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2018 International 3D Power Electronics Integration and Manufacturing Symposium is Open for Registration

P SMA, sponsor of the Second Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18), announces the opening of registration on February 1, 2018. The Symposium will be held June 25-27, 2018 at the University of Maryland, College Park. The Symposium program is being organized by two leading experts in this field: Prof. Patrick McCluskey of the University of Maryland, College Park is General Chair; Prof. Guo-Quan Lu from Virginia Tech is Technical Program Chair.

Once again, the 2nd biennial 3D-PEIM Symposium is assembling a group of world-class experts representing a far-reaching range of disciplinary perspectives to advance the development of packaging for future 3D power electronics systems. The Symposium encompasses additive, embedded, co-designed, and integrative packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power dense components and modules.

Professionals and Educators engaged in R & D of power electronics packaging design, and manufacturing processes

This Symposium provides attendees a perfect opportunity to gain insight or broaden expertise in 3D power electronics packaging and integration. The Symposium schedule is arranged to provide ample time between sessions for people to share ideas, progress, and challenges with leading members of international associations and societies. On the last day of the Symposium, attendees are invited on a guided tour of the Center for Advanced Life Cycle Engineering (CALCE) at the U. of MD.

The symposium will feature five Segments:

  • Three tutorials by invited specialists: Chris Williams of Virginia Tech; Doug Hopkin of NCSU; and Mike Ohadi of U. of MD.
  • Two symposium keynote addresses by: Prof. Mark Johnson of the University of Nottingham; and Dr. Rolf Aschenbrenner of Fraunhofer Institute, Berlin.
  • Eight technical sessions, each includes:
    • one keynote address;
    • two invited presentations;
    • one contributed presentation;
    • hardware demonstrations and/or one-on-one discussions with the speakers.
    • An interactive poster session.
  • And a table top exhibition.

The eight technical sessions and keynote speakers are:

  • Additive Manufacturing: Prof. John Slotwinski of Applied Physics Lab/Johns Hopkins University
  • Systems Integration & Thermal Management: Prof. Douglas Hopkins, NSF FREEDOM LAB, NCSU
  • Multiphysics Design and Tools: TBD
  • Materials: Dr. Jung-Lae Jo, Mitsui Mining & Smelting Co, Ltd, Japan
  • Manufacturing Technologies: Dr. Bill Chen, ASE
  • Embedding Technologies: Dr. Maximilian Hofmann, Fraunhofer IISB, Germany
  • Heterogeneous Integration of Components: Arnold Alderman, Anagenesis
  • Quality and Reliability: Dr. Eckhard Wolfgang, ECPE, Germany
  • The complete Symposium agenda is on the 3D-PEIM Website.

The complete and up-to-date Symposium agenda is on the 3D-PEIM Website.

Attendees from the 2016 Symposium say it best:

  • "Good balance of academic and industry papers and attendance covering and illustrating research, development, and manufacturing technologies."
  • "It was a very important forum as we move into the post-Moore's Law/Heterogeneous Integrated era"
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."

Register now at

Provided by:

General Chair, Prof. Patrick McCluskey, University of Maryland, College Park

Technical Program Chair
Prof. Guo-Quan (GQ) Lu, Virginia Tech

Publicity Chair
Arnold Alderman, Anagenesis, Inc.

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