and provided a brief summary of their background and reasons for wanting to serve on the board. The following candidates were elected to the Board of Directors for the three-year term (2020-2023):

  • Ada Cheng
  • Dhaval Dalal
  • Fred Weber
  • Brian Zahnstecher
ON Semiconductor
Future Technology Worlwide
PowerRox, LLC

Mike Hayes congratulated the four Directors, all elected to serve their second terms.

Mike then presented awards to Tony O'Brien and Brian Zahnstecher, Co-Chairs of the Reliability Committee, for their leadership of PSMA's newest committee, formed in 2017, and publication of the 2019 PSMA Power Supply Software/Firmware Reliability Improvement Project and Report.

Tony O’Brien,
Reliability Committee Co-Chair
Brian Zahnstecher,
Reliability Committee Co-Chair

Jose Cobos, General Chair for APEC 2020, reviewed the background and decision by the committee with the three sponsors to cancel the in-person APEC2020 due to the COVID-19 Pandemic. He also briefly identified some of the major and outstanding issues with the convention center, the many vendors, exhibitors and individual registrants that were being addressed.

The Steering Committee is considering the possibility of organizing a Virtual APEC program that would include presentations of the Plenary Session, accepted Technical Papers, planned Seminars and selected Industry Sessions, but the details have not yet been worked out.

APEC2021 is scheduled March 21-25 in the Phoenix Convention Center but detailed planning has been delayed as the Organizing Committee addresses the outstanding issues with APEC2020.

Mike Hayes, Chair, discussed the mission of the Association, the current status of the membership, the immediate concerns in scheduling and being able to hold a number of workshops scheduled for 2020 and other challenges facing the Association.

Mike briefly reviewed and discussed his vision and objectives for the next two years including:

  • Keeping and Nurturing the Good Stuff,
  • Becoming more Applications and Problems oriented,
  • Define and integrate metrics to monitor the parameters that matter,
  • Engage more with stakeholders,
  • Sustenance and Smart Growth.

Mike then presented an overview of the background and objectives of the PSMA Tiger Teams, small ad hoc groups formed to resolve short and very targeted initiatives that can be addressed quickly. He reviewed a list of completed and ongoing projects recently addressed. Among completed projects include a comprehensive Privacy Policy, a Workshop Support Policy, the new PSMA logo and consolidation of Active Technical Committees. Ongoing Tiger Team projects include an updated website and improving the Public Image.

Secretary/ Treasurer Tim McDonald presented the Financial Report including PSMA's current financial status and a six-quarter financial forecast. Tim highlighted that the forecast is based on the best-known data at this point in time but that there are a lot of additional uncertainties in the post COVID-19 world.

Each of the PSMA Committees provided updates on the recent activities. All of the committees support the 2021 Power Technology Roadmap, and most are planning to provide at least one webinar to the roadmap webinar series. The committees all had face-to-face meetings planned during APEC and will be rescheduling these meetings by webconference in the coming weeks.

  • Fred Weber, Capacitor Committee Co-Chair, reported that the committee is planning an educational webinar on the process of choosing a capacitor, using datasheets and comparing benefits vs. drawbacks. This will be the fourth webinar in the Capacitor Basics series. The first 3 webinars are available on the Educational Resources section of the Capacitor Committee Forum on the PSMA website. The committee organized its Third Annual Workshop and plans to offer the Workshop in virtual form in the coming weeks.
  • Mike Hayes and Brian Zahnstecher, Energy Harvesting Committee Co-Chairs, reported that the committee membership is approaching 50 members with 10 to 15 attendees at their meetings each month. Some of the initiatives they are considering for 2020 include generating a white paper and supporting a student design contest. The EnerHarv 2020 Workshop scheduled for NSCU Assist Center in Raleigh in mid-June has been canceled due to COVID19 and will be rescheduled.
  • David Chen and Ed Herbert, Energy Management Committee Co-Chairs, reported the committee is considering a number of topics for educational and Roadmap webinars including an update on rules and requirements for energy labelling and ecodesign in EU, strategies to meet or beat regulatory requirements, life-cycle analysis, modeling carbon savings as related to the grid and energy storage technologies. The committee continues to support the efforts to update the Energy Efficiency Database. Arnold Alderman provided a brief update on the current status of the EEDB.
  • Mike Hayes reviewed the objectives of the Industry-Education Committee which are to promote interaction between power electronics students and industry and to promote power electronics to university and pre-university students. The committee held an in-person meeting in October 2019 in conjunction with the PSMA Planning Meeting and is looking to increase the committee activities and initiatives. Ideas being considered included mentorship opportunities, competitions, videos, and webinars. The committee is also interested in partnering with and championing projects with other PSMA committees and outside organizations. Anyone interested in joining this effort to encourage and support students, the future of the power electronics industry, was encouraged to contact PSMA at
  • Steve Carlsen and Ed Herbert, Magnetics Committee Co-Chairs, reported that the committee has been sponsoring two special projects during the past year. The PSMA-SMA Core Loss Studies - Phase II project report is complete and available to members on the PSMA website. The committee also sponsored 2 webinars in early 2020 on the Basics of Magnetics for Switching Power. Under the leadership of Matt Wilkowski and Ed Herbert, the committee, with technical support from IEEE PELS, organized the 5th Power Magnetics @ High Frequency Workshop and plans to offer the Workshop in virtual form in the coming weeks.
  • Frank Cirolia and Greg Evans, Marketing Committee Co-Chairs, provided an overview of the committee and highlighted some of the activities on its current agenda. A new Membership Brochure was created and is now available. They are also looking at the best way to proceed with updating the Handbook of Standardized Terminology. The committee has been involved with many of the recent and current Tiger Team initiatives including the selection of a new PSMA logo and providing feedback for the PSMA web site now in development.
  • Power Packaging and Manufacturing Committee Co-Chairs, Brian Narveson and Ernie Parker, reviewed the activities and results of the committee this past year. There are over 20 people on the committee, with a good cross-section of industry and academia. The committee is very active, supporting 3 upcoming workshops 3D-PEIM in Osaka, Japan, IWIPP in Aalborg, Denmark, and PwrSoC in Philadelphia, PA, USA.
  • Dhaval Dalal and Conor Quinn, Power Technology Roadmap Committee Co-Chairs, reported that the committee has just begun the planning for the 2021 Power Technology Roadmap and presented a timeline for the activities leading up to the final report. They are looking to fill a couple of vacant segment co-chair positions and soliciting contributions from PSMA committees for the 2020 webinar series.
  • Tony O'Brien and Brian Zahnstecher, Reliability Committee Co-Chairs, reported that the committee which was formed in 2017 has monthly meetings and has 29 members. The initial focus of the committee was to sponsor a Special Project. The project has been completed and the PSMA Power Supply Software/Firmware Reliability Improvement Report was distributed to the membership. Work has recently begun on a new special project, the Power Supply Communication Bus Reliability Initiative and they are targeting late 2020 for the publication of the project report. 
  • Mike Hayes reported that the Safety & Compliance Committee has become inactive and is looking for new leadership. Anyone interested in helping to reactivate the committee was encouraged to contact the PSMA office at Arnold Alderman, provided a brief update of the current status of the Safety and Compliance Database on the PSMA website. Former committee co-chairs, Kevin Parmenter and Jim Spangler, have also continued to provide monthly articles on Safety and Compliance issues to How 2 Power.
  • Tim McDonald and Tirtha Sarkar, Co-Chairs of the Semiconductor Committee, reported the committee has been very active this past year and organized four Industry Sessions for APEC2020 that included a total of 19 high quality presentations. The committee is considering organizing a number of virtual Industry Sessions to present the material prepared. The committee considered a Special Project during 2019 and continues to look for project sponsoring opportunities. They supported the successful WiPDA 2019 and are involved in the preparations for WiPDA 2020.
  • Ralph Taylor and Fred Weber, Transportation Power Electronics Committee Co-Chairs, reported the committee has been very active this past year. One of the committee's main focusses has been how to leverage the information learned from the 2019 special project to address the current awareness of APEC and PSMA within the Automobile Industry and make recommendations to attract companies in that industry to participate in PSMA events.

