he Second Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18) will be held June 25-27, 2018 at the University of Maryland, College Park.  The Symposium is being organized by two leading experts in this field: Prof. Patrick McCluskey of the University of Maryland, College Park is General Chair; Prof. Guo-Quan Lu from Virginia Tech is Technical Program Chair.

Professionals and Educators engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees a perfect opportunity to gain insight or broaden expertise in 3D power electronics  packaging and integration. The Symposium schedule is arranged to provide ample time between sessions  for people to share ideas, progress, and challenges with leading members of international associations and societies.

General Chair, Prof. Patrick McCluskey of the University of Maryland shares, "It is my pleasure to welcome power electronic professionals of all disciplines to attend the leading conference dedicated to 3D integration and additive manufacturing of power electronics.  The symposium promises to be filled with tutorial, technical, and interactive sessions highlighting the latest discoveries and developments that are making miniaturized, intelligent power electronic systems a reality in a wide range of applications."

Our Outstanding Program is Complete

All of the world-class speakers are lined up to provide you with an outstanding program encompassing additive, embedded, co-designed, and integrative packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power dense components and modules.

Technical Program Chair, Prof. Guo-Quan Lu from Virginia Tech in completing the 3D-PEIM program says, "It is an exciting time for professionals working in the field of power electronics. The world is moving into more and more electrified. We are seeing a rapid rise of research and commercial activities in power electronics.  One indication is the growing number of international conferences and workshops that bring together thousands of PE engineers and researchers. I am glad that our 3D PEIM symposium uniquely addresses the need for a dedicated forum on power electronics packaging and manufacturing. We have assembled many of the leading experts in the field. I am sure that the attendees will have a fruitful learning experience through the lectures and one-on-one interactions."  

Our program includes:

A keynote address by Prof. Mark Johnson Director of the EPSRC Centre for Power Electronics and holds a personal Chair at the University of Nottingham, England. His personal research expertise is in power devices, power electronics packaging, thermal management, reliability and integration. He was instrumental in establishing a nationwide collaborative program in Silicon Carbide (SiC) electronics and was a member of the Executive Committee for the EPSRC-funded Innovative Electronics Manufacturing Research Centre (IeMRC) and project manager for the IeMRC Flagship Project in Power Electronics.

A keynote address by Dr. Rolf Aschenbrenner, deputy director of the Fraunhofer IZM focused on chip interconnection technologies. He received the iNEMI International Recognition Award in 2005, the CPMT David Feldman Outstanding Contribution Award 2013 and the European Semi Award 2016. His research work has spanned from manufacturing process fundamentals, to applied manufacturing and 3D Packaging. From 2002-2015, Rolf Aschenbrenner was a member of the IEEE CPMT and during the term 2010-2011 he was IEEE CPMT President and in 2012 he became IEEE Fellow.

Filling out our 3-day program are outstanding invited speakers and events:

• Three tutorials by invited specialists: Chris Williams of Virginia Tech; Doug Hopkin of NCSU; and Mike Ohadi of U. of MD.
• Eight technical sessions of four (4) speakers each that include hardware demonstration and one-on-one discussions with the speakers
• An interactive poster session.
• Rapping up our Symposium, attendees will have a guided tour of the Center for Advanced Life Cycle Engineering (CALCE) at the U. of MD.
• You can see from our program schedule that plenty of time is available for you to network with speakers and fellow attendees.

You can view the complete Symposium program here.

The Symposium will have exhibits

Those who sign up to be an exhibitor will have an oportunity to display and domonstrate their products and technologies on a Table Top. The exhibits are planned to be open several times each day during the Symposium. Each registered Exhibitor will be given one complementary conference registration.

Sponsorship is offered

All sponsors will be at one common level. Those who become sponsors will get: one table top exhibit, website recognition, and projector recognition. Company banners will be placed in seminar room. Sponsors will receive one complimentary conference registration and complimentary tutorial registration.

Registration, Exhibits, and Sponsorship Information for June 25, 26, 27 is readily available at http://www.3d-peim.org/registration/

If you have questions or would like additional information, please contact us at http://www.3d-peim.org/contact/ or Sponsor PSMA at power@psma.com.

Provided by:

General Chair
Prof. Patrick McCluskey, University of Maryland, College Park

Technical Program Chair
Prof. Guo-Quan (GQ) Lu, Virginia Tech

Publicity Chair
Arnold Alderman, Anagenesis, Inc.

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.