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Distributors' Position Paper on Lead-Free Product Transition and RoHS Compliance
(396 KB, pdf file - leadfree.pdf) |
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Uncovering the New Waste Directives - (MS Word doc)
(5 KB, zip file - New_Waste_Directives.zip) |
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Qualification Temperature Profile for Lead-Free Reflow Soldering
(1 MB, pdf file - 16v_kirchner_presentation.pdf) |
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The Development of a Qualification Temperature Profile for Lead-free Reflow Soldering
(208 KB, pdf file - publication_kir_27_02_2004.pdf) |
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Whisker Evaluation of Tin-Plated Logic Component Leads
(768 KB, pdf file - ti_article_sn_plating.pdf) |
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Testing and Control of Tin-based Platings on Lead-free Components For External Use
(95 KB, pdf file - hp_guidelines_whiskers.pdf) |
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Reliability Data - Matte Tin Lead Finish
(145 KB, pdf file - lt_reliability_data.pdf) |
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Facing a Lead-Free Future
(3 MB, pdf file - lead_free_future.pdf) |
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Lead-Free Soldering Guide
(4 MB, pdf file - aim_lead_free_guide.pdf) |
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Stress Analysis and Accelerated Evaluation of Tin Whisker under Thermal Shock Stress
(605 KB, pdf file - mate_paper.pdf) |
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View on Countermeasures to Sn Whiskers for Lead-free Soldering
(42 KB, pdf file - white_paper.pdf) |
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Qualification Temperature Profile of electronic devices for Leadfree Reflow Soldering
(229 KB, pdf file - burlington_pbfree_profile1.pdf) |
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Lead-Free solder: the issues
(308 KB, pdf file - envirowise_en2874.pdf) |
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European Lead-Free Technology Roadmap
(616 KB, pdf file - eu_roadmap_v13.pdf) |
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Lead-Free Electronic Solder, Why? - (MS Word doc)
(54 KB, zip file - pbfree_22026.zip) |
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Lead-Free Connectors - An Overview
(35 KB, pdf file - pbfree_connector_overview2.pdf) |
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Directive 2002/95/EC of the European Parliament and of the Council - of 27 January 2003, on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(118 KB, pdf file - pbfree_ec_january20035.pdf) |
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IPC Roadmap: A Guide for Assembly of Lead-Free Electronics
(78 KB, pdf file - pbfree_roadmap_4_pub_6_003.pdf) |
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Lead-Free Solder Study - (MS Word doc)
(260 KB, zip file - pbfree_study_august20034.zip) |
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Tin Whisker Info "Brief"
(32 KB, pdf file - tinwhiskers4.pdf) |
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Supplier Intro to Lead-Free (RoHS) letter, June 2003 - (MS Word doc)
(22 KB, zip file - intro_to_pbfree_6_2003.zip) |
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HP's External Lead Elimination Position
(59 KB, pdf file - hp_ext_pb_elim_position.pdf) |
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HP's External PCN Response Flow Chart, August 2003
(109 KB, pdf file - hp_ext_pcn_chart_8_2003.pdf) |
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HP's External Position on Tin-Based Plating for Lead-Free Components
(103 KB, pdf file - hp_ext_pos_sn_for_pbfree.pdf) |
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Testing and Control of Tin-Based Platings on Lead-Free Components, For External Use
(94 KB, pdf file - test_ctrl_sn_for_pbfree_ext.pdf) |
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SMA, as a service to the power electronics industry, wants to provide this information for the education of its members as well as the industry in general. This is a work in progress since every month that passes sees changes and updates to the manner in which the industry is responding to this legislation. Since every electronic product typically has some form of a power supply inside or required. The entire electronics industry is impacted by lead free product requirements. Thus, PSMA is committed to assisting the industry and members on understanding the latest requirements. Useful links are provided as well (see resources tab above) to assist in keeping abreast of the latest changing requirement in our industry.