Presentation recordings (click to expand)
Technical Session - Physical Construction and Structure for Integration of Power Magnetic Devices
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Keynote: Precision Power Magnetics Engineering: A Key Step toward High Performance Power Electronics (Minjie Chen, Princeton University) |
Magnetics Integrations for 2.5D and 3D Packaging (Ranajit Sai, Tyndall) |
Inductive Components on Silicon Substrate 300 mm Wafer (Jens Kehl, Wurth Elektronik) |
Ferrite Technology in Transition - Process and Shaping (Sebastian Bachmann, Tridelta Weichferrite) |
Thin Film Magnetics (John McDonald, Atlas Magnetics) |
Panel Discussion (Bachmann, Chen, Kehl, McDonald, Sai) |
Technical Session - Electrical Parameter Integration
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Keynote: Electrical Parameter Integration (Charles Sullivan, Dartmouth College) |
Variable Inverter/Rectifier Transformers and other Coupled Electronic and Magnetic Systems (Mike Ranjram, Arizona State University) |
Magnetics Design for LLC Circuit Topology (Lukas Mueller, Micrometals) |
Designing Soft Saturating, Low Loss TLVR´s Avoiding Air Gaps for Better Coupling and Highly Efficient Nanocrystalline Power Core Material (Michael Freitag, Yageo) |
Panel Discussion (Freitag, Mueller, Ranjram, Sullivan) |
Presentation slides (click to expand)
Technical Session - Design and Optimization of Magnetics for Different Applications
- Keynote: Precision Power Magnetics Engineering: A Key Step toward High Performance Power Electronics (Minjie Chen, Princeton University)
- Magnetics Integrations for 2.5D and 3D Packaging (Ranajit Sai, Tyndall)
- Inductive Components on Silicon Substrate 300 mm Wafer (Jens Kehl, Wurth Elektronik)
- Ferrite Technology in Transition - Process and Shaping (Sebastian Bachmann, Tridelta Weichferrite)
- Thin Film Magnetics (John McDonald, Atlas Magnetics)
Technical Session - Thermal Design and Other Special Issues: Partial Discharge, Insulation, etc.
- Keynote: Electrical Parameter Integration (Charles Sullivan, Dartmouth College)
- Variable Inverter/Rectifier Transformers and other Coupled Electronic and Magnetic Systems (Mike Ranjram, Arizona State University)
- Magnetics Design for LLC Circuit Topology (Lukas Mueller, Micrometals)
- Designing Soft Saturating, Low Loss TLVR´s Avoiding Air Gaps for Better Coupling and Highly Efficient Nanocrystalline Power Core Material (Michael Freitag, Yageo)
Technology Demonstrations Session
- Static and Dynamic Characteristic Tests on Magnetic Devices (Ryu Nagahama, Iwatsu)
- Low Q Materials for Differential Mode EMI Filters (Lukas Mueller, Micrometals)
- Open Magnetics, Wurth Elektronik & Ansys Automating Magnetics (Alfonso Martinez, Mark Christini, Open Magnetics/Ansys)
- Double Pulse Testing of Magnetic Components (Jens Schweickhardt, PE Systems)
- Measuring Methods of Permeability and Permittivity of Noise Suppression Sheets at the Frequency from 6 GHz to 30 GHz (Akihiko Saito, Daido Steel)
- Electromagnetic Wave Shielding Effect Measurement Method Using Loop Antenna (Kosuke Yuasa, Daido Steel)
- Integrated Magnetics, Optimization of Common Mode Chokes (CMC) Integrated with Differential Mode Chokes (DMC) (Andres Arias, Risha Yu, Premier Magnetics)
- Triple Pulse Testing Open-Source Project (Jun Wang, University of Bristol)
- Nonlinearity & Magnetic Loss (JC Sun, Bs&T)
- Dimensional Resonance in Ferrite Materials (Mike Arasim, Fair-Rite Products Corp.)
- Power Loss Distribution in Planar Windings (Tom Wilson/ Andrija Stupar, SIMPLIS Technologies)
- Simple and Effective Technique to Verify Impact of High Temperature and High Voltage High Frequency Stresses on Inductor Electrical Performance (Efrain Bernal, Wurth Elektronik)
- Roadmap for Nanocrystalline Soft Magnetic Materials & Components in Power Electronics (Reddy Andapally Bharadwaj, CBMM)
- Efficiency Differences with Power Inductor Core Material Variations (Michael Freitag, Yageo)
Posters
- Class D Switching Q-Meter for High-Frequency Core Loss Testing (Jacob Anderson, Nick Kirkby, Arizona State University)
- Rethinking Inductor Structures Across Broad Application Ranges (Rachel Yang, MIT)
- Laminated Cores for High-power Inductive Power Transfer Application: High-efficiency Design with Fe-based Nanocrystalline Material (Yibo Wang, City University of Hong Kong)
- Design Considerations and Multi-Objective Optimization for Magnetic Components in High-Power, Medium-to-High-Frequency Power Electronics (Todd Marzec, UPITT)