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2021 International 3D Power Electronics Integration and Manufacturing Symposium

T he third International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 21-23, 2021, 75 international participants from Asia, Europe and the Americas attended a 100% virtual 3-day symposium. In spite of COVID-19 restrictions requiring the Japan hosted symposium to go fully virtual, all registered and speaking participants were in attendance.

The Symposium attendees received great insight from each of the plenary presentations given by leading experts in power electronics: "Optimal modularization technology for the latest WBG devices" by Yoshikazu Takahashi, Tohoku University, Japan, "Automotive Semiconductors in the CASE era and its 'Jisso' technologies" by Yasushi Shinojima, MIRISE Technologies Corporation, "Materials and Technologies for Power Electronic Module" by Prof. Dr.-Ing. Habil Hans-Jürgen Albrecht, IAVT TU, "Diamond Devices Based on Unique Material Properties" by Toshiharu Makino, AIST, Advanced Power Electronics Research Center, "Applications with SiC Power Devices for Railcar" by Tomonobu Mihara, Mitsubishi Electric Corporation, and "Reliability Aspects of 3D Integrated Power Devices" by Dr. Josef Lutz, Professor at Chemnitz University of Technology.

The Symposium Sessions were kicked off with outstanding keynote talks given by leading experts in power packaging: "Thermal Fluid Simulation Modeling and Structural Analysis of Double-sided Cooling Power Module Based on Thermal Transient Test" by Tom Hara, ‎Siemens Digital Industries Software, "Developments of High Power Blue Diode Laser Systems for Laser Metal Deposition and Selective Laser Melting in Additive Manufacturing" by Masahiro Tsukamoto, Joining and Welding Research Institute, Osaka University, "Development of High Performance SiC Power Module" by Dr. Hiroshi Yamaguchi, National Institute of Advanced Industrial Science and Technology (AIST), "Superior Reliability of Power Electronic Packages with Die Top Systems (DTS®). Why a Wire-Based Technology Solution Outperforms Clip-Based Interconnections" by Michael Joerger, Heraeus Electronics, and "The Technology Race in Power Electronics Packaging: The race is on!" by Rainer Frauwallner AT & S Austria Technologie & Systemtechnik Aktiengesellschaft.

The keynotes were followed by a single-track technical program featuring 21 invited oral presentations divided into seven topical sessions, several with a keynote speaker followed by invited/contributed talks. The presenters and attendees engaged in lively discussions during the question periods in each session.  In addition, 100% of participant feedback stated that attendees felt the presented material was high quality and were interested in attending a future 3D-PEIM either in person or virtually.

The videos and pdf's of the presentations are available to all registered attendees and through post conference registration at Registration - 3D PEIM (

The Symposium was sponsored by the Power Sources Manufacturers Association (, and chaired by Prof. Tsuyoshi Funaki, Osaka University, Japan. IEEE EPS was a technical sponsor and financial support was provided by nine industry sponsors.

Planning is now underway for 3D-PEIM 2023 which will be chaired Associate Prof. P.M. Raj at Florida International University. If you are interested in helping to organize or participate, please contact, or the PSMA office at

Provided by:

General Chair
Prof. Tsuyoshi Funaki, Osaka University
Technical Program Chair
Prof. Guo-Quan (GQ) Lu, Virginia Tech USA
Technical Program Chair
Prof. Katsuaki Suganuma, Osaka University
Technical Program Chair
Minora Ueshima, Daicel, Japan
Steering Committee Chair
Brian Narveson,
PSMA Packaging Committee Co-Chair

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