Invited speaker Marc Benowitz, iNEMI

The invited speaker at this year's Annual Meeting was Marc Benowitz, CEO of iNEMI, the International Electronics Manufacturing Initiative, which is a nonprofit R&D consortium of approximately 80 leading electronics manufacturers' suppliers, associations, government agencies and universities. He reviewed the organization, their roadmap, current projects and projects planned for the next few years.

Marc also suggested some possible areas that PSMA and iNEMI might consider collaborating on in the near and longer term. The PSMA Power Technology Report Technical Committee discussed that there has been cooperation with the iNEMI Roadmap team over the past several years and each has made contributions to their respective Roadmaps.

Mike Hayes and Marc Benowitz agreed that the two Associations will work to increase the relationship and identify areas of mutual benefits.

Before adjourning, Chair Mike Hayes asked the attendees for their comments and input on the Annual Meeting as a virtual meeting. The response to the virtual meeting was very positive and the number of PSMA members in attendance was comparable to previous in person meetings. Mike Hayes thanked all presenters and attendees for their participation.

The minutes from the PSMA Annual Meeting have been posted in the Members Only area of the PSMA web site together with the charts from the presentations.


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Meet Your Directors

Four members of the Board of Directors are elected at the PSMA Annual Meeting held every year during the APEC conference. Each Director serves a three year term and is eligible to be reelected for one additional term.

In this issue we would like to introduce you to Mike Hayes and Fred Weber who are both serving their second term.
Mike Hayes (M.Eng.Sc.) Head of Group ICT4EE, Tyndall National Institute

Mike is an established technology and thought leader in 'power IoT' promoting synergy opportunities between power electronics, energy harvesting and ICT domains. He has written a number of publications, participated in EU studies, presenting & chairing conferences and workshops related to this. His team delivered the world's 1st indoor energy harvesting power management solution operating indefinitely in indoor lighting conditions and for 72 hours in darkness. The team has also delivered MISCHIEF, the world's leading multi-source energy harvesting compatible PMIC (power management IC) for ultra-low power applications He is currently work package leader on several EU energy efficiency projects and co-ordinator of a 'Powering the Internet of Things' infrastructure project ('EnABLES') worth $6M giving industry access (expertise, equipment, models, feasibility studies) to 11 leading research centers and universities in Europe (Tyndall, Fraunhofer, IMEC, CEA et al.)

Mike gained 20 years power electronics industry experience at Artesyn Technologies in various design and senior management roles developing custom power supplies for blue chip telecoms companies. He has previously managed a number of technology collaborations with Power Electronics Ireland and Tyndall.

Mike has over 30 years of experience working in the Power Electronics industry & research. He is an active member of the PSMA Packaging, Energy Management and Energy Harvesting Committees. He has been a member of the PSMA Executive Committee since 2016 and now serves as Chair.

Mike currently works at Tyndall as head of the ICT for Energy Efficiency Group covering collaborative projects on power electronics & energy efficiency for IoT applications. Tyndall is one of Europe's leading research centers and a world leader in PSiP & PwrSoC domains and an epicenter for micro-power energy harvesting research in Europe.

Key achievements to date related to PSMA

  • Co-chair of the Energy Harvesting Committee since 2015
  • Co-chair of PSMA Energy Harvesting industry session at APEC since 2017
  • Co-founder with Brian Zahnstecher (PowerRox) and general chair of EnerHarv, an inaugural PSMA led energy harvesting international workshop (May 2018)
  • Contributor to 2017 & 2019 PSMA Technology Roadmap (Energy harvesting applications)
  • Managed PSMA 3D Power Packaging Phase 1 special project 
  • Represented PSMA in workshop steering committees for PwrSoC, IWIPP2017 and ECPE

Mike continues to identify, promote & drive industry/academic synergies internationally particularly between packaging, MEMS manufacturing, ICT, energy harvesting & power management. This was demonstrated at EnerHarv2018 where over 80 industry and academics participants form 4 continents gathered together forming an ecosystem driven to collaborate together to devise solutions to power the internet of things. This is expected to be a trillion sensor economy by 2025 and a disruptive opportunity for the power electronics community. In 2018 he received a leadership award from University College Cork (Tyndall's parent university) for his various 'powering IoT' initiatives over the past decade. 

Outside of work Mike is a keen golfer, plays tennis, runs, follows the 'highs and lows' of the Cork hurling team and enjoys travel and leisure time with his family. 

Provided by Mike Hayes, Head of Group ICT4EE, Tyndall National Institute

Fred J. Weber, President, Future Technology Worldwide, LLC

Fred Weber is the President of Future Technology Worldwide. LLC (FTW), a Manufacturers Representative firm covering the Great Lakes States with a portfolio of product, component, and service Principals tuned to Power Electronics. Having earned both a degree in Electrical Engineering from the University of Evansville, and an MBA from the University of Michigan, Fred has a strong technical and business acumen. This has been strengthened by years of product design, project management, and sales experience. His ability to open doors, close sales, and manage accounts has allowed FTW to steadily grow since its founding in 2001.

FTW has been a member of the Power Sources Manufacturers Association (PSMA) for almost 10 years.

Fred is active in the PSMA Magnetics Committee, and serves as the co-Chair of the Capacitor Committee, and the Transportation Power Electronics Committee and is currently the President of PSMA.

"I originally joined PSMA to help support a few of my Principals. I found that the diverse membership of PSMA and their continuous effort to educate, keep abreast of the latest technologies and create a networking community were ideal for my business and my personal professional growth. It is my honor and pleasure to work with the PSMA Board and Executive Staff to help guide PSMA into the future. PSMA has made great strides in the past year(s) to cement its position as the leading Power Electronics Organization. It is my goal to help PSMA continue to build on our position and to grow into industries that have only recently migrated towards Power Electronics. These industries are involved in Vehicle Electrification, Autonomous Vehicles, the Internet of Things (IoT) and Energy Storage to name a few."

Provided by Fred Weber, President, Future Technology Worldwide

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Message from the PSMA Executive Committee

H ello friends and members of PSMA.

I was honored to be elected as chair of PSMA accompanied by a very strong executive team comprising Fred Weber (President), Trifon Liakopoulos (Vice-President) & Tim McDonald (Secretary/Treasurer).

Many thanks and appreciation to outgoing Chair Steve Oliver for his leadership the past two years. 

I am delighted to announce that we are adding 2 new features to our newsletter, the PSMA UPDATE.

The first one will be a 'Message from the Executive Committee'. In this issue I will provide a high-level overview of our vision and activities. In future editions, one of our Executive Committee members will give a brief update and a more detailed insight into some of our activities. As was presented at the PSMA Annual Meeting, we have categorized our vision for the future of PSMA into 4 areas and assigned a champion to each one:

  1. The 1st one Maintaining strengths (continue doing what our members seeing as most valuable, e.g. roadmaps, workshops, education) – championed by Tim
  2. Becoming more applications and problems oriented (how PSMA can help you solve real life issues, identify trends, market opportunities, etc.) - championed by Fred
  3. Putting more metrics in place to monitor our performance, assess feedback, identify opportunities to improve, etc. – championed by Trifon
  4. Engaging more with our industry and academic stakeholders, increasing collaborations with existing partners and finding strategic new ones – championed by Mike

Based on discussions to date, the anticipated strategic areas we have identified are IoT (internet of things), Smart Mobility (clean, efficient, safe and connected transportation) & Energy Storage (from micro-power to grid power). But we are open to suggestions from our members.

