PSMA website
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Table of contents
  1. APEC 2018: The World's Best Power Electronics Event Comes Early This Year!
  2. You are Invited to Attend the PSMA Annual Meeting at APEC 2018
  3. Meet Your Directors
  4. Welcome to PSMA
  5. PSMA Capacitor Committee and IEEE PELS Capacitor Workshop: Everything You Wanted to Know About Capacitors But Were Afraid to Ask
  6. PSMA Magnetics Committee and IEEE PELS High Frequency Magnetics Workshop: Power Magnetics @ High Frequency - Eliminating the Smoke and Mirrors
  7. 2018 International 3D Power Electronics Integration and Manufacturing Symposium is Open for Registration
  8. International Power Supply On Chip Workshop to be held October 17,18,19 2018 in Hsinchu, Taiwan
  9. EnerHarv 2018: An International, Technical Workshop Dedicated to Enabling the Energy Harvesting Ecosystem
  10. PCIM Europe 2018
  11. ISPSD 2018, The 30th Annual International Symposium on Semiconductor Devices and ICs
  12. Powering Marine Applications – The Many Challenges!
  13. If You Have Anything to Do With Power Supplies, Here's What You Need to Know About EN 62368
  14. Solar Energy Stock Index Q4 2017
  15. Solar Energy DealReader Q4 2017
  16. EMS Stock Index Q4 2017
  17. EMS DealReader Q4 2017
  18. Events of Interest – Mark Your Calendar
Contents | Next->

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.


Previous issues of update: Q2_2017 | Q3_2017 | Q4_2017


PSMA UPDATE is published and distributed via e-mail quarterly by the Power Sources Manufacturers Association. Send editorial information and comments to:

Editor, PSMA UPDATE
P.O. Box 418
Mendham, NJ 07945-0418

  (973) 543-9660
(973) 543-6207 (Fax)
E-mail: power@psma.com
Web Site: www.PSMA.com

Publisher: Eric Persson   Managing Editor: Lisa Horzepa

Permission to reprint information and articles as published is granted: a courtesy line is appreciated.

Membership in PSMA is open to any organization or corporation involved in the power sources and supplies industry. For membership information, visit our website or contact us by fax, telephone or email.

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.

 

 


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APEC 2018: The World's Best Power Electronics Event Comes Early This Year!

T he 2018 Applied Power Electronics Conference – APEC2018 – is literally right around the corner. It's been a number of years since APEC has come so early in the year. This year's edition of APEC will take place March 4-8 at the Henry B. Gonzalez Convention Center in beautiful downtown San Antonio, Texas. If you haven't already registered for the conference and made your travel arrangements, you better get moving - local hotels are filling up.

The Conference Committee for APEC 2018 has put together:

  • A Plenary Session on Monday, March 5 that will feature world-class presentations to keynote our week-long conference. And new this year, if you can't make to the Monday plenaries, you can watch them on streaming video, courtesy of IEEE.tv.
  • Eighteen Professional Development Seminars on Sunday, March 4 and Monday, March 5, presented by world-class experts, that are designed to bring you up to speed on critical power electronics design technologies and techniques.
  • A Technical Program from Tuesday, March 6 through Thursday, March 8 will include an astounding 40 Presentation Sessions plus a Dialog (Poster) event held during the Thursday hosted lunch. Nearly 600 high-quality, peer-reviewed papers will be presented.
  • The Industry Session program will be running concurrently with the Technical Program and has been expanded to 23 sessions, in response to the demands for more about the latest developments from the industry's leading innovators.
  • Three controversial topics will be covered in our annual Rap Sessions on Tuesday, right after the exhibits close at 5:00 p.m. Grab a cool beverage and bring your questions for the panelists.
  • A crowded exhibit hall packed with the latest power electronics products.
  • The annual MicroMouse contest pitting teams from around the world to solve the maze the fastest with their intelligent motorized mice.
  • A terrific social event with several western-themed activities, along with live entertainment from a country band, trick roper and line dancers will bring us all together on Wednesday evening.

In addition, on Saturday, March 3, prior to the start of APEC 2018, PSMA and PELS will be sponsoring two full day workshops. The third High Frequency Magnetics Workshop - "Power Magnetics @ High Frequency – Eliminating the Smoke and Mirrors" and the first Capacitor Workshop – "Everything You Wanted to Know About Capacitors But Were Afraid to Ask". For more information see the articles on each workshop in this issue of the UPDATE.

Speaking for all of us on the APEC Conference Committee, I invite you to come to San Antonio to be part of our annual gathering. You really don't want to miss it. Check the APEC website for details (www.apec-conf.org).

Provided by Greg Evans,
APEC 2018 Publicity Chair

 



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You are Invited to Attend the PSMA Annual Meeting at APEC 2018

T he 2018 PSMA Annual Meeting will be held in conjunction with APEC 2018 at the Henry B. Gonzalez Convention Center in San Antonio, Texas on Monday March 5. A buffet breakfast at 7:30 a.m. will precede the meeting and individuals from member companies as well non-member guests are invited to attend and participate in a full agenda of topics of interest to the industry. At the meeting, you will have the opportunity to meet and interact with many of the students who received APEC Travel Support to present their papers at the Technical Sessions. Regular member company representatives will participate in the election of four Directors to serve on the PSMA Board. The detailed agenda for the meeting will be on the PSMA web site and will include reports from each of the technical committees and stimulating discussions on new PSMA initiatives for 2018 and beyond.

Members and guests are also invited to remain for the Board of Directors meeting that will immediately follow the Annual Meeting. Participation in these meetings will provide you with the opportunity to network with colleagues from other companies and to influence the direction of the PSMA and the power sources industry.


Another way to get more out of your company membership in PSMA is to get involved with one of our active technical committees. The Capacitor, Energy Harvesting, Energy Management, Industry-Education, Magnetics, Marketing, Power Electronics Packaging, Power Technology Roadmap, Reliability, Safety & Compliance, Semiconductor and Transportation Power Electronics committees all plan to hold open meetings during the week of APEC 2018. All are invited to participate or to just drop in any of these committee meetings to hear and provide input as the committee activities are being planned for the coming year. Visit the PSMA website to see the schedule of PSMA meetings and events at APEC 2018.

On March 3, 2018, the Saturday prior to the start of APEC 2018, PSMA and PELS will be sponsoring two workshops, the third High Frequency Magnetics Workshop - "Power Magnetics @ High Frequency – Eliminating the Smoke and Mirrors" and the first Capacitor Workshop – "Everything You Wanted to Know About Capacitors But Were Afraid to Ask". Information on these workshops are available in separate articles in this issue of the Update.

Be sure to visit us at the PSMA booth, #420, in the exhibition area during APEC. PSMA is again sponsoring the popular PSMA/ APEC Passport Program in the Exhibit Hall. Visit the booths of participating PSMA members to enter your name into a raffle drawing.

We look forward to a good turnout at the PSMA meetings and a very busy and exciting week.

For the latest information on all of the activities planned during APEC 2018, visit us at www.psma.com.


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Meet Your Directors

Four members of the Board of Directors are elected at the PSMA Annual Meeting held every year during the APEC conference. Each Director serves a three year term and is eligible to be reelected for one additional term.

In this issue we would like to acknowledge Ed Herbert and Donald Woodard who were first elected in 2012, and will be finishing their terms at the Annual Meeting at APEC 2018. We thank them both for their six years of service to PSMA and the industry.
 

Ed Herbert received his BEEE from Yale University in 1963. He worked as a design engineer, a project engineer, an engineering supervisor, then as engineering manager until 1985. Since then he has been independent, promoting patented technology for license.

