3D-PEIM
June 21-23, 2021,
Osaka University, Japan

SMA is sponsoring the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2021) June 21-23, 2021. We thank Osaka University for their commitment to being our 3D-PEIM 2021 Host. Based on the unknown status of the COVID-19 pandemic next June, we have cautiously decided to have an in-person/online hybrid event.  Further details will be available in January.

The 2021 3D-PEIM Symposium will be led by General Chair Prof. Tsuyoshi Funaki of Osaka University, Japan and Technical Program Co-Chairs Prof. Katsuaki Suganuma, Osaka University, Japan; Dr. Minora Ueshima, Daicel, Japan; Prof. Guo-Quan Lu, Virginia Tech, USA.

Prof. Tsuyoshi Funaki, Osaka University

Prof. Katsuaki Suganuma, Osaka University

Prof. Guo-Quan (GQ) Lu, Virginia Tech USA

Minora Ueshima, Daicel, Japan

The 3rd biennial 3D-PEIM Symposium has successfully reinvited all of the original 2020 program world-class experts, representing a far-reaching range of disciplinary perspectives to advance the development of future 3D power electronics packaging systems. The Symposium encompasses additive, embedded, co-designed, and integrated packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power-dense components, and modules.

Professionals and Academics engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees an excellent opportunity to gain insight or broaden expertise in 3D power electronics packaging and integration. As in the past, we will arrange the Symposium schedule to provide ample time between sessions for attendees to share ideas, progress, and challenges with leading members of Universities, companies, and international associations and societies. On the last day of the Symposium, attendees will be invited for a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery.

General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. Hopefully, the COVID-19 threat will be over so that we can provide an amazing experience for the attendees because we will be re-assembling as many of the world's prominent experts in power electronics packaging and manufacturing that we had planned for this year. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this Symposium."

Other Organizing Committee Members

• Brian Narveson, Narveson Consulting, USA – Steering Committee Chairman and Finance Chairman
• Prof. Patrick McCluskey, University of Maryland, USA – Past General Chairman and Assistant to General Chairman
• John Bultitude, Kemet, USA – Publications Chairman
• Arnold Alderman, Anagenesis, Inc. USA – Publicity Chairman
• Prof. Doug Hopkins, North Carolina State University, USA – Past General Chairman and Advisor
• Joe Horzepa, U.S.A. – Executive Director of PSMA

If you wish to be a Media, Technical, or Exhibit Partner, please contact http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

Program Schedule:

Because we are offering virtual attendance, the schedule below shows three time zone times in the program for those attendees and presenters attending online. The day starting and ending times example is shown below.  Due to time zones' challenges, all sessions will be recorded and available to paid attendees after the Symposium.

The Symposium will also include:

• Tabletop demonstration exhibitions
• Networking & Laboratory Tours – Osaka University

Further announcements and the complete Symposium agenda will be posted on the 3D-PEIM Website later this year.

Some feedback from attendees at the 2016 & 2018 Symposiums:

• "The 3D-PEIM brings together a unique set of participants – those involved in power packaging who actually know and care about manufacturing and reliability."
• "Most valuable is the breadth of topics. I don't consider myself an expert in many topics presented so, touching on multiple topics is very helpful."
• "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

We look forward to you joining us either in-person or online in Osaka, Japan, in June 2021.

For further information, you can contact: http://www.3d-peim.org/contact/ or Symposium Sponsor PSMA: power@psma.com

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