The second new feature in the PSMA UPDATE will be 'Friends of PSMA' and will start in the next issue.  PSMA has links with many other industry associations and we plan to use this space to increase awareness of this and to promote synergies. First up will be the China Power Supply Society (CPSS). If you have suggestions on new links or ways we can improve our current links with other industry associations, we would be delighted to hear from you.

Finally, please let us know what  you like to see in the PSMA UPDATE newsletter.  Suggestions are always welcome!

Mike Hayes
PSMA Chair
Tyndall National Institute


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  About Our Members 
About Our Members


Indium Corporation

Since its founding in a small garage in Central New York over 85 years ago, Indium Corporation has established itself as a leader in the research and development of new materials and products to solve the industry challenges of today and the future. Now a global company with 13 facilities worldwide, Indium Corporation believes that materials science changes the world, and their commitment to innovation is reflected in the continuing growth of the company's R&D department.

Indium Corporation is dedicated to providing proven, reliable materials for power electronics in automotive, mobile, 5G infrastructure, and other applications across the globe. This commitment is seen in their collaboration with industry partners and customers to address the challenges facing the industry, as well as in their own devotion to developing cutting-edge materials that meet or exceed the ever-evolving power requirements.

As a result, Indium Corporation has developed a wide portfolio of industry-proven materials for power electronics, ranging from solder paste to solder preforms and ribbons, thermal interface materials, and silver sintering paste, such as:

  • InFORMS® reinforced solder alloy fabrications that improve mechanical and thermal reliability while ensuring uniform bondline thickness. InFORMS® also address specific challenges of the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
  • QuickSinter® silver sintering paste delivers consistent, high-speed sintering on a variety of surfaces and die metallizations. QuickSinter® works well in both high- and low-temperature pressure or pressureless applications. It can be used for discretes, small modules, and integrated power modules.
  • Metal thermal interface materials (TIMs) are available for a wide variety of applications and process challenges. Heat-Spring® TIM offers uniform thermal resistance with minimized surface resistance and increased heat flow. HSMF is a compressible TIM that is ideal for large area thermal interface requirements, such as IGBTs.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

Provided by Jingya Huang, Marketing Communications Assistant Manager, Indium Corporation





MinDCet NV

MinDCet is experienced in application-specific integrated circuits (ICs) development for power electronics and measurement systems with over 10 years of innovative solutions. The company was founded by Mike Wens and Jef Thoné as a spin-off from the KULeuven University in Leuven, Belgium. Since then, the MinDCet team has grown to become world-renowned specialists in analog-mixed mode and high-voltage IC design. MinDCet's measurement systems business unit is developing and delivering state-of-the-art inductor and capacitor measurement equipment to globally renowned passive component manufacturers and related industries.

IC Design & Production

Our customers require unique integrated circuit solutions, as off-the-shelf products cannot fulfill their requirements. MinDCet develops encompassing solutions in partnership with the customer by guiding them from the idea stage to the implementation of the custom IC. During this process, MinDCet takes care of the entire development and production chain. Dedicated teams of IC designers, layout engineers, characterization/test engineers and application engineers ensure a predictive and controlled flow from idea to final product. Whether your product needs radiation hardening, high temperature-, high-speed-, high-voltage- and high-reliability-capabilities, MinDCet has the expertise and readiness to provide a fitting result.To date, Astronics power engineers have generated dozens of patents for power systems on aircraft.

A lab-technician programming a production IC test setup.
A 40V / 5A intelligent half-bridge IC.

MinDCet is your single point of contact, taking care of the entire IC process: foundry access, prototyping, characterization, packaging, test development, and the final production and testing. Our network of partners ensures a stable production flow. Since 2019, test development and final production testing are conducted in-house in our new cleanroom facilities. This approach offers significant benefits in timing and cost reduction as the characterization and test steps are combined. Additionally, the closed-loop interaction between our test engineers and IC designers enables short response times, an essential aspect towards a stable production flow.

A BGA packaged GaN gate-driver IC
and the test-socket.

MinDcet Standard IC Solutions

The MADMIX inductor measurement system.

MinDCet firmly believes in a green future driven by wide-bandgap power electronics. Consequently, we have an established track record in developing supporting ICs for wide bandgap circuits, specifically GaN and SiC gate-drivers, signal isolators and monolithic GaN power ICs. Currently, our unique gate-driver solutions are being launched as standard products to further enable wide-bandgap power electronics applications.

Measurement Systems

In the early days of MinDCet, we discovered that switched-mode power supply (SMPS) inductors and capacitors were missing the required models to accurately simulate SMPS circuits. As a key component in the power IC development, this deficit triggered our in-house development of the MADMIX and MADCAP equipment. These patented systems allow measurement of AC losses in SMPS inductors and capacitors under real-life, switched-mode stimuli. Although initially developed for internal use, today this equipment is commercially available and found in many labs throughout the world.

Future Outlook

We live with power on our minds, pushing the power electronics industry to the next level. MinDCet's success story will continue with cutting-edge power products, available in the near future. Stay tuned at

A micro-photograph of a 200V monolithic GaN half-bridge with integrated gate-drive.

Provided by Mike Wens, CEO, Managing Director, MinDCet NV


Richardson Electronics Power and Microwave Technologies
Richardson Electronics – Power & Microwave Technologies

For over 70 years, Richardson Electronics has been an industry-leading global provider of engineered solutions, power and microwave components.

With an extensive global supply network and a presence in over 43 countries, we are well equipped to meet the challenges and considerations unique to any location around the world. We speak the local language and transact in local currencies.

Power electronics is one of our two focus markets. Thanks to our history and specialization in vacuum tubes, we have test capability and experience that reach exceptionally high voltages and high power- up to 100kV and over 100KA.
Leading edge technologies we distribute and support include Silicon Carbide devices and ultracapacitors for a range of applications, along with current generation IGBTs, capacitors, batteries, gate drivers, magnetics, thermal management and related products. Our partners are in the US, Europe, Korea, Japan, China and more; giving us the best performance at competitive costs. Familiar names include Cornell Dubilier, Fuji Semiconductor, LS Mtron, Tamura, UnitedSiC, Starpower, Kendeil, Ohmite and more.

We are more than just a specialized distributor. By and large, we are experts in identifying and designing in disruptive and leading edge technologies, introducing new products to the market, developing solutions for our customers' needs, and providing exceptional global support.

As a manufacturer and authorized distributor, Richardson Electronics – Power & Microwave Technologies' division provides specialized technical expertise and engineered solutions based on our core engineering and manufacturing capabilities. We also provide solutions and add value through design-in support, systems integration, prototype design and manufacturing, testing, logistics, and aftermarket technical service and repair—all through our existing global infrastructure. Our portfolio of products and detailed product specifications, and other valuable information can be found on

Provided by Jeffrey T. Kerner, Business Unit Manager, Power & Energy,
Power & Microwave Technologies, Richardson Electronics, Ltd.


Editors Note: We would like to feature your company in a future issue of the Update. Please contact the Association Office for information about how to submit an article for consideration.

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Welcome to PSMA
   We are pleased to welcome 2 new member companies this quarter. We hope your company is a member. To learn about the benefits of membership, please visit our web site

Alpine Power Solutions
Aldo Caprio
4300 Biscayne Boulevard, Suite 203
Miami, FL 33137
Telephone: 786-241-1577

Alpine Power Solutions mission is to provide specialists in the many different areas of the professional world with the tools to truly power their careers and achieve a synergy amongst the people their work unites. From the batteries that keep your devices and vehicles running to the electrical equipment used by the professionals with the highest standards, Alpine Power Solutions will be there building a stronger world with you from the very first spark.