Ed serves is Co-Chair of the PSMA Magnetics Committee. He is an active participant in the Power Electronics Packaging Committee and Power Technology Roadmap Committee and an occasional participant in several other committees.

He helped with the design of the Energy Efficiency Database. He sponsored all three phases of Core Loss Studies and wrote Supplemental Reports further analyzing the data. He has chaired and presented at several APEC Industry Sessions. He helped organize the High Frequency Magnetics workshops in 2016 and 2017, and is helping with the workshop planned for March 2018. He recently sponsored two special projects to study flux propagation in ferrites; both are on-going.

Ed has been enriched by his association with PSMA and welcomes the opportunity to give more in return.
 

Provided by Ed Herbert, Independent Inventor



Donald Woodard is president of Venable Instruments, a leader in the research, development and manufacture of frequency response analyzers for testing, measurement and power supply design. The Company was founded in 1979 by H. Dean Venable, the pioneer of stability analysis, and Woodard became President in 1999. Woodard was elected to Power Sources Manufacturers Association (PSMA) Board of Directors in 2012, supported by his vast experience serving on the Applied Power Electronics Conference (APEC) committee since 2002. His eight-year tenure as APEC's Exhibits Chairman saw exceptional growth in both vendor participation and exhibit attendance. Woodard is known throughout the power electronics world for his proven leadership and active commitment to advancing the standards, collective direction and corporate responsibility within the industry.

Prior to extending his leadership acumen to Venable Instruments, PSMA and APEC, Woodard spent 25 years working in the private sector in executive management, sales and marketing roles at FMC Corporation.

Woodard graduated from the former North Texas State University (now The University of North Texas) in 1976 with a B.B.A. in Sales & Marketing. A native of East Texas, he and his wife of 31 years, Melony, have called Austin home since 1995. They are parents of two children, with two grandchildren rounding out their growing family. The Woodards are active members of Austin Ridge Bible Church and serve on several non-profit committees and outreach programs, such as Mobile Loaves and Fishes. In his spare time, he enjoys fly fishing, bird hunting, competitive shooting and all things rock and roll.


Provided by Donald Woodard, President, Venable Instruments
 


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Welcome to PSMA
   
 
   We are pleased to welcome 2 new member companies this quarter. We hope your company is a member. To learn about the benefits of membership, please visit our website www.psma.com.
   
 
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Dialog Semiconductor Inc.
Siamak Abedinpour
San Tan Corporate Center II
3100 West Ray Road, Suite 130
Chandler, AZ 85226
Telephone: 480-347-3393
E-mail: siamak.abedinpour@diasemi.com
Website: www.dialog-semiconductor.com


Dialog Semiconductor provides highly integrated standard and custom mixed-signal integrated circuits, optimized for smartphone, computing, IoT, LED solid state lighting, and smart home applications. Dialog's power saving technologies, including DC/DC configurable system power management, deliver high efficiency and enhance the consumer experience by extending battery life. Dialog's AC/DC technology enables faster charging of portable devices. Dialog brings decades of experience to the rapid development of ICs while providing flexible and dynamic support, world-class innovation and the assurance of dealing with an established, socially responsible partner pursuing many programs to benefit the employees, community, other stakeholders and the environment.

 


Fair-Rite Products Corp.
Bridget Kane
1 Commercial Row
Walkill, NY 12589
Telephone: 854-895-2055
E-mail: kaneb@fair-rite.com
Website: www.fair-rite.com


Fair-Rite Products Corp. is a family owned business that was formed in Wallkill, New York in 1952 by Richard Parker with his partners, Edmund Stanwyck and Jack Webb. By 1955, the company was supplying products used in the entertainment electronics industry. Ten years later, in Palestine, Illinois, a new and separate division was established to support the Midwestern television and radio equipment manufacturers.

Fair-Rite quickly expanded into the rapidly growing EMI suppression market, manufacturing ferrite shield beads. The growing demand lead Fair-Rite into the Medical, Lighting, Automotive, Communication, Aero/Defense, Smart Energy and Industrial Markets.

With locations in New York, Illinois and China, Fair-Rite continues to be on the cutting edge of ferrite technology, expanding its product lines across a broad spectrum of exciting new markets.

 


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PSMA Capacitor Committee and IEEE PELS Capacitor Workshop

Everything You Wanted to Know About Capacitors But Were Afraid to Ask

Date: Saturday March 3, 2018
San Antonio, Texas

The PSMA Capacitor Committee and IEEE PELS will hold their first Capacitor Workshop on Saturday, March 3, 2018 - the day before and in the same venue as APEC 2018 at the Henry B. Gonzales Convention Center in San Antonio, Texas.

Capacitors are far more than just parallel plates. At this workshop industry leaders in capacitor technologies will showcase the details of design, construction, manufacturing, and most importantly applications of capacitors. The topics discussed will be of interest to any of the following:

DESIGNERS of electronic circuits
MANUFACTURERS of electronics and electrical equipment
MANAGERS of engineers, supply chain, purchasing

Workshop attendees can arrive to the meeting room between 7:00 and 8:00 AM for a buffet style breakfast, demonstrations, and informal discussions with their colleagues and peers. The demonstrations will also be available during the 2-hour buffet Lunch, and the Networking Session after the workshop. These Demonstrations are intended to be supportive of the Workshop material.

Demonstrations

  • Ripple current effects on different capacitor technologies
  • DC Bias behavior of MLCCs
  • Push your filter design to success, comparison between different capacitor technologies
  • How capacitors e.g. MLCCs will be effected from mechanical stress like board flex
  • How self-healing works on film capacitors
  • How to use LTSpice simulations best
  • How to find the proper capacitor in online tools e.g. K-SIM
  • Comparison of capacitor technologies with online platforms e.g. REDEXPERT
  • Special table: How Virtual Reality helps to understand the components behavior? Have you ever asked yourself how to see the inside of a passive component easily? Let's dive into it in the virtual world.

Workshop

The workshop will begin with a keynote presentation by Ralph Taylor of Delphi Technologies. The technical sessions will be divided into 3 primary sections: low voltage DC capacitor applications, high voltage AC & DC capacitor applications, and common capacitor failure modes.

The low voltage DC topics will feature a thirty-minute keynote presentation and five twenty-minute lecture style presentations concluding with a thirty-minute panel Q&A session. The tentative schedule for this session is as follows:

  • Ceramic Capacitors – Low Voltage DC, Wilmer Companioni, KEMET Electronics Corporation
  • Difference between traditional and polymer aluminum caps, Frank Puhane, Wurth Electronics
  • Recent Development on Supercapacitors, Nihal Kularatna, Waikato University New Zealand
  • Panel Discussion – Low Voltage, Companioni, Puhane, Kularatna

The AC & DC high voltage power topics will follow a similar format to the low voltage DC sessions with the following topics and speakers:

  • High Voltage Academic Input, Robert Pilawa, University of California, Berkeley
  • Ceramic Capacitors – High Voltage, Wilmer Companioni, KEMET Electronics Corporation
  • Film Capacitors – High Voltage, Scott Franco, CDE
  • Aluminum Capacitors – High Voltage, Pierre Lohrber, Wurth Electronics
  • Panel Discussion – High Voltage, Pilawa, Companioni, Franco, Lohrber

After the high Voltage Panel Discussion, a buffet lunch will be available with 2 hours allotted to allow everyone time to eat and visit the demonstrations of their choosing.

