June 22-24, 2020
Osaka University, Japan

Registration is Now Open

The 3rd biennial 3D-PEIM Symposium has invited world-class experts representing a far-reaching range of disciplinary perspectives who are advancing the development of future 3D power electronics systems. The experts are Industry Professionals and Academics engaged in R & D of power electronics packaging design, and manufacturing processes. The Symposium encompasses additive, embedded, co-designed, and integrative packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power-dense components and modules.

This Symposium will provide attendees an excellent opportunity to gain insight or to broaden their expertise in 3D power electronics packaging and integration. The Symposium schedule is arranged to provide ample time between sessions for attendees to share ideas, progress, and challenges with leading members of Universities, companies from industry, and representatives from international associations and societies. On the last day of the Symposium, attendees are invited on a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery.

General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM is held here because there are many power device and peripheral packaging material manufacturers in Japan. I believe this Symposium will be an amazing experience for the attendees because we are assembling world prominent experts in power electronics packaging and manufacturing. I also believe that all attendees will gain significant advance packaging knowledge through discussions at this Symposium".

The Symposium schedule will include Plenary and Keynote Presentations, Technical Sessions, new this year - a Sponsors Round Table Discussion, Tabletop Demonstration Exhibits and Networking & Laboratory Tours. The technical program and session chairs are:

• S1 Plenary I: Tsuyoshi Funaki, Osaka University, Japan
• S2 Additive Manufacturing: Patrick McCluskey, University of Maryland, USA and Douglas Hopkins, North Carolina State University, USA
• S3 Systems Integration & Thermal Management: Christina DiMarino, Virginia Tech, USA
• S4 Plenary II: Katsuaki Suganuma, Sanken Osaka University, Japan
• S5 Multiphysics Design and Tools: Michihiro Shintani, Nara Institute of Science and Technology (NAIST), Kansai Science City, Japan
• S6 Materials: Jason Rouse, Sekisui America, USA
• S7 Manufacturing Technologies: John Bultitude, Kemet Corporation, USA
• S8 Sponsors Session: Minora Ueshima, Daicel, Japan
• S9 Quality and Reliability: Steven Martell, Nordson Sonoscan, USA
• S10 Heterogeneous Integration of Components: Cyril Buttay, Laboratoire Ampère, France

The complete Symposium agenda and latest updates are available on the 3D-PEIM Website: http://www.3d-peim.org/program/

If you are interested in being a 3D-PEIM 2020 PARTNER, contact info@3d-peim.org

Some feedback from attendees at the 2016 & 2018 Symposiums:

• "The 3D-PEIM brings together a unique set of participants – those involved in power packaging who actually know and care about manufacturing and reliability."
• "Most valuable is the breadth of topics. I don't consider myself an expert in many topics presented so, touching on multiple topics is very helpful."
• "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

Register now at http://www.3d-peim.org/registration/

We look forward to seeing you in Osaka, Japan, this coming June.

For further information, contact the 3D-PEIM Symposium organizers at http://www.3d-peim.org/contact/ or Sponsor PSMA at power@psma.com

General Chair, 3D-PEIM Symposium 2020 Prof. Tsuyoshi Funaki, Osaka University
Technical Program Co-Chairs:
Prof. Katsuaki Suganuma, Osaka University	Minora Ueshima, Daicel, Japan	Prof. Guo-Quan (GQ) Lu, Virginia Tech USA

Organizing, Financial and Technical Partners:

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.