CSA Catapult
Stephen Berry
Innovation Centre
Celtic Way, Imperial Park
Newport, Wales NP10 8BE
United Kingdom
Telephone: 01633373193

CSA Catapult was established to help the UK become a global leader in compound semiconductors through collaboration with both large companies, and start-ups to develop and commercialise new applications utilising this technology. Compound semiconductor technology has such potential that it has triggered a cascade of innovative developments at UK companies and research institutes. But the market for compound semiconductors is so new that the infrastructure, systems and processes for realising a concept in the form of a working prototype or a complete system board have not been readily available to UK companies. CSA Catapult's vision is for the UK to become a global leader in developing and commercialising new applications for compound semiconductors. And aims to accomplish this through the knowledge and expertise of their talented team based at the world-class Innovation Centre, in the heart of the compound semiconductor cluster in Newport, South Wales.


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35th Anniversary of PSMA & APEC

C an you believe that the PSMA & APEC are both 35 years young this year? We can look back on our accomplishments and look forward to what we will achieve in the next decade. That means that there is still time to add to the list of accomplishments. For inspiration, here are some PSMA accomplishments over the years:

  • Sponsored APEC (Applied Power Electronics Conference)
    • Created and organized various APEC Industry Sessions
    • Pioneered APEC Presentation Awards
    • Pioneered APEC Student Travel Support
    • Pioneered pre- APEC Magnetics & Capacitor Workshops
  • Supported and contributed to the International Future Energy Challenge (IFEC)
  • Supported Industry input on proposed regulations and standards
  • Created the Energy Efficiency and Safety & Compliance Databases, a collection of international standards and regulations.
  • Pioneered the Power Technology Roadmaps.
  • Pioneered the PwrSoC Workshop, 3D-PEIM Symposium and EnerHarv Workshop
  • Published series of reports on trends and advances in power packaging and 3D Power Packaging working with leading universities and technical organizations.
  • Republished and made available several out of print industry reference books on magnetics

If your company is not yet a member of PSMA, visit to learn more about joining PSMA and adding your voice to the almost 200 companies, organizations and educators who for 35 years have worked together to support the mission and initiatives of PSMA and to influence the directions of the Power Sources Industry.

PSMA Technical Forums - A place for PSMA to share knowledge and information.

Consider how you can contribute to the many opportunities this year, here are few to get started:

  • Contact the Power Technology Roadmap Committee on how you can help the upcoming Power Technology Roadmap 2021.
  • Attend an Energy Management Committee meeting to learn how you can stay informed and help shape upcoming regulations from the US Department of Energy in external power supplies.
  • Attend a Semiconductor Committee meeting to contribute to the adoption of wide bandgap semiconductors.
  • Attend a Transportation Power Electronics Committee meeting to understand the electrification of automobiles and other vehicles.
  • Attend a Reliability Committee meeting to address power supply communication bus issues.
  • Help lead the Safety and Compliance Committee to discuss emerging electromagnetic compliance and certification testing issues facing designers and meeting customer demands.

If you are interested in any of these opportunities, email

In addition, all of the PSMA Technical Committees welcome your participation in planning and organizing industry sessions for APEC 2021. Help to raise the bar for APEC 2021 Industry Sessions with new presenters with different views discussing their perspectives. Regardless of whether APEC 2021 is the traditional in person conference or virtual event, people still need to hear new points of view and interact with others to discuss the emerging opportunities in the power electronics industry.

APEC has grown and evolved from the first conference in 1986 with 250 Attendees and 20 Exhibitors while staying true to the original ideals, solidifying its status as the leading conference for practicing power electronics professionals. View the APEC 35th Anniversary presentation to see the conference roots and learn more about the volunteers starting with the original "Gang of 8" who have made APEC so successful!

First APEC Social (All 250 Attendees)

Provided by Ada Cheng and Frank Cirolia
PSMA Marketing Committee members

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PSMA Launches Webinar Series to Prepare for the Next Power Technology Roadmap (PTR)

This Online webinar series will feature industry experts who will discuss ongoing trends in power technology. The biweekly seminars will be held throughout 2020 and extend into 2021 and will set the stage for the next PSMA Power Technology Roadmap

The Power Sources Manufacturers Association announces a series of webinars as a lead-up to the next edition of the PSMA Power Technology Roadmap (PTR). The webinar series, organized by the PSMA Power Technology Roadmap Committee, will feature invited experts from different fields to offer a range of technological perspectives. In addition to setting the groundwork and providing input for the next PTR, the webinars will give participants access to expert opinions on technology trends and include a question and answer session at the end of each session.

The webinar series will include a number of highly regarded industry and academic experts covering a variety of topics covering components, systems, packaging and applications. The series began on February 20 with a presentation by Ajay Hari of ON Semiconductor "Utilizing WBG Devices in Next Generation Power Converters." Two webinars were held in May, "JEDEC JC-70 Issues Industry First Guidelines for Testing and Evaluating Wide Bandgap Power Devices" presented by Stephanie Watts Butler, Texas Instruments and Peter Friedrichs, Infineon; and "Powering & Retrofitting IoT Devices for Industry 4.0" by Mike Hayes and Peter Haigh, Tyndall National Institute. Future topics include "Ultra-High Density Double-Sided Half-Bridge Packaging with Organic Laminates", "Advanced Packaging Concepts for Wide Band Gap Power Electronics", "Switching Performance of Wide Band Gap Devices", and many others.

Webinars are tentatively scheduled to be held every other Thursday from 10:00-11:00 a.m. Central Time. For updates to the schedule and news of webinars that will be added, please visit: and follow us on LinkedIn and Twitter. To join the PSMA mailing list to receive invitations to all upcoming webinars, sign up at

The Power Technology Roadmap provides a consolidated outlook of trends in power conversion technology for the next two to five years. The trends provided in the report are intended to give a broad outlook of the power conversion technologies, components and applications. The complete Roadmap document has been published every two or three years, incorporating the content of the Roadmap Webinars Series conducted over the months prior to publication. The other content for the PTR is sourced from recognized industry experts and comprises write-ups about trends in components, applications, emerging technologies and university research. It also includes a comprehensive projection of key metrics evolution in four selected power conversion technologies (ac-dc front-end power supplies, ac-dc external power supplies, isolated dc-dc converters and non-isolated dc-dc converters).

Conor Quinn of Artesyn Embedded Technologies and Dhaval Dalal of ACP Technologies, Power Technology Roadmap Committee Co-chairs, stated; "The PTR webinars provide a window into technology trends and the presentations are unique in terms of their diversity of perspectives, commercial-free tone and the opportunity they offer for the audience to interact with industry experts. We are always looking to enrich and expand our panel of webinar presenters and we welcome suggestions and proposals from prospective speakers." Joe Horzepa, PSMA Executive Director, added that the Committee "welcomes and invites subject matter experts who are willing to actively participate and contribute to the development of the next PSMA Power Technology Roadmap to contact the PSMA Association Office at"

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PSMA Energy Efficiency and Safety & Compliance Databases Access Now Open

No Registration Required

T he Power Sources Manufacturers Association (PSMA) announced the opening of the popular Safety & Compliance Standards Database (SCDB) and Energy Efficiency Regulations Database (EEDB) to the industry with no registration required. You can find information about a Regulation or Standard, its most recent version, revision history, or the latest agency updating work. PSMA has successfully offered the EEDB and SCDB databases to the industry at no charge to the user for several years. Now access is even easier with neither a registration nor log-in required to access all of this industry regulations and standards information.