The final session will be a review of failure modes for all capacitors across the various technologies. Again, the discussions will be followed by a panel discussion

  • Recent Advances in Embedded Capacitors, Robert Grant Spurney, Georgia Institute of Technology
  • Ceramic Capacitors – Failure Modes, Wilmer Companioni, KEMET Electronics Corporation
  • Film Capacitors – Failure Modes, Scott Franco, CDE
  • Aluminum Capacitors – Failure Modes, Stephan Menzel, Wurth Electronics
  • PELS Session: Failure Modes (Theoretical Input)
  • Panel Discussion – Failure Modes, Spurney, Companioni, Franco, Menzel, Wang

Following the third technical session there will be a networking hour. Wine, beer and hors d'oeuvres will be served from 5:00 to 6:00. There will be an additional opportunity to visit with the technology demonstration stations during this session.

At first glance, capacitors may not sound like the most exciting topic, but with the industry experts that will be presenting, everyone from experienced engineers to the eager engineering minds of tomorrow that are just about to graduate will find something useful in this workshop.

The early registration fee for the workshop is $325 per participant reducing to $225 for PSMA members, IEEE PELS members and students from an accredited university. After February 15, registration fee increases to $375 reduced to $275 for members and students. the Breakfast and lunch will be provided as part of the workshop. Electronic copies of all presentations will be made available to the workshop participants via a password protected website.

The latest information on agenda as well as registration information for the workshop will continue to be available on the PSMA website at: http://www.psma.com/technical-forums/capacitor/workshop.


Organizing Committee

Fred Weber, Future Technology Worldwide
Pierre Lohrber, Wurth Electronics
Wilmer Companioni, KEMET Electronics


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PSMA Magnetics Committee and IEEE PELS High Frequency Magnetics Workshop

Power Magnetics @ High Frequency -  Eliminating the Smoke and Mirrors

Date: Saturday March 3, 2018
San Antonio, Texas

The PSMA Magnetics Committee and IEEE PELS will hold the third "Power Magnetics @ High Frequency – Eliminating the Smoke and Mirrors" workshop on Saturday, March 3, 2018 - the day before and in the same venue as APEC 2018 at the Henry B. Gonzales Convention Center in San Antonio, Texas

The target audience for this workshop is all who wish to achieve higher power densities, low profile aspect ratio, higher efficiencies, and improved thermal performance. The workshop content is especially suitable for:

DESIGNERS of power magnetic components
MANUFACTURERS of magnetic materials and magnetic structures
FABRICATORS of magnetic components
PROVIDERS of modelling and simulation software
MANUFACTURERS of test and characterization equipment

Workshop attendees can arrive to the meeting room between 7:00 and 8:00 AM for a buffet style breakfast and informal discussions with their colleagues and peers. There will be an opportunity to preview the technology demonstrations during the breakfast session.

The workshop will consist of morning (core losses) and afternoon (fringing effects) technical lecture presentation sessions and a lunchtime interactive technology demonstration session. The two technical lecture presentation sessions will each be followed by a panel Q&A. The technology demonstrations will also be available during the breakfast prior to the opening session and during the networking session at the end of the day's events.

The morning technical session will feature a thirty-five-minute keynote presentation and five twenty-five-minute lecture style presentations concluding with a thirty-minute panel Q&A session. There will be a five-minute Q&A interaction after each lecture presentation. The tentative schedule for this session is:

  • Dr. Charles Sullivan, Dartmouth will present a keynote presentation "Core Loss: What We Know and What We Don't Know"
  • Stefan Ehrlich, Fraunhofer Institute, will present "Accuracy and Compensation Issues for AC Power Loss Measurements"
  • Marek Rylko, SMA Magnetics, will present "Magnetic Core Dimensional Effects – Flux Propagation in Ferrites"
  • Ed Herbert, PSMA, will present "Generic Specification Sheets"
  • Byron Beddingfield, North Carolina State University, will present "Generic Test Methods Core Loss"
  • Ray Ridley, Ridley Engineering, will discuss "What's Needed Going Forward"
  • Panel Discussion: Dr. Sullivan, Stefan Ehrlich, Marek Rylko, Ed Herbert, Byron Beddingfield and Ray Ridley will lead a panel discussion regarding issues associated with ac power loss measurements. Everyone's participation is encouraged.

The second session "Technology Demonstrations" will be coincident with lunch. This will be an interactive session of technology demonstrations and/or presentations each addressing specific technical disciplines and capabilities consistent with the workshop agenda. The individual technology demonstrations will repeat on fifteen-minute intervals with a ten-minute presentation and a five-minute Q&A during each interval. Workshop attendees are encouraged to move between the technology demonstrations on fifteen-minute intervals so they can cover as many as possible during the session as well as to allow reasonably small groups for each technology demonstration session during each interval.

The technical capabilities and disciplines that will be demonstrated displayed during the technology demonstration session are as follows:

  • JC Sun, Bs&T: AC Power Loss Measurements Under Square Wave Excitation
  • Bruce Carsten, Peak: Gapped Cores
  • Ray Ridley, Ridley Engineering: Spice Modelling of Winding Losses
  • Jenna Pollock: Fundamentals of L, R, |Z| Measurements
  • Tom Neville/Byron Beddingfield, Tektronix/NCSU: Generic AC Power Loss Measurements
  • Chris Oliver, Micrometals: Thermal vs Power Loss Limitations for powder Core Materials
  • Martin Gruebl/Doug Malcolm, Sumida: DC Biased Chokes for High Frequency Applications
  • Marcin Kacki, SMA Magnetics: Drilled Core Measurements, Electrical Impedance of Ferrites
  • Chuck Wild, Dexter Magnetics: Magnetic Supplier Technology Roadmaps.
    • EPCOS, a TDK Group Company: Dr. Sadhab Ganda, Philipp Laurer
    • Fair Rite: John Lynch
    • Magnetics; Bradley Van Fleet
    • Rubadue: Kyle Jensen

There are additional technology demonstrations that have not been finalized at this time.

The third technical session will feature a twenty-five-minute keynote presentation and four twenty-minute lecture style presentations concluding with a twenty-five-minute panel Q&A session. Each presenter will speak for thirty minutes followed by ten minutes for Q&A. There will be a five-minute Q&A interaction after each lecture presentation. The tentative schedule for this session is as follows:

  • Dr. Charles Sullivan, Dartmouth will present a keynote overview of ac power loss measurements and modelling
  • Dr Johann Kolar, ETH, will present "Fringing Flux Associated with Cut Cores"
  • Michael Baumann, Sumida, will present "A Simple Analytical Model to Calculate Air Gap Induced Eddy Current Losses in Inductive Components"
  • Michael Seeman, Eta One Power, will present Impact of Fringing Effects on Design of DC-DC Converters"
  • George Slama, Wurth Elektronik, will present near Magnetic Field Considerations for EMI Design"
  • Panel Discussion: Dr. Charles Sullivan, Dr. Johann Kolar, Michael Baumann, Michael Seeman and George Slama will address topics of interest from the workshop attendees. Everyone's participation is encouraged.

Following the third technical session there will be a networking hour. Wine, beer and hors d'oeuvres will be served from 5:00 to 6:00. This will be an additional opportunity to visit with the technology demonstration stations.

The early registration fee for the workshop is $325 per participant reducing to $225 for PSMA members, IEEE PELS members and students from an accredited university. After February 1, registration fee increases to $375 reduced to $275 for members and students. the Breakfast and lunch will be provided as part of the workshop. Electronic copies of all presentations will be made available to the workshop participants via a password protected website.

The latest information on agenda as well as registration information for the workshop will continue to be available on the PSMA website at: http://www.psma.com/technical-forums/magnetics/workshop .

