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2018 International 3D Power Electronics Integration and Manufacturing Symposium Announcement and Call for Papers

Abstracts are Due December 15, 2017



P SMA is proud to announce the organizing of The Second Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18) to be held on June 25-27, 2018.  This Symposium will be held at the University of Maryland, College Park and will bring together world-class experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Prof. Patrick McCluskey of the University of Maryland, College Park is the General Chair and Prof. G.Q. Liu from Virginia Tech is Program Chair for the symposium.

For the professional or educator engaged in the research and development of power electronics packaging design, and manufacturing processes, this Symposium is the ideal event to share your ideas, progress and challenges with leading members of international associations and societies active in these fields of expertise. The program will focus on additive, embedded, co-designed, and integrative packaging technologies. Sessions will address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

Abstracts of candidate papers are sought that address important challenges related to the design, packaging and manufacturing of smaller, lighter, more efficient, and sustainable power electronic products, especially in the following topic areas:

  • Additive Manufacturing
  • Embedded Components and Embedding Technologies
  • Systems Integration and Thermal Management for High-density Packaging
  • Multi-physics Modeling and Simulation of Integrated Packaging and Circuit Solutions
  • Materials (e.g., interconnects, encapsulants, substrates)
  • Heterogeneous Integration
  • Manufacturability of circuits and packaging (manufacturing processes, equipment, and standards)
  • Quality and Reliability, including Prognostics and Condition Monitoring
We invite you to respond to our Call for Papers by submitting an abstract. Applicants can choose if they wish to present a) at a lecture session or b) at an e-poster session. Authors of accepted abstracts are expected to prepare both a power point presentation/or e-poster and an IEEE formatted paper so your material can be published in IEEE Explore. On the day of their presentations, all presenters will have free tabletop space in the exhibit area to demonstrate hardware and hold one-on-one discussions.

You can submit your Abstract at our symposium website www.3D-PEIM.org.
Abstracts are due December 18, 2017.

This is an outstanding opportunity to learn more about advanced fields of power electronics packaging and manufacturing. The symposium will feature 26 invited presentations, highlighted with a keynote address by Prof. Mark Johnson of the University of Nottingham, who is the Director of the Center for Power Electronics under the UK Engineering and Physical Sciences Research Council (EPSRC). There will be three tutorials by invited specialists, eight sessions that include invited and contributed presentations, an interactive poster/demonstration session, and plenty of networking time set aside.

The Symposium will include a table top exhibition area. Interested organizations are invited to purchased exhibit space that will include one registration and a table to exhibit products and literature to a target group of technologists.

Symposium Sponsorship is also available which includes one registration, tutorial registration, an exhibit table, Website and program recognition, lecture room recognition, and a banner displayed in the lecture room.

We will let attendees from the 2016 Symposium say it in their words:
  • "Good balance of academic and industry papers and attendance covering and illustrating research, development, and manufacturing technologies."
  • "It was a very important forum as we move into the post-Moore's Law/Heterogeneous Integrated era"
  • "The keynote speeches were most valuable, providing an excellent recent update on embedded technologies."
Want to learn more? Contact mailto:info@3D-PEIM.org, or the PSMA office at power@psma.com.

We look forward to seeing you in College Park this coming June.

Provided by:

General Chair
Prof. Patrick McCluskey, University of Maryland, College Park

Technical Program Chair
Prof. Guo-Quan (GQ) Lu, Virginia Tech

Publicity Chair
Arnold Alderman, Anagenesis, Inc.
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