Every product sold today must meet the requirements of agency regulations, and ultimately standards. Each country or group of countries may have different requirements. It is critical to know the specific ones which your product must comply and the ones requiring compliance within the next two to four years, products you are probably just commencing to design. Since there are numerous regulations and standards, the SCDB and EEDB databases simplify access to the one you need to find. The specifics for each of these databases and how you can easily find them is as follows.

To find the databases, go the PSMA Home Page and follow the links to the database or use the direct links:

The Energy Efficiency Database (EEDB)

PSMA Energy Management Committee sponsors the Energy Efficiency Database, which covers energy efficiency regulations globally for power supplies and motor drives. This database presently tracks on a daily basis 56 agencies and 521 regulations. A significant number of regulations are presently under revision, or revision is complete to become active in 2021/2022.

Figure 1 shows the regulation selection page. You can select a specific agency by application, country or state, or global region. You can also select a regulation by the application. The "Recent or Upcoming Events" section lists all the latest work on all regulations tracked by the database with the most recent date first.

Figure 1 – Energy Efficiency Database Regulations Page

The Safety & Compliance Database (SCDB)

The PSMA Safety & Compliance Committee sponsors the SCDB, which monitors the Power Electronics Standards globally. Presently, this database tracks 778 standards from 50 agencies. The Standards categories include: Product Safety, EMC, Material Toxicity, Environmental, Quality Standard, Performance, Energy Efficiency, and Fundamental Standard.

Figure 2 shows the standard selection page. As with EEDB, you may select a specific agency by application, country or state, or global region. If you have the standard number, you can find it quickly in the bottom selection menu box. The "Recent or Upcoming Events" section lists all the latest work on all standards tracked by the database by the latest date first.

Figure 2 - Safety & Compliance Database Standards Selection Page with Agency Drop List Shown Expanded

And… PSMA Helps You to Stay Up-to-Date Weekly

PSMA further simplifies your access to Regulation updates and Standard updates by offering weekly email announcements containing the latest "Recent or Upcoming Events". This permits you to stay current automatically with present change considerations and work in process on standards and regulations upgrades. There are an average of 30 updates each month from agencies around the globe which the PSMA database team gathers and includes in the weekly email updates. To receive this service, which is provided at no cost to the recipient, you just need to sign up, provide your email address and select the update announcements you want to receive -  SCDB,  EEDB or both.

The direct links to sign up for email updates to the EEDB data base  is

The direct link to sign up for email updates to the SCDB is

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Power Magnetics @ High Frequency Workshop

Webinar Series Tuesday May 12 – Tuesday June 16, 2020

T he fifth Power Magnetics @ High frequency workshop that was originally scheduled for Saturday March 14 in New Orleans was replaced by a virtual workshop series consisting of five webinar sessions during the months of May and June 2020. The twenty-four presentations, including nine technical presentations, twelve technical demonstrations and three posters, that were planned for the face-to-face workshop were distributed across the five webinar sessions.

Each of the webinar events featured four to six presentations based on homogeneous content for the session followed by a panel question and answer session that continued until all questions from the attendees were answered. This virtual workshop continued the tradition of the first four Power Magnetics @ High Frequency workshops held each year since 2016 by bringing together experts from all aspects of the magnetics industry research and academic organizations, world renowned consultants and the everyday heroes of magnetics design who are responsible for commercializing magnetic products on a regular basis. Registered attendees for this workshop and the Capacitor Workshop originally scheduled in parallel were able to attend both and have access to the workshop materials and webinar recordings from all sessions. Attendees for the event were able to receive Continuing Education Units (CEU) as part of their registration.

This Power Magnetics @ High frequency virtual workshop event addressed following issues:

  • winding techniques including different analysis techniques and application examples,
  • progress in design, modeling, and simulation software techniques towards utilizing models that address magnetic material characteristics of actual waveform of power circuit technologies
  • characterization techniques to provide measurement data to create models for magnetic materials and structures
  • new magnetic materials and magnetic structures on the horizon

Many thanks to the invited presenters and panelists which included Charles Sullivan (Dartmouth), Minjie Chem (Princeton), Kyle Jensen (Rubadue), Thomas Brander (Wurth Elektronik), Pedro Alou and Alberto Delgado (Universidad Politecnica de Madrid), Jannik Schafer (ETH Zurich), Murat Kaymak (RWTH Aachen University), Rachel Yang (Massachusetts Institute of Technology), Tom Wilson (Simplis Technologies), Jose Molina (Frenetic), Chris Oliver (Micrometals), Andrija Stupar (Simplis Technologies), J.C. Sun (Bs&T), Phyo Aung Kyaw (Resonant Link), Mike Wens (MinDCet),  Steve Sandler (Picotest), Tobias Schuster (Omicron Lab), Kadziolka (MESCO), Marcin Kacki (SMA Magnetics), Rodney Rodgers (AllStar Magnetics), Mark Rine (Hitachi Metals America), John Noble (Spang Power Electronics) and Joel Salas (Ferroxcube)

The focus and interactive activities of the workshop series will continue to evolve to support its purpose:

  • identify the latest improvements in areas of magnetic materials, coil (winding) design, construction and fabrication,
  • identify, discuss and demonstrate evaluation techniques, characterization techniques modelling tools and simulation tools needed to meet the technical expectations and requirements for power magnetics operating at higher frequencies for a wide range (1 watt thru 100 kilowatts) of output power applications.
  • identify and discuss the technical expectations and requirements of higher application frequencies and emerging topologies that are being driven by continuous advances in circuits topologies, semi-conductor devices driven by new market applications for both low-power and high-power applications.

Planning for the sixth Power Magnetics @ High Frequency workshop is now in progress. Based on preliminary survey results the tentative themes for the 2021 workshop are EMI issues caused and solved by magnetic components for the morning lecture presentation session and integrated magnetics for the afternoon lecture presentation session. Magnetic materials on the horizon will be included in the technology demonstration session. Anyone interested in participating as a lecture presenter or as part of the technology demonstration session during the next workshop planned for March 20, 2021 in Phoenix, Arizona should contact the PSMA office ( We are looking forward to the sixth workshop and driving the industry forward to meet the expectations of the workshop attendees.

Organizing Committee
Steve Carlsen, Raytheon Systems Company
Ed Herbert, PSMA
Rodney Rogers, Allstar Magnetics
George Slama, Wurth Elektronik
Fred Weber, Future Technology Worldwide
Chuck Wild, Dexter Magnetic Technologies Inc.
Matt Wilkowski, EnaChip

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How to Choose and Define Capacitor Usage for Various Applications, Wideband Trends and New Technologies

PSMA and IEEE PELS Sponsored Workshop Webinar Series Tuesdays April 21 – May 5, 2020

T he Power Sources Manufacturers Association (PSMA) and the IEEE Power Electronics Society (IEEE PELS) jointly sponsored the virtual capacitor workshop "How to Choose and Define Capacitor Usage for Various Applications, Wideband Trends, and New Technologies". The Capacitor Workshop had been scheduled in parallel with a Magnetics Workshop on the Saturday prior to APEC.

The year 2020 started with a major challenge that hit all of us hard. After months of preparation for the third consecutive PSMA and PELS Capacitor Workshop scheduled on March 14th in New Orleans everything changed dramatically. With a worldwide travel ban and the cancellation of APEC, we had to change the very successful in-person workshop format into a virtual session in just a couple of weeks. Despite the difficulties the Workshop Committee faced, their primary goal was to create the highest possible value to all of the registered attendees which would closely follow the agenda planned for the in-person workshop. Both of the committees, Magnetics and Capacitor agreed, that as an additional bonus, registered attendees would be offered both workshops regardless of which workshop they had originally signed up for.