Organizing Committee

Khurram Afridi, University of Colorado Boulder
Ali Bazzi, University of Connecticut
Steve Carlsen, Raytheon Systems Company
Ed Herbert , PSMA
Laili Wang, Xi'an Jiaotong University
Rodney Rogers, Allstar Magnetics
Fred Weber, Future Technology Worldwide
Chuck Wild, Dexter Magnetic Technologies Inc.


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2018 International 3D Power Electronics Integration and Manufacturing Symposium is Open for Registration

P SMA, sponsor of the Second Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18), announces the opening of registration on February 1, 2018. The Symposium will be held June 25-27, 2018 at the University of Maryland, College Park. The Symposium program is being organized by two leading experts in this field: Prof. Patrick McCluskey of the University of Maryland, College Park is General Chair; Prof. Guo-Quan Lu from Virginia Tech is Technical Program Chair.

Once again, the 2nd biennial 3D-PEIM Symposium is assembling a group of world-class experts representing a far-reaching range of disciplinary perspectives to advance the development of packaging for future 3D power electronics systems. The Symposium encompasses additive, embedded, co-designed, and integrative packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power dense components and modules.

Professionals and Educators engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees a perfect opportunity to gain insight or broaden expertise in 3D power electronics packaging and integration. The Symposium schedule is arranged to provide ample time between sessions for people to share ideas, progress, and challenges with leading members of international associations and societies. On the last day of the Symposium, attendees are invited on a guided tour of the Center for Advanced Life Cycle Engineering (CALCE) at the U. of MD.

The symposium will feature five Segments:

  • Three tutorials by invited specialists: Chris Williams of Virginia Tech; Doug Hopkin of NCSU; and Mike Ohadi of U. of MD.
  • Two symposium keynote addresses by: Prof. Mark Johnson of the University of Nottingham; and Dr. Rolf Aschenbrenner of Fraunhofer Institute, Berlin.
  • Eight technical sessions, each includes:
    • one keynote address;
    • two invited presentations;
    • one contributed presentation;
    • hardware demonstrations and/or one-on-one discussions with the speakers.
    • An interactive poster session.
  • And a table top exhibition.

The eight technical sessions and keynote speakers are:

  • Additive Manufacturing: Prof. John Slotwinski of Applied Physics Lab/Johns Hopkins University
  • Systems Integration & Thermal Management: Prof. Douglas Hopkins, NSF FREEDOM LAB, NCSU
  • Multiphysics Design and Tools: TBD
  • Materials: Dr. Jung-Lae Jo, Mitsui Mining & Smelting Co, Ltd, Japan
  • Manufacturing Technologies: Dr. Bill Chen, ASE
  • Embedding Technologies: Dr. Maximilian Hofmann, Fraunhofer IISB, Germany
  • Heterogeneous Integration of Components: Arnold Alderman, Anagenesis
  • Quality and Reliability: Dr. Eckhard Wolfgang, ECPE, Germany
  • The complete Symposium agenda is on the 3D-PEIM Website.

The complete and up-to-date Symposium agenda is on the 3D-PEIM Website.

Attendees from the 2016 Symposium say it best:

  • "Good balance of academic and industry papers and attendance covering and illustrating research, development, and manufacturing technologies."
  • "It was a very important forum as we move into the post-Moore's Law/Heterogeneous Integrated era"
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

Register now at
http://www.3d-peim.org/registration/

Provided by:

General Chair, Prof. Patrick McCluskey, University of Maryland, College Park

Technical Program Chair
Prof. Guo-Quan (GQ) Lu, Virginia Tech

Publicity Chair
Arnold Alderman, Anagenesis, Inc.


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International Power Supply On Chip Workshop to be held October 17, 18, 19 2018 in Hsinchu, Taiwan

I n 2018, the International Workshop on Power Supply on Chip (PwrSoC) will be celebrating its 10th anniversary. The Power Sources Manufacturers Association (PSMA), in partnership with IEEE Power Electronics Society (PELS) is sponsoring the next workshop in Hsinchu, Taiwan October 17-19, 2018.

The workshop will focus on the integration of electrical power converters for multiple applications and address a broad range of technologies. The complete integration on-die (PwrSoC), integration within package (PwrSiP), and the emerging wide-bandgap (WBG) devices for integrated power management are of prime interest. The workshop covers the integration of both modular and granular electronic power converters for multiple applications, by accessing a broad range of leading-edge technologies.

Since the initial events, hosted by Tyndall National Institute in Cork, Ireland in 2008 and 2010, the workshop has, under the joint leadership of IEEE PELS and PSMA, grown from early initial concepts to present emerging commercial product. From 100 attendees in Cork, the Workshops in the USA, in San Francisco and Boston, attracted close to 200 people, in 2012 and 2014. In 2016, the workshop was hosted by UPM in Madrid and again attracted more than 150 people, coming from both industry and academia.

At the Madrid workshop in October 2016, the increasing commercial interest in integrated power was clearly evident. More than 150 participants were in attendance with greater than 50% from companies across the broad microelectronics supply-chain. Attendees were from semiconductor equipment vendors to foundry and fabrication facilities and OSATs (outsourced assembly and test houses) to power converter and passive component suppliers, system-on- chip (SOC) and electronic system companies.

We are fortunate to have the National Chiao Tung University (NCTU) in Hsinchu hosting the 2018 workshop. The General Co-Chairs are Professor Ke-Horng Chen, Chair of the NCTU Department of Electrical and Computer Engineering, and Professor Cian Ó Mathúna, from Tyndall National Institute, the workshop series originator. Given the current level of industry interest in the technology commercialization and the monumental challenge that poses, it is appropriate that the 10th anniversary workshop should be held in Taiwan, the global center of microelectronics manufacturing.

Prof. Chen says, "I am honored to co-chair the 10th PwrSoC workshop in Taiwan. I believe Taiwan's successful experience in IC design, manufacturing, packaging and systems will surely bring more diversity to this year's workshop. The workshop will gather academics and industry experts from the United States, Europe and Asia with innovative and progressive technologies that provide a global breakthrough in PwrSoC and PwrSiP technologies. Professional attendees of this workshop will make it more successful. Wonderful PwrSoC organization will give participants a feeling of excitement with beautiful landscape and delicious foods in Hsinchu, Taiwan in addition to interesting technical discussions. Finally, academics and industry in Taiwan look forward to VIP participations from all over the world."

Technical Program & Call for Organizing Help

The Technical Program Chair for the 2018 workshop is Prof. Hanh-Phuc Le, Dept. of Electrical, Computer and Energy Engineering, University of Colorado at Boulder. Prof. Le is a very familiar participant in past PwrSoC events, chairing several granular power sessions. He is organizing the Technical Program Committee over the coming months and still needs plenty of help. Anyone interested in participating, please contact Prof. Le directly.

Prof. Le explains, "Building upon previous successes, we are expecting a very insightful technical program this year, with a choice team of session chairs from both academia and industry from the U.S., Europe, and Asia. We will bring to our workshop experts with diverse innovations and technical advancements to address the critical needs in PwrSoC, including capabilities of higher input voltages and larger output currents, higher efficiency, while consuming smaller volume/conversion ampere. Particularly, we will focus one session on the challenges and possible solutions for more integrated Wide-bandgap devices that are expected to push the present limits in PwrSoC design. I believe this will be a great workshop, definitely worth attending for everyone concerned with energy efficiency, integrated power electronics design, manufacturing, and cost."

Our workshop will follow the successful formula from previous workshops with a single track of invited presentations and posters.

Session

Chair

Plenary Session

Seth Sanders, Professor, UC Berkeley

Systems and Applications

Oliver Chen, Senior Engineer, Mediatek Inc.

Topologies and Control

Arnold Knott, Professor, Danish Technical University, Denmark

Wide-Band Gap Semiconductors and Integration

Eliot Chen, Director, Vanguard Semiconductor, Taiwan

Integrated Magnetics

Masahiro Yamaguchi, Professor, Tohoku University, Japan

Capacitors and Storage Devices

Mehdi Jatlaoui, IPDiA

System Integration, Packaging and Manufacturing

Hsiao-ching Tuan, Director, TSMC

Granular Power Supply

Vivek De, Fellow, Intel

Posters Session

Chung-Chih Hung, Professor, National Chiao Tung University, Taiwan

Visit the PwrSoc website for more information: http://pwrsocevents.com/

General Co-Chairs:
Professor Ke-Horng Chen. khchen@cn.nctu.edu.tw
Prof. Cian Ó Mathúna. Cian.omathuna@tyndall.ie

Technical Program Chair
Prof. Hanh-Phuc Le. hanhphuc@Colorado.EDU


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EnerHarv 2018: An International, Technical Workshop Dedicated to Enabling the Energy Harvesting Ecosystem

I n less than five short years, attention on energy harvesting has made a dramatic shift.  In past years, we have seen the reaction to proposed energy harvesting applications range from anecdotal curiosity to being dismissed as producing negligible amounts of useful power.  Fast-forward to today and we have an entire production ecosystem that has quickly gained recognition as designers start to realize just how limiting batteries are in (mostly) low power applications – due to limited battery life and the resultant need for frequent and expensive replacement - and how energy harvesting is the key to enabling reliable and maintenance-free powering of all those amazing Internet of Things (IoT)  devices for Industrial IoT, wearables, 5G, wireless sensor networks, robotics, and medical technologies, just to name a few.  The conversation is shifting from "What is it?" and "It will never deliver useful power levels." to "How can my applications take advantage of this technology?" and "Can you help me develop an energy harvesting strategy/roadmap before my competitors do?" and "We see the value, but need help getting our learning curve up-to-speed to execute quickly and verify it will work for our applications."

The Power Sources Manufacturers Association (PSMA) has been at the forefront of power technologies and the promotion of the driving force behind powering of electronics for many decades now and energy harvesting is no exception.  In less than 18 months, the PSMA Energy Harvesting Technical Committee has increased membership from seven to over 30 members who represent a wide mix of academia and representatives from a variety of industry players on both the supplier and user sides of applications.  A key initiative of the Committee was the management and execution of a full Industry Session at the 2017 Applied Power Electronics Conference (APEC), the premier, global event for power electronics.  The session was expected to be a stepping-stone to generate future interest in energy harvesting technologies at APEC and turned into a standing-room-only technical demonstration and presentation session. The demonstrations provided an important message to the audience that energy harvesting is rapidly moving from the lab to real life applications and offers significant competitive advantages.

Under the steadfast and energetic leadership of the PSMA Energy Harvesting Technical Committee, the group is pushing forward with the next, ambitious step in this exciting field.  Besides sponsoring another Industry Session at APEC2018, the Committee has recently announced the creation and planning of EnerHarv 2018, a three-day, international workshop which will be 'A focal point for a community of experts and users of energy harvesting & related technologies to share knowledge, best practices, roadmaps, experiences and create opportunities for collaboration.'  The workshop is completely dedicated to bringing the best and brightest minds in this very siloed industry together to raise awareness, develop synergies between the various constituents of the energy harvesting ecosystem, and enable applications.  EnerHarv will be hosted by Tyndall National Institute in Cork, Ireland, May 29-31, 2018.  Tyndall is one of Europe's leading industry-led IoT research centers and is an epicenter for energy harvesting research.


EnerHarv will be a unique workshop in the way it is being structured to maximize collaboration and push the industry forward.  The entire event will be experienced as a collective of all workshop delegates.  From the technical lectures to the functional technology demonstrations to the open panel discussions, each day will be packed with sharing technical knowledge mixed with practical application information all to culminate in a group discussion on a theme following a common thread throughout each day of the workshop.  The workshop is targeted at anyone involved or considering getting involved in developing or using energy harvesting technology, particularly (but not exclusively) for ultra-low power IoT applications.  Registrants will walk away inspired, enabled, connected and eager to exercise their newfound education and collaborations immediately upon returning to their colleagues/labs/partners/etc.

In addition to PSMA's financial backing and member support, the EnerHarv Workshop Committee (EWC) has quickly identified and involved many of the industry's top organizations as Technical Sponsors.  This list includes the IEEE Power Electronics Society (PELS), the European Power Electronics Research Network (ECPE), Ireland's national research centre for Future Networks & Communications (CONNECT), and the China Power Supply Society (CPSS).  This is in addition to many representatives on the committee from prestigious academic and industry involved in the world of energy harvesting and power electronics.

The EWC is currently filling presentation and poster slots for this invite-only event.  If you are interested in contributing content, then please visit the EnerHarv 2018 website at www.EnerHarv.com for the latest workshop tracks and EWC contact information.  Additionally, you will find an opportunity to input your own contact information and be one of the first to learn when registration becomes available.

KEYNOTE UPDATE:

Yogesh Ramadass, Director of Power Management R&D at Kilby Labs from TI, will open the Workshop with his keynote talk on "Energy Harvesting: Past, Present and Future" in which he will explore the last ~15 years of the energy harvesting industry to understand how we got to this point in the ecosystem of the industry and how matching to applications will continue to propel this commercial adoption into the future. 

Eric Yeatman, Head of the Department of Electrical and Electronic Engineering from Imperial College London, will close the keynote session with a talk on "Alternative Powering Methods for Miniature Wireless Sensors" in which he will provide an overview of energy scavenging capabilities, techniques, and solutions with a particular focus on enabling wireless devices and IoT applications.



Please join us in the beautiful and historical city of Cork, Ireland's gourmet capital, in May and be part of the inaugural EnerHarv Workshop.  Open your mind to harvesting every type of ambient energy physics affords us.  Learn how to extend battery life and perhaps mitigate batteries altogether in your application.  Learn about the materials, devices and systems and supporting simulation development and deployment tools that are making energy harvesting a reality today.  Obtain valuable training on the nuances of ultra-low power designs/loads and build relationships and network with then leading individuals and companies in this emerging industry that will be valuable to you and your organization in the years ahead.

Visit the EnerHarv website for more information: www.enerharv.com

Provided by:

General Chair
Mike Hayes, Tyndall National Institute

Technical Program Chair
Brian Zahnstecher, PowerRox


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PCIM Europe 2018

PCIM Europe is the Place for Power Electronics. Make Your Plans to Come to Nuremburg this June.


PCIM Europe is the leading exhibition and conference for power electronics and its applications. More than 450 exhibitors from all over the world present their most recent product innovations to more than 10,000 highly qualified trade visitors. The international conference that takes place in parallel is renowned for the superior quality of its 300 lectures and poster sessions, all of them initial publications. With a topical focus on latest research findings, the conference is a valuable source of information for both academia and industry.

The unique combination of exhibition and conference makes PCIM Europe the forum for technologies along the entire value chain of the power electronics industry, from the components to the final intelligent system.

Does this sound appealing? Learn more about how to exhibit at PCIM Europe or simply register for a visit to the event on www.pcim-europe.com/.