With the tremendous effort of the Capacitor Committee and the magnificent support of the PSMA staff, the virtual workshop outline solidified and the schedule was published accordingly.  On three consecutive Tuesdays, that started on April 21st the Capacitor Workshop attracted presenters and attendees from around the world. A mixture of technical based presentations from industry professionals and contributions from professors of international renowned universities were well fitted into the three sessions. Supporting demonstrations as well as a live video panel discussion took place to make this virtual workshop a success.

Without exaggeration, the 2020 virtual Capacitor Workshop was a success based on the outstanding efforts of all presenters. With professors and technicians, technical marketing experts and specialists covering a wide range of subjects the value to all attendees was much more than just a replacement of the planned workshop in New Orleans. Brilliant sessions, presented by international speakers from the United States to Europe down to New Zealand had been a promise to all of the participants. Each session concluded with a live and interactive question and answer session and panel discussion that continued until all audience questions were addressed. The feedback was more than just positive. We are pleased to recap that, despite the unique circumstances, the 2020 Capacitor Workshop fulfilled the mission of the workshop organizing committee "to educate the attendees on capacitor trends, technologies, and innovations… to present the best material available to meet the industry's needs." All of the highest praise, and respect is extended to the presenters, the PSMA and IEEE PELS staff and all of the attendees for their contributions. All of the presentations were made available to participants and each session was recorded and is available to all registrants for viewing on demand.

Special credits to all the speakers and organizers for their overwhelming efforts and unstintingly contribution listed below:

  • Pat Wheeler, University of Nottingham, UK; Trends and Challenges in Components for Aircraft Electrification
  • Kevin O'Connor, Caporus Technologies, US, Capacitive Energy Storage in Power Conversion Systems
  • Mark J. Scott, Miami University, US; Failure Modes and Conditional Monitoring Techniques for Capacitors
  • Dong Cao, GE EPISCenter and University of Dayton, US; High Density Converter Capacitor Design Challenges for Data Center and Automotive Application
  • Stephan Menzel, CapXon Europe, Germany; Solid Conductive Polymer and Hybrid Technologies
  • Wilmer Companioni, KEMET Electronics Corporation, US, Ceramic Capacitors for Harsh Environments / Ceramic Capacitors for RF Applications
  • Frank Puhane, Würth Elektronik, Germany; Backup Your Application – Hot Swappable Supercapacitor Backup Solution / DC Link Capacitor and Wireless Power Transfer A Perfect Couple
  • Manuel Gomez, TDK Electronics, US; Innovative Film Capacitor Technologies For Wide Band-Gap Semiconductors
  • Nihal Kularatna, Waikato University, NZ; Benefits of Million Times Larger Capacitance in EDLCs
  • Mike Wens, MinDCet NV, Belgium; Custom Integrated Power Management Solutions
  • Hengzhao Yang, New Mexico Institute of Mining and Technology, US; Peukert's Law for Supercapacitors Physics and Application

The 2020 Capacitor Workshop was different in many ways to prior years. With the feedback provided by attendees following each session, we learned a lot about this format and were able to incorporate many of suggestions received in the later sessions. While nothing will fully replace the face to face dialog and interaction during an in-person workshop, the virtual session is an excellent alternative and/or add-on to increase the value and convenience to attract more attendees all over the world. And the virtual format also allowed individuals to participate in both the Capacitor and Magnetics workshops. With these and additional takeaways from the workshops in 2020 and previous years, we are looking forward to an even brighter future and even more successful workshop 2021 in Phoenix AZ, or perhaps virtually again.

Provided by members of the Capacitor Workshop Organizing Team:
Pierre Lohrber, Wurth Electronics
Fred Weber, Future Technology Worldwide

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EnerHarv 2020 – Important Update

"Building the Ecosystem for Powering the Internet of Things"

T o our many EnerHarveteers and the extended 'power IoT' ecosystem, it is with great consternation and sadness that we feel obliged to announce the indefinite postponement of EnerHarv 2020 event in light of the COVID-19 pandemic situation. We were very excited by interest, agenda and the pedigree of participants we were lining up for the event.

The health, safety, and wellbeing of our attendees/organizers/presenters and their families are our number one priority.  Even if there is a decreased risk and lifting of travel bans by the June '20 timeframe, there is still a risk and we decided it was too high to consider maintaining the event, even at-risk.  There is also a very important mental aspect to health and wellbeing, which would be put to the test if we were to try and move forward with the event in the absence of high confidence in being able to hold it and/or have delegates be able to travel and show up for it.

Notices like these seem to be the norm these days so it appears no further explanation is required as you are likely hearing this type of thing many times a day now.

On the bright side, most of the existing team is fully-committed to putting together a new event when the dust settles on this virus so we thank them for that and stay tuned for when we are able to remerge with plans for a near future EnerHarv event!!!  Please keep the site bookmarked.

Lastly, we want to extend a very heartfelt and deep gratitude to all members of the EnerHarv Workshop Committee (EWC), our accepted and proposed Keynote/Speakers, our host (NC State University ASSIST Center), our Tech Co-sponsors (IEEE PELS, EnABLES, CPSS), our Media Co-sponsors (How2Power, Bodo's Power Systems), our Industry Sponsors (Wurth Elektronik, Analog Devices), and especially for the financial and administrative backing of our Organizing Sponsor, PSMA.

With warm regards and an optimistic, EnerHarviest view toward the future,

Mehmet Ozturk, General Chair
Brian Zahnstecher, General Co-chair
Mike Hayes, Technical Co-chair
Shad Roundy, Technical Co-chair

Mehmet Ozturk
Brian Zahnstecher
Mike Hayes
Shad Roundy

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3D-PEIM 2021 The Third International Symposium on 3D Power Electronics Integration and Manufacturing

Osaka University, Japan

Postponed Due to Coronavirus Threat until June 21-23, 2021 at Osaka University

PSMA, sponsor of the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) announces the postponement of the Symposium until June 21-23, 2021. We remain committed to maintaining the same Symposium venue at Osaka University in Japan on our new date.  We are fortunate to continue to have the 2021 Symposium organization led by: General Chair: Prof. Tsuyoshi Funaki of Osaka University, Japan with Technical Program Co-Chairs: Prof. Katsuaki Suganuma, Osaka University, Japan; Dr. Minora Ueshima, Daicel, Japan; and Prof. Guo Quan Lu, Virginia Tech, U.S.A.

The 3rd biennial 3D-PEIM Symposium is planning on re-inviting as many of the original world-class experts as possible, representing a far-reaching range of disciplinary perspectives to advance the development of future 3D power electronics systems. The Symposium encompasses additive, embedded, co-designed, and integrated packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power-dense components and modules.

Professionals and Academics engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees an excellent opportunity to gain insight or broaden expertise in 3D power electronics packaging and integration. As in the past, we will arrange the Symposium schedule to provide ample time between sessions for attendees to share ideas, progress, and challenges with leading members of Universities, companies, and international associations and societies. On the last day of the Symposium, attendees will be invited on a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery.

Thanks to the Speakers, Session Chairs, and Members of the Technical Program Committee and Steering Committee that worked hard and contributed to building our original 2020 excellent technical program. We want to retain as much of that original Program as possible. So, we encourage those committed to our previous June 2020 event to remain committed to or to re-commit to the 3D-PEIM Symposium in 2021. We intentionally set a firm date for June 21 – 23 so that you could plan appropriately once the crisis is over.

General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the U.S.A. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. Hopefully, the COVID-19 threat will be over so that we can provide an amazing experience for the attendees because we will be re-assembling as many of the world's prominent experts in power electronics packaging and manufacturing that we had planned for this year. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this Symposium".