 



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ISPSD 2018, The 30th Annual International Symposium on Semiconductor Devices and ICs

I t is our pleasure to invite you to attend the 30th Annual International Symposium on Semiconductor Devices and ICs (ISPSD) that will be held May 13-18, 2018, at the Palmer House Hilton in Chicago, IL, USA.  ISPSD is the world's premier forum for technical discussions in all areas of power semiconductor devices and power integrated circuits that bring together over 400 attendees and exhibitors from all fields related to power semiconductors.  Main topics include, but are not limited to, device physics, modeling, design, fabrication, materials, packaging, device reliability, and device/circuit interactions for both silicon and WBG semiconductors.

Since its first meeting in Japan in 1988, ISPSD has made critical contributions to the growth of the global power semiconductor industry. Over the past 3 decades, ISPSD has enabled energy-efficient power electronic applications such as solar power, wind power, electric vehicles, data centers, and industrial drives. Most of the breakthrough power device technologies were first reported and presented at ISPSD conferences before they became large commercial successes. Come join us as ISPSD 2018 will celebrate 30 years of excellence in advancing power semiconductor technologies with a series of technical and social events.

Full Day Short Course
Sunday May 13th, ISPSD will hold a full day short course that is an excellent opportunity for all students and engineers to take an in-depth look at current and emerging topics in power semiconductor and related areas.  All subjects are taught by an expert in their field.  This year we will have short course topics including "AlGaN/GaN Device Reliability," "Vertical GaN Devices," "SiC Design and Fabrication," "Charge Balance Si Power Devices," "Loss Mechanisms in Si and WBG Power Devices," and "Multichip Power Module Design and Assembly."

Technical Sessions
The main technical sessions of ISPSD are filled with industry and academic experts giving a series of plenary talks and over 45 oral and 75 poster presentations.  Highlights from key upcoming sessions and focus areas include:

Plenary talks from industry experts

  • "ISPSD: A 30 Year Journey in Advancing Power Semiconductor Technology" Dr. Leo Lorentz (ECPE)
  •  "Silicon, GaN and SiC: There's Room for All" by Larry Spaziani (GaN Systems)

Superjunction MOS, Diodes and IGBTs
The sessions on Si MOS and IGBTs include 8 talks over 2 days with topics including superior switching IGBT designs (Infineon), 6.5kV IGBT design (ABB), IGBT characterization (Infineon) as well as advanced Superjunction MOSFET design and concept talks (Toshiba).  Additional presentations on advanced 1200V IGBTs will be given by ABB, Toyota Motor Corp., and Toshiba).

SiC Power Devices
The first SiC session will focus on state of the art SiC MOSFETs (Denso, Panasonic) followed by several talks by Infineon, TU Dortmund University, and Hestia Power focus on threshold stability and reliability of SiC devices.  The second sessions with be focused on SiC reliability and ruggedness including papers on short circuit performance, body diode reliability, and modeling (Hitachi, University of Naples, Mitsubishi, and ABB).

GaN Power Devices:
With the increased interest in WBG devices, GaN presentations will have at least 7 talks over 2 full sessions from expert research institutions including the University of Padova, Zhejiang University and The Hong Kong University of Science and Technology.  Topics range from device optimization to reliability and characterization.

Smart Power ICs:
Complementary to the GaN session, this session is focused on novel gate driver and monolithic integrated drive methods for power GaN transistors.  GaN IC talks will be given by The Hong Kong University of Science and Technology, Southeast University, and the University of Toronto.

Packaging and Enabling Technologies:
Critical to power semiconductor performance is the package and module technologies.  In this session we will have 5 talks on topics such as 3.3kV SiC power modules from Hitachi and the University of Nottingham.  Other talks on GaN, SiC, and packaging from Chemnitz University, Fuji Electric, and the University of Nottingham.

Si Reliability:
To complete the comprehensive conference agenda, a session on lateral power device reliability will contain 4 talks with topics ranging from LDMOS devices (Southeast University, UESTC) to power device interconnects (Texas Instruments), and high voltage FinFETs (Indian Institute of Science).

Vendor Exhibits:
In addition to the technical sessions, the conference will host Industrial exhibitions from key vendors and suppliers in the power semiconductor community.  This is an tremendous opportunity to meet and learn about new products, tools, and resources available to the engineers and managers working in the power semiconductor field.

Venue and Activities:
ISPSD 2018 will be held in the historical Palmer House Hilton Hotel in the beautiful and safe downtown district of Chicago.  There are numerous museums, parks, theatres, restaurants, and shops within walking distance.  As an added chance to network with fellow technologists there will be a special social event to celebrate ISPSD's 30th anniversary that will include an Induction of ISPSD Hall of Fame and "Ask a Founder" interviews.  For those traveling with attendees, companion tours and social programs will be available (Chicago architecture tours, Chicago dinning tours, etc.).

Chicago is the third largest city in the United States with non-stop flights connecting to most major cities in Asia, Europe, and North America. This great city is an international hub for finance, commerce, industry, technology, telecommunications, and transportation. Chicago is the headquarters to 12 Fortune 500 companies and has major automotive OEMs and suppliers. Industrial equipment manufacturers within 300-mile radius include: Ford, GM, Chrysler, Delphi, Rockwell, Eaton, Johnson Control, Caterpillar, and Cummings. The city of Chicago is the birth place of modern skyscrapers and a living museum of modern architecture.  We trust you and your family will enjoy your stay in Chicago!

Find more information and full technical program at: www.ispsd2018.com

Provided by David Sheridan, 2018 ISPSD Publicity Chair


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Powering Marine Applications - The Many Challenges!

W e are all aware of self-driving cars and many other exciting projects that the automotive industry is engaged in, but far fewer of us have heard about unmanned ships and associated projects that will operate large fleets of vessels that are capable of navigating from port to port without operational crews. Although in its early stages, projects such as the Maritime Unmanned Navigation Through Intelligence In Networks (MUNIN) project have investigated the feasibility of such projects and also test-bed development for future developments. The use of unmanned ships will require extreme reliability from the main generator through to the single point-of-load, and the challenges and demands placed on power designers will be far beyond anything experienced to date.

State of the art in marine power


Rolls-Royce unmanned ship project (source: Rolls-Royce)

Future generations of power supplies for unmanned ship are still under definition although it is important to understand the specificity of the marine segment that is quite unique in terms of its environmental needs and regulations. Due to the nature of the business, the requirements imposed on products and systems deployed in shipping and offshore installations are greater than what are currently required for land industrial and office environments. In addition, international regulations and standards applying to the marine industry are very complex, requiring an in-depth knowledge of the application and where it will be operated. Power designers must be knowledgeable about marine specific voltage distribution, combining DC and AC networks, safety regulations, and many other aspects such as 'operational zones' that can vary wildly from ship to ship and with the nature of the merchandize being transported.

The zones

Generally, two zones are distinguished on a ship; the 'bridge and the open deck zone', and the 'general power zone', which basically refers to all other spaces on the ship.

One example of a specific requirement per zone is the electromagnetic emission and immunity (EMC). The areas open deck and bridge place extra demands on the EMC, as a lot of sensitive equipment is housed in those areas such as communication, radar and navigation devices. These EMC requirements are well below the known EN55022 Level B and measurements begin at 10kHz instead of the usual 150kHz.

The limits regarding mechanical and climatic requirements are also higher than for the average industrial application. Vibration levels up to 4g are common, as well as large temperature fluctuations from -25 to + 70 degrees C, and high relative humidity conditions where condensation cannot be excluded.

The rules

Every country with a maritime sector has its own certification authority with specific demands for local certification, forcing power designers to keep track of the final application where the power supplies will be installed. In general, there is a common group of standards and qualification processes that have similar roots for all countries' certification, though from country to country and maritime sub segments there are also a number of very specific requirements that increase complexity. The difficulty is, there is no de-facto percentage of 'common standards' versus specific, thus requiring power designers to start any new project by reviewing a large number of documents prior to designing anything – a lot of time consuming, but very necessary, hard work.

In order to develop a sustainable way-of-working to ensure that the power solutions can be utilized all over the world, marine power supplies designers used to combine the requirements from all countries active in marine construction and operation to establish a cross reference table with equivalence and specific action in the case of major deviations - for example, higher demands on shock and vibration. Once such an equivalence table is established, the toughest requirements of each category is selected and used as a reference for designing, verifying and qualifying the final power supply. This is done in close cooperation with the final customer, reducing the risk of under-specifying the power supply and missing final qualification.

Combining this design methodology with an in-depth knowledge of local standards and regulations results in a test protocol that meets international and local requirements. This test protocol is then applied to all products, simplifying not only the final approval, but also confirming that the power supply can be used for replacement or system-upgrade purposes in any country.

Usually marine customers expect the power supplies to comply with and be certified and stamped with the type approval logo of Germanischer Lloyd (GL) because of the extensive testing to meet EN60945 for extended approvals by Bureau Veritas (BV), Lloyds Register (LRS), America Bureau of Shipping (ABS), Det Norske Veritas (DNV), Korean Register of Shipping (KR) and many other notified bodies in the maritime world.

More power in a smaller footprint

With the increased amount of embedded electronics, the marine industry requires more functionality in a smaller space. Nowadays, ship owners want to equip their vessels with broadband internet connections for both passengers and crew while embracing - as much as is possible - the same features as when ashore.

As a further example, position tracking systems are built-in to the monitor, requiring very compact power supplies operating in a confined environment without a fan. Such power supplies must be designed for conduction cooling, with high attention paid to the placement of dissipative components and optimized conduction cooling.


Marine grade power supply design optimized for conduction cooling in confined environments (Source: Powerbox)

For most power distribution systems, power units are preferably in cassette format, hence simpler to install, maintain and upgrade. The marine cassettes are usually mounted on DIN rail, although electrical designers within the ship industry require that the power supply is also compliant with standalone conduction cooling installations anywhere on the ship, meaning - as for the embedded power supplies - that the design has to be highly optimized for conduction cooling.

Packaging more power in a smaller box with optimized conduction cooling requires a high degree of integration of the power circuits. The efficiency needs to be as high as possible because a small housing also means that the cooling surface is smaller. By using the most recently developed resonant circuits and switching control methods, efficiency levels up to 95% are achieved although power designers are exploring new technologies such as digital control and the latest generation of Gallium Nitride (GaN) power FETs, targeting higher efficiency and a flatter curve, maintaining high efficiency from very low through to high loads. All new technologies are explored, although the nature of the business - ships are often in the middle of oceans and weeks from land – means that extremely high reliability levels apply, and so new technologies must be verified for use in extreme conditions. This is an ongoing process that is mandatory for future unmanned ships where maintenance during operation is almost impossible. Reliability and zero downtime are the rule. Accordingly, power supplies should be able to be connected in parallel for redundancy operation. It is common practice to add an external ORing block (usually with similar dimensions to the power supply) that electricians interconnect to the power supplies. This conventional way will tend to disappear and electronics paralleling circuitry built-in to the power supply itself will take over. Adding that function into the power unit saves space for more vital equipment but requires power designers to integrate more into a smaller package.

What's next in marine?


Rolls-Royce oX land-based control center (Source: Rolls-Royce)

Existing power solutions for the marine industry have proven their robustness and meet international compliances. Power designers are exploring new technologies to permanently improve efficiency, and to decrease power consumption and dissipation. Unmanned ships will require a level of reliability that will be close to a mythical 'zero faults' level, and the ability for power supplies to be controlled and monitored from a central office (Figure 04) that could be on the other side of the planet! For the power designer it will be an incredible challenge to combine state of the art technologies in switching, thermal management, control and intelligence. We are close to a new era where power supplies will become self-controlled and able to diagnose early signs of failure to apply corrective action. Is that a dream or reality? In my opinion it's knocking at the door and we will soon be there!

Provided by Patrick Le Fèvre
Chief Marketing and Communications Officer, Powerbox

 


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If You Have Anything to Do With Power Supplies, Here's What You Need to Know About EN 62368

E lectronics technology is changing rapidly and safety standards are being updated to stay relevant. The new standards are technology independent, hazard-based and performance-oriented. According to UL, a nationally recognized testing laboratory, that's a less prescriptive approach, which will help by letting "manufacturers make their own decisions and follow their own pace on the road toward hazard-based safety standards."

The First Thing You Need to Know

EN 62368 is the new safety standard for information technology equipment and audio/video equipment. It replaces EN60950, EN 60905 and EN 60065 as well as IEC 60950-1.

First published in Europe during 2Q-2014, the Date of Withdrawal (DoW) of the standards to be superseded (EN 60065 and EN 60950-1) was assigned to be June 20, 2019. Although the Official Journal of the European Union has yet to be updated to include EN62368 as mandatory and formally associated with the low voltage directive (LVD) – this is expected to be updated soon. Meanwhile, UL has in fact assigned June 20, 2019 as the date of new equipment certification and UL/CSA 62368 will be the law of the land in North America at that time.

Why Did UL Revise the Standard?

Thirty years ago, it was easy to tell the difference between an audio visual, consumer electronics and a computer or test instrument, and many things such as digital signage did not even exist. Today, it's hard to tell where a computer ends and AV or test instruments begin. Thus, 62368 is designed to be applicable to a wider variety of products and technologies which will  also minimizes national/regional certification differences. The new standard is not just a simple merger of EN 60065 and EN 60950-1. It is being replaced because technology is changing, and the EN 62368-1 standard is technology independent.

There's more - the increased flexibility of EN62368 will allow design engineers to identify and eliminate safety hazards in the early product development phase and also provide more performance options for demonstrating compliance.

Here's More to Keep You in the Know

The PSMA Safety & Compliance Committee Technical Forum on the PSMA web site provides free resources to help you keep up with the changes in regulatory safety and compliance activities, including the Safety & Compliance Database. The upcoming 2019 PSMA Power Technology Roadmap will include a section on regulatory issues, together with updates on 62368 presented by TUV, another nationally recognized testing laboratory.

For further education on this topic, you can:

Version 2.0 of 62368 is already in review for 2018 and this space should be watched closely to make sure compliance is understood.

Provided by Kevin Parmenter
PSMA Safety & Compliance Committee Co-Chair
Head of Low Power Applications,
Excelsys, an Advanced Energy company

 

 


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Solar Energy Stock Index: Q4 2017

L incoln International is pleased to present you with the latest Solar Energy Stock Index from our Global Energy, Power & Infrastructure Group. This will provide you with:

  • Quarterly performance of the Solar Energy Stock Index versus the S&P Index
  • Relative market valuations of each Solar Energy sector
  • Current financial data for each company in the index
 solar_energy_stock_index_q4_2017.pdf
(842k pdf)

This data is included with the permission of Lincoln International. For more information, you may contact John McManus (jmcman@optonline.net) or the Association Office.