Other Organizing Committee Members

  • Prof. Patrick McCluskey, University of Maryland U.S.A. – Past General Chairman and Assistant to General Chair
  • Brian Narveson, Narveson Consulting, U.S.A. – Finance Chairman
  • Arnold Alderman, Anagenesis, Inc. U.S.A. – Publicity Chairman
  • John Bultitude, Kemet U.S.A. – Publications Chairman
  • Prof. Doug Hopkins North Carolina State University, U.S.A. – Past General Chairman and advisor
  • Joe Horzepa U.S.A. – Executive Director of PSMA

If you wish to be a member of the Technical Program Committee, please contact or Symposium Sponsor PSMA:

The TEN technical sessions will still be:

S1 Plenary I
S2 Additive Manufacturing
S3 Systems Integration & Thermal Management
S4 Plenary II
S5 Multiphysics Design and Tools
S6 Materials
S7 Manufacturing Technologies
S8 Sponsors Session New for 2021!
S9 Quality and Reliability
S10 Heterogeneous Integration of Components

The Symposium will also include:

Tabletop demonstration exhibitions
Networking & Laboratory Tours – Osaka University

Further announcements and the complete Symposium agenda will be posted on the 3D-PEIM Website later this year.

Some feedback from attendees at the 2016 & 2018 Symposiums:

  • "The 3D-PEIM brings together a unique set of participants – those involved in power packaging who actually know and care about manufacturing and reliability."
  • "Most valuable is the breadth of topics. I don't consider myself an expert in many topics presented so, touching on multiple topics is very helpful."
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

We look forward to seeing you in Osaka, Japan, in June 2021.

This autumn, we will start again looking for Media, Organizing, Financial, and Technical Partners – please  contact info@3d-peim

For further information, you can contact: or Symposium Sponsor PSMA:





General Chair, 3D-PEIM Symposium 2020

Prof. Tsuyoshi Funaki, Osaka University
Technical Program Co-Chairs:

Prof. Katsuaki Suganuma,
Osaka University

Prof. Guo-Quan (GQ) Lu,
Virginia Tech USA

Minora Ueshima,
Daicel, Japan


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2021 International Power Supply-on-Chip (PwrSoC) Workshop

In Philadelphia, Pennsylvania from October 24 – 27, 2021
Sponsored by PSMA and IEEE PELS

T he seventh edition of the biennial International Workshop on Power Supply on Chip (PwrSoC) originally scheduled for October 25 thru October 28 2020 has been re-scheduled to October 24 thru October 27, 2021 due to concerns of the impact of COVID19 on the expected ability of attendees to travel to and attend a live event. The workshop is still scheduled to be held at the Singh Center for Nanotechnology on the campus of the University of Pennsylvania in Philadelphia PA The value of workshop has always been recognized as an event that brings together global academic and industry experts to formally and informally discuss issues to advance and productize power supply on chip technologies.

Plans are being developed for a condensed virtual event to take place in the November 2020 timeframe to keep the discussions and forums active and current for power supply on chip applications and technologies that have taken place since the previous workshop in 2018 and are on track to provide some updates before the next live workshop in 2021.

The technical program committee is working to put together a program of uncompromised caliber and value to include at least one presentation from each of the eight technical lecture presentation sessions. Several presentations will be assigned to each of several webinar sessions which will be less than two hours each during the month of November 2020. There will be a panel question and answer session for the technical presentations of each individual webinar event. Each webinar session will not close until all the questions submitted for that webinar event are answered. In response to the general chair Mark Allen's guidance to  " … address options that will help the virtual program try to approach some of the interaction that have made the live workshops so successful in the past …", the technical program is also identifying other features to maintain a level of interaction across a global community which is an integral part to the success of the workshop series.

The workshop is the leading international forum for the discussion of the challenges and opportunities in technology, business and supply chain, with intent on advancing the miniaturization and integration of power conversion and power management solutions. The workshop features presentation and dialog sessions of advanced technologies with global academic and industry experts aimed at miniaturizing power management solutions through system architecture, circuits and topology, packaging, and passive components. The Power Sources Manufacturers Association (PSMA) and IEEE Power Electronics Society (IEEE PELS) are joint sponsors for the  workshop.

Throughout its history, the workshop has spotlighted advanced technologies to build granular power supplies and compelling demonstrations of commercialized products that make a clear case for PwrSoC and PSiP technologies becoming more prominent and mainstream.

The technical program chairs for the workshop are Prof Hanh-Phuc Le of University of California at San Diego and Matt Wilkowski of EnaChip. Hanh-Phuc and Matt have both been presenters, session chairs and program chairs for past Power Supply on Chip workshops. A team of world-renowned experts, innovators and pioneers of the Power Supply on Chip technology has been assembled to chair the workshop's nine sessions.

Session Chair
Plenary Session Jose Cobos University Polytechnic Madrid
Systems and Applications Francesco Carobolante IoTissimo
Topologies and Control Bruno Allard, Université de Lyon
Wideband Gap Integration Brian Ma, University Texas Dallas
Integrated Capacitors & Energy Storage Medhi Jatlaoui, Murata
Integrated Magnetics Masahiro Yamaguchi, Tohoku University Japan
Sys Integ Manufacturing and Packaging Baoxing Chen, Analog Devices
Granular Power Santosh Kulkarni, Dialog Semiconductor
Posters Minjie Chen, Princeton University

The planning of the technical program, supporting activities as well as identifying workshop partners to contribute to its success are in process. If interested to be a workshop partner, please contact the workshop financial chair, Trifon Liakopoulos, at the following e-mail address:

Continuing the tradition of the enthusiasm, market relevance and success of past workshops, we are looking forward to the virtual corridor event in October 2021 bridging discussions and developments since the most recent workshop in Taiwan during October 2018, while progressing along the path to PwrSoC 2021 in Philadelphia, PA.

General Chair:
Dr Mark Allen

Technical Program Co-Chairs
Matt Wilkowski
Prof. Hanh-Phuc Le

For more information about previous and coming PwrSoC events, visit

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WiPDA 2020 Workshop: The 8th Workshop on Wide Bandgap Power Devices and Applications

WiPDA 2020 is postponed to 2021.

WiPDA 2020 will be postponed until the Fall of 2021. The date is being finalized and will be announced by the end of July as well as new deadlines for abstracts and papers.

To receive the latest news and updates on WiPDA 2021 please subscribe here and visit our website



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Announcing the International Workshop on Integrated Power Packaging (IWIPP 2021)

P SMA is excited to again be sponsoring the latest edition of IWIPP (2021) which will be held April 28-30th, 2021, on the beautiful campus of Aalborg University, in Aalborg, Denmark. IWIPP is a growing and successful power technology workshop with excellent speakers and networking opportunities.  The contents of IWIPP 2021 will include a set of keynote addresses from leading experts, a broad range of technical sessions, as well as a complement of technical tutorial sessions, all of which are included in the registration fee. 

The International Workshop on Integrated Power Packaging (IWIPP) brings together industry, academic and government researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to facilitate and promote the development and commercialization of high-density and high-efficiency power converters. Invited presentations and contributed papers will range from core materials technology and components to power converters. Presenters will address important challenges and present solutions to increase reliability and manufacturability while targeting improved performance and reduced system cost.

Call for Papers

Packaging and related technologies are the key to creating high-density power sources. Attendance at this important event can keep you and your colleagues on the cutting edge. If you have technology advancements or research accomplishments to present to the community, please consider submitting a digest for review by the technical committee. The call for papers is available at The submission portal of the website will be opening on Sept 1, 2020.  

Additional information regarding the workshop can be found at the conference website: .

IWIPP is sponsored by the PSMA Packaging Committee, which is co-chaired by Brian Narveson, Ernie Parker and John Bultitude.  They look forward to seeing all of you at Aalborg University April 28-30, 2021.