 


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Solar Energy DealReader: Q4 2017

L incoln International is pleased to present you with the latest Solar Energy DealReader from our Global Energy & Power Group. This will provide you with:

  • 2017 Deal Volume Comparison
  • Recent Solar Energy Transaction Announcements
  • Q4 2017 Solar Energy Transaction Summary
 solar_dealreader_q4_2017.pdf
(807k pdf)

This data is included with the permission of Lincoln International. For more information, you may contact John McManus (jmcman@optonline.net) or the Association Office.


 


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EMS Stock Index: Q4 2017

L incoln International is pleased to present you with the latest EMS Stock Index from our Global Electronics Sector. This will provide you with:

  • Quarterly performance of the EMS Stock Index versus the S&P Index
  • Relative market valuations of each EMS sector
  • Current financial data for each company in the index
 ems_stock_index_q4_2017.pdf
(2.1M pdf)

This data is included with the permission of Lincoln International. For more information, you may contact John McManus (jmcman@optonline.net) or the Association Office.


 


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EMS DealReader: Q4 2017

L incoln International is pleased to present you with the latest EMS DealReader from our Global Electronics Industry Group. This will provide you with:

  • 2017 deal volume comparison by total transactions, deal type, geography and size
  • Recent EMS transaction announcements
  • 2017 EMS transaction summary
 ems_dealreader_q4_2017.pdf
(2.5MB pdf)

This data is included with the permission of Lincoln International. For more information, you may contact John McManus (jmcman@optonline.net) or the Association Office.


 


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Events of Interest - Mark Your Calendar
Jan 31, 2018 - Feb 2, 2018
Hamilton, North Island
New Zealand
Feb 6, 2018 - Feb 7, 2018
Italy
Feb 8, 2018 - Feb 9, 2018
MSC, TAMU 1237
College Station, TX
Feb 8, 2018 - Feb 9, 2018
Switzerland
Feb 22, 2018 - Feb 23, 2018
Champaign, IL
Feb 27, 2018 - Mar 1, 2018
Aschaffenburg
Germany
Feb 28, 2018 - Mar 2, 2018
Tokyo
Japan
Mar 3, 2018
Henry B. Gonzalez Convention Center
San Antonio, TX
Mar 3, 2018
Henry B. Gonzalez Convention Center
San Antonio, TX
Mar 4, 2018 - Mar 8, 2018
Henry B. Gonzalez Convention Center
San Antonio, TX
Mar 12, 2018 - Mar 14, 2018
Calgary, Alberta
Canada
Mar 12, 2018 - Mar 13, 2018
Italy
Mar 19, 2018 - Mar 23, 2018
Omni Hotel
Fort Worth, TX
Mar 20, 2018 - Mar 22, 2018
Stuttgart
Germany
Mar 26, 2018 - Mar 29, 2018
Fort Lauderdale, FL
Mar 27, 2018 - Mar 28, 2018
Shanghai
China
Apr 9, 2018
Germany
Apr 10, 2018 - Apr 11, 2018
Netherlands
Apr 11, 2018 - Apr 12, 2018
Dresden
Germany
Apr 17, 2018 - Apr 19, 2018
Liverpool
United Kingdom
Apr 22, 2018 - Apr 25, 2018
National Ilan University
Yilan
Taiwan
Apr 23, 2018 - Apr 25, 2018
Greenville, SC
May 6, 2018 - May 8, 2018
Memphis, TN
May 7, 2018 - May 10, 2018
Niagara Falls, ON
Canada
May 9, 2018 - May 10, 2018
Milwaukee Convention Center
Milwaukee, WI
May 13, 2018 - May 17, 2018
Palmer House Hilton Hotel
Chicago, IL
May 15, 2018 - May 17, 2018
Hanover
Germany
May 16, 2018 - May 18, 2018
Xi'an
China
May 20, 2018 - May 24, 2018
Niigata Convention Center
Niigata
Japan
May 24, 2018 - May 26, 2018
Shenzhen
China
May 29, 2018 - May 31, 2018
Tyndall National Institute
Cork
Ireland
Jun 3, 2018 - Jun 7, 2018
Montréal
Canada
Jun 4, 2018 - Jun 7, 2018
San Diego, CA
Jun 5, 2018 - Jun 7, 2018
Nuremberg
Germany
Jun 7, 2018 - Jun 9, 2018
Niagara Falls, ON
Canada
Jun 11, 2018 - Jun 14, 2018
Denver. CO
Jun 13, 2018 - Jun 15, 2018
Long Beach, CA
Jun 20, 2018 - Jun 22, 2018
Munich
Germany
Jun 25, 2018 - Jun 28, 2018
Charlotte, NC
Jun 25, 2018 - Jun 28, 2018
Padova
Italy
Jun 25, 2018 - Jun 26, 2018
Serma
France
Jun 25, 2018 - Jun 27, 2018
Adele H. Stamp Student Union, University of Maryland
College Park, MD
Jun 26, 2018 - Jun 28, 2018
San Jose, CA
Jun 27, 2018 - Jun 29, 2018
Amsterdam
Netherlands
Jul 9, 2018 - Jul 10, 2018
London
United Kingdom
Jul 16, 2018 - Jul 18, 2018
Beijing
China
Aug 23, 2018 - Aug 24, 2018
Asker
Norway
Aug 26, 2018 - Aug 30, 2018
Budapest
Hungary
Aug 27, 2018 - Aug 28, 2018
Stokholm
Sweden
Aug 29, 2018 - Aug 30, 2018
Trondheim
Norway
Sep 3, 2018 - Sep 6, 2018
Thraki Palace Hotel
Alexandroupoli
Greece
Sep 11, 2018 - Sep 13, 2018
Novi, Mi
Sep 13, 2018 - Sep 14, 2018
Helsinki
Finland
Sep 17, 2018 - Sep 21, 2018
Latvia
Sep 18, 2018 - Sep 19, 2018
Stuttgart
Germany
Sep 23, 2018 - Sep 27, 2018
Portland, OR
Oct 3, 2018 - Oct 5, 2018
Nice
France
Oct 7, 2018 - Oct 11, 2018
Turino
Italy
Oct 10, 2018 - Oct 12, 2018
Korea
Oct 16, 2018 - Oct 18, 2018
Osaka
Japan
Oct 17, 2018 - Oct 19, 2018
Hsinchu
Taiwan
Nov 1, 2018 - Nov 3, 2018
Banja Luka
Bosnia and Herzegovina
Nov 6, 2018 - Nov 8, 2018
Pasadena, CA
Nov 7, 2018 - Nov 9, 2018
East Midlands Conference Centre
Nottingham
United Kingdom
Nov 13, 2018 - Nov 16, 2018
Munich
Germany
Nov 13, 2018
Huntsville, AL
Nov 15, 2018 - Nov 16, 2018
Dusseldorf
Germany
Dec 18, 2018 - Dec 21, 2018
Chennai
India
Mar 4, 2019 - Mar 8, 2019
Jacksonville, FL
Mar 17, 2019 - Mar 21, 2019
Anaheim, CA
Apr 28, 2019 - May 1, 2019
Bloomington, MN
May 11, 2019 - May 15, 2019
San Diego, CA
May 22, 2019 - May 24, 2019
San Jose
Costa Rica
May 27, 2019 - May 31, 2019
Busan
Korea (South)
Sep 2, 2019 - Sep 5, 2019
Genova
Italy
Sep 29, 2019 - Oct 3, 2019
Baltimore, MD
Mar 2, 2020 - Mar 6, 2020
Reno, NV
Mar 15, 2020 - Mar 19, 2020
New Orleans, LA

If you know of any upcoming conferences or events of interest to
PSMA members please notify the Association office.

e-mail: Power@PSMA.com
Fax: 973-543-6207

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