Sponsored by:
Power Sources Manufacturers Association (PSMA)
IEEE Power Electronics Society (PELS)
IEEE Electronic Packaging Society (EPS)
IEEE Dielectrics and Electrical Insulation Society (DEIS)
European Center for Power Electronics (ECPE)

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Department of Energy Seeks Input on Energy Conservation Standards for External Power Supplies – Call to Action!

O n May 20, the U.S. Department of Energy (DOE) has published a request for information (RFI) related to energy conservation standards for External Power Supplies (EPS). According to the announcement, the "DOE seeks comment on whether there have been sufficient technological or market changes since the most recent standards update that may justify a new rulemaking to consider more stringent standards."

As an industry stakeholder and in service of its membership, the Energy Management Committee of the Power Sources Manufacturers Association (PSMA) welcomes inputs and  data or information from member companies that would be useful to submit. With the continued advancement in power conversion technologies, amended and updated standards for EPSs could result in significant energy savings while remaining economically viable.

The DOE will accept comments, data, and information regarding this RFI until July 6, 2020. As such, the PSMA Energy Management Committee welcomes your input and participation now! If interested, please contact David Chen ( and Ed Herbert (, co-chairs for the committee. The Energy Management Technical Committee meets monthly via a one hour teleconference and all are invited and welcome to attend and participate in the activities of the committee – see for information on the next  meeting.


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Automotive 4.0 – The New Revolution?

Bus-fleet infotainment ready for "AUTOMOTIVE 4.0"

T he automotive segment is often misunderstood, quickly being solely associated with cars and related applications. However, it is much bigger than that, including a broad range of applications such as buses, trucks, industrial vehicles, mobile machinery e.g. mining equipment, forklifts, automated cleaning machines, emergency service vehicles. Currently everyone in industry is talking about the increasingly famous INDUSTRY 4.0, which is often referred to as the fourth industrial revolution.

INDUSTRY 4.0 provides for what some call a "smart factory". Within the modular structured smart factories, cyber-physical systems monitor processes, creating virtual copies of the physical world enabling decentralized decisions. Over the Internet of Things, cyber-physical systems communicate and cooperate with each other and with humans in real time, and, via the Internet of Services, both internal and pan-organizational services are offered and used by participants of the chain. The effects of applying some part of the INDUSTRY 4.0 upon the automotive industry can be translated into an AUTOMOTIVE 4.0 concept.

In 2019, more than 70% of cars were equipped with a color screen, part of the infotainment system, and the demand on the quality of the information delivered to the driver and passengers is very high. We all expect the same user experience from our cars as we get from our other personal devices, home entertainment and high speed connectivity. These increased expectations add complexities in interoperability and safety for the auto-manufacturers, especially when considering the promise of 5G and intelligent vehicles.

Whilst the screen is the obvious visible part of the 'iceberg', a lot of computing, sensors and other componentry make cars safer and more reliable. Collectively they are requiring increasingly efficient and robust power solutions. In the car industry, power management is often achieved by a set of power-management integrated-circuits (PMIC), part of the centralized embedded computer system. Semiconductor manufacturers are offering a large range of PMIC's, with the latest generation including digital-control and advanced communication interfaces.

If the car industry represents the mass market for automotive infotainment systems, with the development of larger cities and growing demand for inter-city exchanges, existing rail  networks are often insufficient on their own and require complimentary fleets of buses to enable passengers to reach destinations effectively.

Market Analysts reported that the global demand for buses is projected to grow significantly (more than 7% year-over-year), especially in Asia. All categories included (from local, to long distance transit) the number of buses in use worldwide is expected to exceed eight million units in 2022. Many of them will incorporate advanced infotainment and fleet monitoring equipment requiring stable and reliable power solutions.

Connected buses

As with airplanes and the new generations of high-speed rail, infotainment equipment is often installed in passenger seat, requiring local power sources immune from line disturbances, with low level of radio-emissions that are able to work without forced air cooling. In addition, bus manufacturers are requiring seat-manufacturers to make seats simpler and easier to maintain (and upgrade), with less cabling and interconnections.

To satisfy these requirements seats will depend upon simplified connectivity, limited to only one power cable and an optical fiber for data-transmission, meaning that the power source powering the infotainment equipment must be installed within the seat, placing high demand on power supply manufacturers.

Figure 1 – New generation of DC/DC converters (Powerbox ENAR100/200) designed to meet “One package to fit all” integrating advanced thermal management and high efficiency topologies for automotive applications.

For decades power supplies for such equipment used to house underneath seats, utilizing free air convection cooling. The new generation of power modules however must operate without airflow thus they must be design-optimized for conduction cooling (e.g. baseplate connected to the seat armature). To reduce power losses and optimize cooling, power converters require very high efficiency ratings with dissipative components connected directly to the baseplate (figure 01). Technologies used in high power density converters, in the telecommunication industry, such as planar transformer, thermal via, thermal-drains and in some case heat-pumps are now being implemented throughout the automotive industry.

Powering infotainment in automotive applications demands that the power converters comply with international standards, such as ISO7637 specifying electrical disturbances for conducting and coupling test conditions for road vehicles using 12V or 24V batteries (figure 02), requiring the power supplies companies to work in very close cooperation with the equipment manufacturers ensuring the final products operate in full compliance with their environments.

Figure 2 – Example of ISO7367-2 pulse test, simulating supply voltage reduction by energizing the starter-motor circuit of internal combustion engines. The ISO7367 covers a broad range of electrical disturbances tests.

Holistic fleet management

Appreciation is rarely given to the fact that modern buses are equipped with an impressive array of advanced electronics equipment requiring stable and sustainable power supplies (Figure 03). For reliability and optimization of fleet management, new generations of buses are equipped with real-time tracking capabilities connected to the navigation system, engine conditioning and safety equipment such as driving behavior analyzers. Monitoring systems are permanently reporting on the status of the vehicles, making it possible to also manage preventive maintenance and report the positioning of the fleet to a central coordinator.

Figure 3 – Applications installed in modern buses, requiring stable power and
some local battery for safety operation.

For safety reasons, to guarantee continuity of vital functionality, it is imperative in the event of main battery power failure, that strategic systems include local batteries requiring micro-chargers. These micro-chargers share similarities with the infotainment power supplies, in that they are often installed in confined environments. Thus they share a need for high efficiency designs optimized around thermally managed conduction cooled mechanical formats. Designing to mitigate potential failures, caused by thermal stress, is vital and actively contributes towards high reliability units on the road.

Designers must also take into consideration specific demands for battery charging optimization e.g. measuring battery temperature, and in some cases communication between the battery charger and a central monitoring system. Such considerations need to be employed holistically in the overall design process, with suitable comparisons being made with the performances of previous generations of products, mainly based on analog control, the latest generation integrating micro-controllers and real time charging optimization. Some would argue that adding digital control in a micro-charger is overkill technology for such applications, whilst others would counter such arguments claiming that the technology has already proven benefits in terms of reliability and longer battery life-time.

But whatever the arguments, due consideration needs to be given to the number of power sources required to supply stable and reliable voltage to infotainment and other electronic equipment employed on buses. Bus manufacturers are increasingly requiring power supply manufacturers to develop standardized DC/DC converters, Chargers, Step down regulators that are easily installed, maintained and capable of higher powered demands, when upgrading equipment. The concept of "One package to fit all" is no longer a dream but has become reality, adding challenging mechanical constraints to the unit's design parameters.

For power designers, bus-fleet modernization, and new generations of buses with modern infotainment and impressive array of advanced electronics equipment, there are opportunities to bring advanced power technology to a segment that has historically been very slow at adopting new technologies, taking big steps forward towards AUTOMOTIVE 4.0. Perhaps those early adopters are right to call this the fourth automotive revolution!

Provided by Patrick Le Fèvre
Chief Marketing and Communications Officer, Powerbox



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